JPH0728112B2 - Manufacturing method of ceramic substrate having dividing groove - Google Patents

Manufacturing method of ceramic substrate having dividing groove

Info

Publication number
JPH0728112B2
JPH0728112B2 JP29881086A JP29881086A JPH0728112B2 JP H0728112 B2 JPH0728112 B2 JP H0728112B2 JP 29881086 A JP29881086 A JP 29881086A JP 29881086 A JP29881086 A JP 29881086A JP H0728112 B2 JPH0728112 B2 JP H0728112B2
Authority
JP
Japan
Prior art keywords
dividing groove
manufacturing
ceramic substrate
groove
green sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP29881086A
Other languages
Japanese (ja)
Other versions
JPS63184389A (en
Inventor
鉦吾 大谷
正博 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Spark Plug Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP29881086A priority Critical patent/JPH0728112B2/en
Publication of JPS63184389A publication Critical patent/JPS63184389A/en
Publication of JPH0728112B2 publication Critical patent/JPH0728112B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は分割用の溝部を設けたセラミック基板の製造方
法に係り、特に分割用溝先端における亀裂および破断の
防止方法に関するものである。
Description: TECHNICAL FIELD The present invention relates to a method for manufacturing a ceramic substrate having a groove for division, and more particularly to a method for preventing cracks and breaks at the tip of the groove for division.

(従来の技術) 多くの機能部品に使用されるセラミック基板や電子部品
として大規模集積回路用パッケージ等のセラミック基板
の製造に際しては、1枚のセラミック生シートに多数の
同一印刷や孔加工を施し、これに分割用溝を構設して焼
結後多数個に分割して量産する方法が採用されている。
(Prior Art) When manufacturing a ceramic substrate used for many functional components or a ceramic substrate such as a package for a large-scale integrated circuit as an electronic component, a single ceramic green sheet is subjected to a large number of identical printings and perforations. A method is employed in which a dividing groove is provided in this, and after sintering, it is divided into a large number and mass-produced.

従来、この分割用溝付き基板の製造方法には金型に鋭角
な刃物を取り付けて1枚のセラミック生シートの所要寸
法の截断と同時に分割用溝を構設する手段が使用されて
おり、第3図(イ)において説明すれば、1はセラミッ
ク生シートを所要寸法に截断したセラミック生成形基板
で、2は切断分割するためのV字状に切り込んだ分割用
溝であり、セラミック生成形基板1の端面まで切り込ん
である。
Conventionally, in the method of manufacturing a substrate having a groove for division, a means for attaching an acute-angled blade to a die to cut a required size of one ceramic green sheet and constructing a groove for division at the same time is used. Referring to FIG. 3 (a), reference numeral 1 is a ceramic generation type substrate obtained by cutting a ceramic green sheet into a required size, and 2 is a dividing groove cut in a V shape for cutting and dividing. It is cut to the end face of 1.

上記の如くセラミック生シートに分割用溝を構設する
際、第2図に断面図で示す如くセラミック生シート1の
分割用溝2の端縁部においてV字状溝底部から亀裂3を
生じたり、また、溝構設の際に亀裂が発生しなくともそ
の際の応力のために、セラミック生シートの樹脂抜きベ
ーキングあるいは本焼成時に、同時に亀裂を生じ易く破
断に至ることがあるという問題がある。従って、現在で
は上記のような亀裂および破断を極力避けるべく、分割
用溝を第3図(ロ)に示す如くセラミック生成形基板1
の端面まで至らず内部で終わる分割用溝2′と、端面ま
で切り込んだ分割用溝2とを併用し、かつ、分割用溝
2′を多く分割用溝2を少なくするよう考慮して製造さ
れている。
When constructing the dividing grooves in the ceramic green sheet as described above, cracks 3 may be generated from the V-shaped groove bottom at the end edge of the dividing groove 2 of the ceramic green sheet 1 as shown in the sectional view in FIG. Also, even if a crack does not occur during the construction of the groove, there is a problem that due to the stress at that time, during the resin removal baking or the main firing of the ceramic green sheet, a crack is likely to occur at the same time, which may lead to breakage. . Therefore, at present, in order to avoid the cracks and fractures as described above as much as possible, the dividing grooves are formed as shown in FIG.
Of the dividing groove 2'which does not reach the end face and ends internally, and the dividing groove 2 cut to the end face are used together, and the dividing groove 2'is manufactured in consideration of increasing the dividing groove 2'and decreasing the dividing groove 2 '. ing.

(発明が解決しようとする問題点) 上記の如く考慮されていてもセラミック生成形基板1の
端面まで至る分割用溝2が構設されている限り、危険度
は少なくなったとはいえ上記の如き亀裂及び破断のおそ
れがある。
(Problems to be Solved by the Invention) Even if the above consideration is taken into consideration, as long as the dividing groove 2 extending to the end face of the ceramic generation type substrate 1 is constructed, the degree of danger is reduced, but the above is as above. There is a risk of cracks and fractures.

(問題点を解決するための手段及び作用) 本発明は、上記の如き問題点を解決するためになされた
もので、セラミック生シートを截断し、同時に分割用溝
2を構設したセラミック生成形基板の周囲端面を溶剤を
含浸したスポンジバフで摩擦し、その摩擦熱によって端
面の表面を軟化させV字状分割用溝の先端部の一部を素
地の流れにより埋めることにより、溝構設時に発生した
亀裂を補修するとともにベーキングおよび本焼成時の溝
部からの亀裂および破断を防止するために補強する方法
を採るものである。
(Means and Actions for Solving Problems) The present invention has been made to solve the above problems, and is a ceramic generation type in which a ceramic green sheet is cut and at the same time a dividing groove 2 is constructed. At the time of constructing the groove, the peripheral end face of the substrate is rubbed with a solvent-impregnated sponge buff, the surface of the end face is softened by the frictional heat, and part of the tip of the V-shaped dividing groove is filled with the flow of the base material. A method of repairing the generated cracks and reinforcing it to prevent cracks and breakage from the groove portion during baking and main baking is adopted.

(実施例) 第1図(イ)は、本発明による分割用溝部を有するセラ
ミック基板の製造方法を説明するための斜視図、第1図
(ロ)は第1図(イ)において円Aで囲んだ部分の拡大
斜視図であり、従来例の第3図と同様に1はセラミック
生シートで、アルミナ粉末96、フラックス(SiO2、Ca
O、MgO組成)4、樹脂8〜12、可塑剤4〜6、溶剤20〜
30からなるスリップをドクターブレード法で作った生シ
ートを所要寸法(縦75mm×横75mm×厚さ0.8mm)に截断
し、同時に小基板20個になるようにV字状に切り込んだ
分割用溝2が構設されている。そして亀裂がある場合に
はその亀裂を補修し、亀裂が少なくとも補強するため
に、上記の如く加工された生シートの端面4をスポンジ
バフでバフ加工することにより端面とバフとの摩擦によ
って端面の表面が軟化し、その一部が溝端部に溶着して
溝部の底部を埋める。5はこのようにして埋められた部
分を示し、第1図(ロ)ではハッチングで示した。
(Example) FIG. 1 (a) is a perspective view for explaining a method for manufacturing a ceramic substrate having a dividing groove according to the present invention, and FIG. 1 (b) is a circle A in FIG. 1 (a). FIG. 3 is an enlarged perspective view of the enclosed portion. As in FIG. 3 of the conventional example, 1 is a ceramic green sheet, alumina powder 96, flux (SiO 2 , Ca).
O, MgO composition) 4, resin 8-12, plasticizer 4-6, solvent 20-
A raw sheet made of 30 slips by the doctor blade method was cut into the required dimensions (75 mm length × 75 mm width × 0.8 mm thickness), and at the same time, a V-shaped dividing groove was cut into 20 small substrates. 2 are constructed. When there is a crack, the crack is repaired, and at least the end surface 4 of the raw sheet processed as described above is buffed with a sponge buff in order to reinforce the crack. The surface is softened, and a part of the surface is welded to the groove end to fill the bottom of the groove. Reference numeral 5 indicates the portion filled in this way, which is indicated by hatching in FIG.

上記の如くして作製した生シート基板をベーキングを経
て大気中1600℃アルミナ耐火物セッター上に載せて焼成
した。上記の実施例および、比較例として実施例と同一
寸法に従来の方法によって作製したセラミック基板とに
ついて、樹脂抜き工程および焼成工程での亀裂および破
断を比較すると下表の結果を得た。
The raw sheet substrate prepared as described above was baked and placed on an alumina refractory setter at 1600 ° C. in the air and fired. When the cracks and breakages in the resin removing step and the firing step were compared between the above-mentioned example and a ceramic substrate manufactured by a conventional method to the same size as the example as a comparative example, the results shown in the following table were obtained.

なお、バフ加工の際、バフにブチルカービドル、メチル
エチルケトン等の少量の溶剤を霧吹きで吹きつけておく
と更に効果が高い。
In addition, at the time of buffing, it is more effective to spray a small amount of a solvent such as butyl carbidle or methyl ethyl ketone on the buff by spraying.

(発明の効果) 分割用溝を有するセラミック基板の製造方法において本
発明によるセラミック生シートの截断と同時に分割用溝
を構設して、その截断されたセラミック生シートの周囲
端面をバフ加工して補修および補強することにより、ベ
ーキングおよび本焼成時の亀裂および破断を防止するこ
とができ、不良を減少することができた。
(Effects of the Invention) In the method of manufacturing a ceramic substrate having a dividing groove, the dividing groove is provided at the same time as the cutting of the ceramic green sheet according to the present invention, and the peripheral end surface of the cut ceramic green sheet is buffed. By repairing and reinforcing, cracks and fractures during baking and main baking could be prevented, and defects could be reduced.

【図面の簡単な説明】[Brief description of drawings]

第1図(イ)は本発明による分割用溝を有するセラミッ
ク基板の製造方法を説明するための斜視図、第1図
(ロ)は第1図(イ)において円Aで囲んだ部分の拡大
斜視図、第2図は亀裂の発生状況を説明するための断面
図、第3図は分割用溝を有するセラミック基板の従来の
製造方法を説明するための斜視図。 1:セラミック基板、2:分割用溝。
FIG. 1 (a) is a perspective view for explaining a method of manufacturing a ceramic substrate having a dividing groove according to the present invention, and FIG. 1 (b) is an enlarged view of a portion surrounded by a circle A in FIG. 1 (a). FIG. 2 is a perspective view, FIG. 2 is a cross-sectional view for explaining a crack generation state, and FIG. 3 is a perspective view for explaining a conventional method for manufacturing a ceramic substrate having a dividing groove. 1: Ceramic substrate, 2: Dividing groove.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】多数個の小基板に分割されるべく分割用溝
が予め構設されたセラミック生シートをベーキングおよ
び本焼成してセラミック基板を製造する方法において、
セラミック生シートの周囲端面を溶剤含浸バフを用いて
バフ加工することにより分割用溝の端部を補修および補
強することを特徴とする分割用溝部を有するセラミック
基板の製造方法。
1. A method for manufacturing a ceramic substrate by baking and main-baking a ceramic green sheet in which dividing grooves are preliminarily constructed so as to be divided into a large number of small substrates,
A method for manufacturing a ceramic substrate having a dividing groove portion, wherein the peripheral end surface of the ceramic green sheet is buffed with a solvent-impregnated buff to repair and reinforce the end portion of the dividing groove.
JP29881086A 1986-12-17 1986-12-17 Manufacturing method of ceramic substrate having dividing groove Expired - Lifetime JPH0728112B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29881086A JPH0728112B2 (en) 1986-12-17 1986-12-17 Manufacturing method of ceramic substrate having dividing groove

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29881086A JPH0728112B2 (en) 1986-12-17 1986-12-17 Manufacturing method of ceramic substrate having dividing groove

Publications (2)

Publication Number Publication Date
JPS63184389A JPS63184389A (en) 1988-07-29
JPH0728112B2 true JPH0728112B2 (en) 1995-03-29

Family

ID=17864512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29881086A Expired - Lifetime JPH0728112B2 (en) 1986-12-17 1986-12-17 Manufacturing method of ceramic substrate having dividing groove

Country Status (1)

Country Link
JP (1) JPH0728112B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0691299B2 (en) * 1988-10-21 1994-11-14 三菱マテリアル株式会社 Universal substrate for hybrid integrated circuit and manufacturing method thereof
JP2541785Y2 (en) * 1991-10-01 1997-07-16 株式会社住友金属エレクトロデバイス Glaze substrate
KR20160034099A (en) * 2014-09-19 2016-03-29 삼성전기주식회사 Printed circuit board and electronic component package having the same

Also Published As

Publication number Publication date
JPS63184389A (en) 1988-07-29

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