JP4548110B2 - Manufacturing method of chip parts - Google Patents

Description

  The present invention relates to a chip component used for various electronic devices and the like.

  A conventional chip component will be described below with reference to the drawings.

  FIG. 5 is a process diagram showing a manufacturing process of a conventional chip component, and FIG. 6 is an exploded perspective view of part A of FIG.

  As shown in FIG. 5, the chip component manufacturing process includes a sheet forming process (A), a coil part forming process (B), an element body separating process (C), and an electrode forming process (D). Yes.

  First, as shown in FIG. 5A, a plurality of green sheets 1 are formed (sheet forming step (A)).

  Next, as shown in FIGS. 5B and 6, an arc-shaped conductor 2 made of Ag paste is printed on a plurality of green sheets 1, and these green sheets 1 are laminated to form a coil made of a spiral conductor. The part 3 is formed (coil part forming step (B)). At this time, the arcuate conductors 2 printed on the vertically adjacent green sheets 1 are electrically connected to each other through through holes 4 formed in the green sheet 1 to form a coil portion 3.

  Next, as shown in FIG. 5C, using a dicing cutting method, a Thomson cutting method, or the like, adjacent element bodies 5 are cut by a cutting machine 6 to form a plurality of chip parts 7 (element body separation step). (C)).

  And while forming an electrode etc. in this chip component 7, it bakes and manufactures a finished product (electrode formation process (D)).

For example, Patent Document 1 is known as prior art document information related to the invention of this application.
JP 11-186084 A

  In the conventional configuration, since the adjacent element body 5 is cut by the cutting machine 6 using a dicing cutting method, a Thomson cutting method, or the like in the element body separating step (C), only the thickness of the blade of the cutting machine 6 is used. Cutting width is required.

  That is, if the cutting width of the cutting machine 6 is reduced in order to increase the number of chip parts to be taken per unit area of the green sheet 1, the cutting stress by the cutting machine 6 is easily applied to the chip parts 7, and the chip parts 7 are deformed. It had the problem of producing.

  The present invention solves the above-described problems, and an object of the present invention is to provide a chip component manufacturing method having a separation step in which deformation of the chip component is suppressed.

  In order to achieve the above object, the present invention has the following configuration.

The invention according to claim 1 of the present invention includes a step of separating a plurality of chip parts connected to each other at least by a connecting portion, and the connecting portion includes a plurality of frame-like void portions and an inner side of the frame-like void portion. A first step of forming an insulating resin layer having an electrode gap for forming an electrode disposed on the same, and covering the frame-like gap, the electrode gap and the insulating resin layer A second step of simultaneously forming the metal layer and a third step of polishing the metal layer to at least the upper surface of the insulating resin layer, and repeating the first to third steps a plurality of times. Accordingly, the connection portion where the metal layer is embedded is formed in the frame-like gap portion, a plurality of the chip components which are connected to each other by the connecting portion by removing by melting only the connecting portion by etching agent configuration der to separate into pieces .

  With the above configuration, the plurality of chip components are connected to each other in advance by a connecting portion made of metal, and the metal is melted and removed by an etching agent, so that the plurality of chip components connected to each other at the connecting portion is separated. Cutting stress is unlikely to occur in chip parts.

  That is, it is possible to provide a chip component manufacturing method in which deformation of the chip component is suppressed.

  Hereinafter, the invention described in all claims of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view of a chip component according to an embodiment of the present invention, FIG. 2 is a plan view of the chip components connected together, FIG. 3 is an enlarged plan view of part A in FIG. 2, and FIG. It is process drawing which shows the manufacturing process of components.

  In FIG. 1, a chip component according to an embodiment of the present invention is a chip coil component, and includes a rectangular transparent element 12, an electrode 14 disposed on the lower surface of the element 12, and an element 12. The coil part 18 which consists of the embedded helical metal 16 is provided, and the element | base_body 12 is laminated | stacked and formed by the insulating resin layer 20 which consists of photosensitive resin hardened | cured material which hardened photosensitive resin.

  Further, the first corners 22 formed with the surfaces perpendicular to the mounting surface adjacent to each other are formed in a substantially arc shape, and the surfaces parallel to the surfaces perpendicular to the mounting surface are formed adjacent to each other. The second corner portion 24 is formed in a substantially right angle, the first corner portion 22 is formed in the element body 12, and the second corner portion 24 is formed in the electrode 14. When the electrode 14 is also disposed on the side surface of the element body 12, the first corner portion 22 and the second corner portion 24 are formed on the electrode 14.

  Further, the minimum distance (end surface margin (W)) between the outermost spiral metal 16 of the coil portion 18 and the side surface of the element body 12 is 5 μm or more and 50 μm or less, and the maximum diameter of the coil portion 18 is 5 μm to 150 μm. The height of the element body composed of a plurality of laminated insulating resin layers 20 is set to 50 μm to 1 mm.

  Next, the manufacturing process of the chip component 26 will be described.

  As shown in FIGS. 2 and 3, a plurality of the chip components 26 are formed at a time in a state where the plurality of chip components 26 are connected to each other, and finally the plurality of chip components 26 connected by the frame-shaped connecting portion 28. The chip parts 26 are separated and separated into pieces.

  In FIG. 4, the manufacturing process of the chip component 26 is as follows.

  First, the electrode 14 disposed on the lower surface of the element body 12 is formed (electrode formation step (A)).

  An insulating resin layer 20 having a predetermined gap is formed on the substrate 30 on which the release layer is formed by a photolithography method. The gap portion includes a plurality of frame-like gap portions 32 adjacent to each other and an electrode gap portion 34 arranged inside the frame-like gap portion 32, and the chip component 26 is placed inside the frame-like gap portion 32. The frame-shaped connecting portion 28 for connecting the plurality of chip components 26 to the frame-shaped gap portion 32 is formed.

  A metal layer 36 is formed on the frame-shaped gap 32, the electrode gap 34 and the insulating resin layer 20. The metal layer 36 has a base conductor layer 38 formed by an electroless plating method, a sputtering method, a vapor deposition method, or the like, and is formed on the base conductor layer 38 by an electrolytic plating method.

  The metal layer 36 is polished to at least the upper surface of the insulating resin layer 20 to form the electrode 14 made of metal in the electrode gap 34 and the frame-shaped connecting portion 28 made of metal in the frame-shaped gap 32. In addition, insulation between the electrode 14 and the frame-shaped connecting portion 28 is achieved.

  Second, an insulating resin layer 20 having a predetermined gap is further formed by a photolithography method (insulating resin layer forming step (B)).

  This void portion is composed of a plurality of frame-shaped void portions 32 adjacent to each other, a helical void portion 40 disposed inside the frame-shaped void portion 32, and a through-hole void portion 42. 32 is formed so as to overlap with the frame-shaped gap 32 formed in the electrode forming step (A).

  Third, the metal layer 36 is formed on the frame-shaped gap 32, the spiral gap 40, the through-hole gap 42, and the insulating resin layer 20 (metal layer forming step (C)).

  The metal layer 36 has a base conductor layer 38 formed by an electroless plating method, a sputtering method, a vapor deposition method, or the like, and is formed on the base conductor layer 38 by an electrolytic plating method.

  Fourth, a two-layer coil portion 18 made of the spiral metal 16 is formed (coil portion forming step (D)).

  The metal layer 36 formed in the metal layer forming step (C) is polished to at least the upper surface of the insulating resin layer 20 to form the coil part 18 made of the spiral metal 16 in the spiral gap 40, and the frame-like gap A frame-shaped connecting portion 28 made of metal is formed in 32, a through-hole 44 made of metal is formed in the through-hole gap portion 42, and insulation between the coil portion 18 and the frame-shaped connecting portion 28 is achieved.

  Further, the insulating resin layer forming step (B) and the metal layer forming step (C) are repeated to form the two-layer coil portion 18. The two layers of the coil part 18, the electrode 14 and the coil part 18 are electrically connected by a through hole 44.

  Fifth, the insulating resin layer 20 is further formed, and the insulating resin layer 20 having a predetermined gap is formed by a photolithography method to form a protective layer (protective layer forming step (E)).

  This void portion is composed of a plurality of frame-shaped void portions 32 adjacent to each other, and this frame-shaped void portion 32 is formed so as to overlap the frame-shaped void portion 32 formed in the insulating resin layer forming step (B). .

  Sixth, the metal formed in the frame-shaped gap portion 32 is removed by melting with an etching agent, and a plurality of chip components 26 connected to each other by the frame-shaped connection portion 28 are separated, and the chip is separated from the release layer of the substrate 30. The component 26 is peeled off (melted with a solvent, alkali or the like) and separated into pieces (separation step (F)).

  Thus, the element body 12 is formed by the insulating resin layer 20 laminated by the electrode forming process (A), the insulating resin layer forming process (B), and the protective layer forming process (E). The electrode 14 is disposed on the lower surface or the side surface, and the coil portion 18 is embedded in the element body 12.

  In this manufacturing method, the metal layer 36 is preferably a highly conductive metal such as Cu, Al, Ag, Au, Ni, or a metal alloy. Further, the base conductor layer 38 is preferably a metal having high adhesion to the insulating resin layer 20 such as Cu, Al, Ag, Au, Ni, Cr, Ti, and is formed by an electroless plating method, a sputtering method or a vapor deposition method. It is preferable.

  In this manufacturing method, the insulating resin layer 20 is made of a transparent photosensitive resin cured product obtained by curing a photosensitive resin. This insulating resin layer 20 is processed into a predetermined shape by a photolithography method using an epoxy-based resin, a phenol-based resin, a polyimide-based resin, or the like, but unlike a resist used in a general photolithography method, the final chip Since the resin constituting the element body 12 of the component 26 is generally easy to generate static electricity, a resin that suppresses the generation of static electricity may be selected, or a configuration that dissipates static electricity may be added. .

  As a polishing method, CMP (chemical mechanical polishing) polishing using a CMP slurry may be used. Since only the metal is selectively polished while etching the metal layer 36 by CMP polishing, the accuracy is improved. As another polishing method, mechanical polishing using diamond slurry or alumina slurry may be used, but it is disadvantageous in comparison with CMP polishing in terms of accuracy. When the metal layer 36 is not suitable for etching, the portion may be polished by mechanical polishing.

  With the above configuration, the plurality of chip components 26 are connected to each other in advance by a frame-shaped connecting portion 28 made of metal, and the metal is melted and removed by an etching agent, and the plurality of chip components 26 connected to each other by the frame-shaped connecting portion 28. Since the chip component 26 is separated, cutting stress is hardly generated in the chip component 26. That is, the chip component 26 can be manufactured while suppressing deformation of the chip component 26.

  In addition, since the frame-like connecting portion 28 and the spiral metal 16 are formed by a photolithography process and an individualization process in which stress is hardly generated is performed, the end surface margin (W) from the end surface of the chip component 26 can be minimized, It is possible to design with good conductor position accuracy by making the best use of the size of the chip component 26. Therefore, the smaller the size of the chip component 26 is, for example, 1005, 0603, etc., the greater the influence of the end face margin (W) from the end face, and the chip characteristics, for example, in the case of a chip inductor, the inductance value and the Q value are Higher performance than conventional methods.

  In particular, the metal layer 36 is formed on the frame-shaped gap 32 and the insulating resin layer 20, the metal layer 36 is polished to at least the upper surface of the insulating resin layer 20, and the chip component 26 is connected to the frame-shaped gap 32. Since the frame-shaped connecting portion 28 made of metal is formed, the frame-shaped connecting portion 28 can be easily formed.

  Since the frame-shaped gap portion 32 has a substantially rectangular shape and the inner peripheral corner portion has an arc shape, the chip component 26 has a first corner portion 22 in which surfaces perpendicular to the mounting surface are formed adjacent to each other. Can be substantially arcuate. As a result, when supplying a plurality of chip components 26 to the mounting machine with a parts feeder or the like, even if the chip components 26 come into contact with each other, the first corner portion 22 of the chip components 26 is substantially arc-shaped, so that the supply can be smoothly performed. Thus, cracking and chipping of the chip component 26 can be suppressed. On the other hand, since the second corner portion 24 formed by mutually adjoining surfaces perpendicular to the mounting surface is formed in a substantially right angle, chip standing can be suppressed during mounting. In addition, according to the said method, it is easy to make the internal peripheral corner | angular part of the frame-shaped space | gap part 32 into a chamfering shape or another shape.

  Further, since the insulating resin layer 20 is formed by a photolithography method, the conductor position accuracy, the chip dimensional accuracy, etc. can be easily formed with high accuracy. In addition, by using a transparent photosensitive resin for the insulating resin layer 20, the element body 12 becomes transparent, facilitating the appearance inspection of the conductor for each layer, increasing the aspect ratio, and facilitating the thickness of the coil portion 18. Can be thickened.

  Further, the metal layer 36 has a base conductor layer 38 formed by an electroless plating method, a sputtering method, a vapor deposition method, or the like, and is formed on the base conductor layer 38 by an electrolytic plating method, thereby increasing the density of the coil portion. 18 can be formed easily.

  As described above, since the chip component manufacturing method according to the present invention can be manufactured while suppressing deformation of the chip component, it can be applied to various electronic devices.

The perspective view of the chip component in one embodiment of this invention Plan view of multiple connected chip components Enlarged plan view of part A in FIG. Process chart showing the manufacturing process of the same chip component Process diagram showing the manufacturing process of conventional chip parts 5 is an exploded perspective view of part A in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 12 Element body 14 Electrode 16 Spiral metal 18 Coil part 20 Insulating resin layer 22 1st corner | angular part 24 2nd corner | angular part 26 Chip component 28 Frame-like connection part 30 Substrate 32 Frame-like gap part 34 Electrode gap part 36 Metal layer 38 Base conductor layer 40 Spiral air gap 42 Through hole air hole 44 Through hole

Claims (7)

Having a step of separating a plurality of chip parts connected to each other at least by a connecting part;
The connecting portion is
A first step of forming an insulating resin layer having a plurality of frame-shaped voids and an electrode void for forming an electrode disposed inside the frame-shaped void;
A second step of simultaneously forming the same metal layer so as to cover the frame-shaped gap, the electrode gap and the insulating resin layer;
A third step of polishing the metal layer to at least the upper surface of the insulating resin layer;
By stacking repeatedly a plurality of times said first to third step, the said connection portion in which the metal layer is embedded in the frame-like gap portion is formed, to remove only the connecting portion is melted by an etchant method of manufacturing a chip component that separates a plurality of the chip components which are connected to each other by the connecting portions into individual pieces by. The method for manufacturing the chip component according to claim 1, wherein the gap for the electrode is formed in a spiral shape. The chip part manufacturing method according to claim 2, wherein the frame-shaped gap is formed in a substantially rectangular shape and an inner peripheral corner is arcuate. The method for manufacturing a chip part according to claim 2, wherein the insulating resin layer having the frame-like gap and the spiral gap is formed by a photolithography method. The method for manufacturing a chip part according to claim 4, wherein the insulating resin layer is made of a cured photosensitive resin obtained by curing a photosensitive resin. The chip part manufacturing method according to claim 2, wherein the metal layer is formed by a plating method. 3. The method of manufacturing a chip part according to claim 2, wherein the metal layer has a base conductor layer formed by an electroless plating method, a sputtering method, or a vapor deposition method, and is formed on the base conductor layer by an electrolytic plating method.

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