JPH1174105A - Substrate for electronic component - Google Patents
Substrate for electronic componentInfo
- Publication number
- JPH1174105A JPH1174105A JP10155093A JP15509398A JPH1174105A JP H1174105 A JPH1174105 A JP H1174105A JP 10155093 A JP10155093 A JP 10155093A JP 15509398 A JP15509398 A JP 15509398A JP H1174105 A JPH1174105 A JP H1174105A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- grooves
- break
- break grooves
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】この発明は、チップ抵抗器、
ジャンパチップ、ハイブリッドIC等の電子部品の製造
に適用される電子部品用基板に関する。TECHNICAL FIELD The present invention relates to a chip resistor,
The present invention relates to a substrate for electronic components applied to the production of electronic components such as jumper chips and hybrid ICs.
【0002】[0002]
【従来の技術】電子部品、例えばチップ抵抗器を製造す
るには、図8に示すようなアルミナセラミック基板11
が用いられる。この基板11の表面には、分割を容易と
するために、格子状にブレイク溝12,…,12、1
3,…,13が形成されている。各ブレイク溝12,1
3は、図9の(a),(b)に示すように、プレス加工
により形成されるスリットS、或いはスリットS及びこ
のスリットSより生じるクラックCにより構成され、そ
の深さは基板厚さの5〜50%程度とされている。2. Description of the Related Art To manufacture electronic components such as chip resistors, an alumina ceramic substrate 11 as shown in FIG.
Is used. On the surface of the substrate 11, break grooves 12,.
3,..., 13 are formed. Each break groove 12,1
As shown in FIGS. 9A and 9B, 3 is constituted by a slit S formed by press working or a slit S and a crack C generated by the slit S, and the depth thereof is the thickness of the substrate. It is about 5 to 50%.
【0003】この基板11を用いてチップ抵抗器を製造
するには、まず基板11表面の各格子に、電極、抵抗
体、ガラス保護膜を一括して形成する。この基板をブレ
イク溝12,…,12に沿って分割して、短冊状の基板
とし、この短冊状基板の側端面に端面電極を形成する。
そして、この短冊状基板をブレイク溝13,…,13に
沿って分割して最終の形状とする。In order to manufacture a chip resistor using the substrate 11, first, electrodes, resistors, and a glass protective film are collectively formed on each lattice on the surface of the substrate 11. This substrate is divided along the break grooves 12,..., 12 to form a strip-shaped substrate, and an end surface electrode is formed on a side end surface of the strip-shaped substrate.
The strip-shaped substrate is divided along the break grooves 13,..., 13 to obtain a final shape.
【0004】[0004]
【発明が解決しようとする課題】上記従来の電子部品用
基板では、ブレイク溝に沿って分割する際に、例えば図
9の(c)に示すように斜めにクラックC′が走り、端
面形状の不良を生じる問題点があった。図10は、端面
形状の不良を生じたチップ抵抗器18を示しており、1
1″は分割された基板、17は端面電極(斜線を付して
いる)、16はガラス保護膜をそれぞれ示している。こ
のような、いびつな形状のチップ抵抗器18は外観上問
題があるだけではなく、自動実装機による取扱いに支障
が生じる問題点がある。In the above-mentioned conventional electronic component substrate, when dividing along a break groove, for example, a crack C 'runs obliquely as shown in FIG. There is a problem that causes a defect. FIG. 10 shows a chip resistor 18 having a defective end face shape.
1 "denotes a divided substrate, 17 denotes an end face electrode (hatched), and 16 denotes a glass protective film. Such a distorted chip resistor 18 has a problem in appearance. In addition, there is a problem that handling by the automatic mounting machine is hindered.
【0005】この発明は、上記に鑑みなされたものであ
り、形状不良を生じさせることなく分割できる電子部品
用基板の提供を目的としている。The present invention has been made in view of the above, and has as its object to provide an electronic component substrate that can be divided without causing a shape defect.
【0006】[0006]
【課題を解決するための手段】上記課題を解決するた
め、この発明の請求項1記載の電子部品用基板は、1の
方向と他の方向にそれぞれ延伸するブレイク溝を格子状
に形成してなるものにおいて、前記ブレイク溝が基板周
縁部を除いて形成され、この1の方向と他の方向のブレ
イク溝のうち、一方の方向の両端に位置するブレイク溝
が基板端縁まで延伸され、前記1の方向のブレイク溝が
その両端のブレイク溝を除いて全て他の方向のブレイク
溝より深く形成されたことを特徴とするものである。According to a first aspect of the present invention, there is provided a substrate for electronic parts, wherein break grooves extending in one direction and the other direction are formed in a lattice shape. Wherein the break grooves are formed except for the peripheral edge of the substrate, and among the break grooves in one direction and the other direction, the break grooves located at both ends in one direction are extended to the substrate edge, The break grooves in one direction are formed deeper than the break grooves in other directions, except for the break grooves at both ends thereof.
【0007】ブレイク溝(スリット、或いはスリット及
びその延長のクラック)は基板製造時に条件を制御して
作製するため、ブレイク時の「折る」「割る」といった
制御できない因子に比較すると、安定した形状を確保で
きることが期待される。1の方向のブレイク溝(両端の
ブレイク溝を除く)の深さを他の方向のブレイク溝より
深く、例えば基板厚に達するようにしても、基板周縁部
が残されているため、基板はばらばらとはならない。従
って、従来と同様、一体の基板として取り扱うことがで
き、電極等の形成を一括して行うことが可能である。
又、1の方向のブレイク溝の深さを大きくしているの
で、ブレイク端面の仕上がりが良く、電極形成が容易に
なる。Since the break grooves (slits or cracks of the slits and extensions thereof) are formed by controlling the conditions at the time of manufacturing the substrate, a stable shape is obtained in comparison with uncontrollable factors such as "folding" and "breaking" at the time of the break. It is expected that it can be secured. Even if the break grooves in one direction (excluding the break grooves at both ends) are made deeper than the break grooves in the other direction, for example, to reach the thickness of the substrate, the substrate is separated because the peripheral portion of the substrate remains. Does not. Therefore, as in the conventional case, it can be handled as an integrated substrate, and the formation of the electrodes and the like can be performed collectively.
Also, since the depth of the break groove in one direction is increased, the finish of the break end surface is good, and the electrode formation becomes easy.
【0008】又、請求項2記載の電子部品用基板は、1
の方向と他の方向にそれぞれ延伸するブレイク溝を格子
状に形成してなるものにおいて、前記ブレイク溝はが基
板周縁部を除いて形成され、この1の方向と他の方向の
ブレイク溝のうち、他の方向の両端に位置するブレイク
溝が基板端縁まで延伸され、前記1の方向のブレイク溝
が他の方向のブレイク溝より深く形成されたことを特徴
とする。[0008] The electronic component substrate according to the second aspect of the present invention is characterized in that:
In the form of a lattice, wherein the break grooves are formed in a lattice shape, the break grooves extending in the direction of the substrate and the other direction. The break grooves located at both ends in the other direction extend to the edge of the substrate, and the break grooves in the one direction are formed deeper than the break grooves in the other direction.
【0009】[0009]
【発明の実施の形態】この発明の一実施形態に係る電子
部品用基板を図1乃至図7に基づいて以下に説明する。
図1は、この発明の一実施形態に係る基板1の外観斜視
図、図2の(a),(b)は、それぞれ図1のIb−I
b線、Ic−Ic線における要部拡大断面図である。こ
の基板1は、チップ抵抗器の製造に適用されるものであ
り、アルミナセラミックから構成される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component substrate according to an embodiment of the present invention will be described below with reference to FIGS.
FIG. 1 is an external perspective view of a substrate 1 according to an embodiment of the present invention, and FIGS. 2A and 2B are Ib-I of FIG.
It is a principal part expanded sectional view in the b line and the Ic-Ic line. This substrate 1 is applied to the manufacture of a chip resistor, and is made of alumina ceramic.
【0010】基板1の表面には、枠状の周縁部1a,1
a,1b,1bを除いて、ブレイク溝2′,2,…,
2,2′、3′,3,…,3,3′が格子状に形成され
る。ブレイク溝2,2′、3,3′は共にプレス加工に
より形成されており、それぞれスリットS及びこのスリ
ットSより生じるクラックCにより構成される。又、ブ
レイク溝2′,3,3′の深さは従来と同様、基板厚さ
の5〜50%程度とされる。一方、ブレイク溝2の深さ
は、基板裏面に達する程度とされる〔図2の(a),
(b)参照〕。これは貫通していてもよい。基板周縁部
1a,1b(特に1a)が残されているため、ブレイク
溝2により基板1がばらばらになることはない。なお、
条件により、図7に示すように、基板周縁部1a,1a
のみブレイク溝2,3を形成しない構成とすることもで
きる。On the surface of the substrate 1, frame-shaped peripheral portions 1a, 1
a, 1b, 1b, except for the break grooves 2 ', 2,.
2,3 ', 3, ..., 3,3' are formed in a lattice shape. Each of the break grooves 2, 2 ', 3, 3' is formed by press working, and is constituted by a slit S and a crack C generated by the slit S. The depth of the break grooves 2 ', 3, 3' is set to about 5 to 50% of the substrate thickness as in the conventional case. On the other hand, the depth of the break groove 2 is set to reach the rear surface of the substrate [FIG.
(See (b)). It may be penetrating. Since the substrate peripheral portions 1a and 1b (particularly 1a) are left, the substrate 1 does not fall apart due to the break grooves 2. In addition,
Depending on the conditions, as shown in FIG. 7, the substrate peripheral portions 1a, 1a
Only the break grooves 2 and 3 may not be formed.
【0011】次に、実施形態の基板1を用いたチップ抵
抗器の製造を説明する。図3は、基板1上に電極4、抵
抗体5、保護膜6を形成した状態を示しており、図4
は、図3のIIb−IIb線における要部拡大断面図であ
る。電極4は、銀−パラジウム等の導体ペーストをスク
リーン印刷し、焼成してなるものである。抵抗体5も抵
抗体ペーストをスクリーン印刷し、焼成してなるもの
で、電極4,4に跨がるように各格子内に形成される。
各抵抗体5の抵抗値は、レーザトリミングによりそれぞ
れ調整される。保護膜6も、例えばガラスペーストをス
クリーン印刷し、焼成してなるもので、抵抗体5を被覆
・保護する。Next, the manufacture of a chip resistor using the substrate 1 of the embodiment will be described. FIG. 3 shows a state in which the electrode 4, the resistor 5, and the protective film 6 are formed on the substrate 1, and FIG.
FIG. 4 is an enlarged sectional view of a main part taken along line IIb-IIb in FIG. 3. The electrode 4 is formed by screen-printing and firing a conductive paste such as silver-palladium. The resistor 5 is also formed by screen-printing and firing a resistor paste, and is formed in each grid so as to straddle the electrodes 4 and 4.
The resistance value of each resistor 5 is adjusted by laser trimming. The protective film 6 is also formed by, for example, screen-printing and firing a glass paste, and covers and protects the resistor 5.
【0012】次に、ブレイク溝2′,3′に沿ってブレ
イクし、周縁部1a,1bを取り除いて、個々の短冊状
基板1′とする(図5参照)。ブレイク溝2の深さは基
板厚に達しているので、周縁部1a,1bを取り除くだ
けで、基板1はばらばらとなり、「折る」、「割る」と
いった操作は不要である。従って、基板1′の形状不良
は生じない。Next, a break is made along the break grooves 2 ', 3', and the peripheral portions 1a, 1b are removed to form individual strip-shaped substrates 1 '(see FIG. 5). Since the depth of the break groove 2 has reached the thickness of the substrate, the substrate 1 is separated only by removing the peripheral edges 1a and 1b, so that operations such as "folding" and "fracturing" are unnecessary. Therefore, the shape defect of the substrate 1 'does not occur.
【0013】基板1′の側端面1cには、それぞれ端面
電極7が形成される〔図6の(a),(c)参照〕。こ
の端面電極7は、端面1cに導体ペーストを付着、焼成
して形成される厚膜電極7aと、この厚膜電極7a上に
形成されるはんだめっき層7bとから構成される。更
に、この基板1′は、ブレイク溝3,…,3により分割
されて、個々のチップ抵抗器8,…,8とされる〔図6
の(b)参照〕。なお、この場合には、「折る」又は
「割る」といった操作が必要である。An end surface electrode 7 is formed on each side end surface 1c of the substrate 1 '(see FIGS. 6A and 6C). The end face electrode 7 includes a thick film electrode 7a formed by attaching and firing a conductive paste to the end face 1c, and a solder plating layer 7b formed on the thick film electrode 7a. Further, the substrate 1 'is divided by the break grooves 3,..., 3 into individual chip resistors 8,.
(B)). In this case, an operation such as “fold” or “divide” is required.
【0014】なお、上記実施例では、チップ抵抗器の製
造に、この発明の基板を適用した例を示しているが、ジ
ャンパチップ、ハイブリッドIC等の各種電子部品の製
造に適用することが可能である。In the above embodiment, an example is shown in which the substrate of the present invention is applied to the manufacture of a chip resistor. However, the present invention can be applied to the manufacture of various electronic components such as jumper chips and hybrid ICs. is there.
【0015】[0015]
【発明の効果】この発明の請求項1,2の電子部品用基
板は、以上説明したように構成されるので、次の効果を
有する。 (1)1の方向のブレイク端面の形状不良を生じさせる
ことなく分割でき、分割後の短冊状基板の形状不良(バ
リ、欠損等)が殆ど生じない。 (2)1の方向と他の方向のそれぞれ両端のブレイク溝
から基板周縁部を先に取り除いてしまうと、結果的に中
の部分(周縁部より内側の部分)も、基板端縁までブレ
イク溝が形成されているのと同様になり、ブレイクの際
のずれや、所望のパターンからずれることで発生する形
状不良がなくなる。 (3)請求項1の場合、1の方向と他の方向のブレイク
溝のうち、一方の方向の両端に位置するブレイク溝が基
板端縁まで延伸されているので、基板端縁まで延伸され
たブレイク溝から基板周縁部を取り除くとき、そのブレ
イク溝に係る基板周縁部をブレイク溝に沿って確実に除
去することができる。 (4)請求項2の場合、1の方向のブレイク溝が他の方
向のブレイク溝より深いので、他の方向の両端に位置す
るブレイク溝から基板周縁部を取り除けば、短冊状基板
にばらばらに分割し易くなる。The electronic component substrate according to claims 1 and 2 of the present invention has the following effects since it is configured as described above. (1) Splitting can be performed without causing a shape defect at the end face of the break in the direction of 1, and almost no defective shape (burrs, defects, etc.) of the strip-shaped substrate after the division occurs. (2) If the peripheral edge of the substrate is removed first from the break grooves at both ends in the direction 1 and in the other direction, the middle portion (the portion inside the peripheral edge) is eventually broken to the substrate edge. This is the same as the case where the pattern is formed, and the displacement at the time of the break and the shape defect caused by the displacement from the desired pattern are eliminated. (3) In the case of claim 1, since the break grooves located at both ends in one direction of the break grooves in one direction and the other direction are extended to the substrate edge, they are extended to the substrate edge. When removing the substrate peripheral portion from the break groove, the substrate peripheral portion related to the break groove can be reliably removed along the break groove. (4) In the case of claim 2, since the break groove in one direction is deeper than the break groove in the other direction, if the substrate peripheral edges are removed from the break grooves located at both ends in the other direction, the break grooves are separated. It becomes easier to split.
【図1】この発明の一実施形態に係る電子部品用基板の
外観斜視図である。FIG. 1 is an external perspective view of an electronic component substrate according to an embodiment of the present invention.
【図2】図1のIb−Ib線における要部拡大断面図
(a)、及びIc−Ic線における要部拡大断面図
(b)である。FIGS. 2A and 2B are an enlarged sectional view of a main part taken along line Ib-Ib of FIG. 1 and an enlarged cross-sectional view of a main part taken along line Ic-Ic of FIG.
【図3】同電子部品用基板表面に電極等を形成した状態
を示す斜視図である。FIG. 3 is a perspective view showing a state where electrodes and the like are formed on the surface of the electronic component substrate.
【図4】図3のIIb−IIb線における要部拡大断面図で
ある。FIG. 4 is an enlarged sectional view of an essential part taken along line IIb-IIb in FIG. 3;
【図5】同電子部品用基板より周縁部を取り除いた状態
を示す斜視図である。FIG. 5 is a perspective view showing a state in which a peripheral portion is removed from the electronic component substrate.
【図6】同電子部品用基板より棒状に分割された基板の
側端面に端面電極を形成した状態を示す斜視図(a)、
棒状に分割された基板を更に分割し、チップ抵抗器とし
た状態を説明する図(b)、及び(a)のIVc−IVc線
における拡大断面図(c)である。FIG. 6A is a perspective view showing a state in which an end surface electrode is formed on a side end surface of a substrate divided into a rod shape from the electronic component substrate,
It is a figure (b) explaining a state where a substrate divided into a rod shape is further divided into chip resistors, and an enlarged sectional view (c) along line IVc-IVc in (a).
【図7】同電子部品用基板の変形例を示す外観斜視図で
ある。FIG. 7 is an external perspective view showing a modification of the electronic component substrate.
【図8】従来の電子部品用基板の外観斜視図である。FIG. 8 is an external perspective view of a conventional electronic component substrate.
【図9】図8のVIb−VIb線における拡大断面図
(a)、VIc−VIc線における拡大断面図(b)、及び
同従来の電子部品用基板の斜め割れを説明する拡大断面
図(c)である。9A is an enlarged sectional view taken along line VIb-VIb of FIG. 8, FIG. 9B is an enlarged sectional view taken along line VIc-VIc, and FIG. 9C is an enlarged sectional view illustrating an oblique crack in the conventional electronic component substrate. ).
【図10】斜め割れの状態で製造されたチップ抵抗器の
外観斜視図である。FIG. 10 is an external perspective view of a chip resistor manufactured in an obliquely cracked state.
1 電子部品用基板 1a,1b 基板周縁部 2,2′ 1の方向のブレイク溝 3,3′ 他の方向のブレイク溝 DESCRIPTION OF SYMBOLS 1 Electronic component substrate 1a, 1b Peripheral edge of substrate 2, 2 'Break groove in one direction 3, 3' Break groove in another direction
Claims (2)
レイク溝を格子状に形成してなる電子部品用基板におい
て、 前記ブレイク溝は、基板周縁部を除いて形成され、この
1の方向と他の方向のブレイク溝のうち、一方の方向の
両端に位置するブレイク溝は、基板端縁まで延伸され、
前記1の方向のブレイク溝は、その両端のブレイク溝を
除いて全て他の方向のブレイク溝より深く形成されたこ
とを特徴とする電子部品用基板。An electronic component substrate comprising break grooves extending in a grid and extending in one direction and the other direction, wherein the break grooves are formed excluding a peripheral portion of the substrate. Of the break grooves in the other direction, the break grooves located at both ends in one direction are extended to the substrate edge,
The electronic component substrate, wherein the break grooves in one direction are all formed deeper than the break grooves in other directions except for the break grooves at both ends thereof.
レイク溝を格子状に形成してなる電子部品用基板におい
て、 前記ブレイク溝は、基板周縁部を除いて形成され、この
1の方向と他の方向のブレイク溝のうち、他の方向の両
端に位置するブレイク溝は、基板端縁まで延伸され、前
記1の方向のブレイク溝は、他の方向のブレイク溝より
深く形成されたことを特徴とする電子部品用基板。2. An electronic component substrate in which break grooves extending in one direction and the other direction are formed in a grid pattern, wherein the break grooves are formed except for a peripheral portion of the substrate. Of the break grooves in the other direction, the break grooves located at both ends in the other direction are extended to the edge of the substrate, and the break groove in the one direction is formed deeper than the break groove in the other direction. An electronic component substrate characterized by the above-mentioned.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10155093A JP3029821B2 (en) | 1998-06-04 | 1998-06-04 | Substrate for electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10155093A JP3029821B2 (en) | 1998-06-04 | 1998-06-04 | Substrate for electronic components |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2174096A Division JPH0710024B2 (en) | 1990-06-29 | 1990-06-29 | Substrate for electronic parts |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH1174105A true JPH1174105A (en) | 1999-03-16 |
JP3029821B2 JP3029821B2 (en) | 2000-04-10 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10155093A Expired - Fee Related JP3029821B2 (en) | 1998-06-04 | 1998-06-04 | Substrate for electronic components |
Country Status (1)
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004296952A (en) * | 2003-03-28 | 2004-10-21 | Tdk Corp | Electronic component and its outer layer forming method |
JP2008235670A (en) * | 2007-03-22 | 2008-10-02 | Rohm Co Ltd | Manufacturing method of chip resistor |
JP2009200192A (en) * | 2008-02-21 | 2009-09-03 | Koa Corp | Method of manufacturing ceramic substrate for chip parts and chip parts |
JP2012104687A (en) * | 2010-11-11 | 2012-05-31 | Murata Mfg Co Ltd | Manufacturing method for electronic components |
-
1998
- 1998-06-04 JP JP10155093A patent/JP3029821B2/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004296952A (en) * | 2003-03-28 | 2004-10-21 | Tdk Corp | Electronic component and its outer layer forming method |
JP2008235670A (en) * | 2007-03-22 | 2008-10-02 | Rohm Co Ltd | Manufacturing method of chip resistor |
JP2009200192A (en) * | 2008-02-21 | 2009-09-03 | Koa Corp | Method of manufacturing ceramic substrate for chip parts and chip parts |
JP2012104687A (en) * | 2010-11-11 | 2012-05-31 | Murata Mfg Co Ltd | Manufacturing method for electronic components |
Also Published As
Publication number | Publication date |
---|---|
JP3029821B2 (en) | 2000-04-10 |
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