JP2011249419A - Resin sealed package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin sealed package which has a chip window and prevents the reduction of the package strength despite the small, thin, and simple structure.SOLUTION: In the resin sealed package, a chip 307, which is to be sealed in an aperture 311 located in a center part of an insulative substrate opening 312 of a recessed insulative substrate 301 which opens at the center, is arranged, and an underside of the chip 307 is exposed to a package surface. A stepped portion is provided inside the insulative substrate, and a first electrode 303 is arranged in the stepped portion. The first electrode 303 is electrically connected to a chip 307 with bonding wire 305 and is also connected to a second electrode 304 serving as an external connection terminal of the resin sealed package via internal wirings 302 and 306.

Description

  The present invention relates to a resin-sealed package, and more particularly, to a surface-mounted resin-sealed package having an opening on the surface and having a small and simple structure.

  In general electronic devices and optical devices, some kind of sealing member is required to protect the semiconductor chip and the wiring that are the heart of the device. In particular, in light-emitting elements that output optical signals to the outside world, or optical sensors that detect outside light, not only protect the semiconductor chip, but also fix the lens and window for taking in and out the light in some form. Have an important role to do. In particular, in the case of high-sensitivity optical sensors that detect weak signals, the optical sensor package is designed to stabilize the temperature of the sensing unit or to shield the sensing unit from external electromagnetic noise. The Alternatively, in order to realize a small device, the size of the semiconductor chip must be reduced, and at the same time, the package must be reduced within a range that does not deteriorate the device performance.

  In this way, many devices have been devised for achieving the maximum performance of light detection sensitivity and light emission efficiency, which are essential functions of the optical device, and for miniaturization and simplification. In order to reduce the size of the entire package, a package using a sealing resin for the lead frame is often used.

  In general electronic devices other than optical devices, it is not necessary to lead in and out of light, so that a highly reliable package manufactured with a mold can be realized. On the other hand, in the case of an optical device, it is necessary to provide a window part for light extraction / introduction.

  For example, in an infrared sensor that detects light in the infrared region (for example, light having a long wavelength of about 5 to 10 microns), since there is no resin material that efficiently transmits long-wavelength infrared light, an infrared light of about 1 micron or less is used. Infrared sensors for detecting light and epoxy resin packages used for photodiodes cannot be used as they are, and some windows have to be provided. Therefore, in the conventional infrared sensor, it is necessary to use a hollow package or a metal package, and to provide a window material that transmits light efficiently so as not to reduce the sensitivity of the sensor. However, using a hollow package makes it difficult to reduce the size of the sensor and complicates assembly.

  In addition, in order to obtain a high S / N ratio in a long wavelength infrared sensor, it is necessary to increase the area and volume of the photoelectric conversion unit, and even in the case of a quantum type sensor that is said to be highly sensitive, it is necessary to provide a cooling device. So far, it has not been possible to reduce the size of long-wavelength infrared sensors.

  Similarly, in an ultraviolet sensor that detects ultraviolet light having a wavelength of 300 nm or less, an ultraviolet resin that is transparent to visible light, such as that used for visible light photodiodes, does not transmit ultraviolet light. It is necessary to use a window material, and an optical device that is small and easy to package cannot be realized. For this reason, the application range of the ultraviolet sensor has been limited.

  Further, when a window is formed by designing a mold that forms a window and performing a sealing process using the mold, the lead frame must be disposed avoiding the window.

  Moreover, when it is going to form a window part after the shaping | molding process by a sealing member, it is necessary to open a hole in a sealing member with a certain method. For example, when etching is performed to make a hole in the sealing member by the sandblast method, the optical device may be destroyed.

  For example, Patent Document 1 discloses a package form using a lead frame (connection terminal 3). Specifically, one or more elements including a photoelectric conversion element having a photoelectric conversion unit formed on a substrate, a connection terminal electrically connected to the photoelectric conversion element, one or more elements, and a connection terminal An optical device including an opening on a side on which light is incident or emitted, and a bottom surface of the opening is connected to the outside of one or more elements. It is characterized by being an interface between the closest element and the outside world.

  FIG. 1A to FIG. 1E are diagrams showing a package form of an optical device described in Patent Document 1 described above. In FIG. 1A, the photoelectric conversion element 50 includes a substrate 10 and a photoelectric conversion unit 1 formed on the surface of the substrate 10. The photoelectric conversion element 50 is sealed with the sealing member 14. And the opening part 6 is formed in the sealing member 14 so that the photoelectric conversion element 50 may contact the external world by the window part which has optical adjustment ability. The bottom of the opening 6 is a window, and the optical adjustment unit 13 is exposed. The connection terminal 3 is electrically connected to the photoelectric conversion unit 1 by a connection wiring 15 and supplies an external electric signal to the photoelectric conversion unit 1 or an electric signal corresponding to the intensity of incident light. Used to output to

  In FIG. 1B, the photoelectric conversion element 50 includes the photoelectric conversion unit 1 and the optical adjustment unit 13 formed on the substrate 10, and is connected to the connection terminal 3 by the connection wiring 16. In this case, the photoelectric conversion unit 1 and the connection wiring 16 are sealed so as to be covered by the sealing member 14, but it is necessary to provide the opening 7 in the connection terminal 3 in order to lead out light. At this time, the bottom surface of the opening 7, that is, the interface between the outside and the substrate 10 (photoelectric conversion element 50) serves as a window, and the optical adjustment unit 13 is formed in this window. Therefore, the interface between the optical adjustment unit 13 and the outside becomes a window, and light enters and exits the photoelectric conversion unit 1 through the optical adjustment unit 13 and the substrate 14. The opening 7 is a pattern portion that is formed so as to penetrate the connection terminal 3.

  Further, in FIG. 1C, the photoelectric conversion element 50 includes the photoelectric conversion unit 1 formed on the substrate 10, the optical adjustment unit 13, and a reflection plate 9 described later, and is connected to the connection terminal 3 by the connection wiring 15. ing. In this case, as in the case of FIG. 1B, the photoelectric conversion element 50 is sealed so as to be covered with the sealing member 14, but the bottom surface of the opening 7, that is, the outside world, is used for light extraction / introduction. The interface between the photoelectric conversion unit 1 and the photoelectric conversion unit 1 serves as a window, and an optical adjustment unit 13 is formed in the window. Therefore, the interface between the optical adjustment unit 13 and the outside becomes a window, and light enters and exits the photoelectric conversion unit 1 through the optical adjustment unit 13.

  1D, similarly to FIG. 1B, a hole is formed so that the photoelectric conversion element 50 can be inserted into the connection terminal 3, the photoelectric conversion element 50 is disposed in the hole, and then connected. The wiring 16 is electrically connected with a metal wire.

  Further, in FIG. 1 (e), as in FIGS. 1 (b) and 1 (d), the connection terminal 3 is exposed on the same surface as the opening 6 and on its side surface so that it can be connected to the outside. In addition, the surface opposite to the surface on which the opening 6 is formed is also exposed so that it can be connected to the outside.

  Among these, when the light input / output surface and the electrical connection surface can be reversed, in order to improve the adhesion strength between the connection terminal and the sealing resin, It is also possible to design the connection terminal shape, for example, by providing a step in the connection terminal so that a part is not exposed from the sealing resin.

  FIG. 2 is a diagram showing a package form of the semiconductor light emitting device described in Patent Document 2, and discloses a package form using an insulating substrate as a support.

  Specifically, as a semiconductor light-emitting element, for example, a light-emitting layer is formed by vapor-phase growth of a nitrogen compound such as GaN on a light-transmitting insulating material substrate 206b having a high hardness such as sapphire, and the substrate 206b side is formed. An LED element 206 having a light emitting surface is used. Reference numeral 208 denotes a light non-transparent sealing resin material in which fillers such as alumina, carbon, and silica are mixed as a reinforcing material. The non-permeable sealing resin material 208 covers the side surface of the LED element 206 and the one surface 206a on which the p-side and n-side electrodes on the opposite side of the insulating material substrate 206b are formed. Since only the light emitting portion 206b of the LED element 206 is exposed and the entire periphery of the LED element 206 is sealed with a sealing resin material, a light non-transparent sealing resin material should be used as the sealing resin material. Can do. For this reason, for example, the LED element 206 can be sealed with the non-permeable sealing resin material 208 mixed with fillers such as alumina, carbon, and silica as reinforcing materials. Such an impermeable sealing resin material 208 has a small moisture absorption amount and improved heat resistance, so that reflow resistance is improved and damage such as package cracks can be prevented. In addition, even when used in an environment exposed to high heat or ultraviolet rays, semiconductor light emission that suppresses the deterioration phenomenon that the sealing resin material turns yellow and prevents the decrease in luminous intensity due to the deterioration of the sealing resin material A device is obtained.

International Publication WO2006-095834 Pamphlet JP 11-214754 A

  The strength of the package as found in Patent Document 1 described above is determined by the connection terminal that is a metal, the sealing resin, and the adhesion between the connection terminal and the sealing resin. On the other hand, the package itself is required to be reduced in size and thickness by reducing the size, thickness, and functionality of the equipment used.

  In the embodiment of Patent Document 1 described above, the lead frame, which is the main structure of the package, is divided to insulate the openings and connection terminals, and the resin is sealed between them. There is a problem that the package strength is lowered at the interface between the sealing resin and the lead frame or at the sealing resin portion where the lead frame is separated.

  In the embodiment of Patent Document 2 described above, the main structure of the package is an insulating substrate, and the opening of the LED element to be sealed is on the side opposite to the substrate, so that the main structure needs to be divided. There is no.

  However, since the LED element is disposed on the insulating substrate 1 through the metallized wiring layer and the conductive material, the thickness of the package is limited, and there is a limit to reducing the thickness while ensuring the package strength. It was.

  Further, as a means for performing resin sealing, for example, a resin is filled into the upper portion of the insulating substrate 1 using a transfer mold or a dispenser. However, when resin sealing is performed, the flow of the resin directly hits the side surface of the element. There was a problem that moved or peeled off.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a resin seal that does not reduce the package strength while having a structure having a chip window, a small, thin, and simple structure. It is to provide a stop package.

  The present invention has been made to achieve such an object, and the invention according to claim 1 is a support having a window region on one surface and an open region on the other surface. An insulating substrate, one or more chips provided in a central opening of the window region of the insulating substrate, and a seal that seals the window region and the open region so as to surround the chip A resin, a first electrode provided between the insulating substrate and the sealing resin, a second electrode for external connection provided on the other surface of the insulating substrate, and the first Conductive wiring that connects an electrode and the second electrode; and a bonding wire that connects the chip and the first electrode and is sealed with the sealing resin.

  The invention according to claim 2 is the invention according to claim 1, wherein the height of the central opening is at least half of the height of the chip.

  According to a third aspect of the present invention, in the invention of the first or second aspect, the circuit component mounted on the insulating substrate is connected to the chip and the second electrode. Features.

  According to a fourth aspect of the invention, in the first, second, or third aspect of the invention, the second electrode is provided on both surfaces of the insulating substrate.

  The invention according to claim 5 is the invention according to any one of claims 1 to 4, wherein the conductor wiring is exposed on a side surface of the insulating substrate.

  The invention according to claim 6 is the invention according to any one of claims 1 to 5, wherein the insulating substrate is a printed circuit board.

  The invention according to claim 7 is the invention according to any one of claims 1 to 5, wherein the insulating substrate is a ceramic substrate.

  The invention according to claim 8 is the invention according to any one of claims 1 to 7, wherein the chip is a quantum infrared light receiving element.

  The invention according to claim 9 is the invention according to any one of claims 1 to 7, wherein the chip is a quantum infrared light emitting element.

  The invention according to claim 10 is the invention according to any one of claims 1 to 7, wherein the chip is an ultraviolet light receiving element.

  The invention according to claim 11 is the invention according to any one of claims 1 to 7, wherein the chip is an ultraviolet light emitting element.

  The invention according to claim 12 is the invention according to any one of claims 1 to 7, wherein the chip is a MEMS element.

  According to the present invention, the insulating substrate which is a support having the window region on one surface and the open region on the other surface, and the central opening of the window region of the insulating substrate are provided. One or a plurality of chips, a sealing resin that seals the window region and the open region so as to surround the chips, a first electrode provided between the insulating substrate and the sealing resin, and the insulating substrate A second electrode for external connection provided on the other surface of the metal, a conductor wiring for connecting the first electrode and the second electrode, the chip and the first electrode are connected, and resin-sealed with a sealing resin When the package is made small, especially thin, the insulating substrate of the support body is integrated with the entire package, and the thickness is the same as that of the support body. Since it is determined by the insulating substrate, it is small and thin with an opening on the package surface. In it is possible to realize a surface mount type package simple structure.

  Moreover, since the insulating substrate of the support surrounds the outer periphery of the chip to be sealed, stress on the chip due to resin sealing can be alleviated.

  One or a plurality of chips may be arranged in the opening, or a structure in which a plurality of openings are provided and a chip is arranged may be used.

  Further, the chip is die-bonded into the opening of the support, and after wire bonding between the chip and the first electrode formed on the support, resin sealing is performed. By making the height of the opening more than half of the height of the chip, when sealing the resin, the force due to the resin flow hits the side of the chip through the insulating substrate of the support, so the chip moves or peels off It becomes difficult.

  In addition, by mounting circuit components on an insulating substrate and chip-connecting them, a composite component having a signal processing function can be easily formed. The circuit component is not limited as long as it is a semiconductor chip made of Si or a chip component such as a resistor or a capacitor as long as it is small. The circuit component may be disposed on the insulating substrate or in the opening.

  Moreover, since the support is formed of an insulating substrate, the second electrode can be easily arranged on both the front and back surfaces of the package. By disposing the electrode on the surface of the package, it is possible to mount the opening portion downward, to mount by wire bonding from the surface, or to perform a test by probing from the surface.

  Further, if the conductor wiring is exposed on the side surface of the package, for example, when the solder is mounted on the printed board with solder, the solder is joined to the conductor wiring, so that the joining state can be easily confirmed.

  Further, by using a printed circuit board as the support, it is possible to easily set the electrode arrangement, the conductor wiring pattern, the height of the first electrode, and the overall height of the package.

  In addition, by using a ceramic substrate for the support, it is possible to easily set the arrangement of electrodes, the conductor wiring pattern, the height of the first electrode, and the overall height of the package, as well as improving the package strength and heat resistance. The temperature can also be improved.

  In addition, the resin-sealed package of the present invention has an opening and has a structure in which one side of the chip is directly exposed to the outside, so that the whole cannot be sealed with resin. It is particularly excellent as a small and thin package of an element, an ultraviolet light receiving element, an ultraviolet light emitting element, or an MEMS structure element.

(A) thru | or (e) is sectional drawing which shows the package form of the conventional optical device described in patent document 1. FIG. It is sectional drawing which shows the package form of the conventional semiconductor light-emitting device described in patent document 2. FIG. (A) thru | or (e) is a figure for demonstrating Embodiment 1 of the resin sealing package which concerns on this invention, (a) is sectional drawing, (b) is a top view, (c) is resin sealing The bottom view before, (d) is the bottom view after resin sealing, (e) is sectional drawing which shows the modification of (a). (A) thru | or (d) are the figures for demonstrating Embodiment 2 of the resin sealing package which concerns on this invention, (a) is sectional drawing, (b) is a top view, (c) is resin sealing A front bottom view, (d) is a bottom view after resin sealing. (A) thru | or (d) are the figures for demonstrating Embodiment 3 of the resin sealing package which concerns on this invention, (a) is sectional drawing, (b) is a top view, (c) is resin sealing A front bottom view, (d) is a bottom view after resin sealing. (A) thru | or (c) is a figure for demonstrating Embodiment 4 of the resin sealing package which concerns on this invention, (a) is sectional drawing, (b) is a top view, (c) is resin sealing It is a bottom view after a stop. (A), (b) is a figure for demonstrating Embodiment 5 of the resin sealing package which concerns on this invention, (a) is sectional drawing, (b) is a side view. (A), (b) is a figure for demonstrating the modification of Embodiment 5 of the resin sealing package which concerns on this invention, (a) is sectional drawing, (b) is a side view. (A) thru | or (e) is a figure for demonstrating Embodiment 6 of the resin sealing package which concerns on this invention, (a) is sectional drawing of a chip part, (b) is sectional drawing of a circuit component part, (C) is a top view, (d) is a bottom view before resin sealing, and (e) is a bottom view after resin sealing.

  Hereinafter, each embodiment of the present invention will be described with reference to the drawings.

[Embodiment 1]
FIGS. 3A to 3E are views for explaining the first embodiment of the resin-sealed package according to the present invention. FIG. 3A is a cross-sectional view, FIG. 3B is a top view, and FIG. 3 (c) is a bottom view before resin sealing, FIG. 3 (d) is a bottom view after resin sealing, and FIG. 3 (e) is a cross-sectional view showing a modification of FIG. 3 (a).

  The resin-sealed package of the present invention includes at least a chip 307, a bonding wire 305, an insulating substrate (frame part) 301, and a sealing resin 308.

  The insulating substrate 301 is a support body having a window region 312 on one surface and an open region 313 on the other surface. One or more chips 307 are provided in the central opening of the window region 312 of the insulating substrate 301. The sealing resin 308 seals the window region 312 and the open region 313 so as to surround the chip 307.

  The first electrode 303 is provided on the lower surface of the insulating substrate 301 between the insulating substrate 301 and the sealing resin 308, that is, on the upper surface of the sealing resin 308. The second electrode 304 is for external connection provided on the other surface of the insulating substrate 301. The conductor wiring 302 is used to connect the first electrode 303 and the second electrode 304 and is led into the insulating substrate 301. The bonding wire 305 connects the chip 307 and the first electrode 303 and is sealed with a sealing resin 308.

  As described above, the resin-sealed package of Embodiment 1 has the chip 307 sealed in the central opening 311 of the insulating substrate opening (window region) 312 of the concave insulating substrate 301 having an opening at the center. And the back surface side of the chip 307 is exposed on the package surface.

  The insulating substrate 301 that is a support for the resin-sealed package has an insulating substrate opening 312. An insulating substrate 301 is integrally disposed on the outer periphery of the package. In addition, there is a stepped portion inside the insulating substrate 301, and a first electrode 303 for electrical connection with the semiconductor chip 307 and the bonding wire 305 is disposed on the stepped portion.

  The first electrode 303 is connected to a second electrode 304 that is an external connection terminal of the resin-sealed package via a conductor wiring (internal wiring) 302. The internal wiring 302 is configured by a via in which a hole is formed in the substrate in the stepped portion and plated, and the inside is filled with a conductor or resin.

  The chip 307 is disposed in the insulating substrate opening 312 and wire-bonded, and then resin-sealed in the insulating substrate opening 312 and the insulating substrate recess (open region) 313.

  In the first embodiment, the number of the first electrodes 303 and the number of the second electrodes 304 is four. However, a plurality of the first electrodes 303 and the second electrodes 304 may be arranged according to the number of chip electrodes to be sealed, the package size, the strength during mounting, and the like. good.

Further, the height of the central opening in which the chip 307 is stored is at least half the height of the chip 307. That is, the thickness of the insulating substrate opening 312 of the insulating substrate 301 on which the chip 307 and the first electrode 303 are disposed is more than half the thickness of the chip 307.
In addition, a circuit component (not shown) can be mounted on the insulating substrate 301, and this circuit component is connected to the chip 307 and the second electrode 304. The insulating substrate 301 can be a printed circuit board or a ceramic substrate.

  The chip 307 may be a quantum infrared light receiving element or a quantum infrared light emitting element. This type of quantum infrared sensor is a sensor that utilizes electrons and holes generated by photons when a semiconductor is irradiated with infrared light, such as a photoconductive type (such as HgCdTe) or a photovoltaic type (such as InAs). There is. This quantum infrared sensor has a wavelength dependency of sensitivity, a high sensitivity, and a high response speed. The chip 307 may be an ultraviolet light receiving element or an ultraviolet light emitting element.

  The chip 307 can also be a MEMS element. 2. Description of the Related Art Generally, an electromechanical system including a structure formed using a fine processing technique called MEMS (Micro Electro Mechanical System), such as a resonator, a filter, a sensor, and a motor, is known. A MEMS element in which this structure is formed on a semiconductor substrate, for example, a silicon substrate has been proposed. Such a MEMS element can be integrated with a semiconductor circuit such as a CMOS by being formed on a semiconductor substrate. Therefore, for example, communication that requires downsizing and high performance such as a mobile phone or the like. Application to high-frequency circuits used in equipment is expected.

  FIG. 3E is a cross-sectional view showing a modification of FIG. In this modification, the internal wiring 306 is configured by forming a conductor on the surface of the stepped portion on the wiring of the stepped portion. That is, the internal wiring 306 is not led into the insulating substrate 301, but is led between the insulating substrate 301 and the sealing resin 308.

  As described above, by adopting the structure as in the first embodiment, when the package is reduced in size, in particular, thinner, the insulating substrate of the support is integrated with the entire package, and the thickness is Since it is determined by the insulating substrate of the support, it is possible to realize a surface-mounted resin-sealed package having a small, thin and simple structure having an opening on the surface of the package.

  Moreover, since the insulating substrate of the support surrounds the outer periphery of the chip to be sealed, stress on the chip due to resin sealing can be alleviated.

  In addition, by using a printed circuit board or a ceramic substrate for the insulating substrate 301, it is possible to easily set the electrode arrangement, the conductor wiring pattern, the height of the first electrode, and the overall height of the package. It is also possible to improve the package strength and the heat resistant temperature.

  Further, when resin sealing is performed, the force due to the flow of the resin hits the side surface of the chip through the insulating substrate of the previous support, so that the chip does not move or peel off, and the assembly failure rate can be reduced. .

[Embodiment 2]
4A to 4D are views for explaining a second embodiment of the resin-sealed package according to the present invention. FIG. 4A is a cross-sectional view, FIG. 4B is a top view, and FIG. 4 (c) is a bottom view before resin sealing, and FIG. 4 (d) is a bottom view after resin sealing.

  The resin-sealed package of the second embodiment has the same structure as that of the first embodiment described above. By disposing the chip 307 a and the chip 307 b in the insulating substrate opening 312, two chips can be sealed in one resin-sealed package.

  In the second embodiment, the number of chips to be sealed is two. However, as long as the strength of the resin-sealed package can be obtained, the present invention is not limited to this, and a plurality of chips may be arranged vertically and horizontally.

[Embodiment 3]
FIGS. 5A to 5D are views for explaining a third embodiment of the resin-encapsulated package according to the present invention, where FIG. 5A is a sectional view, FIG. 5B is a top view, and FIG. 5C is a resin. The bottom view before sealing, (d) is the bottom view after resin sealing.

  In the resin-sealed package of the third embodiment, there are two insulating substrate openings 312a and 301b, and a chip 307c and a chip 307d are arranged inside, respectively. Other structures are the same as those of the first embodiment.

  The first electrode 303 may be used as an electrode for connecting the chip 307c and the chip 307d in addition to wiring the electrodes of the chip 307c and the chip 307d to the outside.

  When the size of the chip to be sealed is large, when insulation between chips is desired, or when it is desired to increase the distance between chips, the resin-sealed package is not reduced in strength. It is possible to realize a surface-mounted resin-sealed package having a small, thin and simple structure having an opening.

  In Embodiment 3, the number of openings in the insulating substrate is two. However, the number is not limited as long as the strength of the resin-sealed package can be obtained, and a plurality of openings may be arranged vertically and horizontally.

[Embodiment 4]
6 (a) to 6 (c) are views for explaining a fourth embodiment of the resin-sealed package according to the present invention, FIG. 6 (a) is a cross-sectional view, and FIG. 6 (b) is a top view. FIG. 6C is a bottom view after resin sealing.

  In the resin-encapsulated package of the fourth embodiment, the second electrode 304a and the second electrode 304b, which are external connection electrodes, are arranged on the front and back surfaces of the package, respectively, and are connected to the first electrode by the internal wiring 302. Other structures are the same as those of the first embodiment.

  In this resin-encapsulated package, since the support is formed of the insulating substrate 301, the second electrode 304b can be easily arranged on both the front and back surfaces of the package.

  By disposing the electrode on the surface of the package, it is possible to mount the opening portion downward, mount by wire bonding from the surface, or perform a test by probing from the surface.

[Embodiment 5]
7 (a) and 7 (b) are views for explaining a resin-sealed package according to Embodiment 5 of the present invention. FIG. 7 (a) is a sectional view and FIG. 7 (b) is a side view. .

  The resin-sealed package of the fifth embodiment has a structure in which the internal wiring between the first electrode 303 and the second electrode 304 is exposed on the side surface of the resin-sealed package.

  7A and 7B, since the second electrode is only on the back surface, the internal wiring 309 is structured to connect to the second electrode from the middle of the side surface of the insulating substrate. Other structures are the same as those of the first embodiment.

  8 (a) and 8 (b) are views for explaining a modified example of Embodiment 5 of the resin-sealed package according to the present invention. FIG. 8 (a) is a sectional view and FIG. 8 (b) is a side view. FIG.

  8A and 8B, since the second electrode is on both the front surface and the back surface, the internal wiring 309 has a structure in which the side surface of the insulating substrate is vertically cut. The structure is connected to two electrodes. Other structures are the same as those of the first embodiment.

  In this resin-encapsulated package, the internal wiring 309 is exposed on the side surface, and the solder is bonded to the conductor wiring when mounted on the printed circuit board by making the exposed side surface easy to bond to the solder. It becomes possible to easily confirm the joining state.

[Embodiment 6]
FIGS. 9A to 9E are views for explaining a sixth embodiment of the resin-sealed package according to the present invention. FIG. 9A is a cross-sectional view of a chip portion, and FIG. 9B is a circuit. FIG. 9C is a top view, FIG. 9D is a bottom view before resin sealing, and FIG. 9E is a bottom view after resin sealing.

  In the resin-sealed package of the sixth embodiment, the chip 307 is provided in the insulating substrate opening 312, the circuit component 314 is provided on the insulating substrate recess 313, and the chip 307 and the circuit component 314 are connected via the internal wiring electrode 310. The internal wiring electrode 310 is connected to the first electrode 303 and the second electrode 304 through the internal wiring 315 as necessary.

  Since the circuit component 314 is mounted on the insulating substrate 301 and the chip 307 is connected, a composite component having a signal processing function can be easily formed.

  The circuit component 314 may be a semiconductor chip made of Si or a chip component such as a resistor or a capacitor, as long as it is small, and is not limited. Further, the circuit component 314 may be disposed on the insulating substrate or in the opening.

  The circuit component 314 may be directly die-bonded on the insulating substrate recess 313 or may be die-bonded after forming a die-bonding electrode. For example, if a semiconductor chip made of Si is die-bonded onto a die-bonding electrode, the substrate of the semiconductor chip can be easily connected to GND via an external wiring via the second electrode.

DESCRIPTION OF SYMBOLS 1 Photoelectric conversion part 3 Connection terminal 6,7 Opening part 9 Light reflection part 10 Board | substrate 13 Optical adjustment part 14 Sealing resin 15 Connection wiring 16 Viewing angle 50 Photoelectric conversion element 201 Insulating base body 202,203 Metallization wiring layers 204,205 Conductive material 206 LED elements 206a, 206b Sapphire substrate 207 Sealing resin material 208 Non-permeable sealing resin material 301 Insulating substrate 302, 306, 309, 315 Internal wiring 303 First electrode 304, 304a Second electrode 305 Bonding wire 307, 307a , 307b, 307c, 307d Chip 308 Sealing resin 310 Internal wiring electrode 311 Central opening 312, 312a, 312b Insulating substrate opening (window region)
313 Insulating substrate recess (open area)
314 Circuit components

Claims (12)

An insulating substrate which is a support having a window region on one side and an open region on the other side;
One or more chips provided in a central opening of the window region of the insulating substrate;
A sealing resin that seals the window region and the open region so as to surround the chip;
A first electrode provided between the insulating substrate and the sealing resin;
A second electrode for external connection provided on the other surface of the insulating substrate;
A conductor wiring connecting the first electrode and the second electrode;
A resin-sealed package comprising: a bonding wire that connects the chip and the first electrode and is resin-sealed with the sealing resin.   The resin-encapsulated package according to claim 1, wherein a height of the central opening is at least half of a height of the chip.   The resin-sealed package according to claim 1 or 2, wherein a circuit component mounted on the insulating substrate is connected to the chip and the second electrode.   The resin-sealed package according to claim 1, wherein the second electrode is on both surfaces of the insulating substrate.   The resin-sealed package according to claim 1, wherein the conductor wiring is exposed on a side surface of the insulating substrate.   The resin-sealed package according to claim 1, wherein the insulating substrate is a printed circuit board.   The resin-sealed package according to claim 1, wherein the insulating substrate is a ceramic substrate.   The resin-sealed package according to claim 1, wherein the chip is a quantum infrared light receiving element.   The resin-sealed package according to claim 1, wherein the chip is a quantum infrared light emitting element.   The resin-sealed package according to claim 1, wherein the chip is an ultraviolet light receiving element.   The resin-sealed package according to claim 1, wherein the chip is an ultraviolet light emitting element.   The resin-sealed package according to claim 1, wherein the chip is a MEMS element.

Images