JPH1174105A - Substrate for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate for electronic components which can be divided into pieces without causing defective shapes by extending breaking grooves at both the ends of the substrate in one direction to the edges of the substrate and forming the breaking grooves in one direction deeper than those in the other direction except at the breaking grooves at the both ends in the one direction. SOLUTION: Breaking grooves 2, 2', 3, and 3' are formed in a grid-like state on the surface of a substrate 1 except the frame-like peripheral edge sections 1a and 1b of the substrate 1. All of the grooves 2, 2', 3, and 3' are formed by press working, and the depths of the grooves 2', 3, and 3' are adjusted to about 5-50% of the thickness of the substrate 1. The depths of the breaking grooves 2 are adjusted so that the depth of the grooves 2 reach around the rear surface of the substrate 1. Here, since peripheral edge sections 1a and 1b are retained the substrate 1 is prevented from being broken into pieces at the grooves 2. Therefore, strip-like substrates can be obtained without generating defective shape, because the substrate 1 can be divided into substrates without causing defective shapes in the broken end faces of the substrates in one direction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a chip resistor,
The present invention relates to a substrate for electronic components applied to the production of electronic components such as jumper chips and hybrid ICs.

[0002]

2. Description of the Related Art To manufacture electronic components such as chip resistors, an alumina ceramic substrate 11 as shown in FIG.
Is used. On the surface of the substrate 11, break grooves 12,.
3,..., 13 are formed. Each break groove 12,1
As shown in FIGS. 9A and 9B, 3 is constituted by a slit S formed by press working or a slit S and a crack C generated by the slit S, and the depth thereof is the thickness of the substrate. It is about 5 to 50%.

In order to manufacture a chip resistor using the substrate 11, first, electrodes, resistors, and a glass protective film are collectively formed on each lattice on the surface of the substrate 11. This substrate is divided along the break grooves 12,..., 12 to form a strip-shaped substrate, and an end surface electrode is formed on a side end surface of the strip-shaped substrate.
The strip-shaped substrate is divided along the break grooves 13,..., 13 to obtain a final shape.

[0004]

In the above-mentioned conventional electronic component substrate, when dividing along a break groove, for example, a crack C 'runs obliquely as shown in FIG. There is a problem that causes a defect. FIG. 10 shows a chip resistor 18 having a defective end face shape.
1 "denotes a divided substrate, 17 denotes an end face electrode (hatched), and 16 denotes a glass protective film. Such a distorted chip resistor 18 has a problem in appearance. In addition, there is a problem that handling by the automatic mounting machine is hindered.

The present invention has been made in view of the above, and has as its object to provide an electronic component substrate that can be divided without causing a shape defect.

[0006]

According to a first aspect of the present invention, there is provided a substrate for electronic parts, wherein break grooves extending in one direction and the other direction are formed in a lattice shape. Wherein the break grooves are formed except for the peripheral edge of the substrate, and among the break grooves in one direction and the other direction, the break grooves located at both ends in one direction are extended to the substrate edge, The break grooves in one direction are formed deeper than the break grooves in other directions, except for the break grooves at both ends thereof.

Since the break grooves (slits or cracks of the slits and extensions thereof) are formed by controlling the conditions at the time of manufacturing the substrate, a stable shape is obtained in comparison with uncontrollable factors such as "folding" and "breaking" at the time of the break. It is expected that it can be secured. Even if the break grooves in one direction (excluding the break grooves at both ends) are made deeper than the break grooves in the other direction, for example, to reach the thickness of the substrate, the substrate is separated because the peripheral portion of the substrate remains. Does not. Therefore, as in the conventional case, it can be handled as an integrated substrate, and the formation of the electrodes and the like can be performed collectively.
Also, since the depth of the break groove in one direction is increased, the finish of the break end surface is good, and the electrode formation becomes easy.

[0008] The electronic component substrate according to the second aspect of the present invention is characterized in that:
In the form of a lattice, wherein the break grooves are formed in a lattice shape, the break grooves extending in the direction of the substrate and the other direction. The break grooves located at both ends in the other direction extend to the edge of the substrate, and the break grooves in the one direction are formed deeper than the break grooves in the other direction.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component substrate according to an embodiment of the present invention will be described below with reference to FIGS.
FIG. 1 is an external perspective view of a substrate 1 according to an embodiment of the present invention, and FIGS. 2A and 2B are Ib-I of FIG.
It is a principal part expanded sectional view in the b line and the Ic-Ic line. This substrate 1 is applied to the manufacture of a chip resistor, and is made of alumina ceramic.

On the surface of the substrate 1, frame-shaped peripheral portions 1a, 1
a, 1b, 1b, except for the break grooves 2 ', 2,.
2,3 ', 3, ..., 3,3' are formed in a lattice shape. Each of the break grooves 2, 2 ', 3, 3' is formed by press working, and is constituted by a slit S and a crack C generated by the slit S. The depth of the break grooves 2 ', 3, 3' is set to about 5 to 50% of the substrate thickness as in the conventional case. On the other hand, the depth of the break groove 2 is set to reach the rear surface of the substrate [FIG.
(See (b)). It may be penetrating. Since the substrate peripheral portions 1a and 1b (particularly 1a) are left, the substrate 1 does not fall apart due to the break grooves 2. In addition,
Depending on the conditions, as shown in FIG. 7, the substrate peripheral portions 1a, 1a
Only the break grooves 2 and 3 may not be formed.

Next, the manufacture of a chip resistor using the substrate 1 of the embodiment will be described. FIG. 3 shows a state in which the electrode 4, the resistor 5, and the protective film 6 are formed on the substrate 1, and FIG.
FIG. 4 is an enlarged sectional view of a main part taken along line IIb-IIb in FIG. 3. The electrode 4 is formed by screen-printing and firing a conductive paste such as silver-palladium. The resistor 5 is also formed by screen-printing and firing a resistor paste, and is formed in each grid so as to straddle the electrodes 4 and 4.
The resistance value of each resistor 5 is adjusted by laser trimming. The protective film 6 is also formed by, for example, screen-printing and firing a glass paste, and covers and protects the resistor 5.

Next, a break is made along the break grooves 2 ', 3', and the peripheral portions 1a, 1b are removed to form individual strip-shaped substrates 1 '(see FIG. 5). Since the depth of the break groove 2 has reached the thickness of the substrate, the substrate 1 is separated only by removing the peripheral edges 1a and 1b, so that operations such as "folding" and "fracturing" are unnecessary. Therefore, the shape defect of the substrate 1 'does not occur.

An end surface electrode 7 is formed on each side end surface 1c of the substrate 1 '(see FIGS. 6A and 6C). The end face electrode 7 includes a thick film electrode 7a formed by attaching and firing a conductive paste to the end face 1c, and a solder plating layer 7b formed on the thick film electrode 7a. Further, the substrate 1 'is divided by the break grooves 3,..., 3 into individual chip resistors 8,.
(B)). In this case, an operation such as “fold” or “divide” is required.

In the above embodiment, an example is shown in which the substrate of the present invention is applied to the manufacture of a chip resistor. However, the present invention can be applied to the manufacture of various electronic components such as jumper chips and hybrid ICs. is there.

[0015]

The electronic component substrate according to claims 1 and 2 of the present invention has the following effects since it is configured as described above. (1) Splitting can be performed without causing a shape defect at the end face of the break in the direction of 1, and almost no defective shape (burrs, defects, etc.) of the strip-shaped substrate after the division occurs. (2) If the peripheral edge of the substrate is removed first from the break grooves at both ends in the direction 1 and in the other direction, the middle portion (the portion inside the peripheral edge) is eventually broken to the substrate edge. This is the same as the case where the pattern is formed, and the displacement at the time of the break and the shape defect caused by the displacement from the desired pattern are eliminated. (3) In the case of claim 1, since the break grooves located at both ends in one direction of the break grooves in one direction and the other direction are extended to the substrate edge, they are extended to the substrate edge. When removing the substrate peripheral portion from the break groove, the substrate peripheral portion related to the break groove can be reliably removed along the break groove. (4) In the case of claim 2, since the break groove in one direction is deeper than the break groove in the other direction, if the substrate peripheral edges are removed from the break grooves located at both ends in the other direction, the break grooves are separated. It becomes easier to split.

[Brief description of the drawings]

FIG. 1 is an external perspective view of an electronic component substrate according to an embodiment of the present invention.

FIGS. 2A and 2B are an enlarged sectional view of a main part taken along line Ib-Ib of FIG. 1 and an enlarged cross-sectional view of a main part taken along line Ic-Ic of FIG.

FIG. 3 is a perspective view showing a state where electrodes and the like are formed on the surface of the electronic component substrate.

FIG. 4 is an enlarged sectional view of an essential part taken along line IIb-IIb in FIG. 3;

FIG. 5 is a perspective view showing a state in which a peripheral portion is removed from the electronic component substrate.

FIG. 6A is a perspective view showing a state in which an end surface electrode is formed on a side end surface of a substrate divided into a rod shape from the electronic component substrate,
It is a figure (b) explaining a state where a substrate divided into a rod shape is further divided into chip resistors, and an enlarged sectional view (c) along line IVc-IVc in (a).

FIG. 7 is an external perspective view showing a modification of the electronic component substrate.

FIG. 8 is an external perspective view of a conventional electronic component substrate.

9A is an enlarged sectional view taken along line VIb-VIb of FIG. 8, FIG. 9B is an enlarged sectional view taken along line VIc-VIc, and FIG. 9C is an enlarged sectional view illustrating an oblique crack in the conventional electronic component substrate. ).

FIG. 10 is an external perspective view of a chip resistor manufactured in an obliquely cracked state.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component substrate 1a, 1b Peripheral edge of substrate 2, 2 'Break groove in one direction 3, 3' Break groove in another direction

Claims (2)

[Claims] An electronic component substrate comprising break grooves extending in a grid and extending in one direction and the other direction, wherein the break grooves are formed excluding a peripheral portion of the substrate. Of the break grooves in the other direction, the break grooves located at both ends in one direction are extended to the substrate edge,
The electronic component substrate, wherein the break grooves in one direction are all formed deeper than the break grooves in other directions except for the break grooves at both ends thereof. 2. An electronic component substrate in which break grooves extending in one direction and the other direction are formed in a grid pattern, wherein the break grooves are formed except for a peripheral portion of the substrate. Of the break grooves in the other direction, the break grooves located at both ends in the other direction are extended to the edge of the substrate, and the break groove in the one direction is formed deeper than the break groove in the other direction. An electronic component substrate characterized by the above-mentioned.