JP2011040612A - Electronic component, and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component that can prevent a laminate from cracking and also suppress a defect in connection with a substrate, and to provide a method of manufacturing the same. <P>SOLUTION: Connection conductor layers 20a, 20b are provided on a reverse surface S1 while forming a gap G. An insulator layer 22 covers outer edges e1, e2, forming the gap G, of the connection conductor layers 20a, 20b. The connection conductor layer 24a is provided over the connection conductor layer 20a. The connection conductor layer 24b is provided over the connection conductor layer 20b. Principal surfaces of the connection conductor layers 24a, 24b are more apart from the reverse surface S1 than from a principal surface of the insulator layer 22. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic component and a manufacturing method thereof, and more particularly to an electronic component including an external electrode and a manufacturing method thereof.

  As a conventional electronic component and a method for manufacturing the same, an electronic component shown in FIG. 12A is known. FIG. 12A is a cross-sectional structure diagram of a conventional electronic component 500.

  The electronic component 500 includes a multilayer body 502, external electrodes 504a and 504b, and connection conductor layers 506a and 506b. The laminated body 502 is formed by laminating insulating layers such as ceramics and has a rectangular parallelepiped shape. The external electrodes 504a and 504b are provided so as to cover two opposite side surfaces of the multilayer body 502. Furthermore, the external electrodes 504a and 504b are provided so as to be folded back with respect to the upper surface and the lower surface of the multilayer body 502, as shown in FIG. The connection conductor layers 506a and 506b are provided on the lower surface of the multilayer body 502 in a state of being connected to the external electrodes 504a and 504b, respectively.

  The electronic component 500 configured as described above is solder mounted on the resin substrate 510. Specifically, the external electrode 504a and the connection conductor layer 506a are fixed to the substrate 510 by the solder 512a, and the external electrode 504b and the connection conductor layer 506b are fixed to the substrate 510 by the solder 512b.

  By the way, in the electronic component 500, when the electronic component 500 is solder-mounted with respect to the board | substrate 510, there exists a possibility that a crack may generate | occur | produce. More specifically, the thermal expansion coefficient of the laminate 502 is smaller than the thermal expansion coefficient of the substrate 510. Therefore, when the electronic component 500 and the substrate 510 are heated during solder mounting, the substrate 510 expands more than the electronic component 500. As a result, the solders 512a and 512b are pulled by the stress F1 in the direction in which the distance between the solders 512a and 512b increases. Then, the connection conductor layers 506a and 506b are pulled by the solders 512a and 512b in a direction in which the distance between them is increased. At this time, as shown in FIG. 12A, the stress F2 is concentrated on the tips of the connection conductor layers 506a and 506b, so that cracks occur in a portion B of the multilayer body 502 where the tips of the connection conductor layers 506a and 506b are in contact. May occur.

  In order to solve the above problem, for example, an electronic component 600 shown in FIG. FIG. 12B is a sectional structural view of a conventional electronic component 600.

  In the electronic component 600, an insulator layer 602 is provided with respect to the electronic component 500. The insulator layer 602 is provided on the lower surface of the multilayer body 502 so as to cover the tips of the connection conductor layers 506a and 506b. Thereby, in the electronic component 600, the stress F2 is suppressed from being concentrated on the tips of the connection conductor layers 506a and 506b when the electronic component 600 is mounted on the substrate 510 by soldering. As a result, in the electronic component 600, the occurrence of cracks at the portion B where the tips of the connection conductor layers 506a and 506b are in contact with each other in the multilayer body 502 is suppressed.

  However, the electronic component 600 has a problem that when the multilayer body 502 is fired, the components in the insulator layer 602 are melted and spread on the connection conductor layers 506a and 506b. Specifically, the insulator layer 602 is formed so as to cover the tips of the connection conductor layers 506a and 506b on the lower surface of the multilayer body 502 after the connection conductor layers 506a and 506b are formed and before the multilayer body 502 is fired. Is done. Then, the insulator layer 602 is fired together with the stacked body 502. Therefore, when the multilayer body 502 is fired, the components in the insulator layer 602 are melted and spread on the connection conductor layers 506a and 506b. As a result, the area where the connection conductor layers 506a and 506b are exposed is reduced, and the contact area between the connection conductor layers 506a and 506b and the solder 512a and 512b is reduced. As a result, connection failure may occur between the electronic component 600 and the substrate 510.

  As an invention similar to the electronic component 600, for example, an electrode structure of an electronic component described in Patent Document 1 is known. However, in the electrode structure of the electronic component, since the solder resist member corresponding to the insulator layer 602 is formed after firing the laminated body, the problem that the components in the solder resist member melt during firing does not occur. Therefore, Patent Document 1 does not describe a method for solving the problem of a decrease in connectivity between the electronic component 600 and the substrate 510.

JP-A-6-244051

  Therefore, an object of the present invention is to provide an electronic component that can prevent the occurrence of cracks in a laminate and suppress the occurrence of poor connection with a substrate, and a method for manufacturing the same.

  An electronic component according to an aspect of the present invention is a rectangular parallelepiped body containing a circuit element, and includes a first surface, a second surface facing each other across the first surface, and a second surface A main body having three surfaces, a first conductor layer and a second conductor layer provided on the first surface with a gap therebetween, and the first conductor layer and the second conductor layer. A first insulator layer covering an outer edge forming the gap in the conductor layer; a third conductor layer provided on the first conductor layer; and the second conductor layer. A fourth conductor layer provided; a first external electrode provided on the second surface; and in contact with the first conductor layer or the third conductor layer; 3, and a second external electrode in contact with the second conductor layer or the fourth conductor layer. , The major surface and the main surface of the fourth conductive layer of the third conductive layer, that is remote from the first surface than the main surface of the first insulator layer, characterized by.

  The method for manufacturing an electronic component according to an aspect of the present invention includes a step of forming the main body, a step of forming the first conductor layer and the second conductor layer, and the first insulator layer. Forming the third conductor layer and the fourth conductor layer, and forming the first conductor layer to the fourth conductor layer and the first insulator layer. A step of firing the main body; and a step of forming the first external electrode and the second external electrode on the main body.

  According to the present invention, it is possible to prevent cracks from occurring in the laminate, and to suppress the occurrence of poor connection with the substrate.

1 is an external perspective view of an electronic component according to an embodiment of the present invention. It is a disassembled perspective view of the laminated body of the electronic component of FIG. FIG. 2 is a cross-sectional structural view taken along line AA in FIG. 1. It is process sectional drawing of an electronic component. It is process sectional drawing of an electronic component. It is process sectional drawing of an electronic component. It is process sectional drawing of an electronic component. It is process sectional drawing of an electronic component. It is process sectional drawing of an electronic component. It is process sectional drawing of an electronic component. It is a cross-section figure of the electronic component which concerns on a modification. It is sectional structure drawing of the conventional electronic component.

  Below, the electronic component which concerns on embodiment of this invention, and its manufacturing method are demonstrated.

(Configuration of electronic parts)
The configuration of an electronic component according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an external perspective view of an electronic component 10 according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the laminate 12 of the electronic component 10 of FIG. FIG. 3 is a sectional structural view taken along line AA of FIG. Hereinafter, the stacking direction of the electronic component 10 is defined as the z-axis direction, the direction along the long side of the electronic component 10 is defined as the x-axis direction, and the direction along the short side of the electronic component 10 is defined as the y-axis direction. To do. The x axis, the y axis, and the z axis are orthogonal to each other. In FIG. 2, the vertical direction of FIGS. 1 and 3 is reversed.

  As shown in FIGS. 1 and 2, the electronic component 10 includes a laminate (main body) 12, external electrodes 14 (14a, 14b), connection conductor layers 20 (20a, 20b), 24 (24a, 24b), an insulator. A layer 22 and a coil L are provided. The laminated body 12 has a rectangular parallelepiped shape and incorporates a coil (circuit element) L as shown in FIG. As shown in FIG. 3, the laminated body 12 has a lower surface S1 and end surfaces S2, S3. In the laminated body 12, the surface on the negative direction side in the z-axis direction is referred to as a lower surface S1. In addition, as shown in FIG. 3, in the laminated body 12, the surfaces facing each other across the lower surface S <b> 1 are referred to as end surfaces S <b> 2 and S <b> 3. The end surface S2 is a surface on the negative direction side in the x-axis direction, and the end surface S3 is a surface on the positive direction side in the x-axis direction.

  As illustrated in FIG. 2, the stacked body 12 is configured by stacking the insulating layers 16 (16 a to 16 h) so that they are arranged in this order from the positive direction side to the negative direction side in the z-axis direction. Each of the insulator layers 16a to 16h is a rectangular insulator layer formed by applying a ceramic paste mainly composed of glass. In the following, in the insulator layer 16, the main surface on the positive direction side in the z-axis direction is referred to as the front surface, and the main surface on the negative direction side in the z-axis direction is referred to as the back surface.

  The coil L is comprised by the coil conductor layer 18 (18a-18g) and the via-hole conductors b1-b6. The coil conductor layer 18 is made of a conductive material made of Ag and constitutes a spiral coil L. Specifically, as shown in FIG. 2, each of the coil conductor layers 18a to 18g is a linear conductor provided on the back surface of the insulator layers 16a to 16g and having a length of 3/4 turns. The coil conductor layers 18a to 18g form a rectangular annular track by overlapping each other when viewed in plan from the z-axis direction. Accordingly, the coil conductor layers 18a to 18g have a U shape in which one side of a rectangle is cut out. Hereinafter, when viewed in plan from the negative direction side in the z-axis direction, the counterclockwise upstream end of the coil conductor layers 18a to 18g is referred to as the upstream end of the coil conductor layers 18a to 18g, and the coil conductor layer 18a. The end on the downstream side in the counterclockwise direction of ˜18 g is referred to as the downstream end of the coil conductor layers 18 a to 18 g.

  As shown in FIG. 2, the via-hole conductors b1 to b6 penetrate the insulator layers 16b to 16g in the z-axis direction and connect the coil conductor layers 18a to 18g adjacent in the z-axis direction. Specifically, the via-hole conductor b1 connects the downstream end of the coil conductor layer 18a and the upstream end of the coil conductor layer 18b. The via-hole conductor b2 connects the downstream end of the coil conductor layer 18b and the upstream end of the coil conductor layer 18c. The via-hole conductor b3 connects the downstream end of the coil conductor layer 18c and the upstream end of the coil conductor layer 18d. The via-hole conductor b4 connects the downstream end of the coil conductor layer 18d and the upstream end of the coil conductor layer 18e. The via-hole conductor b5 connects the downstream end of the coil conductor layer 18e and the upstream end of the coil conductor layer 18f. The via-hole conductor b6 connects the downstream end of the coil conductor layer 18f and the upstream end of the coil conductor layer 18g. As described above, the coil conductor layers 18a to 18g and the via-hole conductors b1 to b6 constitute a spiral coil L having a coil axis extending in the z-axis direction. The coil L is rotated on a rectangular ring-shaped orbit when viewed in plan from the z-axis direction.

  As shown in FIG. 2, the upstream end of the coil conductor layer 18a is drawn out to the short side of the insulator layer 16a on the negative side in the x-axis direction. Thereby, the coil conductor layer 18a is connected to the external electrode 14a.

  As shown in FIG. 2, the downstream end of the coil conductor layer 18g is drawn to the short side of the insulator layer 16g on the positive side in the x-axis direction. Thereby, the coil conductor layer 18g is connected to the external electrode 14b.

  As shown in FIGS. 2 and 3, the connection conductor layer 20 is provided with a gap G on the back surface of the insulator layer 16 h (that is, on the bottom surface S <b> 1). Specifically, the connection conductor layer 20a extends along the short side on the negative direction side in the x-axis direction of the insulator layer 16h, and has a rectangular shape having a width d1 in the x-axis direction. Is a layer. The connection conductor layer 20b is a rectangular conductor layer that extends along the short side of the insulator layer 16h on the positive side in the x-axis direction and has a width d1 in the x-axis direction. Thereby, the connection conductor layer 20a, the gap G, and the connection conductor layer 20b are arranged in this order in the direction from the end surface S2 to the end surface S3 (that is, the direction from the negative direction side to the positive direction side in the x-axis direction). Yes.

  In the connection conductor layers 20a and 20b, outer edges that form the gap G are referred to as outer edges e1 and e2. More specifically, the gap G is located on the positive side in the x-axis direction of the connection conductor layer 20a, and is located on the outer edge extending in the y-axis direction and on the negative direction side in the x-axis direction of the connection conductor layer 20b. And between the outer edge extending in the y-axis direction. Therefore, an outer edge located on the positive side in the x-axis direction of the connection conductor layer 20a and extending in the y-axis direction is referred to as an outer edge e1. An outer edge located on the negative side in the x-axis direction of the connection conductor layer 20b and extending in the y-axis direction is referred to as an outer edge e2.

  As shown in FIG. 3, the insulator layer 22 has a rectangular shape provided on the back surface of the insulator layer 16h and the back surfaces of the connection conductor layers 20a and 20b so as to cover the outer edges e1 and e2 and the gap G. It is an insulator layer. The insulator layer 22 is made of the same material as the insulator layer 16 (for example, a ceramic paste mainly composed of glass).

  As shown in FIGS. 2 and 3, the connection conductor layer 24 is provided on the back surface of the connection conductor layer 20 as shown in FIGS. 2 and 3. Further, the connection conductor layer 24 a covers a part of the insulator layer 22. Specifically, the connection conductor layer 24a extends along the long side on the negative direction side in the x-axis direction of the connection conductor layer 20a, and has a width d2 smaller than the width d1 in the x-axis direction. It is a rectangular conductor layer. The connection conductor layer 24a covers and hides the side of the insulator layer 22 on the negative direction side in the x-axis direction. The connecting conductor layer 24b extends along the long side of the connecting conductor layer 20b on the positive direction side in the x-axis direction, and has a width d2 smaller than the width d1 in the x-axis direction. Is a layer. The connection conductor layer 24b covers and hides the side of the insulator layer 22 on the positive direction side in the x-axis direction. Thereby, as shown in FIG. 3, the back surface of the connection conductor layer 24 is farther from the lower surface S <b> 1 than the back surface of the insulator layer 22.

  The external electrode 14a is provided so as to cover the end surface S2 on the negative direction side in the x-axis direction, and is in contact with the connection conductor layers 20a and 24a. The external electrode 14b is provided so as to cover the end surface S3 on the positive direction side in the x-axis direction, and is in contact with the connection conductor layers 20b and 24b.

  The electronic component 10 configured as described above is solder-mounted on a substrate (not shown). Specifically, the external electrode 14a and the connection conductor layer 24a are soldered to the first electrode of the substrate, and the external electrode 14b and the connection conductor 24b are soldered to the second electrode of the substrate. .

(Method for manufacturing electronic parts)
Below, the manufacturing method of the electronic component 10 is demonstrated, referring drawings. In the following, a method of manufacturing the electronic component 10 when simultaneously creating a plurality of electronic components 10 will be described. 4 to 10 are process sectional views of the electronic component 10.

  First, as shown to Fig.4 (a), the base material 100 which consists of alumina, for example is prepared. Then, the varnish 102 is applied to the entire back surface of the substrate 100.

  Next, as shown in FIG. 4B, a photosensitive ceramic paste mainly composed of glass or the like is applied to the entire back surface of the varnish 102 to form an insulator layer 116a. Then, as shown in FIG. 4C, the insulator layer 116a is cured by irradiating the entire surface of the insulator layer 116a with ultraviolet rays to form the insulator layer 16a. Thus, the insulator layer 16a is formed by a photolithography process.

  Next, as shown in FIG. 4D, a photosensitive conductive paste mainly composed of Ag is applied to the entire back surface of the insulator layer 16a to form a conductor layer 118a. Then, as shown in FIG. 5A, a part of the conductor layer 118a is cured by irradiating the conductor layer 118a with ultraviolet rays through a mask M1. Here, the opening of the mask M1 has the same shape as that of the coil conductor layer 18a. Therefore, a portion of the conductor layer 118a corresponding to the coil conductor layer 18a is cured. And it develops with an alumina solution etc., and as shown in FIG.5 (b), the coil conductor layer 18a is formed. Thus, the coil conductor layer 18a is formed by a photolithography process.

  Next, as shown in FIG. 5C, a photosensitive ceramic paste mainly composed of glass or the like is applied to the entire back surface of the insulator layer 16a and the coil conductor layer 18a to form the insulator layer 116b. To do. And as shown in FIG.5 (d), a part of insulator layer 116b is hardened by irradiating with ultraviolet rays with respect to the insulator layer 116b through the mask M2. Here, the mask M2 covers the position of the via-hole conductor b1. Therefore, in the insulator layer 116b, a portion other than the portion corresponding to the via-hole conductor b1 is cured. And by developing with an alumina solution etc., as shown to Fig.6 (a), the insulator layer 16b provided with the via hole h1 is formed. Thus, the insulator layer 16b is formed by a photolithography process.

  Next, as shown in FIG. 6B, a photosensitive conductive paste mainly composed of Ag is applied to the entire back surface of the insulator layer 16b to form a conductor layer 118b. At this time, the conductive paste is also filled in the via hole h1. Then, as shown in FIG. 6C, a part of the conductor layer 118b is cured by irradiating the conductor layer 118b with ultraviolet rays through the mask M3. Here, the opening of the mask M3 has the same shape as the shape of the coil conductor layer 18b. Therefore, a portion of the conductor layer 118b corresponding to the coil conductor layer 18b is cured. Furthermore, the portion corresponding to the via-hole conductor b1 in the conductor layer 118b is also cured. And by developing with an alumina solution etc., as shown in FIG.6 (d), the coil conductor layer 18b and the via-hole conductor b1 are formed. Thus, the coil conductor layer 18b and the via-hole conductor b1 are formed by a photolithography process.

  Thereafter, insulator layers 16c to 16h, coil conductor layers 18c to 18g, and via-hole conductors b2 to b6 are formed. However, these forming steps are the same as the steps shown in FIGS. 5C to 6D, and thus description thereof is omitted.

  Next, as shown in FIG. 7A, a photosensitive conductive paste mainly composed of Ag is applied to the entire back surface of the insulator layer 16h to form the conductor layer 120. Then, as shown in FIG. 7B, a portion of the conductor layer 120 is cured by irradiating the conductor layer 120 with ultraviolet rays through a mask M4. Here, the opening of the mask M4 has the same shape as the shape of the connection conductor layers 20a and 20b. Therefore, portions of the conductor layer 120 corresponding to the connection conductor layers 20a and 20b are cured. And by developing with an alumina solution etc., as shown in FIG.7 (c), the connection conductor layers 20a and 20b are formed. Thus, the connection conductor layers 20a and 20b are formed by a photolithography process.

  Next, as shown in FIG. 8A, a photosensitive ceramic paste mainly composed of glass or the like is applied to the entire back surfaces of the insulator layer 16h and the connection conductor layers 20a and 20b, and the insulator layer 122 is then applied. Form. And as shown in FIG.8 (b), a part of insulator layer 122 is hardened by irradiating the ultraviolet rays with respect to the insulator layer 122 through the mask M5. Here, the opening of the mask M5 has the same shape as the shape of the insulator layer 22. Therefore, a portion corresponding to the insulator layer 22 in the insulator layer 122 is cured. And by developing with an alumina solution etc., as shown in FIG.8 (c), the insulator layer 22 is formed. Thus, the insulator layer 22 is formed by a photolithography process.

  Next, as shown in FIG. 9A, a photosensitive conductive paste mainly composed of Ag is applied to the entire back surfaces of the connection conductor layers 20a and 20b and the insulator layer 22, and the conductor layer 124 is applied. Form. Then, as shown in FIG. 9B, a part of the conductor layer 124 is cured by irradiating the conductor layer 124 with ultraviolet rays through a mask M6. Here, the opening of the mask M6 has the same shape as the shape of the connection conductor layers 24a and 24b. Therefore, portions of the conductor layer 124 corresponding to the connection conductor layers 24a and 24b are cured. And by developing with an alumina solution etc., as shown in FIG.9 (c), the connection conductor layers 24a and 24b are formed. Thus, the connection conductor layers 24a and 24b are formed by a photolithography process. The mother laminated body 112 shown in FIG.9 (c) is formed of the above process.

  Next, the mother laminated body 112 is cut into the laminated body 12 having a predetermined dimension (2.5 mm × 2.0 mm × 1.0 mm) with a cutting blade. Thereby, the unsintered laminated body 12 shown to Fig.10 (a) is obtained. And the binder removal process and baking are performed to the unbaked laminated body 12 in which the connection conductor layers 20 and 24 and the insulator layer 22 were formed. By baking, as shown in FIG. 10B, the varnish 102 is burned away, and the substrate 100 is detached from the laminate 12. The fired laminated body 12 is obtained through the above steps.

  The laminated body 12 is subjected to barrel processing to chamfer. Thereafter, an electrode paste whose main component is silver is applied and baked on the surface of the laminate 12 by, for example, a dipping method or the like, thereby forming silver electrodes to be the external electrodes 14a and 14b.

  Finally, the external electrodes 14a and 14b are formed by performing Ni plating / Sn plating on the surface of the silver electrode. Through the above steps, the electronic component 10 as shown in FIGS. 1 and 3 is completed.

(effect)
According to the electronic component 10 described above, it is possible to prevent the laminate 12 from being cracked. More specifically, in the conventional electronic component 500 shown in FIG. 12A, cracks may occur when the electronic component 500 is mounted on the substrate 510 by soldering. More specifically, the thermal expansion coefficient of the laminate 502 is smaller than the thermal expansion coefficient of the substrate 510. Therefore, when the electronic component 500 and the substrate 510 are heated during solder mounting, the substrate 510 expands more than the electronic component 500. As a result, the solders 512a and 512b are pulled by the stress F1 in the direction in which the distance between the solders 512a and 512b increases. Then, the connection conductor layers 506a and 506b are pulled by the solders 512a and 512b in a direction in which the distance between them is increased. At this time, as shown in FIG. 12A, the stress F2 is concentrated on the tips of the connection conductor layers 506a and 506b, so that cracks occur in a portion B of the multilayer body 502 where the tips of the connection conductor layers 506a and 506b are in contact. May occur.

  Therefore, the electronic component 10 is provided with the insulator layer 22. As shown in FIG. 3, the insulator layer 22 is provided on the back surface of the insulator layer 16 h and the back surfaces of the connection conductor layers 20 a and 20 b so as to cover the outer edges e 1 and e 2 on the lower surface of the multilayer body 12. Yes. Thereby, the stress concentrated on the portion where the outer edges e1 and e2 of the connection conductor layers 20a and 20b are in contact with each other in the multilayer body 12 is distributed to the portion where the connection conductor layer 20 and the insulator layer 22 are in contact with each other. The As a result, in the electronic component 10, the occurrence of cracks at the portion where the outer edges e 1 and e 2 of the connection conductor layers 20 a and 20 b are in contact with each other in the multilayer body 12 is suppressed.

  Moreover, according to the electronic component 10, it can suppress that a connection defect generate | occur | produces between board | substrates. More specifically, in the conventional electronic component 600 shown in FIG. 12B, when the multilayer body 502 is fired, the components in the insulator layer 602 are melted and spread on the connecting conductor layers 506a and 506b. Have a problem. Specifically, the insulator layer 602 is formed so as to cover the tips of the connection conductor layers 506a and 506b on the lower surface of the multilayer body 502 after the connection conductor layers 506a and 506b are formed and before the multilayer body 502 is fired. Is done. Then, the insulator layer 602 is fired together with the stacked body 502. Therefore, when the multilayer body 502 is fired, the components in the insulator layer 602 are melted and spread on the connection conductor layers 506a and 506b. As a result, the area where the connection conductor layers 506a and 506b are exposed is reduced, and the contact area between the connection conductor layers 506a and 506b and the solder 512a and 512b is reduced. As a result, connection failure may occur between the electronic component 600 and the substrate 510.

  On the other hand, in the electronic component 10, the connection conductor layer 24 a covers and hides the side of the insulator layer 22 on the negative direction side in the x-axis direction. Further, the connection conductor layer 24b covers and hides the side of the insulator layer 22 on the positive side in the x-axis direction. Thereby, as shown in FIG. 3, the back surface of the connection conductor layer 24 is farther from the lower surface S <b> 1 than the back surface of the insulator layer 22. Therefore, when the laminate 12 is baked, the components in the insulator layer 22 are dammed by the connection conductor layers 24a and 24b even if they are melted out of the insulator layer 22, and therefore, on the back surfaces of the connection conductor layers 24a and 24b. Difficult to spread. As a result, the occurrence of poor connection between the electronic component 10 and the substrate 510 is suppressed.

  In addition, since the insulator layer 22 is made of the same material as the insulator layer 16, it has high adhesion to the insulator layer 16. Therefore, the insulator layer 22 is difficult to peel from the stacked body 12 during firing.

(Modification)
Next, an electronic component according to a modification of the present invention will be described with reference to the drawings. FIG. 11 is a cross-sectional structure diagram of an electronic component 10 ′ according to a modification.

  The electronic component 10 ′ is different from the electronic component 10 in the shape of the insulator layers 22 and 22 ′. Specifically, the width of the insulator layer 22 ′ of the electronic component 10 ′ in the x-axis direction is smaller than the width of the insulator layer 22 of the electronic component 10 in the x-axis direction. Therefore, in the electronic component 10 ′, the connection conductor layers 24a and 24b do not cover a part of the insulator layer 22 ′. As a result, as shown in FIG. 11, the connection conductor layer 20 is exposed from the insulator layer 22 in the electronic component 10 ′. As a result, the electronic component 10 ′ can be connected to the substrate by the connection conductor layer 20 in addition to the external electrode 14 and the connection conductor layer 24. It has high connectivity to the substrate.

  However, in the electronic component 10, a part of the insulator layer 22 is covered with the connection conductor layers 24a and 24b. Therefore, in the electronic component 10, the components in the insulator layer 22 are less likely to spread on the back surfaces of the connection conductor layers 24a and 24b when the multilayer body 12 is baked than in the electronic component 10 ′.

  In addition, since the other structure of electronic component 10 'is the same as the other structure of electronic component 10, description is abbreviate | omitted.

  In the electronic components 10 and 10 ′, the connection conductor layers 20 and 24 are in contact with the external electrode 14. However, it is sufficient that at least one of the connection conductors 20 and 24 is in contact with the external electrode 14.

  INDUSTRIAL APPLICABILITY The present invention is useful for an electronic component and a method for manufacturing the same, and is particularly excellent in that it is possible to prevent cracks from occurring in the laminate and to suppress poor connection with the substrate.

S1 bottom surface S2, S3 end face b1 to b6 via-hole conductor 10, 10 'electronic component 12 laminated body 14a, 14b external electrode 16a-16h insulator layer 18a-18g coil conductor layer 20a, 20b, 24a, 24b connecting conductor layer 22, 22 '' Insulator layer

Claims (4)

A rectangular parallelepiped main body containing a circuit element, the main body having a first surface and a second surface and a third surface facing each other across the first surface;
In the first surface, a first conductor layer and a second conductor layer provided with a gap therebetween;
A first insulator layer covering an outer edge forming the gap in the first conductor layer and the second conductor layer;
A third conductor layer provided on the first conductor layer;
A fourth conductor layer provided on the second conductor layer;
A first external electrode provided on the second surface and in contact with the first conductor layer or the third conductor layer;
A second external electrode provided on the third surface and in contact with the second conductor layer or the fourth conductor layer;
With
The main surface of the third conductor layer and the main surface of the fourth conductor layer are farther from the first surface than the main surface of the first insulator layer;
Electronic parts characterized by The third conductor layer and the fourth conductor layer cover a part of the first insulator layer;
The electronic component according to claim 1. The main body is formed by laminating a plurality of second insulator layers,
The first insulator layer is made of the same material as the second insulator layer;
The electronic component according to claim 1, wherein: A method of manufacturing an electronic component according to claim 1,
Forming the body;
Forming the first conductor layer and the second conductor layer;
Forming the first insulator layer;
Forming the third conductor layer and the fourth conductor layer;
Firing the body on which the first conductor layer to the fourth conductor layer and the first insulator layer are formed; and
Forming the first external electrode and the second external electrode on the body;
Having
A method of manufacturing an electronic component characterized by the above.

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