JPH1187115A - Manufacture of chip component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a chip component with high quality of all times by eliminating defective factors when cutting or dividing the substrate. SOLUTION: A forming frame 1 with a plurality of cavities 1a fitted into the shape of a unit chip 3 is eliminated by heat at a burning step. After the cavity 1a of the forming frame 1 is filled with slurry to be burned, the formation frame 1 is heated at a burning temperature for making the slurry burnt and form the unit chip 3, while the formation frame 1 is eliminated by the heat at burning. Then, the cutting step for obtaining a chip from a ceramic substrate as in the conventional step can be omitted, and a defective factor such as dipping or burs caused by the cutting or separation can be eliminated. In this way, a unit chip with a given shape can be obtained easily whit high precision, and a chip resistor with high quality can be manufactured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a chip component such as a chip resistor, and more particularly, to a method for manufacturing a chip component in which a method for forming a unit chip is improved.

[0002]

2. Description of the Related Art A chip resistor known as a chip component is generally manufactured as follows.

[0003] First, a ceramic substrate made of alumina porcelain or the like having a size corresponding to a large number of pieces is prepared. One surface of the ceramic substrate is mixed with a metal powder such as silver, nickel or the like by mixing a binder and a solvent. The prepared electrode paste is
It is applied in a predetermined shape and arrangement using a technique such as screen printing, and is baked at a temperature according to the paste composition to form an extraction electrode.

Next, a resistor paste prepared by mixing a binder and a solvent with a metal powder such as ruthenium oxide is applied to one surface of the ceramic substrate in a predetermined shape and arrangement by using a technique such as screen printing. More specifically, the resistive film is formed by coating the both ends so as to overlap the pair of extraction electrodes, and baking this at a temperature according to the paste composition.

Next, the ceramic substrate on which the lead electrodes and the resistive film are formed is cut along a plurality of lines in the X and Y directions which are set in advance with respect to the ceramic substrate. A dicing machine equipped with a cutting blade such as a diamond blade is used for this cutting, and each chip after cutting has one resistive film and a pair of extraction electrodes connected to the resistive film on one surface thereof. .

Thereafter, a pair of external electrodes is formed on each chip so as to be electrically connected to each extraction electrode, and an exterior film is formed so as to cover a part of the resistance film and the extraction electrode. Chip resistors are manufactured.

Incidentally, as a method of obtaining individual chips, divided grooves are formed in a ceramic substrate in advance in accordance with the chip size in a lattice pattern, and after forming an extraction electrode and a resistive film on the ceramic substrate, the grooves are formed. There is also a method of obtaining individual chips by dividing along the line. There is also a manufacturing procedure in which an exterior film is formed before cutting a substrate or before dividing a substrate, and external electrodes are formed on the cut or divided chip.

[0008]

When a ceramic substrate is cut into individual chips using a cutting blade, not only the above-described chip resistor, even if a diamond blade is used due to the high hardness of the substrate itself. The cutting is not easy, and if the cutting conditions are not properly set, there is a problem that chipping and dimensional defects occur due to stress at the time of cutting. Further, when the ceramic substrate is divided into individual chips along the grooves formed in advance, the frequency of chipping and burrs caused by the stress at the time of division is higher than that of the above-described cutting, so that the quality of the chip component is likely to deteriorate. There is a defect.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to eliminate the disadvantages when using a method of cutting or dividing a substrate and to stably obtain a high-quality chip component. To provide a method for manufacturing a chip component.

[0010]

According to a first aspect of the present invention, there is provided a method for manufacturing a chip component, comprising a plurality of cavities having a shape matched to a unit chip. A step of filling a cavity of the molding frame with a calcinable slurry using a molding frame that can be lost by additional heat during firing, and heating the molding frame after the slurry filling at a firing temperature to bake the slurry in the cavity. And a step of obtaining a unit chip by erasing the molding frame by additional heat during firing.

According to a second aspect of the present invention, a molding frame having a plurality of cavities having a shape matched to a unit chip and having heat resistance to additional heat during firing is used. A step of filling the cavity with a calcinable slurry, a step of heating the molding frame after filling the slurry at a baking temperature to calcine the slurry in the cavity to form unit chips, and a step of removing unit chips from the cavity of the molding frame It is characterized by having.

Further, as set forth in claim 3, a molding frame having a plurality of cavities having a shape matched to the unit chip is used, and a cavity of the molding frame is filled with a slurry which can be naturally cured, and And a step of taking out the unit chip from the cavity of the molding frame.

In the manufacturing method according to the first aspect, after filling the cavity of the molding frame with the sinterable slurry, the entire molding frame after the slurry filling is heated at the sintering temperature to sinter the slurry in the cavity to obtain a unit. By forming chips and losing the molding frame by the additional heat during firing to obtain unit chips, unit chips of a predetermined shape can be easily and accurately formed without using the conventional method of cutting or dividing the substrate. Can be obtained at

Further, in the manufacturing method according to the second aspect, after filling the cavity of the molding frame with the slurry capable of being fired,
By heating the forming frame after the slurry filling at the firing temperature, firing the slurry in the cavity into unit chips, and taking out the unit chips from the cavity of the forming frame,
A unit chip having a predetermined shape can be obtained easily and with high accuracy without using a conventional method of cutting or dividing a substrate.

Further, in the manufacturing method according to the third aspect,
Filling the cavity of the molding frame with a slurry that can be naturally cured, curing the slurry to form unit chips, and then taking out the unit chips from the cavity of the molding frame,
A unit chip having a predetermined shape can be obtained easily and with high accuracy without using a conventional method of cutting or dividing a substrate.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION

[First Embodiment] FIGS. 1 to 6 relate to a first embodiment in which the present invention is applied to a chip resistor, and the manufacturing procedure of the chip resistor will be described below with reference to FIG.

In manufacturing, first, a molding frame 1 as shown in FIG. 1 is prepared. The molding frame 1 includes a plurality of cavities 1a having a shape (a rectangular parallelepiped shape in the illustrated example) aligned with a unit chip 3 described later in a predetermined arrangement. The molding frame 1 is made of a material that can be eliminated by additional heat during firing (1300 to 1500 ° C. in the case of alumina porcelain) described later, for example, a resin or wood capable of burning at the above firing temperature. Is formed. Regardless of the type of material, the thickness of the molding frame 1 should be as thin as possible so as to reduce the combustion load. In particular, in the case of a resin, the foaming resin (preferably having no pores on the surface) will be eliminated. It can be done easily. Further, in the case of wood, there is a possibility that the ceramic slurry may penetrate, so it is preferable to apply a resin coating or the like to the surface thereof.

Next, as shown in FIG. 2, each of the cavities 1a of the molding frame 1 is almost completely filled with the ceramic slurry 2. The ceramic slurry 2 is a well-known one prepared by mixing a binder, a solvent, and the like with ceramic powder such as alumina.

Next, the molding frame 1 after filling with the slurry is put into a heating furnace (not shown) for firing, and the cavity 1 is formed under predetermined conditions according to the composition of the ceramic slurry 2.
The ceramic slurry 2 in a is fired. In this firing step, the molding frame 1 disappears due to the additional heat during firing. That is, in the state where the firing is completed, as shown in FIG. 3, the molding frame 1 disappears (some debris remains in the actual case), and the fired unit chips 3 are arranged in an array corresponding to the cavity 1a.

Next, the plurality of unit chips 3 are taken out of the heating furnace for firing and aligned without gaps. As shown in FIG. 4, one surface of each aligned unit chip 3 is coated with a metal powder such as silver or nickel. A well-known electrode paste prepared by mixing a binder, a solvent, and the like is applied in a predetermined shape and arrangement using a method such as screen printing, and is baked at a temperature according to the paste composition to form the extraction electrode 4. I do.

Next, as shown in FIG. 5, a well-known resistance paste prepared by mixing a binder, a solvent and the like with a metal powder such as ruthenium oxide is screen-printed on the same surface of each of the aligned unit chips 3. The resist film 5 is formed by applying a predetermined shape and arrangement using a technique such as the method described above. Specifically, the resist film 5 is formed by applying the both ends so as to overlap with the pair of extraction electrodes and baking it at a temperature according to the paste composition. .

Of course, the above-mentioned extraction electrode 4 and resistance film 5
It can also be formed by a thin film technique such as sputtering or electrolytic / electroless plating.

Next, the aligned unit chips 3 are separated, and as shown in FIG. 6, a pair of external electrodes 6 is formed on each unit chip 3 so as to be electrically connected to the extraction electrode 5, and a resistive film is formed. An exterior film 7 is formed so as to cover 5 and a part of the extraction electrode 4. Either of the formation order of the external electrode 6 and the package film 7 may be performed first. The external electrode 6 is coated with a well-known electrode paste prepared by mixing a binder, a solvent, and the like with a metal powder such as silver, nickel, or the like, using a technique such as dip or roller coating. It is created by baking at the appropriate temperature. The exterior film 7 is formed by applying a known exterior paste mainly composed of plastic such as epoxy or silicon-based glass by using a method such as screen printing, roller coating or transfer, and converting the paste into a paste composition. It is created by baking at the appropriate temperature.
As described above, a chip resistor having a vertical sectional shape as shown in FIG. 6 can be obtained.

In the first embodiment, a molding frame 1 having a plurality of cavities 1a having a shape conforming to the unit chip 3 and capable of being eliminated by the additional heat during firing is used. After filling the possible slurry 2, the molding frame 1 after the slurry filling is heated at a firing temperature, and the slurry 2 in the cavity 1a is fired to form a unit chip, and the molding frame 1 disappears due to additional heat during firing. Since the unit chip 3 is obtained by cutting the substrate, it is not necessary to cut or divide the ceramic substrate to obtain the unit chip 3 as in the related art, and defects such as chipping and burrs caused by substrate cutting or substrate division are obtained. Can be obtained, and the unit chip 3 having a predetermined shape can be obtained easily and with high accuracy, whereby a high-quality chip resistor can be manufactured.

In the first embodiment, the cavity 1a of the molding frame 1 is filled with one type of ceramic slurry 2. However, as shown in FIGS. 7 (a) and 7 (b),
When two types of ceramic slurries 8 and 9 having different compositions are filled in a predetermined amount, a unit chip 10 having two layers 10a and 10b having different compositions can be obtained as shown in FIG. Similarly, a unit chip 11 having a three-layer structure as shown in FIG. 8A and a unit chip 12 having a five-layer structure as shown in FIG. 8B can be arbitrarily formed.

In the case of such a multi-layer structure, one of the layers 10a, 11a, 12a on the surface side on which the resistive film or the like is formed has a low porosity and is dense, while the other layers 10b, 11a have a low porosity.
If b and 11c are made to have a high porosity, a resistive film or the like can be formed with high precision, and the weight per unit chip can be reduced to reduce the weight.

[Second Embodiment] FIGS. 9 to 11 relate to a second embodiment in which the present invention is applied to a chip resistor.
Hereinafter, the manufacturing procedure of the chip resistor will be described with reference to FIG.

In manufacturing, first, a molding frame 21 as shown in FIG. 9 is prepared. The molding frame 21 is provided with a plurality of cavities 21a having a shape (in the illustrated example, a rectangular parallelepiped shape) aligned with a unit chip 23 described later in a predetermined arrangement. The molding frame 21 is formed of a material having heat resistance to additional heat during firing (1300 to 1500 ° C. in the case of alumina porcelain) described later, such as a metal having a melting point higher than the above firing temperature. ing.

Next, as shown in FIG. 10, each of the cavities 21a of the molding frame 21 is almost completely filled with the ceramic slurry 22. This ceramic slurry 22
It is a well-known material prepared by mixing a binder, a solvent, and the like with ceramic powder such as alumina.

Next, the molding frame 21 after the slurry filling is put into a heating furnace (not shown) for firing, and firing of the ceramic slurry 22 in the cavity 21a is performed under predetermined conditions according to the composition of the ceramic slurry 22. I do. As described above, since the molding frame 21 has heat resistance against additional heat during firing, the shape of the molding frame 21 does not collapse during the firing process. That is, in a state where the firing is completed, the fired unit chip 3 remains in the cavity 21a of the molding frame 21 as it is.

Next, the molding frame 21 is taken out of the firing furnace, and as shown in FIG. 11, the molding frame 21 is turned upside down and the fired unit chips 23 in the cavity 21a are placed.
Take out. Even when the unit chip 23 is stuck to the inner surface of the cavity 21a, the unit chip 23 can be easily taken out by applying a twisting force or giving an impact to the molding frame 21.

Next, the plurality of unit chips 23 extracted from the molding frame 21 are aligned without gaps, and the extraction electrodes are formed in a predetermined shape and arrangement on one surface of each aligned unit chip 23 as in FIG. I do. Next, similarly to FIG. 5, a resistive film is formed in a predetermined shape and arrangement on the same surface of the aligned unit chips 23. Of course, the extraction electrode and the resistive film
It can also be formed by a thin film technique such as sputtering or electrolytic / electroless plating.

Next, as shown in FIG. 6, a pair of external electrodes is formed on each unit chip 3 so as to be electrically connected to each extraction electrode, and the unit chips 23 are separated from each other. An exterior film 7 is formed so as to cover a part of the electrode. Either of the formation order of the external electrode and the package film may be performed first. As described above, a chip resistor having the same vertical cross-sectional shape as in FIG. 6 can be obtained.

In the second embodiment, a molding frame 21 having a plurality of cavities 21a having a shape matched to the unit chip 23 and having heat resistance against additional heat during firing is used. After filling the cavity 22a with the sinterable slurry 22, the molding frame 21 after the slurry filling is filled.
Is heated to the firing temperature to obtain slurry 2 in cavity 21a.
2 is baked to form a unit chip, which is taken out from the cavity 21a of the molding frame 21, so that it is not necessary to cut or divide the ceramic substrate to obtain the unit chip 23 as in the conventional case. Eliminates problems such as chipping and burrs caused by substrate division,
A unit chip 23 having a predetermined shape can be obtained easily and with high accuracy, and a high-quality chip resistor can be manufactured.

In the second embodiment, the molding frame 21
Ceramic slurry 22 in cavity 21a
However, as shown in FIGS. 7 and 8, when a plurality of types of ceramic slurries having different compositions are filled in predetermined amounts, a unit chip having a multilayer structure can be easily obtained.

In the above-described second embodiment, after the fired unit chips 23 are taken out of the cavities 21a of the molding frame 21, extraction electrodes and resistive films are formed on these unit chips 23, as shown in FIG. As described above, before taking out the unit chip 23 from the cavity 21a of the molding frame 21, the extraction electrode 24, the resistance film 25, and the like may be formed on the exposed surface of the unit chip 23 in the cavity 21a.
In this case, there is an advantage that the unit chips 23 do not need to be aligned to form the extraction electrodes and the resistive film, and the jigs and devices required for the alignment can be omitted.

[Third Embodiment] FIGS. 13 and 14 relate to a third embodiment in which the present invention is applied to a chip resistor. Hereinafter, a manufacturing procedure of the chip resistor will be described with reference to FIG.

In manufacturing, first, a molding frame 31 as shown in FIG. 13 is prepared. The molding frame 31 is provided with a plurality of cavities 31a having a shape (a rectangular parallelepiped shape in the illustrated example) aligned with the unit chip in a predetermined arrangement. There is no particular limitation on the physical properties of the molding frame 31 as in the first and second embodiments, and the molding frame 31 can be arbitrarily formed of resin, metal, or the like.

Next, as shown in FIG. 14, each of the cavities 31a of the molding frame 31 is almost completely filled with a slurry 32 which can be naturally hardened, for example, a gypsum slurry.
This gypsum slurry is a well-known gypsum or anhydrous gypsum plaster kneaded with water.

Next, the molding frame 31 after the slurry filling is left for a time corresponding to the composition of the slurry 32, and the slurry 32 in the cavity 31a is hardened. In other words, after the curing is completed, the fired unit chip remains in the cavity 31a of the molding frame 31 as it is.

Next, similarly to FIG. 11, the molding frame 31 is turned upside down, and the cured unit chip in the cavity 31a is extracted.

Next, a plurality of unit chips extracted from the molding frame 31 are aligned without gaps, and the extraction electrodes are formed in a predetermined shape and arrangement on one surface of each aligned unit chip as in FIG. Next, similarly to FIG. 5, a resistive film is formed in a predetermined shape and arrangement on the same surface of each aligned unit chip. Needless to say, the extraction electrode and the resistive film can be formed by a thin film method such as sputtering or electrolytic / electroless plating.

Next, the aligned unit chips are separated,
As in FIG. 6, a pair of external electrodes is formed for each unit chip so as to be electrically connected to each extraction electrode, and an exterior film is formed to cover a part of the resistance film and the extraction electrode. Either of the formation order of the external electrode and the package film may be performed first. FIG. 6
A chip resistor having a similar vertical cross-sectional shape can be obtained.

In the third embodiment, a molding frame 31 having a plurality of cavities 31a having a shape matched to a unit chip is used, and after a cavity 32a of the molding frame 31 is filled with a slurry 32 which can be naturally hardened, Cavity 31a
The slurry 32 in the inside is hardened into unit chips, which are taken out from the cavities 31a of the molding frame 31, so that it is not necessary to cut or divide the ceramic substrate to obtain the unit chips as in the conventional case. Problems such as chipping and burrs caused by cutting or dividing the substrate can be resolved, and a unit chip having a predetermined shape can be obtained easily and with high accuracy, whereby a high-quality chip resistor can be manufactured.

In the third embodiment, the molding frame 31 is used.
Ceramic slurry 32 in cavity 31a
However, as shown in FIGS. 7 and 8, when a plurality of types of ceramic slurries having different compositions are filled in predetermined amounts, a unit chip having a multilayer structure can be easily obtained.

In the third embodiment described above, after the cured unit chips are taken out from the cavity 31a of the molding frame 31, the extraction electrodes and the resistive films are formed on these unit chips. Cavity 31 of molding frame 31
Before taking out the unit chip from a, an extraction electrode, a resistance film and the like may be formed on the exposed surface of the unit chip in the cavity 31a. In this case, the extraction electrode and the resistance film are formed. Therefore, there is an advantage that it is not necessary to align the unit chips and jigs and devices required for the alignment can be omitted.

As described above, in each of the above embodiments, the present invention is applied to a chip resistor. However, the present invention relates to a chip component other than the chip resistor, for example, an inductor in which a circuit component has a planar shape. And can be widely applied to jumpers and the like, and similar effects can be obtained.

[0048]

As described in detail above, according to the present invention,
In order to obtain a unit chip, it is not necessary to cut or divide the ceramic substrate as in the conventional case. It is possible to obtain with high precision, and it is possible to manufacture high quality chip components.

[Brief description of the drawings]

FIG. 1 is a perspective view of a molding frame according to a first embodiment of the present invention.

FIG. 2 is a perspective view showing a state in which a molding frame is filled with slurry.

FIG. 3 is a perspective view showing a state in which a mold has disappeared by firing and only a unit chip remains.

FIG. 4 is a perspective view showing a state in which an extraction electrode is formed on a unit chip.

FIG. 5 is a perspective view showing a state in which a resistive film is formed on a unit chip.

FIG. 6 is a longitudinal sectional view showing a state in which an external electrode and an exterior film are formed on a unit chip.

FIG. 7 is a vertical sectional view of a unit chip having a multilayer structure obtained according to another slurry filling method and the same method.

8 is a longitudinal sectional view of a unit chip having a multilayer structure other than that shown in FIG. 7;

FIG. 9 is a perspective view of a molding frame according to a second embodiment of the present invention.

FIG. 10 is a perspective view showing a state where a slurry is filled in a molding frame.

FIG. 11 is a perspective view showing a state in which a unit chip is taken out from a molding frame.

FIG. 12 is a perspective view showing a state in which a lead electrode and a resistive film are formed on a unit chip in a cavity of a molding frame.

FIG. 13 is a perspective view of a molding frame according to a third embodiment of the present invention.

FIG. 14 is a perspective view showing a state where a slurry is filled in a molding frame.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Mold frame, 1a ... Cavity, 2 ... Slurry, 3 ... Unit chip, 4 ... Extraction electrode, 5 ... Resistive film, 6 ... External electrode,
7: protective film, 8, 9: slurry, 10, 11, 12: unit chip, 21: molding frame, 21a: cavity, 22:
Slurry, 23 ... unit chip, 24 ... extraction electrode, 25 ...
Resistive film, 31: molding frame, 31a: cavity, 32: slurry.

Claims (4)

[Claims] In a method of manufacturing a chip component for forming various films for circuit construction corresponding to a unit chip in at least a step before or after a step of obtaining a unit chip having a predetermined shape, a shape matched to the unit chip is determined. Using a molding frame that has a plurality of cavities and that can be dissipated by additional heat during firing, filling a cavity of the molding frame with a slurry that can be sintered, and heating the molding frame after the slurry filling at a firing temperature. And baking the slurry in the cavity to form unit chips, and losing the forming frame by the additional heat during firing to obtain unit chips, the method comprising the steps of: 2. A method of manufacturing a chip component for forming various films for circuit construction corresponding to a unit chip in at least a step before or after a step of obtaining a unit chip having a predetermined shape. Using a molding frame having a plurality of cavities and having heat resistance against additional heat during firing, filling a cavity of the molding frame with a sinterable slurry, and firing the slurry after filling the slurry with a firing temperature. And baking the slurry in the cavity to form a unit chip by heating the slurry in the cavity; and taking out the unit chip from the cavity of the molding frame. 3. A method for manufacturing a chip component for forming various films for circuit construction corresponding to a unit chip in at least a step before or after a step of obtaining a unit chip having a predetermined shape. Using a molding frame having a plurality of cavities, filling a cavity of the molding frame with a slurry that can be naturally cured, curing the slurry to form unit chips, and removing a unit chip from the cavity of the molding frame A method for manufacturing a chip component, comprising: 4. The method according to claim 1, further comprising, before the step of taking out the unit chip from the cavity of the molding frame, a step of forming a part of various films for circuit construction on the exposed surface of the unit chip in the cavity. 4. The method for manufacturing a chip component according to claim 2, wherein