JP4277633B2 - Manufacturing method of chip resistor - Google Patents

Description

The present invention particularly relates to a method of manufacturing a minute chip resistor .

Hereinafter, a conventional method of manufacturing a chip resistor will be described with reference to the drawings.

10 (a) to 10 (c) and FIGS. 11 (a) to 11 (d) show manufacturing process diagrams of a conventional chip resistor . FIGS. 10 (a) to 10 (c) and FIG. ) To (d), the manufacturing method will be described below.

  First, as shown in FIG. 10A, a sheet-like insulating substrate 3 made of porcelain such as alumina in which a primary dividing groove 1 and a secondary dividing groove 2 are formed in advance is prepared, and the upper surface of the insulating substrate 3 is prepared. In addition, a plurality of upper surface electrodes 4 are formed by screen printing so as to straddle the primary dividing grooves 1.

  Next, as shown in FIG. 10B, a plurality of back electrodes 5 are formed on the back surface of the sheet-like insulating substrate 3 by screen printing so as to straddle the primary dividing grooves 1.

  Next, as shown in FIG. 10C, a resistor 6 is formed on the upper surface of the insulating substrate 3 so as to partially overlap the plurality of upper surface electrodes 4 by screen printing. A trimming groove 7 is formed in the resistor 6 by a laser or the like so that the resistance value falls within a predetermined resistance value range.

  Next, as shown in FIG. 11A, a protective film 8 is formed by screen printing so as to cover at least the entire resistor 6.

  Next, a strip-shaped substrate 3a as shown in FIG. 11B is formed by dividing the primary dividing groove 1 shown in FIG. 11A.

  Next, as shown in FIG. 11B, end face electrodes 9 are formed on both end faces of the strip-shaped substrate 3a so as to be electrically connected to the upper face electrode 4 and the rear face electrode 5.

  Next, by dividing at the portion of the secondary dividing groove 2 in the strip-like substrate 3a shown in FIG. 11B, a piece-like substrate 3b as shown in FIG. 11C is configured.

Finally, as shown in FIG. 11 (d), after plating the surfaces of the top electrode 4, the back electrode 5 and the end electrode 9, the plating layer 10 is formed by applying the solder plating to form the conventional plating layer 10. Manufactured chip resistors .

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
Japanese Patent Laid-Open No. 7-86003

In the conventional chip resistor described above, an electrode paste or a resistor paste is screen-printed on the upper surface of the insulating substrate 3 and baked to form the upper electrode 4 and the resistor 6, and the electrode on the back surface of the insulating substrate 3. The back electrode 5 is formed by screen-printing and baking the paste, but the dimensional variation of the primary divided grooves 1 and the secondary divided grooves 2 provided on the insulating substrate 3 and the printing mask The position of the upper surface electrode 4 and the rear surface electrode 5 on the insulating substrate 3 varies due to variations in dimensions and alignment accuracy during screen printing, and the shape of the upper surface electrode 4 and the rear surface electrode 5 due to bleeding of the electrode paste. The dimensions were likely to vary.

Here, when bleeding of the electrode paste constituting the upper surface electrode 4 occurs, the effective length of the resistor 6 electrically connected to the upper surface electrode 4 varies, thereby forming the resistor 6. Later resistance value variations occur. Since the size of the bleeding of the electrode paste is substantially constant regardless of the geometry of the entire chip resistor (about 0.01 mm), as the effective length is short small chip resistor of the resistor 6, the upper electrode 4 The influence of the bleeding of the electrode paste constituting the film becomes relatively large, and the resistance value variation becomes very large. For example, since the effective length of the resistor 6 in a chip resistor having a total length of 1 mm is 0.3 mm as a standard, the influence of the blur of 0.01 mm is 3.3%, but the chip resistor having a total length of 0.6 mm Since the effective length of the resistor 6 at 0.2 is 0.2 mm, the influence of the blur of 0.01 mm becomes as large as 5%. The variation in resistance value can be corrected by forming the trimming groove 7 with a laser or the like. However, as the trimming groove 7 becomes longer and the remaining width of the resistor 6 becomes narrower , the power resistance of the chip resistor deteriorates. Normally, the trimming groove 7 is prevented from becoming too long by limiting the initial resistance value before the trimming groove 7 is formed. However, if the trimming groove 7 is out of the limit range of the resistance value, it is finally removed as a resistance value defect by the resistance value inspection. 7 is not formed, and many resistance values are included, and the yield deteriorates.

In addition, when the electrode paste composing the back electrode 5 bleeds or the printing position shifts, the size of the back electrode 5 varies, and therefore, when the chip resistor is mounted on the printed board, a short circuit between the electrodes occurs. In addition, since the Manhattan phenomenon (chip standing) is likely to occur, the dimensional accuracy of the back electrode 5 is also very important.

SUMMARY OF THE INVENTION The present invention solves the above-described conventional problems, and an object thereof is to provide a method for manufacturing a chip resistor that can eliminate the influence of bleeding and misalignment of the electrode paste constituting the top electrode and the back electrode. Is.

  In order to achieve the above object, the present invention has the following configuration.

According to the first aspect of the present invention, a step of forming a back electrode by screen-printing and baking a resinate paste on the back surface of a sheet-like substrate, and the opposite sides of the back electrode are removed by a laser. And a step of forming a position recognition mark with a laser on the back surface of the sheet-like substrate, and a top surface electrode by screen printing a resinate paste on the upper surface of the sheet-like substrate and baking it. A step of forming, a step of forming a primary dividing groove in a sheet-like substrate with reference to the position recognition mark, a step of forming a resistor between the upper surface electrodes, and a sheet shape so as to cover the resistor A step of forming a protective film on the upper surface of the substrate, a step of obtaining a strip-like substrate by dividing the sheet-like substrate along the primary dividing groove, and the strip-like shape A step of forming an end face electrode so as to electrically connect a top surface electrode and a back surface electrode to a side surface of the substrate, a step of obtaining a piece-like substrate by dividing or cutting the strip-shaped substrate, and the top surface electrode And a step of forming a plating layer covering the end face electrode and the back electrode, and according to this manufacturing method, the method includes a step of removing the opposite sides of the back electrode by a laser. Even if bleeding occurs in the electrode, the bleeding can be reliably removed by the laser, and the upper surface electrode and the primary dividing groove are formed on the back surface of the sheet-like substrate with reference to the position recognition mark formed by the laser. Since the upper electrode, the rear electrode, and the primary dividing groove can be prevented from being displaced, as a result, when the individual substrate is obtained, the rear electrode is separated into the individual substrate. It is possible to dimension accuracy formed against, short circuit between electrodes and Manhattan due to dimensional variations of the facing rear surface electrode (tombstone) phenomenon of suppression can be achieved. In addition, since the back electrode is formed by screen printing a resinate paste and firing, the resinate paste has a thin film thickness after firing of about 1 μm, and the bleeding generated in the back electrode composed of the resinate paste. Is removed with a laser as compared with the case of removing a normal thick film paste (with a film thickness of about 5 to 20 μm), and it is possible to remove the blur, and the laser necessary for removing this blur. Therefore, it is possible to reduce the cost of facilities and electricity costs.

According to a second aspect of the present invention, a step of forming a back electrode by screen-printing and baking a resinate paste on the back surface of a sheet-like substrate and removing opposite sides of the back electrode by a laser And a step of forming a position recognition mark with a laser on the back surface of the sheet-like substrate, and a top surface electrode by screen printing a resinate paste on the upper surface of the sheet-like substrate and baking it. A step of forming a resistor between the upper surface electrodes , a step of forming a protective film on the upper surface of the sheet-like substrate so as to cover the resistor, and a sheet-like shape based on the position recognition mark A step of obtaining a strip-shaped substrate by cutting the substrate, and an end face electrode so as to electrically connect the top electrode and the back electrode to the side surface of the strip-shaped substrate. A step of obtaining a piece-like substrate by dividing or cutting the strip-shaped substrate, and a step of forming a plating layer covering the exposed portion of the upper surface electrode, the end surface electrode, and the back surface electrode. Therefore, according to this manufacturing method, since the step of removing the opposite sides of the back electrode with a laser is provided, even if the bleeding occurs on the back electrode, the bleeding can be reliably removed by the laser. In addition, since the upper surface electrode is formed on the back surface of the sheet-like substrate with reference to the position recognition mark formed by the laser, and cutting to obtain a strip-like substrate is performed, the upper surface electrode and the back surface electrode Also, displacement of the cutting position can be prevented, and as a result, when it becomes a piece-like substrate, the back electrode can be formed with high dimensional accuracy on the piece-like substrate, Short circuit between electrodes and Manhattan due to dimensional variations in the back electrode countercurrent suppression (tombstone) phenomenon can be reduced. In addition, since the back electrode is formed by screen printing a resinate paste and firing, this resinate paste has a thin film thickness after firing of about 1 μm, and bleeding generated on the back electrode composed of the resinate paste. Is removed with a laser as compared with the case of removing a normal thick film paste (with a film thickness of about 5 to 20 μm), and it is possible to remove the blur, and the laser necessary for removing this blur. Therefore, it is possible to reduce the cost of facilities and electricity costs.

The invention described in claim 3 of the present invention, particularly, those having a step of removing by laser on the basis of the position recognition mark opposite sides of the upper electrode, according to this manufacturing method, according to claim 1 or In addition to the effects obtained by the manufacturing method described in 2, the bleeding of the upper surface electrode can be removed by a laser, so that dimensional variation between the upper surface electrodes can be suppressed, and thereby the resistor connected to the upper surface electrode Since the effective length is stabilized, the resistance value variation can be reduced, and as a result, the effect of improving the yield can be obtained.

The invention according to claim 4 of the present invention is such that, in particular, the periphery of the position where the position recognition mark is formed is covered with the same material as that of the upper surface electrode or the rear surface electrode. Since the position recognition mark can be formed on the sheet-like substrate by peeling the back electrode material, it is not necessary to process the sheet-like substrate itself, and the position recognition mark can be easily formed. Since the laser output required to form this position recognition mark can be small, the cost of equipment and electricity costs can be reduced, and the difference in hue between the sheet-like substrate and the top or back electrode can be used. Thus, the effect that the position recognition can be easily performed with high accuracy can be obtained.

In the invention according to claim 5 of the present invention, in particular, the position recognition mark is formed by a through-hole penetrating the sheet-like substrate. According to this manufacturing method, both the upper surface and the back surface of the sheet-like substrate are formed. Since the position recognition mark can be recognized from the reflected light from, for example, the position recognition mark formed from the upper surface of the sheet-like substrate needs to be recognized by the transmitted light necessary for recognizing from the back surface of the sheet-like substrate. As a result, it is possible to obtain an operational effect that the position can be easily recognized and the recognition accuracy can be improved.

According to a sixth aspect of the present invention, there is provided a step of simultaneously forming an upper surface electrode and a position recognition mark by screen-printing and baking a resinate paste on an upper surface of a sheet-like substrate, and a rear surface of the sheet-like substrate. Forming a back electrode by screen-printing and baking a resinate paste, removing the opposite sides of the back electrode with a laser based on the position recognition mark, and using the position recognition mark as a reference Forming a primary dividing groove in the sheet-like substrate, forming a resistor between the upper surface electrodes, forming a protective film on the upper surface of the sheet-like substrate so as to cover the resistor , A step of obtaining a strip-shaped substrate by dividing the sheet-shaped substrate along the primary dividing groove, and electrically connecting a top electrode and a back electrode on the side surface of the strip-shaped substrate. A step of forming an end face electrode so as to continue, a step of obtaining a piece-like substrate by dividing or cutting the strip-like substrate, and a plating layer covering the exposed portion of the top electrode, the end face electrode, and the back electrode According to this manufacturing method, since there is a step of removing opposite sides of the back electrode with a laser, even if the bleeding occurs on the back electrode, In addition, since the back electrode is removed and the primary divided grooves are formed on the basis of the position recognition mark formed on the surface of the sheet-like substrate, the top electrode and the back surface are removed. The positional displacement of the electrode and the primary dividing groove can also be prevented. As a result, when the substrate is a piece-like substrate, the back electrode can be formed with high dimensional accuracy on the piece-like substrate. , In which effect that a short circuit between electrodes and Manhattan due to dimensional variations of the facing rear surface electrode suppression (tombstone) phenomenon can be reduced is obtained.

According to a seventh aspect of the present invention, there is provided a step of simultaneously forming an upper surface electrode and a position recognition mark by screen-printing and baking a resinate paste on an upper surface of a sheet-like substrate, and a rear surface of the sheet-like substrate. Forming a back electrode by screen-printing and baking a resinate paste, a step of removing opposite sides of the back electrode by a laser with reference to the position recognition mark, and a resistor between the top electrodes Forming a protective film on the upper surface of the sheet-like substrate so as to cover the resistor, and cutting the sheet-like substrate by cutting the sheet-like substrate with reference to the position recognition mark. A step of forming an end face electrode so as to electrically connect a top electrode and a back electrode on a side surface of the strip-shaped substrate, and dividing or stripping the strip-shaped substrate. The method includes a step of obtaining an individual substrate by cutting, and a step of forming a plating layer covering the exposed portion of the upper surface electrode, the end surface electrode, and the back surface electrode. In this case, even if the back electrode is smeared, the smear can be surely removed by the laser, and the position formed on the upper surface of the sheet-like substrate. Since the reference electrode is used as a reference to remove the back electrode and perform cutting to obtain a strip-shaped substrate, it is possible to prevent displacement of the top electrode, the back electrode, and the cutting position. When it becomes a piece-like substrate, the back electrode can be formed with high dimensional accuracy on the piece-like substrate. Nhattan in which effect that attained suppression of (tombstone) phenomena is obtained.

Since the manufacturing method of the chip resistor of the present invention includes the step of removing the opposite sides of the back electrode with a laser after forming the back electrode on the back surface of the sheet-like substrate by a screen printing method, Even if the back electrode bleeds when the back electrode is formed on the back surface of the substrate by screen printing, the back electrode bleed can be reliably removed by the laser. Therefore, it is possible to suppress the dimensional variation in the width of the back electrode due to the above-described, and therefore, it is possible to suppress the short circuit between the electrodes and the Manhattan (chip standing) phenomenon due to the dimensional variation of the opposing back electrode .

(Embodiment 1)
1 (a) to 1 (d) and FIGS. 2 (a) to 2 (f) are manufacturing process diagrams showing a manufacturing method of the chip resistor in the first embodiment of the present invention.

Hereinafter, the manufacturing method of the chip resistor in the first embodiment of the present invention will be described with reference to FIGS. 1 (a) to (d) and FIGS. 2 (a) to (f).

  First, as shown in FIG. 1A, a sheet-like substrate 13 having an insulating property made of a ceramic such as alumina having a primary division groove 11 and a secondary division groove 12 formed in advance on the upper surface and the rear surface is prepared. Then, on the upper surface of the sheet-like substrate 13, a gold resinate paste mainly composed of gold so as to straddle the primary dividing grooves 11 is screen-printed, and fired with a firing profile having a peak temperature of 850 ° C. A top electrode 14 is formed. In this case, the plurality of upper surface electrodes 14 are formed to be slightly larger than the design target value. However, when the plurality of upper surface electrodes 14 are formed by screen printing, bleeding 14a occurs on opposite sides of the plurality of upper surface electrodes 14. is there.

  Next, as shown in FIG. 1B, opposing sides of the plurality of upper surface electrodes 14 are removed by a laser. Due to the removal by the laser, the blur 14a generated on the opposite sides of the plurality of upper surface electrodes 14 is removed, so that the upper surface electrode 14 has a dimension as designed. The removal of the blur 14 a by this laser is performed by dividing the upper surface electrode 14 into two by the primary dividing groove 11 and opposing upper surface electrodes in the substrate region surrounded by the primary dividing groove 11 and the secondary dividing groove 12. The primary division grooves 11 or the primary division grooves 11 may be formed on the basis of the reference marks created at the same time when the primary division grooves 11 or the primary division grooves 11 are formed so that the dimensions of 14 are substantially the same.

  Next, as shown in FIG.1 (c), the gold resinate paste which has gold as a main component is screen-printed on the back surface of the sheet-like board | substrate 13 so that the primary division | segmentation groove | channel 11 may be straddled, and peak temperature is 850 degreeC. The back electrode 15 is formed by baking with a baking profile. In this case, the plurality of backside electrodes 15 are formed slightly larger than the design target value. However, when the plurality of backside electrodes 15 are formed by screen printing, bleeding 15a or misalignment occurs on opposite sides of the plurality of backside electrodes 15. To do.

  Next, as shown in FIG. 1D, opposite sides of the plurality of back surface electrodes 15 are removed by laser. Due to the removal by the laser, the blur 15a generated on the opposing sides of the plurality of back surface electrodes 15 is removed, so that the back surface electrodes 15 have dimensions as designed. The removal of the blur 15 a by this laser is performed by dividing the back electrode 15 into two parts by the primary dividing groove 11 and opposing the back electrode 15 in the substrate region surrounded by the primary dividing groove 11 and the secondary dividing groove 12. It is preferable to finely adjust the irradiation position of the laser with reference to the reference mark created at the same time when forming the primary divided groove 11 or the primary divided groove 11 so that the dimensions of the laser beam are substantially the same.

  Next, as shown in FIG. 2A, a ruthenium oxide-based material is screen-printed so as to partially overlap the plurality of upper surface electrodes 14, that is, to be electrically connected to the plurality of upper surface electrodes 14. A plurality of resistors 16 are formed on the upper surface of the sheet-like substrate 13 and fired with a firing profile having a peak temperature of 850 ° C., thereby making the resistors 16 stable. When the resistor 16 is formed by screen printing, a blur 16a occurs on the side of the plurality of resistors 16 that is not connected to the upper surface electrode 14.

  Next, as shown in FIG. 2B, the sides of the plurality of resistors 16 that are connected to the upper surface electrode 14 and the sides that are not connected to the upper surface electrode 14 are removed by laser. By the removal by the laser, the bleeding 16a generated on the side of the plurality of resistors 16 not connected to the upper surface electrode 14 is removed. Further, as shown in FIG. 2B, the resistor 16 is trimmed by laser trimming to adjust the resistance value of the resistor 16 between the plurality of upper surface electrodes 14 to a constant value. A groove 17 is formed.

  Next, as shown in FIG. 2C, a protective film 18 mainly composed of a resin is formed by a screen printing method so as to cover at least the entire plurality of resistors 16, and a curing profile having a peak temperature of 200 ° C. The protective film 18 is made a stable film by curing with.

  Next, by dividing at the portion of the primary dividing groove 11 shown in FIG. 2 (c), a strip-shaped substrate 13a as shown in FIG. 2 (d) is formed, and both end surfaces of the strip-shaped substrate 13a are formed. Then, an end face electrode 19 is formed by coating so as to be electrically connected to the upper surface electrode 14 and the back surface electrode 15.

  Next, by dividing at the portion of the secondary dividing groove 12 in the strip-like substrate 13a shown in FIG. 2D, an individual substrate 13b as shown in FIG. 2E is configured.

Finally, as shown in FIG. 2 (f), after plating the surfaces of the upper surface electrode 14 and the end surface electrode 19 with nickel, the plating layer 20 is formed by applying solder plating or tin plating, and FIG. A chip resistor as shown in FIG.

In the cross-sectional view of the chip resistor shown in FIG. 3, the end face electrodes 19 are formed on both end faces of the strip-shaped substrate 13a so as to be electrically connected to the top face electrode 14 and the back face electrode 15. Is. The plating layer 20 is formed by performing nickel plating on the surface of the upper surface electrode 14, the surface of the end surface electrode 19, and the surface of the back electrode 15 and then performing solder plating or tin plating.

  In the first embodiment of the present invention, after the upper surface electrode 14 is formed on the upper surface of the sheet-like substrate 13 by the screen printing method that is thick film printing, the step of removing the opposing sides of the upper surface electrode 14 with a laser is performed. Therefore, even if the upper surface electrode 14 is formed on the upper surface of the sheet-like substrate 13 by the screen printing method, which is thick film printing, even if the upper surface electrode 14 has a blur 14a, the upper surface electrode 14 has a blur 14a. As a result, the dimensional variation between the upper surface electrodes 14 due to the blur 14a can be suppressed, so that the effective length of the resistor 16 connected to the upper surface electrode 14 is stabilized. As a result, since the resistance value distribution is reduced, the yield can be improved. Further, by removing the blur 14a by the laser with reference to the primary dividing groove 11, the effective portion of the resistor 16 (the portion excluding the overlapping portion with the upper surface electrode 14) is the center of the individual substrate 13b. Can be located.

  The top electrode 14 and the back electrode 15 in Embodiment 1 of the present invention are formed by screen-printing and baking a gold resinate paste containing gold as a main component. Since the film thickness after firing is as thin as about 1 μm, when removing the blur 14 a generated on the upper surface electrode 14 composed of the gold resinate paste with a laser, a normal thick film paste (film thickness of about 5 to 20 μm) ) Can be easily removed as compared with the case of removing), and the laser output required to remove this bleed 14a can be reduced, thereby reducing costs such as equipment and electricity costs. It has the effect that can be achieved.

In the first embodiment of the present invention, the back electrode 15 is formed on the back surface of the sheet-like substrate 13 by a screen printing method using thick film printing, and then the opposite sides of the back electrode 15 are removed by a laser. Therefore, even when the back electrode 15 is formed on the back surface of the sheet-like substrate 13 by the screen printing method, which is thick film printing, even if the bleeding 15a occurs in the back electrode 15, The blur 15a is surely removed by the laser, thereby suppressing the variation in the width of the back electrode 15 due to the blur 15a. Further, by removing the blur 15a by the laser with reference to the primary dividing groove 11, the dimensions of the opposite back electrodes on the individual substrate can be made substantially the same, so that the dimensional accuracy can be further improved. it can. As a result, when the chip resistor is mounted on the printed circuit board, it is possible to suppress the occurrence of a short circuit between electrodes and the occurrence of the Manhattan phenomenon (chip standing).

  Furthermore, in the first embodiment of the present invention, after the resistor 16 is formed on the upper surface of the sheet-like substrate 13 by the screen printing method that is thick film printing so as to be electrically connected to the upper surface electrode 14, Since the step of removing the side of the resistor 16 that is not connected to the upper surface electrode 14 with a laser is provided, the resistor 16 is formed on the upper surface of the sheet-like substrate 13 by a screen printing method that is thick film printing. In addition, even if the bleeding 16b occurs in the width direction of the resistor 16, that is, the side not connected to the upper surface electrode 14, the bleeding 16b in the width direction of the resistor 16 is surely removed by the laser. Thereby, since the dimensional variation in the width direction of the resistor 16 due to the blur 16b can be suppressed, the variation in the resistance value can be reduced. Further, the width of the resistor 16 is widened by the blur 16a, and the resistor 16 may be exposed on the side surface of the substrate when the sheet-like substrate 13 is divided. However, the resistor 16 is removed from the side surface of the substrate by removing the blur 16a. In other words, there is no plating adhesion to the resistor 16, and as a result, the reliability can be improved.

  In the first embodiment of the present invention, the primary dividing groove 11 and the secondary dividing groove 12 are formed on the upper surface and the back surface of the sheet-like substrate 13, respectively. However, the present invention is not limited to this. Instead, the primary dividing groove 11 and the secondary dividing groove 12 may be formed only on either the upper surface or the back surface of the sheet-like substrate 13.

In the first embodiment of the present invention, the case where the top electrode 14 and the back electrode 15 are formed in a discontinuous pattern has been described. However, the top electrode 14 and the back electrode 15 are formed in a pattern continuous in a direction orthogonal to the primary dividing groove 11. In addition, the space between the primary division grooves 11 may be removed with a laser, and in this case as well, the same function and effect as those of the first embodiment of the present invention can be obtained.

(Embodiment 2)
4 (a) to (d), FIGS. 5 (a) to (d) and FIGS. 6 (a) to (c) are manufacturing process diagrams showing a manufacturing method of the chip resistor according to the second embodiment of the present invention. is there.

Hereinafter, with reference to FIGS. 4A to 4D, FIGS. 5A to 5D, and FIGS. 6A to 6C regarding the chip resistor manufacturing method according to the second embodiment of the present invention. While explaining.

  First, as shown in FIG. 4A, an insulating sheet-like substrate 21 made of a porcelain such as alumina having no dividing groove is prepared. Then, a gold resinate paste containing gold as a main component is screen-printed on the back surface of the sheet-like substrate 21 and fired with a firing profile having a peak temperature of 850 ° C., whereby a plurality of back surface electrodes 22 and bases 23 for position recognition marks are obtained. Form. In this case, the plurality of back surface electrodes 22 are formed slightly larger than the design target value. However, when the plurality of back surface electrodes 22 are formed by screen printing, bleeding 22a occurs on opposite sides of the plurality of back surface electrodes 22. is there. The base 23 is provided in a portion of the sheet-like substrate 21 that does not become a product.

  Next, as shown in FIG. 4B, the opposing sides of the plurality of back surface electrodes 22 are removed by laser, and the base 23 is partially removed by laser to form a cross-shaped position recognition mark 24. To do. By removing the opposing sides by the laser, the blur 22a generated on the opposing sides of the plurality of back electrodes 22 is removed, so that the back electrodes 22 have dimensions as designed. Further, in order to perform position recognition using the position recognition mark 24, it is necessary to provide at least two position recognition marks 24 on the sheet-like substrate 21. It is desirable to provide three or more recognition marks 24, and it is desirable to provide the recognition marks 24 in a portion near the outer frame of the sheet-like substrate 21. In Embodiment 2 of the present invention, the position recognition marks 24 are provided at four locations that are portions near the four corners of the sheet-like substrate 21.

  Next, as shown in FIG. 4C, gold is mainly formed on the upper surface of the sheet-like substrate 21 while finely adjusting the position with reference to the position recognition mark 24 formed on the back surface of the sheet-like substrate 21. The upper surface electrode 25 is formed by screen-printing the gold resinate paste and baking with a baking profile having a peak temperature of 850 ° C. At this time, the upper surface electrode 25 is disposed at a position substantially opposite to the rear surface electrode 22 with the sheet-like substrate 21 interposed therebetween. In this case, the plurality of upper surface electrodes 25 are formed to be slightly larger than the design target value. However, when the plurality of upper surface electrodes 25 are formed by screen printing, bleeding 25a and displacement occur on opposite sides of the plurality of upper surface electrodes 25. To do.

  Next, as shown in FIG. 4D, the position recognition marks 24 formed on the back surface of the sheet-like substrate 21 are recognized by the transmitted light, and the opposite sides of the plurality of upper surface electrodes 25 are adjusted finely. Are removed by a laser. By this removal by the laser, the blur 25a generated on the opposing sides of the plurality of upper surface electrodes 25 is removed, and the back surface electrode 22 and the upper surface electrode 25 are adjusted to a position facing each other with the sheet-like substrate 21 interposed therebetween.

  Next, as shown in FIG. 5 (a), a screen printing method is used to make a stenium oxide-based material so as to partially overlap the plurality of upper surface electrodes 25, that is, to be electrically connected to the plurality of upper surface electrodes 25. A plurality of resistors 26 are formed on the upper surface of the sheet-like substrate 21 and fired with a firing profile having a peak temperature of 850 ° C., thereby making the resistors 26 stable. When the resistor 26 is formed by screen printing, a blur 26a is generated on the side of the plurality of resistors 26 that is not connected to the upper surface electrode 25.

  Next, as shown in FIG. 5B, the side of the plurality of resistors 26 that is not connected to the upper surface electrode 25 is irradiated with a laser to remove the blur 26a.

  Next, as shown in FIG. 5C, the position recognition mark 24 formed on the back surface of the sheet-like substrate 21 is recognized by transmitted light, and the position of the sheet-like substrate 21 is adjusted by a laser while finely adjusting the position. A primary dividing groove 27 and a secondary dividing groove 28 are formed on the upper surface, and further, trimming is performed by laser trimming in order to adjust the resistance value of the resistor 26 between the plurality of upper surface electrodes 25 to a constant value. A groove 29 is formed. The position of the primary dividing groove 27 is adjusted so that the effective portion of the resistor 26, that is, the portion of the resistor 26 that does not overlap with the upper surface electrode 25 is approximately in the middle between the plurality of primary dividing grooves 27. The secondary dividing groove 28 is configured so that the resistor 26 is substantially at the center between the secondary dividing grooves 28. The primary divided groove 27 and the secondary divided groove 28 may be formed after the trimming groove 29 is formed, but the substrate 21 becomes hot when the primary divided groove 27 and the secondary divided groove 28 are formed. Since the resistance value may fluctuate, it is better to perform it before the trimming groove 29 is formed, or after the position recognition mark 24 or the upper surface electrode 25 is formed.

  Next, as shown in FIG. 5D, a protective film 30 mainly composed of a resin is formed by a screen printing method so as to cover at least the entire plurality of resistors 26, and a curing profile having a peak temperature of 200 ° C. The protective film 30 is made a stable film by curing.

  Next, the sheet-like substrate 21 is divided at a portion of the primary dividing groove 27 shown in FIG. 5D, and a resin electrode is applied to the end surface that appears by the division, and the end electrode 31 is formed by curing. Then, a strip-shaped substrate 21a as shown in FIG. Note that a part of the end face electrode 31 extends around the upper and lower surfaces of the strip-shaped substrate 21 a so as to be electrically connected to the upper surface electrode 25 and the rear surface electrode 22.

  Next, by dividing at the portion of the secondary dividing groove 28 in the strip-like substrate 21a shown in FIG. 6A, a piece-like substrate 21b as shown in FIG. 6B is configured.

Finally, as shown in FIG. 6 (c), the exposed portion of the upper surface electrode 25 and the surfaces of the end surface electrode 31 and the back surface electrode 22 are subjected to nickel plating, and then subjected to solder plating or tin plating, whereby a plating layer 32 is obtained. To form a chip resistor .

In the above-described chip resistor manufacturing method according to the second embodiment of the present invention, in addition to the effects of the first embodiment of the present invention, the position recognition formed at the same time when the bleeding 22a of the back electrode 22 is removed by the laser. Since the removal of the blur 25a of the upper surface electrode 25 and the formation of the primary divided groove 27 are performed with reference to the mark 24, the positional relationship between the upper surface electrode 25 and the primary divided groove 27 can be matched with high accuracy. As a result, the dimensions of the back electrode 22 can be formed with high accuracy, and therefore, the short circuit between electrodes and the Manhattan phenomenon can be suppressed. Further, since the upper surface electrode 25 and the back surface electrode 22 can be aligned without forming the primary division grooves 27 on both surfaces of the substrate 21, the cost is lower than the case where the primary division grooves 27 are formed on both surfaces. It has the effect that can be reduced.

  Further, since the gold base 23 is formed of the same material as that of the back electrode 22, that is, a gold resinate paste, only a part of the base 23 is removed by a laser to expose the white sheet-like substrate 21 made of alumina. Thus, the position recognition mark 24 can be easily formed. As a result, the required laser output can be reduced as compared with the case of directly processing the substrate 21 without the base 23, so that the equipment and the electricity bill The cost can be reduced, and by using the difference in hue between the substrate 21 and the base 23, the effect of easily recognizing the position can be obtained.

  In the second embodiment of the present invention, the position recognition mark 24 is formed on the back surface of the sheet-like substrate 21, but it may be formed on the upper surface of the sheet-like substrate 21. The base 23 of the position recognition mark 24 is formed of the same material as that of the upper surface electrode 25, and the formation of the back surface electrode 22 and the bleeding 22a by the laser are performed based on the position recognition mark 24 formed on the upper surface of the sheet-like substrate 21. If the removal is performed with reference to the formation of the primary dividing grooves 27, the same effects as those of the second embodiment of the present invention can be obtained.

  In the second embodiment of the present invention, the case where the cross-shaped position recognition mark 24 is formed by partially removing the base 23 formed on the back surface of the sheet-like substrate 21 with a laser has been described. The position recognition mark 24 may have a shape other than a cross, for example, a circle or a key shape. Further, even if the base 23 of the position recognition mark 24 is not provided and the position recognition mark 24 is directly processed and formed on the sheet-like substrate 21, the same effect as that of the second embodiment of the present invention can be obtained. It is.

  In the second embodiment of the present invention, the cross-shaped position recognition mark 24 is formed by partially removing the base 23 formed on the back surface of the sheet-like substrate 21 with a laser. However, when the back electrode 22 or the top electrode 25 is printed, the position recognition mark 24 may be formed with a print pattern at the same time. In this case, the same effect as that of the second embodiment of the present invention can be obtained. Is.

  Further, in the second embodiment of the present invention, the case where the primary divided grooves 27 and the secondary divided grooves 28 are formed on the upper surface of the sheet-like substrate 21 has been described. The dividing grooves 28 may be formed on the back surface of the sheet-like substrate 21 or on both the upper surface and the back surface of the sheet-like substrate 21.

(Embodiment 3)
7 (a) to (d), FIGS. 8 (a) to (d) and FIGS. 9 (a) to (d) are manufacturing process diagrams showing a manufacturing method of the chip resistor according to the third embodiment of the present invention. is there.

Hereinafter, the manufacturing method of the chip resistor according to the third embodiment of the present invention will be described with reference to FIGS. 7A to 7D, FIGS. 8A to 8D, and FIGS. 9A to 9D. While explaining.

  First, as shown in FIG. 7A, an insulating sheet-like substrate 33 made of a porcelain such as alumina having no dividing groove is prepared. Then, a gold resinate paste containing gold as a main component is screen-printed on the upper surface of the sheet-like substrate 33 and fired with a firing profile having a peak temperature of 850 ° C., thereby forming a plurality of upper surface electrodes 34. In this case, the plurality of upper surface electrodes 34 are formed to be slightly larger than the design target value. However, when the plurality of upper surface electrodes 34 are formed by screen printing, bleeding 34a occurs on opposite sides of the plurality of upper surface electrodes 34. is there.

  Next, as shown in FIG. 7B, the opposing sides of the plurality of upper surface electrodes 34 are removed by a laser, and further, the sheet-like substrate 33 is formed at four locations near the four corners of the sheet-like substrate 33 by the laser. The position recognition mark 35 penetrating through is formed. By removing the opposite sides by the laser, the blur 34a generated on the opposite sides of the plurality of upper surface electrodes 34 is removed, so that the upper surface electrodes 34 have dimensions as designed.

  Next, as shown in FIG. 7C, gold is used as a main component on the back surface of the sheet-like substrate 33 while finely adjusting the position by the position recognition mark 35 formed so as to penetrate the sheet-like substrate 33. The back electrode 36 is formed by screen-printing a gold resinate paste to be fired and firing it with a firing profile having a peak temperature of 850 ° C. In this case, the plurality of backside electrodes 36 are formed slightly larger than the design target value. However, when the plurality of backside electrodes 36 are formed by screen printing, bleeding 36a and positional deviation occur on the opposite sides of the plurality of backside electrodes 36. To do.

  Next, as shown in FIG. 7D, the opposing sides of the plurality of backside electrodes 36 are removed with a laser while finely adjusting the position with the position recognition mark 35 formed so as to penetrate the sheet-like substrate 33. To do. By this removal by the laser, the blur 36 a generated on the opposite sides of the plurality of back surface electrodes 36 is removed, and the back surface electrode 36 and the top surface electrode 34 are adjusted to a position facing each other with the substrate 33 interposed therebetween.

  Next, as shown in FIG. 8A, a ruthenium oxide-based material is screen-printed so as to partially overlap the plurality of upper surface electrodes 34, that is, to be electrically connected to the plurality of upper surface electrodes 34. A plurality of resistors 37 are formed on the upper surface of the sheet-like substrate 33 and fired with a firing profile having a peak temperature of 850 ° C., thereby making the resistors 37 stable. When the resistor 37 is formed by screen printing, a bleed 37a is generated on the side of the plurality of resistors 37 that is not connected to the upper surface electrode 34.

  Next, as shown in FIG. 8B, the side of the plurality of resistors 37 that is not connected to the upper surface electrode 34 is irradiated with laser to remove the blur 34 a and the resistance between the plurality of upper surface electrodes 34. In order to adjust the resistance value of the body 37 to a constant value, trimming is performed by a laser trimming method to form a trimming groove 38.

  Next, as shown in FIG. 8C, a protective film 39 containing a resin as a main component is formed by screen printing so as to cover at least the entire plurality of resistors 37, and a curing profile having a peak temperature of 200 ° C. The protective film 39 is made a stable film by curing with.

  Next, as shown in FIG. 8D, a sheet-like substrate is formed on the sheet-like substrate 33 by a dicing method while finely adjusting the position with a position recognition mark 35 formed so as to penetrate the sheet-like substrate 33. A first slit 40 penetrating 33 in the thickness direction is formed. At this time, the first slit 40 is formed to be shorter than the width of the sheet-like substrate 33, and the portions where the first slit 40 is not formed are left at both end portions of the sheet-like substrate 33, so that the sheet-like substrate is formed. 33 is an assembly of a plurality of strip-shaped substrates 33a. In this case, the 1st slit 40 is provided in the position which divides the back surface electrode 36 and the upper surface electrode 34 into two equally. In the case of a square chip resistor having a length of 0.6 mm, the width of the first slit 40 is 0.1 mm, and the pitch of the first slit 40 is 0.7 mm.

  Next, as shown in FIG. 9A, a metal mask 41 having a through-groove having a width wider than that of the first slit 40 at the same pitch (ie, 0.7 mm) as that of the first slit 40 is formed in a sheet shape. The upper surface of the substrate 33 is bonded to the upper surface of the substrate 33 so that the grooves of the first slit 40 and the metal mask 41 overlap, and a metal material such as NiCr is sputtered from the upper surface side of the sheet substrate 33. An end face electrode 42 made of a metal thin film is formed on a part of the first slit 40 and the inner surface of the first slit 40.

  Next, as shown in FIG. 9B, a second slit 43 is formed in the sheet-like substrate 33 in a direction that does not cut the resistor 37 in a direction orthogonal to the first slit 40. Then, the substrate is divided into individual substrate 33b as shown in FIG.

Finally, as shown in FIG. 9 (d), the exposed portion of the upper surface electrode 34 and the surfaces of the end surface electrode 42 and the back surface electrode 36 made of a metal thin film are subjected to nickel plating, and then subjected to solder plating or tin plating. Then, a plating layer 44 is formed to manufacture a chip resistor .

In the above-described chip resistor manufacturing method according to the third embodiment of the present invention, in addition to the effects of the first and second embodiments of the present invention, the longitudinal dimension of the individual substrate 33b is dicing. Since it is determined by the interval between the first slits 40 formed by the construction method, there is no occurrence of division burrs as in the case of division by the primary division grooves. As a result, the dimensions are stabilized and the same position recognition mark 35 is obtained. Therefore, the blur 36a generated on the opposite side of the back electrode 36 is removed and the shape of the first slit 40 is formed. Therefore, the first slit 40 is accurately placed in the center of the back electrode 36. As a result, it is possible to form the back surface electrode dimensions of the individual substrate 33b with high accuracy, and therefore, a short circuit between electrodes and a Manhattan phenomenon. In which the effect of being able to suppress obtained.

  In the third embodiment of the present invention, since position recognition is performed by the position recognition mark 35 formed so as to penetrate the sheet-like substrate 33, position recognition is performed using transmitted light. Compared to the above, position recognition by reflected light can be performed on both the upper surface and the back surface of the sheet-like substrate 33 much more easily. As a result, the dimensional accuracy of the back electrode 36 can be improved.

  In the third embodiment of the present invention, the end surface electrode 42 made of a metal thin film is formed by sputtering from the upper surface side of the sheet-like substrate 33. An end face electrode 42 made of a metal thin film may be formed by attaching a metal mask 41 and sputtering from the back side of the sheet-like substrate 33.

Further, in the third embodiment of the present invention, the blur 34a generated on the opposite side of the upper surface electrode 34 is removed by the laser, and then the sheet-like substrate is formed from the upper surface side of the sheet-like substrate 33 by the laser. The position recognition mark 35 penetrating the sheet-like substrate 33 is described. However, the position recognition mark 35 penetrating the sheet-like substrate 33 from the back side of the sheet-like substrate 33 is first formed by a laser, and then this position is Even when the blur 34a generated on the opposite side of the upper surface electrode 34 is removed by the laser with the recognition mark 35 as a reference, the same effect as in the third embodiment of the present invention can be obtained.

  In the third embodiment of the present invention, the case where the sheet-like substrate 33 is an assembly of a plurality of strip-like substrates 33a by the first slit 40 has been described. The strip-shaped substrate 33a may be completely cut to form a strip-shaped substrate 33a, and an end face electrode may be formed on the strip-shaped substrate 33a by coating or the like. However, in this case, the position recognition necessary for cutting the sheet-like substrate 33 into the piece-like substrate 33b can be performed by using the assembly of the strip-like substrates 33a in a single position recognition. In addition, since the second slit 43 can be simultaneously formed on a plurality of strip-shaped substrates 33a, the sheet-shaped substrate 33 is not completely cut by the first slit 40. Is more desirable.

The manufacturing method of the chip resistor according to the present invention is to remove the bleeding of the back electrode with a laser even if the back electrode is smeared when the back electrode is formed on the back surface of the sheet-like substrate by screen printing. Therefore, it is possible to suppress back electrode width variation due to back electrode bleeding and displacement, and to suppress short-circuiting between electrodes and Manhattan (chip standing) phenomenon due to back surface electrode size variations. In particular, it is useful when applied to a minute chip resistor .

(A)-(d) Manufacturing process figure which shows the manufacturing method of the chip resistor in Embodiment 1 of this invention. (A)-(f) Manufacturing process figure which shows the manufacturing method of the chip resistor Cross section of the chip resistor (A)-(d) Manufacturing process figure which shows the manufacturing method of the chip resistor in Embodiment 2 of this invention. (A)-(d) Manufacturing process figure which shows the manufacturing method of the chip resistor (A)-(c) Manufacturing process figure which shows the manufacturing method of the chip resistor (A)-(d) Manufacturing process figure which shows the manufacturing method of the chip resistor in Embodiment 3 of this invention. (A)-(d) Manufacturing process figure which shows the manufacturing method of the chip resistor (A)-(d) Manufacturing process figure which shows the manufacturing method of the chip resistor (A)-(c) Manufacturing process figure which shows the manufacturing method of the conventional chip resistor (A)-(d) Manufacturing process figure which shows the manufacturing method of the chip resistor

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Primary division groove 12 Secondary division groove 13 Sheet-like board | substrate 13a Strip-like board | substrate 13b Piece-like board | substrate 14 Upper surface electrode 14a Bleeding 15 Back surface electrode 15a Bleeding 16 Resistor 16a Bleeding 18 Protective film 19 End surface electrode 21 Sheet-like Substrate 21a strip-shaped substrate 21b piece-like substrate 22 back surface electrode 22a blur 24 position recognition mark 25 upper surface electrode 25a blur 26 resistor 26a blur 27 primary split groove 28 secondary split groove 30 protective film 31 end face electrode 33 sheet Substrate 33a strip substrate 33b piece substrate 34 upper surface electrode 34a blur 35 position recognition mark 36 back electrode 36a blur 37 resistor 37a blur 39 protective film 40 first slit 42 end electrode 43 second slit

Claims (7)

A step of forming a back electrode by screen printing a resinate paste on the back side of the sheet-like substrate and firing, and removing opposite sides of the back-side electrode with a laser, and positioning the laser on the back side of the sheet-like substrate Forming a recognition mark; forming a top surface electrode by screen-printing and baking a resinate paste on the upper surface of the sheet-like substrate on the basis of the position recognition mark; and using the position recognition mark as a reference. Forming a primary dividing groove in the sheet-like substrate, forming a resistor between the upper surface electrodes, forming a protective film on the upper surface of the sheet-like substrate so as to cover the resistor, , A step of obtaining a strip-shaped substrate by dividing the sheet-shaped substrate along the primary dividing groove, and an upper surface electrode and a back surface electrode on a side surface of the strip-shaped substrate. A step of forming an end face electrode so as to be electrically connected; a step of obtaining a piece-like substrate by dividing or cutting the strip-like substrate; an exposed portion of the upper surface electrode, an end surface electrode, and a back electrode; And a step of forming a plating layer to cover the chip resistor. A step of forming a back electrode by screen printing a resinate paste on the back side of the sheet-like substrate and firing, and removing opposite sides of the back-side electrode with a laser, and positioning the laser on the back side of the sheet-like substrate Forming a recognition mark; forming a top surface electrode by screen-printing and baking a resinate paste on the top surface of the sheet-like substrate on the basis of the position recognition mark ; and a resistor between the top surface electrodes Forming a protective film on the upper surface of the sheet-like substrate so as to cover the resistor, and cutting the sheet-like substrate by cutting the sheet-like substrate with reference to the position recognition mark. A step of forming an end face electrode so as to electrically connect a top electrode and a back electrode on a side surface of the strip-shaped substrate, and the strip-shaped substrate. Obtaining a piece-like substrate by splitting or cutting, manufacturing method of the chip resistor and forming a plating layer covering the exposed portion and the end surface electrode and the back electrode of the upper electrode. Method of manufacturing a side opposite of the upper electrode with respect to the position recognition mark chip resistor according to claim 1 or 2, wherein comprising a step of removing by laser. Method for producing a chip resistor according to claim 1, the periphery was covered with the same material as the upper electrode or the backside electrode of the position for forming a position recognition mark. The manufacturing method of the chip resistor according to any one of claims 1 to 4 , wherein the position recognition mark is formed by a through hole penetrating the sheet-like substrate . By simultaneously printing a resinate paste on the upper surface of a sheet-like substrate and firing it, and simultaneously forming an upper surface electrode and a position recognition mark, by screen-printing and firing the resinate paste on the back surface of the sheet-like substrate A step of forming a back electrode, a step of removing opposite sides of the back electrode by a laser based on the position recognition mark, and forming a primary dividing groove on a sheet-like substrate based on the position recognition mark A step of forming a resistor between the upper surface electrodes, a step of forming a protective film on the upper surface of the sheet-like substrate so as to cover the resistor, and a sheet-like shape along the primary dividing groove A step of obtaining a strip-shaped substrate by dividing the substrate, and an end surface electrode is formed on the side surface of the strip-shaped substrate so as to electrically connect the top electrode and the back electrode. Degree and, obtaining a piece-like substrate by splitting or cutting the strip-shaped substrate, chip and forming a plating layer covering the exposed portion and the end surface electrode and the back electrode of the upper electrode Manufacturing method of resistors. By simultaneously printing a resinate paste on the upper surface of a sheet-like substrate and firing it, and simultaneously forming an upper surface electrode and a position recognition mark, by screen-printing and firing the resinate paste on the back surface of the sheet-like substrate A step of forming a back electrode, a step of removing opposite sides of the back electrode by a laser with reference to the position recognition mark, a step of forming a resistor between the top electrodes , and covering the resistor Forming a protective film on the upper surface of the sheet-shaped substrate, obtaining a strip-shaped substrate by cutting the sheet-shaped substrate on the basis of the position recognition mark, and on the side surface of the strip-shaped substrate A step of forming an end face electrode so as to electrically connect the upper surface electrode and the rear surface electrode, and a piece-like substrate by dividing or cutting the strip-like substrate Process and, chip resistor manufacturing method that includes a step of forming a plating layer covering the exposed portion and the end surface electrode and the back electrode of the upper electrode to obtain.

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