JP2006173162A - Chip component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide chip components having controlled generation of crack and missing during supply thereof. <P>SOLUTION: The chip component is provided with a transparent square raw material 12, an electrode 14 allocated at the lower surface of this raw material 12, and a coil 18 formed of a spiral metal 16 embedded in the raw material 12. The raw material 12 is formed by laminating insulating resin layers 20 formed of a photosensitive resin hardening substance formed by hardening the photosensitive resin, in the constitution that a first angled part 22 formed by adjacently providing the surface perpendicular to the mounting surface is almost arced, and a second angled part 24 is formed almost in the right angle, where the surface parallel to the surface perpendicular to the mounting surface is formed adjacently with each other. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a chip component used for various electronic devices and the like.

  A conventional chip component will be described below with reference to the drawings.

  FIG. 5 is a process diagram showing a manufacturing process of a conventional chip component, and FIG. 6 is an exploded perspective view of part A of FIG.

  As shown in FIG. 5, the chip component manufacturing process includes a sheet forming process (A), a coil part forming process (B), an element body separating process (C), and an electrode forming process (D). Yes.

  First, as shown in FIG. 5A, a plurality of green sheets 1 are formed (sheet forming step (A)).

  Next, as shown in FIGS. 5B and 6, an arc-shaped conductor 2 made of Ag paste is printed on a plurality of green sheets 1, and these green sheets 1 are laminated to form a coil made of a spiral conductor. The part 3 is formed (coil part forming step (B)). At this time, the arcuate conductors 2 printed on the vertically adjacent green sheets 1 are electrically connected to each other through through holes 4 formed in the green sheet 1 to form a coil portion 3.

  Next, as shown in FIG. 5C, using a dicing cutting method, a Thomson cutting method, or the like, adjacent element bodies 5 are cut by a cutting machine 6 to form a plurality of chip parts 7 (element body separation step). (C)).

  And while forming an electrode etc. in this chip component 7, it bakes and manufactures a finished product (electrode formation process (D)).

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP 11-186084 A

  In the conventional configuration, since the adjacent element body 5 is cut by the cutting machine 6 using a dicing cutting method, a Thomson cutting method or the like in the element body separating step (C), a surface perpendicular to the mounting surface is provided. The first corners formed adjacent to each other are formed in a right angle.

  That is, when supplying a plurality of chip parts to a mounting machine with a parts feeder or the like, if the chip parts come into contact with each other, the first corner of the chip parts is right-angled, so that the supply of the chip parts is not smooth. It had the problem of causing cracks and chipping.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a chip component that suppresses the occurrence of cracking or chipping when the chip component is supplied.

  In order to achieve the above object, the present invention has the following configuration.

  The invention according to claim 1 of the present invention includes a rectangular element and electrodes arranged at end portions of the element, and surfaces perpendicular to the mounting surface are formed adjacent to each other. The corner portion is substantially arc-shaped, and the second corner portion formed by adjoining surfaces perpendicular to the mounting surface to each other is substantially perpendicular.

  With the above configuration, since the first corners formed with the surfaces perpendicular to the mounting surface adjacent to each other are formed in a substantially arc shape, when supplying a plurality of chip components to the mounting machine with a parts feeder or the like, Even if the chip parts come into contact with each other, the supply and movement of the chip parts can be performed smoothly, and cracks and chipping of the chip parts can be suppressed. In particular, since the second corners formed by mutually adjoining surfaces perpendicular to the mounting surface are formed at substantially right angles, chip standing can be suppressed during mounting.

  Hereinafter, the invention described in all claims of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view of a chip component according to an embodiment of the present invention, FIG. 2 is a plan view of the chip components connected together, FIG. 3 is an enlarged plan view of part A in FIG. 2, and FIG. It is process drawing which shows the manufacturing process of components.

  In FIG. 1, a chip component according to an embodiment of the present invention is a chip coil component, and includes a rectangular transparent element 12, an electrode 14 disposed on the lower surface of the element 12, and an element 12. The coil part 18 which consists of the embedded helical metal 16 is provided, and the element | base_body 12 is laminated | stacked and formed by the insulating resin layer 20 which consists of photosensitive resin hardened | cured material which hardened photosensitive resin.

  Further, the first corners 22 formed with the surfaces perpendicular to the mounting surface adjacent to each other are formed in a substantially arc shape, and the surfaces parallel to the surfaces perpendicular to the mounting surface are formed adjacent to each other. The second corner portion 24 is formed in a substantially right angle, the first corner portion 22 is formed in the element body 12, and the second corner portion 24 is formed in the electrode 14. When the electrode 14 is also disposed on the side surface of the element body 12, the first corner portion 22 and the second corner portion 24 are formed on the electrode 14.

  Further, the minimum distance (end surface margin (W)) between the outermost spiral metal 16 of the coil portion 18 and the side surface of the element body 12 is 5 μm or more and 50 μm or less, and the maximum diameter of the coil portion 18 is 5 μm to 150 μm. The height of the element body composed of a plurality of laminated insulating resin layers 20 is set to 50 μm to 1 mm.

  Next, the manufacturing process of the chip component 26 will be described.

  As shown in FIGS. 2 and 3, a plurality of the chip components 26 are formed at a time in a state where the plurality of chip components 26 are connected to each other, and finally the plurality of chip components 26 connected by the frame-shaped connecting portion 28. The chip parts 26 are separated and separated into pieces.

  In FIG. 4, the manufacturing process of the chip component 26 is as follows.

  First, the electrode 14 disposed on the lower surface of the element body 12 is formed (electrode formation step (A)).

  An insulating resin layer 20 having a predetermined gap is formed on the substrate 30 on which the release layer is formed by a photolithography method. The gap portion includes a plurality of frame-like gap portions 32 adjacent to each other and an electrode gap portion 34 arranged inside the frame-like gap portion 32, and the chip component 26 is placed inside the frame-like gap portion 32. The frame-shaped connecting portion 28 for connecting the plurality of chip components 26 to the frame-shaped gap portion 32 is formed.

  A metal layer 36 is formed on the frame-shaped gap 32, the electrode gap 34 and the insulating resin layer 20. The metal layer 36 has a base conductor layer 38 formed by an electroless plating method, a sputtering method, or a vapor deposition method, and is formed on the base conductor layer 38 by an electrolytic plating method.

  The metal layer 36 is polished to at least the upper surface of the insulating resin layer 20 to form the electrode 14 made of metal in the electrode gap 34 and the frame-shaped connecting portion 28 made of metal in the frame-shaped gap 32. In addition, insulation between the electrode 14 and the frame-shaped connecting portion 28 is achieved.

  Second, an insulating resin layer 20 having a predetermined gap is further formed by a photolithography method (insulating resin layer forming step (B)).

  This void portion is composed of a plurality of frame-shaped void portions 32 adjacent to each other, a helical void portion 40 disposed inside the frame-shaped void portion 32, and a through-hole void portion 42. 32 is formed so as to overlap with the frame-shaped gap 32 formed in the electrode forming step (A).

  Third, the metal layer 36 is formed on the frame-shaped gap 32, the spiral gap 40, the through-hole gap 42, and the insulating resin layer 20 (metal layer forming step (C)).

  The metal layer 36 has a base conductor layer 38 formed by an electroless plating method, a sputtering method, or a vapor deposition method, and is formed on the base conductor layer 38 by an electrolytic plating method.

  Fourth, a two-layer coil portion 18 made of the spiral metal 16 is formed (coil portion forming step (D)).

  The metal layer 36 formed in the metal layer forming step (C) is polished to at least the upper surface of the insulating resin layer 20 to form the coil part 18 made of the spiral metal 16 in the spiral gap 40, and the frame-like gap A frame-shaped connecting portion 28 made of metal is formed in 32, a through-hole 44 made of metal is formed in the through-hole gap portion 42, and insulation between the coil portion 18 and the frame-shaped connecting portion 28 is achieved.

  Further, the insulating resin layer forming step (B) and the metal layer forming step (C) are repeated to form the two-layer coil portion 18. The two layers of the coil part 18, the electrode 14 and the coil part 18 are electrically connected by a through hole 44.

  Fifth, the insulating resin layer 20 is further formed, and the insulating resin layer 20 having a predetermined gap is formed by a photolithography method to form a protective layer (protective layer forming step (E)).

  This void portion is composed of a plurality of frame-shaped void portions 32 adjacent to each other, and this frame-shaped void portion 32 is formed so as to overlap the frame-shaped void portion 32 formed in the insulating resin layer forming step (B). .

  Sixth, the metal formed in the frame-shaped gap portion 32 is removed by melting with an etching agent, and a plurality of chip components 26 connected to each other by the frame-shaped connection portion 28 are separated, and the chip is separated from the release layer of the substrate 30. The component 26 is peeled off (melted with a solvent, alkali or the like) and separated into pieces (separation step (F)).

  Thus, the element body 12 is formed by the insulating resin layer 20 laminated by the electrode forming process (A), the insulating resin layer forming process (B), and the protective layer forming process (E). The electrode 14 is disposed on the lower surface, and the coil portion 18 is embedded in the element body 12.

  In this manufacturing method, the metal layer 36 is preferably a highly conductive metal such as Cu, Al, Ag, Au, Ni, or a metal alloy. Further, the base conductor layer 38 is preferably a metal having high adhesion to the insulating resin layer 20 such as Cu, Al, Ag, Au, Ni, Cr, Ti, and is formed by an electroless plating method, a sputtering method or a vapor deposition method. It is preferable.

  In this manufacturing method, the insulating resin layer 20 is made of a transparent photosensitive resin cured product obtained by curing a photosensitive resin. This insulating resin layer 20 is processed into a predetermined shape by a photolithography method using an epoxy-based resin, a phenol-based resin, a polyimide-based resin, or the like, but unlike a resist used in a general photolithography method, the final chip Since the resin constituting the element body 12 of the component 26 is generally easy to generate static electricity, a resin that suppresses the generation of static electricity may be selected, or a configuration that dissipates static electricity may be added. .

  As a polishing method, CMP (chemical mechanical polishing) polishing using a CMP slurry may be used. Since only the metal is selectively polished while etching the metal layer 36 by CMP polishing, the accuracy is improved. As another polishing method, mechanical polishing using diamond slurry or alumina slurry may be used, but it is disadvantageous in comparison with CMP polishing in terms of accuracy. When the metal layer 36 is not suitable for etching, the portion may be polished by mechanical polishing.

  With the above configuration, in the chip component 26, the first corner portion 22 in which surfaces perpendicular to the mounting surface are formed adjacent to each other can be formed in a substantially arc shape. As a result, when supplying a plurality of chip components 26 to the mounting machine with a parts feeder or the like, even if the chip components 26 come into contact with each other, the first corner 22 of the chip components 26 is substantially arc-shaped, so that the supply can be smoothly performed Thus, cracking and chipping of the chip component 26 can be suppressed. On the other hand, since the second corner portion 24 formed by mutually adjoining surfaces perpendicular to the mounting surface is formed in a substantially right angle, chip standing can be suppressed during mounting. In addition, according to the said method, it is easy to make the internal peripheral corner | angular part of the frame-shaped space | gap part 32 into a chamfering shape or another shape.

  In particular, in the manufacturing process, the plurality of chip components 26 are connected to each other in advance by a frame-shaped connecting portion 28 made of metal formed in a frame-shaped gap portion 32 having an arcuate inner peripheral corner. Thus, the plurality of chip components 26 connected to each other by the frame-like connecting portion 28 are separated, so that the first corner portion 22 can be formed in a substantially arc shape and the second corner portion 24 can be formed in a substantially right angle shape.

  Further, since the insulating resin layer 20 is formed by a photolithography method, the conductor position accuracy, the chip dimension accuracy, etc. can be easily formed with high accuracy. In addition, by using a transparent photosensitive resin for the insulating resin layer 20, the element body 12 becomes transparent, facilitating the appearance inspection of the conductor for each layer, increasing the aspect ratio, and facilitating the thickness of the coil portion 18. Can be thickened.

  Furthermore, the metal layer 36 has a base conductor layer 38 formed by an electroless plating method, a sputtering method, a vapor deposition method, or the like. 18 can be formed easily.

  As described above, the chip component according to the present invention can be applied to various electronic devices because it can suppress generation of cracks and chips during supply.

The perspective view of the chip component in one embodiment of this invention Plan view of multiple connected chip components Enlarged plan view of part A in FIG. Process chart showing the manufacturing process of the same chip component Process diagram showing the manufacturing process of conventional chip parts 5 is an exploded perspective view of part A.

Explanation of symbols

DESCRIPTION OF SYMBOLS 12 Element body 14 Electrode 16 Spiral metal 18 Coil part 20 Insulating resin layer 22 1st corner | angular part 24 2nd corner | angular part 26 Chip component 28 Frame-like connection part 30 Substrate 32 Frame-like gap part 34 Electrode gap part 36 Metal layer 38 Under conductor layer 40 Spiral gap 42 Through-hole gap 44 Through-hole

Claims (5)

A first element having a rectangular element and electrodes arranged at end portions of the element, the first corners of which surfaces perpendicular to the mounting surface are formed adjacent to each other are substantially arc-shaped and mounted. A chip component in which a second corner portion in which a plane perpendicular to the plane and a plane parallel to each other are formed adjacent to each other is substantially perpendicular. The chip component according to claim 1, wherein the first corner and the second corner are formed on the electrode. The chip component according to claim 1, wherein the first corner is formed in the element body and the second corner is formed in the electrode. The chip part according to claim 1, wherein the element body is formed of an insulating resin layer made of a cured photosensitive resin obtained by curing a photosensitive resin, and a coil portion made of a spiral metal is embedded in the insulating resin layer. The chip component according to claim 1, wherein the photosensitive resin cured product is transparent.

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