JP2001058874A - Ceramics substrate and its production - Google Patents
Ceramics substrate and its productionInfo
- Publication number
- JP2001058874A JP2001058874A JP11231096A JP23109699A JP2001058874A JP 2001058874 A JP2001058874 A JP 2001058874A JP 11231096 A JP11231096 A JP 11231096A JP 23109699 A JP23109699 A JP 23109699A JP 2001058874 A JP2001058874 A JP 2001058874A
- Authority
- JP
- Japan
- Prior art keywords
- dividing
- substrate
- grooves
- dividing groove
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Oxide Ceramics (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は角チップ抵抗器に代
表されるような各種電子部品などに用いられるセラミッ
ク基板およびその製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic substrate used for various electronic parts typified by square chip resistors and a method for manufacturing the same.
【0002】[0002]
【従来の技術】従来から分割溝付きのセラミック基板
は、以下のようにして作られる。2. Description of the Related Art Conventionally, a ceramic substrate having a dividing groove is manufactured as follows.
【0003】まず、原料となるセラミック粉末を有機バ
インダーとともに混合・分散したスラリーから、ドクタ
ーブレード法などを用いて図5に示すようにグリーンシ
ート4を形成する。次に、所定の刃先角度を有するブレ
ードを組み込んだ金型を用いて、このグリーンシート4
に分割溝5を形成する。分割溝5はブレードの刃先角度
を先端角としてV形状となる。このようにして得られた
成形体を十分焼結が進行する温度で焼成する。First, a green sheet 4 is formed from a slurry obtained by mixing and dispersing a ceramic powder as a raw material together with an organic binder by a doctor blade method or the like as shown in FIG. Next, using a mold incorporating a blade having a predetermined edge angle, the green sheet 4
The division groove 5 is formed. The dividing groove 5 has a V-shape with the tip angle of the blade edge angle. The compact obtained in this way is fired at a temperature at which sintering proceeds sufficiently.
【0004】ここで、グリーンシート4に形成されてい
る分割溝5の先端角は鋭いほど分割性が向上するが、ブ
レードの耐久性などを考慮するとブレードの刃先角度が
30°より小さい場合、量産に向かない。そのため、成
形条件を定めて刃先角度が30°以上のブレードを用い
て分割溝を成形した際に分割溝5の先端から数10ミク
ロンのマイクロクラック6を形成して分割性を向上させ
ている。[0004] Here, the sharper the leading edge of the dividing groove 5 formed in the green sheet 4 is, the more the dividing property is improved. However, considering the durability of the blade, if the blade edge angle of the blade is smaller than 30 °, mass production is difficult. Not suitable for Therefore, when the forming conditions are determined and the dividing groove is formed using a blade having a blade edge angle of 30 ° or more, a microcrack 6 of several tens of microns is formed from the tip of the dividing groove 5 to improve the dividing property.
【0005】[0005]
【発明が解決しようとする課題】しかしながら、このよ
うな従来の技術では、マイクロクラック6が分割溝5の
先端から垂直に形成されない場合があり、この時、分割
溝にマイクロクラック6に沿って斜めに分割されてしま
うという分割性の劣化の課題を有していた。However, in such a conventional technique, the micro crack 6 may not be formed vertically from the tip of the dividing groove 5, and at this time, the micro crack 6 is obliquely formed along the micro crack 6 in the dividing groove. However, there is a problem of deterioration in the dividing property that the image is divided into pieces.
【0006】本発明は分割溝の先端角を鋭くすることに
よって分割性の向上を図ったセラミック基板およびその
製造方法を提供することを目的とするものである。SUMMARY OF THE INVENTION It is an object of the present invention to provide a ceramic substrate in which the dividing property is improved by sharpening the tip angle of the dividing groove, and a method of manufacturing the same.
【0007】[0007]
【課題を解決するための手段】この課題を解決するため
に本発明は、分割溝の先端角が20°以下であり、分割
溝の間に窪みを形成したセラミック基板であり、分割溝
を形成したグリーンシートの分割溝の間に窪みを形成し
て分割溝の先端角が20°以下にして、これを焼成する
セラミック基板およびその製造方法である。SUMMARY OF THE INVENTION In order to solve this problem, the present invention is directed to a ceramic substrate having a dividing groove having a tip angle of 20 ° or less and having a recess formed between the dividing grooves. And a method of manufacturing a ceramic substrate in which a recess is formed between the divided grooves of the green sheet so that the tip angle of the divided grooves is set to 20 ° or less, and the resultant is fired.
【0008】この本発明によれば、分割溝の先端角が小
さな分割溝付きのセラミック基板を得ることができる。According to the present invention, it is possible to obtain a ceramic substrate having a dividing groove having a small tip angle of the dividing groove.
【0009】[0009]
【発明の実施の形態】本発明の請求項1に記載の発明
は、基板の表裏異なった面上にそれぞれ分割溝と窪みを
有し、前記分割溝の先端角が20°以下であり、前記窪
みを前記分割溝の間の裏面に形成したセラミック基板で
あり、基板に窪みを形成して分割溝の先端角を小さくす
ることにより、分割性が向上するという作用を有する。The invention according to claim 1 of the present invention is characterized in that the substrate has a dividing groove and a dent on different sides of the substrate, and the tip angle of the dividing groove is 20 ° or less. This is a ceramic substrate having a depression formed on the back surface between the division grooves, and has an effect of improving the division performance by forming a depression in the substrate to reduce the tip angle of the division groove.
【0010】本発明の請求項2に記載の発明は、基板の
同一面上に分割溝と窪みを有し、前記分割溝の先端角が
20°以下であり、前記窪みを前記分割溝の間に形成し
たセラミック基板であり、基板に比較的浅い窪みを形成
して分割溝の先端角を小さくすることにより、分割性が
向上するという作用を有する。According to a second aspect of the present invention, there is provided a semiconductor device having a dividing groove and a recess on the same surface of a substrate, wherein a tip angle of the dividing groove is 20 ° or less, and the recess is formed between the dividing grooves. This has the effect of improving the dividability by forming a relatively shallow depression in the substrate to reduce the tip angle of the dividing groove.
【0011】本発明の請求項3に記載の発明は、基板の
両面に形成された分割溝と片側に形成された窪みを有
し、前記分割溝の先端角が20°以下であり、前記窪み
を前記分割溝の間に形成したセラミック基板であり、基
板の片面に窪みを形成して基板両面の分割溝の先端角を
小さくすることにより、分割性がさらに向上するという
作用を有する。According to a third aspect of the present invention, there is provided a semiconductor device, comprising: a dividing groove formed on both sides of a substrate; and a dent formed on one side, wherein the tip angle of the dividing groove is 20 ° or less, Is a ceramic substrate formed between the above-mentioned dividing grooves, and has a function of further improving the dividing property by forming a depression on one surface of the substrate to reduce the tip angle of the dividing groove on both surfaces of the substrate.
【0012】本発明の請求項4に記載の発明は、基板の
両面に分割溝と窪みを有し、前記分割溝の先端角が20
°以下であり、前記窪みを前記分割溝の間に形成したセ
ラミック基板であり、基板の両面に窪みを形成して基板
両面の分割溝の先端角を小さくすることにより、分割性
がさらに向上するという作用を有する。According to a fourth aspect of the present invention, the substrate has a dividing groove and a depression on both sides, and the tip angle of the dividing groove is 20.
° or less, a ceramic substrate in which the depression is formed between the division grooves, and the dividability is further improved by forming depressions on both surfaces of the substrate to reduce the tip angles of the division grooves on both surfaces of the substrate. It has the action of:
【0013】本発明の請求項5に記載の発明は、グリー
ンシートを形成する第1工程と、第1工程で得られたグ
リーンシートに分割溝を形成する第2工程と、第2工程
で得られたグリーンシートの分割溝の間に窪みを形成す
る第3工程と、第3工程で得られたグリーンシートを焼
成する第4工程を少なくとも有し、第3工程で第2工程
で形成された分割溝の先端角を小さくするセラミック基
板の製造方法であり、分割溝の間に窪みを形成した際に
分割溝のほうにグリーンシートが局所的に流動して先端
角が小さくなり、分割性が向上するという作用を有す
る。According to a fifth aspect of the present invention, there is provided a first step of forming a green sheet, a second step of forming a dividing groove in the green sheet obtained in the first step, and a second step of forming a green sheet. A third step of forming a depression between the divided grooves of the obtained green sheet, and a fourth step of firing the green sheet obtained in the third step, wherein the third step is formed in the second step. This is a method of manufacturing a ceramic substrate in which the tip angle of a dividing groove is reduced, and when a depression is formed between the dividing grooves, the green sheet flows locally toward the dividing groove to reduce the tip angle, thereby improving the dividing property. It has the effect of improving.
【0014】以下、本発明の実施の形態について図面を
用いて説明する。Hereinafter, embodiments of the present invention will be described with reference to the drawings.
【0015】(実施の形態1)本発明の第1の実施の形
態におけるセラミック基板は、図1に示すようにAl 2
O3:MgO:CaCO3:SiO2粉末を96:1.
0:0.5:2.5の重量比で混合した原料粉末とブチ
ラール樹脂、可塑剤、溶剤を混合・分散して得られたス
ラリーからドクターブレード法によりグリーンシート1
を形成する第1工程と、第1工程で得られたグリーンシ
ート1に刃先角度がそれぞれ30°〜45°のブレード
が、360μm間隔で組み込まれた金型で分割溝2を形
成する第2工程と、第2工程で得られたグリーンシート
1の分割溝2の間に幅240μm、深さ40μmの窪み
3を金型で形成する第3工程と、第3工程で得られたグ
リーンシート1を1600℃で焼成する第4工程とを経
て形成される(試料1,2)。(Embodiment 1) First embodiment of the present invention
The ceramic substrate in the state is made of Al as shown in FIG. Two
OThree: MgO: CaCOThree: SiOTwo96: 1.
Raw material powder and spots mixed in a weight ratio of 0: 0.5: 2.5
A mixture obtained by mixing and dispersing Lal resin, plasticizer and solvent
Green sheet 1 from rally by doctor blade method
A first step of forming a green sheet; and a green chip obtained in the first step.
Blades with blade angles of 30 ° to 45 ° for each
Formed the dividing groove 2 with a mold assembled at 360 μm intervals
The second step to be formed and the green sheet obtained in the second step
A recess having a width of 240 μm and a depth of 40 μm between one dividing groove 2.
3 in a mold, and the mold obtained in the third step.
A fourth step of firing the lean sheet 1 at 1600 ° C.
(Samples 1 and 2).
【0016】また、Al2O3:MnO2:TiO2:Si
O2粉末を94:2.0:2.0:2.0の重量比で混
合した原料粉末から、同様の方法で1200℃で焼成し
てセラミック基板(試料3,4)を得た。Further, Al 2 O 3 : MnO 2 : TiO 2 : Si
A ceramic substrate (samples 3 and 4) was obtained by firing at 1200 ° C. in the same manner from a raw material powder obtained by mixing O 2 powder at a weight ratio of 94: 2.0: 2.0: 2.0.
【0017】比較のため、上記第2工程で刃先角度の3
0〜45°のブレードを用いて、窪みを形成せずに他は
同一条件でセラミック基板を作成した(比較品1,
2)。その結果を(表1)に比較して示す。For comparison, in the second step described above, 3
Using a blade of 0 to 45 °, a ceramic substrate was prepared under the same conditions except that no depression was formed (Comparative Product 1,
2). The results are shown in comparison with (Table 1).
【0018】[0018]
【表1】 [Table 1]
【0019】(表1)から本発明によれば、比較品1,
2に比べて試料1,2,3,4のように分割歩留まりが
向上していることがわかる。また、試料1,2と試料
3,4の比較から、分割性はセラミック基板の組成に依
存せず、分割溝の形態が大きく影響を受けることがわか
った。According to Table 1, according to the present invention, the comparative products 1,
It can be seen that the yield of division is improved as in Samples 1, 2, 3, and 4 as compared with Sample No. 2. In addition, from the comparison between Samples 1 and 2 and Samples 3 and 4, it was found that the dividing property did not depend on the composition of the ceramic substrate, and that the shape of the dividing groove was greatly affected.
【0020】(実施の形態2)本発明の第2の実施の形
態におけるセラミック基板は、図2に示すようにAl 2
O3:MnO2:TiO2:SiO2粉末を94:2.0:
2.0:2.0の重量比で混合した原料粉末から、実施
の形態1と同様の方法でグリーンシート1を得た。この
グリーンシート1にブレードの刃先角度を30°として
片面に分割溝2と窪み3を形成し、窪み3の深さを10
〜40μmの間で変化させてセラミック基板を得た(試
料5,6,7,8)。その結果を上記(表1)に比較し
て示す。(Embodiment 2) A second embodiment of the present invention
The ceramic substrate in the state is, as shown in FIG. Two
OThree: MnOTwo: TiOTwo: SiOTwoPowder 94: 2.0:
Starting from raw material powder mixed at a weight ratio of 2.0: 2.0
Green sheet 1 was obtained in the same manner as in the first embodiment. this
Green sheet 1 with 30 ° blade edge angle
A dividing groove 2 and a depression 3 are formed on one side, and the depth of the depression 3 is set to 10
The ceramic substrate was obtained by changing the distance between
Fees 5, 6, 7, 8). Compare the results to the above (Table 1)
Shown.
【0021】窪み3の深さが深くなるほど分割溝2の先
端角度が小さくなり分割歩留まりが向上することがわか
る。また、分割溝2と窪み3を基板の同一面に形成する
ことによって、試料3と同様な分割溝2の先端角が試料
6のような20μmの窪み3の深さで達成でき、比較的
浅い窪み3で分割性が向上することがわかる。It can be seen that as the depth of the dent 3 increases, the tip angle of the division groove 2 decreases, and the division yield improves. In addition, by forming the division groove 2 and the depression 3 on the same surface of the substrate, the tip angle of the division groove 2 similar to that of the sample 3 can be achieved with the depth of the depression 3 of 20 μm as in the case of the sample 6, and is relatively shallow. It can be seen that the dents 3 improve the dividing property.
【0022】(実施の形態3)本発明の第3の実施の形
態におけるセラミック基板は、図3に示すようにAl 2
O3:MnO2:TiO2:SiO2粉末を94:2.0:
2.0:2.0の重量比で混合した原料粉末から、実施
の形態1と同様の方法でグリーンシート1を得た。この
グリーンシート1にブレードの刃先角度を30°として
片面に分割溝2を形成し、両面の分割溝2間に20μm
の深さの窪み3を形成し焼成してセラミック基板を得た
(試料9)。その結果を上記(表1)に比較して示す。(Embodiment 3) A third embodiment of the present invention
In the state, the ceramic substrate is made of Al as shown in FIG. Two
OThree: MnOTwo: TiOTwo: SiOTwoPowder 94: 2.0:
Starting from raw material powder mixed at a weight ratio of 2.0: 2.0
Green sheet 1 was obtained in the same manner as in the first embodiment. this
Green sheet 1 with 30 ° blade edge angle
A dividing groove 2 is formed on one side, and 20 μm is formed between the dividing grooves 2 on both sides.
To form a recess 3 having a depth of 3 mm and firing to obtain a ceramic substrate.
(Sample 9). The results are shown in comparison with the above (Table 1).
【0023】(表1)によれば、本発明は片面に分割溝
2、両面に窪み3を形成することにより分割溝2の先端
角度が小さくなり、さらに分割歩留まりが向上すること
がわかる。According to Table 1, according to the present invention, by forming the dividing groove 2 on one side and the depression 3 on both sides, the tip angle of the dividing groove 2 is reduced, and the dividing yield is further improved.
【0024】(実施の形態4)本発明の第4の実施の形
態におけるセラミック基板は、図4に示すようにAl 2
O3:MnO2:TiO2:SiO2粉末を94:2.0:
2.0:2.0の重量比で混合した原料粉末から、実施
の形態1と同様の方法でグリーンシート1を得た。この
グリーンシート1の両面にブレードの刃先角度を30°
として分割溝2を形成し、さらに両面の分割溝2間に1
0μmの深さの窪み3を形成し焼成してセラミック基板
を得た(試料10)。その結果を上記(表1)に比較し
て示す。(Embodiment 4) A fourth embodiment of the present invention.
The ceramic substrate in the state is, as shown in FIG. Two
OThree: MnOTwo: TiOTwo: SiOTwoPowder 94: 2.0:
Starting from raw material powder mixed at a weight ratio of 2.0: 2.0
Green sheet 1 was obtained in the same manner as in the first embodiment. this
30 ° angle of blade edge on both sides of green sheet 1
To form a dividing groove 2, and further, between the dividing grooves 2 on both surfaces, 1
A recess 3 having a depth of 0 μm is formed and fired to form a ceramic substrate.
Was obtained (Sample 10). Compare the results to the above (Table 1)
Shown.
【0025】(表1)によれば、本発明は両面に分割溝
2が形成される効果と相乗して、基板の両面に窪み3を
形成することにより、10μmというより浅い窪み3の
深さで分割溝2の先端角度が小さくなり、さらに分割歩
留まりが向上することがわかる。According to Table 1, according to the present invention, the depth of the shallower recess 3 of 10 μm is formed by forming the recess 3 on both sides of the substrate in synergy with the effect of forming the dividing grooves 2 on both sides. It can be seen that the tip angle of the dividing groove 2 becomes smaller, and the dividing yield is further improved.
【0026】なお、ここでは、100個のサンプルを用
い、分割不良とは、斜め方向の分割を示し、基板面の垂
直方向から8°以上ずれたものを不良と判定した。In this case, 100 samples were used, and the division failure was a diagonal division, and a specimen deviated by 8 ° or more from the vertical direction of the substrate surface was determined to be defective.
【0027】[0027]
【発明の効果】以上のように本発明によれば、分割溝の
先端角が20°以下であり、分割溝の間に窪みを形成し
たセラミック基板であり、グリーンシートを形成する第
1工程と、第1工程で得られたグリーンシートに分割溝
を形成する第2工程と、第2工程で得られたグリーンシ
ートの分割溝の間に窪みを形成する第3工程と、第3工
程で得られたグリーンシートを焼成する第4工程を少な
くとも有し、第3工程で第2工程で形成された分割溝の
先端角を小さくするセラミック基板の製造方法であり、
第3工程で窪みを形成することによって第2工程で形成
した分割溝の先端角が小さくなるという作用を有するこ
とによって、分割性の優れたセラミック基板を得ること
ができる。As described above, according to the present invention, the first step of forming the green sheet is a ceramic substrate in which the tip angle of the dividing groove is not more than 20 ° and the hollow is formed between the dividing grooves. A second step of forming a dividing groove in the green sheet obtained in the first step, a third step of forming a depression between the dividing grooves of the green sheet obtained in the second step, and a third step. A method of manufacturing a ceramic substrate, comprising at least a fourth step of firing the obtained green sheet, and reducing a tip angle of the divided groove formed in the second step in the third step;
By forming the depression in the third step, the tip angle of the division groove formed in the second step is reduced, so that a ceramic substrate having excellent division characteristics can be obtained.
【図1】本発明のセラミック基板の実施の形態1の断面
図FIG. 1 is a sectional view of a ceramic substrate according to a first embodiment of the present invention;
【図2】本発明のセラミック基板の実施の形態2の断面
図FIG. 2 is a sectional view of a ceramic substrate according to a second embodiment of the present invention;
【図3】本発明のセラミック基板の実施の形態3の断面
図FIG. 3 is a sectional view of a ceramic substrate according to a third embodiment of the present invention;
【図4】本発明のセラミック基板の実施の形態4の断面
図FIG. 4 is a sectional view of a ceramic substrate according to a fourth embodiment of the present invention;
【図5】従来の分割溝付きセラミック基板の断面図FIG. 5 is a cross-sectional view of a conventional divided grooved ceramic substrate.
1 グリーンシート 2 分割溝 3 窪み 1 Green sheet 2 Dividing groove 3 Depression
フロントページの続き (72)発明者 下山 浩司 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Fターム(参考) 4G030 AA07 AA08 AA16 AA25 AA36 AA37 BA01 Continuation of the front page (72) Inventor Koji Shimoyama 1006 Kazuma Kadoma, Kadoma-shi, Osaka Matsushita Electric Industrial Co., Ltd. F-term (reference) 4G030 AA07 AA08 AA16 AA25 AA36 AA37 BA01
Claims (5)
溝と窪みを有し、前記分割溝の先端角が20°以下であ
り、前記窪みを前記分割溝の間の裏面に形成したセラミ
ック基板。1. A ceramic substrate having a dividing groove and a dent on different sides of a substrate, wherein a tip angle of the dividing groove is 20 ° or less, and wherein the dent is formed on a back surface between the dividing grooves. .
前記分割溝の先端角が20°以下であり、前記窪みを前
記分割溝の間に形成したセラミック基板。2. A substrate having a dividing groove and a depression on the same surface of a substrate,
A ceramic substrate, wherein a tip angle of the division groove is equal to or less than 20 ° and the depression is formed between the division grooves.
形成された窪みを有し、前記分割溝の先端角が20°以
下であり、前記窪みを前記分割溝の間に形成したセラミ
ック基板。3. A ceramic having a dividing groove formed on both sides of a substrate and a dent formed on one side, wherein a tip angle of the dividing groove is 20 ° or less, and wherein the dent is formed between the dividing grooves. substrate.
分割溝の先端角が20°以下であり、前記窪みを前記分
割溝の間に形成したセラミック基板。4. A ceramic substrate having a dividing groove and a dent on both sides of a substrate, wherein a tip angle of the dividing groove is 20 ° or less, and wherein the dent is formed between the dividing grooves.
第1工程で得られたグリーンシートに分割溝を形成する
第2工程と、第2工程で得られた成形体の分割溝の間に
窪みを形成する第3工程と、第3工程で得られた成形体
を焼成する第4工程を少なくとも有し、第3工程で第2
工程で形成された分割溝の先端角を小さくするセラミッ
ク基板の製造方法。5. A first step of forming a green sheet,
A second step of forming a dividing groove in the green sheet obtained in the first step, a third step of forming a depression between the dividing grooves of the molded body obtained in the second step, and a third step At least a fourth step of firing the molded body, and the third step
A method of manufacturing a ceramic substrate, wherein the tip angle of a dividing groove formed in a process is reduced.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11231096A JP2001058874A (en) | 1999-08-18 | 1999-08-18 | Ceramics substrate and its production |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11231096A JP2001058874A (en) | 1999-08-18 | 1999-08-18 | Ceramics substrate and its production |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2001058874A true JP2001058874A (en) | 2001-03-06 |
Family
ID=16918243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11231096A Pending JP2001058874A (en) | 1999-08-18 | 1999-08-18 | Ceramics substrate and its production |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2001058874A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2015182229A1 (en) * | 2014-05-27 | 2017-04-20 | 株式会社村田製作所 | Mother ceramic substrate, ceramic substrate, mother module component, module component, and method of manufacturing mother ceramic substrate |
-
1999
- 1999-08-18 JP JP11231096A patent/JP2001058874A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2015182229A1 (en) * | 2014-05-27 | 2017-04-20 | 株式会社村田製作所 | Mother ceramic substrate, ceramic substrate, mother module component, module component, and method of manufacturing mother ceramic substrate |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100320720B1 (en) | Piezoelectric Ceramic, Method for Producing Piezoelectric Ceramic, and Piezoelectric Oscillator | |
JP2001058874A (en) | Ceramics substrate and its production | |
EP1039485B1 (en) | Porcelain insulator and method of manufacturing the same | |
JPH09187809A (en) | Manufacture of ceramic member having fine through holes | |
JP2003082403A (en) | Bottom board for firing | |
JP2000128671A (en) | Glazed ceramic and its production | |
JPH07240571A (en) | Manufacture of ceramic substrate with split groove | |
JP3838810B2 (en) | Ceramic substrate for electronic parts | |
KR100457058B1 (en) | Firing tool material and manufacturing method | |
JP3325483B2 (en) | Method of manufacturing glaze substrate for thermal head | |
JP2002316877A (en) | Burning tool for electronic parts | |
JP2612843B2 (en) | Ceramic substrate and insulating substrate for chip components | |
JP3305673B2 (en) | Ceramic substrate | |
JPH02192459A (en) | Production of piezoelectric ceramics | |
JPH09278536A (en) | Production of ceramic molding | |
JP3690998B2 (en) | Earthenware tile | |
JP4509541B2 (en) | Manufacturing method of ceramic plate and ceramic plate | |
JPH07118071A (en) | Housing for producing dielectric porcelain | |
JPH10135583A (en) | Ceramic substrate with split groove | |
JP2609193B2 (en) | Manufacturing method of split tile | |
JPH10158070A (en) | Ceramic sintering jig and production of ceramic parts | |
JPS63184389A (en) | Manufacture of ceramic substrate with breakable trench | |
JPH09107158A (en) | Insulation board for chip components | |
JPH0748409B2 (en) | Ceramic substrate and manufacturing method thereof | |
JP2984017B2 (en) | Glaze substrate for thermal head and method of manufacturing the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20040608 |
|
A521 | Written amendment |
Effective date: 20040730 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Effective date: 20040824 Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20040906 |
|
R150 | Certificate of patent (=grant) or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |