JP4457420B2 - Manufacturing method of chip resistor - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a chip resistor used for various electronic devices, and more particularly to a method for manufacturing a chip resistor for the purpose of low resistance.
[0002]
[Prior art]
As a conventional chip resistor, the one disclosed in JP-A-1-719422 is known.
[0003]
Hereinafter, a conventional chip resistor will be described with reference to the drawings.
[0004]
FIG. 7 is a cross-sectional view of a conventional chip resistor.
[0005]
In FIG. 7, reference numeral 1 denotes an insulating substrate. Reference numeral 2 denotes a pair of upper surface electrodes, which are provided at both ends of the upper surface of the insulating substrate 1. Reference numeral 3 denotes a pair of back electrodes, which are provided at both ends of the lower surface of the insulating substrate 1. A resistor 4 is provided between the pair of upper surface electrodes 2 and is electrically connected to a part of the pair of upper surface electrodes 2. A protective film 5 is provided so as to cover a part of the pair of upper surface electrodes 2 and the resistor 4. A side electrode 6 is located on the end face of the insulating substrate 1 and is provided so as to electrically connect a part of the top electrode 2 and a part of the back electrode 3. A nickel plating 7 is formed on the surface of the side electrode 6, and a low melting point metal plating 8 is formed on the surface of the nickel plating 7.
[0006]
FIG. 8 is a top view showing a sheet-like insulating substrate on which a top electrode 2, a back electrode 3 and a resistor 4 are printed in a pattern in a conventional chip resistor.
[0007]
In FIG. 8, 9 is a vertical groove for division, 10 is a horizontal groove for division, and a plurality of the horizontal grooves 10 and the vertical grooves 9 are provided on the sheet-like insulating substrate 11. The region thus obtained corresponds to one chip resistor. Moreover, it straddles both sides of the vertical groove 9 so that each region adjacent in the horizontal direction is electrically connected to the upper surface of the sheet-like insulating substrate 11, and each region in the vertical direction is electrically independent. The upper surface electrode 2 is provided so as not to straddle both sides of the lateral groove 10. Further, a notch 12 is formed in a portion of the upper surface electrode 2 across the vertical groove 9. The back electrode 3 (not shown) is provided on the lower surface of the sheet-like insulating substrate 11 so as to face the upper electrode 2. In addition, the resistor 4 is provided so as not to straddle regions adjacent in the vertical direction and to be electrically connected to a part of the upper surface electrode 2 between the pair of upper surface electrodes 2 in each region. .
[0008]
A manufacturing method of the conventional chip resistor configured as described above will be described below with reference to the drawings.
[0009]
9A to 9C and FIGS. 10A to 10C are process diagrams showing a conventional method for manufacturing a chip resistor.
[0010]
First, as shown in FIG. 9A, the upper surface of the sheet-like insulating substrate 11 straddles both sides of the vertical groove 9 so that the regions adjacent in the horizontal direction are electrically connected to each other and extends in the vertical direction. The top electrode 2 is provided so as not to straddle both sides of the lateral groove 10 so that each region is electrically independent. At this time, the notch 12 is formed in the portion of the upper surface electrode 2 across the vertical groove 9. Further, the back electrode 3 (not shown) is provided on the lower surface of the sheet-like insulating substrate 11 so as to face the upper electrode 2, and the upper electrode 2 and the back electrode 3 are fired respectively.
[0011]
Next, as shown in FIG. 9B, the resistor 4 is electrically connected to a part of the upper surface electrode 2 between the pair of upper surface electrodes 2 so as not to straddle the regions adjacent to each other in the vertical direction. It is provided so as to be connected to the substrate and fired.
[0012]
Next, as shown in FIG. 9C, trimming is performed using a laser beam so that a desired resistance value is obtained while measuring the resistance value between the upper surface electrodes 2 by placing a measurement terminal on the upper surface electrode 2. Do. Reference numeral 13 denotes the trimming trace.
[0013]
Next, as shown in FIG. 10A, a protective film 5 is provided so as to cover a part of the upper surface electrode 2 and the resistor 4, and is fired.
[0014]
Next, as shown in FIG. 10B, the sheet-like insulating substrate 11 is divided into strips along the longitudinal grooves 9, and the side electrodes are electrically connected to the top electrode 2 and the back electrode 3. 6 is fired.
[0015]
Finally, as shown in FIG. 10C, the strip-shaped insulating substrate 14 is divided into individual pieces along the longitudinal grooves 9. In the individual insulating substrate 15, nickel plating 7 (not shown) is formed on the surface of the side electrode 6, and low melting point metal plating 8 (not shown) is further formed on the surface of the nickel plating 7. Form. After that, the resistance value of the completed chip resistor is measured again in the state of individual pieces and classified and sorted to manufacture a conventional chip resistor.
[0016]
FIG. 11 is a top view of the conventional individual chip resistor obtained as described above (the protective film 5, nickel plating 7, and low melting point metal plating 8 are not shown).
[0017]
[Problems to be solved by the invention]
In the conventional chip resistor configured as described above, the upper electrode 2 is formed directly on the upper surface of the insulating substrate 1, and therefore, when the material having a large metal component (low resistance material) is used as the resistor 4. When the upper surface electrode 2 is formed of a material that has little glass frit or does not contain glass frit for the purpose of improving the metal bond between the conductive particles in the resistor 4 and the conductive particles in the upper surface electrode 2, 2 is made of a material with little glass frit that plays the role of adhesive strength or does not contain glass frit, the portion where the upper surface electrode 2 and the insulating substrate 1 are in contact with each other has extremely weak adhesive strength, and the upper surface electrode is immediately 2 had the subject that it will peel from the insulated substrate 1. FIG.
[0018]
The present invention solves the above-mentioned conventional problems, and even when the upper surface electrode is formed of a material with little glass frit or no glass frit, the chip resistor can prevent the upper surface electrode from peeling from the insulating substrate. It aims at providing the manufacturing method of a vessel .
[0019]
[Means for Solving the Problems]
In order to achieve the above object, the chip resistor manufacturing method of the present invention is a sheet-like structure in which a plurality of dividing vertical grooves and horizontal grooves are provided, and a region corresponding to one chip resistor is continuously partitioned. On both sides of the vertical groove so that all the regions arranged in the horizontal direction are electrically connected to each other and on the both sides of the horizontal groove so that the vertical regions are electrically independent. In addition, a step of forming a resistor made of a low-resistance metal material including a glass frit having a notch in a portion straddling the longitudinal groove, and each region so as not to straddle adjacent regions in the longitudinal direction And forming a top surface electrode made of a material with little glass frit or no glass frit at both ends of the upper surface of the resistor so as to face in the horizontal direction. , The role of joining That less glass frit, or a material that does not contain glass frit even when forming the upper electrode, it is possible to prevent the upper surface electrodes peel off from the insulating substrate, the resistance of the region laterally adjacent to definitive during trimming The influence of the value can also be kept small .
[0020]
DETAILED DESCRIPTION OF THE INVENTION
The invention according to claim 1 of the present invention is provided on a sheet-like insulating substrate in which a plurality of vertical grooves and horizontal grooves for division are provided and a region corresponding to one chip resistor is continuously partitioned. It straddles both sides of the vertical groove so that all the regions arranged in the horizontal direction are electrically connected, and does not straddle both sides of the horizontal groove so that each region in the vertical direction is electrically independent. A step of forming a resistor made of a low-resistance metal material including a glass frit having a notch in a portion straddling the substrate, and a laterally opposite direction in each region so as not to straddle adjacent regions in the vertical direction And forming a top surface electrode made of a material with little glass frit or no glass frit at both ends of the top surface of the resistor. According to this manufacturing method, the top surface of the insulating substrate is formed on the top surface of the insulating substrate. Forming a resistor directly, In addition, since the upper surface electrode is formed on the upper surface of the resistor, the resistor and the insulating substrate are strongly bonded by the glass frit in the resistor, and the glass frit serving as a bonding member is bonded. Even when the top electrode is formed of a material that contains little or no glass frit, the metal bond between the conductive particles in the resistor and the conductive particles in the top electrode is improved, so the resistor and the top electrode are strong. As a result, the upper surface electrode can be prevented from being peeled off from the insulating substrate. In addition, since the notched portion is provided in the portion across the vertical groove of the resistor, it is possible to prevent the adjacent vertical resistors from being connected to each other due to the flow of the paste into the groove for dividing the paste during printing of the resistor. In addition, the width of the portion across the vertical groove of the resistor is narrowed, and the resistance value of the portion connecting the regions adjacent in the horizontal direction is also increased, so the resistance value of the region adjacent in the horizontal direction at the time of trimming is increased . The influence can also be suppressed to a small extent, and as a result, there is almost no change in resistance value before and after the division of the insulating substrate, so that the yield is improved.
[0021]
(Reference example)
Hereinafter, a chip resistor showing a reference example of the present invention will be described with reference to the drawings.
[0022]
FIG. 1 is a cross-sectional view of a chip resistor showing a reference example of the present invention.
[0023]
In FIG. 1, 21 is an insulating substrate. Reference numeral 22 denotes a resistor, which is provided on the upper surface of the insulating substrate 21 and is made of a low resistance metal material such as a copper nickel alloy containing glass frit. Reference numeral 23 denotes a pair of upper surface electrodes, which are provided at both ends of the upper surface of the resistor 22 and are made of a material with little glass frit or no glass frit, and made of a low resistance metal such as silver or copper. A pair of back electrodes 24 are provided at both ends of the lower surface of the insulating substrate 21 and are made of a low resistance metal such as silver or copper. A protective film 25 is provided so as to cover a part of the pair of upper surface electrodes 23 and the resistor 22, and is mainly composed of glass. A side electrode 26 is located on the end surface of the insulating substrate 21 and is provided so as to electrically connect a part of the top electrode 23 and a part of the back electrode 24. The side electrode 26 is composed of a conductive powder made of a low-resistance metal such as silver or copper and containing glass or a binding resin. Further, a nickel plating 27 is formed on the surface of the side electrode 26, and a low melting point metal plating 28 such as tin or solder is formed on the surface of the nickel plating 27.
[0024]
FIG. 2 is a top view of a sheet-like insulating substrate on which a top electrode 23, a back electrode 24, and a resistor 22 are printed in a chip resistor according to a reference example of the present invention.
[0025]
In FIG. 2, reference numeral 29 denotes a dividing vertical groove, and reference numeral 30 denotes a dividing horizontal groove. A plurality of the horizontal grooves 30 and the vertical grooves 29 are provided on the sheet-like insulating substrate 31, and the vertical grooves 29 and the horizontal grooves 30 are partitioned. The region thus obtained corresponds to one chip resistor. In addition, the horizontal groove is formed on the upper surface of the sheet-like insulating substrate 31 so as to straddle both sides of the vertical groove 29 so that all the regions arranged in the horizontal direction are electrically connected and so that the vertical regions are electrically independent. A resistor 22 is provided so as not to straddle both sides of 30. Further, the upper surface electrode 23 is formed on the both ends of the upper surface of the resistor 22 with the sheet-like insulating substrate 31 so as not to straddle the regions adjacent to each other in the vertical direction and to face in the horizontal direction in each region. It is provided not to touch. The back electrode 24 (not shown) is provided on the lower surface of the sheet-like insulating substrate 31 so as to face the upper electrode 23.
[0026]
With respect to the chip resistor configured as described above and showing a reference example of the present invention, a manufacturing method thereof will be described below with reference to the drawings.
[0027]
3 (a) to 3 (c) and FIGS. 4 (a) to 4 (c) are process diagrams showing a manufacturing method of a chip resistor showing a reference example of the present invention.
[0028]
First, as shown in FIG. 3A, the upper surface of the sheet-like insulating substrate 31 is straddled on both sides of the vertical groove 29 so that all the regions aligned in the horizontal direction are electrically connected to each other in the vertical direction. The resistor 22 is provided and fired so as not to straddle both sides of the lateral groove 30 so that the regions are electrically independent.
[0029]
Next, as shown in FIG. 3B, both end portions of the upper surface of the resistor 22 so as not to straddle the region adjacent to the upper surface electrode 23 in the vertical direction and to face each other in the horizontal direction in each region. In addition, it is provided so as not to contact the sheet-like insulating substrate 31. Further, a back electrode 24 (not shown) is provided on the bottom surface of the sheet-like insulating substrate 31 so as to face the top electrode 23, and the top electrode 23 and the back electrode 24 are fired respectively.
[0030]
Next, as shown in FIG. 3C, trimming is performed using a laser beam so as to obtain a desired resistance value while measuring the resistance value between the upper surface electrodes 23 by placing a measurement terminal on the upper surface electrode 23. Do. Reference numeral 32 denotes the trimming trace.
[0031]
Next, as shown in FIG. 4A, a protective film 25 is provided so as to cover a part of the upper surface electrode 23 and the resistor 22, and is baked.
[0032]
Next, as shown in FIG. 4B, the sheet-like insulating substrate 31 is divided into strips along the longitudinal grooves 29, and the side electrodes are connected so as to electrically connect the top electrode 23 and the back electrode 24. 26 is fired.
[0033]
Finally, as shown in FIG. 4C, the strip-shaped insulating substrate 33 is divided into individual pieces along the longitudinal grooves 29. In the individual insulating substrate 34, nickel plating 27 (not shown) is formed on the surface of the side electrode 26, and low melting point metal plating 28 (not shown) is further formed on the surface of the nickel plating 27. Form. After that, the resistance value of the completed chip resistor is measured again in the state of individual pieces and classified and sorted to manufacture a chip resistor showing a reference example of the present invention.
[0034]
As described above, in the chip resistor showing the reference example of the present invention, the resistor 22 made of a metal material including glass frit is directly formed on the upper surface of the insulating substrate 21, and the glass frit is further formed on the upper surface of the resistor 22. Since the upper surface electrode 23 made of a material containing little or no glass frit is provided, the resistor 22 and the insulating substrate 21 are firmly bonded by the glass frit in the resistor 22, and the role of bonding Even when the upper surface electrode 23 is formed of a material that contains little glass frit or does not contain glass frit, conductive particles such as a copper nickel alloy contained in the resistor 22 and low resistance such as silver contained in the upper surface electrode 23 Therefore, the resistor 22 and the upper surface electrode 23 are firmly bonded to each other. , The effect is obtained that the upper surface electrodes 23 can be prevented from being separated from the insulating substrate 21.
[0035]
(Embodiment 1)
Hereinafter, the chip resistor according to the first embodiment of the present invention will be described with reference to the drawings.
[0036]
5A is a cross-sectional view of the chip resistor according to the first embodiment of the present invention, and FIG. 5B is a top view of the chip resistor (the protective film 25, nickel plating 27, and low melting point metal plating 28 are illustrated). Not shown).
[0037]
FIG. 6 is a top view of a sheet-like insulating substrate on which the top electrode 23, the back electrode 24, and the resistor 22 are printed in the chip resistor according to the first embodiment of the present invention.
[0038]
The chip resistor in the first embodiment of the present invention is different from the chip resistor showing the reference example of the present invention in FIGS. 5A and 5B at both ends of the resistor 22 and in FIG. Is a point in which a notch 35 is provided in each portion across the vertical groove 29 of the resistor 22, and the other configurations and manufacturing methods are the same, so the description is omitted and the same reference numerals are given.
[0039]
When the resistor 22 formed on the upper surface of the sheet-like insulating substrate 31 is just a rod (not provided with the notch 35), like the chip resistor showing the reference example of the present invention, When a material having a large metal component (low resistance material) is used as the resistor 22, mutual diffusion of the upper surface electrode 23 and the resistor 22 occurs during firing of the upper surface electrode 23, and the resistance value of the upper surface electrode 23 portion becomes the resistance 22. Therefore, when the resistance value is measured at the time of trimming by the four-terminal method, it is affected by the resistance value of the region adjacent in the horizontal direction, and the paste is divided into the dividing grooves when the resistor 22 is printed. Adjacent vertical resistors 22 are connected by flowing. Thereby, after the sheet-like insulating substrate 31 is divided into pieces, the resistance value changes and the yield deteriorates.
[0040]
On the other hand, in the configuration according to the first embodiment of the present invention, since the notch 35 is provided in the portion across the vertical groove 29 of the resistor 22, the width of the portion across the vertical groove 29 of the resistor 22. As a result, the resistance value of the portion connecting the adjacent regions in the horizontal direction becomes high, so that the influence of the resistance value of the adjacent region in the horizontal direction can be reduced during trimming, and the resistor It is possible to prevent the adjacent vertical resistors 22 from being connected to each other by the paste flowing into the dividing grooves when printing 22. As a result, there is almost no change in the resistance value before and after the division of the insulating substrate 31, so that the yield is improved.
[0041]
In addition, since the resistors 22 are present at both ends of the insulating substrate 21, an effect that the strength of the side electrode 26 is improved can be expected.
[0042]
In the first embodiment of the present invention, the shape of the notch 35 provided in the resistor 22 is convex, but the same effect can be obtained even when the shape is V-shaped.
[0043]
【The invention's effect】
As described above, the chip resistor manufacturing method of the present invention is a sheet-like insulating substrate in which a plurality of dividing vertical grooves and horizontal grooves are provided, and regions corresponding to one chip resistor are continuously partitioned. Furthermore, it straddles both sides of the vertical groove so that all the regions arranged in the horizontal direction are electrically connected, and does not straddle both sides of the horizontal groove so that the vertical regions are electrically independent. A step of forming a resistor made of a low-resistance metal material including a glass frit having a notch in a portion straddling the longitudinal groove, and a lateral portion in each region so as not to straddle adjacent regions in the longitudinal direction. And forming a top surface electrode made of a material with little glass frit or no glass frit at both end portions of the top surface of the resistor so as to face each other. According to this manufacturing method, the insulating substrate Direct resistance on top of Forming a, since as further to form an upper electrode on the upper surface of the resistor, the resistor and the insulating substrate will be strongly bonded by glass frit in the resistor, and the role of bonding Even when the upper surface electrode is formed of a material that contains little glass frit or does not contain glass frit, the metal bond between the conductive particles in the resistor and the conductive particles in the upper surface electrode is improved. Are firmly bonded to each other, whereby the upper surface electrode can be prevented from peeling from the insulating substrate . In addition, since the notched portion is provided in the portion across the vertical groove of the resistor, it is possible to prevent the adjacent vertical resistors from being connected to each other due to the flow of the paste into the groove for dividing the paste during printing of the resistor. In addition, the width of the portion across the vertical groove of the resistor is narrowed, and the resistance value of the portion connecting the regions adjacent in the horizontal direction is also increased, so the resistance value of the region adjacent in the horizontal direction at the time of trimming is increased . effect can also be reduced, thereby, for dividing the resistance value change before and after the insulating substrate is hardly, and has an excellent effect that the yield is improved.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a chip resistor showing a reference example of the present invention. FIG. 2 is a top view of a sheet-like insulating substrate on which a top electrode, a back electrode and a resistor are printed. (A) to (c) Process diagram showing the first half of the chip resistor manufacturing method. FIG. 4 (a) to (c) Process diagram showing the latter half of the chip resistor manufacturing method. a) Cross-sectional view of the chip resistor according to the first embodiment of the present invention (b) Top view of the chip resistor FIG. 6 is a sheet-like pattern on which the top electrode, the back electrode, and the resistor of the chip resistor are printed. FIG. 7 is a cross-sectional view of a conventional chip resistor. FIG. 8 is a top view of a sheet-like insulating substrate on which a top electrode, a back electrode, and a resistor are printed. 9) (a) to (c) of the manufacturing method of the same chip resistor Process diagram showing the first half [FIG. 10] (a) to (c) Process diagram showing the second half of the manufacturing method of the chip resistor [FIG. 11] Top view of the chip resistor [Explanation of symbols]
21 Insulating substrate 22 Resistor 23 Upper surface electrode 29 Vertical groove 30 Horizontal groove 31 Sheet-like insulating substrate 35 Notch

Claims (1)

  All regions arranged in the horizontal direction are electrically connected on a sheet-like insulating substrate in which a plurality of dividing vertical grooves and horizontal grooves are provided and regions corresponding to one chip resistor are continuously partitioned. A glass frit that extends across both sides of the vertical groove and does not cross over both sides of the horizontal groove so that each region in the vertical direction is electrically independent, and further has a notch in the portion straddling the vertical groove. A step of forming a resistor made of a low-resistance metal material, and both ends of the upper surface of the resistor so as not to straddle adjacent regions in the vertical direction and to face each other in the horizontal direction in each region A method of manufacturing a chip resistor comprising a step of forming an upper surface electrode made of a material with little glass frit or no glass frit.

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