JP2014093464A - Manufacturing method of led mounting product, resin mold method of led mounting product, and led manufacturing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED mounting product which achieves high manufacturing yield and high reliability.SOLUTION: An LED mounting product 10 includes: a wiring board 11 having a wiring layer 15 and a surface protective layer 16 which covers the wiring layer 15 to protect the wiring layer 15; an LED chip 12 which is mounted on the wiring board 11 and is electrically connected with the wiring layer 15 exposed from the surface protective layer 16; a reflector part 23 molded at an area on the wiring board 11, which is located around the LED chip 12, by using a resin for a reflector; and a lens part 24 which is molded on the wiring board 11 by using a resin for a lens so as to cover the LED chip 12 and the reflector part 23.

Description

  The present invention relates to a technology effective when applied to a method for manufacturing an LED (Light Emitting Diode) mounted product, a resin molding method for an LED mounted product, and an LED manufacturing apparatus.

  Japanese Patent Application Laid-Open No. 2009-206370 (Patent Document 1) discloses an LED composed of a reflector part molded on a lead frame and an LED chip (light emitting chip) mounted thereon, and a lens part molded so as to cover them. A technique in which a package is mounted on a printed circuit board is described.

JP 2009-206370 A

  An example of the manufacturing process of the LED package will be outlined. First, the reflector part is transfer-molded with a resin for a reflector (primary molding resin) on a die pad on which an LED chip is mounted, a lead frame having leads, or a resin substrate. Next, the LED chip is die-bonded to the die pad and electrically connected to the lead (for example, wire bonding). Next, the lens portion is transfer-molded with a lens resin (secondary molding resin) for molding the LED chip. Next, the lead frame or the like is separated into pieces by, for example, dicing such as blade cutting, laser cutting, or press cutting, whereby the LED package is substantially completed. After that, the LED package is mounted on a wiring board such as a PCB (Printed Circuit Board) board, and the LED mounted product is almost completed.

  Here, as the resin for the reflector and the resin for the lens, for example, an epoxy resin or a silicone resin is used, but this has a lower viscosity than a resin for molding a general semiconductor chip. For this reason, in the mold mold with the lead frame clamped, the resin flows out from the gap between the lead frame and the mold mold, or the gap formed in the lead frame itself (resin leakage), the parting surface of the mold mold, This may cause resin flash (flash flash) in the non-molded portion of the lead frame. Such resin burrs need to be removed because they affect the manufacturing yield and reliability of LED packages and LED mounted products. For this reason, after reflector molding or lens molding, a process of removing and cleaning resin burrs using a chemical solution is added, but this leads to a decrease in productivity.

  An object of the present invention is to provide an LED mounted product with a high manufacturing yield and high reliability. Another object of the present invention is to provide a technique capable of improving the productivity of LED mounted products. The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  According to one embodiment of the present invention, there is provided a method for manufacturing an LED-mounted product comprising: (a) preparing a wiring board having a wiring layer and a surface protective layer that covers and protects the wiring layer; and (b) on the wiring board. Mounting an LED chip electrically connected to the wiring layer exposed from the surface protective layer, and electrically connecting the chip; and (c) clamping the wiring board with a reflector molding die having a reflector cavity Then, after filling the reflector cavity with the resin for the reflector, heating and curing to form a reflector portion around the LED chip, and (d) the wiring with the lens molding die having the lens cavity The substrate is clamped, and the lens cavity containing the LED chip and the reflector is filled with a lens resin. Characterized in that it comprises a step of molding the part.

  According to this, the LED mounting product provided with the reflector part and lens part which were directly shape | molded on the wiring board (for example, PCB board | substrate) with which the LED chip was mounted can be manufactured. For this reason, the surface protective layer of the wiring board and the reflector portion are in close contact with each other, and the generation of resin burrs can be prevented. Therefore, it is possible to provide LED mounting products with high manufacturing yield and reliability.

  Moreover, since an LED chip can be manufactured by directly mounting an LED chip on a wiring board without using a lead frame and forming a reflector part and a lens part, the LED mounted part can be made smaller and thinner. The number of parts can be reduced and the product cost can be reduced. Moreover, the manufacturing process of LED mounting products can be simplified greatly, and the productivity of LED mounting products can be improved.

  In the LED mounting product manufacturing method according to another embodiment of the present invention, in the step (c), the wiring board is clamped with the reflector molding die having an escape recess for allowing the LED chip to escape, and the LED The reflector portion is formed while the tip is received in the relief recess. According to this, it is possible to prevent the reflector resin from adhering to the LED chip by the relief recess, and to provide an LED mounting product with a high manufacturing yield and high reliability. Moreover, a reflector part can be shape | molded in arbitrary layouts, protecting LED chip, and the productivity of LED mounting goods can be improved.

  In one embodiment of the present invention, a resin molding method for an LED mounted product includes a wiring layer and a surface protective layer that covers and protects the wiring layer, and is electrically connected to the wiring layer exposed from the surface protective layer. A resin molding method of an LED mounting product for molding a reflector part and a lens part on a wiring board on which an LED chip is mounted, wherein (a) the wiring board is clamped with a reflector molding die having a reflector cavity A step of filling the reflector cavity with a resin for the reflector and then heating and curing to form the reflector portion around the LED chip; and (b) the wiring with a lens mold having a lens cavity. Clamp the substrate and fill the lens cavity containing the LED chip and the reflector part with lens resin. After, wherein the heat-cured to a step of molding the lens portion.

  Moreover, in the resin molding method of the LED mounting product in another embodiment of the present invention, in the step (a), the wiring board is clamped by the reflector molding die having an escape recess for allowing the LED chip to escape, The reflector portion is molded while the LED chip is accommodated in the relief recess.

  An LED manufacturing apparatus according to an embodiment of the present invention includes a wiring layer and a surface protective layer that covers and protects the wiring layer, and an LED chip that is electrically connected to the wiring layer exposed from the surface protective layer. An LED manufacturing apparatus for manufacturing an LED mounting product in which a reflector portion and a lens portion are molded on a mounted wiring board, comprising a reflector molding die having a reflector cavity, and the wiring is formed by the reflector molding die. The substrate is clamped, and the reflector cavity is filled with a resin for reflector, and then heated and cured to form the reflector portion around the LED chip.

  In the LED manufacturing apparatus according to another embodiment of the present invention, the reflector molding die further includes an escape recess for allowing the LED chip to escape, and the wiring board is clamped by the reflector molding die, so that the LED chip is The reflector portion is molded while being accommodated in the escape recess.

  In an LED manufacturing apparatus according to another embodiment of the present invention, a lens molding die having a lens cavity is provided, the wiring board is clamped by the lens molding die, and the LED chip and the reflector unit are accommodated. After the lens cavity is filled with the lens resin, the lens portion is formed by heating and curing.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows. According to one embodiment of the present invention, it is possible to provide an LED mounted product with a high manufacturing yield and high reliability.

It is a top view of the LED mounting goods in one Embodiment of this invention. It is sectional drawing of the LED mounting goods in the AA line shown in FIG. It is a flowchart of the manufacturing process of the LED mounting product shown in FIG. It is sectional drawing in the manufacturing process of the LED mounting goods shown in FIG. It is sectional drawing in the manufacturing process of the LED mounting goods following FIG. It is sectional drawing in the manufacturing process of the LED mounting goods following FIG. FIG. 7 is a plan view of the lower mold after the mold is opened after the reflector molding of the resin mold apparatus corresponding to the manufacturing process shown in FIG. 6. It is sectional drawing at the time of the clamp of the resin mold apparatus in the BB line shown in FIG. It is sectional drawing of the resin mold apparatus in CC line shown in FIG. FIG. 2 is a plan view of a lower mold with a mold opened after reflector molding of a resin mold apparatus corresponding to the manufacturing process shown in FIG. 1. It is sectional drawing of the resin mold apparatus in the BB line shown in FIG. It is sectional drawing of the resin mold apparatus in the CC line shown in FIG. It is a top view of the LED mounting goods in other embodiment of this invention. It is a principal part top view of the resin mold apparatus corresponding to the manufacturing process of the LED mounting goods shown in FIG. It is a top view of the LED mounting goods in other embodiment of this invention. It is a top view of the LED mounting goods in other embodiment of this invention. It is a top view of the LED mounting goods in other embodiment of this invention. It is a top view of the LED mounting goods in other embodiment of this invention.

  In the following embodiments according to the present invention, a plurality of sections will be described when necessary. However, in principle, they are not irrelevant to each other, and one of them is a modification of some or all of the other, details, etc. There is a relationship. For this reason, the same code | symbol is attached | subjected to the member which has the same function in all the figures, and the repeated description is abbreviate | omitted.

  In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less. In addition, when referring to the shape of a component, etc., it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .

[Embodiment 1]
First, an LED mounted product 10 according to an embodiment of the present invention will be described mainly with reference to FIGS. FIG. 1 is a plan view of the LED mounted product 10, and FIG. 2 is a cross-sectional view of the LED mounted product 10 taken along the line AA of FIG. The LED mounted product 10 includes a wiring board 11 and an LED chip 12, and the LED chip 12 is mounted on the wiring board 11. The LED mounted product 10 includes a TVS (Transient Voltage Suppressor) diode 25 (electronic component) that suppresses a transient voltage applied to the LED chip 12, and the TVS diode 25 is mounted on the wiring board 11.

The wiring substrate 11 includes a core substrate 13 (base material), a wiring layer 15 provided on the core substrate 13 via an insulating layer 14 (interlayer insulating layer), and a surface protective layer 16 that covers and protects the wiring layer 15. And an external connection terminal 17. As the core substrate 13, for example, an aluminum (Al) substrate, a ceramic (Al ₂ O ₃ ) substrate, a glass epoxy substrate (FR-4), or the like can be used. Moreover, as the insulating layer 14, for example, a resin layer (such as an epoxy resin layer) can be used. As the wiring layer 15, for example, a plating layer (Cu layer or the like) can be used. The insulating layer 14 and the wiring layer 15 can be formed using, for example, a build-up technique. As the wiring layer 15 and the insulating layer 14, a single layer is shown in FIG. 2, but it may be a multilayer.

  As the surface protective layer 16, for example, a solder resist layer composed of a material in which silica, a photopolymerization initiator, or the like is added to an epoxy resin, a modified epoxy resin, or an acrylate resin by screen printing can be used. . The solder resist layer is insulative, withstands the soldering heat temperature (for example, about 260 ° C.), and has the performance of protecting the wiring board 11 from the environment such as heat and humidity as compared with the inner insulating layer 14. Are better.

  In the wiring substrate 11, a wiring layer 15 </ b> A (15) exposed from the surface protective layer 16 is configured as a die pad 20 as a region where the LED chip 12 is mounted. The wiring layer 15A is patterned and electrically connected to the external connection terminal 17A. Further, in the wiring substrate 11, a wiring layer 15 </ b> B (15) exposed from the surface protective layer 16 is configured as a connection pad 21 as a region to be wire-bonded to the connection terminal of the LED chip 12. The wiring layer 15B is patterned and electrically connected to the external connection terminal 17B. Note that the wiring layer 15A and the wiring layer 15B are electrically separated.

  For example, a pre-solder (solder) can be used as the external connection terminal 17. The external connection terminal 17 is provided so as to be exposed from the surface protective layer 16 at the end of the wiring substrate 11. A voltage can be supplied to the LED mounting product 10 from the outside via the external connection terminal 17.

  The LED chip 12 mounted on the wiring board 11 includes a pair of electrodes, ie, an anode electrode (positive electrode) on the front surface side and a cathode electrode (negative electrode) on the back surface side, and applies a predetermined voltage of forward bias between these electrodes. Thus, the device emits light (emits light). The LED chip 12 is die-bonded on the back surface side, the cathode electrode is electrically connected to the die pad 20 of the wiring substrate 11, and is wire-bonded on the front surface side, and the anode electrode is bonded via a bonding wire 22 (for example, a gold wire). Are electrically connected to the connection pads 21 of the wiring board 11.

  In order to improve the efficiency of light emission from the LED chip 12, the LED mounted product 10 includes a reflector portion 23 and a lens portion 24. The reflector portion 23 is formed on the wiring substrate 11 around the LED chip 12 and is made of a resin for reflector. The lens unit 24 is formed on the wiring board 11 so as to cover the LED chip 12 and the reflector unit 23, and is made of a lens resin.

  As the resin for the reflector of the reflector portion 23, an epoxy resin is used. As the filler, for example, a material mainly composed of aluminum nitride (AlN) for light reflection and heat dissipation is used. Since the filler of aluminum nitride is contained, the color is white as a whole, and thus it has reflectivity. That is, the light from the LED chip 12 is effectively reflected. In addition, since this resin has high thermal conductivity, it is possible to efficiently conduct the heat generated by the LED chip 12 to the outside and dissipate it.

In addition, as resin for reflectors, it is not limited to such an epoxy resin, Silicone resin and another thermosetting resin can also be used. In addition, the filler is not limited to such aluminum nitride, and the reflector resin may contain other fillers such as titanium oxide, silica, TiO ₂ , and SiO ₂ . Moreover, the color of the resin for reflectors is not limited to white, and may be other colors.

  As the lens resin of the lens portion 24, a silicone resin having translucency and thermosetting properties is used. Silicone resin is suitable for molding the LED chip 12 because it has a property that its translucency is less likely to be lowered by ultraviolet rays or heat than an epoxy resin, for example. The lens resin is not limited to a transparent one, and a resin colored with yellow or the like may be used as long as it is a translucent resin.

  In the LED mounted product 10 configured as described above, when a forward bias is applied to the LED chip 12 with the external connection terminal 17A as the negative electrode and the external connection terminal 17B as the positive electrode, the LED chip 12 emits light. The light emitted from the LED chip 12 is mainly emitted directly to the outside through the lens unit 24. On the other hand, part of the light emitted from the LED chip 12 is emitted toward the reflector unit 23, is reflected by the reflector unit 23, and is emitted to the outside through the lens unit 24.

  By the way, this LED mounting product 10 is configured without using a lead frame as compared with the one described in Patent Document 1 (the LED package having a lead frame mounted on a printed board). In other words, the LED mounted product 10 is configured such that the LED chip 12, the reflector portion 23, and the lens portion 24 are directly provided on the wiring substrate 11 (for example, a PCB substrate). For this reason, there is a merit that it is easy to make an assembly such as a light projection unit in which a large number of LEDs are mounted on one substrate.

  Further, the surface protective layer 16 and the reflector portion 23 are made of a resin material having the same main component, for example, an epoxy resin, so that the adhesion between the surface protective layer 16 and the reflector portion 23 is further improved. Can do.

  In the LED mounted product 10, the light emission efficiency of the LED chip 12 can be improved by providing the reflector portion 23 on the wiring substrate 11. For example, the luminous efficiency of the LED chip 12 can be further improved by molding the reflector portion 23 with an epoxy resin containing a white filler.

  Next, a method for manufacturing the LED mounted product 10 will be described mainly with reference to FIGS. FIG. 3 is a flowchart of the manufacturing process of the LED mounted product 10. 4-6 is sectional drawing of the LED mounting goods 10 in a manufacturing process, and is sectional drawing in the AA of FIG. As shown in FIG. 3, the method for manufacturing the LED mounted product 10 includes manufacturing steps from Step S <b> 10 to Step S <b> 50. In the present embodiment, a case where one LED mounted product 10 is obtained from one wiring board 11 will be described.

  First, as shown in FIG. 4, a flat wiring substrate 11 having a wiring layer 15 and a surface protective layer 16 covering and protecting the wiring layer 15 is prepared (step S10 in FIG. 3). Specifically, the wiring layer 15 (for example, a copper layer) is formed on the core substrate 13 via the insulating layer 14 on the wiring substrate 11 by using, for example, a build-up technique. Further, the surface protective layer 16 is formed using, for example, screen printing so as to cover the wiring layer 15. Further, in order to form the die pad 20 and the connection pad 21 on the wiring substrate 11, the surface protection layer 16 at a location is removed by using, for example, an etching technique, and the wiring layer 15 is exposed.

  Subsequently, as shown in FIG. 5, the LED chip 12 electrically connected to the wiring layer 15 (die pad 20 and connection pad 21) exposed from the surface protective layer 16 is mounted on the wiring substrate 11 (FIG. 3). Step S20). Specifically, the LED chip 12 is bonded (mounted) on the back side thereof via the die pad 20 and a conductive material (for example, solder). In addition, the LED chip 12 bonded to the die pad 20 is wire-bonded via the connection pad 21 and the bonding wire 22 at the connection terminal on the surface side.

  Then, as shown in FIG. 6, the reflector part 23 is shape | molded around the LED chip 12 on the wiring board 11 (step S30 of FIG. 3). Specifically, using a resin molding apparatus as the LED manufacturing apparatus, the reflector portion 23 is transfer-molded on the wiring board 11 with the workpiece in the state shown in FIG.

  Here, a resin molding method for transfer molding the reflector portion 23 will be described mainly with reference to FIGS. FIG. 7 is a main part (press part) of the resin molding apparatus 60 during the manufacturing process of the LED mounted product 10, and is a plan view of the opened lower mold after the reflector molding, and FIG. 8 is a view of B in the state shown in FIG. 9 is a cross-sectional view corresponding to the line B, and FIG. 9 is a cross-sectional view corresponding to the line CC in the state shown in FIG. In FIG. 7, the area where the upper mold 71 of the reflector mold 70 (mold mold) and the wiring board 11 are in contact with each other is indicated by hatching.

  The resin mold device 60 is configured to include at least one press unit between a supply unit and a storage unit (not shown). A supply part is comprised by the well-known mechanism which supplies a workpiece | work and resin to a press part using a loader (conveyance apparatus). In addition, the storage unit is configured by a known mechanism that takes out and stores the transfer-molded work from the press unit using an unloader (conveyance device).

  In order to transfer-mold the reflector part 23, the resin mold device 60 includes a press part for the reflector part 23. As shown in FIG. 9, the reflector press section is supplied with an upper mold 71 (one mold) and a lower mold 72 (the other mold) that form a pair as a reflector molding mold 70, and a reflector resin 23a. And a plunger 61 accommodated in the pot 62 so as to be slidable (movable in the vertical direction). A pot 62 that opens on the mold surface is provided at the center of the lower die 72, and a set portion 73 for setting the wiring substrate 11 is provided at the end of the lower die 72.

  The upper mold 71 includes a reflector cavity 74, a cull 75, a runner gate 76, a chip relief recess 77, a terminal relief recess 78, and an air vent 79 that are recessed from the parting surface. ing. The reflector cavity 74 in which the reflector portion 23 is molded is recessed in a circumferential groove shape from the parting surface of the upper mold 71, and is annular (see FIG. 7) in plan view and trapezoidal shape (see FIG. (See FIG. 9). In forming the resin path of the reflector molding die 70, the runner gate 76 is provided so as to be narrowed from the cull 75 provided at a position facing the pot 62 to the reflector cavity 74. The air vent 79 is provided on the side opposite to the runner gate 76 side of the reflector cavity 74 and communicates with the reflector cavity 74.

  When the wiring board 11 is clamped by the upper mold 71 of the reflector molding die 70 and the reflector resin 23a is filled in the reflector cavity 74, the chip relief recess 77 is connected to the LED from the upper mold 71 of the reflector molding mold 70. The chip 12 and the TVS diode 25 are accommodated so as to escape (not contact). Similarly, the terminal relief recess 78 is for accommodating the external connection terminal 17 so as to escape from the reflector molding die 70 at the time of clamping. The chip relief recess 77 and the terminal relief recess 78 are independent of the resin path of the reflector molding die 70, and no resin flows in.

  In the resin molding apparatus 60 provided with such a reflector molding die 70, the wiring substrate 11 is clamped by the reflector molding die 70, and the plunger 61 is pushed upward in the pot 62, so that the molding temperature is reached. The molten reflector resin 23 a is heated by the heated reflector molding die 70. At this time, in the reflector cavity 74, the reflector resin 23a flows in contact with the surface protective layer 16 (for example, epoxy resin).

  Next, after the reflector cavity 74 is filled with the reflector resin 23 a, the reflector portion 23 is formed around the LED chip 12 by heating and curing under predetermined conditions (holding pressure, temperature, time).

  By preventing the reflector resin 23a from adhering to the LED chip 12, it is possible to provide the LED mounting product 10 with a high manufacturing yield and high reliability. In addition, the reflector portion 23 can be formed in an arbitrary layout while protecting the LED chip 12, and the productivity of the LED mounted product 10 can be improved.

  Then, as shown in FIG. 1, the lens part 24 is shape | molded on the wiring board 11 (step S40 of FIG. 3). Specifically, a resin molding apparatus is used as the LED manufacturing apparatus, and the lens part 24 is transfer molded on the wiring substrate 11 so as to cover the LED chip 12 and the reflector part 23, etc., with the workpiece in the state shown in FIG. To do.

  Here, a resin molding method for molding the lens portion 24 will be described with reference to FIGS. FIG. 10 is a main part (press part) of the resin molding apparatus 60 during the manufacturing process of the LED mounted product 10, and is a plan view of the lower mold after the reflector is formed, and FIG. 11 is a view of B in the state shown in FIG. FIG. 12 is a cross-sectional view corresponding to line B, and FIG. 12 is a cross-sectional view corresponding to line CC in the state shown in FIG. In FIG. 10, the area where the upper mold 81 of the lens molding die 80 (molding die) and the wiring substrate 11 are in contact with each other is indicated by hatching.

  In order to transfer-mold the lens unit 24, the resin mold device 60 includes a press unit for the lens unit 24. As shown in FIG. 12, the lens press section is supplied with an upper mold 81 (one mold) and a lower mold 82 (the other mold) that form a pair as a lens molding mold 80, and a lens resin 24a. And a plunger 61 accommodated in the pot 62 so as to be slidable (movable in the vertical direction). A pot 62 that opens on the mold surface is provided at the center of the lower die 82, and a set portion 83 for setting the wiring substrate 11 is provided at the end of the lower die 82.

  The upper mold 81 includes a lens cavity 84, a cull 85, a runner gate 86, a terminal relief recess 88, and an air vent 89 formed to be recessed from the parting surface. The lens cavity 84 in which the lens portion 24 is molded has a first concave portion that is recessed from the parting surface of the upper mold 81 so as to accommodate the reflector portion 23, and a second R-surface shape that is further recessed from the first concave portion. A recess is provided. For this reason, the lens cavity 84 has a rectangular shape in plan view (see FIG. 10) and a hemispherical shape in the cross-sectional view above the LED chip 12 (see FIGS. 11 and 12).

  In forming the resin path of the lens molding die 80, the runner gate 86 is provided so as to narrow from the cull 85 provided at a position facing the pot 62 to the lens cavity 84. The air vent 89 is provided in communication with the lens cavity 84 on the opposite side of the lens cavity 84 from the runner gate 86 side.

  The terminal relief recess 88 allows the external connection terminal 17 to escape from the lens molding die 80 when the wiring board 11 is clamped with the lens molding die 80 and the lens resin 84a is filled into the lens cavity 84 (not contacted). ) So as to accommodate. The terminal relief recess 88 is independent of the resin path of the lens molding die 80, and no resin flows in.

  In the resin molding apparatus 60 provided with such a lens molding die 80, the wiring substrate 11 is clamped by the lens molding die 80, and the plunger 61 is pushed upward in the pot 62, so that the molding temperature is reached. The heated and melted lens resin 24a is pumped. At this time, in the lens cavity 84, the lens resin 24a flows in contact with the surface protective layer 16 (for example, epoxy resin) and the reflector portion 23 (reflector resin 23a).

  Next, the lens portion 24 is molded by heating and curing under predetermined conditions (holding pressure, temperature, time).

  Thus, the LED mounting product 10 in which the reflector portion 23 and the lens portion 24 are transfer-molded on the wiring substrate 11 on which the LED chip 12 is mounted can be manufactured. In the present embodiment, the same resin molding process is continuously performed, that is, after the reflector portion 23 is molded (primary molding), the lens portion 24 including the reflector portion 23 is molded (secondary molding, overmolding). For this reason, by concentrating the same manufacturing process of the LED mounted product 10, the entire manufacturing process of the LED mounted product 10 can be simplified, and the productivity of the LED mounted product 10 can be improved.

[Embodiment 2]
In the first embodiment, the LED mounted product 10 in which one LED chip 12 is mounted on the wiring board 11 inside the annular reflector portion 23 in plan view is shown (see FIG. 1). In contrast, the present embodiment shows an LED mounted product 10A (10) in which a plurality (two) of LED chips 12 are mounted on a wiring board 11A (11) inside a circular reflector portion 23 in plan view ( (See FIG. 13). FIG. 13 is a plan view of the LED mounted product 10A (10) according to the embodiment of the present invention.

  Moreover, in the said Embodiment 1, the case where the one LED mounting product 11 was acquired from the one wiring board 11 was shown. On the other hand, this embodiment prepares a large-sized wiring board 11A (11) (see FIG. 14), performs LED chip mounting, reflector molding, and lens molding, and then surrounds the lens portion 24 (in FIG. 14, This is a case where dicing such as blade cutting, laser cutting, or press cutting is performed and separated into individual pieces to obtain a plurality of LED mounted products 10A. FIG. 14 is a plan view of a principal part of the resin molding apparatus 60A (60) corresponding to the manufacturing process of the LED mounted product 10A shown in FIG. 13, and the reflector part 23 is in a state of being transfer-molded by the resin molding apparatus 60A. .

  Also in the present embodiment, the LED mounted product 10A including the reflector portion 23 and the lens portion 24 that are directly formed on the wiring substrate 11A (for example, a PCB substrate) on which the LED chip 12 is mounted can be manufactured. . For this reason, the surface protective layer 16 of the wiring board 11A and the reflector portion 23 are in close contact with each other, and the generation of resin burrs can be prevented. Therefore, it is possible to provide the LED mounting product 10A with high manufacturing yield and reliability.

[Embodiment 3]
In the first embodiment, the case where the LED chip 12, the reflector portion 23, and the lens portion 24 are provided as a set on the wiring substrate 11 having a rectangular shape in plan view has been described. On the other hand, in the present embodiment, as in the LED mounted product 10B (10) shown in FIG. 15, a set of the LED chip 12, the reflector portion 23, and the lens portion 24 on the strip-like wiring board 11B (11). Is provided. Further, as in the LED mounted product 10C (10) shown in FIG. 16, a plurality of sets of the LED chip 12, the reflector portion 23, and the lens portion 24 are provided on the circular wiring substrate 11C (11). In addition, as in the LED mounted product 10D (10) shown in FIG. 17, the LED chip 12, the reflector portion 23, and the lens portion 24 are provided in a matrix on the rectangular wiring board 11D (11). .

  Also in the present embodiment, LED mounted products 10B, 10C including a reflector portion 23 and a lens portion 24 that are directly molded on the wiring boards 11B, 11C, 11D (for example, a PCB substrate) on which the LED chip 12 is mounted. 10D can be manufactured. For this reason, the surface protective layer 16 and the reflector part 23 of the wiring boards 11B, 11C, and 11D are in close contact with each other. Therefore, it is possible to provide LED mounting products 10B, 10C, and 10D with high manufacturing yield and reliability.

[Embodiment 4]
In the third embodiment, a case has been described in which a plurality of annular reflector portions 23 in a plan view are formed on the wiring board 11 and the LED chips 12 are arranged in the respective LED arrangement regions (concave portions). On the other hand, in the present embodiment, like the LED mounting product 10E (10) shown in FIG. 18, the reflector portion 23A having the LED arrangement region (concave portion) in a lattice shape is transfer-molded, and each LED arrangement region is formed. This is a case where the LED chip 12 is arranged. In this case, the lens portion 24A (24) is transfer-molded so as to cover the plurality of LED chips 23 and the reflector portion 23A so as to cover the plurality of LED arrangement regions collectively.

  According to this, the light emission intensity can be increased using the plurality of LED chips 12. Moreover, since it becomes the reflector part 23A which connected the reflector part 23 of the said Embodiment 3 mutually, size reduction can be achieved in the LED mounting product 10E.

  In the first to third embodiments, the TVS diode 25 is provided on the inner side or the outer side of the annular reflector 23 in plan view. On the other hand, in this embodiment, like the LED mounted product 10E (10) shown in FIG. 18, the TVS transistor 25 is accommodated in the reflector cavity, and the TVS diode 25 is molded with the reflector resin. .

  According to this, the area where the TVS diode 25 is disposed can be overlapped with the molding area of the reflector portion 23A, and the LED mounted product 10E can be downsized. Further, the reflector portion 23A can be formed in an arbitrary layout, and the productivity of the LED mounted product 10E can be improved.

  Also in the present embodiment, the LED mounted product 10E including the reflector portion 23A and the lens portion 24A that are directly molded on the wiring substrate 11E (for example, PCB substrate) on which the LED chip 12 is mounted can be manufactured. . For this reason, the surface protection layer 16 of the wiring board 11E and the reflector part 23 will adhere, and generation | occurrence | production of a resin burr | flash can be prevented. Therefore, it is possible to provide the LED mounting product 10E with high manufacturing yield and reliability.

  As described above, the present invention has been specifically described based on the embodiment. However, the following is a brief description of typical features and actions and effects obtained thereby.

  The LED mounted product 10 is electrically connected to the wiring layer 11 having the wiring layer 15 and the surface protection layer 16 that covers and protects the wiring layer 15, and the wiring layer 15 that is mounted on the wiring substrate 11 and exposed from the surface protection layer 16. The LED chip 12 connected to the reflector, the reflector part 23 formed by transfer molding on the wiring board 11 around the LED chip 12 using the resin for the reflector, and the wiring board 11 so as to cover the LED chip 12 and the reflector part 23 And a lens portion 24 formed by transfer molding using a lens resin.

  According to this, the LED mounting product 10 including the reflector part 23 and the lens part 24 formed directly on the wiring board 11 (for example, PCB board) on which the LED chip 12 is mounted can be manufactured. For this reason, the surface protective layer 16 of the wiring board 11 and the reflector part 23 will adhere, and generation | occurrence | production of a resin burr | flash can be prevented. Therefore, the LED mounting product 10 with high manufacturing yield and reliability can be provided.

  Furthermore, it goes without saying that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention.

  In the above-described embodiment, the case where the wiring substrate 11 is clamped while the LED chip 12 is accommodated in the relief recess 77 of the reflector molding die 70 when the reflector portion 23 is transfer molded has been described. Not limited to this, for wiring boards on which LED chips are flip-chip mounted, a film is attached to the parting surface of the reflector mold without providing a relief recess, and the thickness of the LED chip is absorbed by the film. It may be a case where the substrate is clamped.

  In the embodiment, the case where the reflector portion 23 and the lens portion 24 are transfer molded has been described. Not only this but the case where compression molding is performed may be sufficient.

  In the above-described embodiment, the case where the reflector portion 23 and the lens portion 24 are transfer molded using one resin molding device 60 (LED manufacturing device) has been described. However, the present invention is not limited thereto, and it may be a case where reflector molding and lens molding are respectively performed using an LED manufacturing apparatus (manufacturing system) including two resin mold apparatuses.

  In the embodiment, the case where the wiring substrate 11 having the wiring layer 15 and the surface protective layer 16 that covers and protects the wiring layer 15 has been described. If it is such, the case where printed circuit boards (organic substrate), such as a PCB board, are used may be used, for example.

  In the embodiment, the case where the LED chip 12 is mounted on the wiring board 11 has been described. However, the present invention is not limited to this, and other electronic components such as semiconductor chips and chip resistors may be mounted on the wiring board together with the LED chips. In this case, the relief molding for the electronic component can be provided in the reflector molding die or the lens molding die to prevent the resin from adhering to the electronic component.

DESCRIPTION OF SYMBOLS 10 LED mounting product 11 Wiring board 12 LED chip 16 Surface protective layer 23 Reflector part 24 Lens part

Claims (7)

(A) preparing a wiring board having a wiring layer and a surface protective layer covering and protecting the wiring layer;
(B) mounting and electrically connecting an LED chip electrically connected to the wiring layer exposed from the surface protective layer on the wiring substrate;
(C) Clamping the wiring board with a reflector molding die having a reflector cavity, filling the reflector cavity with a resin for the reflector, and then heating and curing to form a reflector portion around the LED chip Process,
(D) The wiring board is clamped with a lens molding die having a lens cavity, and the lens cavity containing the LED chip and the reflector portion is filled with a lens resin, and then heated and cured to form a lens. And a step of forming a part. A method for manufacturing an LED-mounted product. In the manufacturing method of the LED mounting product of Claim 1,
In the step (c), the wiring board is clamped by the reflector molding die having an escape recess for allowing the LED chip to escape, and the reflector portion is molded while the LED chip is accommodated in the escape recess. The manufacturing method of the LED mounting product. A reflector part and a lens are provided on a wiring board having a wiring layer and a surface protective layer that covers and protects the wiring layer, and an LED chip that is electrically connected to the wiring layer exposed from the surface protective layer is mounted on the wiring board. It is a resin molding method of an LED mounting product for molding a part,
(A) After clamping the wiring board with a reflector mold having a reflector cavity, filling the reflector cavity with a resin for the reflector, and then heating and curing to mold the reflector portion around the LED chip And a process of
(B) Clamp the wiring board with a lens molding die having a lens cavity, fill the lens cavity containing the LED chip and the reflector portion with a lens resin, and then heat and cure the resin. And a step of molding the lens portion. A resin molding method for an LED mounted product. In the resin molding method of the LED mounting product according to claim 3,
In the step (a), the reflector substrate is molded while the wiring board is clamped by the reflector molding die having an escape recess for allowing the LED chip to escape, and the LED chip is accommodated in the escape recess. A resin molding method for LED mounting products. A reflector part and a lens are provided on a wiring board having a wiring layer and a surface protective layer that covers and protects the wiring layer, and an LED chip that is electrically connected to the wiring layer exposed from the surface protective layer is mounted on the wiring board. An LED manufacturing apparatus for manufacturing an LED mounting product with a molded part,
A reflector mold having a reflector cavity,
The LED is characterized in that the wiring board is clamped by the reflector molding die, the reflector cavity is filled with a resin for the reflector, and then heated and cured to mold the reflector portion around the LED chip. manufacturing device. The LED manufacturing apparatus according to claim 5,
The reflector molding die has an escape recess that allows the LED chip to escape,
The LED manufacturing apparatus, wherein the wiring board is clamped by the reflector molding die, and the reflector part is molded while the LED chip is accommodated in the relief recess. The LED manufacturing apparatus according to claim 5 or 6,
A lens molding die having a lens cavity;
Clamping the wiring board with the lens molding die, filling the lens cavity containing the LED chip and the reflector part with a lens resin, and then heating and curing to mold the lens part. LED manufacturing apparatus characterized.

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