JPS63184389A - Manufacture of ceramic substrate with breakable trench - Google Patents

Manufacture of ceramic substrate with breakable trench

Info

Publication number
JPS63184389A
JPS63184389A JP29881086A JP29881086A JPS63184389A JP S63184389 A JPS63184389 A JP S63184389A JP 29881086 A JP29881086 A JP 29881086A JP 29881086 A JP29881086 A JP 29881086A JP S63184389 A JPS63184389 A JP S63184389A
Authority
JP
Japan
Prior art keywords
dividing
ceramic substrate
ceramic
cracks
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP29881086A
Other languages
Japanese (ja)
Other versions
JPH0728112B2 (en
Inventor
大谷 鉦吾
正博 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP29881086A priority Critical patent/JPH0728112B2/en
Publication of JPS63184389A publication Critical patent/JPS63184389A/en
Publication of JPH0728112B2 publication Critical patent/JPH0728112B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は分割用の溝部を設けたセラミック基板の製造方
法に係り、特に分割用溝先端における亀裂および破断の
防止力”法に関するものである。
[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a method of manufacturing a ceramic substrate provided with a dividing groove, and particularly relates to a method for preventing cracking and breakage at the tip of the dividing groove. .

(従来の技術) 多くの機能部品に使用されるセラミック基板や電子部品
として大規模集積回路用パッケージ等のセラミック基板
の製造に際しては、1枚のセラミック生シートに多数の
同一印刷や孔加工を施し、これに分割用溝を構設して焼
結後多数個に分割して量産する方法が採用されている。
(Prior art) When manufacturing ceramic substrates used in many functional parts and electronic components such as large-scale integrated circuit packages, a single green ceramic sheet is subjected to numerous identical printings and holes. A method has been adopted in which dividing grooves are formed in this, and after sintering, the material is divided into a large number of parts for mass production.

従来、この分割用溝付き基板の製造方法には金型に鋭角
な刃物を取り付けて1枚のセラミック生シートの所要寸
法の截断と同時に分割用溝を構設する手段が採用されて
おり、第3図(イ)において説明すれば、1はセラミッ
ク生シートを所要寸法に截断したセラミック生成形基板
で、2は切断分割するためのV字状に切り込んだ分割用
溝であり、セラミック生成形基板1の端面まで切り込ん
である。
Conventionally, the manufacturing method of this substrate with grooves for dividing has adopted a method of attaching a sharp blade to a mold and simultaneously cutting a single raw ceramic sheet to a required size and simultaneously constructing grooves for dividing. To explain in Fig. 3 (A), 1 is a ceramic-formed substrate that has been cut into required dimensions from a raw ceramic sheet, and 2 is a dividing groove cut into a V-shape for cutting and dividing the ceramic-formed substrate. The cut is made to the end face of 1.

上記の如くセラミック生シートに分割用溝を構設する際
、第2図に断面図で示す如くセラミック生シート1の分
割用a2の端縁部においてV字状溝底部から亀裂3を生
じたり、また、溝構設の際に亀裂が発生しなくともその
際の応力のために、セラミック生シートの樹脂抜きベー
キングあるいは本焼成時に、同様に亀裂を生じ易く破断
に至ることがあるという問題がある。従って、現在では
上記のような亀裂および破断を極力避けるべく、分割用
溝を第3図(ロ)に示す如くセラミック生成形基板1の
端面まで至らず内部で終わる分割用溝2゛ と、端面ま
で切り込んだ分割用溝2とを併用し、かつ、分割用溝2
゛を多く分割用溝2を少なくするよう考慮して製造され
ている。
When forming the dividing grooves in the raw ceramic sheet as described above, cracks 3 may occur from the bottom of the V-shaped groove at the edge of the dividing groove a2 of the raw ceramic sheet 1, as shown in the cross-sectional view in FIG. Additionally, even if no cracks occur during groove construction, due to the stress at that time, cracks are likely to occur during resin removal baking or final firing of the raw ceramic sheet, which may lead to breakage. . Therefore, in order to avoid the above-mentioned cracks and breaks as much as possible, currently, the dividing grooves are formed into dividing grooves 2' that do not reach the end face of the ceramic forming substrate 1 but end inside the end face, as shown in FIG. 3(B). The dividing groove 2 is used in combination with the dividing groove 2 cut to
It is manufactured with consideration given to increasing the number of dividing grooves 2 and decreasing the number of dividing grooves 2.

(発明が解決しようとする問題点) 上記の如く考慮されていてもセラミック生成形基板1の
端面まで至る分割用溝2が構設されている限り、危険度
は少なくなったとはいえ上記の如き亀裂及び破断のおそ
れがある。
(Problems to be Solved by the Invention) Even if the above considerations are taken into consideration, as long as the dividing groove 2 extending to the end face of the ceramic forming substrate 1 is provided, the above-mentioned problem may occur even though the degree of danger is reduced. There is a risk of cracking and breaking.

(問題点を解決するための手段及び作用)本発明は、上
記の如き問題点を解決するためになされたもので、セラ
ミック生シートを截断し、同時に分割用溝2を構設した
セラミック生成形基板の周囲端面薔溶剤を含浸したスポ
ンジバフで摩擦し、その摩擦熱によって端面の表面を軟
化させv字状分割用溝の先端部の一部を素地の流れによ
り埋めることにより、講構設時に発生した亀裂を補修す
るとともにベーキングおよび本焼成時の溝部からの亀裂
および破断を防止するために補強する方法を採るもので
ある。
(Means and effects for solving the problems) The present invention has been made to solve the problems as described above, and is made by cutting a raw ceramic sheet and forming a ceramic raw material with dividing grooves 2 at the same time. By rubbing the peripheral edge surface of the substrate with a sponge buff impregnated with a solvent, the surface of the edge surface is softened by the frictional heat, and a part of the tip of the V-shaped dividing groove is filled with the flow of substrate. This method involves repairing cracks that have occurred and reinforcing the grooves to prevent cracks and breakage from occurring during baking and final firing.

(実施例) 第1図(イ)は、本発明による分割用溝部を有するセラ
ミック基板の製造方法を説明するための斜視図、第1図
(ロ)は第1図(イ)において円Aで囲んだ部分の拡大
斜視図であり、従来例の第3図と同様に1はセラミック
生シートで、アルミナ粉末96、フラックス(5iOz
、CaO、MgO組成)4、樹脂8〜12、可塑剤4〜
6、溶剤20〜30からなるスリップをドクターブレー
ド法で作った生シートを所要寸法(縦75mm x横7
5mm X厚さ0.8mm )に截断し、同時に小基板
20個になるようにV字状に切り込んだ分割用溝2が構
設されている。そして亀裂がある場合にはその亀裂を補
修し、亀裂がなくとも補強するために、上記の如く加工
された生シートの端面4をスポンジハフでバフ加工する
ことにより端面とハフとの摩擦によって端面の表面が軟
化し、その一部が溝端部に溶着して溝部の底部を埋める
。5はこのようにして埋められた部分を示し、第1図(
ロ)ではハンチングで示した。
(Example) FIG. 1(A) is a perspective view for explaining the manufacturing method of a ceramic substrate having dividing grooves according to the present invention, and FIG. 1(B) is a circle A in FIG. 1(A). It is an enlarged perspective view of the enclosed part, and 1 is a ceramic raw sheet as in the conventional example shown in FIG.
, CaO, MgO composition) 4, resin 8-12, plasticizer 4-
6. Cut a raw sheet made from a slip containing 20 to 30% solvent using the doctor blade method into the required dimensions (height 75mm x width 7
5 mm x 0.8 mm thick), and a V-shaped dividing groove 2 is provided so that there are 20 small substrates at the same time. Then, in order to repair the cracks if there are any cracks or to strengthen them even if there are no cracks, the end faces 4 of the raw sheet processed as described above are buffed with a sponge huff, and the friction between the end faces and the huffs causes the end faces to The surface softens and a portion of it welds to the groove ends and fills the bottom of the groove. 5 shows the part filled in this way, and Figure 1 (
b) is shown by hunting.

上記の如くして作製した生シート基板をベーキングを経
て大気中1600℃アルミナ耐火物センター上に載せて
焼成した。上記の実施例および、比較例として実施例と
同一寸法に従来の方法によって作製したセラミック基板
とについて、樹脂抜き工程および焼成工程での亀裂およ
び破断を比較すると下表の結果を得た。
The raw sheet substrate produced as described above was baked and then placed on an alumina refractory center at 1600° C. in the air and fired. The results shown in the table below were obtained by comparing the cracks and breaks in the resin extraction process and firing process for the above example and a ceramic substrate manufactured by a conventional method to the same dimensions as the example as a comparative example.

なお、ハフ加工の際、ハフにプチルカービドル、メチル
エチルケトン等の少量の溶剤を霧吹きで吹きつけておく
と更に効果が高い。
In addition, during the huffing process, it is more effective if a small amount of a solvent such as butyl carbide or methyl ethyl ketone is sprayed onto the huff.

備考:上表で分子は亀裂、破断の発生した基板の数、分
母は基板の数 (発明の効果) 分割用溝を有するセラミック基板の製造方法において本
発明によるセラミック生シートの截断と同時に分割用溝
を構設して、その截断されたセラミック生シートの周囲
端面をハフ加工して補修および補強することにより、ベ
ーキングおよび本焼成時の亀裂および破断を防止するこ
とができ、不良を減少することができた。
Note: In the above table, the numerator is the number of substrates where cracks or breaks have occurred, and the denominator is the number of substrates (effects of the invention). By constructing a groove and repairing and reinforcing the peripheral end surface of the cut raw ceramic sheet by huffing, it is possible to prevent cracks and breaks during baking and main firing, and reduce defects. was completed.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(イ)は本発明による分割用溝を有するセラミッ
ク基板の製造方法を説明するための斜視図、第1図(ロ
)は第1図(イ)において円Aで囲んだ部分の拡大斜視
図、第2図は亀裂の発生状況を説明するための断面図、
第3図は分割用溝を有するセラミック基板の従来の製造
方法を説明するための斜視図。 1:セラミック基板、2:分割用溝。
Figure 1 (a) is a perspective view for explaining the method of manufacturing a ceramic substrate having dividing grooves according to the present invention, and Figure 1 (b) is an enlarged view of the part surrounded by circle A in Figure 1 (a). A perspective view, FIG. 2 is a sectional view to explain the occurrence of cracks,
FIG. 3 is a perspective view for explaining a conventional manufacturing method of a ceramic substrate having dividing grooves. 1: Ceramic substrate, 2: Dividing groove.

Claims (1)

【特許請求の範囲】[Claims]  多数個の小基板に分割されるべく分割用溝が予め構設
されたセラミック生シートをベーキングおよび本焼成し
てセラミック基板を製造する方法において、セラミック
生シートの周囲端面を溶剤含浸バフを用いてバフ加工す
ることにより分割用溝の端部を補修および補強すること
を特徴する分割用溝部を有するセラミック基板の製造方
法。
In a method of manufacturing a ceramic substrate by baking and firing a green ceramic sheet in which dividing grooves have been formed in advance so as to be divided into a large number of small substrates, the peripheral end surface of the green ceramic sheet is coated with a solvent-impregnated buff. A method for manufacturing a ceramic substrate having a dividing groove, the method comprising repairing and reinforcing the ends of the dividing groove by buffing.
JP29881086A 1986-12-17 1986-12-17 Manufacturing method of ceramic substrate having dividing groove Expired - Lifetime JPH0728112B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29881086A JPH0728112B2 (en) 1986-12-17 1986-12-17 Manufacturing method of ceramic substrate having dividing groove

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29881086A JPH0728112B2 (en) 1986-12-17 1986-12-17 Manufacturing method of ceramic substrate having dividing groove

Publications (2)

Publication Number Publication Date
JPS63184389A true JPS63184389A (en) 1988-07-29
JPH0728112B2 JPH0728112B2 (en) 1995-03-29

Family

ID=17864512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29881086A Expired - Lifetime JPH0728112B2 (en) 1986-12-17 1986-12-17 Manufacturing method of ceramic substrate having dividing groove

Country Status (1)

Country Link
JP (1) JPH0728112B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02112296A (en) * 1988-10-21 1990-04-24 Mitsubishi Mining & Cement Co Ltd Universal substrate for hybrid integrated circuit and its manufacture
JPH0531270U (en) * 1991-10-01 1993-04-23 株式会社住友金属セラミツクス Glaze board
CN106034375A (en) * 2014-09-19 2016-10-19 三星电机株式会社 Printed circuit board and electronic component package having the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02112296A (en) * 1988-10-21 1990-04-24 Mitsubishi Mining & Cement Co Ltd Universal substrate for hybrid integrated circuit and its manufacture
JPH0531270U (en) * 1991-10-01 1993-04-23 株式会社住友金属セラミツクス Glaze board
CN106034375A (en) * 2014-09-19 2016-10-19 三星电机株式会社 Printed circuit board and electronic component package having the same

Also Published As

Publication number Publication date
JPH0728112B2 (en) 1995-03-29

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