JP2001274002A - Resistor and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To unnecessitate dimensional classification of chip-type substrates, eliminate a conventional step for changing a mask according to the dimensional ranking of the chip-type substrate, and to provide an inexpensive and fine resistor. SOLUTION: This resistor is comprised of a chip-type substrate 11 that a sheet-like insulation substrate is divided by a first slitted dividing part and a second dividing part orthogonal to the first dividing part, an upper electrode layer 12 formed on the substrate 11, a resistance layer 13 which is formed overlapping partly the upper electrode layer 12, protective layers 14 and 16 which is formed covering the resistance layer 13, a side electrode layer 17 formed on the side surface of the substrate 11 so that it may be electrically connected with the upper electrode layer 12, and a solder layer 18 covering the side electrode layer 17.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a resistor and a method for manufacturing the same, and more particularly, to a fine resistor and a method for manufacturing the same.

[0002]

2. Description of the Related Art As a conventional resistor of this type, a resistor disclosed in Japanese Patent Application Laid-Open No. 4-102302 is known.

A conventional resistor and a method for manufacturing the same will be described below with reference to the drawings.

FIG. 42 is a sectional view of a conventional resistor.

In FIG. 42, reference numeral 1 denotes an insulating individual piece substrate made of porcelain such as alumina. Reference numeral 2 denotes a pair of first upper electrode layers provided on both right and left ends of the upper surface of the individual substrate 1. Reference numeral 3 denotes a resistance layer provided on the upper surface of the individual substrate 1 so as to partially overlap the pair of first upper electrode layers 2. Reference numeral 4 denotes a first protective layer provided so as to cover only the entire resistive layer 3. Reference numeral 5 denotes a trimming groove provided in the resistance layer 3 and the first protection layer 4 for correcting the resistance value. Reference numeral 6 denotes a second protective layer provided only on the upper surface of the first protective layer 4. Reference numeral 7 denotes a pair of second upper electrode layers provided on the upper surfaces of the pair of first upper electrode layers 2 so as to extend to the full width of the individual substrate 1. 8
Are a pair of side electrode layers provided on both side surfaces of the individual substrate 1. Reference numerals 9 and 10 denote a pair of nickel plating layers and a pair of solder plating layers provided on the surfaces of the pair of second upper electrode layers 7 and the pair of side electrode layers 8, respectively. In this case, the solder plating layer 10 is provided lower than the second protective layer 6.

Next, a method of manufacturing the conventional resistor having the above-described structure will be described with reference to the drawings.

FIGS. 43A to 43F are process diagrams showing a conventional method for manufacturing a resistor.

First, as shown in FIG. 43 (a), a pair of first upper electrode layers 2 are formed by coating on the left and right ends of the upper surface of an individual piece substrate 1 having an insulating property.

Next, as shown in FIG. 43B, a resistive layer 3 is formed on the upper surface of the individual substrate 1 so as to partially overlap the pair of first upper electrode layers 2.

Next, as shown in FIG. 43 (c), after a first protective layer 4 is formed by coating so as to cover only the entire resistive layer 3, the total resistance of the resistive layer 3 is reduced to a predetermined value. A trimming groove 5 is formed in the resistance layer 3 and the first protection layer 4 by a laser or the like so as to fall within the range of the value.

Next, as shown in FIG. 43D, a second protective layer 6 is formed by coating only on the upper surface of the first protective layer 4.

Next, as shown in FIG. 43 (e), the individual substrate 1 is located on the upper surfaces of the pair of first upper electrode layers 2.
A pair of second upper electrode layers 7 is formed by coating so as to extend to the full width of the upper electrode layer.

Next, as shown in FIG. 43 (f), a pair of first upper surface electrode layers 2 and a pair of first and second upper surface electrode layers 2 , 7 are coated with a pair of side electrode layers 8 so as to be electrically connected thereto.

Finally, the surfaces of the pair of second upper electrode layers 7 and the pair of side electrode layers 8 are nickel-plated and then plated with solder to form a pair of nickel plating layers 9 and a pair of solder layers. The conventional resistor was manufactured by forming the plating layer 10.

Further, the above-mentioned resistor has also been extremely miniaturized, and in recent years, the length is 0.6 mm × the width is 0.3 mm ×
Very small resistors with a thickness of 0.25 mm have also been manufactured.

[0016]

Problems to be solved when a very small resistor having a length of 0.6 mm, a width of 0.3 mm and a thickness of 0.25 mm are to be manufactured by the above-mentioned conventional configuration and manufacturing method will be described. I do.

A conventional sheet-like insulating substrate made of porcelain such as alumina is manufactured by forming a substrate dividing groove in advance before firing the sheet-like insulating substrate, and firing the insulating substrate. For this reason, the substrate division groove formed in advance on the sheet-shaped insulating substrate has a dimensional variation due to a delicate variation in the composition of the sheet-shaped insulating substrate or a delicate variation in the temperature during firing of the sheet-shaped insulating substrate. (This dimensional variation is about 100
Approximately 0.5 m for a sheet-shaped insulating substrate of mm x 100 mm
m. ).

When a very fine resistor is manufactured using a sheet-shaped insulating substrate having such a dimensional variation, the dimensions of the individual substrate are extremely fine in both the vertical and horizontal directions. It is necessary to classify into the dimensional ranks and prepare screen printing masks corresponding to the respective dimensional ranks, such as the upper electrode layer 2, the resistive layer 3, the protective layer 4, and the like. It has to be exchanged, and as a result, there is a problem that the process becomes very complicated (dimension rank is 0.05 mm
In the case of classifying by increments, a total of about 600 ranks in vertical and horizontal directions and a total of about 600 ranks or more are required. ).

The present invention solves the above-mentioned conventional problems, and eliminates the need for dimensional classification of individual substrates, and replaces the conventional process of exchanging masks according to the dimensional rank of individual substrates. It is an object of the present invention to provide an inexpensive and fine resistor that can be eliminated.

[0020]

In order to achieve the above object, a resistor according to the present invention comprises a sheet-like insulating substrate and a slit-like first divided portion which is orthogonal to the first divided portion. The singulated substrate divided into two by the dividing part, a pair of upper electrode layers formed on the upper surface of the singulated substrate, and a part of the pair of upper electrode layers are overlapped. A protective layer formed so as to cover the resistive layer, and a nickel-based layer formed on a side surface of the individual substrate so as to be electrically connected to the pair of upper electrode layers. With a pair of side electrode layers formed by electrodes and a pair of solder layers covering the pair of side electrode layers, according to this configuration, it is not necessary to classify the size of the individual substrate, as in the related art. Eliminates the process of replacing masks according to the dimensional rank of simple individual substrates It is possible, it is capable of providing inexpensive, and fine resistor.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS According to a first aspect of the present invention, a sheet-like insulating substrate is formed by dividing a sheet-shaped insulating substrate into a first divided portion and a second divided portion which is orthogonal to the first divided portion. And a pair of upper electrode layers formed on the upper surface of the individual substrate, and a pair of upper electrode layers formed on the upper surface of the individual substrate. A resistance layer, a protective layer formed to cover the resistance layer, and a pair of nickel-based electrodes formed on side surfaces of the individual substrate so as to be electrically connected to the pair of upper electrode layers. According to this structure, the sheet-like insulating substrate is provided with a slit-shaped first divided portion and a first side-divided portion, the side-surface electrode layer and a pair of solder layers covering the pair of side-surface electrode layers. Singly divided by dividing by a second dividing part which is orthogonal to the part Is used, so that there is no need to classify the size of the individual substrates, which eliminates the step of replacing the mask according to the dimension rank of the individual substrates, as well as being inexpensive. And a fine resistor can be provided.

According to a second aspect of the present invention, a sheet-shaped insulating substrate is divided into a slit-shaped first divided portion and a second divided portion which is orthogonal to the first divided portion. The individualized substrate, a resistance layer formed on the upper surface of the individualized substrate, a pair of upper electrode layers formed so as to partially overlap the resistance layer, and a layer covering the resistance layer. A pair of side electrode layers formed of nickel-based electrodes formed on side surfaces of the individual substrate so as to be electrically connected to the pair of upper surface electrode layers; and the pair of side electrodes. According to this configuration, a sheet-like insulating substrate is formed by a first split portion having a slit shape and a second split portion that is orthogonal to the first split portion. Since a singulated substrate is used, which is divided by dividing It is not necessary to classify the size of the plate, thereby eliminating the step of replacing the mask according to the size rank of the individual substrate as in the related art, and providing an inexpensive and fine resistor. It has the effect of being able to do so.

According to a third aspect of the present invention, the thickness of the pair of side electrode layers according to the first or second aspect is 1 to 15 μm, and according to this configuration, extremely high dimensional accuracy is achieved. It has the effect that something can be obtained.

According to a fourth aspect of the present invention, the pair of solder layers according to the first or second aspect is formed of a tin or tin alloy-based material. It has the effect of being able to be soldered.

According to a fifth aspect of the present invention, the pair of upper electrode layers according to the first or second aspect is made of a silver-based material and the resistance layer is made of a ruthenium oxide-based material. According to the configuration, it has an effect that a resistance characteristic excellent in heat resistance and durability can be secured.

According to a sixth aspect of the present invention, the protective layer according to the first or second aspect includes a first protective layer made of a glass layer covering the resistance layer, and a resin covering the first protective layer. According to this configuration, the first protective layer made of a glass layer can prevent the occurrence of cracks during laser trimming, so that the current noise can be reduced. At the same time, since the entire resistive layer is covered with the second protective layer mainly composed of resin, it has the effect of ensuring the resistance characteristics with excellent moisture resistance.

The invention according to claim 7 is a step of forming a plurality of pairs of upper electrode layers on the upper surface of a sheet-shaped insulating substrate, and the step of forming a plurality of resistance layers so that a part of the plurality of upper electrode layers partially overlaps the plurality of pairs of upper electrode layers. Forming, adjusting the resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers, and forming a plurality of protection layers so as to cover at least the plurality of resistance layers. A step of forming a plurality of slit-shaped first divided portions for dividing the sheet-shaped insulating substrate into a plurality of strip-shaped substrates, and a state in which the plurality of slit-shaped first divided portions are formed. Forming a plurality of pairs of side electrode layers on the inner surface of the plurality of slit-shaped first divided portions of the sheet-shaped insulating substrate; and forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers. Forming, and In a plurality of strip-shaped substrates in the shape of an insulating substrate, the plurality of resistive layers are individually separated and divided into a plurality of individual substrates in a direction orthogonal to the slit-shaped first divided portion. And forming a plurality of slit-shaped first divided portions in the sheet-shaped insulating substrate in which a plurality of slit-shaped first divided portions are formed. Since a plurality of pairs of side electrode layers are formed on the inner surface of one divided portion, this side electrode layer does not have to be formed for each of a plurality of strip-shaped substrates as in the related art, but is in a state of a sheet-shaped insulating substrate. And has the effect of being able to be formed collectively.

The invention according to claim 8 is a step of forming a plurality of resistance layers on the upper surface of a sheet-shaped insulating substrate, and forming a plurality of pairs of upper electrode layers so as to partially overlap the plurality of resistance layers. Performing, trimming to adjust the resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers, and forming a plurality of protective layers so as to cover at least the plurality of resistance layers. A first slit-shaped substrate for dividing the sheet-shaped insulating substrate into a plurality of strip-shaped substrates;
Forming a plurality of divided portions, and forming the slit-shaped first portion.
Forming a plurality of pairs of side surface electrode layers on the inner surface of the plurality of slit-shaped first divided portions in a sheet-like insulating substrate in which a plurality of divided portions are formed; and Forming a plurality of pairs of solder layers so as to cover the plurality of strip-shaped substrates in the sheet-shaped insulating substrate, wherein the plurality of resistive layers are individually separated so as to be divided into individual substrates. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portion. According to this manufacturing method, a plurality of slit-shaped first divided portions are formed. Because a plurality of pairs of side electrode layers are formed on the inner surfaces of the plurality of slit-shaped first divisions in the sheet-like insulating substrate in the folded state, the side electrode layers are formed of a plurality of strips as in the related art. Sheet-shaped without forming for each substrate Those having an effect of being able to form collectively a state of the insulating substrate.

According to a ninth aspect of the present invention, there is provided a method for forming a plurality of pairs of upper electrode layers on an upper surface, and forming a plurality of resistance layers so as to partially overlap the plurality of pairs of upper electrode layers.
A sheet in which a step of performing trimming for adjusting a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers and a step of forming a plurality of protective layers so as to cover at least the plurality of resistance layers are performed. A plurality of slit-shaped first divided portions for separating the plurality of pairs of upper electrode layers and dividing the plurality of strip-shaped substrates into a plurality of strip-shaped substrates are formed on the insulated substrate. A plurality of pairs of side surface electrode layers are formed on the inner surface of the plurality of slit-shaped first divided portions by applying nickel plating to the sheet-shaped insulating substrate in a state where a plurality of portions are formed by electroless plating. ,
A plurality of pairs of solder layers are formed so as to cover a plurality of pairs of side electrode layers, and thereafter, the plurality of resistive layers are individually separated on a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, and the individual substrate is formed. A plurality of second divided portions are formed in a direction orthogonal to the slit-shaped first divided portion so as to be divided into a plurality of slit-shaped first divided portions. According to this manufacturing method, a plurality of slit-shaped first divided portions are formed. A plurality of pairs of side electrode layers are formed on the inner surface of the plurality of slit-shaped first divided portions by applying nickel plating to the formed sheet-shaped insulating substrate by electroless plating. This side electrode layer can be formed collectively in the form of a sheet-shaped insulating substrate, instead of being formed for each of a plurality of strip-shaped substrates as in the related art, and so as to cover a plurality of pairs of side electrode layers. When forming multiple pairs of solder layers In addition, since it can be formed in a lump in the state of a sheet-shaped insulating substrate, and when the solder layer is formed by an electroplating method, the potential difference can be reduced, so that a stable solder layer can be formed. Have

The invention according to claim 10 is a step of forming a plurality of resistance layers on an upper surface, a step of forming a plurality of pairs of upper electrode layers so as to partially overlap the plurality of resistance layers, A step of performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the resistance layer, and a step of forming a plurality of protective layers so as to cover at least the plurality of resistance layers. On the insulating substrate, a plurality of slit-shaped first divided portions for separating the plurality of pairs of upper surface electrode layers and dividing into a plurality of strip-shaped substrates are formed,
By applying nickel plating to the sheet-like insulating substrate having the plurality of slit-shaped first divided portions formed thereon by an electroless plating method, a plurality of pairs of slit-shaped first divided portions are formed on inner surfaces of the plurality of slit-shaped first divided portions. Forming side electrode layers, then forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers, and then, on the plurality of strip-shaped substrates in the sheet-shaped insulating substrate, the plurality of resistance layers According to this manufacturing method, a plurality of second divided portions are formed in a direction orthogonal to the first slit-shaped divided portions so as to be separated into individual pieces and divided into individual substrates. A plurality of pairs of side electrodes are formed on the inner surface of the plurality of slit-shaped first divided portions by applying nickel plating to the sheet-shaped insulating substrate in a state in which a plurality of first divided portions are formed by electroless plating. To form a layer Are therefore, this aspect electrode layer without forming for each of a plurality of strip-like substrate as in the prior art can be formed collectively in a state of a sheet-like insulating substrate,
Also, in the case where a plurality of pairs of solder layers are formed so as to cover a plurality of pairs of side electrode layers, the solder layers can be formed collectively in the state of a sheet-shaped insulating substrate and the solder layer is formed by an electroplating method. Has an effect that a stable solder layer can be formed because the potential difference can be reduced.

According to an eleventh aspect of the present invention, a plurality of pairs of upper electrode layers and a plurality of resistance layers are formed on an upper surface of a sheet-shaped insulating substrate so that both are electrically connected to each other; A step of performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the resistive layer, a step of forming a plurality of protective layers so as to cover at least the plurality of resistive layers, and the sheet-shaped insulating substrate Forming a resist layer on the back surface of the substrate; and forming a plurality of slit-shaped first divided portions on the sheet-shaped insulating substrate for separating the plurality of pairs of upper electrode layers into a plurality of strip-shaped substrates. Forming a nickel or nickel-based alloy by sputtering on the back surface of the sheet-shaped insulating substrate and the inner surface of the plurality of slit-shaped first divided portions where a plurality of the slit-shaped first divided portions are formed. Forming a plurality of pairs of side electrode layers by removing the resist layer and patterning a plurality of pairs of side electrode layers, and forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers. In a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, the plurality of resistive layers are individually separated and divided into individual substrates in a direction orthogonal to the slit-shaped first divided portion. Forming a plurality of second divided portions. According to this manufacturing method, a plurality of pairs of upper surface electrode layers are separated into a plurality of strip-shaped substrates on a sheet-shaped insulating substrate. Forming a plurality of slit-shaped first divided portions for forming a plurality of slit-shaped first divided portions, a back surface of a sheet-shaped insulating substrate in which a plurality of slit-shaped first divided portions are formed, and a plurality of slit-shaped first divided portions To the inner surface of the part by sputtering. A step of forming a side electrode layer made of a metal or a nickel-based alloy, and a step of patterning a plurality of pairs of side electrode layers by peeling a resist layer formed on the back surface of the sheet-shaped insulating substrate. The side surface electrode layer has an effect that it can be formed collectively in a state of a sheet-shaped insulating substrate, instead of being formed for each of a plurality of strip-shaped substrates as in the related art.

According to a twelfth aspect of the present invention, a plurality of pairs of upper electrode layers and a plurality of resistance layers are formed on the upper surface so that they are electrically connected to each other; The step of performing trimming to adjust the resistance value between the upper electrode layers of the above, and the step of forming a plurality of protective layers so as to cover at least the plurality of resistive layers, the sheet-like insulating substrate, A plurality of slit-shaped first divided portions for separating the upper electrode layer of the above into a plurality of strip-shaped substrates, and then forming the plurality of slit-shaped first divided portions on the sheet A mask is provided on the back surface of the insulating substrate in a shape of a matrix, and a plurality of pairs of nickel or a nickel-based alloy are formed on the back surface of the insulating substrate and the inner surfaces of the plurality of first slit portions by the sputtering method in a state where the mask is provided. Forming side electrode layers, then forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers, and then, on the plurality of strip-shaped substrates in the sheet-shaped insulating substrate, the plurality of resistance layers According to this manufacturing method, a plurality of second divided portions are formed in a direction orthogonal to the first slit-shaped divided portions so as to be separated into individual pieces and divided into individual substrates. A mask is provided on the back surface of a sheet-shaped insulating substrate in which a plurality of first divided portions are formed, and the back surface of the insulating substrate and a plurality of slit-shaped first divided portions are provided in a state where the mask is provided. Because a plurality of pairs of side electrode layers made of nickel or a nickel-based alloy are formed on the inner surface of the substrate by a sputtering method, the side electrode layers are not formed for each of a plurality of strip-shaped substrates as in the related art, but are formed in a sheet shape. Insulation group Those having an effect of being able to collectively formed in the state.

According to a thirteenth aspect of the present invention, a plurality of pairs of upper electrode layers and a plurality of resistance layers are formed on the upper surface so that they are electrically connected to each other. The step of performing trimming to adjust the resistance value between the upper electrode layers of the above, and the step of forming a plurality of protective layers so as to cover at least the plurality of resistive layers, the sheet-like insulating substrate, A plurality of slit-shaped first divided portions for separating the upper electrode layer of the above into a plurality of strip-shaped substrates, and then forming the plurality of slit-shaped first divided portions on the sheet A metal film made of nickel or a nickel-based alloy is formed on the entire back surface of the insulated substrate, and a plurality of pairs of side electrode layers made of nickel or a nickel-based alloy are formed on the inner surfaces of the plurality of slit-shaped first divided portions. Thereafter, unnecessary portions of the metal film formed on the entire back surface of the sheet-shaped insulating substrate are removed with a laser to form a plurality of pairs of back electrode layers, and then cover the plurality of pairs of side electrode layers. To form a plurality of pairs of solder layers, and then, on the plurality of strip-shaped substrates in the sheet-shaped insulating substrate, the plurality of resistive layers are individually separated so that the plurality of resistive layers are separated into individual-piece substrates. A plurality of second divided portions are formed in a direction orthogonal to the first divided portion. According to this manufacturing method, the slit-shaped first divided portion is formed.
A metal film made of nickel or a nickel-based alloy is formed on the entire back surface of the sheet-shaped insulating substrate having a plurality of divided portions formed thereon, and nickel or nickel-based metal is formed on the inner surface of the plurality of slit-shaped first divided portions. A plurality of pairs of side electrode layers are formed of an alloy, and thereafter, a plurality of pairs of back electrode layers are formed by removing unnecessary portions of a metal film formed on the entire back surface of the sheet-shaped insulating substrate with a laser. Therefore, this side electrode layer can be formed collectively in the state of a sheet-shaped insulating substrate without forming it for each of a plurality of strip-shaped substrates as in the related art. Since a plurality of pairs of back electrode layers are formed by removing unnecessary portions of the metal film formed on the entire surface with a laser, the dimensional accuracy of the back electrode layer can be improved. More, those having an effect of this resistor can be reduced mounting failure when mounted on the back surface side in the mounting substrate.

According to a fourteenth aspect of the present invention, in the sheet-like insulating substrate, a plurality of slit-like first divisions for dividing the insulating substrate into a plurality of strip-like substrates are formed. Forming a plurality of pairs of upper surface electrode layers on the upper surface of a sheet-shaped insulating substrate having a plurality of divided portions formed therein, and forming a plurality of resistance layers so as to partially overlap the plurality of pairs of upper surface electrode layers Performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers, and forming a plurality of protective layers so as to cover at least the plurality of resistance layers; A plurality of pairs of side surfaces are formed on the inner surface of the plurality of slit-shaped first divided portions by applying nickel plating to the sheet-shaped insulating substrate having a plurality of slit-shaped first divided portions formed thereon by an electroless plating method. Form the electrode layer A step of forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; and a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, wherein the plurality of resistance layers are individually separated. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so as to be divided into individual substrates. A plurality of pairs of side electrodes are formed on the inner surface of the plurality of slit-shaped first divided portions by applying nickel plating to the sheet-shaped insulating substrate in a state in which a plurality of first divided portions are formed by electroless plating. Since the layers are formed, this side electrode layer can be formed collectively in the form of a sheet-shaped insulating substrate, instead of being formed for each of a plurality of strip-shaped substrates as in the related art,
Also, in the case where a plurality of pairs of solder layers are formed so as to cover a plurality of pairs of side electrode layers, the solder layers can be formed collectively in the state of a sheet-shaped insulating substrate and the solder layer is formed by an electroplating method. Has an effect that a stable solder layer can be formed because the potential difference can be reduced.

According to a fifteenth aspect of the present invention, a step of forming a plurality of slit-shaped first divided portions for dividing the insulating substrate into a plurality of strip-shaped substrates on the sheet-shaped insulating substrate; Forming a plurality of resistive layers on the upper surface of a sheet-shaped insulating substrate having a plurality of divided portions formed thereon, and forming a plurality of pairs of upper surface electrode layers so as to partially overlap the plurality of resistive layers; A step of performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers; a step of forming a plurality of protective layers so as to cover at least the plurality of resistance layers; A plurality of pairs of side electrode layers are formed on the inner surface of the plurality of slit-shaped first divided portions by applying nickel plating to the sheet-shaped insulating substrate having the plurality of first divided portions formed thereon by electroless plating. The process of forming Forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; and forming a plurality of strips of the sheet-shaped insulating substrate, wherein the plurality of resistance layers are individually separated and individually. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so as to be divided into a substrate having a slit shape. A plurality of pairs of side electrode layers are formed on the inner surfaces of the plurality of slit-shaped first divided portions by applying nickel plating to the sheet-shaped insulating substrate having a plurality of first divided portions formed thereon by electroless plating. Since the side electrode layer is formed, it can be formed collectively in the form of a sheet-shaped insulating substrate, instead of being formed for each of a plurality of strip-shaped substrates as in the related art. Pair of pairs to cover side electrode layers In the case where a solder layer is formed, it can be formed collectively in the state of a sheet-like insulating substrate, and when the solder layer is formed by an electroplating method, the potential difference can be reduced, so that a stable This has the function of forming a solder layer.

According to a sixteenth aspect of the present invention, a step of forming a plurality of slit-shaped first divided portions for dividing the insulating substrate into a plurality of strip-shaped substrates on the sheet-shaped insulating substrate; Forming a plurality of pairs of upper electrode layers and a plurality of resistance layers on the upper surface of a sheet-shaped insulating substrate having a plurality of divided portions formed thereon so that both are electrically connected to each other; A step of performing trimming to adjust a resistance value between a plurality of pairs of upper electrode layers, a step of forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and a resist on a back surface of the sheet-shaped insulating substrate Forming a layer, nickel or nickel by a sputtering method on the back surface of the sheet-shaped insulating substrate having the plurality of slit-shaped first divided portions formed thereon and on the inner surface of the plurality of slit-shaped first divided portions. Forming a side electrode layer of a base alloy, stripping the resist layer and patterning a plurality of pairs of side electrode layers, and forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers. A plurality of strip-shaped substrates in the sheet-shaped insulating substrate, wherein the plurality of resistive layers are separated from each other and are orthogonal to the slit-shaped first divided portions so as to be divided into individual substrates. Forming a plurality of second divided portions in the direction. According to this manufacturing method, a plurality of pairs of upper electrode layers are separated into a plurality of strip-shaped substrates by separating a plurality of pairs of upper electrode layers on a sheet-shaped insulating substrate. Forming a plurality of slit-shaped first divided portions for dividing, a back surface of the sheet-shaped insulating substrate in a state where the plurality of slit-shaped first divided portions are formed, and a plurality of slit-shaped first portions; Sputtering method on the inner surface of the split part Forming a side electrode layer of nickel or a nickel-based alloy, and a step of patterning a plurality of pairs of side electrode layers by removing a resist layer formed on the back surface of the sheet-shaped insulating substrate, This side electrode layer has an effect that it can be formed collectively in the state of a sheet-shaped insulating substrate, instead of being formed for each of a plurality of strip-shaped substrates as in the related art.

The invention according to claim 17 is a step of forming a plurality of slit-shaped first divided portions for dividing the insulating substrate into a plurality of strip-shaped substrates on the sheet-shaped insulating substrate; Forming a plurality of pairs of upper electrode layers and a plurality of resistance layers on the upper surface of a sheet-shaped insulating substrate having a plurality of divided portions formed thereon so that both are electrically connected to each other; A step of performing trimming to adjust a resistance value between a plurality of pairs of upper electrode layers, a step of forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and a mask on a back surface of the sheet-shaped insulating substrate And the inner surface of the sheet-shaped insulating substrate and the inner surface of the plurality of slit-shaped first divided portions in a state in which a plurality of the slit-shaped first divided portions are formed with the mask installed. By sputtering method Forming a plurality of pairs of side electrode layers of nickel or a nickel-based alloy, forming a plurality of pairs of solder layers to cover the plurality of pairs of side electrode layers, and forming a plurality of strips on the sheet-shaped insulating substrate. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so that the plurality of resistive layers are individually separated and divided into individual substrates on the substrate According to this manufacturing method, a mask is provided on the back surface of the sheet-shaped insulating substrate in a state where a plurality of slit-shaped first divided portions are formed, and the mask is provided in a state where the mask is provided. Since a plurality of pairs of side electrode layers made of nickel or a nickel-based alloy are formed on the back surface of the insulating substrate and the inner surfaces of the plurality of slit-shaped first divided portions by a sputtering method, this side electrode layer is formed by a conventional method. Without forming each urchin plurality of strip-like substrate, and has an effect of being able to form collectively a state of a sheet-like insulating substrate.

The invention according to claim 18 is a step of forming a plurality of slit-shaped first divided portions for dividing the insulating substrate into a plurality of strip-shaped substrates on the sheet-shaped insulating substrate; Forming a plurality of pairs of upper electrode layers and a plurality of resistance layers on the upper surface of a sheet-shaped insulating substrate having a plurality of divided portions formed thereon so that both are electrically connected to each other; A step of performing trimming to adjust a resistance value between a plurality of pairs of upper surface electrode layers, a step of forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and the slit-shaped first divided portion. A metal film made of nickel or a nickel-based alloy is formed on the entire back surface of the sheet-shaped insulating substrate in a plurality of formed states, and nickel or a nickel-based alloy is formed on the inner surfaces of the plurality of slit-shaped first divided portions. Forming a plurality of pairs of side surface electrode layers, forming a plurality of pairs of back surface electrode layers by removing unnecessary portions of a metal film formed on the back surface of the sheet-shaped insulating substrate with a laser, A step of forming a plurality of pairs of solder layers so as to cover the pair of side electrode layers, and a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, wherein the plurality of resistance layers are individually separated into individual pieces. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portion so as to be divided. According to this manufacturing method, the slit-shaped first divided portion is formed. A metal film made of nickel or a nickel-based alloy is formed on the entire back surface of the sheet-shaped insulating substrate having a plurality of divided portions formed thereon, and a nickel or nickel-based alloy is formed on the inner surface of the plurality of slit-shaped first divided portions. By A plurality of pairs of back electrode layers are formed by forming a plurality of pairs of side electrode layers, and then removing unnecessary portions of the metal film formed on the entire back surface of the sheet-shaped insulating substrate with a laser. Therefore, this side surface electrode layer can be formed collectively in the state of a sheet-shaped insulating substrate without being formed for each of a plurality of strip-shaped substrates as in the related art. Since a plurality of pairs of back electrode layers are formed by removing unnecessary portions of the formed metal film with a laser, the dimensional accuracy of the back electrode layer can be improved. This has the effect of reducing mounting defects when mounted on a mounting board.

According to a nineteenth aspect of the present invention, a plurality of pairs of upper electrode layers are formed on the upper surface of a sheet-like insulating substrate in which a plurality of slit-like first divisions for dividing into a plurality of strip-like substrates are formed in advance. Forming, forming a plurality of resistance layers such that a part thereof overlaps the plurality of pairs of upper surface electrode layers, and adjusting a resistance value between the plurality of pairs of upper surface electrode layers in the plurality of resistance layers. Performing a trimming process;
Forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and applying nickel plating to the sheet-like insulating substrate in a state where the plurality of slit-like first divided portions are formed by an electroless plating method. Forming a plurality of pairs of side-surface electrode layers on the inner surface of the plurality of slit-shaped first divided portions by applying, and forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side-surface electrode layers. In a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, the plurality of resistive layers are individually separated and divided into individual substrates in a direction orthogonal to the slit-shaped first divided portion. Forming a plurality of second divisions, and according to this manufacturing method, an electroless plating method is applied to a sheet-like insulating substrate in which a plurality of slit-like first divisions are formed. With nickel plating The said plurality of slit-like by 1
Because a plurality of pairs of side surface electrode layers are formed on the inner surface of the divided portion, this side surface electrode layer is not formed for each of a plurality of strip-shaped substrates as in the related art, but in the state of a sheet-shaped insulating substrate. It can be formed collectively, and when forming a plurality of pairs of solder layers so as to cover a plurality of pairs of side electrode layers, it can be formed collectively in the state of a sheet-shaped insulating substrate, and When the layer is formed by the electroplating method, the potential difference can be reduced,
This has the function of forming a stable solder layer.

According to a twentieth aspect of the present invention, a plurality of resistive layers are formed on an upper surface of a sheet-like insulating substrate in which a plurality of slit-like first dividing portions for dividing into a plurality of rectangular substrates are formed in advance. A step of forming a plurality of pairs of upper surface electrode layers such that a part of the upper surface electrode layers partially overlaps the plurality of resistance layers, and trimming to adjust a resistance value between the plurality of pairs of upper surface electrode layers in the plurality of resistance layers. Performing, a step of forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and an electroless plating method on a sheet-shaped insulating substrate in which a plurality of the slit-shaped first divided portions are formed. Forming a plurality of pairs of side electrode layers on the inner surface of the plurality of slit-shaped first divided portions by applying nickel plating, and forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers. Form And a plurality of strip-shaped substrates in the sheet-shaped insulating substrate are orthogonal to the slit-shaped first divided portion such that the plurality of resistance layers are individually separated and divided into individual substrates. Forming a plurality of second divided portions in the direction. According to this manufacturing method, the sheet-shaped insulating substrate having a plurality of slit-shaped first divided portions formed thereon is electroless. Since a plurality of pairs of side electrode layers are formed on the inner surface of the plurality of slit-shaped first divided portions by performing nickel plating by a plating method, the side electrode layers are formed of a plurality of strips as in the related art. Can be formed collectively in the form of a sheet-shaped insulating substrate without forming for each substrate, and when a plurality of pairs of solder layers are formed to cover a plurality of pairs of side electrode layers, Collectively formed on the insulating substrate It is Rukoto, it is possible to reduce a potential difference in the case of forming by electroplating method of the solder layer, and has an effect of being able to form a stable solder layer.

According to a twenty-first aspect of the present invention, a plurality of pairs of upper electrode layers are formed on the upper surface of a sheet-like insulating substrate in which a plurality of slit-like first divisions for dividing into a plurality of strip-like substrates are formed in advance. Forming a plurality of resistance layers so that both are electrically connected; and performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers; Forming a plurality of protective layers so as to cover the resistive layer, forming a resist layer on the back surface of the sheet-shaped insulating substrate, and forming a plurality of the slit-shaped first divided portions. Forming a side electrode layer made of nickel or a nickel-based alloy on the back surface of the sheet-shaped insulating substrate and the inner surfaces of the plurality of slit-shaped first divided portions by a sputtering method, and peeling the resist layer; Patterning a plurality of pairs of side electrode layers; forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; and forming a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so that the resistive layers are individually separated and divided into individual substrates. According to this manufacturing method, the back surface of the sheet-shaped insulating substrate in which a plurality of slit-shaped first divided portions for dividing into a plurality of strip-shaped substrates are formed in advance and the plurality of slit-shaped first divided portions are formed. A step of forming a side electrode layer made of nickel or a nickel-based alloy on the inner surface by a sputtering method, and removing a resist layer formed on the back surface of the sheet-shaped insulating substrate to pattern a plurality of pairs of side electrode layers. Therefore, this side electrode layer has an effect that it can be formed collectively in the form of a sheet-shaped insulating substrate, instead of being formed for each of a plurality of strip-shaped substrates as in the related art. is there.

According to a twenty-second aspect of the present invention, a plurality of pairs of upper electrode layers are formed on the upper surface of a sheet-like insulating substrate in which a plurality of slit-like first divisions for dividing into a plurality of strip-like substrates are formed in advance. Forming a plurality of resistance layers so that both are electrically connected; and performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers; Forming a plurality of protective layers so as to cover the resistive layer, installing a mask on the back surface of the sheet-shaped insulating substrate, and forming the slit-shaped first divided portion with the mask installed. A plurality of pairs of side electrode layers made of nickel or a nickel-based alloy are formed by a sputtering method on the back surface of the sheet-shaped insulating substrate in a plurality of formed states and on the inner surface of the plurality of slit-shaped first divided portions. Forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; and forming a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, wherein the plurality of resistance layers are individually separated. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so as to be divided into individual substrates. A mask is provided on the back surface of a sheet-shaped insulating substrate in which a plurality of first divided portions are formed, and the back surface of the insulating substrate and a plurality of slit-shaped first divided portions are provided in a state where the mask is provided. Because a plurality of pairs of side electrode layers made of nickel or a nickel-based alloy are formed on the inner surface of the substrate by a sputtering method, the side electrode layers are not formed for each of a plurality of strip-shaped substrates as in the related art, but are formed in a sheet shape. Of insulating board Those having an effect of being able to form collectively in state.

According to a twenty-third aspect of the present invention, a plurality of pairs of upper electrode layers are formed on the upper surface of a sheet-like insulating substrate in which a plurality of slit-like first divisions for dividing into a plurality of strip-like substrates are formed in advance. Forming a plurality of resistance layers so that both are electrically connected; and performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers; Forming a plurality of protective layers so as to cover the resistive layer, and forming a metal film made of nickel or a nickel-based alloy on the entire back surface of the sheet-shaped insulating substrate in which the plurality of slit-shaped first divided portions are formed. Forming a plurality of pairs of side electrode layers made of nickel or a nickel-based alloy on the inner surface of the plurality of slit-shaped first divided portions; and forming a back surface of the sheet-shaped insulating substrate. Forming a plurality of pairs of back electrode layers by removing unnecessary portions of the metal film formed by a laser, and forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers, In the plurality of strip-shaped substrates in the sheet-shaped insulating substrate, the plurality of resistance layers are separated in a direction orthogonal to the slit-shaped first divided portion so as to be individually separated and divided into individual substrates. According to this manufacturing method, nickel or nickel is formed on the entire back surface of the sheet-shaped insulating substrate in which a plurality of slit-shaped first divided portions are formed. A metal film of a nickel-based alloy is formed, and a plurality of pairs of side electrode layers of nickel or a nickel-based alloy are formed on inner surfaces of the plurality of slit-shaped first divided portions. back Since a plurality of pairs of back electrode layers are formed by removing unnecessary portions of the metal film formed on the entire surface with a laser, the side electrode layers are formed for each of a plurality of strip-shaped substrates as in the related art. It is possible to collectively form the sheet-like insulating substrate without using any of them, and by removing unnecessary portions of the metal film formed on the entire back surface of the sheet-like insulating substrate by laser, a plurality of pairs of back surface electrodes can be formed. Since the layer is formed, the dimensional accuracy of the back electrode layer can be improved, thereby having the effect of reducing mounting defects when this resistor is mounted on the mounting board on the back side. Things.

According to a twenty-fourth aspect of the present invention, a plurality of pairs of upper electrode layers are formed on the upper surface of a sheet-shaped insulating substrate;
A step of forming a plurality of slit-shaped first divided portions for dividing the insulating substrate into a plurality of strip-shaped substrates on the sheet-shaped insulating substrate on which the plurality of pairs of upper electrode layers are formed; A step of forming a plurality of resistance layers so as to partially overlap an upper electrode layer, and a step of performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers; Forming a plurality of protective layers so as to cover the resistive layer, and applying nickel plating by an electroless plating method to the sheet-like insulating substrate in which the plurality of slit-like first divisions are formed. Forming a plurality of pairs of side electrode layers on the inner surface of the plurality of slit-shaped first divided portions; forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; Insulating group A plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions such that the plurality of resistive layers are individually separated and divided into individual substrates on the plurality of strip-shaped substrates. According to this manufacturing method, a nickel-plated electroless plating method is applied to a sheet-like insulating substrate having a plurality of slit-shaped first divided portions formed thereon. Since a plurality of pairs of side electrode layers are formed on the inner surface of the plurality of slit-shaped first divided portions, this side electrode layer is not formed for each of a plurality of strip-shaped substrates as in the related art. It can be formed collectively in the state of a sheet-shaped insulating substrate,
Also, in the case where a plurality of pairs of solder layers are formed so as to cover a plurality of pairs of side electrode layers, the solder layers can be formed collectively in the state of a sheet-shaped insulating substrate and the solder layer is formed by an electroplating method. Has an effect that a stable solder layer can be formed because the potential difference can be reduced.

According to a twenty-fifth aspect of the present invention, the step of forming a plurality of resistive layers on the upper surface of a sheet-like insulating substrate and the step of forming the plurality of resistive layers on the sheet-like insulating substrate having the plurality of resistive layers formed thereon Forming a plurality of slit-shaped first divided portions for dividing into a plurality of strip-shaped substrates; forming a plurality of pairs of upper surface electrode layers so as to partially overlap the plurality of resistance layers; Performing trimming to adjust the resistance value between the plurality of pairs of upper electrode layers in the resistive layer, forming a plurality of protective layers so as to cover at least the plurality of resistive layers, A plurality of pairs of side electrode layers are formed on the inner surface of the plurality of slit-shaped first divided portions by applying nickel plating to the sheet-shaped insulating substrate having a plurality of the divided portions formed thereon by an electroless plating method. The process of Forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; and forming a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, wherein the plurality of resistance layers are individually separated into individual pieces. Forming a plurality of second divided portions in a direction perpendicular to the slit-shaped first divided portions so as to be divided into substrates. According to this manufacturing method, the slit-shaped first divided portions are formed. A plurality of pairs of side electrode layers are formed on the inner surface of the plurality of slit-shaped first divided portions by applying nickel plating to the sheet-shaped insulating substrate having a plurality of the divided portions formed thereon by an electroless plating method. Therefore, this side electrode layer can be formed collectively in the form of a sheet-shaped insulating substrate, instead of being formed for each of a plurality of strip-shaped substrates as in the related art. Multiple pairs of solder to cover the electrode layers Also when forming a layer, it can be formed collectively in the state of a sheet-shaped insulating substrate, and when the solder layer is formed by an electroplating method, the potential difference can be reduced, so that a stable solder layer Can be formed.

According to a twenty-sixth aspect of the present invention, a plurality of pairs of upper electrode layers are formed on the upper surface of a sheet-shaped insulating substrate;
Forming a plurality of slit-shaped first divided portions for dividing the insulating substrate into a plurality of strip-shaped substrates on the sheet-shaped insulating substrate on which the plurality of pairs of upper surface electrode layers are formed; A step of forming a plurality of resistance layers so as to partially overlap an upper surface electrode layer, and a step of performing trimming to adjust a resistance value between the plurality of pairs of upper surface electrode layers in the plurality of resistance layers; Forming a plurality of protective layers so as to cover the resistive layer, forming a resist layer on the back surface of the sheet-shaped insulating substrate, and forming a plurality of the slit-shaped first divided portions. Forming a side electrode layer made of nickel or a nickel-based alloy on the back surface of the sheet-shaped insulating substrate and the inner surface of the plurality of slit-shaped first divided portions by a sputtering method; Patterning the side electrode layers, forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers, and forming the plurality of strip-shaped substrates in the sheet-shaped insulating substrate with the plurality of resistors. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so that the layers are individually separated and divided into individual pieces of substrates. According to the manufacturing method, a step of forming a plurality of slit-shaped first divided portions for separating a plurality of pairs of upper electrode layers into a plurality of strip-shaped substrates on a sheet-shaped insulating substrate; A side electrode layer made of nickel or a nickel-based alloy is formed by a sputtering method on the back surface of the sheet-shaped insulating substrate having a plurality of first divided portions formed therein and on the inner surface of the plurality of first divided portions. The steps and Since the method includes a step of patterning a plurality of pairs of side electrode layers by peeling off a resist layer formed on the back surface of the sheet-shaped insulating substrate, the side electrode layers are formed for each of a plurality of strip-shaped substrates as in the related art. It is possible to form the insulating substrate in the form of a sheet without forming the insulating substrate.

The invention according to claim 27 is a step of forming a plurality of pairs of upper electrode layers on the upper surface of a sheet-shaped insulating substrate;
Forming a plurality of slit-shaped first divided portions for dividing the insulating substrate into a plurality of strip-shaped substrates on the sheet-shaped insulating substrate on which the plurality of pairs of upper surface electrode layers are formed; A step of forming a plurality of resistance layers so as to partially overlap an upper surface electrode layer, and a step of performing trimming to adjust a resistance value between the plurality of pairs of upper surface electrode layers in the plurality of resistance layers; Forming a plurality of protective layers so as to cover the resistive layer, installing a mask on the back surface of the sheet-shaped insulating substrate, and forming the slit-shaped first divided portion with the mask installed. Forming a plurality of pairs of side electrode layers made of nickel or a nickel-based alloy on the back surface of the sheet-shaped insulating substrate in a plurality of formed states and on the inner surface of the plurality of slit-shaped first divided portions by a sputtering method; Forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; and forming a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, wherein the plurality of resistance layers are individually separated into individual pieces. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so as to be divided into substrates. According to this manufacturing method, the slit-shaped first divided portions are formed. A mask is installed on the back surface of the sheet-shaped insulating substrate in which a plurality of one divided portions are formed, and on the back surface of the insulating substrate and the inner surface of the plurality of slit-shaped first divided portions in a state where the mask is installed. Since a plurality of pairs of side electrode layers made of nickel or a nickel-based alloy are formed by a sputtering method, the side electrode layers are not formed for each of a plurality of strip-shaped substrates as in the related art. In the state of Those having an effect of being able to form by Batch.

According to a twenty-eighth aspect of the present invention, a plurality of pairs of upper electrode layers are formed on the upper surface of a sheet-shaped insulating substrate;
Forming a plurality of slit-shaped first divided portions for dividing the insulating substrate into a plurality of strip-shaped substrates on the sheet-shaped insulating substrate on which the plurality of pairs of upper surface electrode layers are formed; A step of forming a plurality of resistance layers so as to partially overlap an upper surface electrode layer, and a step of performing trimming to adjust a resistance value between the plurality of pairs of upper surface electrode layers in the plurality of resistance layers; Forming a plurality of protective layers so as to cover the resistive layer, and forming a metal film made of nickel or a nickel-based alloy on the entire back surface of the sheet-shaped insulating substrate in which the plurality of slit-shaped first divided portions are formed. Forming a plurality of pairs of side electrode layers made of nickel or a nickel-based alloy on the inner surface of the plurality of slit-shaped first divided portions; and forming a shape on the back surface of the sheet-shaped insulating substrate. Forming a plurality of pairs of back electrode layers by removing unnecessary portions of the formed metal film with a laser, and forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; and In a plurality of strip-shaped substrates in the shape of an insulating substrate, the plurality of resistive layers are individually separated and divided into a plurality of individual substrates in a direction orthogonal to the slit-shaped first divided portion. According to this manufacturing method, a nickel or nickel-based material is formed on the entire back surface of the sheet-shaped insulating substrate in which a plurality of slit-shaped first divided portions are formed. Forming a metal film of an alloy, and forming a plurality of pairs of side electrode layers of nickel or a nickel-based alloy on the inner surface of the plurality of slit-shaped first divided portions; Since a plurality of pairs of back electrode layers are formed by removing unnecessary portions of the formed metal film with a laser, this side electrode layer does not need to be formed for each of a plurality of strip-shaped substrates as in the related art. A plurality of pairs of back electrode layers can be formed by collectively forming a sheet-shaped insulating substrate, and removing unnecessary portions of a metal film formed on the entire back surface of the sheet-shaped insulating substrate with a laser. Since it is formed, it is possible to improve the dimensional accuracy of the back electrode layer, thereby having the effect of reducing mounting defects when this resistor is mounted on the mounting board on the back side. is there.

According to a twenty-ninth aspect of the present invention, a plurality of pairs of upper electrode layers are formed on the upper surface of a sheet-shaped insulating substrate;
Forming a plurality of resistive layers such that a part thereof overlaps the plurality of pairs of upper electrode layers; and dividing the insulating substrate into a plurality of strip-like substrates into a sheet-like insulating substrate on which the plurality of resistive layers are formed. Forming a plurality of slit-shaped first divided portions for performing a step of performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers; Forming a plurality of protective layers so as to cover the plurality of layers, and applying nickel plating to the sheet-like insulating substrate having the plurality of slit-shaped first divided portions formed thereon by electroless plating. Forming a plurality of pairs of side electrode layers on the inner surface of the slit-shaped first divided portion; forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; On an insulating substrate A plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions such that the plurality of resistive layers are individually separated and divided into individual substrates on a plurality of strip-shaped substrates. According to this manufacturing method, a nickel-plated electroless plating method is applied to a sheet-like insulating substrate having a plurality of slit-shaped first divided portions formed thereon. Since a plurality of pairs of side electrode layers are formed on the inner surface of the plurality of slit-shaped first divided portions, this side electrode layer is not formed for each of a plurality of strip-shaped substrates as in the related art. It can be formed collectively in the state of a sheet-shaped insulating substrate, and when forming a plurality of pairs of solder layers so as to cover a plurality of pairs of side electrode layers, it can be formed collectively in the state of a sheet-shaped insulating substrate. Can be formed and solder layer It is possible to reduce a potential difference in the case of forming by electroplating method, and has an effect of being able to form a stable solder layer.

The invention according to claim 30 is a step of forming a plurality of resistance layers on the upper surface of a sheet-shaped insulating substrate, and forming a plurality of pairs of upper electrode layers so as to partially overlap the plurality of resistance layers. And a slit-shaped first substrate for dividing the insulating substrate into a plurality of strip-shaped substrates on a sheet-shaped insulating substrate on which the plurality of resistance layers and the plurality of pairs of upper electrode layers are formed.
Forming a plurality of divided portions, trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers, and forming a plurality of protection layers so as to cover at least the plurality of resistance layers. A step of forming a layer, and applying a nickel plating to the sheet-like insulating substrate on which a plurality of the slit-shaped first divided portions are formed by an electroless plating method to thereby form the plurality of slit-shaped first divided portions. Forming a plurality of pairs of side electrode layers on the inner surface of the portion, forming a plurality of pairs of solder layers to cover the plurality of pairs of side electrode layers, and forming a plurality of strip-shaped substrates in the sheet-shaped insulating substrate. Forming a plurality of second divisions in a direction orthogonal to the slit-shaped first divisions so that the plurality of resistance layers are individually separated and divided into individual substrates. With According to the manufacturing method, the sheet-like insulating substrate having the plurality of slit-shaped first divided portions formed thereon is subjected to nickel plating by an electroless plating method, thereby forming the plurality of slit-shaped first divided portions. Since a plurality of pairs of side electrode layers are formed on the inner surface, the side electrode layers are formed collectively in a state of a sheet-shaped insulating substrate, instead of being formed for each of a plurality of strip-shaped substrates as in the related art. When a plurality of pairs of solder layers are formed so as to cover a plurality of pairs of side electrode layers, they can be formed collectively in a state of a sheet-shaped insulating substrate, and the solder layers can be formed by electroplating. In the case of forming by a construction method, the potential difference can be reduced, so that it has an effect that a stable solder layer can be formed.

According to a thirty-first aspect of the present invention, a plurality of pairs of upper electrode layers and a plurality of resistance layers are formed on a sheet-shaped insulating substrate on the upper surface such that both are electrically connected to each other. Slit-shaped first for dividing into strip-shaped substrates
Forming a plurality of divided portions, trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers, and forming a plurality of protection layers so as to cover at least the plurality of resistance layers. A step of forming a layer, a step of forming a resist layer on the back surface of the sheet-shaped insulating substrate, and a step of forming a plurality of slit-shaped first divided portions on the back surface and the plurality of sheet-shaped insulating substrates. Forming a side electrode layer of nickel or a nickel-based alloy on the inner surface of the slit-shaped first divided portion by a sputtering method, peeling the resist layer and patterning a plurality of pairs of side electrode layers; Forming a plurality of pairs of solder layers so as to cover the pair of side electrode layers; and separating the plurality of resistance layers into a plurality of strip-shaped substrates in the sheet-shaped insulating substrate. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so as to be divided into individual pieces. Forming a plurality of slit-shaped first divided portions for separating a plurality of pairs of upper electrode layers into a plurality of strip-shaped substrates on a sheet-shaped insulating substrate; and forming the slit-shaped first divided portions. Forming a side electrode layer made of nickel or a nickel-based alloy on the back surface of the sheet-shaped insulating substrate in which a plurality of portions are formed and the inner surface of the plurality of slit-shaped first divided portions by a sputtering method; Since the method includes a step of patterning a plurality of pairs of side electrode layers by peeling a resist layer formed on the back surface of the insulating substrate, the side electrode layers are formed for each of a plurality of strip-shaped substrates as in the related art. Not sheet Those having an effect of being able to form collectively a state of the insulating substrate.

According to a thirty-second aspect of the present invention, a plurality of pairs of upper electrode layers and a plurality of resistance layers are formed on an upper surface of a sheet-like insulating substrate so that both are electrically connected to each other. Slit-shaped first for dividing into strip-shaped substrates
Forming a plurality of divided portions, trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers, and forming a plurality of protection layers so as to cover at least the plurality of resistance layers. A step of forming a layer, a step of placing a mask on the back surface of the sheet-like insulating substrate, and a sheet-like insulating state in which a plurality of the slit-like first divisions are formed with the mask placed Forming a plurality of pairs of side electrode layers made of nickel or a nickel-based alloy on the back surface of the substrate and the inner surfaces of the plurality of slit-shaped first divided portions by sputtering, and forming a plurality of side electrode layers so as to cover the plurality of pairs of side electrode layers. Forming a pair of solder layers; and forming the plurality of strips on the sheet-shaped insulating substrate so that the plurality of resistance layers are individually separated and divided into individual substrates. Forming a plurality of second divided portions in a direction orthogonal to the slot-shaped first divided portions. According to this manufacturing method, a plurality of slit-shaped first divided portions are formed. A mask is installed on the back surface of the sheet-shaped insulating substrate in the state of being cut, and in the state where the mask is installed, nickel or a nickel-based material is formed on the back surface of the insulating substrate and the inner surface of the plurality of slit-shaped first divided portions by a sputtering method. Since a plurality of pairs of side electrode layers made of an alloy are formed, the side electrode layers are collectively formed in the form of a sheet-shaped insulating substrate instead of being formed for each of a plurality of strip-shaped substrates as in the related art. It has the effect of being able to do so.

According to a thirty-third aspect of the present invention, a plurality of pairs of upper electrode layers and a plurality of resistive layers are formed on a sheet-like insulating substrate on the upper surface such that both are electrically connected to each other. Slit-shaped first for dividing into strip-shaped substrates
Forming a plurality of divided portions, trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers, and protecting a plurality of protection layers so as to cover at least the plurality of resistance layers. Forming a layer, forming a metal film of nickel or a nickel-based alloy on the entire back surface of the sheet-shaped insulating substrate in a state where the plurality of slit-shaped first divided portions are formed, and forming the plurality of slit-shaped first divided portions. Forming a plurality of pairs of side electrode layers of nickel or a nickel-based alloy on the inner surface of the first divided portion, and removing unnecessary portions of the metal film formed on the back surface of the sheet-shaped insulating substrate by laser. Forming a plurality of pairs of backside electrode layers, forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers, A plurality of second divided portions are formed on a plurality of strip-shaped substrates in a direction perpendicular to the slit-shaped first divided portions so that the plurality of resistance layers are individually separated and divided into individual pieces. According to this manufacturing method, a metal film made of nickel or a nickel-based alloy is formed on the entire back surface of the sheet-shaped insulating substrate in which a plurality of slit-shaped first divided portions are formed. While forming
A plurality of pairs of side electrode layers made of nickel or a nickel-based alloy are formed on the inner surface of the plurality of slit-shaped first divided portions, and then unnecessary portions of a metal film formed on the entire back surface of the sheet-shaped insulating substrate Is removed with a laser to form a plurality of pairs of back electrode layers,
This side surface electrode layer can be formed collectively in the state of a sheet-shaped insulating substrate without being formed for each of a plurality of strip-shaped substrates as in the related art, and formed on the entire back surface of the sheet-shaped insulating substrate. By removing unnecessary portions of the metal film with a laser to form a plurality of pairs of back electrode layers, the dimensional accuracy of the back electrode layers can be improved, thereby mounting this resistor on the back side This has the effect of reducing mounting defects when mounted on a substrate.

According to a thirty-fourth aspect of the present invention, a plurality of pairs of upper surface electrode layers are formed on the upper surface of a sheet-shaped insulating substrate;
A step of forming a plurality of resistance layers so as to partially overlap the plurality of pairs of upper electrode layers, and a step of performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers. Forming a plurality of slit-shaped first divided portions for dividing the insulating substrate into a plurality of strip-shaped substrates on the trimmed sheet-shaped insulating substrate; and covering at least the plurality of resistance layers. Forming a plurality of protective layers as described above, and applying a nickel plating by an electroless plating method to a sheet-like insulating substrate in which a plurality of the slit-like first divided portions are formed. Forming a plurality of pairs of side electrode layers on the inner surface of the first divided portion; forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; A plurality of second divided portions are formed on a plurality of strip-shaped substrates in a direction perpendicular to the slit-shaped first divided portions so that the plurality of resistance layers are individually separated and divided into individual pieces. According to this manufacturing method, the sheet-shaped insulating substrate having a plurality of slit-shaped first divided portions formed thereon is subjected to nickel plating by an electroless plating method. Since a plurality of pairs of side electrode layers are formed on the inner surface of the plurality of slit-shaped first divisions, the side electrode layers are not formed for each of the plurality of strip-shaped substrates as in the related art, Can be formed collectively in the form of a sheet-shaped insulating substrate, and also when forming a plurality of pairs of solder layers so as to cover a plurality of pairs of side electrode layers, in a state of a sheet-shaped insulating substrate The solder layer It is possible to reduce a potential difference in the case of forming by plating method, and has an effect of being able to form a stable solder layer.

According to a thirty-fifth aspect of the present invention, a step of forming a plurality of resistance layers on the upper surface of a sheet-shaped insulating substrate, and forming a plurality of pairs of upper surface electrode layers so as to partially overlap the plurality of resistance layers. Performing a trimming process to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers; and forming a plurality of strips on the trimmed sheet-shaped insulating substrate. Forming a plurality of slit-shaped first divided portions for dividing into a substrate, forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and forming the slit-shaped first divided portions Forming a plurality of pairs of side electrode layers on the inner surface of the plurality of slit-shaped first divided portions by applying nickel plating to the sheet-shaped insulating substrate in a state where a plurality of portions are formed by electroless plating. And said A step of forming a plurality of pairs of solder layers so as to cover several pairs of side electrode layers; and a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, wherein the plurality of resistance layers are individually separated from each other, and Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so as to be divided into a plurality of slit-shaped first divided portions. A plurality of pairs of side electrode layers are formed on the inner surfaces of the plurality of slit-shaped first divided portions by applying nickel plating to the sheet-shaped insulating substrate having the plurality of divided portions formed thereon by electroless plating. As a result, this side electrode layer can be formed collectively in the form of a sheet-shaped insulating substrate, instead of being formed for each of a plurality of strip-shaped substrates as in the related art. Multiple pairs of solder layers to cover layers If you are also formed,
In addition to being able to be formed collectively in the state of a sheet-shaped insulating substrate, when the solder layer is formed by an electroplating method, the potential difference can be reduced, so that there is an effect that a stable solder layer can be formed. Things.

According to a thirty-sixth aspect of the present invention, a step of forming a plurality of resistive layers on an upper surface of a sheet-like insulating substrate, and the step of forming a plurality of the insulating substrates on the sheet-like insulating substrate having the plurality of resistive layers formed thereon. Forming a plurality of slit-shaped first divided portions for dividing into a plurality of strip-shaped substrates; forming a plurality of pairs of upper surface electrode layers so as to partially overlap the plurality of resistance layers; Performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the resistive layer, forming a plurality of protective layers so as to cover at least the plurality of resistive layers, Forming a resist layer on the back surface of the substrate;
Forming a side electrode layer of nickel or a nickel-based alloy by a sputtering method on the back surface of the sheet-shaped insulating substrate in a state where a plurality of divided portions are formed and on the inner surface of the plurality of slit-shaped first divided portions; Stripping a resist layer to pattern a plurality of pairs of side electrode layers; forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; and forming a plurality of strips on the sheet-shaped insulating substrate. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so that the plurality of resistive layers are individually separated and divided into individual substrates on the substrate According to this manufacturing method, the sheet-like insulating substrate has a slit-shaped first dividing portion for separating a plurality of pairs of upper electrode layers and dividing the upper electrode layer into a plurality of strip-shaped substrates. Process of forming multiple A side electrode layer made of nickel or a nickel-based alloy by a sputtering method on the back surface of the sheet-shaped insulating substrate in which the plurality of slit-shaped first divided portions are formed and the inner surface of the plurality of slit-shaped first divided portions; And a step of stripping a resist layer formed on the back surface of the sheet-shaped insulating substrate to pattern a plurality of pairs of side electrode layers. It is possible to form them collectively in the state of a sheet-shaped insulating substrate without forming them for each strip-shaped substrate.

According to a thirty-seventh aspect of the present invention, a step of forming a plurality of resistive layers on an upper surface of a sheet-like insulating substrate, and the step of forming a plurality of the insulating substrates on the sheet-like insulating substrate having the plurality of resistive layers formed thereon. Forming a plurality of slit-shaped first divided portions for dividing into a plurality of strip-shaped substrates; forming a plurality of pairs of upper surface electrode layers so as to partially overlap the plurality of resistance layers; Performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the resistive layer, forming a plurality of protective layers so as to cover at least the plurality of resistive layers, A step of installing a mask on the back surface of the substrate, and a back surface of the sheet-shaped insulating substrate and a plurality of slit-shaped first portions in which a plurality of the slit-shaped first divided portions are formed in a state where the mask is installed. Inside of division A step of forming a plurality of pairs of side electrode layers made of nickel or a nickel-based alloy by a sputtering method, and a step of forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; A plurality of second divisions are formed on a plurality of strip-shaped substrates in a direction orthogonal to the slit-shaped first divisions so that the plurality of resistance layers are individually separated and divided into individual substrates. According to this manufacturing method, a mask is provided on the back surface of the sheet-shaped insulating substrate in a state where a plurality of slit-shaped first divided portions are formed, and the mask is provided. In this state, a plurality of pairs of side electrode layers made of nickel or a nickel-based alloy are formed on the back surface of the insulating substrate and the inner surfaces of the plurality of slit-shaped first divided portions by a sputtering method. Surface electrode layer is not formed for each of a plurality of strip-like substrate as in the prior art, and has an effect of being able to form collectively a state of a sheet-like insulating substrate.

According to a thirty-eighth aspect of the present invention, a step of forming a plurality of resistive layers on the upper surface of a sheet-like insulating substrate; Forming a plurality of slit-shaped first divided portions for dividing into a plurality of strip-shaped substrates; forming a plurality of pairs of upper surface electrode layers so as to partially overlap the plurality of resistance layers; Performing trimming to adjust the resistance value between the plurality of pairs of upper electrode layers in the resistive layer, forming a plurality of protective layers so as to cover at least the plurality of resistive layers, A metal film made of nickel or a nickel-based alloy is formed on the entire back surface of the sheet-shaped insulating substrate having a plurality of one divided portions formed thereon, and nickel or nickel or nickel-based alloy is formed on the inner surface of the plurality of slit-shaped first divided portions. A step of forming a plurality of pairs of side electrode layers made of a nickel-based alloy, and a step of forming a plurality of pairs of back electrode layers by removing unnecessary portions of a metal film formed on the back surface of the sheet-shaped insulating substrate with a laser. Forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; and forming the plurality of resistive layers individually on a plurality of strip-shaped substrates in the sheet-shaped insulating substrate. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so as to be divided into one-piece substrates. A metal film made of nickel or a nickel-based alloy is formed on the entire back surface of the sheet-shaped insulating substrate having a plurality of first divided portions formed thereon, and nickel is formed on the inner surface of the plurality of slit-shaped first divided portions. Or A plurality of pairs of backside electrode layers are formed by forming a plurality of pairs of side surface electrode layers of a nickel-based alloy, and thereafter, unnecessary portions of the metal film formed on the entire back surface of the sheet-shaped insulating substrate are removed by a laser. As a result, this side electrode layer can be formed collectively in the form of a sheet-like insulating substrate, instead of being formed for each of a plurality of strip-like substrates as in the related art. Since a plurality of pairs of back electrode layers are formed by removing unnecessary portions of the metal film formed on the entire back surface of the substrate with a laser, the dimensional accuracy of the back electrode layer can be improved. This has the effect of reducing mounting defects when the device is mounted on the mounting board on the back side.

According to a thirty-ninth aspect of the present invention, a plurality of pairs of upper electrode layers and a plurality of resistive layers are formed on the upper surface of a sheet-shaped insulating substrate so that they are electrically connected to each other. A step of performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the resistance layer, and a step of dividing the insulating substrate into a plurality of strip-shaped substrates into the trimmed sheet-shaped insulating substrate. Forming a plurality of slit-shaped first divided portions, forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and forming a resist layer on the back surface of the sheet-shaped insulating substrate And a nickel or nickel-based alloy formed by sputtering on the back surface of the sheet-shaped insulating substrate having the plurality of slit-shaped first divided portions formed thereon and on the inner surface of the plurality of slit-shaped first divided portions. Forming a plurality of pairs of side electrode layers by removing the resist layer and patterning a plurality of pairs of side electrode layers, and forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers. In a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, the plurality of resistive layers are individually separated and divided into individual substrates in a direction orthogonal to the slit-shaped first divided portion. Forming a plurality of second divided portions. According to this manufacturing method, a plurality of pairs of upper surface electrode layers are separated into a plurality of strip-shaped substrates on a sheet-shaped insulating substrate. Forming a plurality of slit-shaped first divided portions for forming a plurality of slit-shaped first divided portions, a back surface of a sheet-shaped insulating substrate in which a plurality of slit-shaped first divided portions are formed, and a plurality of slit-shaped first divided portions To the inner surface of the part by sputtering. A step of forming a side electrode layer made of a metal or a nickel-based alloy, and a step of patterning a plurality of pairs of side electrode layers by peeling a resist layer formed on the back surface of the sheet-shaped insulating substrate. The side surface electrode layer has an effect that it can be formed collectively in a state of a sheet-shaped insulating substrate, instead of being formed for each of a plurality of strip-shaped substrates as in the related art.

The invention according to claim 40 is a step of forming a plurality of pairs of upper electrode layers and a plurality of resistance layers on the upper surface of a sheet-shaped insulating substrate so that they are electrically connected to each other; A step of performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the resistance layer, and a step of dividing the insulating substrate into a plurality of strip-shaped substrates into the trimmed sheet-shaped insulating substrate. Forming a plurality of slit-shaped first divided portions, forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and installing a mask on the back surface of the sheet-shaped insulating substrate; In a state where the plurality of slit-shaped first divided portions are formed with the mask installed, the back surface of the sheet-shaped insulating substrate and the inner surface of the plurality of slit-shaped first divided portions are nickel-plated by a sputtering method. Or forming a plurality of pairs of side electrode layers of a nickel-based alloy, forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers, and forming a plurality of strips in the sheet-shaped insulating substrate. Forming a plurality of second divisions on the substrate in a direction orthogonal to the slit-like first divisions so that the plurality of resistance layers are individually separated and divided into individual substrates; According to this manufacturing method, a mask is installed on the back surface of the sheet-shaped insulating substrate in a state where a plurality of slit-shaped first divided portions are formed, and the insulating is performed in a state where the mask is installed. Since a plurality of pairs of side electrode layers made of nickel or a nickel-based alloy are formed on the back surface of the substrate and the inner surfaces of the plurality of slit-shaped first divided portions by a sputtering method, the side electrode layers are formed in a conventional manner. Duplicate Without forming each strip substrate, and has an effect of being able to form collectively a state of a sheet-like insulating substrate.

The invention according to claim 41 is a step of forming a plurality of pairs of upper electrode layers and a plurality of resistance layers on the upper surface of a sheet-shaped insulating substrate so that they are electrically connected to each other; A step of performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the resistance layer, and a step of dividing the insulating substrate into a plurality of strip-shaped substrates into the trimmed sheet-shaped insulating substrate. A step of forming a plurality of slit-shaped first divided sections, a step of forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and a state in which the plurality of slit-shaped first divided sections are formed A metal film made of nickel or a nickel-based alloy is formed on the entire back surface of the sheet-shaped insulating substrate, and a plurality of pairs made of nickel or a nickel-based alloy are formed on inner surfaces of the plurality of slit-shaped first divided portions. Forming a side electrode layer; forming a plurality of pairs of back electrode layers by removing unnecessary portions of a metal film formed on the back surface of the sheet-shaped insulating substrate with a laser; and forming the plurality of pairs of side surfaces. A step of forming a plurality of pairs of solder layers so as to cover the electrode layers; and a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, wherein the plurality of resistive layers are individually separated and divided into individual substrates. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portion. According to this manufacturing method, the slit-shaped first divided portion is While forming a metal film of nickel or a nickel-based alloy on the entire back surface of the sheet-shaped insulating substrate in a plurality of formed states,
A plurality of pairs of side electrode layers made of nickel or a nickel-based alloy are formed on the inner surface of the plurality of slit-shaped first divided portions, and then unnecessary portions of a metal film formed on the entire back surface of the sheet-shaped insulating substrate Is removed with a laser to form a plurality of pairs of back electrode layers,
This side surface electrode layer can be formed collectively in the state of a sheet-shaped insulating substrate without being formed for each of a plurality of strip-shaped substrates as in the related art, and formed on the entire back surface of the sheet-shaped insulating substrate. By removing unnecessary portions of the metal film with a laser to form a plurality of pairs of back electrode layers, the dimensional accuracy of the back electrode layers can be improved, thereby mounting this resistor on the back side This has the effect of reducing mounting defects when mounted on a substrate.

The invention as set forth in claim 42 is the method according to claims 7 to 4
1, wherein the plurality of slit-shaped first divided portions are formed by through holes vertically penetrating the sheet-shaped insulating substrate. According to this manufacturing method, the slit-shaped first divided portions are formed. Are formed as through-holes, so that when a side-surface electrode layer is formed on a sheet-shaped insulating substrate, the side-surface electrode layer is formed on the entire inner surface of the slit-shaped first divided portion that is a through-hole. It has the effect of being able to do so.

The invention according to claim 43 is the invention according to claims 7 to 4.
1. A plurality of slit-shaped first divided portions according to any one of 1) are formed by dicing, and according to this manufacturing method, a sheet-shaped insulating substrate that does not require dimensional classification of individual substrate is used. Therefore, it is not necessary to classify the size of the individual substrate as in the related art, and thereby, it is possible to eliminate the complexity of the process due to the conventional mask replacement, and
Dicing also has the effect that it can be easily performed using semiconductors or the like using general dicing equipment.

The invention according to claim 44 is the invention according to claims 7 to 4
1. A plurality of second divisions described in any one of 1) are formed by dicing, and according to this manufacturing method, since a sheet-like insulating substrate that does not require dimensional classification of an individual substrate is used, It is no longer necessary to classify the size of individual pieces as in the conventional case, which makes it possible to eliminate the complexity of the process of exchanging masks as in the conventional case, and dicing is performed using a semiconductor or other general dicing equipment. It has an effect that it can be easily performed.

The invention according to claim 45 is the invention according to claims 7 to 4.
A plurality of the second divided portions described in any one of the above (1) is formed by cutting the sheet-shaped insulating substrate while leaving a thin portion, and according to this manufacturing method, the second divided portion is formed. It does not singulate every time, but has the effect of being singulated in two stages.

According to a forty-sixth aspect, the thin portion according to the forty-fifth aspect is left on the back surface of the sheet-shaped insulating substrate. According to this manufacturing method, the second divided portion is formed. Instead of being singulated every time, it has the effect of being singulated in two stages.

The invention according to claim 47 is the invention according to claims 7 to 4
1. An unnecessary area portion is formed at an end of the sheet-shaped insulating substrate according to any one of 1 to 3, and a plurality of slit-shaped first divided portions and a plurality of second divided portions are formed in the unnecessary area portion. According to this manufacturing method, the plurality of strip-shaped substrates are connected to the unnecessary region even after the plurality of slit-shaped first divided portions are formed. The post-process is not finely divided into a plurality of strip-shaped substrates. Therefore, even after the plurality of slit-shaped first divided portions are formed, the post-process is performed in a state of a sheet-shaped insulating substrate having an unnecessary region portion. Therefore, the method has the effect of simplifying the method design, and when a plurality of second divisions are formed, each time the plurality of second divisions are formed, the substrate is cut and divided into individual substrates. No need for individualized products Because it is separated from the frequency band, and has the effect that there is no need of separately providing a step of later sorting and unnecessary area portion and products.

The invention according to claim 48 is the invention according to claims 7 to 4
2. The method according to claim 1, wherein the plurality of pairs of side electrode layers and the plurality of pairs of solder layers are formed in a state of a sheet-shaped insulating substrate. When a solder layer is formed by an electroplating method, the potential difference can be reduced, so that a stable solder layer can be formed.

(Embodiment 1) Hereinafter, a resistor and a method of manufacturing the resistor according to Embodiment 1 of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view of a resistor according to the first embodiment of the present invention.

In FIG. 1, reference numeral 11 denotes a sheet-like insulating substrate made of fired 96% purity alumina and a slit-shaped first divided portion and a second divided portion which is orthogonal to the first divided portion. This is a singulated substrate that has been singulated by dividing the substrate. Reference numeral 12 denotes a pair of upper electrode layers mainly formed of silver and formed on the upper surface of the individual substrate 11. Reference numeral 13 denotes a ruthenium oxide-based resistance layer formed on the upper surface of the individual substrate 11 so as to partially overlap the pair of upper electrode layers 12. 1
Reference numeral 4 denotes a first protective layer formed of a pre-coated glass layer formed on the upper surface of the resistance layer 13. Reference numeral 15 denotes a trimming groove provided for correcting the resistance value of the resistance layer 13 between the pair of upper electrode layers 12. Reference numeral 16 denotes a second protective layer mainly composed of a resin formed so as to cover the first protective layer 14 made of a precoated glass layer. Reference numeral 17 denotes a pair of side electrode layers made of nickel which overlap with a part of the pair of upper electrode layers 12 and cover both side surfaces of the individual substrate 11 and both end portions of the back surface. Reference numeral 18 denotes a solder layer made of tin formed to cover a part of the pair of side electrode layers 17 and a part of the pair of upper electrode layers 12.

The method of manufacturing the resistor according to the first embodiment of the present invention configured as described above will now be described with reference to the drawings.

FIG. 2 is a top view showing a state in which an unnecessary region is formed at the entire peripheral edge of a sheet-like insulating substrate used in manufacturing the resistor according to the first embodiment of the present invention.
3 (a) to 3 (e), 4 (a) to 4 (e), 5 (a)
6 (a) to 6 (d), 7 (a) to 7 (c), and 8 (a) to 8 (c) show a method of manufacturing a resistor according to the first embodiment of the present invention. It is a process drawing.

First, as shown in FIGS. 2, 3A, and 4A, a sheet-like insulating substrate 21 made of fired 96% -purity alumina and having a thickness of 0.2 mm and having insulating properties.
Prepare In this case, as shown in FIG. 2, the sheet-shaped insulating substrate 21 has an unnecessary area portion 21a which does not become a final product at all peripheral ends. The unnecessary area 21a is formed in a substantially rectangular shape.

Next, as shown in FIG. 2, FIG. 3 (b), and FIG. 4 (b), a plurality of pairs of upper electrode layers 22 containing silver as a main component are formed on the upper surface of the sheet-like insulating substrate 21 by screen printing.
Was formed and baked with a baking profile having a peak temperature of 850 ° C., whereby the upper electrode layer 22 was made a stable film.

Next, as shown in FIGS. 2, 3C, and 4C, a plurality of ruthenium oxide-based resistance layers 23 are formed by a screen printing method so as to straddle a plurality of pairs of upper electrode layers 22. Was formed and baked with a baked profile having a peak temperature of 850 ° C., so that the resistance layer 23 was a stable film.

Next, as shown in FIGS. 3D and 4D, a first protective layer 24 made of a plurality of pre-coated glass layers is formed by a screen printing method so as to cover the plurality of resistance layers 23. The first protective layer 24 made of a pre-coated glass layer was formed into a stable film by sintering with a sintering profile having a peak temperature of 600 ° C.

Next, as shown in FIGS. 3E and 4E, in order to adjust the resistance value of the resistance layer 23 between the plural pairs of upper electrode layers 22 to a constant value, a laser trimming method is used. And a plurality of trimming grooves 25 were formed.

Next, as shown in FIGS. 5 (a) and 6 (a), a screen printing method is used to cover the first protective layer 24 composed of a plurality of pre-coated glass layers arranged vertically in the drawing. A plurality of second protective layers 26 mainly composed of resin
Was formed and was cured with a curing profile having a peak temperature of 200 ° C., so that the second protective layer 26 was made a stable film.

Next, as shown in FIGS. 5B and 6B, a plurality of first resist layers 27 are formed by a screen printing method so as to cover the plurality of second protective layers 26. The first resist layer 27 was made into a stable film by ultraviolet curing.
Further, a plurality of second resist layers 28 were formed on the back surface of the sheet-shaped insulating substrate 21 by a screen printing method, and the second resist layers 28 were made into stable films by ultraviolet curing.

Next, as shown in FIGS. 2, 5C and 6C, the first resist layer 27 and the second resist
Except for an unnecessary area 21a formed on the entire periphery of the sheet-shaped insulating substrate 21 on which the substrate 8 is formed, a plurality of pairs of upper surface electrode layers 22 are separated and divided into a plurality of strip-shaped substrates 21b. A plurality of slit-shaped first divided portions 29 are formed by a dicing method. In this case, the plurality of slit-shaped first divided portions 29 are formed at a pitch of 700 μm,
The width of the slit-shaped first divided portion 29 is 120 μm.
m width. The plurality of slit-shaped first divided portions 29 are formed by through holes penetrating the sheet-shaped insulating substrate 21 in the vertical direction. Further, since the sheet-shaped insulating substrate 21 has a plurality of slit-shaped first divided portions 29 formed by dicing except for the unnecessary region portion 21a, the slit-shaped first divided portions 29 are formed. After that, since the plurality of strip-shaped substrates 21b are connected to the unnecessary area portion 21a, they are in a sheet state.

Next, as shown in FIGS. 5 (d) and 6 (d), the entire surface of the sheet-shaped insulating substrate 21 is nickel-plated by using an electroless plating method of plating by dipping in a plating bath. To form a side electrode layer 30 having a thickness of about 4 to 6 μm. In this case, a plurality of slit-shaped first divided portions 2
9 is formed by a through-hole penetrating the sheet-like insulating substrate 21 in the vertical direction, so that the side surface electrode layer 30 is formed by applying nickel plating to the entire surface of the sheet-like insulating substrate 21 by an electroless plating method. In this case, the side electrode layer 30 is formed from the upper surface side of the sheet-shaped insulating substrate 21 to the back surface side of the sheet-shaped insulating substrate 21 through the entire inner surface of the slit-shaped first divided portion 29 which is a through hole. Things. The side electrode layer 30 is formed on the sheet-like insulating substrate 2.
1 is formed so as to cover a part of the exposed upper electrode layer 22 and the first resist layer 27 on the upper surface side, and is formed so as to cover the second resist layer 28 on the back surface side of the sheet-shaped insulating substrate 21. Is what is done.

Next, as shown in FIGS. 7A and 8A, the plurality of first resist layers (not shown) and the plurality of second resist layers (not shown) are peeled off. The paired side electrode layers 30 are patterned.

Next, as shown in FIGS. 7B and 8B, a plurality of pairs of exposed side electrode layers 30 and a plurality of first resist layers (FIG. (Not shown), a plurality of pairs of tin solder layers 31 having a thickness of about 4 to 6 μm are formed so as to cover a part of the plurality of pairs of upper surface electrode layers 22 exposed by peeling.

The thickness of the side electrode layer 30 is about 4 to 6 μm.
However, the thickness is not limited to this range, the thickness is appropriately 1 to 15 μm, and the side electrode layer 30 is to be plated with nickel using an electroless plating method. Because it is constituted by, it is a form that does not have magnetism, in such a configuration,
A very high dimensional accuracy can be obtained, and when a resistor is sucked and mounted by a suction pin of an automatic mounting machine, stability at the time of suction is improved and a high mounting rate can be secured.

The solder layer 31 is made of tin. However, the present invention is not limited to this. Tin alloy-based materials may be used. When these materials are used, a stable solder can be used during reflow soldering. It can be attached.

Since the upper electrode layer 22 is made of a silver-based material and the resistance layer 23 is made of a ruthenium oxide-based material, resistance characteristics excellent in heat resistance and durability can be secured. It is.

The protective layer covering the resistance layer 23 and the like
A first protective layer 24 made of a pre-coated glass layer that covers the resistance layer 23 and a second protective layer 26 that mainly covers the trimming groove 25 and covers the trimming groove 25, while covering the first protective layer 24. The first protective layer 24
This prevents the occurrence of cracks at the time of laser trimming and reduces the current noise, and the second protective layer 26 containing the resin as a main component covers the entire resistive layer 23 to provide resistance characteristics with excellent moisture resistance. It can be secured.

Finally, as shown in FIG. 2, FIG. 7 (c), and FIG. 8 (c), except for an unnecessary area 21a formed on the entire peripheral edge of the sheet-shaped insulating substrate 21, In the direction orthogonal to the slit-shaped first divided portion 29, the plurality of resistive layers 23 are individually separated into a plurality of strip-shaped substrates 21 b in the insulated substrate 21 so as to be divided into the individual substrates 21 c. A plurality of second divided portions 32 are formed by using a dicing method. In this case, the plurality of second division units 32
.mu.m pitch, and the second divided portion 3
2 has a width of 100 μm. Since the plurality of second divided portions 32 are formed on the plurality of strip-shaped substrates 21b by the dicing method except for the unnecessary region portion 21a, each time the plurality of second divided portions 32 are formed. The product that has been cut and divided into individual substrates 21c, and then individualized, is separated from the unnecessary region 21a.

By the steps described above, the resistor according to the first embodiment of the present invention is manufactured.

The length dimension and width dimension of the resistor manufactured by the above-described process are accurate (within ± 0.005 mm) between the slit-shaped first divided portion 29 and the second divided portion 32 formed by the dicing method. ) And the thicknesses of the side electrode layer 30 and the solder layer 31 are also accurate, so that the total length and total width of the product resistor are exactly 0.6 mm long × 0.3 mm wide. In addition, the pattern accuracy of the upper electrode layer 22 and the resistance layer 23 does not need to be classified into dimensional ranks of the individual substrates, and it is not necessary to consider dimensional variations within the dimensional rank of the same individual substrate. The effective area of 23 can be made larger than that of the conventional product. That is, the resistance layer in the conventional product has a length of about 0.20 mm × width 0.19 mm, whereas the resistance layer 23 of the resistor in the first embodiment of the invention has a length of about 0.25 mm × width 0. .24 mm, which is about 1.6 times or more in area.

The plurality of slit-shaped first divided portions 29
The plurality of second divided portions 32 are formed by using a dicing method, and the sheet-shaped insulating substrate 21 that does not require the dimensional classification of the individual substrate is used. It is not necessary to classify the size of the substrate in the form of a substrate. This makes it possible to eliminate the complexity of the process of exchanging the mask as in the related art and to easily perform dicing using a semiconductor or other general dicing equipment. Things.

The sheet-shaped insulating substrate 21 has an unnecessary area 21a which is not finally formed as a product at the entire peripheral edge, and has a plurality of slit-shaped first divided portions 29 and a plurality of second divided portions 29a. Is not formed in the unnecessary area 21a, the plurality of strip-shaped substrates 21b are formed even after the plurality of slit-shaped first divisions 29 are formed.
Is connected to the unnecessary area 21a, so that the sheet-shaped insulating substrate 21 is not finely divided into the plurality of strip-shaped substrates 21b. Therefore, the plurality of slit-shaped first divided portions 29 are formed. After this, the post-process can be performed in the state of the sheet-like insulating substrate 21 having the unnecessary region 21a, so that the design of the method can be simplified. When a plurality of second divisions 32 are formed, each time the plurality of second divisions 32 are formed, the individual substrate 2
Since the product cut and divided into 1c and separated into individual pieces is separated from the unnecessary area portion 21a, the step of sorting the unnecessary area portion 21a and the product later becomes unnecessary.

Since the plurality of pairs of side electrode layers 30 and the plurality of pairs of solder layers 31 are formed in the state of the sheet-like insulating substrate 21, the side-surface electrode layers 30 are formed on the sheet-like insulating substrate 21. Be able to
When the solder layer 31 is formed by the electroplating method, the potential difference can be reduced, whereby a stable solder layer 31 can be formed.

In the first embodiment of the present invention, the unnecessary region 21a, which is not finally formed as a product, is formed at the entire peripheral edge of the sheet-shaped insulating substrate 21 to form a substantially square shape. The unnecessary area portion 2 has been described.
1a is not necessarily formed at the entire peripheral end of the sheet-shaped insulating substrate 21. For example, when an unnecessary region 21d is formed at one end of the sheet-shaped insulating substrate 21 as shown in FIG. As shown in FIG.
The first embodiment of the present invention can be applied to the case where the unnecessary region portions 21e are formed at both ends of the insulating substrate 21 and the unnecessary region portions 21f are formed at three ends of the sheet-shaped insulating substrate 21 as shown in FIG. The same operation and effect as described above can be obtained.

Further, in the first embodiment of the present invention, the case where the plurality of second divided portions 32 are formed by the dicing method has been described.
The plurality of second divisions 32 are connected to the sheet-shaped insulating substrate 21.
Is formed by cutting any one of the upper surface side, the rear surface side, and the central portion of the sheet-shaped insulating substrate 21 by a laser method, a dicing method, or the like, leaving a thin portion on any of the rear surface side, the upper surface side, and the central portion. In these cases, individualization is not performed every time the second divided portion 32 is formed, but in two stages.

In the first embodiment of the present invention, the first resist layer 27 and the second resist layer 28
After the formation of the first resist layer 27 and the second resist layer 28
May be formed after forming the slit-shaped first divided portion 29. However, when the first resist layer 27 and the second resist layer 28 are screen-printed after the formation of the slit-shaped first divided portions 29, the strength of the sheet-shaped insulating substrate 21 is reduced. It is necessary to reduce the printing pressure during screen printing.

Further, even if the second resist layer 28 is formed immediately after forming the first protective layer 24 made of a pre-coated glass layer, the same effect as that of the first embodiment of the present invention can be obtained.

Furthermore, in the first embodiment of the present invention, the first resist layer 27 and the second resist layer 28
The peeling was performed before the formation of the solder layer 31, but this can be performed after the formation of the solder layer 31.

In the first embodiment of the present invention, a silver-based material is used for the upper electrode layer 22 and a ruthenium oxide-based material is used for the resistance layer 23. However, these materials may be used in other material systems. An effect similar to that of the first embodiment of the invention can be obtained.

In the first embodiment of the present invention, the slit-shaped first division 29 and the second division 32 are formed by using the dicing method. Even if the slit-shaped first division 29 and the second division 32 are formed by using division means such as a laser or a water jet, the same operation as in the first embodiment of the present invention described above. It is effective.

Further, in the first embodiment of the present invention, when a plurality of slit-shaped first divisions 29 for dividing into a plurality of strip-shaped substrates 21b are formed, a plurality of pairs of upper surface electrode layers 22, Resistance layer 23, a plurality of first protection layers 24, a plurality of trimming grooves 25, a plurality of second protection layers 2
6. A description has been given of a case in which a plurality of slit-shaped first divided portions 29 are formed on a sheet-shaped insulating substrate 21 on which a plurality of first resist layers 27 and a plurality of second resist layers 28 are formed. However, the present invention is not limited to this. For example, when a plurality of slit-shaped first divided portions 29 are first formed on the sheet-shaped insulating substrate 21, the slit-shaped first divided portion 29 may be used. In the case of using a sheet-like insulating substrate 21 in which a plurality of 29 are formed in advance, after forming a plurality of pairs of upper electrode layers 22 on the sheet-like insulating substrate 21, a slit-like first insulating layer 21 is formed on the sheet-like insulating substrate 21. When a plurality of divided portions 29 are formed, a plurality of resistance layers 23 are formed on the sheet-shaped insulating substrate 21, and then the slit-shaped first divided portions 29 are formed on the sheet-shaped insulating substrate 21.
Is formed, a sheet-shaped insulating substrate 2
A plurality of pairs of upper electrode layers 22 are formed on one of the plurality of upper electrode layers 22, and a plurality of resistance layers 2
In the case where a plurality of slit-shaped first divided portions 29 are formed on the sheet-shaped insulating substrate 21 after the formation of the plurality of resistive layers 23, a plurality of resistance layers 23 are formed on the sheet-shaped insulating substrate 21 and When a plurality of pairs of upper surface electrode layers 22 are formed so as to partially overlap the plurality of resistance layers 23, and then a plurality of slit-shaped first divisions 29 are formed on the sheet-shaped insulating substrate 21, A plurality of pairs of upper surface electrode layers 22 and a plurality of resistance layers 23 are formed on a sheet-shaped insulating substrate 21, and the plurality of pairs of upper surface electrode layers 2 in the plurality of resistance layers 23 are formed.
After trimming to adjust the resistance between the two,
Even when the slit-shaped first divided portion 29 is formed on the sheet-shaped insulating substrate 21, the same effects as those of the first embodiment of the present invention can be obtained.

(Embodiment 2) Hereinafter, a method of manufacturing a resistor according to Embodiment 2 of the present invention will be described with reference to the drawings.

FIG. 12 is a top view showing a state in which an unnecessary region is formed at the entire peripheral edge of a sheet-shaped insulating substrate used in manufacturing the resistor according to the second embodiment of the present invention. a)-(e), FIGS. 14 (a)-(e), FIGS. 15 (a)-(d), FIGS. 16 (a)-(d), FIG.
(A)-(c) and FIGS. 18 (a)-(c) are process diagrams showing a method for manufacturing a resistor according to the second embodiment of the present invention.

First, FIG. 12, FIG. 13 (a), FIG.
As shown in (a), a 0.2 mm thick sheet-like insulating substrate 41 made of fired 96% -purity alumina is prepared. In this case, as shown in FIG. 12, the sheet-shaped insulating substrate 41 has an unnecessary area portion 41a which is not finally formed as a product at all peripheral edges. The unnecessary area 41a is formed in a substantially rectangular shape.

Next, FIGS. 12, 13 (b) and 14 (b)
As shown in FIG. 3, a plurality of pairs of upper electrode layers 42 mainly composed of silver are formed on the upper surface of a sheet-shaped insulating substrate 41 by a screen printing method, and baked in a firing profile at a peak temperature of 850 ° C. Layer 42 was a stable film.

Next, FIG. 12, FIG. 13 (c), FIG.
As shown in (c), a plurality of ruthenium oxide-based resistance layers 43 are formed by a screen printing method so as to straddle a plurality of pairs of upper surface electrode layers 42, and are fired by a firing profile having a peak temperature of 850 ° C. The resistance layer 43 was a stable film.

Next, as shown in FIGS. 13D and 14D, a first protective layer 44 composed of a plurality of pre-coated glass layers is formed by a screen printing method so as to cover the plurality of resistance layers 43. The first protective layer 44 made of a pre-coated glass layer was formed into a stable film by baking with a baking profile having a peak temperature of 600 ° C.

Next, as shown in FIGS. 13E and 14E, in order to adjust the resistance value of the resistance layer 43 between the plurality of pairs of upper electrode layers 42 to a constant value, a laser trimming method is used. And a plurality of trimming grooves 45 were formed.

Next, as shown in FIGS. 15 (a) and 16 (a), a screen printing method is used so as to cover the first protective layer 44 composed of a plurality of pre-coated glass layers arranged vertically in the drawing. A plurality of second protective layers 46 containing a resin as a main component were formed by using the method described above, and cured with a curing profile at a peak temperature of 200 ° C., so that the second protective layer 46 was a stable film.

Next, as shown in FIGS. 15 (b) and 16 (b), a plurality of resist layers 47 are formed on the back surface of the sheet-shaped insulating substrate 41 by a screen printing method, and the resist is cured by ultraviolet light. Layer 47 was a stable film.

Next, FIG. 12, FIG. 15 (c), FIG.
As shown in (c), a plurality of pairs of upper surface electrode layers 42 are separated and separated from each other, except for an unnecessary region 41a formed on the entire periphery of the sheet-shaped insulating substrate 41 on which the resist layer 47 is formed. A plurality of slit-shaped first divided portions 48 for dividing the substrate into strip-shaped substrates 41b are formed by a dicing method. In this case, the plurality of slit-shaped first divided portions 48 are formed at a pitch of 700 μm, and the width of the slit-shaped first divided portions 48 is 120 μm. Further, the plurality of slit-shaped first divided portions 48 are
It is formed by a through-hole penetrating the sheet-shaped insulating substrate 41 in the vertical direction. Further, since the sheet-shaped insulating substrate 41 has a plurality of slit-shaped first divided portions 48 formed by dicing except for the unnecessary region portion 41a, the slit-shaped first divided portions 48 are formed. After that, since the plurality of strip-shaped substrates 41b are connected to the unnecessary area portion 41a, they are in a sheet state.

Next, as shown in FIGS. 15D and 16D, the sheet-like insulating substrate 4 is formed by a sputtering method.
A side electrode layer 49 having a thickness of about 0.1 to 1 μm made of nickel or a nickel-based alloy, for example, a nickel-chromium alloy, is formed on the back surface of the first and the inner surfaces of the plurality of slit-shaped first divided portions 48. In this case, a plurality of slit-shaped first
The side surface electrode layer 49 formed on the inner surface of the divisional portion 48 of the upper surface is formed on the upper surface electrode layer 4 formed on the upper surface of the sheet-shaped insulating substrate 41.
2 and are electrically connected.

Next, as shown in FIGS. 17A and 18A, a plurality of resist layers (not shown) are peeled off, and a plurality of pairs of side electrode layers 49 are patterned.

Next, as shown in FIGS. 17 (b) and 18 (b), a plurality of pairs of exposed side electrode layers 49 and a plurality of resist layers (not shown) are formed by electroplating.
Pairs of upper surface electrode layers 42 exposed by peeling off
A plurality of pairs of nickel layers 50 made of nickel having a thickness of about 4 to 6 μm and a plurality of pairs of solder layers 51 made of tin having a thickness of about 4 to 6 μm are formed so as to cover part of.

The thickness of the side electrode layer 49 formed by the sputtering method is about 0.1 to 1 μm, but is not limited to this range.
The thickness including the 0 and the solder layer 51 is appropriately 1 to 15 μm.

The solder layer 51 is made of tin. However, the present invention is not limited to this. For example, a tin alloy-based material may be used. It can be attached.

Since the upper electrode layer 42 is made of a silver-based material and the resistance layer 43 is made of a ruthenium oxide-based material, resistance characteristics excellent in heat resistance and durability can be secured. It is.

The protective layer covering the resistance layer 43 and the like
A first protective layer 44 made of a pre-coated glass layer that covers the resistance layer 43, and a second protective layer 46 that mainly covers the trimming groove 45 and covers the first protective layer 44, while covering the first protective layer 44. The first protective layer 44
This prevents the occurrence of cracks at the time of laser trimming and reduces the current noise, and the second protective layer 46 containing the resin as a main component covers the entire resistive layer 43 to provide resistance characteristics with excellent moisture resistance. It can be secured.

Finally, FIG. 12, FIG. 17 (c), FIG.
As shown in (c), a plurality of strip-shaped substrates 41b of the sheet-shaped insulating substrate 41 are formed except for an unnecessary area portion 41a formed at an end of the entire periphery of the sheet-shaped insulating substrate 41.
The plurality of resistance layers 43 are individually separated from each other to form an individual substrate 41c.
A plurality of second divisions 52 are formed using a dicing method in a direction orthogonal to the slit-like first divisions 48 so as to be divided into two. In this case, the plurality of second dividing units 52
Are formed at a pitch of 400 μm, and the width of the second divided portion 52 is 100 μm. The plurality of second divided portions 52 are formed on the plurality of strip-shaped substrates 41b by a dicing method except for the unnecessary region portion 41a. The product that is cut and divided into the individual pieces of the substrate 41c and separated into individual pieces is separated from the unnecessary area 41a.

Through the steps described above, the resistor according to the second embodiment of the present invention is manufactured.

The length dimension and width dimension of the resistor manufactured by the above process are accurate (within ± 0.005 mm) between the slit-shaped first divided portion 48 and the second divided portion 52 formed by the dicing method. ) And the thickness of the side electrode layer 49, the nickel layer 50, and the solder layer 51 are also accurate, so that the total length and width of the product resistor are exactly 0.6 mm long × 0.3 mm wide. Things. In addition, the pattern accuracy of the upper electrode layer 42 and the resistance layer 43 does not need to be classified into dimensional ranks of the individual substrates, and it is not necessary to consider a dimensional variation within the dimensional rank of the same individual substrate. The effective area of 43 can be made larger than that of the conventional product. That is, the resistance layer in the conventional product was about 0.20 mm in length × 0.19 mm in width, whereas the resistance layer in the second embodiment of the present invention was
Is about 0.25 mm long × 0.24 mm wide and about 1.6 times or more in area.

The plurality of slit-shaped first divided portions 48
Further, since the plurality of second divided portions 52 are formed by using the dicing method, the sheet-shaped insulating substrate 41 which does not require the dimensional classification of the individual substrate can be used. It is not necessary to classify the size of the substrate in the form of a substrate. This makes it possible to eliminate the complexity of the process of exchanging the mask as in the related art and to easily perform dicing using a semiconductor or other general dicing equipment. Things.

The sheet-shaped insulating substrate 41 has an unnecessary region 41a which is not finally formed as a product at the entire peripheral edge, and has a plurality of slit-shaped first divided portions 48 and a plurality of second divided portions. Is not formed in the unnecessary area 41a, the plurality of strip-shaped substrates 41b are formed even after the plurality of slit-shaped first divided parts 48 are formed.
Is connected to the unnecessary area 41a, so that the sheet-shaped insulating substrate 41 is not finely divided into a plurality of strip-shaped substrates 41b. After this, the post-process can be performed in the state of the sheet-shaped insulating substrate 41 having the unnecessary region 41a, so that the design of the method can be simplified. When a plurality of second divisions 52 are formed, each time the plurality of second divisions 52 are formed, the individual substrate 4
Since the product cut and divided into 1c and separated into individual pieces is separated from the unnecessary area 41a, the step of separating the unnecessary area 41a and the product later is not required.

Since the plurality of pairs of side electrode layers 49, the nickel layer 50, and the plurality of pairs of solder layers 51 are formed in the state of the sheet-like insulating substrate 41, the side-surface electrode layers 49 are formed in a sheet-like insulating layer. It can be formed at a required portion of the substrate 41, and the potential difference can be reduced when the nickel layer 50 and the solder layer 51 are formed by the electroplating method. Can be formed.

In the second embodiment of the present invention, the unnecessary region 41a, which is not finally formed as a product, is formed at the entire peripheral edge of the sheet-shaped insulating substrate 41 to form a substantially square shape. The unnecessary area portion 4 has been described.
1a is not necessarily formed at the entire peripheral end of the sheet-shaped insulating substrate 41. For example, when an unnecessary area portion 41d is formed at one end of the sheet-shaped insulating substrate 41 as shown in FIG. As shown in FIG.
In the case where the unnecessary area portions 41e are formed at both ends of
As shown in the above, even when the unnecessary region 41f is formed at three ends of the sheet-shaped insulating substrate 41, the same operation and effect as those of the second embodiment of the present invention can be obtained.

In the second embodiment of the present invention, the case where the plurality of second divided portions 52 are formed by the dicing method has been described.
The plurality of second divided portions 52 are formed into a sheet-shaped insulating substrate 41.
The sheet-shaped insulating substrate 41 is formed by cutting any one of the upper surface side, the rear surface side, and the central portion of the sheet-shaped insulating substrate 41 by a laser method, a dicing method, or the like, leaving a thin portion on any of the rear surface side, the upper surface side, and the central portion. In these cases, the pieces are not divided into pieces each time the second divided portion 52 is formed, but are divided into pieces in two stages.

In the second embodiment of the present invention, the slit-shaped first divided portion 48 is formed after the resist layer 47 is formed. However, the resist layer 47 is formed by the slit-shaped first divided portion. It may be formed after forming the portion 48. However, when the resist layer 47 is screen-printed after the formation of the slit-shaped first divided portions 48, the strength of the sheet-shaped insulating substrate 41 is reduced, so that the printing pressure during screen printing is reduced. There is a need to.

Further, even if the resist layer 47 is formed immediately after the formation of the first protective layer 44 made of a pre-coated glass layer, the same effect as that of the second embodiment of the present invention can be obtained.

Furthermore, in the second embodiment of the present invention, the resist layer 47 is peeled off before the nickel layer 50 and the solder layer 51 are formed. Is also possible.

In the second embodiment of the present invention, a silver-based material is used for the upper electrode layer 42 and a ruthenium oxide-based material is used for the resistance layer 43. However, these materials may be used in other material systems. An effect similar to that of the second embodiment can be obtained.

In the second embodiment of the present invention, the slit-shaped first divided portion 48 and the second divided portion 52 are formed using the dicing method. However, other than the dicing method. In the case where the slit-shaped first divided portion 48 and the second divided portion 52 are formed by using a dividing means such as a laser or a water jet, the same operation as in the second embodiment of the present invention is performed. It is effective.

Further, in the second embodiment of the present invention, when a plurality of slit-shaped first divisions 48 for dividing into a plurality of strip-shaped substrates 41b are formed, a plurality of pairs of upper electrode layers 42, Resistance layer 43, a plurality of first protection layers 44, a plurality of trimming grooves 45, a plurality of second protection layers 4
6. A description has been given of a case in which a plurality of slit-shaped first divided portions 48 are formed on a sheet-shaped insulating substrate 41 on which a plurality of resist layers 47 are formed. However, the present invention is not limited to this. In addition, when a plurality of slit-shaped first divided portions 48 are first formed on the sheet-shaped insulating substrate 41, the slit-shaped first divided portions 4 are formed.
When a plurality of pairs of upper electrode layers 42 are formed on the sheet-like insulating substrate 41, a slit-like first insulating layer 41 is formed on the sheet-like insulating substrate 41. When a plurality of divided portions 48 are formed, a plurality of resistance layers 43 are formed on the sheet-shaped insulating substrate 41, and then a plurality of slit-shaped first divided portions 48 are formed on the sheet-shaped insulating substrate 41. In this case, a plurality of pairs of upper electrode layers 42 are formed on a sheet-like insulating substrate 41, and a plurality of resistance layers 43 are formed so as to partially overlap the plurality of pairs of upper electrode layers 42. When a plurality of slit-shaped first divided portions 48 are formed on the sheet-shaped insulating substrate 41, a plurality of resistance layers 43 are formed on the sheet-shaped insulating substrate 41, and one So that the parts overlap After forming the upper electrode layer 42 of the pair,
When a plurality of slit-shaped first divided portions 48 are formed on the sheet-like insulating substrate 41, a plurality of pairs of upper electrode layers 42 and a plurality of resistance layers 43 are formed on the sheet-like insulating substrate 41.
Is formed, and trimming is performed to adjust the resistance between the plurality of pairs of upper surface electrode layers 42 in the plurality of resistance layers 43, and then the slit-like first division is formed on the sheet-like insulating substrate 41. Even when the portion 48 is formed, the same effect as in the second embodiment of the present invention can be obtained.

(Embodiment 3) A method of manufacturing a resistor according to Embodiment 3 of the present invention will be described below with reference to the drawings.

FIG. 22 is a top view showing a state in which an unnecessary region is formed at the entire peripheral edge of a sheet-like insulating substrate used in manufacturing the resistor according to the third embodiment of the present invention. a) to (e), FIGS. 24 (a) to (e), FIGS. 25 (a) to (d), FIGS. 26 (a) to (d), and FIG.
(A) to (c) and FIGS. 28 (a) to (c) are step diagrams showing a method of manufacturing a resistor according to Embodiment 3 of the present invention.

First, FIG. 22, FIG. 23 (a), FIG.
As shown in (a), a sheet-like insulating substrate 61 having a thickness of 0.2 mm and made of fired 96% -purity alumina is prepared. In this case, as shown in FIG. 22, the sheet-shaped insulating substrate 61 has an unnecessary area portion 61a which is not a final product at the entire peripheral end. The unnecessary area 61a is formed in a substantially rectangular shape.

Next, FIGS. 22, 23 (b) and 24 (b)
As shown in FIG. 6, a plurality of pairs of upper electrode layers 62 mainly composed of silver are formed on the upper surface of a sheet-shaped insulating substrate 61 by a screen printing method, and baked with a firing profile having a peak temperature of 850 ° C. Layer 62 was a stable film.

Next, FIG. 22, FIG. 23 (c), FIG.
As shown in (c), a plurality of ruthenium oxide-based resistance layers 63 are formed by a screen printing method so as to straddle a plurality of pairs of upper electrode layers 62, and are fired by a firing profile having a peak temperature of 850 ° C. The resistance layer 63 was a stable film.

Next, as shown in FIGS. 23D and 24D, a first protective layer 64 made of a plurality of pre-coated glass layers is formed by a screen printing method so as to cover the plurality of resistance layers 63. The first protective layer 64 made of a pre-coated glass layer was formed into a stable film by forming and firing with a firing profile having a peak temperature of 600 ° C.

Next, as shown in FIGS. 23 (e) and 24 (e), in order to adjust the resistance of the resistance layer 63 between the plural pairs of upper electrode layers 62 to a constant value, a laser trimming method is used. , And a plurality of trimming grooves 65 were formed.

Next, as shown in FIGS. 25 (a) and 26 (a), a screen printing method is used so as to cover the first protective layer 64 composed of a plurality of pre-coated glass layers arranged vertically in the drawing. A plurality of second protective layers 66 containing a resin as a main component were formed by using the method described above, and cured with a curing profile at a peak temperature of 200 ° C., whereby the second protective layer 66 was made a stable film.

Next, FIG. 22, FIG. 25 (b), FIG.
As shown in (b), a plurality of pairs of upper surface electrode layers 62 are separated to form a plurality of strip-shaped substrates 61b except for an unnecessary area portion 61a formed on the entire peripheral edge of the sheet-shaped insulating substrate 61. A plurality of slit-shaped first divisions 67 for division are formed by a dicing method. In this case, the plurality of slit-shaped first divisions 67 are formed at a pitch of 700 μm, and the width of the slit-shaped first divisions 67 is 120 μm. The plurality of slit-shaped first divided portions 67 are formed by through holes penetrating the sheet-shaped insulating substrate 61 in the vertical direction. Further, the sheet-shaped insulating substrate 61 is provided in the unnecessary area portion 6.
Since the plurality of slit-shaped first divided portions 67 are formed by the dicing method except for the first divided portion 1a, the plurality of strip-shaped substrates 61b are formed even after the slit-shaped first divided portions 67 are formed.
Is connected to the unnecessary area 61a, so that it is in a sheet state.

Next, as shown in FIGS. 25C and 26C, the back surface of the sheet-shaped insulating substrate 61 in which a plurality of slit-shaped first divided portions 67 are formed is made of magnetic metal. And a magnet 69 for fixing the mask 68 at a predetermined position on the upper surface side of the sheet-shaped insulating substrate 61. Next, FIG.
(D), as shown in FIG.
Using a sputtering method, a nickel or nickel-based alloy, for example, a nickel-chromium alloy having a thickness of about 0.1 to 1 μm is formed on the back surface of the sheet-shaped insulating substrate 61 and the inner surface of the plurality of slit-shaped first divisions 67. A plurality of pairs of side electrode layers 70 are formed. In this case, a plurality of slit-shaped first
The side surface electrode layer 70 formed on the inner surface of the divided portion 67 is formed by the upper surface electrode layer 6 formed on the upper surface of the sheet-shaped insulating substrate 61.
2 and are electrically connected.

Next, as shown in FIGS. 27A and 28A, the mask 68 and the magnet 69 are removed.

Next, as shown in FIGS. 27 (b) and 28 (b), using an electroplating method, a plurality of pairs of exposed side surface electrode layers 70 and a plurality of pairs of upper surface electrode layers 62 are formed. A plurality of pairs of nickel layers 71 made of nickel having a thickness of about 4 to 6 μm and a plurality of pairs of solder layers 72 made of tin having a thickness of about 4 to 6 μm are formed so as to cover the portions.

The thickness of the side electrode layer 70 formed by the sputtering method is about 0.1 to 1 μm, but is not limited to this range.
1 to 15 μm is appropriate for the thickness including 1 and the solder layer 72.

The solder layer 72 is made of tin. However, the present invention is not limited to this. For example, a tin alloy-based material may be used. It can be attached.

Since the upper electrode layer 62 is made of a silver-based material and the resistance layer 63 is made of a ruthenium oxide-based material, resistance characteristics excellent in heat resistance and durability can be secured. It is.

Further, the protective layer covering the resistance layer 63 and the like
A first protective layer 64 made of a pre-coated glass layer that covers the resistance layer 63 and a second protective layer 66 that mainly covers the trimming groove 65 and covers the trimming groove 65 while covering the first protective layer 64. The first protective layer 64
In this way, the generation of cracks during laser trimming can be prevented and current noise can be reduced, and the entire resistance layer 63 is covered with the second protective layer 66 containing the resin as a main component, thereby providing resistance characteristics with excellent moisture resistance. It can be secured.

Finally, FIG. 22, FIG. 27 (c), FIG.
As shown in (c), a plurality of strip-shaped substrates 61b of the sheet-like insulating substrate 61 are formed except for an unnecessary area portion 61a formed at an end of the entire periphery of the sheet-like insulating substrate 61.
A plurality of resistive layers 63 are individually separated to form individual substrates 61c.
The plurality of second divided portions 73 are formed using a dicing method in a direction orthogonal to the slit-shaped first divided portions 67 so as to be divided into two. In this case, the plurality of second dividing units 73
Are formed at a pitch of 400 μm, and the width of the second divided portion 73 is 100 μm. Since the plurality of second divided portions 73 are formed on the plurality of strip-shaped substrates 61b by the dicing method except for the unnecessary region portion 61a, each time the plurality of second divided portions 73 are formed. The product that has been cut and divided into individual substrates 61c and separated into individual substrates is separated from the unnecessary region 61a.

By the steps described above, the resistor according to the third embodiment of the present invention is manufactured.

The length and width of the resistor manufactured by the above-described process are such that the interval between the slit-shaped first divided portion 67 and the second divided portion 73 formed by the dicing method is accurate (within ± 0.005 mm). ) And the thicknesses of the side electrode layer 70, the nickel layer 71, and the solder layer 72 are also accurate, so that the total length and width of the product resistor are exactly 0.6 mm long × 0.3 mm wide. Things. In addition, the pattern accuracy of the upper electrode layer 62 and the resistance layer 63 does not need to be classified into dimensional ranks of the individual substrates, and it is not necessary to consider dimensional variations within the dimensional rank of the same individual substrate. The effective area of 63 can be made larger than that of the conventional product. That is, the resistance layer in the conventional product was about 0.20 mm in length × 0.19 mm in width, whereas Embodiment 3 of the present invention
Is about 0.25 mm in length × 0.24 mm in width, which is about 1.6 times or more in area.

The plurality of slit-like first divisions 67
Further, since the plurality of second divided portions 73 are formed using the dicing method, the sheet-shaped insulating substrate 61 which does not require the dimensional classification of the individual substrate can be used. It is not necessary to classify the size of the substrate, and thus it is possible to eliminate the complexity of the process for exchanging the mask as in the related art, and to easily perform dicing using a semiconductor or other general dicing equipment. Things.

In addition, the sheet-shaped insulating substrate 61 has an unnecessary area 61a which is not finally formed as a product at the entire peripheral end, and has a plurality of slit-shaped first divided portions 67 and a plurality of second divided portions. Is not formed in the unnecessary area portion 61a. Therefore, even after the plurality of slit-shaped first divided portions 67 are formed, the plurality of strip-shaped substrates 61b are formed.
Is connected to the unnecessary area portion 61a, so that the sheet-shaped insulating substrate 61 is not finely divided into the plurality of strip-shaped substrates 61b, and therefore, the plurality of slit-shaped first divided portions 67 are formed. After that, the post-process can be performed in the state of the sheet-shaped insulating substrate 61 having the unnecessary region portion 61a, so that the design of the method can be simplified. When a plurality of second divisions 73 are formed, each time the plurality of second divisions 73 are formed, the individual substrate 6
Since the product cut and divided into 1c and separated into individual pieces is separated from the unnecessary area portion 61a, the step of sorting the unnecessary area portion 61a and the product later becomes unnecessary.

Further, since the plurality of pairs of side electrode layers 70, the nickel layer 71, and the plurality of pairs of solder layers 72 are formed in the state of the sheet-like insulating substrate 61, the side-surface electrode layers 70 are formed of the sheet-like insulating layer. It can be formed at a required portion of the substrate 61, and the potential difference can be reduced when the nickel layer 71 and the solder layer 72 are formed by the electroplating method, so that the stable nickel layer 71 and the solder layer 72 can be formed. Can be formed.

In the third embodiment of the present invention, the unnecessary area portion 61a which does not finally become a product is formed on the entire peripheral edge of the sheet-like insulating substrate 61 to form a substantially rectangular shape. The unnecessary area portion 6 has been described.
1a is not necessarily formed at the entire peripheral edge of the sheet-shaped insulating substrate 61. For example, when an unnecessary region 61d is formed at one end of the sheet-shaped insulating substrate 61 as shown in FIG. As shown in FIG.
In the case where the unnecessary area portions 61e are formed at both end portions of FIG.
In the case where the unnecessary region portions 61f are formed at the three ends of the sheet-shaped insulating substrate 61 as shown in FIG. 19, the same operation and effect as those of the third embodiment of the present invention can be obtained.

In the third embodiment of the present invention, the case where the plurality of second divided portions 73 are formed by the dicing method has been described.
The plurality of second divided portions 73 are formed into a sheet-shaped insulating substrate 61.
The sheet-shaped insulating substrate 61 is formed by cutting any one of the upper surface side, the rear surface side, and the central portion by a laser method, a dicing method, or the like, leaving a thin portion on any of the rear surface side, the upper surface side, and the central portion. In these cases, individualization is not performed every time the second divided portion 73 is formed, but in two stages.

In the third embodiment of the present invention, a silver-based material is used for the upper electrode layer 62 and a ruthenium oxide-based material is used for the resistance layer 63. However, these materials may be used in other material systems. An effect similar to that of the third embodiment can be obtained.

In the third embodiment of the present invention, the slit-shaped first divided portion 67 and the second divided portion 73 are formed by using the dicing method. Even if the slit-shaped first division 67 and the second division 73 are formed using division means such as a laser or a water jet, the same operation as in the third embodiment of the present invention described above. It is effective.

Further, in the third embodiment of the present invention, when a plurality of slit-like first divisions 67 for dividing into a plurality of strip-like substrates 61b are formed, a plurality of pairs of upper surface electrode layers 62, a plurality of Resistance layer 63, a plurality of first protection layers 64, a plurality of trimming grooves 65, a plurality of second protection layers 6
Although a description has been given of a case where a plurality of slit-shaped first divisions 67 are formed on the sheet-shaped insulating substrate 61 on which 6 is formed, the present invention is not limited to this.
In addition, when a plurality of slit-shaped first divided portions 67 are first formed on the sheet-shaped insulating substrate 61, a sheet-shaped insulating substrate in which a plurality of slit-shaped first divided portions 67 are formed in advance. When the substrate 61 is used, a plurality of pairs of upper surface electrode layers 62 are formed on the sheet-shaped insulating substrate 61, and then a plurality of slit-shaped first divided portions 67 are formed on the sheet-shaped insulating substrate 61. In this case, after the plurality of resistance layers 63 are formed on the sheet-shaped insulating substrate 61, the slit-shaped first divided portions 67 are formed on the sheet-shaped insulating substrate 61.
Are formed, a sheet-shaped insulating substrate 6
A plurality of pairs of upper surface electrode layers 62 are formed on one of the plurality of upper electrode layers 62, and the plurality of resistance layers 6
In the case where a plurality of slit-shaped first divided portions 67 are formed on the sheet-shaped insulating substrate 61 after the formation of the third, a plurality of resistance layers 63 are formed on the sheet-shaped insulating substrate 61, and When a plurality of pairs of upper surface electrode layers 62 are formed so as to partially overlap the plurality of resistance layers 63, and then a plurality of slit-shaped first divided portions 67 are formed on the sheet-shaped insulating substrate 61, A plurality of pairs of upper electrode layers 62 and a plurality of resistance layers 63 are formed on a sheet-shaped insulating substrate 61, and the plurality of pairs of upper electrode layers 6 in the plurality of resistance layers 63 are formed.
After trimming to adjust the resistance between the two,
Even when the slit-shaped first divided portion 67 is formed on the sheet-shaped insulating substrate 61, the same effect as that of the third embodiment of the present invention can be obtained.

Embodiment 4 Hereinafter, a method for manufacturing a resistor according to Embodiment 4 of the present invention will be described with reference to the drawings.

FIG. 32 is a top view showing a state in which an unnecessary region is formed at the entire peripheral edge of a sheet-shaped insulating substrate used in manufacturing the resistor according to the fourth embodiment of the present invention. a) to (e), FIGS. 34 (a) to (e), FIGS. 35 (a) to (c), FIGS. 36 (a) to (c), and FIG.
(A) to (c) and FIGS. 38 (a) to (c) are process diagrams showing a method for manufacturing a resistor according to Embodiment 4 of the present invention.

First, FIG. 32, FIG. 33 (a), FIG.
As shown in (a), a sheet-shaped insulating substrate 81 having a thickness of 0.2 mm and made of calcined 96% -purity alumina is prepared. In this case, as shown in FIG. 32, the sheet-shaped insulating substrate 81 has an unnecessary area portion 81a which is not a final product at all peripheral ends. The unnecessary area 81a is formed in a substantially rectangular shape.

Next, FIGS. 32, 33 (b) and 34 (b)
As shown in FIG. 5, a plurality of pairs of upper electrode layers 82 containing silver as a main component are formed on the upper surface of a sheet-shaped insulating substrate 81 by a screen printing method, and fired with a firing profile at a peak temperature of 850 ° C. Layer 82 was a stable film.

Next, FIG. 32, FIG. 33 (c), FIG.
As shown in (c), a plurality of ruthenium oxide-based resistance layers 83 are formed by a screen printing method so as to straddle a plurality of pairs of upper electrode layers 82, and are fired by a firing profile having a peak temperature of 850 ° C. The resistance layer 83 was a stable film.

Next, as shown in FIGS. 33 (d) and 34 (d), a first protective layer 84 composed of a plurality of pre-coated glass layers is formed by a screen printing method so as to cover the plurality of resistance layers 83. The first protective layer 84 made of a pre-coated glass layer was formed into a stable film by forming and firing with a firing profile having a peak temperature of 600 ° C.

Next, as shown in FIGS. 33 (e) and 34 (e), in order to adjust the resistance value of the resistance layer 83 between the plural pairs of upper electrode layers 82 to a constant value, a laser trimming method is used. , And a plurality of trimming grooves 85 were formed.

Next, as shown in FIGS. 35 (a) and 36 (a), a screen printing method is used to cover the first protective layer 84 composed of a plurality of pre-coated glass layers arranged in the vertical direction on the drawing. A plurality of second protective layers 86 containing a resin as a main component were formed by using the method described above, and cured with a curing profile at a peak temperature of 200 ° C., whereby the second protective layers 86 were made into a stable film.

Next, FIG. 32, FIG. 35 (b), FIG.
As shown in (b), a plurality of pairs of upper electrode layers 82 are separated to form a plurality of strip-shaped substrates 81b except for an unnecessary region 81a formed at the entire peripheral edge of the sheet-shaped insulating substrate 81. A plurality of slit-shaped first division portions 87 for division are formed by a dicing method. In this case, the plurality of slit-shaped first divided portions 87 are formed at a pitch of 700 μm, and the width of the slit-shaped first divided portions 87 is 120 μm. The plurality of slit-shaped first divided portions 87 are formed by through holes penetrating the sheet-shaped insulating substrate 81 in the vertical direction. Further, the sheet-shaped insulating substrate 81 is provided with the unnecessary area portion 8.
Since the plurality of slit-shaped first divided portions 87 are formed by the dicing method except for the first slit portion 1a, even after the slit-shaped first divided portions 87 are formed, the plurality of strip-shaped substrates 81b are formed.
Is connected to the unnecessary area portion 81a, so that it is in a sheet state.

Next, as shown in FIGS. 35 (c) and 36 (c), nickel or nickel is formed on the entire back surface of the sheet-like insulating substrate 81 in which a plurality of slit-like first divided portions 87 are formed. Metal film 88 made of a base alloy by a sputtering method,
A plurality of pairs of side electrode layers 89 made of nickel or a nickel-based alloy are formed on the inner surface of the first slit portion 87 by a sputtering method, an electroless plating method, or the like. In this case, the side surface electrode layers 89 formed on the inner surfaces of the plurality of slit-shaped first divided portions 87 are in contact with and electrically connected to the upper surface electrode layers 82 formed on the upper surface of the sheet-shaped insulating substrate 81. Things.

Next, as shown in FIGS. 37A and 38A, a plurality of unnecessary portions of the metal film 88 formed on the entire back surface of the sheet-like insulating substrate 81 are removed by laser. A pair of back electrode layers 90 are formed.

Next, as shown in FIGS. 37 (b) and 38 (b), a plurality of pairs of exposed side electrode layers 89 and a part of a plurality of pairs of upper surface electrode layers 82 are exposed by electroplating. Are formed to form a plurality of pairs of nickel layers 91 of nickel of about 4 to 6 μm and a plurality of pairs of solder layers 92 of tin of about 4 to 6 μm in thickness. When the plurality of pairs of side electrode layers 89 are formed by a sputtering method, it is necessary to form the nickel layer 91 and the solder layer 92 because the thickness of the side electrode layers 89 is about 0.1 to 1 μm. However, when the plurality of pairs of side electrode layers 89 are formed by an electroless plating method, the thickness of the side electrode layers 89 is about 4 to
Since the thickness is 6 μm, only the solder layer 92 needs to be formed.

The solder layer 92 is made of tin. However, the present invention is not limited to this. For example, a tin alloy-based material may be used. It can be attached.

Since the upper electrode layer 82 is made of a silver-based material and the resistance layer 83 is made of a ruthenium oxide-based material, resistance characteristics excellent in heat resistance and durability can be secured. It is.

Further, the protective layer covering the resistance layer 83 and the like
A first protective layer 84 made of a pre-coated glass layer that covers the resistance layer 83, and a second protective layer 86 that mainly covers the trimming groove 85 and covers the trimming groove 85, while covering the first protective layer 84. The first protective layer 84
This prevents the occurrence of cracks at the time of laser trimming and reduces current noise, and also provides the second protective layer 86 containing the resin as a main component, so that the entire resistive layer 83 is covered with a resistance characteristic excellent in moisture resistance. It can be secured.

Finally, FIG. 32, FIG. 37 (c), FIG.
As shown in (c), a plurality of strip-shaped substrates 81b of the sheet-shaped insulating substrate 81 are formed except for an unnecessary area portion 81a formed at the entire periphery of the sheet-shaped insulating substrate 81.
The plurality of resistance layers 83 are individually separated from each other to form an individual substrate 81c.
A plurality of second divisions 93 are formed using a dicing method in a direction orthogonal to the slit-like first divisions 87 so as to be divided into a plurality of divisions. In this case, the plurality of second division units 93
Are formed at a pitch of 400 μm, and the width of the second divided portion 93 is 100 μm. Since the plurality of second divided portions 93 are formed on the plurality of strip-shaped substrates 81b by a dicing method except for the unnecessary region portion 81a, each time the plurality of second divided portions 93 are formed. The product that has been cut and divided into individual pieces of the substrate 81c and separated into individual pieces is separated from the unnecessary area portion 81a.

By the steps described above, the resistor according to the fourth embodiment of the present invention is manufactured.

In the length and width dimensions of the resistor manufactured by the above process, the interval between the slit-shaped first divided portion 87 and the second divided portion 93 formed by the dicing method is accurate (within ± 0.005 mm). ) And the thicknesses of the side electrode layer 89, the nickel layer 91 and the solder layer 92 are also accurate, so that the total length and width of the product resistor are exactly 0.6 mm long × 0.3 mm wide. Things. Also, the pattern accuracy of the upper electrode layer 82 and the resistance layer 83 does not need to be classified into dimensional ranks of the individual substrates, and it is not necessary to consider dimensional variations within the dimensional rank of the same individual substrate. The effective area of 83 can be made larger than that of the conventional product. That is, the resistance layer in the conventional product was about 0.20 mm in length × 0.19 mm in width, whereas Embodiment 4 of the present invention
The resistance layer 83 of the resistor in the above is about 0.25 mm in length × 0.24 mm in width, and the area is about 1.6 times or more.

The plurality of slit-shaped first divided portions 87
Further, since the plurality of second divided portions 93 are formed by using the dicing method, the sheet-shaped insulating substrate 81 which does not require the dimensional classification of the individual substrate can be used. It is not necessary to classify the size of the substrate, and thus it is possible to eliminate the complexity of the process for exchanging the mask as in the related art, and to easily perform dicing using a semiconductor or other general dicing equipment. Things.

The sheet-shaped insulating substrate 81 has an unnecessary area 81a which is not finally formed as a product at all peripheral edges, and has a plurality of slit-shaped first divided portions 87 and a plurality of second divided portions. Is not formed in the unnecessary area 81a, the plurality of strip-shaped substrates 81b are formed even after the plurality of slit-shaped first divided parts 87 are formed.
Is connected to the unnecessary region 81a, so that the sheet-shaped insulating substrate 81 is not finely divided into the plurality of strip-shaped substrates 81b. Therefore, the plurality of slit-shaped first divided portions 87 are formed. After this, the post-process can be performed in the state of the sheet-shaped insulating substrate 81 having the unnecessary region portion 81a, so that the design of the method can be simplified. When a plurality of second divisions 93 are formed, each time the plurality of second divisions 93 are formed, the individual substrates 8 are formed.
Since the product cut and divided into 1c and separated into individual pieces is separated from the unnecessary area portion 81a, the step of sorting the unnecessary area portion 81a and the product later becomes unnecessary.

Since the plurality of pairs of side electrode layers 89, the nickel layer 91, and the plurality of pairs of solder layers 92 are formed in the state of a sheet-like insulating substrate 81, the side-surface electrode layers 89 are formed in a sheet-like insulating layer. It can be formed at a necessary portion of the substrate 81, and the potential difference can be reduced when the nickel layer 91 and the solder layer 92 are formed by the electroplating method, whereby the stable nickel layer 91 and the solder layer 92 can be formed. Can be formed.

In the fourth embodiment of the present invention, the unnecessary region 81a which is not finally formed as a product is formed on the entire peripheral edge of the sheet-shaped insulating substrate 81 to form a substantially square shape. The unnecessary area portion 8 has been described.
1a is not necessarily formed at the entire peripheral edge of the sheet-shaped insulating substrate 81. For example, when an unnecessary area portion 81d is formed at one end of the sheet-shaped insulating substrate 81 as shown in FIG. As shown in FIG.
In the case where the unnecessary area portions 81e are formed at both end portions of FIG.
In the case where the unnecessary region 81f is formed at the three ends of the sheet-shaped insulating substrate 81 as shown in FIG. 19, the same operation and effect as those of the fourth embodiment of the present invention can be obtained.

In the fourth embodiment of the present invention, the case where the plurality of second divided portions 93 are formed by the dicing method has been described.
The plurality of second divisions 93 are divided into sheet-like insulating substrates 81.
The sheet-shaped insulating substrate 81 is formed by cutting any one of the upper surface side, the rear surface side, and the center portion of the sheet-shaped insulating substrate 81 by a laser method, a dicing method, or the like, leaving a thin portion on any of the back surface side, the upper surface side, and the center portion. In these cases, the pieces are not divided into pieces each time the second divided portion 93 is formed, but are divided into pieces in two stages.

In the fourth embodiment of the present invention, a silver-based material is used for the upper electrode layer 82 and a ruthenium oxide-based material is used for the resistance layer 83, but these materials may be used in other material systems. An effect similar to that of the fourth embodiment can be obtained.

In the fourth embodiment of the present invention, the slit-shaped first divided portion 87 and the second divided portion 93 are formed by using the dicing method. Even when the slit-shaped first divided portion 87 and the second divided portion 93 are formed by using a dividing means such as a laser or a water jet, the same operation as in the fourth embodiment of the present invention described above. It is effective.

Further, in the fourth embodiment of the present invention, when a plurality of slit-shaped first divisions 87 for dividing into a plurality of strip-shaped substrates 81b are formed, a plurality of pairs of upper surface electrode layers 82, a plurality of Resistance layer 83, a plurality of first protection layers 84, a plurality of trimming grooves 85, a plurality of second protection layers 8
Although a plurality of slit-shaped first divided portions 87 are formed on the sheet-shaped insulating substrate 81 on which 6 is formed, the present invention is not limited to this.
In addition, when a plurality of slit-shaped first divided portions 87 are first formed on the sheet-shaped insulating substrate 81, a plurality of slit-shaped first divided portions 87 are previously formed in the sheet-shaped insulating substrate 81. When the substrate 81 is used, a plurality of pairs of upper electrode layers 82 are formed on the sheet-shaped insulating substrate 81, and then a plurality of slit-shaped first divided portions 87 are formed on the sheet-shaped insulating substrate 81. In this case, after the plurality of resistance layers 83 are formed on the sheet-shaped insulating substrate 81, the slit-shaped first divided portions 87 are formed on the sheet-shaped insulating substrate 81.
Is formed, a sheet-like insulating substrate 8 is formed.
A plurality of pairs of upper electrode layers 82 are formed on one of the plurality of upper electrode layers 82 and a plurality of resistance layers 8
In the case where a plurality of slit-shaped first divided portions 87 are formed on the sheet-shaped insulating substrate 81 after the formation of the third, a plurality of resistance layers 83 are formed on the sheet-shaped insulating substrate 81 and When a plurality of pairs of upper surface electrode layers 82 are formed so as to partially overlap the plurality of resistance layers 83, and then a plurality of slit-shaped first divided portions 87 are formed on the sheet-shaped insulating substrate 81, A plurality of pairs of upper electrode layers 82 and a plurality of resistance layers 83 are formed on a sheet-shaped insulating substrate 81, and the plurality of pairs of upper electrode layers 8 in the plurality of resistance layers 83 are formed.
After trimming to adjust the resistance between the two,
Even when the slit-shaped first divided portion 87 is formed on the sheet-shaped insulating substrate 81, the same effect as that of the fourth embodiment of the present invention can be obtained.

[0187]

As described above, in the resistor according to the present invention, the sheet-shaped insulating substrate is divided by the slit-shaped first divided portion and the second divided portion orthogonal to the first divided portion. The individual substrate thus singulated, a pair of upper electrode layers formed on the upper surface of the individual substrate, and a resistance layer formed so as to partially overlap the pair of upper electrode layers A protective layer formed to cover the resistance layer, and a pair of side electrode layers formed by nickel-based electrodes formed on the side surfaces of the individual substrate so as to be electrically connected to the pair of upper electrode layers. And a pair of solder layers that cover the pair of side electrode layers. According to this configuration, the sheet-like insulating substrate is orthogonal to the slit-shaped first divided portion and the first divided portion. Using a singulated substrate that has been singulated by being divided by a second divisional part Therefore, it is not necessary to classify the size of the individual substrates, which eliminates the process of replacing the mask according to the size rank of the individual substrates, as well as being inexpensive and miniaturizing. It has an excellent effect that a simple resistor can be provided.

[Brief description of the drawings]

FIG. 1 is a sectional view of a resistor according to a first embodiment of the present invention.

FIG. 2 is a top view showing a state in which an unnecessary region is formed on the entire peripheral edge of a sheet-like insulating substrate used in manufacturing the resistor.

3 (a) to 3 (e) are cross-sectional views showing steps of manufacturing the resistor.

4A to 4E are plan views showing manufacturing steps of the resistor.

5 (a) to 5 (d) are cross-sectional views showing steps of manufacturing the resistor.

FIGS. 6A to 6D are plan views showing manufacturing steps of the resistor.

FIGS. 7A to 7C are cross-sectional views showing manufacturing steps of the resistor.

8A to 8C are plan views showing manufacturing steps of the resistor.

FIG. 9 is a top view showing a state in which an unnecessary region is formed at one end of a sheet-shaped insulating substrate used in manufacturing the resistor.

FIG. 10 is a top view showing a state where unnecessary regions are formed at both ends of a sheet-shaped insulating substrate used in manufacturing the resistor.

FIG. 11 is a top view showing a state in which unnecessary regions are formed at three ends of a sheet-shaped insulating substrate used in manufacturing the resistor.

FIG. 12 is a top view showing a state in which an unnecessary region is formed on the entire peripheral edge of a sheet-shaped insulating substrate used in manufacturing the resistor according to the second embodiment of the present invention;

13 (a) to 13 (e) are cross-sectional views showing steps of manufacturing the same resistor.

14A to 14E are plan views showing manufacturing steps of the resistor.

15 (a) to 15 (d) are cross-sectional views showing steps of manufacturing the same resistor.

16A to 16D are plan views showing manufacturing steps of the resistor.

17A to 17C are cross-sectional views illustrating steps of manufacturing the resistor.

18A to 18C are plan views showing manufacturing steps of the resistor.

FIG. 19 is a top view showing a state in which an unnecessary region is formed at one end of a sheet-shaped insulating substrate used in manufacturing the resistor.

FIG. 20 is a top view showing a state where unnecessary regions are formed at both ends of a sheet-shaped insulating substrate used in manufacturing the resistor.

FIG. 21 is a top view showing a state where unnecessary regions are formed at three ends of a sheet-shaped insulating substrate used in manufacturing the resistor.

FIG. 22 is a top view showing a state in which an unnecessary region is formed on the entire periphery of a sheet-shaped insulating substrate used in manufacturing the resistor according to the third embodiment of the present invention;

23 (a) to 23 (e) are cross-sectional views showing steps of manufacturing the same resistor.

24A to 24E are plan views showing manufacturing steps of the resistor.

25 (a) to 25 (d) are cross-sectional views showing steps of manufacturing the same resistor.

26A to 26D are plan views showing manufacturing steps of the resistor.

27 (a) to 27 (c) are cross-sectional views showing steps of manufacturing the same resistor.

FIGS. 28A to 28C are plan views showing manufacturing steps of the resistor.

FIG. 29 is a top view showing a state in which an unnecessary region is formed at one end of a sheet-shaped insulating substrate used in manufacturing the resistor.

FIG. 30 is a top view showing a state in which unnecessary regions are formed at both ends of a sheet-shaped insulating substrate used in manufacturing the resistor.

FIG. 31 is a top view showing a state where unnecessary regions are formed at three ends of a sheet-shaped insulating substrate used in manufacturing the resistor.

FIG. 32 is a top view showing a state in which an unnecessary region is formed on the entire periphery of a sheet-shaped insulating substrate used in manufacturing the resistor according to the fourth embodiment of the present invention;

33 (a) to 33 (e) are cross-sectional views showing steps of manufacturing the same resistor.

34 (a) to (e) are plan views showing steps of manufacturing the same resistor.

FIGS. 35A to 35C are cross-sectional views illustrating steps of manufacturing the same resistor.

36 (a) to (c) are plan views showing steps of manufacturing the same resistor.

FIGS. 37A to 37C are cross-sectional views showing steps of manufacturing the resistor.

38 (a) to 38 (c) are plan views showing steps of manufacturing the same resistor.

FIG. 39 is a top view showing a state in which an unnecessary region is formed at one end of a sheet-shaped insulating substrate used in manufacturing the resistor.

FIG. 40 is a top view showing a state where unnecessary regions are formed at both ends of a sheet-shaped insulating substrate used in manufacturing the resistor.

FIG. 41 is a top view showing a state where unnecessary regions are formed at three ends of a sheet-shaped insulating substrate used in manufacturing the resistor.

FIG. 42 is a sectional view of a conventional resistor.

43 (a) to 43 (f) are perspective views showing steps of manufacturing a conventional resistor.

[Explanation of symbols]

11 Single substrate 12, 22, 42, 62, 82 Upper electrode layer 13, 23, 43, 63, 83 Resistive layer 14, 24, 44, 64, 84 First protective layer 15, 25, 45, 65, 85 Trimming groove 16, 26, 46, 66, 86 Second protective layer 17, 30, 49, 70, 89 Side electrode layer 18, 31, 51, 72, 92 Solder layer 21, 41, 61, 81 Sheet-like Insulating substrate 21a, 21d to 21f, 41a, 41d to 41f, 6
1a, 61d to 61f, 81a, 81d to 81f Unnecessary area portions 21b, 41b, 61b, 81b Strip-shaped substrates 21c, 41c, 61c, 81c Individual substrates 27 First resist layer 28 Second resist layer 29, 48, 67 , 87 Slit-shaped first divisions 32, 52, 73, 93 Second divisions 47 Resist layer 68 Mask 88 Metal film

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Akio Fukuoka 1006 Kazuma Kadoma, Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Inventor Hiroyuki Saikawa 1006 Kadoma, Kadoma, Osaka Prefecture F-term in Matsushita Electric Industrial Co., Ltd. (Reference)

Claims (48)

[Claims] 1. A sheet-like insulating substrate is formed into a slit-like first substrate.
And a singulated substrate that is divided into individual pieces by being divided by a second divided section that is orthogonal to the first divided section;
A pair of upper electrode layers formed on the upper surface of the individual substrate, a resistance layer formed so as to partially overlap the pair of upper electrode layers, and a protection layer formed to cover the resistance layer A pair of side electrode layers formed of nickel-based electrodes formed on side surfaces of the individual substrate so as to be electrically connected to the pair of upper surface electrode layers, and a pair of solders covering the pair of side electrode layers Resistors with layers. 2. A sheet-like insulating substrate is formed by a slit-like first substrate.
And a singulated substrate that is divided into individual pieces by being divided by a second divided section that is orthogonal to the first divided section;
A resistance layer formed on the upper surface of the individual substrate, a pair of upper electrode layers formed to partially overlap the resistance layer, and a protection layer formed to cover the resistance layer; A pair of side electrode layers formed of nickel-based electrodes formed on the side surfaces of the individual substrate so as to be electrically connected to the pair of upper surface electrode layers, and a pair of solder layers covering the pair of side electrode layers. Equipped resistor. 3. The thickness of the pair of side electrode layers is 1 to 15 μm.
3. The resistor according to claim 1, wherein said resistor has a thickness of: 4. The resistor according to claim 1, wherein the pair of solder layers is made of a tin or tin alloy-based material. 5. The resistor according to claim 1, wherein the pair of upper electrode layers are formed of a silver-based material, and the resistance layer is formed of a ruthenium oxide-based material. 6. The protection layer according to claim 1, wherein the first protection layer is made of a glass layer covering the resistance layer, and the second protection layer is mainly made of a resin and covers the first protection layer. 2. The resistor according to 2. 7. A step of forming a plurality of pairs of upper electrode layers on an upper surface of a sheet-shaped insulating substrate; a step of forming a plurality of resistance layers so as to partially overlap the plurality of pairs of upper electrode layers; A step of performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in a plurality of resistance layers; a step of forming a plurality of protective layers so as to cover at least the plurality of resistance layers; Forming a plurality of slit-shaped first divided portions for dividing the insulating substrate into a plurality of strip-shaped substrates; and forming a plurality of slit-shaped first divided portions on the sheet-shaped insulating substrate. Forming a plurality of pairs of side electrode layers on the inner surface of the plurality of slit-shaped first divided portions; forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; On insulating substrate A plurality of second divided portions are formed on a plurality of strip-shaped substrates in a direction orthogonal to the slit-shaped first divided portions so that the plurality of resistive layers are individually separated and divided into individual substrates. Forming a resistor. 8. A step of forming a plurality of resistance layers on an upper surface of a sheet-shaped insulating substrate; a step of forming a plurality of pairs of upper electrode layers so as to partially overlap the plurality of resistance layers; A step of performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the resistive layer, a step of forming a plurality of protective layers so as to cover at least the plurality of resistive layers, and the sheet-shaped insulating substrate Forming a plurality of slit-shaped first divided portions for dividing the substrate into a plurality of strip-shaped substrates; and forming the plurality of slit-shaped first divided portions on the sheet-shaped insulating substrate in a state where the plurality of slit-shaped first divided portions are formed. Forming a plurality of pairs of side electrode layers on the inner surface of the slit-shaped first divided portion; forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; Multiple shorts on insulating substrate A plurality of second divisions are formed on the book substrate in a direction orthogonal to the slit-shaped first divisions such that the plurality of resistance layers are individually separated and divided into individual substrates. And a method of manufacturing a resistor. 9. A step of forming a plurality of pairs of upper surface electrode layers on an upper surface, a step of forming a plurality of resistance layers so as to partially overlap the plurality of pairs of upper electrode layers, and The step of performing trimming to adjust the resistance value between a plurality of pairs of upper electrode layers, and the step of forming a plurality of protective layers so as to cover at least the plurality of resistance layers, the sheet-shaped insulating substrate, A state in which a plurality of slit-shaped first divided portions are formed to separate a plurality of pairs of upper electrode layers and divide the plurality of strip-shaped substrates into a plurality of strip-shaped substrates, and thereafter, a plurality of slit-shaped first divided portions are formed. A plurality of pairs of side electrode layers are formed on the inner surface of the plurality of slit-shaped first divided portions by applying nickel plating to the sheet-shaped insulating substrate by electroless plating. Multiple pairs to cover After that, the slit-shaped first substrate is formed on a plurality of strip-shaped substrates in the sheet-shaped insulating substrate such that the plurality of resistance layers are individually separated and divided into individual substrates. A method for manufacturing a resistor, wherein a plurality of second divided portions are formed in a direction orthogonal to the divided portions. 10. A step of forming a plurality of resistance layers on an upper surface, a step of forming a plurality of pairs of upper electrode layers so as to partially overlap the plurality of resistance layers, and a step of forming the plurality of resistance layers in the plurality of resistance layers. The step of performing trimming to adjust the resistance value between the upper electrode layers of the above, and the step of forming a plurality of protective layers so as to cover at least the plurality of resistive layers, the sheet-like insulating substrate, Slit-shaped first electrode for separating the upper electrode layer of
Are formed, and then the slit-shaped first portion is formed.
A plurality of pairs of side surface electrode layers are formed on the inner surface of the plurality of slit-shaped first divided portions by applying nickel plating to the sheet-shaped insulating substrate in a state where a plurality of divided portions are formed by electroless plating. Thereafter, a plurality of pairs of solder layers are formed so as to cover the plurality of pairs of side electrode layers, and then, the plurality of resistive layers are individually separated on a plurality of strip-shaped substrates in the sheet-shaped insulating substrate. A method for manufacturing a resistor, wherein a plurality of second divided portions are formed in a direction orthogonal to the slit-shaped first divided portions so as to be divided into one-piece substrates. 11. A step of forming a plurality of pairs of upper electrode layers and a plurality of resistance layers on an upper surface of a sheet-shaped insulating substrate so that both are electrically connected to each other; A step of performing trimming to adjust the resistance value between the upper electrode layers, a step of forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and forming a resist layer on the back surface of the sheet-shaped insulating substrate And a slit-shaped first substrate for separating the plurality of pairs of upper electrode layers into a plurality of strip-shaped substrates on the sheet-shaped insulating substrate.
Forming a plurality of divided portions, and forming the slit-shaped first portion.
Forming a side electrode layer of nickel or a nickel-based alloy by a sputtering method on the back surface of the sheet-like insulating substrate in a state where a plurality of divided portions are formed and on the inner surface of the plurality of slit-shaped first divided portions; Removing a resist layer and patterning a plurality of pairs of side electrode layers; forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; and forming a plurality of strips on the sheet-shaped insulating substrate. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so that the plurality of resistive layers are individually separated and divided into individual substrates on the substrate A method for manufacturing a resistor comprising: 12. A step of forming a plurality of pairs of upper electrode layers and a plurality of resistance layers on an upper surface so that they are electrically connected to each other, and a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers. Performing trimming to adjust the
Forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and separating the plurality of pairs of upper electrode layers into a plurality of strip-shaped substrates on a sheet-shaped insulating substrate. Forming a plurality of slit-shaped first divided portions;
Thereafter, a mask is placed on the back surface of the sheet-shaped insulating substrate in a state where a plurality of the slit-shaped first divided portions are formed,
With this mask installed, a plurality of pairs of side electrode layers made of nickel or a nickel-based alloy are formed on the back surface of the insulating substrate and the inner surfaces of the plurality of slit-shaped first divided portions by a sputtering method. A plurality of pairs of solder layers are formed so as to cover the side electrode layer, and then, on the plurality of strip-shaped substrates in the sheet-shaped insulating substrate, the plurality of resistance layers are individually separated and divided into individual-piece substrates. As described above, a method of manufacturing a resistor in which a plurality of second divided portions are formed in a direction orthogonal to the slit-shaped first divided portion. 13. A step of forming a plurality of pairs of upper electrode layers and a plurality of resistance layers on an upper surface so that they are electrically connected to each other, and a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers. Performing trimming to adjust the
Forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and separating the plurality of pairs of upper electrode layers into a plurality of strip-shaped substrates on a sheet-shaped insulating substrate. Forming a plurality of slit-shaped first divided portions;
Thereafter, a metal film made of nickel or a nickel-based alloy is formed on the entire back surface of the sheet-shaped insulating substrate having the plurality of slit-shaped first divided portions formed thereon, and the plurality of slit-shaped first divided portions are formed. A plurality of pairs of side electrode layers made of nickel or a nickel-based alloy are formed on the inner surface of the portion, and thereafter, unnecessary portions of the metal film formed on the entire back surface of the sheet-shaped insulating substrate are removed by laser to form a plurality of pairs. A back electrode layer is formed, and thereafter, a plurality of pairs of solder layers are formed so as to cover a plurality of pairs of side electrode layers. Thereafter, the plurality of resistance layers are formed on a plurality of strip-shaped substrates in the sheet-shaped insulating substrate. A method of manufacturing a resistor, wherein a plurality of second divided portions are formed in a direction orthogonal to the slit-shaped first divided portions so as to be separated into individual pieces and divided into individual substrates. 14. A slit-shaped first substrate for dividing the insulating substrate into a plurality of strip-shaped substrates on a sheet-shaped insulating substrate.
Forming a plurality of divided portions, forming a plurality of pairs of upper surface electrode layers on an upper surface of a sheet-shaped insulating substrate having a plurality of the first divided portions formed thereon, and partially forming the plurality of pairs of upper surface electrode layers. Forming a plurality of resistive layers such that the resistive layers overlap, trimming to adjust the resistance value between the plurality of pairs of upper electrode layers in the plurality of resistive layers, and covering at least the plurality of resistive layers. Forming a plurality of protective layers, and applying a nickel plating to the sheet-like insulating substrate in a state where the plurality of slit-like first divided portions are formed by an electroless plating method. Forming a plurality of pairs of side electrode layers on the inner surface of the first divided portion; forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; Strip base Forming a plurality of second divisions in a direction orthogonal to the slit-shaped first divisions so that the plurality of resistance layers are individually separated and divided into individual substrates. Method for manufacturing a resistor provided. 15. A slit-shaped first substrate for dividing the insulating substrate into a plurality of strip-shaped substrates on a sheet-shaped insulating substrate.
Forming a plurality of divided portions, forming a plurality of resistive layers on an upper surface of a sheet-shaped insulating substrate having the plurality of first divided portions formed thereon, and partially overlapping the plurality of resistive layers. A step of forming a plurality of pairs of upper electrode layers; a step of performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers; and a plurality of steps to cover at least the plurality of resistance layers. Forming a plurality of first slit-shaped portions by applying nickel plating to the sheet-shaped insulating substrate having the plurality of slit-shaped first divided portions formed thereon by an electroless plating method. Forming a plurality of pairs of side electrode layers on the inner surface of the divided portion;
Forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; and forming a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, wherein the plurality of resistance layers are individually separated into individual pieces. The slit-shaped first is divided into substrates.
Forming a plurality of second divided portions in a direction orthogonal to the divided portions. 16. A slit-shaped first substrate for dividing the insulating substrate into a plurality of strip-shaped substrates on a sheet-shaped insulating substrate.
Forming a plurality of divided portions, and forming a plurality of pairs of upper electrode layers and a plurality of resistance layers on the upper surface of the sheet-shaped insulating substrate having the plurality of first divided portions formed thereon so that both are electrically connected to each other. Forming, trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers, and forming a plurality of protective layers so as to cover at least the plurality of resistance layers. Forming a resist layer on the back surface of the sheet-shaped insulating substrate; and forming the plurality of slit-shaped first divided portions on the back surface of the sheet-shaped insulating substrate and the plurality of slit-shaped first divided portions. Forming a side electrode layer of nickel or a nickel-based alloy on the inner surface of the divided portion by a sputtering method, removing the resist layer and patterning a plurality of pairs of side electrode layers, Forming a plurality of pairs of solder layers so as to cover the surface electrode layer; and forming a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, wherein the plurality of resistance layers are individually separated and divided into individual-piece substrates. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions as described above. 17. A slit-shaped first substrate for dividing the insulating substrate into a plurality of strip-shaped substrates on a sheet-shaped insulating substrate.
Forming a plurality of divided portions, and forming a plurality of pairs of upper electrode layers and a plurality of resistance layers on the upper surface of the sheet-shaped insulating substrate having the plurality of first divided portions formed thereon so that both are electrically connected to each other. Forming, trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers, and forming a plurality of protective layers so as to cover at least the plurality of resistance layers. Installing a mask on the back surface of the sheet-shaped insulating substrate; and providing a plurality of slit-shaped first divided portions on the back surface of the sheet-shaped insulating substrate and a plurality of slit-shaped first divided portions formed with the mask installed. Forming a plurality of pairs of side electrode layers made of nickel or a nickel-based alloy on the inner surface of the slit-shaped first divided portion by a sputtering method; and forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers. Forming a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, the plurality of resistive layers are individually separated, and the slit-shaped first divided portions are divided into individual substrates. A plurality of second
Forming a divided part of the resistor. 18. A slit-shaped first substrate for dividing the insulating substrate into a plurality of strip-shaped substrates on a sheet-shaped insulating substrate.
Forming a plurality of divided portions, and forming a plurality of pairs of upper electrode layers and a plurality of resistance layers on the upper surface of the sheet-shaped insulating substrate having the plurality of first divided portions formed thereon so that both are electrically connected to each other. Forming, trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers, and forming a plurality of protective layers so as to cover at least the plurality of resistance layers. And the slit-shaped first
A metal film made of nickel or a nickel-based alloy is formed on the entire back surface of the sheet-shaped insulating substrate having a plurality of divided portions formed thereon, and a nickel or nickel-based metal is formed on the inner surface of the plurality of slit-shaped first divided portions. A step of forming a plurality of pairs of side electrode layers made of an alloy, and a step of forming a plurality of pairs of back electrode layers by removing unnecessary portions of the metal film formed on the back surface of the sheet-shaped insulating substrate with a laser; Forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; and forming a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, wherein the plurality of resistance layers are individually separated into individual pieces. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so as to be divided into substrates. 19. A step of forming a plurality of pairs of upper surface electrode layers on an upper surface of a sheet-shaped insulating substrate in which a plurality of slit-shaped first divided portions for dividing into a plurality of strip-shaped substrates are formed in advance; A step of forming a plurality of resistance layers so as to partially overlap the pair of upper electrode layers, and a step of performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers, Forming a plurality of protective layers so as to cover the plurality of resistance layers, and applying nickel plating to the sheet-like insulating substrate having the plurality of slit-like first divided portions formed thereon by an electroless plating method. A step of forming a plurality of pairs of side electrode layers on the inner surface of the plurality of slit-shaped first divided portions, and a step of forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers, The sheet In a plurality of strip-shaped substrates in the shape of an insulating substrate, the plurality of resistive layers are individually separated and divided into a plurality of individual substrates in a direction orthogonal to the slit-shaped first divided portion. Forming a second divided portion. 20. A step of forming a plurality of resistive layers on an upper surface of a sheet-like insulating substrate in which a plurality of slit-like first divisions for dividing into a plurality of strip-like substrates are formed in advance; A step of forming a plurality of pairs of upper electrode layers so as to partially overlap with a layer; a step of performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers; Forming a plurality of protective layers so as to cover the resistive layer, and applying nickel plating by an electroless plating method to the sheet-like insulating substrate in which the plurality of slit-like first divisions are formed. Forming a plurality of pairs of side electrode layers on the inner surface of the plurality of slit-shaped first divided portions; forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; Statelessness In a plurality of strip-shaped substrates in the edge substrate, a plurality of second layers are arranged in a direction orthogonal to the slit-shaped first divided portion so that the plurality of resistance layers are individually separated and divided into individual pieces. Forming a divided portion. 21. A plurality of pairs of upper electrode layers and a plurality of resistive layers are formed on the upper surface of a sheet-shaped insulating substrate in which a plurality of slit-shaped first divided portions for dividing into a plurality of strip-shaped substrates are formed in advance. A step of forming so as to be electrically connected, and a step of performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers,
A step of forming a plurality of protective layers so as to cover at least the plurality of resistance layers; a step of forming a resist layer on the back surface of the sheet-shaped insulating substrate; and a plurality of the slit-shaped first divided portions are formed. Forming a side electrode layer made of nickel or a nickel-based alloy by a sputtering method on the back surface of the sheet-shaped insulating substrate in a folded state and on the inner surface of the plurality of slit-shaped first divided portions; Patterning a pair of side electrode layers, forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers, and forming a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, Forming a plurality of second divisions in a direction orthogonal to the slit-shaped first divisions so that the resistance layers are individually separated and divided into individual substrates. Production method. 22. A plurality of pairs of upper electrode layers and a plurality of resistive layers are formed on the upper surface of a sheet-shaped insulating substrate in which a plurality of slit-shaped first divided portions for dividing into a plurality of strip-shaped substrates are formed in advance. A step of forming so as to be electrically connected, and a step of performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers,
A step of forming a plurality of protective layers so as to cover at least the plurality of resistive layers; a step of installing a mask on the back surface of the sheet-shaped insulating substrate; A back surface of a sheet-shaped insulating substrate in which a plurality of divided portions are formed and a plurality of slit-shaped first substrates.
Forming a plurality of pairs of side electrode layers made of nickel or a nickel-based alloy on the inner surface of the divided portion by a sputtering method, and forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; In a plurality of strip-shaped substrates in a sheet-shaped insulating substrate, a plurality of the resistive layers are individually separated and divided in a direction orthogonal to the slit-shaped first divided portion so as to be divided into individual substrates. Forming a second divided portion. 23. A plurality of pairs of upper electrode layers and a plurality of resistance layers are formed on the upper surface of a sheet-like insulating substrate in which a plurality of slit-like first divisions for dividing into a plurality of strip-like substrates are formed in advance. A step of forming so as to be electrically connected, and a step of performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers,
Forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and forming nickel or a nickel-based alloy on the entire back surface of the sheet-shaped insulating substrate in which the plurality of slit-shaped first divided portions are formed. Forming a plurality of pairs of side electrode layers made of nickel or a nickel-based alloy on the inner surface of the plurality of slit-shaped first divided portions, and forming the metal film on the back surface of the sheet-shaped insulating substrate. Forming a plurality of pairs of back electrode layers by removing unnecessary portions of the formed metal film with a laser, and forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; and In a plurality of strip-shaped substrates in the shape of an insulating substrate, in a direction orthogonal to the slit-shaped first divided portion such that the plurality of resistance layers are individually separated and divided into individual substrates. Method for producing a resistor and forming a second split portion of the number. 24. A step of forming a plurality of pairs of upper surface electrode layers on the upper surface of a sheet-like insulating substrate, and forming the plurality of pairs of upper surface electrode layers on the sheet-like insulating substrate. Forming a plurality of slit-shaped first divided portions for dividing the substrate, forming a plurality of resistive layers such that the plurality of resistive layers partially overlap the plurality of pairs of upper electrode layers, and forming the plurality of resistive layers Performing trimming to adjust a resistance value between the plurality of pairs of upper surface electrode layers in the above, forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and performing the slit-shaped first division. Forming a plurality of pairs of side electrode layers on the inner surface of the plurality of slit-shaped first divided portions by applying nickel plating to the sheet-shaped insulating substrate in a state where a plurality of portions are formed by electroless plating. , The plurality of pairs A step of forming a plurality of pairs of solder layers so as to cover the side electrode layers, and a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, wherein the plurality of resistance layers are individually separated and divided into individual substrates. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions as described above. 25. A step of forming a plurality of resistive layers on an upper surface of a sheet-like insulating substrate, and dividing the insulating substrate into a plurality of strip-like substrates into a sheet-like insulating substrate on which the plurality of resistive layers are formed. Forming a plurality of slit-shaped first divisions for forming a plurality of pairs of upper electrode layers so as to partially overlap the plurality of resistance layers; and forming the plurality of pairs of upper electrode layers in the plurality of resistance layers. Performing trimming to adjust the resistance value between the upper electrode layers, forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and forming a plurality of the slit-shaped first divided portions. Forming a plurality of pairs of side electrode layers on the inner surface of the plurality of slit-shaped first divided portions by applying nickel plating to the sheet-shaped insulating substrate in a state of being subjected to electroless plating, and Side electrode layer Forming a plurality of pairs of solder layers so as to cover the plurality of strip-shaped substrates in the sheet-shaped insulating substrate, wherein the plurality of resistance layers are individually separated and divided into individual pieces. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions. 26. A step of forming a plurality of pairs of upper surface electrode layers on an upper surface of a sheet-like insulating substrate, and forming the plurality of pairs of upper surface electrode layers on the sheet-like insulating substrate by forming the plurality of strips into a plurality of strips. Forming a plurality of slit-shaped first divided portions for dividing the substrate, forming a plurality of resistive layers such that the plurality of resistive layers partially overlap the plurality of pairs of upper electrode layers, and forming the plurality of resistive layers Performing trimming to adjust the resistance value between the plurality of pairs of upper electrode layers, forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and a back surface of the sheet-shaped insulating substrate. Forming a resist layer on the back surface of the sheet-shaped insulating substrate having the plurality of slit-shaped first divided portions formed thereon and nickel on the inner surface of the plurality of slit-shaped first divided portions by a sputtering method. Or A step of forming a side electrode layer of a nickel-based alloy, a step of stripping the resist layer and patterning a plurality of pairs of side electrode layers, and forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers And orthogonally intersecting with the slit-shaped first divided portion such that the plurality of resistive layers are individually separated into a plurality of strip-shaped substrates in the sheet-shaped insulating substrate and divided into individual substrates. Forming a plurality of second divided portions in the direction in which the resistors are formed. 27. A step of forming a plurality of pairs of upper surface electrode layers on an upper surface of a sheet-like insulating substrate, and forming the plurality of pairs of upper surface electrode layers on the sheet-like insulating substrate by forming the plurality of strips into a plurality of strips. Forming a plurality of slit-shaped first divided portions for dividing the substrate, forming a plurality of resistive layers such that the plurality of resistive layers partially overlap the plurality of pairs of upper electrode layers, and forming the plurality of resistive layers Performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers, forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and a back surface of the sheet-shaped insulating substrate. Installing a mask on the back surface of the sheet-shaped insulating substrate and a plurality of slit-shaped first divided portions in a state where a plurality of the slit-shaped first divided portions are formed with the mask installed. Sputtering on inner surface Forming a plurality of pairs of side electrode layers of nickel or a nickel-based alloy by a method; forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions on the strip-shaped substrate so that the plurality of resistive layers are individually separated and divided into individual substrates. And a method of manufacturing the resistor. 28. A step of forming a plurality of pairs of upper electrode layers on an upper surface of a sheet-like insulating substrate, and forming the plurality of pairs of upper electrode layers on the sheet-like insulating substrate by forming the plurality of pairs of upper electrode layers on a sheet-like insulating substrate. Forming a plurality of slit-shaped first divided portions for dividing the substrate, forming a plurality of resistive layers such that the plurality of resistive layers partially overlap the plurality of pairs of upper electrode layers, and forming the plurality of resistive layers Performing trimming to adjust a resistance value between the plurality of pairs of upper surface electrode layers in the above, forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and performing the slit-shaped first division. While forming a metal film of nickel or a nickel-based alloy on the entire back surface of the sheet-shaped insulating substrate in a state where a plurality of parts are formed,
Forming a plurality of pairs of side electrode layers made of nickel or a nickel-based alloy on inner surfaces of the plurality of slit-shaped first divided portions, and removing unnecessary portions of a metal film formed on a back surface of the sheet-shaped insulating substrate. Forming a plurality of pairs of back electrode layers by removing with a laser, forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers, and forming a plurality of strips in the sheet-shaped insulating substrate. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so that the plurality of resistive layers are individually separated and divided into individual substrates on the substrate A method for manufacturing a resistor comprising: 29. A step of forming a plurality of pairs of upper electrode layers on an upper surface of a sheet-shaped insulating substrate; and forming a plurality of resistance layers so as to partially overlap the plurality of pairs of upper electrode layers.
A step of forming a plurality of slit-shaped first divided portions for dividing the insulating substrate into a plurality of strip-shaped substrates on the sheet-shaped insulating substrate on which the plurality of resistance layers are formed; A step of performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers, a step of forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and the slit-shaped first divided portion Forming a plurality of pairs of side electrode layers on the inner surface of the plurality of slit-shaped first divided portions by applying nickel plating to the sheet-shaped insulating substrate in a state where a plurality of the formed first portions are formed by electroless plating.
Forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; and forming a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, wherein the plurality of resistance layers are individually separated into individual pieces. The slit-shaped first is divided into substrates.
Forming a plurality of second divided portions in a direction orthogonal to the divided portions. 30. A step of forming a plurality of resistance layers on an upper surface of a sheet-shaped insulating substrate; a step of forming a plurality of pairs of upper electrode layers so as to partially overlap the plurality of resistance layers; Forming a plurality of slit-shaped first divided portions for dividing the insulating substrate into a plurality of strip-shaped substrates on a sheet-shaped insulating substrate on which a resistance layer and a plurality of pairs of upper electrode layers are formed; Performing trimming to adjust the resistance value between the plurality of pairs of upper electrode layers in the resistive layer, forming a plurality of protective layers so as to cover at least the plurality of resistive layers, A plurality of pairs of side electrode layers are formed on the inner surfaces of the plurality of slit-shaped first divided portions by applying nickel plating to the sheet-shaped insulating substrate having a plurality of the divided portions formed thereon by an electroless plating method. The process of Forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; and forming a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, wherein the plurality of resistance layers are individually separated into individual pieces. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so as to be divided into substrates. 31. The insulating substrate is divided into a plurality of strip-shaped substrates on a sheet-shaped insulating substrate having a plurality of pairs of upper electrode layers and a plurality of resistance layers formed on the upper surface so that both are electrically connected to each other. Forming a plurality of slit-shaped first divided portions for performing a trimming process to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers, and at least the plurality of resistance layers Forming a plurality of protective layers so as to cover the substrate; forming a resist layer on the back surface of the sheet-shaped insulating substrate;
Forming a side electrode layer of nickel or a nickel-based alloy by a sputtering method on the back surface of the sheet-like insulating substrate in a state where a plurality of divided portions are formed and on the inner surface of the plurality of slit-shaped first divided portions; Removing a resist layer and patterning a plurality of pairs of side electrode layers; forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; and forming a plurality of strips on the sheet-shaped insulating substrate. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so that the plurality of resistive layers are individually separated and divided into individual substrates on the substrate A method for manufacturing a resistor comprising: 32. The insulating substrate is divided into a plurality of strip-shaped substrates on a sheet-shaped insulating substrate in which a plurality of pairs of upper electrode layers and a plurality of resistance layers are formed on the upper surface so as to be electrically connected to each other. Forming a plurality of slit-shaped first divided portions for performing a trimming process to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers, and at least the plurality of resistance layers Forming a plurality of protective layers so as to cover the substrate, installing a mask on the back surface of the sheet-shaped insulating substrate, and forming the plurality of slit-shaped first divided portions with the mask installed. Forming a plurality of pairs of side electrode layers made of nickel or a nickel-based alloy on the back surface of the sheet-shaped insulating substrate in a folded state and on the inner surfaces of the plurality of slit-shaped first divided portions by a sputtering method; Forming a plurality of pairs of solder layers so as to cover the side electrode layers, and dividing the plurality of resistive layers into a plurality of strip-shaped substrates in the sheet-shaped insulating substrate into individual pieces. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions. 33. A sheet-like insulating substrate having a plurality of pairs of upper electrode layers and a plurality of resistive layers formed on the upper surface so as to be electrically connected to each other, the insulating substrate is divided into a plurality of strip-shaped substrates. Forming a plurality of slit-shaped first divided portions for performing a trimming process to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers, and at least the plurality of resistance layers Forming a plurality of protective layers so as to cover the substrate, and forming a metal film made of nickel or a nickel-based alloy on the entire back surface of the sheet-shaped insulating substrate in which the plurality of slit-shaped first divided portions are formed. Forming a plurality of pairs of side electrode layers made of nickel or a nickel-based alloy on inner surfaces of the plurality of slit-shaped first divided portions; and forming a metal formed on a back surface of the sheet-shaped insulating substrate. Forming a plurality of pairs of backside electrode layers by removing unnecessary portions of the film with a laser; forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; A plurality of second divisions in a direction orthogonal to the slit-shaped first division portion such that the plurality of resistance layers are individually separated into a plurality of strip-like substrates and divided into individual substrates. Forming a portion. 34. A step of forming a plurality of pairs of upper electrode layers on an upper surface of a sheet-shaped insulating substrate; and a step of forming a plurality of resistance layers so as to partially overlap the plurality of pairs of upper electrode layers.
A step of performing trimming to adjust the resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers, and dividing the insulating substrate into a plurality of strip-shaped substrates into a sheet-shaped insulating substrate that has been subjected to the trimming. Forming a plurality of slit-shaped first divisions for forming a plurality of slits, and forming a plurality of protective layers so as to cover at least the plurality of resistance layers,
A plurality of pairs of slit-shaped first divided portions are formed on the inner surface of the plurality of slit-shaped first divided portions by applying nickel plating to the sheet-shaped insulating substrate in a state where the plurality of slit-shaped first divided portions are formed. Forming a side electrode layer; forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; and forming the plurality of resistance layers on a plurality of strip-shaped substrates in the sheet-shaped insulating substrate. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions such that the plurality of second divided portions are individually separated and divided into individual substrates. . 35. A step of forming a plurality of resistance layers on an upper surface of a sheet-like insulating substrate; a step of forming a plurality of pairs of upper surface electrode layers so as to partially overlap the plurality of resistance layers; A step of performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the resistance layer, and a step of dividing the insulating substrate into a plurality of strip-shaped substrates into the trimmed sheet-shaped insulating substrate. A step of forming a plurality of slit-shaped first divided parts, a step of forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and a state in which the plurality of slit-shaped first divided parts are formed Forming a plurality of pairs of side electrode layers on the inner surface of the plurality of slit-shaped first divided portions by applying nickel plating to the sheet-shaped insulating substrate by an electroless plating method; Cover layer Forming a plurality of pairs of solder layers, and forming the slits on the plurality of strip-shaped substrates in the sheet-shaped insulating substrate so that the plurality of resistance layers are individually separated and divided into individual substrates. Forming a plurality of second divided portions in a direction orthogonal to the first divided portions. 36. A step of forming a plurality of resistance layers on an upper surface of a sheet-shaped insulating substrate, and dividing the insulating substrate into a plurality of strip-shaped substrates into a sheet-shaped insulating substrate having the plurality of resistance layers formed thereon. Forming a plurality of slit-shaped first divisions for forming a plurality of pairs of upper electrode layers so as to partially overlap the plurality of resistance layers; and forming the plurality of pairs of upper electrode layers in the plurality of resistance layers. Performing a trimming process to adjust the resistance value between the upper electrode layers, forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and forming a resist layer on the back surface of the sheet-shaped insulating substrate. Forming a plurality of slit-shaped first divided portions on the back surface of the sheet-shaped insulating substrate in a state where a plurality of slit-shaped first divided portions are formed and an inner surface of the plurality of slit-shaped first divided portions by a sputtering method. Forming a side electrode layer of gold, stripping the resist layer and patterning a plurality of pairs of side electrode layers, and forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers A direction orthogonal to the slit-shaped first divided portion so that the plurality of resistive layers are individually separated and divided into individual substrates in the plurality of strip-shaped substrates in the sheet-shaped insulating substrate. Forming a plurality of second divisions in the resistor. 37. A step of forming a plurality of resistive layers on an upper surface of a sheet-like insulating substrate, and dividing the insulating substrate into a plurality of strip-like substrates into a sheet-like insulating substrate on which the plurality of resistive layers are formed. Forming a plurality of slit-shaped first divisions for forming a plurality of pairs of upper electrode layers so as to partially overlap the plurality of resistance layers; and forming the plurality of pairs of upper electrode layers in the plurality of resistance layers. Performing trimming to adjust the resistance value between the upper electrode layers, forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and installing a mask on the back surface of the sheet-shaped insulating substrate. And a step of performing the first slit-like process with the mask installed.
Forming a plurality of pairs of side electrode layers made of nickel or a nickel-based alloy on the back surface of a sheet-like insulating substrate having a plurality of divided portions formed thereon and on the inner surface of a plurality of slit-shaped first divided portions by a sputtering method. Forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; and forming the plurality of resistive layers individually on a plurality of strip-shaped substrates in the sheet-shaped insulating substrate. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so as to be divided into one-piece substrates. 38. A step of forming a plurality of resistive layers on an upper surface of a sheet-like insulating substrate, and dividing the insulating substrate into a plurality of strip-like substrates into a sheet-like insulating substrate having the plurality of resistive layers formed thereon. Forming a plurality of slit-shaped first divisions for forming a plurality of pairs of upper electrode layers so as to partially overlap the plurality of resistance layers; and forming the plurality of pairs of upper electrode layers in the plurality of resistance layers. Performing trimming to adjust the resistance value between the upper electrode layers, forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and forming a plurality of the slit-shaped first divided portions. A metal film made of nickel or a nickel-based alloy is formed on the entire back surface of the sheet-shaped insulating substrate in the state of being cut, and a plurality of nickel-based or nickel-based alloys are formed on the inner surface of the plurality of slit-shaped first divided portions. Forming a pair of side electrode layers;
Forming a plurality of pairs of back electrode layers by removing unnecessary portions of the metal film formed on the back surface of the sheet-shaped insulating substrate with a laser, and forming a plurality of pairs of the plurality of side electrode layers so as to cover the plurality of side electrode layers. A step of forming a solder layer; and forming the first slit-shaped substrate on a plurality of strip-shaped substrates in the sheet-shaped insulating substrate so that the plurality of resistance layers are individually separated and divided into individual substrates. Forming a plurality of second divisions in a direction orthogonal to the divisions. 39. A step of forming a plurality of pairs of upper electrode layers and a plurality of resistive layers on the upper surface of a sheet-shaped insulating substrate so that they are electrically connected to each other; A step of performing trimming for adjusting the resistance value between the upper electrode layers, and a slit-shaped first division for dividing the insulating substrate into a plurality of strip-shaped substrates on the trimmed sheet-shaped insulating substrate. Forming a plurality of portions, forming a plurality of protective layers so as to cover at least the plurality of resistance layers, forming a resist layer on the back surface of the sheet-shaped insulating substrate, and forming the slit-shaped 1
Forming a side electrode layer of nickel or a nickel-based alloy by a sputtering method on the back surface of the sheet-like insulating substrate in a state where a plurality of divided portions are formed and on the inner surface of the plurality of slit-shaped first divided portions; Removing a resist layer and patterning a plurality of pairs of side electrode layers; forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers; and forming a plurality of strips on the sheet-shaped insulating substrate. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so that the plurality of resistive layers are individually separated and divided into individual substrates on the substrate A method for manufacturing a resistor comprising: 40. A step of forming a plurality of pairs of upper electrode layers and a plurality of resistive layers on the upper surface of a sheet-shaped insulating substrate so that they are electrically connected to each other; A step of performing trimming for adjusting the resistance value between the upper electrode layers, and a slit-shaped first division for dividing the insulating substrate into a plurality of strip-shaped substrates on the trimmed sheet-shaped insulating substrate. Forming a plurality of parts, forming a plurality of protective layers so as to cover at least the plurality of resistance layers, setting a mask on the back surface of the sheet-shaped insulating substrate, and setting the mask Then, on the back surface of the sheet-like insulating substrate having the plurality of slit-shaped first divided portions formed thereon and on the inner surface of the plurality of slit-shaped first divided portions, nickel or a nickel-based alloy is formed by a sputtering method. Forming a plurality of pairs of side electrode layers, forming a plurality of pairs of solder layers so as to cover the plurality of pairs of side electrode layers, and forming a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, Forming a plurality of second divisions in a direction orthogonal to the slit-shaped first divisions so that the plurality of resistance layers are individually separated and divided into individual substrates. Method of manufacturing the vessel. 41. A step of forming a plurality of pairs of upper electrode layers and a plurality of resistance layers on the upper surface of a sheet-shaped insulating substrate so that they are electrically connected to each other; A step of performing trimming for adjusting the resistance value between the upper electrode layers, and a slit-shaped first division for dividing the insulating substrate into a plurality of strip-shaped substrates on the trimmed sheet-shaped insulating substrate. Forming a plurality of portions, forming a plurality of protective layers so as to cover at least the plurality of resistance layers, and forming a plurality of slit-shaped first divided portions on the sheet-shaped insulating substrate. Forming a metal film of nickel or a nickel-based alloy on the entire back surface, and forming a plurality of pairs of side electrode layers of nickel or a nickel-based alloy on the inner surface of the plurality of slit-shaped first divided portions; Forming a plurality of pairs of back surface electrode layers by removing unnecessary portions of the metal film formed on the back surface of the sheet-shaped insulating substrate with a laser, and covering the plurality of pairs of side surface electrode layers. Forming a plurality of pairs of solder layers, and forming a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, wherein the plurality of resistive layers are individually separated so as to be divided into individual substrates; Forming a plurality of second divided portions in a direction orthogonal to the first divided portion. 42. A plurality of slit-like first divided portions,
The method for manufacturing a resistor according to any one of claims 7 to 41, wherein the sheet-shaped insulating substrate is formed with a through-hole penetrating vertically. 43. The method of manufacturing a resistor according to claim 7, wherein the plurality of slit-shaped first divided portions are formed by dicing. 44. The method according to claim 7, wherein the plurality of second divided portions are formed by dicing. 45. The method according to claim 7, wherein the plurality of second divided portions are formed by cutting the sheet-shaped insulating substrate while leaving a thin portion. 46. The method of manufacturing a resistor according to claim 45, wherein the thin portion is left on the back side of the sheet-shaped insulating substrate. 47. An unnecessary area portion is formed at an end of a sheet-shaped insulating substrate, and a plurality of slit-shaped first divided portions and a plurality of second divided portions are not formed in the unnecessary area portion. The method for manufacturing a resistor according to any one of claims 7 to 41. 48. The method of manufacturing a resistor according to claim 7, wherein a plurality of pairs of side electrode layers and a plurality of pairs of solder layers are formed in a sheet-like insulating substrate.