KR101781989B1

KR101781989B1 - Glass Circuit Board and method of manufacturing the same

Info

Publication number: KR101781989B1
Application number: KR1020150173569A
Authority: KR
Inventors: 심재철; 박숙희
Original assignee: 주식회사 심텍
Priority date: 2015-12-07
Filing date: 2015-12-07
Publication date: 2017-09-27
Also published as: KR20170067236A

Abstract

In a method of manufacturing a glass circuit board according to an embodiment, a base substrate including a glass core and an insulating frame disposed so as to surround an outer frame portion of the glass core is prepared. The glass core is processed to form a through glass via hole. Through glass vias filling the inside of the through glass via holes and first and second circuit pattern layers disposed on both sides of the glass core are formed. The first and second insulating layers covering the first and second circuit pattern layers are formed. The glass core including the through glass vias and the first and second circuit pattern layers is separated from the insulating frame.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass circuit board and a manufacturing method thereof.

The present invention relates to a glass circuit board and a method of manufacturing the same.

BACKGROUND ART [0002] With the trend toward miniaturization and multifunctionality of electronic devices, electronic components are becoming more sophisticated and more compact. Due to the advancement of digital networks, portable information terminal devices such as mobile phones and portable computers are becoming more sophisticated, versatile and highly functional, and various functions are being fused into one device to be combined.

As described above, it has been demanded that the thickness of the printed circuit board is also reduced in accordance with the thinning and shortening of electronic devices. As the thickness of the printed circuit board is reduced, the problem of warpage of the target substrate during the manufacture of the printed circuit board continues to arise. The above-mentioned bending problem causes breakage of the original plate or process failure, which leads to reduction in the yield, and therefore, a method for overcoming this problem is being demanded.

In order to solve such a bending problem, Korean Patent Laid-Open Publication No. 2015-0047880 entitled " Insulating Resin Composition for Printed Circuit Boards and Products Using the Same "

SUMMARY OF THE INVENTION It is an object of the present invention to provide a manufacturing method for suppressing the occurrence of defects such as cracks in a glass core by applying a glass core to a printed circuit board in order to improve a deflection problem of the substrate.

A problem to be solved by the present invention is to provide a new method for manufacturing a glass circuit board with improved defectiveness described above more reliably.

A manufacturing method of a glass circuit board according to one aspect is disclosed. In the method of manufacturing the glass circuit board, a base substrate including a glass core and an insulating frame arranged to surround an outer frame portion of the glass core is prepared. The glass core is processed to form a through glass via hole. Through glass vias filling the inside of the through glass via holes and first and second circuit pattern layers disposed on both sides of the glass core are formed. The first and second insulating layers covering the first and second circuit pattern layers are formed. The glass core including the through glass vias and the first and second circuit pattern layers is separated from the insulating frame.

A manufacturing method of a glass circuit board according to another aspect is disclosed. In the above method of manufacturing a glass circuit board, a base substrate including a glass core having a through glass via hole and an insulating frame arranged to surround an outer frame portion of the glass core is prepared. Through glass vias filling the inside of the through glass via holes and first and second circuit pattern layers disposed on both sides of the glass core are formed. The first and second insulating layers covering the first and second circuit pattern layers are formed. The glass core including the through glass vias and the first and second circuit pattern layers is separated from the insulating frame.

A manufacturing method of a glass circuit substrate according to another aspect is disclosed. In the method of manufacturing the glass circuit board, a base substrate including a glass core and an insulating frame arranged to surround an outer frame portion of the glass core is prepared. At this time, the glass core includes through glass vias passing through the glass core, and first and second circuit pattern layers connected to the through glass vias and disposed on both sides of the glass core. Forming first and second insulating layers respectively covering the first and second circuit pattern layers; separating the glass core including the through glass vias and the first and second circuit pattern layers from the insulating frame.

A glass circuit board according to another aspect is disclosed. Wherein the glass circuit board comprises a glass core having glass through vias and having first and second circuit pattern layers on both sides connected to the glass through vias; First and second insulating layers covering the first and second circuit pattern layers on the glass core; First and second blind vias disposed in the first and second insulating layers and connected to the first and second circuit pattern layers; And third and fourth circuit pattern layers disposed on the first and second insulating layers and connected to the first and second blind vias.

According to one embodiment, a glass circuit board can be manufactured by disposing a glass core in a frame structure using a copper clad laminate (CCL) or a prepreg substrate. Specifically, a frame structure in which a cavity is formed in the copper-clad substrate or the prepreg substrate is provided to overcome the fact that the glass core is relatively vulnerable to edge impact. After the glass core is inserted into the cavity and the glass core is coupled with the frame structure, the glass core is subjected to a printed circuit board manufacturing process. By removing the frame structure after the printed circuit board manufacturing process is completed, the glass circuit board can be reliably manufactured.

As described above, the glass core can be protected from the impact of the outer frame by advancing the printed circuit board manufacturing process while the outer frame of the glass core is protected by the frame structure. Thus, it is possible to easily manufacture a glass circuit board having a higher elastic modulus and stiffness and a lower coefficient of thermal expansion than conventional copper-clad laminated boards or prepreg boards.

1 is a flowchart schematically showing a method of manufacturing a glass circuit board according to an embodiment of the present invention.
2 to 16 are sectional views schematically showing a method of manufacturing a glass circuit board according to an embodiment of the present invention.
17 is a cross-sectional view schematically showing one step of a method of manufacturing a glass circuit board according to another embodiment of the present invention.
18 to 21 are sectional views schematically showing a method of manufacturing a glass circuit board according to still another embodiment of the present invention.
22 is a cross-sectional view schematically showing a step of a method of manufacturing a glass circuit board according to still another embodiment of the present invention.
23 is a plan view schematically showing a glass core according to an embodiment of the present invention.
24 is a plan view schematically showing a glass core according to another embodiment of the present invention.
25 is a flowchart schematically showing a method of manufacturing a glass circuit board according to another embodiment of the present invention.
26 is a plan view schematically showing a glass core according to another embodiment of the present invention.
27 is a flowchart schematically showing a method of manufacturing a glass circuit board according to still another embodiment of the present invention.
28 to 31 are sectional views schematically showing a method of manufacturing a glass circuit board according to still another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the techniques disclosed in the present invention are not limited to the embodiments described herein but may be embodied in other forms. It should be understood, however, that the embodiments disclosed herein are provided so that this disclosure will be thorough and complete, and will fully convey the concept of this disclosure to those skilled in the art. In the drawings, the width, thickness, and the like of the components are enlarged in order to clearly illustrate the components of each device. It is to be understood that when an element is described as being located on another element, it is meant that the element is directly on top of the other element or that additional elements can be interposed between the elements .

Like numbers refer to like elements throughout the several views. It is to be understood that the singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise, and the terms "comprise" Or combinations thereof, and does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Further, in carrying out the method or the manufacturing method, the respective steps of the method may take place differently from the stated order unless clearly specified in the context. That is, each process may occur in the same order as described, may be performed substantially concurrently, or may be performed in the opposite order.

As used herein, the term " top surface " or " bottom " of a substrate or device chip is a relative concept observed at an observer's viewpoint. Therefore, one of the two surfaces except the side of the substrate or the element chip may be referred to as an 'upper surface' or 'lower surface', and the other surface may be referred to as 'lower surface' or 'upper surface' correspondingly. Likewise, in the present specification, the concept of 'upper', 'upper' or 'lower' and 'lower' can be used as a relative concept as well.

In the embodiments of the present invention, a method of using a glass core instead of a conventional copper laminate (CCL) substrate or a prepreg substrate as a base material for a printed circuit board is proposed. The glass core has a higher elastic modulus and rigidity and a lower coefficient of thermal expansion on the material side than the conventional copper laminated board or prepreg substrate. This makes it possible to effectively suppress the warpage of the original plate caused by the stress between the upper and lower layers stacked and the lack of rigidity of the material during the printing circuit process.

However, as a result of the inventors' research, it has been found that the glass core applied to the manufacturing process has a weak point that the outer portion is vulnerable to impact. Particularly, as the panel size of the glass core increases, it has been found that cracks due to the impact are easily generated at the outer portion of the glass core during the printed circuit manufacturing process. Cracks generated in the outer frame portion can easily propagate to the center of the core, thereby causing process defects and yield reduction.

In the embodiments of the present invention described below, in a method of manufacturing a printed circuit board to which a glass core is applied, it is possible to effectively suppress the occurrence of a crack due to an outer frame impact. This makes it possible to reliably manufacture the glass circuit board to which the glass core is applied.

1 is a flowchart schematically showing a method of manufacturing a glass circuit board according to an embodiment of the present invention. Referring to S110 of FIG. 1, a base substrate including a glass core and a frame structure arranged to surround the outer periphery of the glass core is prepared.

In step S120, the glass core is processed to form a through glass via hole.

In step S130, through glass vias filling the inside of the through glass via holes and first and second circuit pattern layers disposed on both sides of the glass core are formed.

In step S140, first and second insulating layers are formed to cover the first and second circuit pattern layers, respectively. Additionally, first and second blind vias disposed in the first and second insulating layers and connected to the first and second circuit pattern layers may be formed. Next, third and fourth circuit pattern layers, which are disposed on the first and second insulating layers and connected to the first and second blind vias, may be formed. Similarly, a multilayer interlayer insulating layer, a blind via, and a circuit pattern layer can be laminated on the third and fourth circuit pattern layers in the same manner.

In step S150, the glass core including the through glass vias and the first and second circuit pattern layers is separated from the frame structure. Thus, a glass circuit substrate having a via core and a circuit pattern layer formed on the glass core and the glass core can be manufactured.

A more specific process for manufacturing the glass circuit substrate will be described below.

2 to 16 are sectional views schematically showing a method of manufacturing a glass circuit board according to an embodiment of the present invention. Referring to FIG. 2, a copper clad laminate 110 and prepreg boards 120a and 120b are prepared as original plates. The copper laminated board 110 may have a form in which the copper foil 112 is bonded to both surfaces of the insulating core layer 111.

3, the copper clad laminate 110 and the prepreg boards 120a and 120b are processed to form a copper clad laminate 110 and prepreg boards 120a and 120b, Thereby forming a through-hole cavity 10. [ As an example of the processing method, a laser processing method or a mechanical processing method may be used.

Referring to FIG. 4, the copper laminated board 110 and the prepreg boards 120a and 120b on which the cavity 10 is formed are aligned with each other. Specifically, the prepreg boards 120a and 120b can be aligned on the upper and lower portions of the copper laminated board 110, respectively. Then, the glass core 200 is placed in the cavity 10. [ The glass core 200 may have a flat plate shape of a glass material. The glass core 200 may have a high stiffness and elastic modulus and a low thermal expansion coefficient as compared with the copper laminated substrate 110 and the prepreg substrates 120a and 120b.

Next, a pair of sacrificial copper foils 130a and 130b are prepared and disposed on both sides of the glass core 200, the copper laminate substrate 110, and the prepreg substrates 120a and 120b.

Referring to FIG. 5, a pair of sacrificial copper foils 130a and 130b, a glass core 200, a copper laminate substrate 110, and prepreg boards 120a and 120b are bonded and bonded to each other. In the drawing, the area of the glass core 200 is denoted by 'AG', and the area of the copper laminated substrate 110 and the prepreg substrates 120a and 120b is denoted by 'AP'. At this time, the copper laminated board 110 and the prepreg boards 120a and 120b arranged to surround the outer frame of the glass core 200 may be referred to as a frame structure.

In some embodiments, the pair of sacrificial copper foils 130a, 130b may have an adhesive layer on the surface facing the glass core 200 and the prepreg substrates 120a, 120b. The adhesive force between the sacrificial copper foils 130a and 130b and the glass core 200 and the prepreg boards 120a and 120b can be improved when the pair of sacrificial copper foils 130a and 130b include the adhesive layer . As an example, the adhesive layer may include a resin, and by applying heat during the pressing, the adhesive strength of the resin can be improved.

Referring to FIG. 6, a pair of sacrificial copper foils 130a and 130b may be selectively processed to expose both sides of the glass core 200. FIG. The patterned layers 132a and 132b of the sacrificial copper foil remaining after the selective processing are positioned to extend from the region AP of the frame structure to the region of the glass core 200 to cover at least a portion of the glass core 200 It is possible.

Alternatively, both sides of the glass core 200 may be exposed by removing the entirety of the pair of sacrificial copper foils 130a and 130b.

Referring to FIG. 7, the exposed glass core 200 can be processed to form the through glass via hole 20. As shown in FIG. 7, this step may be performed by penetrating the inside of the glass core 200 from one surface of the glass core 200 to the other surface. On the other hand, it is also possible to form the through glass via holes 20 by processing the glass core 200 simultaneously from both surfaces of the glass core 200 in the inward direction. As a method of processing the glass core 200, for example, a laser processing method or a mechanical processing method can be applied.

8, the plating seed layer 142 can be formed on the surfaces of the prepreg boards 120a and 120b and the glass core 200 and on the inner walls of the through glass via holes 20. [ The step of forming the plating seed layer 142 may be carried out by, for example, a step of forming a copper layer by a sputtering method or an electroless plating method.

9, an electrolytic plating method using a plating seed layer 142 is performed to form a copper plating layer 144 that fills through glass via holes 20, and a plating layer 144 is formed on both surfaces of the glass core 200 The pattern layers 146a and 146b can be formed. In this case, the plating pattern layer may be formed, for example, by a tanting process, an additive process, a semi-additive process (SAP), or a modified semi-additive process (MSAP) Can be carried out by one process.

As a result, the through glass vias 144 can be manufactured from the copper plating layer 144, and the first and second circuit pattern layers 146a and 146b can be manufactured from the plating pattern layers 146a and 146b. Copper layers 134a and 134b having an increased thickness can also be formed by forming a copper plating layer on the pattern layers 132a and 132b of the sacrificial copper foil of the frame structure.

Referring to FIG. 10, the first and second insulating layers 150a and 150b may be formed to cover the first and second circuit pattern layers 146a and 146b, respectively. In a specific embodiment, this step may proceed in the following order. First, a pair of interlayer insulating materials is prepared. The pair of interlayer insulating materials are disposed on both sides of the frame structure and the glass core 200. The pair of interlayer insulating materials, the frame structure, and the glass core 200 are bonded to each other. At this time, as an example of the pressing and bonding method, a hot press or a vacuum laminating method may be applied.

11, blind via holes 30a and 30b for selectively exposing the first and second circuit pattern layers 146a and 146b are formed by selectively processing the first and second insulating layers 150a and 150b can do.

12, the first and second blind vias 162a and 162b filling the blind via holes 30a and 30b, and the third and fourth circuits 150a and 150b disposed on the first and second insulating layers 150a and 150b, The pattern layers 164a and 164b can be formed. Copper layers 166a and 166b may be formed in the frame structure region.

Referring to FIG. 13, third and fourth insulating layers 170a and 170b covering the third and fourth circuit pattern layers 164a and 164b may be formed.

Referring to FIG. 14, the third and fourth insulating layers 170a and 170b may be selectively processed to form a blind via hole that selectively exposes the third and fourth circuit pattern layers 164a and 164b. The third and fourth blind vias 182a and 182b filling the blind via holes and the fifth and sixth circuit pattern layers 184a and 184b disposed on the third and fourth insulating layers 170a and 170b . At this time, copper layers 186a and 186b may be formed in the frame structure region.

Referring to FIG. 15, first and second solder resist pattern layers 190a and 190b selectively covering the fifth and sixth circuit pattern layers 184a and 184b can be formed. The fifth and sixth circuit pattern layers 184a and 184b exposed by the first and second solder resist pattern layers 190a and 190b can function as connection pads for connecting with external systems such as device chips and packages have.

Referring to FIG. 16, through glass vias 144, first and second circuit pattern layers 146a and 146b, first and second blind vias 162a and 162b, third and fourth circuit pattern layers 164a and 164b, The glass core 200 on which the third and fourth blind vias 182a and 182b and the fifth and sixth circuit pattern layers 184a and 184b are formed is separated from the frame structure. As an example, the present step may be a step of removing the frame structure surrounding the outer frame of the glass core 200 by applying a router processing method or a laser processing method. The frame structure includes a copper laminated board 110, prepreg boards 120a and 120b, copper layers 134a and 134b, first and second insulating layers 150a and 150b, copper layers 166a and 166b, The third and fourth insulating layers 170a and 170b, the copper layers 186a and 186b and the first and second solder resist pattern layers 190a and 190b.

By proceeding with the above-described processes, a glass circuit board according to an embodiment of the present invention can be manufactured.

2, a copper laminate substrate 110 and prepreg substrates 120a and 120b are shown as a disk, but the present invention is not limited thereto. That is, in some other embodiments, only the copper-clad laminate substrate 110 may be used as a circular plate, or only the prepreg substrates 120a and 120b may be used as a circular plate to carry out a manufacturing process of a subsequent glass circuit board.

Meanwhile, unlike the above-described embodiment, in some other embodiments, the passive element 300 may be embedded in the glass core 200 as shown in FIG. The passive element 300 may be a capacitor element having a first electrode layer 310, a dielectric layer 320, and a second electrode layer 330, for example. The method of manufacturing the glass circuit board shown in Fig. 17 can be followed by the following steps.

First, a process substantially the same as the process related to Figs. 2 to 9 is performed. Thus, the structure shown in Fig. 18 is formed. Referring to Fig. 19, the glass core 200 is processed to form the glass core cavity 40 penetrating the glass core 200. 18, the through glass vias 144 and the first and second circuit pattern layers 146a and 146b may not be formed in some regions of the glass core 200 where the glass core cavity 40 is formed have.

Referring to FIG. 20, after the passive element 300 is prepared, the passive element 300 is disposed in the glass core cavity 40. The passive device 300 may be a capacitor device having a first electrode 310, a dielectric layer 320, and a second electrode 330 as an example. At this time, the connection circuit pattern layers 148a and 148b may be formed on the first and second electrode layers 310 and 330 of the passive device 300 in advance. After the passive element 300 is disposed in the glass core cavity 40, the first and second insulating layers 150a are formed. Thereafter, a glass circuit substrate can be manufactured by carrying out substantially the same steps as those described above with reference to Figs. 17 to 20, the passive element 300 is described as an element embedded in the glass core cavity 40, but the passive element 300 is not necessarily limited to the passive element 300, Can also be applied. Here, the semiconductor element may include a semiconductor chip, a semiconductor package, and the like.

On the other hand, in some other embodiments, the fifth and sixth circuit pattern layers 184a2 and 184b2 corresponding to the uppermost circuit pattern layer are formed on the third and fourth insulating layers 170a , 170b. At this time, the upper surfaces of the fifth and sixth circuit pattern layers 184a2 and 184b2 may be disposed on the same plane as the upper surfaces of the third and fourth insulating layers 170a and 170b. Thus, an embedded trace pattern may be implemented for the uppermost circuit pattern layer.

On the other hand, in the above-described manufacturing methods, the glass core 200 can be disposed in the cavity 10 without forming a pattern in the glass core 200, as shown in Fig. Alternatively, in some other embodiments, the glass core 210 may be provided in the cavity 10 with the through-glass via hole 20 already formed, as shown in Fig. At this time, the manufacturing method of the glass circuit board can be in accordance with the flowchart shown in Fig.

Referring to FIG. 24, in step S210, a base substrate including a glass core having a through glass via hole and a frame structure arranged to surround the outer periphery of the glass core is prepared. In step S220, through glass vias filling the inside of the through glass via holes and first and second circuit pattern layers disposed on both sides of the glass core are formed. In step S230, first and second insulating layers are formed to cover the first and second circuit pattern layers, respectively. Additionally, first and second blind vias disposed in the first and second insulating layers and connected to the first and second circuit pattern layers may be formed. Next, third and fourth circuit pattern layers, which are disposed on the first and second insulating layers and connected to the first and second blind vias, may be formed. Similarly, a multilayer interlayer insulating layer, a blind via, and a circuit pattern layer can be laminated on the third and fourth circuit pattern layers in the same manner. In step S240, the glass core including the through glass vias and the first and second circuit pattern layers can be separated from the frame structure.

The following steps can be followed in detail. First, as shown in FIG. 23, a glass core 210 is prepared, and a glass core 210 is processed to form a through glass via hole 20 penetrating the glass core 210. At this time, an alignment hole 22 for alignment or handling may be additionally formed on the outer edge of the glass core 210.

2 and 3, the glass core 210 having the through-hole glass via hole 20 is placed in the cavity 10 of the original plate. Then, as shown in FIG. Next, a pair of sacrificial copper foils 130a and 130b are prepared and disposed on both sides of the original plate on which the glass core 210 is disposed. Next, a pair of sacrificial copper foils 130a and 130b, the disk and the glass core 210 are compression bonded by performing a process substantially the same as the process described above with reference to Fig. Then, the glass core 210 is exposed to both sides by selectively performing a pair of sacrificial copper foils 130a and 130b by performing substantially the same process as the process described above with reference to Fig. Since the through glass via hole 20 has already been formed in the glass core 210, the processing steps related to FIG. 7 are omitted and the through glass via 144 and the first and second circuit pattern layers < RTI ID = 0.0 > The process of forming the first and second electrodes 146a and 146b is performed. Subsequently, the glass circuit substrate can be manufactured by carrying out substantially the same processes as those described above with reference to Figs. 10 to 16.

In some other embodiments, the glass core 220 can be formed in a state in which the first and second circuit pattern layers, which are connected to the through glass vias 24 and the through glass vias 24, Can be provided. At this time, the manufacturing method of the glass circuit board can be in accordance with the flowchart shown in Fig.

Referring to FIG. 26, in step S310, a base substrate including a glass core and a frame structure arranged to surround the outer periphery of the glass core is prepared. The glass core may include through glass vias formed to penetrate the glass core, and first and second circuit pattern layers connected to the through glass vias and disposed on both sides of the glass core. In step S320, the first and second insulating layers may be formed to cover the first and second circuit pattern layers, respectively. In step S330, the glass core including the through glass vias and the first and second circuit pattern layers can be separated from the frame structure.

The following steps can be followed in detail. First, as shown in FIG. 25, a glass core 220 is prepared, and a glass core 220 is processed to form a through glass via hole passing through the glass core 220. At this time, an alignment hole 22 for alignment or handling may be additionally formed on the outer edge of the glass core 220. Then, the first and second circuit pattern layers disposed on both sides of the through glass vias 24 and the glass core 220 filling the through-hole glass via holes are formed.

2 and 3, the glass core 220 having the through-hole glass vias 24 and the first and second circuit pattern layers is cut into the cavity of the original plate, (10). Next, a pair of sacrificial copper foils 130a and 130b are prepared and disposed on both surfaces of the original plate on which the glass core 220 is disposed. Subsequently, a pair of sacrificial copper foils 130a and 130b, the disk and the glass core 200 are compression bonded by performing substantially the same process as the process described above with reference to Fig. Subsequently, the glass core 200 is exposed on both sides by selectively performing a pair of sacrificial copper foils 130a and 130b by performing substantially the same process as the process described above with reference to Fig. Since the through glass vias 24 and the first and second circuit pattern layers 146a and 146b are already formed in the glass core 200, the processes related to Figs. 7 to 9 may be omitted. Subsequently, the glass circuit substrate can be manufactured by carrying out substantially the same processes as those described above with reference to Figs. 10 to 16.

In some other embodiments, the process shown in Figs. 27 to 30 can be selectively applied to the manufacturing process of the glass circuit board. Referring to FIG. 27, a copper laminated substrate 110 is prepared. The copper laminated board 110 may have a form in which the copper foil 112 is bonded to both surfaces of the insulating core layer 111.

Referring to FIG. 28, the copper layered substrate 110 may be processed to form the cavity 10 through the copper layered substrate 110.

Referring to FIG. 29, a glass core 200 is prepared, and a glass core 200 is placed in a cavity 10. Next, a pair of insulating base material layers 1200a and 1200b and a pair of sacrificial copper foils 130a and 130b are prepared. Subsequently, the insulating base layers 1200a and 1200b and the sacrificial copper foils 130a and 130b are sequentially disposed on both sides of the glass core 200 and the copper laminated substrate 110, respectively.

Referring to FIG. 30, the sacrificial copper foils 130a and 130b, the insulating substrate layers 1200a and 1200b, the copper laminated substrate 110, and the glass core 200 are bonded to each other. Then, the pair of sacrificial copper foils 130a and 130b are selectively processed to expose both sides of the glass core portion to which the insulating base layer is bonded. Thereafter, a glass circuit substrate can be manufactured by performing substantially the same processes as those described above with reference to Figs. 7 to 16.

As described above, the glass circuit board manufactured by applying the manufacturing method of various embodiments is an example, and the structure can be explained using Fig. Referring to FIG. 16, the glass circuit board may include a glass core 200. The glass core 200 may include glass through vias 144 and may include first and second circuit pattern layers 146a and 146b on both sides connected to the glass through vias 144. [ The glass core 200 has a high elastic modulus and rigidity and a low coefficient of thermal expansion, so that the warpage of the original plate can be effectively suppressed as compared with the case of using a conventional copper laminated board or prepreg board as a original plate.

Referring to FIG. 16, first and second insulating layers 150a and 150b may be disposed on the glass core 200 to cover the first and second circuit pattern layers 146a and 146b. The first and second blind vias 162a and 162b disposed in the first and second insulating layers 150a and 150b and connected to the first and second circuit pattern layers 146a and 146b may be disposed . The third and fourth circuit pattern layers 164a and 164b connected to the first and second blind vias 162a and 162b may be disposed on the first and second insulating layers 150a and 150b.

The third and fourth insulating layers 170a and 170b covering the third and fourth circuit pattern layers 164a and 164b may be disposed on the first and second insulating layers 150a and 150b. Third and fourth blind vias 182a and 182b connected to the third and fourth circuit pattern layers 164a and 164b may be disposed in the third and fourth insulating layers 170a and 170b. The fifth and sixth circuit pattern layers 184a and 184b connected to the third and fourth blind vias 182a and 182b may be disposed on the third and fourth insulating layers 170a and 170b.

As some other embodiments, the glass circuit board shown in Fig. 17 can be provided. The illustrated glass circuit substrate is the same as the glass circuit board described above with reference to FIG. 16, except that a passive element 300 or a semiconductor element such as an active element is embedded in the cavity formed in the glass core 200. [ May be substantially the same.

As another embodiment, a glass circuit board shown in Fig. 21 can be provided. The illustrated glass circuit substrate has the same structure as that described with reference to Fig. 16 except that the fifth and sixth circuit pattern layers 184a and 184b are buried in the third and fourth insulating layers 170a and 170b. As shown in Fig. At this time, the upper surfaces of the fifth and sixth circuit pattern layers 184a and 185b may be disposed on the same plane as the upper surfaces of the third and fourth insulating layers 170a and 170b.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It can be understood that

10: cavity, 20: through glass via hole,
30a 30b: Blind via hole, 40: Glass core cavity,
110: copper laminated substrate, 111: insulating core layer,
112: copper foil, 120a 120b: prepreg substrate,
130a 130b: sacrificial copper foil, 144: through glass vias,
146a 146b: first and second circuit pattern layers,
150a 150b: first and second insulating layers,
162a 162b: first and second blind vias,
164a 164b: third and fourth circuit pattern layers,
170a 170b: third and fourth insulating layers,
182a 182b: third and fourth blind vias,
184a 184b 184a2 184b2: fifth and sixth circuit pattern layers,
190a 190b: first and second solder resist pattern layers,
200: glass core
1200a 1200b: insulating substrate layer.

Claims

(a) preparing a base substrate including a glass core, and a frame structure arranged to surround the outer periphery of the glass core;
(b) processing the glass core to form a through glass via hole;
(c) forming through glass vias filling the inside of the through glass via holes and first and second circuit pattern layers respectively disposed on both sides of the glass core;
(d) forming first and second insulating layers on both surfaces of the base substrate, respectively, to cover the first and second circuit pattern layers, respectively;
(e) separating the glass core and the frame structure from each other to manufacture the glass core including the through glass vias, the first and second circuit pattern layers, and the first and second insulating layers doing
A method of manufacturing a glass circuit board.

The method according to claim 1,
(a)
(a1) preparing a substrate of at least one of a copper laminated substrate and a prepreg substrate;
(a2) forming a cavity through the circular plate by machining the circular plate;
(a3) preparing the glass core, and placing the glass core in the cavity;
(a4) preparing a pair of sacrificial copper foils, placing the glass core and the upper surface of the glass plate on both sides
(a5) pressing and bonding the pair of sacrificial copper foils, the disk and the glass core; And
(a6) selectively exposing the pair of sacrificial copper foils to expose both sides of the glass core
A method of manufacturing a glass circuit board.

3. The method of claim 2,
Wherein the pair of sacrificial copper foils comprises an adhesive layer on a surface facing the glass core and the original plate.

3. The method of claim 2,
In step (a6)
Wherein the pattern layer of the sacrificial copper foil remaining after the selective processing is positioned to cover at least a portion of the glass core
A method of manufacturing a glass circuit board.

The method according to claim 1,
(a)
(a1) preparing a copper laminated substrate;
(a2) forming a cavity through the copper-clad laminate by processing the copper-clad laminate;
(a3) preparing the glass core, and placing the glass core in the cavity;
(a4) preparing a pair of insulating substrate layers and a pair of sacrificial copper foils;
(a5) sequentially arranging the insulating base layer and the sacrificial copper foil on upper surfaces of the glass core and the copper laminated substrate;
(a5) pressing and bonding the sacrificial copper foil, the insulating base layer, the copper laminated substrate and the glass core; And
(a6) selectively exposing the pair of sacrificial copper foils to expose both sides of the glass core to which the insulating substrate layer is bonded
A method of manufacturing a glass circuit board.

The method according to claim 1,
(b)
Processing the glass core to penetrate the inside of the glass core so as to reach the other surface from one surface of the glass core or to process the glass core inward from both surfaces of the glass core
A method of manufacturing a glass circuit board.

The method according to claim 1,
(c)
(c1) forming a seed layer for plating on a surface of the glass core and an inner wall of the through-hole; And
(c2) a step of forming an electroplating process using the seed layer for plating to form a copper plating layer filling the through glass via holes and a plating pattern layer positioned on the surface of the glass core
A method of manufacturing a glass circuit board.

8. The method of claim 7,
The step of forming the plating seed layer
Forming a copper layer by a sputtering method or an electroless plating method
A method of manufacturing a glass circuit board.

8. The method of claim 7,
The step of forming the plating pattern layer
And is performed by any one of the processes selected from the group consisting of a tenting process, an additive process, a semi-additive process (SAP), and a modified semi-additive process (MSAP)
A method of manufacturing a glass circuit board.

The method according to claim 1,
Between step (c) and step (d)
Processing the glass core to form a glass core cavity penetrating the glass core;
Preparing a semiconductor device;
Disposing the semiconductor element in the glass core cavity; And
And forming a connecting circuit pattern layer on the electrode layer of the semiconductor element
A method of manufacturing a glass circuit board.

The method according to claim 1,
(d)
Preparing a pair of interlayer insulating materials;
Disposing the pair of interlayer insulating materials on both sides of the frame structure and the glass core; And
And pressing and bonding the pair of interlayer insulating materials, the frame structure and the glass core
A method of manufacturing a glass circuit board.

The method according to claim 1,
After step (d)
Forming a blind via hole selectively exposing the first and second circuit pattern layers by selectively processing the first and second insulating layers; And
Forming first and second blind via holes filling the blind via hole and third and fourth circuit pattern layers disposed on the first and second insulating layers,
A method of manufacturing a glass circuit board.

The method according to claim 1,
(e)
Removing the frame structure from the base substrate by applying a laser processing method
A method of manufacturing a glass circuit board.

(a) preparing a base substrate including a glass core having a through glass via hole, and a frame structure arranged to surround the outer periphery of the glass core;
(b) forming through glass vias filling the inside of the through glass via holes and first and second circuit pattern layers respectively disposed on both sides of the glass core;
(c) forming first and second insulating layers on both surfaces of the base substrate, respectively, to cover the first and second circuit pattern layers, respectively;
(d) separating the glass core and the frame structure from each other to manufacture the glass core including the through glass vias, the first and second circuit pattern layers, and the first and second insulating layers doing
A method of manufacturing a glass circuit board.

15. The method of claim 14,
(a)
(a1) preparing a substrate of at least one of a copper laminated substrate and a prepreg substrate;
(a2) forming a cavity through the circular plate by machining the circular plate;
(a3) preparing a glass core and processing the glass core to form a through glass via hole penetrating the glass core;
(a4) disposing a glass core having the through-glass via hole in the cavity;
(a5) preparing a pair of sacrificial copper foils, and placing the sacrificial copper foil on both sides of the disk on which the glass core is disposed;
(a6) pressing and bonding the pair of sacrificial copper foils, the disk and the glass core; And
(a7) selectively exposing the pair of sacrificial copper foils to expose both sides of the glass core,
A method of manufacturing a glass circuit board.

(a) preparing a base substrate including a glass core and a frame structure disposed so as to surround the outer periphery of the glass core, the glass core including a through glass via arranged through the glass core, And first and second circuit pattern layers connected to the glass core and disposed on both sides of the glass core, respectively;
(b) forming first and second insulating layers, respectively, on the base substrate to cover the first and second circuit pattern layers, respectively;
(c) separating the glass core and the frame structure from each other to manufacture the glass core including the through glass vias, the first and second circuit pattern layers, and the first and second insulating layers doing
A method of manufacturing a glass circuit board.

17. The method of claim 16,
(a)
(a1) preparing a substrate of at least one of a copper laminated substrate and a prepreg substrate;
(a2) forming a cavity through the circular plate by machining the circular plate;
(a3) preparing a glass core and processing the glass core to form a through glass via hole penetrating the glass core;
(a4) forming through glass vias filling the inside of the through glass via holes and first and second circuit pattern layers disposed on both sides of the glass core;
(a5) disposing a glass core including the through glass via, the first and second circuit pattern layers in the cavity;
(a5) preparing a pair of sacrificial copper foils and disposing them on both sides of the glass core and the original plate;
(a6) pressing and bonding the pair of sacrificial copper foils, the disk and the glass core; And
(a7) selectively exposing the pair of sacrificial copper foils to expose both sides of the glass core,
A method of manufacturing a glass circuit board.

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