JP2006019669A - Resistor of low resistance using cladding material, and manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resistor of low resistance which is excellent in electrical characteristics, and to provide its manufacturing method low in cost with the number of processes reduced. <P>SOLUTION: A plated layer is formed at a hoop-like material in which a resistor body 11 composed of an alloy for low resistance, and a metal plate composed of a material of high conductivity are welded, and the hoop-like material is sliced to the width of the longitudinal direction of the resistor of low resistance. The center of the metal plate is smoothly cut off continuously almost in parallel along the longitudinal direction of the hoop-like material to form a pair of electrode portions 12, 13, and simultaneously a resistance value is adjusted, but a trimming process is not provided. Then cut portions of the upper face and the lower face of the resistor body 11 are cladded with insulating materials, and the hoop-like material is cut off continuously to the width of the lateral direction of the resistor of low resistance. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a low resistor suitable for high current detection using a clad material and a method for manufacturing the same with a small number of steps.

  In order to form a pair of electrode portions at both ends in the longitudinal direction, a conventional resistor is formed by etching a resistor such as a low-resistance alloy, for example, a copper-nickel alloy, into a size of each resistor by pressing, etc. A highly conductive material such as copper is formed into a lead frame shape as a terminal, solder-plated, and welded to individual resistors. Thereafter, in the resistance adjustment, the resistor is trimmed, covered with an insulator, and the lead frame is cut.

  In the resistance value adjustment, as shown in FIG. 4, laser trimming in which a cut 4 is made in the longitudinal direction of the resistor 1 is generally used. However, in this trimming, a hot spot 5 is generated at the tip of the notch, so that the resistance temperature characteristic changes and the current path 6 bypasses the notch, so that the inductance value of the low resistor increases.

Problems to be solved by the invention

  The present invention has a problem of a change in resistance temperature characteristics and an increase in inductance value that occur in a trimming process, a process of cutting to the size of each resistor, a process of welding a solder-plated terminal to each resistor, and resistance value adjustment There are many trimming processes, insulator coating processes, and cutting and cutting of terminals from the lead frame, resulting in a significant increase in manufacturing cost. An object of the present invention is to solve these problems and to produce a low resistor having excellent electrical characteristics and an inexpensive low resistor having a small number of steps.

Means for solving the problem

  In order to achieve the above object, the low resistor of the present invention is a material obtained by fusing a resistor made of an alloy for low resistance and a metal plate made of a highly conductive material, for example, a metal made of the highly conductive material to a clad material. A plating layer is provided on the plate side to improve solderability, and the hoop-like material sliced in the longitudinal width of the low resistor is formed from the plating layer of the hoop-like material to form a pair of electrode portions. The center of the resulting metal plate is continuously smooth cut substantially parallel to the longitudinal direction. In the step, a part of the resistor made of the low resistance alloy is continuously and smoothly cut, and the resistance value is adjusted at the same time. The cutting portions on the upper and lower surfaces of the resistor are continuously covered with an insulator, and the hoop-like material sliced into the width in the longitudinal direction of the low resistor is continuously applied in the width in the short direction of the low resistor. Characterized by cutting.

In the low resistor manufacturing method of the present invention, in order to form the pair of electrode portions, the center of the metal plate composed of the plating layer of the hoop-like material sliced in the longitudinal width of the low resistor is elongated. A process of continuously performing smooth cutting substantially parallel to the direction;
A step of continuously covering the upper and lower cut portions of the resistor with an insulator;
Cutting the hoop-like material sliced into the width of the low resistor in the longitudinal direction continuously into the width of the low resistor in the short direction;
It is characterized by comprising.

  In the low resistor manufacturing method of the present invention, in order to form the pair of electrode portions, the center of the metal plate composed of the plating layer of the hoop-like material sliced in the width in the longitudinal direction of the low resistor is elongated. In the process of continuously smooth cutting substantially parallel to the direction, the trimming process can be omitted and the resistance value accuracy is excellent by continuously cutting even part of the resistor made of the low-resistance alloy. The electrical characteristics are stable.

  The low-resistance alloy is any one of copper / nickel alloy, nickel alloy, nickel / chromium alloy, copper, iron, chromium alloy, copper / manganese alloy, palladium, silver alloy, and gold. .

  The highly conductive material is copper or an alloy containing copper.

  In addition, the plating layer is characterized in that any of Sn, SnCu, SnBi, SnAgCu, Ag, and Au is applied with SnPb and Ni plating as a base in order to facilitate solderability on a printed circuit board or the like.

  The insulator covering the upper and lower cut portions of the resistor is one of epoxy resin, silicon resin, phenol resin, fluorine resin, polyester resin, and polyimide resin.

The invention's effect

  In the present invention described above, the resistor and the metal plate are fixed by using a material obtained by fusing the resistor made of the low-resistance alloy and the metal plate made of the highly conductive material, for example, a clad material. In order to omit the process and form the pair of electrode portions, the metal plate center made of the plating layer of the hoop-like material sliced in the longitudinal width of the low resistor is continuously arranged substantially in parallel along the longitudinal direction. In the smooth cutting process, by continuously smooth cutting up to a part of the resistor made of the resistance alloy, the resistor can be uniformly cut in the thickness direction, the resistance value accuracy is good, and the trimming process is also performed. Save. Therefore, no hot spot is generated and the temperature coefficient of resistance does not change. This is a low-resistance resistor that does not cause a current path detour, has a low inductance value, and has stable electrical characteristics. In addition, it is an inexpensive low-resistor manufacturing method that has few steps and is excellent in mass productivity.

  Hereinafter, a low resistor using a clad material and a method for manufacturing the same will be described with reference to the accompanying drawings.

FIG. 1 shows a low resistor using a clad material according to an embodiment of the present invention.
Reference numeral 11 denotes a resistor made of a low-resistance alloy, and reference numerals 12 and 13 denote a pair of electrode portions, which are metal plates made of a highly conductive material. Reference numeral 14 is a plating layer for facilitating solderability, and reference numerals 15 and 16 are insulators covering the cutting portions of the upper and lower surfaces of the resistor.

  In FIG. 2, a hoop-like clad material, which is a clad material for producing the low resistor of the present invention and in which a resistor 11 made of an alloy for low resistance and a metal plate 13 made of a highly conductive material are fused, is printed. The surface of the resistor 11 is masked and the surface of the metal plate 13 is plated in order to facilitate solderability on a substrate or the like, and is formed into a hoop shape in a state of being sliced in the longitudinal width of the low resistor. .

In FIG. 3, the metal plate 13 side center of the hoop-like clad material sliced in the longitudinal width of the low resistor is formed in the longitudinal direction of the hoop-like clad material in order to form the pair of electrode portions 12 and 13. Then, smooth cutting is performed continuously to the plating layer 14, the metal plate 13, and a part of the resistor 11 substantially in parallel.
At this time, a resistance value measuring probe is brought into contact with a portion corresponding to the electrode portion, and a part of the resistor 11 is continuously cut smoothly while observing the resistance value.

  In the above process, the resistance value measuring probe is brought into contact with the portion corresponding to the electrode portion, and the hot spot and current path are formed by the conventional laser trimming in order to cut smoothly in the thickness direction of the resistor 11 while observing the resistance value. This is a low-resistance resistor with a stable inductance and a low inductance value.

  And the insulators 15 and 16 are continuously coat | covered in the state of the said hoop-shaped clad material between the both electrodes of the upper surface whole surface and the lower surface cutting part of the said resistor, respectively.

Finally, it is continuously cut into the short width of the low resistor.
It is important that the cutting method is performed with a press, a dicing cutter or the like, and is cut with high dimensional accuracy.

It is a perspective view which shows the low resistor by embodiment of this invention. It is a perspective view of the hoop-like clad material sliced into the longitudinal dimension of the low resistor of the present invention. It is a perspective view of the 1st process in the manufacturing method of the low resistor of the present invention. Plan view showing hot spots and current paths due to conventional resistor trimming

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Resistor 12, 13 Electrode part 14 Plating layer 15, 16 Insulator 17 Hoop-like clad material

Claims (7)

  A material in which a resistor made of an alloy for low resistance and a metal plate made of a highly conductive material are fused, for example, a clad layer is provided with a plating layer on the metal plate made of the highly conductive material to improve solderability. In order to form a pair of electrode portions of the hoop-like material sliced in the longitudinal width of the low resistor, the metal plate side center consisting of the plating layer of the hoop-like material is continued substantially parallel along the longitudinal direction. Smooth cutting. In the step, a part of the resistor made of the low resistance alloy is cut smoothly and the resistance value is adjusted at the same time. The cutting portions on the upper and lower surfaces of the resistor are continuously covered with an insulator, and the hoop-like material sliced into the width in the longitudinal direction of the low resistor is continuously applied in the width in the short direction of the low resistor. A low resistor characterized by cutting. In order to form the pair of electrode portions, the center of the metal plate made of the plating layer of the hoop-like material sliced in the longitudinal width of the low resistor is continuously and smoothly cut substantially parallel to the longitudinal direction. Process,
A step of continuously covering the upper and lower cut portions of the resistor with an insulator;
Cutting the hoop-like material sliced into the width of the low resistor in the longitudinal direction continuously into the width of the low resistor in the short direction;
A method of manufacturing a low resistor, comprising:   In order to form the pair of electrode portions, the center of the metal plate made of the plating layer of the hoop-like material sliced in the longitudinal width of the low resistor is continuously and smoothly cut substantially parallel to the longitudinal direction. A method of manufacturing a low resistor in which the trimming step can be omitted, the resistance value accuracy is excellent, and the electrical characteristics are stable by smoothly cutting a part of the resistor made of the low resistance alloy in the process.   The low-resistance alloy is any one of a copper / nickel alloy, a nickel alloy, a nickel / chromium alloy, copper, iron, a chromium alloy, a copper / manganese alloy, palladium, a silver alloy, and gold. The low resistor according to claim 1.   5. The low resistor according to claim 1, wherein the highly conductive material is copper or an alloy containing copper.   2. The plated layer according to claim 1, wherein Sn, SnCu, SnBi, SnAgCu, Ag, or Au is provided on a base of SnPb and Ni in order to facilitate solderability on a printed circuit board or the like. The low resistor according to claim 5.   The insulator that covers the cutting portions on the upper surface and the lower surface of the resistor is one of an epoxy resin, a silicon resin, a phenol resin, a fluororesin, a polyester resin, and a polyimide resin. 6. The low resistor according to 6.

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