JP2017157683A - Led light-emitting device and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED light-emitting device that can be made thin.SOLUTION: An LED light-emitting device A1 includes an LED chip 1 having a semiconductor layer 12, a chip main face 1a and a chip reverse face 1b directing oppositely to each other in the thickness direction (z direction) of the semiconductor layer 12, and a p-side electrode 13 formed on the chip main face 1a, a translucent resin 5 covering other than the chip reverse face 1b of the LED chip 1, and transmitting the light from the LED chip 1, and a first electrode pad 21 subjected to conduction bonding to the p-side electrode 13 by means of a wire 31, and having a first principal surface 21a to which a wire 31 is bonded, and a first reverse surface directing the opposite side to the first electrode pad 21. The translucent resin 5 includes a translucent resin reverse face 5b directing the same direction as the chip reverse face 1b. The chip reverse face 1b and a first reverse face 21b are exposed from the translucent resin reverse face 5b, and are flush with the translucent resin reverse face 5b.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an LED light emitting device including an LED chip as a light source and a method for manufacturing the same.

  Patent Document 1 discloses an example of a conventional LED light emitting device. The LED light-emitting device disclosed in this document includes a substrate and an LED chip mounted on the substrate. The LED chip is mounted on one side of the substrate. The LED light-emitting device includes a translucent resin that covers the LED chip. In some cases, a reflector that reflects light traveling sideways from the LED chip in a direction in which the one side faces is provided.

  Since the LED chip is mounted on the one surface of the substrate, the LED chip protrudes from the substrate. Furthermore, the translucent resin and the reflector must be thicker than the LED chip. Therefore, it is not easy to make the LED light-emitting device thin by reducing the thickness direction dimension of the LED light-emitting device.

Japanese Patent Laying-Open No. 2015-191924

  The present invention has been conceived under the circumstances described above, and an object thereof is to provide an LED light-emitting device that can be reduced in thickness.

  The LED light emitting device provided by the first aspect of the present invention includes a semiconductor layer, a chip main surface and a chip back surface that face opposite sides in the thickness direction of the semiconductor layer, and a first formed on the chip main surface. An LED chip comprising one electrode, a translucent resin that transmits light from the LED chip that covers the LED chip other than the back surface of the LED chip, and is electrically connected to the first electrode by a first wire, A first electrode pad including a first main surface to which the first wire is bonded and a first back surface facing the opposite side of the first main surface, and the translucent resin includes the chip back surface, A back surface of the transparent resin facing in the same direction is provided, and the back surface of the chip and the first back surface are exposed from the back surface of the transparent resin and are flush with the back surface of the transparent resin.

  In a preferred embodiment of the present invention, the LED chip further includes a second electrode formed on the chip main surface, and is electrically connected to the second electrode by a second wire. The LED light emitting device further includes a second electrode pad including a second main surface to which two wires are bonded and a second back surface facing the opposite side of the second main surface, and the second back surface is It is exposed from the back surface of the translucent resin and is flush with the back surface of the translucent resin.

  In a preferred embodiment of the present invention, the LED chip further includes a second electrode located on the opposite side of the first electrode with the semiconductor layer interposed therebetween and constituting the back surface of the chip.

  In a preferred embodiment of the present invention, the LED light-emitting device includes an opaque resin main surface facing the same direction as the chip main surface, an opaque resin back surface facing the same direction as the chip back surface, and the non-transparent resin surface. A translucent resin having a reflective surface that connects the translucent resin main surface and the translucent resin back surface and surrounds the LED chip is further provided, and the translucent resin back surface is flush with the chip back surface. It has become.

  In a preferred embodiment of the present invention, the opaque resin exposes at least a part of the first main surface, and the first wire includes the opaque light in the first main surface. Bonded to the area exposed from the resin.

  In a preferred embodiment of the present invention, the reflecting surface has a circular cross section parallel to the back surface of the opaque resin.

  In a preferred embodiment of the present invention, the reflection surface has a shape in which a cross section parallel to the back surface of the opaque resin has a portion protruding in the direction of the first electrode pad.

  In a preferred embodiment of the present invention, the translucent resin has a translucent resin main surface that is flush with the translucent resin main surface.

  In a preferred embodiment of the present invention, the opaque resin is made of a white resin.

  In preferable embodiment of this invention, the shape of the said translucent resin is a rectangular parallelepiped shape.

  In a preferred embodiment of the present invention, the shape of the translucent resin is a bullet-shaped shape having a portion that bulges in a direction in which the chip main surface faces.

  The manufacturing method provided by the 2nd side surface of this invention is a manufacturing method of LED light-emitting device, Comprising: The process which forms an electrode pad in the single side | surface of a fixing member, The LED chip which has an electrode in the single side | surface of the said fixing member A step of electrically connecting the electrode and the electrode pad of the LED chip with a wire, and a translucent resin that transmits light from the LED chip so as to cover the LED chip and the wire And a step of peeling the fixing member from the LED chip, the electrode pad and the translucent resin.

  In a preferred embodiment of the present invention, prior to the step of forming the light-transmitting resin, a step of forming a light-impermeable resin so as to surround the LED chip is provided. It is formed by injecting resin into a region surrounding the LED chip of the opaque resin and curing it.

  In a preferred embodiment of the present invention, the fixing member is a dicing tape.

  According to the present invention, the back surface of the chip is exposed and does not include a substrate or the like that supports the back surface of the chip. The chip back surface, the first back surface, and the translucent resin back surface are all flush with each other. Thereby, the thickness direction dimension can be made into the thickness direction dimension of the said translucent resin which does not include dimensions, such as a board | substrate. Therefore, the LED light emitting device can be thinned.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

It is a principal part top view which shows the LED light-emitting device based on 1st Embodiment of this invention. It is a bottom view which shows the LED light-emitting device of FIG. It is sectional drawing which follows the III-III line of FIG. It is a figure which shows an example of the manufacturing method of the LED light-emitting device of FIG. It is a principal part top view which shows the LED light-emitting device based on 2nd Embodiment of this invention. It is a bottom view which shows the LED light-emitting device of FIG. It is sectional drawing which follows the VII-VII line of FIG. It is a principal part top view which shows the LED light-emitting device based on 3rd Embodiment of this invention. It is a bottom view which shows the LED light-emitting device of FIG. It is sectional drawing which follows the XX line of FIG. It is a principal part top view which shows the LED light-emitting device based on 4th Embodiment of this invention. It is a bottom view which shows the LED light-emitting device of FIG. It is sectional drawing which follows the XIII-XIII line | wire of FIG. It is sectional drawing which shows the modification of the LED light-emitting device based on 4th Embodiment of this invention. It is sectional drawing which shows the modification of the LED light-emitting device based on 4th Embodiment of this invention.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1 to 3 show an LED light-emitting device according to a first embodiment of the present invention. The LED light emitting device A1 of the present embodiment includes an LED chip 1, a first electrode pad 21, a second electrode pad 22, wires 31, 32, a reflector 4, and a translucent resin 5.

  FIG. 1 is a plan view of an essential part showing the LED light emitting device A1. FIG. 2 is a bottom view showing the LED light emitting device A1. 3 is a cross-sectional view taken along line III-III in FIG. In these drawings, the thickness direction of the LED light emitting device A1 is defined as the z direction, and the directions perpendicular to the z direction are defined as the x direction and the y direction. In FIG. 1 and FIG. 2, the translucent resin 5 is hatched for convenience of understanding.

  The LED chip 1 is a light source of the LED light emitting device A1, and emits, for example, visible light, infrared light, ultraviolet light, and the like. The LED chip 1 is formed by laminating a semiconductor layer 12 on a support substrate 11. The chip main surface 1 a on the semiconductor layer 12 side in the thickness direction (z direction) of the semiconductor layer 12 and the support substrate in the thickness direction. 11 side chip back surface 1b (see FIG. 3). The LED chip 1 is a so-called two-wire type chip, and a p-side electrode 13 conducting to the p-type semiconductor layer of the semiconductor layer 12 and an n-side electrode 14 conducting to the n-type semiconductor layer are formed on the chip main surface 1a. It is formed (see FIG. 3). One end of a wire 31 is bonded to the p-side electrode 13, and one end of a wire 32 is bonded to the n-side electrode 14. The “p-side electrode 13” corresponds to the “first electrode” of the present invention, and the “n-side electrode 14” corresponds to the “second electrode” of the present invention. The structure of the LED chip 1 is not limited to this.

  The first electrode pad 21 and the second electrode pad 22 are used as electrodes that are conductively joined when the LED light emitting device A1 is mounted on a circuit board or the like. The first electrode pad 21 and the second electrode pad 22 are made of, for example, a single type or a plurality of types of metals such as Cu, Ni, Ti, and Au, and are formed by plating, for example. The first electrode pad 21 includes a first main surface 21a to which the other end of the wire 31 is bonded, and a first back surface 21b facing the opposite side of the first main surface 21a. The second electrode pad 22 includes a second main surface 22a to which the other end of the wire 32 is bonded, and a second back surface 22b facing the opposite side of the second main surface 22a.

  The chip back surface 1b of the LED chip 1, the first back surface 21b of the first electrode pad 21, and the second back surface 22b of the second electrode pad 22 are exposed from the reflector 4 and the translucent resin 5 (FIGS. 2 and 3). See FIG. 3).

  The wires 31 and 32 are for electrically connecting the LED chip 1 to the first electrode pad 21 and the second electrode pad 22 and are made of a metal such as Au. One end of the wire 31 is bonded to the p-side electrode 13 of the LED chip 1, and the other end is bonded to the first main surface 21 a of the first electrode pad 21. One end of the wire 32 is bonded to the n-side electrode 14 of the LED chip 1, and the other end is bonded to the second main surface 22 a of the electrode pad 22.

  The reflector 4 is for reflecting the light emitted from the LED chip 1 to the side toward the chip main surface 1a. The reflector 4 is made of, for example, white silicone resin or epoxy resin, and is formed so as to surround the LED chip 1. The reflector 4 connects the reflector main surface 4a facing the same direction as the chip main surface 1a, the reflector back surface 4b facing the same direction as the chip back surface 1b, the reflector main surface 4a and the reflector back surface 4b, and surrounds the LED chip 1. And a reflective surface 4c. The reflector 4 also has a main surface side opening 41 that opens to the reflector main surface 4a side, and a back surface side opening 42 that opens to the reflector back surface 4b side. The “reflector 4” corresponds to the “opaque resin” of the present invention. The “reflector main surface 4a” corresponds to the “opaque resin main surface” of the present invention, and the “reflector back surface 4b” corresponds to the “opaque resin back surface” of the present invention. The reflector 4 is formed by molding, for example.

  In the present embodiment, the reflective surface 4c is inclined so as to be farther from the LED chip 1 in a direction perpendicular to the z direction as it is separated from the reflector back surface 4b in the thickness direction (z direction) of the reflector 4. Yes. That is, the reflecting surface 4c has a tapered shape in which a cross section perpendicular to the z direction increases toward the reflector main surface 4a. Further, the reflecting surface 4c has a circular cross section perpendicular to the z direction (a cross section parallel to the reflector back surface 4b).

  The reflector 4 exposes the region of the first main surface 21a of the first electrode pad 21 where the wire 31 is bonded, and the wire 32 of the second main surface 22a of the second electrode pad 22 A region to be bonded is exposed (see FIGS. 1 and 3). The reflector back surface 4b of the reflector 4 is flush with the chip back surface 1b of the LED chip 1, the first back surface 21b of the first electrode pad 21, and the second back surface 22b of the second electrode pad 22 (see FIG. 3). ).

  The translucent resin 5 covers other than the chip back surface 1 b of the LED chip 1 and fills the space surrounded by the reflecting surface 4 c of the reflector 4. The translucent resin 5 is made of a material that transmits light from the LED chip 1 such as a transparent or translucent silicone resin or epoxy resin. The translucent resin 5 is formed, for example, by injecting a translucent resin material in a liquid state from the main surface side opening 41 into a space surrounded by the reflection surface 4c of the reflector 4 and then curing it. The translucent resin 5 includes a translucent resin main surface 5a facing the same direction as the chip main surface 1a and a translucent resin back surface 5b facing the same direction as the chip back surface 1b. The translucent resin 5 may include a fluorescent material that emits light having a wavelength different from that of the light when excited by the light from the LED chip 1.

  The translucent resin 5 is formed so as not to protrude from the opening 42 on the back surface side of the reflector 4, and the translucent resin back surface 5b is flush with the reflector back surface 4b (see FIG. 3). That is, the chip back surface 1 b of the LED chip 1, the first back surface 21 b of the first electrode pad 21, the second back surface 22 b of the second electrode pad 22, the reflector back surface 4 b of the reflector 4, and the translucent resin back surface of the translucent resin 5. 5b is all flat.

  In the present embodiment, the translucent resin 5 is formed so as not to protrude from the main surface side opening 41 of the reflector 4, and the translucent resin main surface 5a and the reflector main surface 4a are flush with each other. (See FIG. 3). The translucent resin 5 may be formed so as to rise from the main surface side opening 41 of the reflector 4 and function as a lens. However, in order to make the LED light emitting device A1 thinner, it is desirable that the translucent resin main surface 5a and the reflector main surface 4a be flush with each other.

  Next, an example of a method for manufacturing the LED light emitting device A1 will be described with reference to FIG.

  First, the 1st electrode pad 21 and the 2nd electrode pad 22 are formed in the upper surface (adhesion surface 6a) of the heat resistant dicing tape 6 arrange | positioned so that the adhesion surface 6a may face upwards, and LED chip 1 is arrange | positioned ( (See FIG. 4 (a)). The heat-resistant dicing tape 6 corresponds to the “fixing member” of the present invention. The formation of the first electrode pad 21 and the second electrode pad 22 is performed, for example, by plating. Specifically, first, a Cu plating layer is formed in a so-called solid coating form on the heat-resistant dicing tape 6 by electroless plating. Then, the first electrode pad 21 and the second electrode pad 22 are formed by performing patterning using, for example, etching on the Cu plating layer and forming a metal plating layer such as Cu, Ni, or Au by electrolytic plating. The first electrode pad 21 and the second electrode pad 22 created in advance may be formed by other methods. The surface of the first electrode pad 21 (second electrode pad 22) in contact with the adhesive surface 6a of the heat-resistant dicing tape 6 is the first back surface 21b (second back surface 22b). Then, the LED chip 1 is disposed between the first electrode pad 21 and the second electrode pad 22. The LED chip 1 is arranged so that the chip back surface 1 b is in contact with the adhesive surface 6 a of the heat-resistant dicing tape 6. The first electrode pad 21 and the second electrode pad 22 may be formed or disposed after the LED chip 1 is disposed first.

  Next, the LED chip 1 is electrically connected to the first electrode pad 21 and the second electrode pad 22 by bonding wires 31 and 32, respectively (see FIG. 4B).

  Next, the reflector 4 is formed on the adhesive surface 6a of the heat-resistant dicing tape 6 so as to surround the LED chip 1 (see FIG. 4C). The reflector 4 is formed on the heat-resistant dicing tape 6 by, for example, molding. Alternatively, the reflector 4 may be prepared separately and disposed on the adhesive surface 6 a of the heat resistant dicing tape 6. The surface of the reflector 4 facing the adhesive surface 6a of the heat-resistant dicing tape 6 becomes the reflector back surface 4b. Note that the reflector 4 may be formed before the LED chip 1 is disposed, or the wires 31 and 32 may be bonded to the LED chip 1 after the reflector 4 is formed.

  Next, the translucent resin 5 is formed in the space surrounded by the reflecting surface 4c of the reflector 4 (see FIG. 4D). Specifically, the light-transmitting resin material in a liquid state is injected into the space surrounded by the reflecting surface 4c of the reflector 4 from the main surface side opening 41 and then cured. By appropriately adjusting the viscosity and amount of the translucent resin material to be injected, the translucent resin 5 is prevented from protruding from the main surface side opening 41 of the reflector 4. The surface of the translucent resin 5 facing the adhesive surface 6a of the heat-resistant dicing tape 6 becomes the translucent resin back surface 5b.

  Next, cutting is performed at a predetermined position, and the heat-resistant dicing tape 6 is peeled off from the LED chip 1, the first electrode pad 21, the second electrode pad 22, the reflector 4, and the translucent resin 5, so that the LED light emitting device A1 is obtained (FIG. 4 (e)). In addition, you may make it cut | disconnect, after peeling the heat-resistant dicing tape 6 previously.

  The LED chip 1, the first electrode pad 21 and the second electrode pad 22 are arranged on the heat-resistant dicing tape 6, the reflector 4 and the translucent resin 5 are formed thereon, and then the heat-resistant dicing tape 6 is peeled off. Therefore, the chip back surface 1 b of the LED chip 1, the first back surface 21 b of the first electrode pad 21, and the second back surface 22 b of the second electrode pad 22 are exposed from the reflector 4 and the translucent resin 5. The chip back surface 1b, the first back surface 21b, the second back surface 22b, the reflector back surface 4b, and the translucent resin back surface 5b are all flush with each other.

  The heat-resistant dicing tape 6 is used to fix the LED chip 1, the first electrode pad 21, and the second electrode pad 22 in the manufacturing process, and may be replaced with another fixing member. For example, a plate-like member coated with an adhesive may be used.

  Next, the operation of the LED light emitting device A1 will be described.

  According to this embodiment, the chip back surface 1b of the LED chip 1 is exposed. That is, the LED light emitting device A1 does not include a substrate that supports the chip back surface 1b of the LED chip 1, and does not support the chip back surface 1b by the reflector 4. Further, the chip back surface 1 b of the LED chip 1, the first back surface 21 b of the first electrode pad 21, the second back surface 22 b of the second electrode pad 22, the reflector back surface 4 b of the reflector 4, and the translucent resin back surface of the translucent resin 5. 5b is all flat. Therefore, the thickness direction dimension of the reflector 4 and the translucent resin 5 becomes the thickness direction dimension of the LED light emitting device A1. Thereby, the thickness direction dimension becomes small compared with what supports the chip | tip back surface 1b of the LED chip 1 with a board | substrate or a reflector. Therefore, the LED light emitting device A1 can be thinned.

  Moreover, according to this embodiment, the translucent resin main surface 5a of the translucent resin 5 and the reflector main surface 4a of the reflector 4 are flush with each other. Thereby, compared with the thing of the shape where the translucent resin 5 protruded from the main surface side opening part 41 of the reflector 4, the thickness direction dimension becomes small. Therefore, the LED light emitting device A1 can be thinned.

  Further, according to the present embodiment, since the chip back surface 1b of the LED chip 1 is exposed, when the LED light emitting device A1 is mounted on a circuit board or the like, the chip back surface 1b is in direct contact with the circuit board. Therefore, since the heat of the LED chip 1 can be released to the circuit board, the heat dissipation is good.

  Further, according to the present embodiment, the reflecting surface 4c of the reflector 4 has a circular cross section perpendicular to the z direction (a cross section parallel to the reflector back surface 4b). Thereby, more uniform light can be emitted from the LED light emitting device A1.

  Moreover, according to this embodiment, the reflector 4 is formed so that the area | region where the wires 31 and 32 of the 1st main surface 21a and the 2nd main surface 22a are bonded may be exposed. Thereby, when forming the reflector 4 after wire bonding, the wires 31 and 32 can be prevented from getting in the way. Further, when the reflector 4 is formed before the wire bonding, the reflector 4 can be prevented from interfering with the wire bonding.

  Moreover, according to this embodiment, LED light-emitting device A1 arrange | positions the LED chip 1, the 1st electrode pad 21, and the 2nd electrode pad 22 on the heat resistant dicing tape 6, and the reflector 4 and translucent resin are formed from it. 5 and then the heat-resistant dicing tape 6 is peeled off. Accordingly, the LED light emitting device is configured such that the chip back surface 1b, the first back surface 21b, and the second back surface 22b are exposed from the reflector 4 and the translucent resin 5 and are flush with the reflector back surface 4b and the translucent resin back surface 5b. A1 can be manufactured.

  5 to 15 show other embodiments of the present invention. In these drawings, the same or similar elements as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment.

  5 to 7 show an LED light-emitting device according to a second embodiment of the present invention. The LED light-emitting device A2 of this embodiment is different from the LED light-emitting device A1 described above in that the LED chip 1 is a so-called 1-wire type chip.

  FIG. 5 is a plan view of an essential part showing the LED light emitting device A2. FIG. 6 is a bottom view showing the LED light emitting device A2. 7 is a cross-sectional view taken along line VII-VII in FIG.

  In this embodiment, the LED chip 1 is a one-wire type chip, and a p-side electrode 13 that is conductive to the p-type semiconductor layer is provided on the chip main surface 1a, and is conductive to the n-type semiconductor layer. The n-side electrode 14 is provided on the opposite side of the support substrate 11 from the semiconductor layer 12 (see FIG. 7). Therefore, the surface of the n-side electrode 14 opposite to the support substrate 11 is the chip back surface 1b. The “p-side electrode 13” corresponds to the “first electrode” of the present invention, and the “n-side electrode 14” corresponds to the “second electrode” of the present invention. In the present embodiment, the n-side electrode 14 is exposed as the chip back surface 1b of the LED chip 1 (see FIG. 7), and is conductively bonded when mounted on a circuit board or the like instead of the second electrode pad 22. Functions as an electrode. Therefore, the LED light emitting device A2 does not include the second electrode pad 22 and the wire 32.

  In this embodiment, the same effect as that of the first embodiment can be obtained. Moreover, since it is not necessary to provide the 2nd electrode pad 22, it is also possible to make the dimension of the x direction of LED light-emitting device A2 smaller than LED light-emitting device A1.

  8 to 10 show an LED light-emitting device according to a third embodiment of the present invention. The LED light emitting device A3 of the present embodiment is different from the LED light emitting device A2 described above in the shapes of the reflector 4 and the translucent resin 5.

  FIG. 8 is a plan view of an essential part showing the LED light emitting device A3. FIG. 9 is a bottom view showing the LED light emitting device A3. 10 is a cross-sectional view taken along line XX of FIG.

  In the present embodiment, the back surface side opening 42 of the reflector 4 is small (see FIGS. 9 and 10), and the reflecting surface 4c is exposed in order to expose a portion for bonding the wire 31 to the first electrode pad 21. A recess 4d is provided on the surface (see FIGS. 8 and 10). Therefore, the reflecting surface 4c has a shape in which a cross section orthogonal to the z direction (a cross section parallel to the reflector back surface 4b) has a portion protruding in the direction of the first electrode pad 21 (see FIG. 8). And the part other than the recessed part 4d of the reflective surface 4c has the same inclination as the reflective surface 4c in 2nd Embodiment, and the main surface side opening part 41 is circular.

  Also in this embodiment, the chip back surface 1b of the LED chip 1 is exposed, the chip back surface 1b of the LED chip 1, the first back surface 21b of the first electrode pad 21, the second back surface 22b of the second electrode pad 22, and the reflector. The reflector back surface 4b 4 and the translucent resin back surface 5b of the translucent resin 5 are all flush with each other. Further, the translucent resin main surface 5 a of the translucent resin 5 and the reflector main surface 4 a of the reflector 4 are flush with each other. Therefore, the LED light emitting device A3 can be thinned. Moreover, since the chip | tip back surface 1b of LED chip 1 is exposed, heat dissipation is good. Also in the present embodiment, the reflector 4 is formed so as to expose a region where the wire 31 of the first main surface 21a is bonded. Therefore, the reflector 4 and the wire 31 do not interfere with each other. Moreover, it can manufacture with the manufacturing method similar to 1st Embodiment. Furthermore, since the back surface side opening part 42 of the reflector 4 is small, it can suppress that the light emitted from the LED chip 1 is emitted from the back surface side opening part 42. Moreover, since the inclination of the reflective surface 4c is the same as that of the LED light emitting device A2, and the back surface side opening 42 is small, the main surface side opening 41 is also small compared to the LED light emitting device A2. Therefore, it is possible to make the dimensions of the LED light emitting device A3 in the x direction and the y direction smaller than those of the LED light emitting device A2.

  In addition, the shape of the reflective surface 4c of the reflector 4 is not restricted to what was mentioned above. It is sufficient that the reflector 4 has a shape that does not cover the bonding position of the first electrode pad 21. For example, the back surface side opening 42 may have an elliptical shape having a major axis in the x direction. Further, the shape of the main surface side opening 41 is not limited. In the third embodiment, the LED chip 1 may be a two-wire type chip. In this case, it is necessary to provide the electrode pad 22 and the wire 32 as in the first embodiment.

  11 to 13 show an LED light emitting device according to a fourth embodiment of the present invention. The LED light emitting device A4 of this embodiment is different from the LED light emitting device A1 described above in that the reflector 4 is not provided.

  FIG. 11 is a plan view of an essential part showing the LED light emitting device A4. FIG. 12 is a bottom view showing the LED light emitting device A4. 13 is a cross-sectional view taken along line XIII-XIII in FIG.

  In the present embodiment, the reflector 4 is not provided, and the light transmitting resin 5 is provided except for the chip back surface 1b of the LED chip 1, the first back surface 21b of the first electrode pad 21, and the second back surface 22b of the second electrode pad 22. Covered by. The translucent resin 5 has a rectangular parallelepiped shape. The LED light emitting device A4 is manufactured by omitting the step of forming the reflector 4 (see FIG. 4C) in the LED light emitting device A1 manufacturing method (see FIG. 4).

  Also in this embodiment, the chip back surface 1b of the LED chip 1 is exposed, the chip back surface 1b of the LED chip 1, the first back surface 21b of the first electrode pad 21, the second back surface 22b of the second electrode pad 22, and The translucent resin back surface 5b of the translucent resin 5 is all flush. Therefore, the LED light emitting device A4 can be thinned. Also in this embodiment, the translucent resin main surface 5a of the translucent resin 5 is flush. Thereby, the thickness direction dimension becomes small compared with the thing of the shape where the translucent resin 5 protruded in the translucent resin main surface 5a side. Therefore, the LED light emitting device A4 can be thinned. Also in this embodiment, since the chip back surface 1b of the LED chip 1 is exposed, heat dissipation is good. Further, according to the present embodiment, the LED light emitting device A4 has the LED chip 1, the first electrode pad 21, and the second electrode pad 22 disposed on the heat-resistant dicing tape 6, and the transparent resin 5 is formed thereon. Thereafter, the heat-resistant dicing tape 6 is peeled off. Thereby, LED light-emitting device A4 can be manufactured so that the chip | tip back surface 1b, the 1st back surface 21b, and the 2nd back surface 22b may be exposed from the translucent resin 5, and may become flush with the translucent resin back surface 5b. .

  In the fourth embodiment, the LED chip 1 may be a one-wire type chip (see FIG. 14). In this case, it is not necessary to provide the electrode pad 22 and the wire 32.

  Moreover, the shape of the translucent resin 5 is not limited. For example, in the fourth embodiment, the shape of the translucent resin 5 may be a bullet shape having a portion that bulges in the direction in which the chip main surface 1a faces. (See FIG. 15). In this case, the light emitted from the LED chip 1 can be emitted while enhancing the directivity.

  The LED light emitting device and the manufacturing method thereof according to the present invention are not limited to the above-described embodiments. The specific configuration of each part of the LED light emitting device and the manufacturing method thereof according to the present invention can be varied in design in various ways.

A1 to A4: LED light emitting device 1: LED chip 11: support substrate 12: semiconductor layer 13: p-side electrode (first electrode)
14: n-side electrode (second electrode)
1a: chip main surface 1b: chip back surface 21: first electrode pad 21a: first main surface 21b: first back surface 22: second electrode pad 22a: second main surface 22b: second back surface 31, 32: wire 4: Reflector (opaque resin)
4a: Reflector main surface (opaque resin main surface)
4b: Reflector back (non-translucent resin back)
4c: Reflective surface 4d: Recess 41: Main surface side opening 42: Back surface side opening 5: Translucent resin 5a: Translucent resin main surface 5b: Translucent resin back surface 6: Heat resistant dicing tape 6a: Adhesive surface

Claims (14)

An LED chip comprising: a semiconductor layer; a chip main surface and a chip back surface facing opposite sides in the thickness direction of the semiconductor layer; and a first electrode formed on the chip main surface;
A light-transmitting resin that transmits light from the LED chip, covering the LED chip other than the back surface of the chip,
A first electrode pad, which is conductively joined to the first electrode by a first wire, and includes a first main surface to which the first wire is bonded, and a first back surface facing the opposite side of the first main surface. When,
With
The translucent resin has a translucent resin back surface facing the same direction as the chip back surface,
The chip back surface and the first back surface are exposed from the translucent resin back surface and are flush with the translucent resin back surface.
An LED light emitting device characterized by that. The LED chip further includes a second electrode formed on the chip main surface,
A second electrode that is conductively joined to the second electrode by a second wire, and includes a second main surface to which the second wire is bonded, and a second back surface facing the opposite side of the second main surface. A pad,
The second back surface is exposed from the translucent resin back surface and is flush with the translucent resin back surface.
The LED light-emitting device according to claim 1. The LED chip further includes a second electrode located on the opposite side of the first electrode across the semiconductor layer and constituting the chip back surface.
The LED light-emitting device according to claim 1. A translucent resin main surface facing the same direction as the chip main surface, a translucent resin back surface facing the same direction as the chip back surface, and connecting the translucent resin main surface and the translucent resin back surface; And further comprising an opaque resin having a reflective surface surrounding the LED chip,
The opaque resin back surface is flush with the chip back surface;
The LED light-emitting device according to claim 1. The opaque resin exposes at least a part of the first main surface;
The first wire is bonded to a region of the first main surface exposed from the opaque resin.
The LED light-emitting device according to claim 4. The reflective surface has a circular cross section parallel to the back surface of the opaque resin.
The LED light-emitting device according to claim 5. The reflective surface has a shape in which a cross section parallel to the back surface of the opaque resin has a portion protruding in the direction of the first electrode pad.
The LED light-emitting device according to claim 5. The translucent resin has a translucent resin main surface that is flush with the translucent resin main surface.
The LED light-emitting device according to claim 4. The opaque resin is made of a white resin.
The LED light-emitting device according to claim 4. The shape of the translucent resin is a rectangular parallelepiped shape,
The LED light-emitting device according to claim 1. The shape of the translucent resin is a bullet-shaped shape having a portion that bulges in a direction in which the chip main surface faces.
The LED light-emitting device according to claim 1. A method for manufacturing an LED light-emitting device,
Forming an electrode pad on one side of the fixing member;
Arranging an LED chip having an electrode on one side of the fixing member;
A step of electrically bonding the electrode of the LED chip and the electrode pad with a wire;
Forming a translucent resin that transmits light from the LED chip so as to cover the LED chip and the wire;
Peeling the fixing member from the LED chip, the electrode pad and the translucent resin;
A manufacturing method comprising: Before the step of forming the translucent resin, it comprises a step of forming an opaque resin so as to surround the LED chip,
The light-transmitting resin is formed by injecting a liquid resin into a region surrounding the LED chip of the light-impermeable resin and curing it.
The manufacturing method according to claim 12. The fixing member is a dicing tape.
The manufacturing method according to claim 12 or 13.

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