JP3608569B2 - Resistor manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing a resistor, and particularly to a method for manufacturing a fine resistor.

  Hereinafter, a conventional resistor and a manufacturing method thereof will be described with reference to the drawings.

  FIG. 12 is a sectional view of a conventional resistor.

  In FIG. 12, reference numeral 1 denotes an insulating piece-shaped substrate made of a ceramic such as alumina. Reference numeral 2 denotes a pair of first upper surface electrode layers provided at both left and right end portions of the upper surface of the individual substrate 1. Reference numeral 3 denotes a resistance layer provided on the upper surface of the individual substrate 1 so as to partially overlap the pair of first upper electrode layers 2. Reference numeral 4 denotes a first protective layer provided so as to cover only the entire resistance layer 3. Reference numeral 5 denotes a trimming groove provided in the resistance layer 3 and the first protective layer 4 in order to correct the resistance value. Reference numeral 6 denotes a second protective layer provided only on the upper surface of the first protective layer 4. Reference numeral 7 denotes a pair of second upper surface electrode layers provided on the upper surfaces of the pair of first upper surface electrode layers 2 so as to extend to the full width of the individual substrate 1. Reference numeral 8 denotes a pair of side surface electrode layers provided on both side surfaces of the individual substrate 1. Reference numerals 9 and 10 denote a pair of nickel plating layers and a pair of solder plating layers provided on the surfaces of the pair of second upper surface electrode layers 7 and the pair of side surface electrode layers 8, respectively. In this case, the solder plating layer 10 is provided lower than the second protective layer 6.

  With respect to the conventional resistor configured as described above, the following manufacturing method will be described with reference to the drawings.

  13A to 13F are process diagrams showing a conventional method for manufacturing a resistor.

  First, as shown in FIG. 13A, a pair of first upper surface electrode layers 2 are formed by coating on both left and right end portions of the upper surface of the insulating piece-like substrate 1.

  Next, as shown in FIG. 13B, the resistance layer 3 is formed on the upper surface of the individual substrate 1 so as to partially overlap the pair of first upper surface electrode layers 2.

  Next, as shown in FIG. 13C, after the first protective layer 4 is coated and formed so as to cover only the entire resistance layer 3, the total resistance value in the resistance layer 3 is within a predetermined resistance value range. A trimming groove 5 is formed in the resistance layer 3 and the first protective layer 4 by a laser or the like so as to enter the inside.

  Next, as shown in FIG. 13D, the second protective layer 6 is formed by coating only on the upper surface of the first protective layer 4.

  Next, as shown in FIG. 13 (e), the pair of second upper surface electrode layers 7 are positioned on the upper surfaces of the pair of first upper surface electrode layers 2 so as to extend to the full width of the individual substrate 1. Coating and forming.

  Next, as shown in FIG. 13 (f), a pair of first upper surface electrode layers 2, 7 on the left and right side surfaces of the pair of first upper surface electrode layers 2 and the individual substrate 1, and A pair of side electrode layers 8 is formed by coating so as to be electrically connected.

  Finally, after nickel plating is applied to the surfaces of the pair of second upper surface electrode layers 7 and the pair of side surface electrode layers 8, a pair of nickel plating layers 9 and a pair of solder plating layers 10 are formed by performing solder plating. To form a conventional resistor.

  In addition, the above-described resistors have been very miniaturized. In recent years, very small resistors having a length of 0.6 mm, a width of 0.3 mm, and a thickness of 0.25 mm have been manufactured.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP-A-4-102302

  A problem when an extremely small resistor having a length of 0.6 mm, a width of 0.3 mm, and a thickness of 0.25 mm is to be manufactured by the above-described conventional configuration and manufacturing method will be described.

  Conventional sheet-like insulating substrates made of porcelain such as alumina are manufactured by previously forming substrate dividing grooves before firing the sheet-like insulating substrate, and firing the insulating substrate. For this reason, the substrate dividing grooves formed in advance on the sheet-like insulating substrate are subject to dimensional variations due to subtle compositional variations of the sheet-like insulating substrate and subtle temperature variations during firing of the sheet-like insulating substrate. (This variation in dimensions reaches about 0.5 mm for a sheet-like insulating substrate of about 100 mm × 100 mm).

  When manufacturing a very fine resistor using a sheet-like insulating substrate having such dimensional variations, the size of the individual substrate is set to a very fine dimension rank in each of the vertical and horizontal directions. It is necessary to classify the screen print masks such as the top electrode layer 2, the resistance layer 3, and the protective layer 4 corresponding to each dimension rank, and to replace the masks according to the dimension rank of the individual substrate. As a result, there was a problem that the process becomes very complicated (when the dimension rank is classified in increments of 0.05 mm, the vertical and horizontal totals are 25 ranks each in the vertical and horizontal directions. Dimension classification of about 600 ranks or more is required.)

  The present invention solves the above-mentioned conventional problems, and eliminates the need for categorizing the individual substrate and replacing the mask according to the dimension rank of the conventional individual substrate. It is an object of the present invention to provide a method of manufacturing a resistor that can be manufactured at low cost and that can easily obtain a fine resistor.

  In order to achieve the above object, the present invention has the following configuration.

According to a first aspect of the present invention, a plurality of pairs of upper surface electrode layers and a plurality of resistance layers are formed on an upper surface of a sheet-like insulating substrate so as to be electrically connected to each other; Trimming to adjust the resistance value between the plurality of pairs of upper electrode layers in the resistance layer, forming a protective layer so as to cover at least the plurality of resistance layers, and the sheet-like insulating substrate, Forming a plurality of slit-shaped first divided portions for separating the plurality of pairs of upper surface electrode layers and dividing them into a plurality of strip-shaped substrates; and a plurality of the slit-shaped first divided portions formed. A step of installing a mask by the magnetic force of a magnet on the back surface of the sheet-like insulating substrate in a state, and a sputtering method on the back surface of the insulating substrate and the inner surfaces of the plurality of slit-shaped first divided portions with the mask installed Multiple pairs A step of forming a side electrode layer; a step of removing the mask from the sheet-like insulating substrate after forming the side electrode layer; and a plurality of strip-like substrates in the sheet-like insulating substrate; Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so that the layers are individually separated and divided into pieces. According to the manufacturing method, a mask is installed by the magnetic force of a magnet on the back surface of the sheet-like insulating substrate in a state where a plurality of slit-shaped first division parts are formed, and the back surface of the insulating substrate is installed in a state where this mask is installed. In addition, since a plurality of pairs of side electrode layers are formed on the inner surfaces of the plurality of slit-shaped first divided portions by the sputtering method, the side electrode layers are formed for each of the plurality of strip-shaped substrates as in the prior art. That's true And it has effects that can be formed collectively in a state of a sheet-like insulating substrate.

According to a second aspect of the present invention, a plurality of pairs of upper surface electrode layers or a plurality of resistance layers are formed on the upper surface of a sheet-like insulating substrate, and the plurality of pairs of upper surface electrode layers or the plurality of resistance layers are formed. Forming a plurality of slit-shaped first dividing portions for separating the plurality of pairs of upper surface electrode layers or the plurality of resistance layers into a plurality of strip-shaped substrates on the formed sheet-like insulating substrate; Forming a plurality of resistance layers or a plurality of pairs of top electrode layers so as to partially overlap the plurality of pairs of top electrode layers or the plurality of resistance layers; and between the plurality of pairs of top electrode layers in the plurality of resistance layers A step of trimming to adjust the resistance value, a step of forming a protective layer so as to cover at least the plurality of resistance layers, and a sheet-like state in which a plurality of the slit-shaped first divided portions are formed Magne on the back surface of the insulating substrate A step of placing a mask by preparative magnetic force, forming a side electrode layer of the plurality of pairs by a sputtering method on the inner surface of the first divided portion backside and a plurality of slit-shaped the insulating substrate while installing the mask And after forming the side electrode layer, the step of removing the mask from the sheet-like insulating substrate, and the plurality of resistive layers are individually separated into a plurality of strip-like substrates in the sheet-like insulating substrate. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so as to be divided into individual substrate, and according to this manufacturing method, the slits first divided portion of Jo is a mask was placed by the magnetic force of the magnet on the back surface of the sheet-like insulating substrate in a state in which a plurality formed, the back surface and a plurality of slits of the insulating substrate while installing the mask Since a plurality of pairs of side electrode layers are formed on the inner surface of the first divided portion by a sputtering method, the side electrode layers are not formed for each of a plurality of strip-shaped substrates as in the prior art. It has the effect that it can form in a lump in the state of this insulating substrate.

According to a third aspect of the present invention, a plurality of pairs of upper electrode layers and a plurality of resistance layers are formed on the upper surface of a sheet-like insulating substrate so that they are electrically connected to each other, and the plurality of pairs A plurality of slit-shaped first dividing portions for separating the plurality of pairs of upper surface electrode layers into a plurality of strip-shaped substrates on a sheet-like insulating substrate having a plurality of upper surface electrode layers and a plurality of resistance layers formed thereon; A step of forming, a step of trimming to adjust a resistance value between the plurality of pairs of upper surface electrode layers in the plurality of resistance layers, a step of forming a protective layer so as to cover at least the plurality of resistance layers, A step of installing a mask by the magnetic force of a magnet on the back surface of the sheet-like insulating substrate in a state where a plurality of the slit-shaped first division parts are formed; and Slit shape A step of forming a plurality of pairs of side electrode layers on the inner surface of the first divided portion by a sputtering method, a step of removing the mask from the sheet-like insulating substrate after forming the side electrode layers, A plurality of second substrates in a direction perpendicular to the slit-shaped first divided portion so that the plurality of resistive layers are individually separated and divided into individual pieces of substrate on the plurality of strip-like substrates in the insulating substrate. According to this manufacturing method, a mask is installed by the magnetic force of the magnet on the back surface of the sheet-like insulating substrate in which a plurality of slit-shaped first divided portions are formed. In the state where the mask is installed, a plurality of pairs of side electrode layers are formed by sputtering on the back surface of the insulating substrate and the inner surfaces of the plurality of slit-shaped first divided portions. Is Without forming for each of a plurality of strip-like substrate as years, and has a effect that can be formed collectively in a state of a sheet-like insulating substrate.

According to a fourth aspect of the present invention, a plurality of pairs of upper surface electrode layers and a plurality of resistance layers are formed on an upper surface of a sheet-like insulating substrate so as to be electrically connected to each other, and the plurality of resistors Trimming to adjust a resistance value between the plurality of pairs of upper surface electrodes in the layer, and separating the plurality of pairs of upper surface electrode layers into the trimmed sheet-like insulating substrate to form a plurality of strips A step of forming a plurality of slit-shaped first divided portions for dividing the substrate, a step of forming a protective layer so as to cover at least the plurality of resistance layers, and a plurality of the slit-shaped first divided portions. A step of installing a mask by the magnetic force of a magnet on the back surface of the sheet-like insulating substrate in the formed state, and the back surface of the insulating substrate and the inner surfaces of the plurality of slit-shaped first divided portions with the mask installed spa A step of forming a plurality of pairs of side electrode layers by a method, a step of removing the mask from the sheet-like insulating substrate after forming the side electrode layers, and a plurality of strip-like substrates in the sheet-like insulating substrate And forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so that the plurality of resistance layers are individually separated and divided into pieces. According to this manufacturing method, a mask is installed by the magnetic force of a magnet on the back surface of the sheet-like insulating substrate in a state where a plurality of slit-shaped first division parts are formed, and this mask is installed. Since a plurality of pairs of side electrode layers are formed by sputtering on the back surface of the insulating substrate and the inner surfaces of the plurality of slit-shaped first divided portions, the side electrode layers are formed of a plurality of strips as in the prior art. State group Without forming each, and has a effect that can be formed collectively in a state of a sheet-like insulating substrate.

  As described above, the method for manufacturing a resistor according to the present invention can eliminate the step of replacing the mask according to the dimension rank of the piece-like substrate as in the prior art, and is an inexpensive and fine resistor. It has an excellent effect that can be provided.

(Embodiment 1)
Hereinafter, the first to fourth aspects of the present invention will be described using the first embodiment.

  FIG. 1 is a cross-sectional view of a resistor according to Embodiment 1 of the present invention.

  In FIG. 1, reference numeral 11 denotes a sheet-like insulating substrate made of baked 96% purity alumina, which is divided into a slit-shaped first divided portion and a second divided portion orthogonal to the first divided portion. It is the piece-like substrate separated into pieces by this. Reference numeral 12 denotes a pair of upper surface electrode layers mainly composed of silver formed on the upper surface of the individual substrate 11. Reference numeral 13 denotes a ruthenium oxide resistance layer formed on the upper surface of the individual substrate 11 so as to partially overlap the pair of upper electrode layers 12. Reference numeral 14 denotes a first protective layer made of a precoat glass layer formed on the upper surface of the resistance layer 13. A trimming groove 15 is provided to correct the resistance value of the resistance layer 13 between the pair of upper surface electrode layers 12. Reference numeral 16 denotes a second protective layer mainly composed of a resin formed so as to cover the first protective layer 14 made of a precoat glass layer. Reference numeral 17 denotes a pair of side electrode layers made of nickel that is formed so as to overlap a part of the pair of upper surface electrode layers 12 and to cover both side surfaces and both end portions of the back surface of the individual substrate 11. Reference numeral 18 denotes a solder layer made of tin formed so as to cover a part of the pair of side electrode layers 17 and the pair of upper surface electrode layers 12.

  Next, a manufacturing method of the resistor according to the first embodiment of the present invention configured as described above will be described with reference to the drawings.

  FIG. 2 is a top view showing a state in which an unnecessary region portion is formed at an end portion of the entire periphery of the sheet-like insulating substrate used in manufacturing the resistor according to the first embodiment of the present invention. (E), FIG. 4 (a)-(e), FIG. 5 (a)-(d), FIG. 6 (a)-(d), FIG. 7 (a)-(c), and FIG. (C) is process drawing which shows the manufacturing method of the resistor in Embodiment 1 of this invention.

  First, as shown in FIG. 2, FIG. 3 (a), and FIG. 4 (a), a sheet-like insulating substrate 21 having a thickness of 0.2 mm and made of baked 96% purity alumina is prepared. In this case, as shown in FIG. 2, the sheet-like insulating substrate 21 has an unnecessary region portion 21 a that does not eventually become a product at the end of the entire periphery. And this unnecessary area | region part 21a is comprised by the substantially square shape.

  Next, as shown in FIG. 2, FIG. 3 (b), and FIG. 4 (b), a plurality of pairs of upper surface electrode layers 22 mainly composed of silver are formed on the upper surface of the sheet-like insulating substrate 21 by screen printing. The upper electrode layer 22 was made a stable film by firing with a firing profile having a peak temperature of 850 ° C.

  Next, as shown in FIGS. 2, 3 (c), and 4 (c), a plurality of ruthenium oxide-based resistance layers 23 are formed by screen printing so as to straddle a plurality of pairs of upper surface electrode layers 22. The resistance layer 23 was made a stable film by firing with a firing profile having a peak temperature of 850 ° C.

  Next, as shown in FIGS. 3D and 4D, a first protective layer 24 made of a plurality of precoat glass layers is formed by screen printing so as to cover the plurality of resistance layers 23, By firing with a firing profile having a peak temperature of 600 ° C., the first protective layer 24 made of the precoat glass layer was made a stable film.

  Next, as shown in FIGS. 3E and 4E, in order to adjust the resistance value of the resistance layer 23 between the plurality of pairs of upper surface electrode layers 22 to a constant value, trimming is performed by a laser trimming method. A plurality of trimming grooves 25 were formed.

  Next, as shown in FIGS. 5 (a) and 6 (a), a resin is applied by screen printing so as to cover the first protective layer 24 composed of a plurality of precoat glass layers arranged in the vertical direction on the drawing. A plurality of second protective layers 26 as main components were formed, and cured with a curing profile having a peak temperature of 200 ° C., thereby making the second protective layer 26 a stable film.

  Next, as shown in FIGS. 2, 5B, and 6B, a plurality of pairs of upper surfaces are formed except for the unnecessary region portion 21a formed at the end portion of the entire periphery of the sheet-like insulating substrate 21. A plurality of slit-shaped first divided portions 27 for separating the electrode layer 22 and dividing it into a plurality of strip-shaped substrates 21b are formed by a dicing method. In this case, the plurality of slit-shaped first divided portions 27 are formed at a pitch of 700 μm, and the width of the slit-shaped first divided portions 27 is 120 μm. The plurality of slit-shaped first divided portions 27 are formed by through holes that penetrate the sheet-like insulating substrate 21 in the vertical direction. Further, since the sheet-like insulating substrate 21 forms the plurality of slit-shaped first divided portions 27 by the dicing method except for the unnecessary region portion 21a, the slit-shaped first divided portions 27 are formed. Even after this, the plurality of strip-shaped substrates 21b are connected to the unnecessary region portion 21a, and thus are in a sheet state.

  Next, as shown in FIGS. 5C and 6C, a mask 28 made of a magnetic metal is formed on the back surface of the sheet-like insulating substrate 21 in a state where a plurality of slit-like first division portions 27 are formed. And a magnet 29 for fixing the mask 28 at a predetermined position on the upper surface side of the sheet-like insulating substrate 21. Next, as shown in FIG. 5D and FIG. 6D, in this installed state, using the sputtering method, the back surface of the sheet-like insulating substrate 21 and the plurality of slit-shaped first divided portions 27 are used. A plurality of pairs of side electrode layers 30 having a thickness of about 0.1 to 1 μm are formed on the inner surface of the substrate by using nickel or a nickel-based alloy, for example, a nickel-chromium alloy. In this case, the side electrode layer 30 formed on the inner surface of the plurality of slit-shaped first division portions 27 is in contact with and electrically connected to the upper surface electrode layer 22 formed on the upper surface of the sheet-like insulating substrate 21. Is.

  Next, as shown in FIGS. 7A and 8A, the mask 28 and the magnet 29 are removed.

  Next, as shown in FIGS. 7B and 8B, the exposed plurality of pairs of side electrode layers 30 and a part of the plurality of pairs of upper surface electrode layers 22 are covered using an electroplating method. In this manner, a plurality of pairs of nickel layers 31 made of nickel having a thickness of about 4 to 6 μm and a plurality of pairs of solder layers 32 made of tin having a thickness of about 4 to 6 μm are formed.

  The thickness of the side electrode layer 30 formed by the sputtering method is about 0.1 to 1 μm. However, the thickness is not limited to this range, and the thickness including the nickel layer 31 and the solder layer 32 is as follows. A thickness of 1-15 μm is reasonable.

  Further, the solder layer 32 is made of tin, but is not limited to this, and may be a tin alloy-based material. When formed of these materials, stable soldering can be performed during reflow soldering. It can be done.

  In addition, since the upper electrode layer 22 is made of a silver-based material and the resistance layer 23 is made of a ruthenium oxide-based material, resistance characteristics excellent in heat resistance and durability can be ensured. .

  Further, the protective layer covering the resistance layer 23 and the like is mainly composed of a first protective layer 24 made of a pre-coated glass layer covering the resistive layer 23 and a resin covering the first protective layer 24 and covering the trimming groove 25. Since it is composed of two layers of the second protective layer 26 as a component, the first protective layer 24 can prevent generation of cracks during laser trimming and reduce current noise, and the resin as a main component. By covering the entire resistance layer 23 with the second protective layer 26, it is possible to ensure resistance characteristics with excellent moisture resistance.

  Finally, as shown in FIGS. 2, 7C, and 8C, the sheet-like insulation is formed except for the unnecessary region portion 21a formed at the end of the entire circumference of the sheet-like insulating substrate 21. A dicing method is applied in a direction perpendicular to the slit-shaped first dividing portion 27 so that the plurality of resistive layers 23 are individually separated into the plurality of strip-shaped substrates 21b in the substrate 21 and divided into the piece-shaped substrates 21c. A plurality of second divided portions 33 are formed by using them. In this case, the plurality of second divided portions 33 are formed at a pitch of 400 μm, and the width of the second divided portions 33 is 100 μm. Since the plurality of second divided portions 33 are formed on the plurality of strip-shaped substrates 21b by the dicing method except for the unnecessary region portion 21a, each time the plurality of second divided portions 33 are formed. The product that is cut and divided into the individual substrate 21c and separated into pieces is separated from the unnecessary region portion 21a.

  The resistor according to the first embodiment of the present invention is manufactured through the processes as described above.

  The length dimension and width dimension of the resistor manufactured by the above process are accurate (within ± 0.005 mm) between the slit-shaped first divided portion 27 and the second divided portion 33 formed by the dicing method. In addition, since the thicknesses of the side electrode layer 30, the nickel layer 31, and the solder layer 32 are also accurate, the total length and the entire width of the resistor, which is a product, are exactly 0.6 mm long and 0.3 mm wide. . Further, the pattern accuracy of the upper surface electrode layer 22 and the resistance layer 23 is not required to be classified into the dimension ranks of the individual substrate, and it is not necessary to consider the dimensional variation within the dimension rank of the same individual substrate. The effective area of 23 can be made larger than that of the conventional product. That is, the resistance layer in the conventional product has a length of about 0.20 mm × width of 0.19 mm, whereas the resistor layer 23 of the resistor in the first embodiment of the present invention has a length of about 0.25 mm × width 0. .24 mm and the area is about 1.6 times or more.

  The plurality of slit-shaped first divided portions 27 and the plurality of second divided portions 33 are formed by using a dicing method, and the plurality of slit-shaped first divided portions 27 and the plurality of second divided portions 33 are formed. Since the divided portion 33 of 2 is formed by dicing on the sheet-like insulating substrate 21 that does not require the size classification of the individual substrate, the conventional size classification of the individual substrate is not required. In addition, it is possible to eliminate the complexity of the conventional process by exchanging the mask, and dicing can be easily performed using a general dicing equipment such as a semiconductor.

  Further, the sheet-like insulating substrate 21 forms an unnecessary region portion 21a that does not eventually become a product at the end of the entire periphery, and a plurality of slit-shaped first divided portions 27 and a plurality of second divided portions. Since the portion 33 is not formed in the unnecessary region portion 21a, the plurality of strip-shaped substrates 21b are connected to the unnecessary region portion 21a even after the plurality of slit-shaped first divided portions 27 are formed. Therefore, the sheet-like insulating substrate 21 is not finely separated into a plurality of strip-like substrates 21b. Therefore, even after the plurality of slit-shaped first divided portions 27 are formed, the unnecessary region portion 21a is provided. Since the post-process can be performed in the state of the sheet-like insulating substrate 21, the construction method design can be simplified. Further, when the plurality of second divided portions 33 are formed, every time the plurality of second divided portions 33 are formed, the product is cut and divided into the individual substrates 21c, and the separated products are separated from the unnecessary region portion 21a. Since they are separated, the construction method of selecting the unnecessary area 21a and the product later becomes unnecessary.

  In addition, since the plurality of pairs of side electrode layers 30, the nickel layers 31, and the plurality of pairs of solder layers 32 are formed in the state of the sheet-like insulating substrate 21, the side electrode layers 30 are formed as the sheet-like insulating substrate 21. The potential difference can be reduced when the nickel layer 31 and the solder layer 32 are formed by the electroplating method, thereby forming the stable nickel layer 31 and the solder layer 32. It can be done.

  In the first embodiment of the present invention, the unnecessary region portion 21a which is not finally a product is formed at the end of the entire periphery of the sheet-like insulating substrate 21 and is configured in a substantially square shape. As described above, the unnecessary region portion 21a is not necessarily formed at the end of the entire periphery of the sheet-like insulating substrate 21. For example, as shown in FIG. 9, an unnecessary region is formed at one end portion of the sheet-like insulating substrate 21. When the portion 21d is formed, when the unnecessary region portion 21e is formed at both end portions of the sheet-like insulating substrate 21 as shown in FIG. 10, at the three end portions of the sheet-like insulating substrate 21 as shown in FIG. Even when the unnecessary region portion 21f is formed, the same function and effect as those of the first embodiment of the present invention are achieved.

  In the first embodiment of the present invention, the plurality of second divided portions 33 are formed by the dicing method. However, in addition to this, for example, the plurality of second divided portions 33 are formed on the sheet. The sheet-like insulating substrate 21 is cut by a laser method, a dicing method, or the like, leaving a thin portion on any of the back side, the top side, and the center of the sheet-like insulating substrate 21 In these cases, each of the second divided portions 33 is not separated into pieces, but is separated into two stages.

  In the first embodiment of the present invention, a silver-based material is used for the top electrode layer 22 and a ruthenium oxide-based material is used for the resistance layer 23. However, the present invention is applicable to other material systems. The same effects as those of the first embodiment can be obtained.

  Furthermore, in Embodiment 1 of the present invention described above, the slit-shaped first divided portion 27 and the second divided portion 33 are formed using the dicing method, but in addition to this dicing method, a laser is used. Even when the slit-shaped first divided portion 27 and the second divided portion 33 are formed by using a dividing means such as a water jet or the like, the same effects as those of the first embodiment of the present invention can be obtained. Is.

  Furthermore, in the first embodiment of the present invention, when a plurality of slit-shaped first division portions 27 for dividing the plurality of strip-shaped substrates 21b are formed, a plurality of pairs of upper surface electrode layers 22, A plurality of slit-like first divided portions 27 are formed on a sheet-like insulating substrate 21 on which a resistance layer 23, a plurality of first protective layers 24, a plurality of trimming grooves 25, and a plurality of second protective layers 26 are formed. However, the present invention is not limited to this. For example, a plurality of first slit-shaped divided portions 27 are first formed on the sheet-like insulating substrate 21. In this case, when a sheet-like insulating substrate 21 in which a plurality of slit-shaped first division parts 27 are formed in advance is used, a plurality of pairs of upper surface electrode layers 22 are formed on the sheet-like insulating substrate 21, and then the sheet-like insulating substrate 21 is formed. Insulating substrate In the case where a plurality of slit-shaped first dividing portions 27 are formed in one, after forming a plurality of resistance layers 23 on the sheet-like insulating substrate 21, the slit-shaped first substrate 27 is formed on the sheet-like insulating substrate 21. When a plurality of divided portions 27 are formed, a plurality of pairs of upper surface electrode layers 22 of the sheet-like insulating substrate 21 are formed, and a plurality of resistances are formed so as to partially overlap the plurality of pairs of upper surface electrode layers 22. After forming the layer 23, when a plurality of slit-shaped first division parts 27 are formed on the sheet-like insulating substrate 21, a plurality of resistance layers 23 are formed on the sheet-like insulating substrate 21, and When a plurality of pairs of upper surface electrode layers 22 are formed so as to partially overlap the plurality of resistance layers 23, and then a plurality of slit-shaped first divided portions 27 are formed on the sheet-like insulating substrate 21. To the sheet-like insulating substrate 21 After forming several pairs of upper surface electrode layers 22 and a plurality of resistance layers 23 and performing trimming to adjust the resistance value between the plurality of pairs of upper surface electrode layers 22 in the plurality of resistance layers 23, the sheet Even when the slit-shaped first divided portion 27 is formed on the insulating substrate 21, the same effects as those of the first embodiment of the present invention are achieved.

Sectional drawing of the resistor in Embodiment 1 of this invention The top view which shows the state which formed the unnecessary area | region part in the edge part of the perimeter of the sheet-like insulated substrate used when manufacturing the resistor (A)-(e) Sectional drawing which shows the manufacturing process of the resistor (A)-(e) The top view which shows the manufacturing process of the resistor (A)-(d) Sectional drawing which shows the manufacturing process of the resistor (A)-(d) The top view which shows the manufacturing process of the resistor (A)-(c) Sectional drawing which shows the manufacturing process of the resistor (A)-(c) The top view which shows the manufacturing process of the resistor The top view which shows the state which formed the unnecessary area | region part in the one end part of the sheet-like insulating substrate used when manufacturing the resistor The top view which shows the state which formed the unnecessary area | region part in the both ends of the sheet-like insulated substrate used when manufacturing the resistor The top view which shows the state which formed the unnecessary area | region part in three edge parts of the sheet-like insulating substrate used when manufacturing the resistor Cross section of conventional resistor (A)-(f) Perspective view which shows the manufacturing process of the conventional resistor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 21 Sheet-like insulating substrate 21a, 21d-21f Unnecessary area | region part 21b Strip-shaped board | substrate 21c Single piece board | substrate 22 Upper surface electrode layer 23 Resistance layer 24 1st protective layer 25 Trimming groove 26 2nd protective layer 27 2nd protective layer 27 1 divided portion 28 mask 30 side electrode layer 31 nickel layer 32 solder layer 33 second divided portion

Claims (4)

Forming a plurality of pairs of upper surface electrode layers and a plurality of resistance layers on the upper surface of the sheet-like insulating substrate so as to be electrically connected to each other; and a resistance between the plurality of pairs of upper surface electrode layers in the plurality of resistance layers Trimming to adjust the value, forming a protective layer so as to cover at least the plurality of resistance layers, and separating the plurality of pairs of upper surface electrode layers on the sheet-like insulating substrate. Forming a plurality of slit-shaped first divided portions for dividing the strip-shaped substrate, and forming a magnet on a back surface of the sheet-like insulating substrate in a state in which the plurality of slit-shaped first divided portions are formed . A step of installing a mask by magnetic force, and a step of forming a plurality of pairs of side electrode layers by sputtering on the back surface of the insulating substrate and the inner surfaces of the plurality of slit-shaped first divided portions while the mask is installed; Previous After the side electrode layer is formed, the step of removing the mask from the sheet-like insulating substrate, and the plurality of strip layers in the sheet-like insulating substrate, the plurality of resistance layers are individually separated into pieces. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so as to be divided into substrates. Forming a plurality of pairs of upper surface electrode layers or a plurality of resistance layers on the upper surface of the sheet-like insulating substrate; and forming the plurality of pairs on the sheet-like insulating substrate on which the plurality of pairs of upper surface electrode layers or the plurality of resistance layers are formed. Forming a plurality of slit-shaped first division parts for separating the upper surface electrode layer or the plurality of resistance layers into a plurality of strip-shaped substrates, and the plurality of pairs of upper surface electrode layers or the plurality of resistance layers Forming a plurality of resistance layers or a plurality of pairs of upper surface electrode layers so as to partially overlap with each other, and performing a trimming to adjust a resistance value between the plurality of pairs of upper surface electrode layers in the plurality of resistance layers; A step of forming a protective layer so as to cover at least the plurality of resistance layers, and a mask is installed on the back surface of the sheet-like insulating substrate in a state in which a plurality of the slit-shaped first divided portions are formed by the magnetic force of a magnet. Do Forming a plurality of pairs of side electrode layers by sputtering on the back surface of the insulating substrate and the inner surfaces of the plurality of slit-shaped first divided portions with the mask installed; and forming the side electrode layers Then, the step of removing the mask from the sheet-like insulating substrate, and the plurality of resistive layers are individually separated into a plurality of strip-like substrates on the sheet-like insulating substrate and divided into individual pieces. And a step of forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions. Forming a plurality of pairs of upper surface electrode layers and a plurality of resistance layers on the upper surface of the sheet-like insulating substrate, and forming the plurality of pairs of upper surface electrode layers and the plurality of resistance layers; Forming a plurality of slit-shaped first divided portions for separating the plurality of pairs of upper surface electrode layers into a plurality of strip-shaped substrates on a sheet-like insulating substrate; and Trimming to adjust resistance values between a plurality of pairs of upper electrode layers, forming a protective layer so as to cover at least the plurality of resistance layers, and forming a plurality of slit-shaped first divided portions A step of installing a mask on the back surface of the sheet-like insulating substrate in a state of being formed by a magnetic force of a magnet, and sputtering on the back surface of the insulating substrate and the inner surfaces of the plurality of slit-shaped first divided portions with the mask installed Craft A step of forming a plurality of pairs of side electrode layers, a step of removing the mask from the sheet-like insulating substrate after forming the side electrode layers, and a plurality of strip-like substrates in the sheet-like insulating substrate, Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so that the plurality of resistance layers are individually separated and divided into individual piece-like substrates. Manufacturing method of resistors. A plurality of pairs of upper surface electrode layers and a plurality of resistance layers are formed on the upper surface of the sheet-like insulating substrate so as to be electrically connected to each other, and a resistance value between the plurality of pairs of upper surface electrode layers in the plurality of resistance layers. Trimming to adjust the thickness, and a slit-shaped first for separating the plurality of pairs of upper surface electrode layers into a plurality of strip-shaped substrates on the trimmed sheet-like insulating substrate A step of forming a plurality of divided portions; a step of forming a protective layer so as to cover at least the plurality of resistance layers; and a back surface of the sheet-like insulating substrate in which a plurality of slit-shaped first divided portions are formed. a step of placing a mask by the magnetic force of the magnet, the side electrode layer of the plurality of pairs by a sputtering method on the inner surface of the first divided portion backside and a plurality of slit-shaped the insulating substrate while installing the mask Forming the side electrode layer, removing the mask from the sheet-like insulating substrate, and forming the plurality of resistive layers individually on the plurality of strip-like substrates in the sheet-like insulating substrate. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so as to be separated into individual pieces.

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