JP4741355B2 - Chip-type electronic components - Google Patents

Description

  The present invention relates to a chip-type electronic component, and in particular, a chip substrate is formed by dividing a large-sized substrate in which a dividing groove is formed, such as a chip resistor, and the chip-type electronic component comprising the chip substrate. It is about.

  Conventionally, in a chip-type electronic component made of a ceramic chip substrate such as a chip resistor, a dividing groove is formed in advance in a lattice shape on a ceramic large substrate, and electrodes and resistors are formed on the large substrate. After forming a required structure such as a body, it is divided along a dividing groove to form individual chip substrates, and chip-type electronic components are formed using this chip substrate as a base.

  Here, the manufacturing process of the chip resistor, which is one form of the chip electronic component, will be briefly described with reference to FIG. 6. As shown in FIG. A plurality of first grooves 110 parallel to each other and a plurality of second grooves 120 orthogonal to the first grooves 110 are provided to form a rectangular chip substrate region 130.

  Next, as shown in FIG. 6B, an electrode paste is applied to the ceramic large-sized substrate 100 across the first groove 110, and the electrode paste is sintered to form the electrode 140. Since the electrode 140 is formed across the first groove 110, the first groove 110 is filled with an electrode metal.

  By forming the electrode 140 across the first groove 110 in this manner, the electrodes 140 and 140 are arranged on the side edges along the first groove 110 in the chip substrate region 130, respectively, as shown in FIG. As shown, a resistor 150 is formed by applying and sintering a resistor paste between the electrodes 140 and 140.

  Next, as shown in FIG. 6 (d), a first protective glass layer 160 is formed on the upper surface of the resistor 150 by printing and sintering a glass paste, and then, as shown in FIG. 6 (e). The resistance value is adjusted while forming a trimming groove 170 on the resistor 150 by laser trimming.

  After adjusting the resistance value, as shown in FIG. 6F, an overcoat layer 180 is formed on the upper surface of the resistor 150 by printing and sintering a glass paste.

  After the overcoat layer 180 is formed, the large substrate 100 is divided along the first groove 110 to form a bar-shaped substrate 200 in which the chip substrates 300 are arranged in a row as shown in FIG. A side electrode 210 is formed by applying and sintering an electrode paste on the exposed surface of the bar-shaped substrate 200 exposed as a result of division in one groove 110, and then forming the bar-shaped substrate 200 along the second groove 120. Are divided into individual chip substrates 300 (see, for example, Patent Document 1).

The chip substrate 300 is further plated to form a solder film on the side electrode 210 portion, thereby forming a chip resistor as a product.
JP 2001-118705 A

  However, as the substrate thickness of the large format substrate becomes thinner with the recent demand for further miniaturization of chip-type electronic components, the large format substrate is divided by the first groove and the second groove provided on the large format substrate. In addition, the tendency for the divided end face to be difficult to become a clean flat sectional surface has become apparent.

  In particular, when dividing the large substrate into the bar-shaped substrate in the first groove, the first groove is filled with the metal for the electrode by the electrode formed across the first groove. The metal for electrodes filled in the metal acts so as to inhibit the division, and the shape of the cross section of the large substrate in the first groove is further distorted, which may cause a defect.

  Specifically, as shown in FIG. 7, when the large-sized substrate 100 is divided between the upper surface first groove 110a formed on the upper surface of the large-sized substrate 100 and the lower surface first groove 110b formed on the lower surface of the large-sized substrate. In addition, when the crack formed with the upper surface first groove 110a as a base point reaches the position deviated from the lower surface first groove 110b, the dividing surface may not be flat. In FIG. 7, 140a is an upper surface electrode provided on the upper surface of the large substrate 100 across the upper surface first groove 110a, and 140b is a lower surface electrode provided on the lower surface of the large substrate 100 across the lower surface first groove 110b.

  In particular, when the protruding piece 400 including the lower surface first groove 110b is formed on the lower surface side of the large-sized substrate 100 as in the right-side substrate of FIG. 7, the lower electrode 140b is peeled off at the protruding piece 400 portion. This is likely to occur, and the bottom electrode 140b is peeled off to cause a defect.

  In addition, since the adhesion between the lower surface electrode 140b and the substrate is likely to decrease until the lower surface electrode 140b is not peeled off, the lower surface electrode 140b may be peeled off from the substrate after being mounted on the mounting substrate, which may cause a defect. there were.

  On the other hand, as shown in the left side of FIG. 7, the receding edge 500 that is reversely receded with the formation of the protruding piece 400 described above is a divided section formed when the large-sized substrate 100 is normally divided. If the side electrode is formed by applying the electrode paste that becomes the side electrode to this cross section, it may cause a disconnection due to an inrush current due to insufficient contact area. was there.

  Furthermore, when the lower surface electrode 140b at the receding edge 500 has a defect, the electrode paste does not reach the receding edge 500, so that the lower surface electrode 140b and the side electrode may become non-conductive.

  In view of the present situation, the present inventor has ensured that the divided cross section formed when the large substrate is divided is as flat as possible, and the electrodes and the side electrodes provided on the upper and lower surfaces of the chip substrate are securely connected. Research and development has been carried out to enable conduction, and the present invention has been achieved.

In the chip-type electronic component of the present invention, a plurality of first grooves parallel to each other and a plurality of second grooves perpendicular to the first grooves are provided to form a rectangular chip substrate region. A chip type comprising a chip substrate formed by dividing a large substrate having electrodes formed on the side edges along the first groove in the chip substrate region along the first groove and the second groove, respectively. in the electronic component, the large substrate is the addition to form the top and bottom surfaces said electrodes by spaced apart from the first groove in each, the electrode formation region of the large-sized substrate that these electrodes are formed stepped Each of the chip substrate is provided with a thin portion on both sides of the chip substrate , and the step is formed by a groove recessed along the first groove. The electrode away from the part Respectively to form.

Further, the first groove is characterized in that it is formed by irradiating a large substrate with laser light, and the edge of the first groove is protruded sharply upward.
In addition, a bowl-shaped groove is formed along the first groove.

According to the first aspect of the present invention, a plurality of first grooves parallel to each other and a plurality of second grooves orthogonal to the first grooves are provided to form a rectangular chip substrate region. Chip-type electron comprising a chip substrate formed by dividing a large substrate having electrodes formed on side edges along the first groove in the substrate region along the first groove and the second groove, respectively. in part, the large-sized substrate, and forming the upper surface and the electrode by spaced apart from the first groove on the lower surface, respectively, a step in the electrode formation region of the large-sized substrate that these electrodes are formed Each of the chip substrates is provided with a thin portion on both sides of the chip substrate , and the step is formed by a groove recessed along the first groove. Separate the electrodes from each other. By forming, it is possible to prevent the metal of the electrode is filled in the first groove, it is possible to perform a reliable division of the large-sized substrate according to the first groove.

According to a second aspect of the present invention, in the chip-type electronic component according to the first aspect, the first groove is formed by irradiating a large substrate with a laser beam, and the edge of the first groove is pointed upward and sharpened. By making it protrude, it can prevent reliably that the metal for electrodes fills the 1st groove | channel.
According to a third aspect of the present invention, in the chip-type electronic component according to the second aspect, a bowl-shaped groove is formed along the first groove, so that the shape is sharpened upward along the first groove. It is possible to reliably prevent the first groove from being filled with the electrode paste serving as an electrode due to the protruding edge.

  The chip-type electronic component of the present invention is a chip-type electronic component in which a large-sized substrate made of a large-sized ceramic substrate is divided to form individual chip substrates, and the chip substrate is used as a base. A rectangular chip substrate region is provided by providing a plurality of first grooves parallel to each other and a plurality of second grooves orthogonal to the first grooves.

  And when forming the electrode in the chip substrate region, the electrode straddling the first groove is conventionally formed, but it is separated from the first groove and does not straddle the first groove. An electrode is formed on the substrate.

  In addition, a step is provided in advance in the electrode formation region of the large substrate on which the electrode is formed, and thin portions are provided on both sides of the chip substrate along with the formation of this step.

  In this way, when the large substrate is divided by the first groove portion, the electrode is formed separately from the first groove so that the first groove is not filled with the metal material to be the electrode. The division can be prevented from being hindered, and the division can be performed such that a flat cross section is formed.

  Furthermore, the electrode formation region portion of the large-sized substrate on which the electrodes are formed is reinforced by the application of the metal film serving as the electrode, while the metal film serving as the electrode is deposited. Since the first groove portion which is not a portion has no reinforcing structure, stress can be easily concentrated structurally in the first groove portion when the first groove portion is divided. Utilizing the action, it is possible to promote the division at the first groove portion.

  In addition, by providing a step in the electrode formation region of the large substrate, it is possible to easily hold the electrode material serving as the electrode at the step portion, and the electrode material serving as the electrode flows into the first groove. Can be prevented.

  In addition, since a thin portion can be formed on both sides of the chip substrate by providing a step in the electrode formation region of the large substrate, when forming side electrodes on both sides of the chip substrate, A reliable bonding with the side electrode can be performed, and the occurrence of poor conduction can be prevented.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following,
For convenience of explanation, a chip resistor will be described as an example of a chip electronic component. However, the chip resistor is not limited to the chip resistor, and is applied to a chip electronic component that forms an electrode similar to the chip resistor. can do.

FIG. 1 is a manufacturing process explanatory view showing the manufacturing process of the chip resistor of the present embodiment. The chip resistor of the present embodiment is based on individual chip substrates formed by dividing a ceramic large-sized substrate P. The large-sized substrate P has a structure as shown in FIG. A plurality of first grooves 11 parallel to each other and a plurality of second grooves 12 parallel to each other perpendicular to the first grooves 11 are provided to form a chip substrate region 13 having a rectangular shape in plan view. As shown in FIG. 2, the substrate P is provided with the first groove 11 on the lower surface corresponding to the first groove 11 provided on the upper surface. Although not shown, the substrate P corresponds to the second groove 12 provided on the upper surface. The second groove 12 is also provided on the lower surface.

  Further, a step 22 is formed in the large-sized substrate P as shown in an enlarged view in FIG. 2 by a concave groove 21 that is recessed along the first groove 11. The first groove 11 is provided at the center of the bottom of the concave groove 21. The concave groove 21 is provided not only on the upper surface of the large substrate P but also on the lower surface of the large substrate P.

  The step 22 may be formed by engraving a concave groove 21 having a predetermined width on the large-sized substrate P, or a ceramic green sheet is attached to a region other than the concave groove 21 and fired, or a glass paste is screen printed. It may be formed by later sintering or expanding, or before firing the ceramic green sheet to be a large substrate P, by pressing the ceramic green sheet, the concave groove 21 and You may form by providing the groove | channel which becomes. In the present embodiment, the large substrate P is ground along a virtual line (not shown) for forming the first groove 11 formed on the large substrate P to form a concave groove 21, and a laser is formed at the bottom of the concave groove 21. Irradiation is performed to form the first groove 11. Similarly to the first groove 11, the second groove 12 is formed by laser irradiation.

  In this way, on the upper surface of the large substrate P provided with the first groove 11, the second groove 12, and the concave groove 21, an electrode paste is printed in a predetermined position by screen printing, and the printed electrode paste is sintered. As shown in FIG. 1B, an upper surface first electrode 14a and an upper surface second electrode 14b are formed in each chip substrate region 13.

  In particular, in the case where the electrode paste to be the upper surface first electrode 14a and the upper surface second electrode 14b is screen-printed, the electrode paste is printed separately from the first groove 11, so that the upper surface The first electrode 14a and the upper surface second electrode 14b are formed separately from the first groove 11, respectively, so that the first groove 11 is not filled with electrode paste.

  Similarly, an electrode paste is printed at a predetermined position on the lower surface of the large-size substrate P by screen printing, and the printed electrode paste is sintered as shown in FIG. 2 to sinter the lower surface first electrode 14c and the lower surface second electrode. 14d is formed.

  After each electrode 14a, 14b, 14c, 14d is formed, a resistor paste is printed with a predetermined width by screen printing between the upper surface first electrode 14a and the upper surface second electrode 14b in each chip substrate region 13, The printed resistor paste is sintered to form resistors 15 in each chip substrate region 13 as shown in FIG.

  After the resistor 15 is formed, a glass paste is printed in a predetermined shape on the upper surface of the resistor 15 in each chip substrate region 13 by screen printing, and the printed glass paste is sintered, so that FIG. As shown in FIG. 2, a protective glass layer 16 covered with a resistor 15 is formed on each chip substrate region 13.

  After the protective glass layer 16 is formed, the resistor 15 is laser-trimmed while measuring the current value or voltage value of the resistor 15 by bringing a probe (not shown) into contact with the upper surface first electrode 14a and the upper surface second electrode 14b, respectively. Thus, the resistance value of the resistor 15 is adjusted. In FIG. 1E, reference numeral 17 denotes a trimming groove carved in the resistor 15 by laser trimming.

  After adjusting the resistance value by forming the trimming groove 17, the overcoat layer 18 is formed on the upper surface of the protective glass layer 16 by applying and sintering the glass paste again as shown in FIG. Yes. In this embodiment, the overcoat layer 18 is a glass layer, but may be a resin layer formed by screen printing of a resin paste.

  After the overcoat layer 18 is formed, the large substrate P is divided along the first groove 11 to form a bar-shaped substrate 20 in which the chip substrates 30 are arranged in a row as shown in FIG. .

  When the large substrate P is divided along the first groove 11, the metal material constituting each electrode 14a, 14b, 14c, 14d is not filled in the first groove 11, so that the division is made with the metal material. Can be prevented, and can be divided so as to form a flat section 23 as shown in FIG.

  In particular, the electrode formation region portion of the large-sized substrate P on which the electrodes 14a, 14b, 14c, and 14d are formed is reinforced by the metal films that become the electrodes 14a, 14b, 14c, and 14d being deposited. On the other hand, since the first groove 11 portion does not have a reinforcing structure, it is possible to easily concentrate the stress in the first groove 11 when the first groove 11 is divided. It is possible to promote the division in the first groove 11 by utilizing the concentration action of.

Further, since the step 22 is provided in the electrode formation region of the large-sized substrate P along with the formation of the concave groove 21, the electrode paste that becomes the electrodes 14a, 14b, 14c, 14d can be easily held in the step 22 portion. The electrode paste can be prevented from flowing into the first groove 11 after the large-sized substrate P is divided into the bar-shaped substrate 20, and then the electrode is applied to the section 23 exposed by the division in the first groove 11. By applying and sintering the paste, as shown in FIG. 4, the first side electrode 24 electrically connecting the upper surface first electrode 14a and the lower surface first electrode 14c is formed. A second side electrode is formed by electrically connecting the upper surface second electrode 14b and the lower surface second electrode 14d.

  In the bar-shaped substrate 20, the thin portion 25 is formed by the step 22 provided in the electrode formation region, so that when the electrode paste serving as the first side electrode 24 and the second side electrode is applied to the dividing surface 23, In the thin portion 25, the upper surface first electrode 14a, the lower surface first electrode 14c and the first side electrode 24, and the upper surface second electrode 14b, the lower surface second electrode 14d and the second side electrode can be reliably bonded. Thus, it is possible to prevent the occurrence of poor conduction due to poor bonding.

  In addition, it is possible to prevent the electrode paste serving as the first side surface electrode 24 and the second side surface electrode from extending along the chip substrate at the step 22, so that a short circuit between the lower surface first electrode 14 b and the lower surface second electrode 14 d occurs. Can be prevented.

  After the formation of the first side electrode 24 and the second side electrode, the bar-shaped substrate 20 is divided along the second groove 12 into individual chip substrates, and each of the first side electrode 24 and the second side electrode is formed by plating. A chip-type resistor is formed by forming a nickel coating and a solder coating.

In the above-described embodiment, the concave groove 21 has a flat bottom surface as shown in FIG. 2, but the aperture of the laser beam used for forming the first groove 11 and the second groove 12 is weakened. Then, the concave groove 21 ′ may be formed by irradiation with laser light having a larger diameter as shown in FIG.

  In this case, due to the characteristics of the laser beam, the ceramic substrate can be engraved in the central region of the laser beam larger than the peripheral region, and the concave groove 21 ′ having a mortar-like cross section can be formed.

  In the present embodiment, the concave groove 21 ′ is formed by scanning the laser light twice along the first groove 11, and then the central portion of the concave groove 21 ′ is scanned with the laser light with a strong aperture. A first groove 11 is formed.

  Thus, by forming the first groove 11 in the concave groove 21 ′ having a mortar-like cross-sectional shape, the edge 26 of the first groove 11 can be protruded sharply upward. It is possible to reliably prevent the first groove 11 from being filled with the electrode paste that becomes the electrodes 14a, 14b, 14c, and 14d.

  Here, the concave groove 21 'is formed in a mortar-shaped cross section. However, as shown in FIG. 2, the intensity of the laser beam to be irradiated and the aperture amount are adjusted by the second groove 12 having a flat bottom surface. It is possible to form a relatively sharp edge in the first groove 11.

It is manufacturing process explanatory drawing of the chip-type resistor concerning embodiment of this invention. It is a longitudinal cross-sectional schematic diagram of the large format board | substrate of a 1st groove part. It is a longitudinal cross-sectional schematic diagram of the large format board | substrate divided | segmented by the 1st groove | channel. FIG. 3 is a schematic longitudinal sectional view showing an end surface of a bar-shaped substrate on which a first side electrode is formed. It is a longitudinal cross-sectional schematic diagram of the large format board | substrate of the 1st groove part in other embodiment. It is manufacturing process explanatory drawing of the conventional chip type resistor. It is the longitudinal cross-sectional schematic diagram which showed the bar-shaped board | substrate end surface of the defect state.

Explanation of symbols

P Large format board
11 1st groove
12 Second groove
13 Chip substrate area
14a Upper surface first electrode
14b Second electrode on top surface
14c Bottom first electrode
14d Bottom second electrode
15 resistor
16 Protective glass layer
17 Trimming groove
18 Overcoat layer
20 Bar substrate
21 concave groove
21 'concave groove
22 steps
23 min cross section
24 First side electrode
25 Thin section
26 Edge
30 chip substrate

Claims (3)

A plurality of first grooves parallel to each other and a plurality of second grooves perpendicular to the first grooves are provided to form a rectangular chip substrate region, and the first substrate in the chip substrate region is formed. In a chip-type electronic component comprising a chip substrate formed by dividing a large substrate having electrodes formed on side edges along the groove along the first groove and the second groove,
Wherein the large substrate is adapted to form the upper surface and the electrode by spaced apart from the first groove on the lower surface, respectively, each provided with a step in the electrode formation region of the large-sized substrate that these electrodes are formed, Thin chip portions are provided on both sides of the chip substrate , and the step is a groove recessed along the first groove. The large substrate is separated from a part of the groove on the upper surface and the lower surface thereof. A chip-type electronic component, wherein each of the electrodes is formed .   2. The chip-type electron according to claim 1, wherein the first groove is formed by irradiating the large substrate with laser light, and the edge of the first groove protrudes sharply upward. parts. 3. A chip-type electronic component according to claim 2, wherein a bowl-shaped groove is formed along the first groove.

Images