JP2004146858A - Method of manufacturing resistor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method by which the conventional step of exchanging masks in accordance with the dimensional rank of a singulated substrate can be eliminated, because the dimensional classification of the singulated substrates becomes unnecessary, and, at the same time, an inexpensive fine resistor can be manufactured easily. <P>SOLUTION: This method of manufacturing resistor includes a step of forming a first resist layer 27 on the upper surface of a sheet-like insulating substrate 21 so as to cover protective layers 24 and 26 and, at the same time, a second resist layer 28 on the rear surface of the substrate 21, and a step of forming a plurality of slit-like first split sections 29 for dividing the substrate 21 into a plurality of strip-like substrates by separating a plurality of pairs of upper-surface electrode layers 22. This method also includes a step of forming a plurality of pairs of side-face electrode layers 30 on the internal surfaces of the first split sections 29 by electroless plating the insulating substrate 21 containing the split sections 29 with nickel, and a step of patterning the side-face electrode layers 30 by peeling the first and second resistor layers 27 and 28 from the substrate 21. <P>COPYRIGHT: (C)2004,JPO

Description

The present invention relates to a method of manufacturing a resistor, and more particularly to a method of manufacturing a fine resistor.

Hereinafter, a conventional resistor and a method of manufacturing the same will be described with reference to the drawings.

FIG. 12 is a sectional view of a conventional resistor.

に お い て In FIG. 12, reference numeral 1 denotes an insulating individual substrate made of porcelain such as alumina. Reference numeral 2 denotes a pair of first upper electrode layers provided on both right and left ends of the upper surface of the individual substrate 1. Reference numeral 3 denotes a resistance layer provided on the upper surface of the individual substrate 1 so as to partially overlap the pair of first upper electrode layers 2. Reference numeral 4 denotes a first protective layer provided so as to cover only the entire resistive layer 3. Reference numeral 5 denotes a trimming groove provided in the resistance layer 3 and the first protection layer 4 for correcting the resistance value. Reference numeral 6 denotes a second protective layer provided only on the upper surface of the first protective layer 4. Reference numeral 7 denotes a pair of second upper electrode layers provided on the upper surfaces of the pair of first upper electrode layers 2 so as to extend to the full width of the individual substrate 1. Reference numeral 8 denotes a pair of side electrode layers provided on both side surfaces of the individual substrate 1. Reference numerals 9 and 10 denote a pair of nickel plating layers and a pair of solder plating layers provided on the surfaces of the pair of second upper electrode layers 7 and the pair of side electrode layers 8, respectively. In this case, the solder plating layer 10 is provided lower than the second protective layer 6.

(4) With respect to the conventional resistor configured as described above, the following manufacturing method will be described with reference to the drawings.

FIGS. 13A to 13F are process diagrams showing a conventional method for manufacturing a resistor.

First, as shown in FIG. 13 (a), a pair of first upper electrode layers 2 is formed by coating on the left and right ends of the upper surface of the individual substrate 1 having insulating properties.

Next, as shown in FIG. 13B, a resistive layer 3 is applied on the upper surface of the individual substrate 1 so as to partially overlap the pair of first upper electrode layers 2.

Next, as shown in FIG. 13C, after forming the first protective layer 4 by coating so as to cover only the whole of the resistance layer 3, the total resistance value of the resistance layer 3 is within a predetermined resistance value range. A trimming groove 5 is formed in the resistance layer 3 and the first protection layer 4 by a laser or the like so as to enter the inside.

Next, as shown in FIG. 13D, the second protective layer 6 is formed by coating only on the upper surface of the first protective layer 4.

Next, as shown in FIG. 13E, the pair of second upper electrode layers 7 are located on the upper surfaces of the pair of first upper electrode layers 2 and extend to the full width of the individual substrate 1. To form a coating.

Next, as shown in FIG. 13F, a pair of first and second upper electrode layers 2 and 7 are provided on the side surfaces of the pair of first upper electrode layers 2 and the left and right ends of the individual substrate 1. A pair of side electrode layers 8 are formed by coating so as to be electrically connected.

Finally, after nickel plating is performed on the surfaces of the pair of second upper electrode layers 7 and the pair of side electrode layers 8, solder plating is performed to form a pair of nickel plating layers 9 and a pair of solder plating layers 10. To manufacture a conventional resistor.

Also, the above-mentioned resistors have been extremely miniaturized, and in recent years, very small resistors having a length of 0.6 mm × a width of 0.3 mm × a thickness of 0.25 mm have been manufactured.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP-A-4-102302

A description will be given of a problem when a very small resistor of 0.6 mm long × 0.3 mm wide × 0.25 mm thick is manufactured by the above-described conventional configuration and manufacturing method.

に お け る A conventional sheet-shaped insulating substrate made of porcelain such as alumina is manufactured by forming a substrate dividing groove in advance before firing the sheet-shaped insulating substrate, and firing the insulating substrate. For this reason, the substrate dividing grooves formed in advance on the sheet-shaped insulating substrate may have dimensional variations due to subtle variations in the composition of the sheet-shaped insulating substrate or subtle variations in the temperature during firing of the sheet-shaped insulating substrate. (This dimensional variation reaches about 0.5 mm for a sheet-shaped insulating substrate of about 100 mm × 100 mm).

When manufacturing a very fine resistor using a sheet-shaped insulating substrate having such a dimensional variation, the dimensions of the individual substrate are set to very fine dimensional ranks in each of the vertical and horizontal directions. It is necessary to categorize and arrange screen printing masks such as the upper electrode layer 2, the resistance layer 3, and the protective layer 4 corresponding to the respective dimensional ranks, and it is necessary to replace the masks according to the dimensional ranks of the individual substrates. However, as a result, there is a problem that the process becomes very complicated (when the dimensional rank is classified in 0.05 mm increments, the total of 25 ranks in the vertical direction and the horizontal direction is totaled vertically and horizontally). Dimension classification of about 600 ranks or more is required.)

The present invention solves the above-mentioned conventional problems, and eliminates the need for the step of replacing the mask according to the dimensional rank of the singular substrate, which eliminates the need for dimensional classification of the singular substrate. It is an object of the present invention to provide a method of manufacturing a resistor which can be manufactured at a low cost and easily obtain a fine resistor.

た め In order to achieve the above object, the present invention has the following configuration.

The invention according to claim 1 of the present invention includes a step of forming a plurality of pairs of upper electrode layers and a plurality of resistance layers on the upper surface of a sheet-shaped insulating substrate so that both are electrically connected to each other; A step of performing trimming for adjusting a resistance value between the plurality of pairs of upper electrode layers in the resistance layer, a step of forming a protective layer so as to cover at least the plurality of resistance layers, and an upper surface of the sheet-shaped insulating substrate Forming a first resist layer so as to cover the protective layer on the side and forming a second resist layer on the back surface of the sheet-shaped insulating substrate; and forming the first resist layer and the second resist layer on the sheet. Forming a plurality of slit-shaped first divided portions for separating the plurality of pairs of upper surface electrode layers and dividing the plurality of strip-shaped substrates into a plurality of strip-shaped substrates, and the slit-shaped first division Multiple parts are formed Forming a plurality of pairs of side surface electrode layers on the inner surface of the plurality of slit-shaped first divided portions by applying nickel plating to the entire surface of the sheet-shaped insulating substrate in an inclined state by electroless plating. A step of patterning the plurality of pairs of side electrode layers by peeling one resist layer and a second resist layer; and a step of separating the plurality of resistive layers individually into a plurality of strip-shaped substrates in the sheet-shaped insulating substrate. According to this manufacturing method, a plurality of second divided portions are formed in a direction orthogonal to the slit-shaped first divided portions so as to be divided into individual pieces. A plurality of pairs of side surface electrode layers are formed on the inner surface of the plurality of slit-shaped first divided portions by applying nickel plating to the sheet-shaped insulating substrate having the plurality of divided portions formed thereon by electroless plating. Like Are therefore, this aspect electrode layer without forming for each of a plurality of strip-like substrate as in the prior art, and has effects that can be formed collectively in a state of a sheet-like insulating substrate.

The invention according to claim 2 of the present invention includes a step of forming a plurality of pairs of upper electrode layers or a plurality of resistance layers on an upper surface of a sheet-shaped insulating substrate, and forming the plurality of pairs of upper electrode layers or the plurality of resistance layers. Forming a plurality of slit-shaped first divided portions for separating the plurality of pairs of upper electrode layers or the plurality of resistance layers into a plurality of strip-shaped substrates on the formed sheet-shaped insulating substrate; Forming a plurality of resistance layers or a plurality of pairs of upper electrode layers such that a part thereof overlaps the plurality of pairs of upper electrode layers or the plurality of resistance layers; and a step of forming the plurality of pairs of upper electrode layers in the plurality of resistance layers. A step of performing trimming to adjust the resistance value, a step of forming a protective layer so as to cover at least the plurality of resistance layers, and a first step of covering the protective layer on an upper surface side of the sheet-shaped insulating substrate. When the resist layer is formed A step of forming a second resist layer on the back surface of the sheet-like insulating substrate; and a step of nickel plating by electroless plating on the sheet-like insulating substrate in which a plurality of the slit-like first divisions are formed. Forming a plurality of pairs of side electrode layers on the inner surface of the plurality of slit-shaped first divided portions, and peeling the first resist layer and the second resist layer to form the plurality of pairs of side electrode electrodes. A step of patterning a layer, the plurality of strip-shaped substrates in the sheet-shaped insulating substrate, the plurality of resistive layers are individually separated so that the slit-shaped first substrate is divided into individual substrates. Forming a plurality of second divided portions in a direction orthogonal to the divided portions. According to this manufacturing method, a sheet-like sheet in which a plurality of slit-shaped first divided portions are formed is provided. Electroless plating on insulating substrate Since a plurality of pairs of side electrode layers are formed on the inner surface of the plurality of slit-shaped first divided portions by applying nickel plating by a construction method, the side electrode layers are formed into a plurality of strip-shaped portions as in the related art. This has the effect of being able to be formed collectively in the state of a sheet-shaped insulating substrate without forming it for each substrate.

According to a third aspect of the present invention, there is provided a method for forming a plurality of pairs of upper electrode layers and a plurality of resistance layers on an upper surface of a sheet-shaped insulating substrate so that both are electrically connected to each other; A plurality of slit-shaped first divisions for separating the plurality of pairs of upper electrode layers and dividing the plurality of pairs of upper electrode layers into a plurality of strip-shaped substrates on a sheet-shaped insulating substrate formed with a plurality of upper electrode layers and a plurality of resistance layers. Forming, trimming to adjust the resistance between the plurality of pairs of upper electrode layers in the plurality of resistance layers, and forming a protective layer so as to cover at least the plurality of resistance layers, Forming a first resist layer on the upper surface side of the sheet-shaped insulating substrate so as to cover the protective layer, and forming a second resist layer on the back surface of the sheet-shaped insulating substrate; Multiple divisions are formed Forming a plurality of pairs of side electrode layers on the inner surface of the plurality of slit-shaped first divided parts by applying nickel plating to the sheet-shaped insulating substrate in a state of being separated by electroless plating. A step of patterning the plurality of pairs of side electrode layers by peeling a resist layer and a second resist layer; and a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, wherein the plurality of resistive layers are individually separated. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions so as to be divided into individual substrates. A plurality of pairs of side electrodes are formed on the inner surface of the plurality of slit-shaped first divided portions by applying nickel plating to the sheet-shaped insulating substrate having the plurality of first divided portions formed thereon by electroless plating. Form a layer Therefore, this side electrode layer has an operation and effect that it can be formed collectively in the state of a sheet-shaped insulating substrate, instead of being formed for each of a plurality of strip-shaped substrates as in the related art. is there.

According to a fourth aspect of the present invention, a plurality of pairs of upper surface electrode layers and a plurality of resistance layers are formed on the upper surface of a sheet-shaped insulating substrate so that both are electrically connected to each other, and the plurality of resistance layers are formed. Performing trimming to adjust the resistance value between the plurality of pairs of upper electrode layers in a layer; and separating the plurality of pairs of upper electrode layers into a plurality of strips on the trimmed sheet-shaped insulating substrate. Forming a plurality of slit-shaped first divided portions for dividing into a substrate, forming a protective layer so as to cover at least the plurality of resistance layers, and forming a plurality of slit-shaped first divided portions on an upper surface side of the sheet-shaped insulating substrate. Forming a first resist layer so as to cover the protective layer and forming a second resist layer on the back surface of the sheet-shaped insulating substrate; and forming a sheet having a plurality of slit-shaped first divided portions formed thereon. Shaped insulation Forming a plurality of pairs of side electrode layers on the inner surface of the plurality of slit-shaped first divided portions by subjecting the plate to nickel plating by an electroless plating method; and forming the first resist layer and the second resist layer. Peeling and patterning the plurality of pairs of side electrode layers; and a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, wherein the plurality of resistance layers are individually separated and divided into individual-shaped substrates. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portion as described above. According to this manufacturing method, the slit-shaped first divided portion is A plurality of pairs of side surface electrode layers are formed on the inner surfaces of the plurality of slit-shaped first divided portions by applying nickel plating to the sheet-shaped insulating substrate in a plurality of formed states by an electroless plating method. Because of this Surface electrode layer is not formed for each of a plurality of strip-like substrate as in the prior art, and has effects that can be formed collectively in a state of a sheet-like insulating substrate.

As described above, the resistor manufacturing method of the present invention can eliminate the step of replacing the mask according to the dimensional rank of the individual substrate as in the related art, and is inexpensive and has a fine resistor. Can be provided.

(Embodiment 1)
Hereinafter, the first to fourth aspects of the present invention will be described with reference to the first embodiment.

FIG. 1 is a sectional view of the resistor according to the first embodiment of the present invention.

In FIG. 1, reference numeral 11 denotes a sheet-like insulating substrate made of fired 96% -purity alumina divided into a slit-shaped first divided portion and a second divided portion orthogonal to the first divided portion. In this way, the substrate is singulated. Reference numeral 12 denotes a pair of upper electrode layers mainly formed of silver and formed on the upper surface of the individual substrate 11. Reference numeral 13 denotes a ruthenium oxide-based resistance layer formed on the upper surface of the individual substrate 11 so as to partially overlap the pair of upper electrode layers 12. Reference numeral 14 denotes a first protective layer formed of a pre-coated glass layer formed on the upper surface of the resistance layer 13. Reference numeral 15 denotes a trimming groove provided for correcting the resistance value of the resistance layer 13 between the pair of upper electrode layers 12. Reference numeral 16 denotes a second protective layer mainly composed of resin and formed so as to cover the first protective layer 14 made of a precoated glass layer. Reference numeral 17 denotes a pair of side electrode layers made of nickel formed so as to overlap a part of the pair of upper electrode layers 12 and to cover both side surfaces of the individual substrate 11 and both end portions of the back surface. Reference numeral 18 denotes a solder layer made of tin formed so as to cover a part of the pair of side electrode layers 17 and a part of the pair of upper electrode layers 12.

Next, a method of manufacturing the resistor configured as described above according to the first embodiment of the present invention will be described with reference to the drawings.

FIG. 2 is a top view showing a state in which an unnecessary region is formed on the entire peripheral edge of a sheet-like insulating substrate used in manufacturing the resistor according to the first embodiment of the present invention, and FIGS. (E), FIGS. 4 (a) to (e), FIGS. 5 (a) to (d), FIGS. 6 (a) to (d), FIGS. 7 (a) to (c), and FIGS. FIG. 3C is a process drawing illustrating the method for manufacturing the resistor in the first embodiment of the present invention.

First, as shown in FIG. 2, FIG. 3 (a), and FIG. 4 (a), a 0.2 mm thick sheet-like insulating substrate 21 made of fired 96% purity alumina is prepared. In this case, as shown in FIG. 2, the sheet-shaped insulating substrate 21 has an unnecessary area portion 21a which does not eventually become a product at all peripheral edges. The unnecessary area 21a is formed in a substantially rectangular shape.

Next, as shown in FIGS. 2, 3B and 4B, a plurality of pairs of upper electrode layers 22 mainly composed of silver are formed on the upper surface of the sheet-shaped insulating substrate 21 by screen printing. Then, by baking with a baking profile having a peak temperature of 850 ° C., the upper electrode layer 22 was made a stable film.

Next, as shown in FIGS. 2, 3C, and 4C, a plurality of ruthenium oxide-based resistance layers 23 are formed by a screen printing method so as to straddle a plurality of pairs of upper electrode layers 22. By baking with a baking profile with a peak temperature of 850 ° C., the resistance layer 23 was made a stable film.

Next, as shown in FIGS. 3D and 4D, a first protective layer 24 including a plurality of pre-coated glass layers is formed by a screen printing method so as to cover the plurality of resistance layers 23. By baking with a baking profile having a peak temperature of 600 ° C., the first protective layer 24 made of a precoated glass layer was made a stable film.

Next, as shown in FIGS. 3E and 4E, trimming is performed by a laser trimming method in order to adjust the resistance value of the resistance layer 23 between the plurality of pairs of upper electrode layers 22 to a constant value. Then, a plurality of trimming grooves 25 were formed.

Next, as shown in FIGS. 5A and 6A, resin is applied by a screen printing method so as to cover the first protective layer 24 including a plurality of pre-coated glass layers arranged in the vertical direction on the drawing. A plurality of second protective layers 26 as a main component were formed and cured with a curing profile at a peak temperature of 200 ° C., thereby forming the second protective layer 26 as a stable film.

Next, as shown in FIG. 5B and FIG. 6B, a plurality of first resist layers 27 are formed by a screen printing method so as to cover the plurality of second protective layers 26, and are cured by ultraviolet light. The first resist layer 27 was a stable film. Further, a plurality of second resist layers 28 were formed on the back surface of the sheet-shaped insulating substrate 21 by a screen printing method, and the second resist layer 28 was made into a stable film by ultraviolet curing.

Next, as shown in FIG. 2, FIG. 5 (c), and FIG. 6 (c), the first resist layer 27 and the second resist layer 28 are formed on the entire peripheral edge of the sheet-like insulating substrate 21. Except for the unnecessary region portion 21a thus formed, a plurality of slit-shaped first division portions 29 for separating a plurality of pairs of upper electrode layers 22 and dividing the plurality of upper electrode layers 22 into a plurality of strip-shaped substrates 21b are formed by a dicing method. In this case, the plurality of slit-shaped first divided portions 29 are formed at a pitch of 700 μm, and the width of the slit-shaped first divided portions 29 is 120 μm. The plurality of slit-shaped first divided portions 29 are formed by through holes penetrating the sheet-shaped insulating substrate 21 in the vertical direction. Further, since the sheet-shaped insulating substrate 21 has a plurality of slit-shaped first divided portions 29 formed by a dicing method except for the unnecessary region portion 21a, the slit-shaped first divided portions 29 are formed. After that, since the plurality of strip-shaped substrates 21b are connected to the unnecessary area portion 21a, they are in a sheet state.

Next, as shown in FIGS. 5 (d) and 6 (d), the entire surface of the sheet-shaped insulating substrate 21 is nickel-plated by using an electroless plating method of performing plating by dipping in a plating bath. The side electrode layer 30 having a thickness of about 4 to 6 μm is formed. In this case, since the plurality of slit-shaped first divided portions 29 are formed with through holes vertically penetrating the sheet-shaped insulating substrate 21, the entire surface of the sheet-shaped insulating substrate 21 is subjected to the electroless plating method. When the side surface electrode layer 30 is formed by performing nickel plating on the side surface electrode layer 30, the entire inner surface of the slit-shaped first divided portion 29 which is a through hole from the upper surface side of the sheet-shaped insulating substrate 21 is formed. This is formed up to the back side of the sheet-shaped insulating substrate 21 through the sheet. The side surface electrode layer 30 is formed so as to cover a part of the upper surface electrode layer 22 and the first resist layer 27 that are exposed on the upper surface side of the sheet-shaped insulating substrate 21. On the back surface side, it is formed so as to cover the second resist layer 28.

Next, as shown in FIGS. 7A and 8A, a plurality of first resist layers (not shown) and a plurality of second resist layers (not shown) are peeled off, and a plurality of pairs of side surfaces are formed. The electrode layer 30 is patterned.

Next, as shown in FIGS. 7B and 8B, a plurality of pairs of exposed side surface electrode layers 30 and a plurality of first resist layers (not shown) are formed by using an electroplating method. A plurality of pairs of solder layers 31 made of tin having a thickness of about 4 to 6 μm are formed so as to cover a part of the plurality of pairs of upper surface electrode layers 22 exposed by peeling off.

The thickness of the side electrode layer 30 is about 4 to 6 μm, but is not limited to this range, and the thickness is appropriately 1 to 15 μm. Since it is constructed by applying nickel plating using the electroless plating method, it has no magnetism.In such a configuration, very high dimensional accuracy can be obtained and automatic mounting When a resistor is sucked and mounted by a suction pin of a machine, stability at the time of suction is improved and a high mounting rate can be secured.

The solder layer 31 is made of tin, but is not limited to tin. The solder layer 31 may be made of a tin alloy-based material. When these materials are used, stable soldering can be performed during reflow soldering. You can do it.

Further, since the upper electrode layer 22 is made of a silver-based material and the resistance layer 23 is made of a ruthenium oxide-based material, resistance characteristics excellent in heat resistance and durability can be secured. .

Further, the protective layer covering the resistance layer 23 and the like mainly includes a first protective layer 24 made of a pre-coated glass layer that covers the resistance layer 23, and a resin that covers the first protective layer 24 and covers the trimming groove 25. Since the first protective layer 24 is composed of two layers, the first protective layer 24 can prevent the occurrence of cracks at the time of laser trimming and reduce the current noise. By covering the entire resistive layer 23 with the second protective layer 26 described above, it is possible to secure resistance characteristics excellent in moisture resistance.

Finally, as shown in FIG. 2, FIG. 7 (c), and FIG. 8 (c), a sheet-like insulating substrate 21 is formed except for an unnecessary area portion 21a formed on the entire peripheral edge of the sheet-like insulating substrate 21. A dicing method is applied to a plurality of strip-shaped substrates 21b of the substrate 21 in a direction orthogonal to the slit-shaped first division 29 so that the resistance layers 23 are individually separated and divided into individual substrates 21c. Are used to form a plurality of second divisions 32. In this case, the plurality of second divisions 32 are formed at a pitch of 400 μm, and the width of the second divisions 32 is 100 μm. Since the plurality of second divided portions 32 are formed on the plurality of strip-shaped substrates 21b by a dicing method except for the unnecessary region portion 21a, each time the plurality of second divided portions 32 are formed. The product that is cut and divided into the individual pieces of the substrate 21c and separated into individual pieces is separated from the unnecessary area portion 21a.

抵抗 Through the steps described above, the resistor according to the first embodiment of the present invention is manufactured.

In the length and width dimensions of the resistor manufactured by the above process, the interval between the slit-shaped first divided portion 29 and the second divided portion 32 formed by the dicing method is accurate (within ± 0.005 mm). At the same time, since the thickness of the side electrode layer 30 and the solder layer 31 is also accurate, the total length and the total width of the resistor as a product are exactly 0.6 mm in length × 0.3 mm in width. In addition, the pattern accuracy of the upper electrode layer 22 and the resistance layer 23 does not need to be classified into dimensional ranks of the individual substrates, and it is not necessary to consider a dimensional variation within the dimensional rank of the same individual substrate. The effective area of 23 can be made larger than that of the conventional product. That is, the resistance layer in the conventional product has a length of about 0.20 mm × width 0.19 mm, whereas the resistance layer 23 of the resistor according to the embodiment of the present invention has a length of about 0.25 mm × width 0. .24 mm, which is about 1.6 times or more in area.

The plurality of slit-shaped first divided portions 29 and the plurality of second divided portions 32 are formed by using a dicing method, and the plurality of slit-shaped first divided portions 29 and the plurality of second divided portions 29 are formed. Since the two divided portions 32 are formed by dicing on the sheet-shaped insulating substrate 21 which does not require the dimensional classification of the individual substrates, the conventional dimensional classification of the individual substrates becomes unnecessary. In addition, it is possible to eliminate the complexity of the process due to the conventional mask replacement, and to easily perform dicing using a semiconductor or other general dicing equipment.

Further, the sheet-shaped insulating substrate 21 has an unnecessary area 21a which is not finally formed as a product at the entire peripheral end, and has a plurality of slit-shaped first divisions 29 and a plurality of second divisions. Since the portion 32 is not formed in the unnecessary region portion 21a, the plurality of strip-shaped substrates 21b are connected to the unnecessary region portion 21a even after forming the plurality of slit-shaped first divided portions 29, Therefore, the sheet-shaped insulating substrate 21 is not finely divided into the plurality of strip-shaped substrates 21b, and therefore, even after forming the plurality of slit-shaped first divided portions 29, the unnecessary region portion 21a is provided. Since the post-process can be performed in the state of the sheet-shaped insulating substrate 21, the design of the method can be simplified. When a plurality of second divisions 32 are formed, each time the plurality of second divisions 32 are formed, they are cut and divided into individual substrates 21c, and the individualized products are removed from the unnecessary area 21a. Since the separation is performed, the step of selecting the unnecessary area portion 21a and the product later is unnecessary.

Further, since the plurality of pairs of the side electrode layers 30 and the plurality of pairs of the solder layers 31 are formed in the state of the sheet-shaped insulating substrate 21, the side electrode layers 30 are formed at necessary portions of the sheet-shaped insulating substrate 21. The potential difference can be reduced when the solder layer 31 is formed by the electroplating method, and the stable solder layer 31 can be formed.

In the first embodiment of the present invention, the unnecessary region 21a, which is not finally formed as a product, is formed at the entire peripheral edge of the sheet-shaped insulating substrate 21 to form a substantially rectangular shape. As described above, the unnecessary area portion 21a does not necessarily need to be formed on the entire peripheral edge of the sheet-like insulating substrate 21. For example, as shown in FIG. When the portion 21d is formed, as shown in FIG. 10, when the unnecessary region portions 21e are formed at both ends of the sheet-shaped insulating substrate 21, as shown in FIG. Even when the unnecessary area portion 21f is formed, the same operation and effect as those of the first embodiment of the present invention are exerted.

Further, in the first embodiment of the present invention, the case where the plurality of second divided portions 32 are formed by the dicing method has been described. In addition, for example, the plurality of second divided portions 32 may be formed of a sheet. Any one of the upper surface, the lower surface, and the center of the sheet-shaped insulating substrate 21 is cut by a laser method, a dicing method, or the like while leaving a thin portion on any of the back surface, the upper surface, and the center of the insulating substrate 21 having the shape. In these cases, individual pieces are formed in two stages instead of being individualized each time the second divided portion 32 is formed.

Further, in the first embodiment of the present invention, the first resist layer 27 and the second resist layer 28 are formed, and then the slit-shaped first division 29 is formed. The second resist layer 28 may be formed after forming the slit-shaped first division 29. However, when the first resist layer 27 and the second resist layer 28 are screen-printed after the formation of the slit-shaped first divisional portions 29, the strength of the sheet-shaped insulating substrate 21 is reduced. It is necessary to reduce the printing pressure during screen printing.

{Circle around (2)} Even if the second resist layer 28 is formed immediately after the formation of the first protective layer 24 made of a pre-coated glass layer, the same effect as in the first embodiment of the present invention can be obtained.

Furthermore, in the first embodiment of the present invention, the first resist layer 27 and the second resist layer 28 are peeled off before the formation of the solder layer 31, but this can be performed after the formation of the solder layer 31. It is.

In the first embodiment of the present invention, a silver-based material is used for the upper electrode layer 22 and a ruthenium oxide-based material is used for the resistance layer 23. However, these may be used in other material systems. An effect similar to that of the first embodiment can be obtained.

In the first embodiment of the present invention, the slit-shaped first divided portion 29 and the second divided portion 32 are formed using the dicing method. However, other than the dicing method, Even when the slit-shaped first divided portion 29 and the second divided portion 32 are formed by using a dividing means such as a laser or a water jet, the same operation and effect as those of the first embodiment of the present invention can be obtained. To play.

Further, in the first embodiment of the present invention, when a plurality of slit-shaped first divisions 29 for dividing into a plurality of strip-shaped substrates 21b are formed, a plurality of pairs of upper surface electrode layers 22 and a plurality of resistances are formed. Sheet-shaped insulating substrate on which a layer 23, a plurality of first protective layers 24, a plurality of trimming grooves 25, a plurality of second protective layers 26, a plurality of first resist layers 27, and a plurality of second resist layers 28 are formed. Although a description has been given of a case where a plurality of slit-shaped first division portions 29 are formed in the first insulating member 21, the present invention is not limited to this. When a plurality of slit-shaped first divided portions 29 are formed, and when a sheet-shaped insulating substrate 21 in which a plurality of slit-shaped first divided portions 29 are formed in advance is used, a plurality of sheet-shaped insulating substrates 21 are formed. Twin When a plurality of slit-shaped first divided portions 29 are formed on the sheet-shaped insulating substrate 21 after the formation of the surface electrode layer 22, a plurality of resistance layers 23 are formed on the sheet-shaped insulating substrate 21. Thereafter, when a plurality of slit-shaped first divided portions 29 are formed on the sheet-shaped insulating substrate 21, a plurality of pairs of upper surface electrode layers 22 are formed on the sheet-shaped insulating substrate 21, and the plurality of pairs are formed. In the case where a plurality of slit-shaped first divisions 29 are formed on the sheet-like insulating substrate 21 after forming a plurality of resistance layers 23 so that After forming a plurality of resistance layers 23 on the insulating substrate 21 and forming a plurality of pairs of upper electrode layers 22 so as to partially overlap the plurality of resistance layers 23, the sheet-shaped insulating substrate 21 is slit-shaped. Of the first division 29 In this case, a plurality of pairs of upper electrode layers 22 and a plurality of resistance layers 32 are formed on a sheet-shaped insulating substrate 21, and the resistance between the plurality of pairs of upper electrode layers 22 in the plurality of resistance layers 23 is formed. After trimming in order to adjust the value, the slit-like first divided portion 29 is formed in the sheet-like insulating substrate 21 in the same manner as in the first embodiment of the present invention. It is effective.

Sectional view of the resistor according to the first embodiment of the present invention. Top view showing a state in which an unnecessary region is formed at the entire peripheral edge of a sheet-shaped insulating substrate used in manufacturing the resistor. (A)-(e) Sectional drawing which shows the manufacturing process of the same resistor. (A)-(e) The top view which shows the manufacturing process of the same resistor. (A)-(d) Sectional drawing which shows the manufacturing process of the same resistor. (A)-(d) The top view which shows the manufacturing process of the same resistor. (A)-(c) Sectional drawing which shows the manufacturing process of the same resistor. (A)-(c) The top view which shows the manufacturing process of the same resistor. Top view showing a state where an unnecessary region is formed at one end of a sheet-shaped insulating substrate used in manufacturing the resistor. Top view showing a state in which unnecessary regions are formed at both ends of a sheet-shaped insulating substrate used in manufacturing the resistor. Top view showing a state where unnecessary regions are formed at three ends of a sheet-shaped insulating substrate used for manufacturing the resistor. Cross section of conventional resistor (A)-(f) Perspective view showing a manufacturing process of a conventional resistor.

Explanation of reference numerals

DESCRIPTION OF SYMBOLS 21 Sheet-shaped insulating substrate 21a, 21d-21f Unnecessary area part 21b Strip-shaped substrate 21c Individual substrate 22 Upper surface electrode layer 23 Resistive layer 24 First protective layer 25 Trimming groove 26 Second protective layer 27 First resist layer 28 second resist layer 29 slit-shaped first division 30 side electrode layer 31 solder layer 32 second division

Claims (4)

Forming a plurality of pairs of upper electrode layers and a plurality of resistance layers on the upper surface of the sheet-shaped insulating substrate so that they are electrically connected to each other; and forming a resistance between the plurality of pairs of upper electrode layers in the plurality of resistance layers. Trimming to adjust the value, forming a protective layer so as to cover at least the plurality of resistance layers, and forming a first resist on the upper surface side of the sheet-shaped insulating substrate so as to cover the protective layer. Forming a layer and forming a second resist layer on the back surface of the sheet-shaped insulating substrate; and forming the plurality of pairs of upper surface electrodes on the sheet-shaped insulating substrate on which the first resist layer and the second resist layer are formed. A step of forming a plurality of slit-shaped first divided portions for separating a layer into a plurality of strip-shaped substrates, and a sheet-shaped insulating member in a state where the plurality of slit-shaped first divided portions are formed; The entire surface of the substrate Forming a plurality of pairs of side electrode layers on the inner surfaces of the plurality of slit-shaped first divided portions by applying nickel plating by an electroless plating method, and peeling the first resist layer and the second resist layer. Patterning the plurality of pairs of side-surface electrode layers, and forming a plurality of strip-shaped substrates in the sheet-shaped insulating substrate so that the plurality of resistance layers are individually separated and divided into individual substrates. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions. Forming a plurality of pairs of upper surface electrode layers or a plurality of resistance layers on the upper surface of the sheet-shaped insulating substrate; and forming the plurality of pairs on the sheet-shaped insulating substrate formed with the plurality of pairs of the upper surface electrode layers or the plurality of resistance layers. Forming a plurality of slit-shaped first divided portions for separating the upper electrode layer or the plurality of resistance layers into a plurality of strip-shaped substrates, and the plurality of pairs of upper electrode layers or the plurality of resistance layers Forming a plurality of resistive layers or a plurality of pairs of upper electrode layers so as to partially overlap with each other, and performing trimming to adjust a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistive layers. Forming a protective layer so as to cover at least the plurality of resistance layers; and forming a first resist layer on the upper surface side of the sheet-shaped insulating substrate so as to cover the protective layer, and forming the sheet-shaped insulating substrate. Back of Forming a second resist layer, and applying a nickel plating by an electroless plating method to a sheet-shaped insulating substrate having a plurality of the slit-shaped first divided portions formed thereon, thereby forming the plurality of slit-shaped first divided portions. A step of forming a plurality of pairs of side electrode layers on the inner surface of one divided portion; a step of peeling the first resist layer and the second resist layer to pattern the plurality of pairs of side electrode layers; A plurality of second substrates in a direction orthogonal to the slit-shaped first divided portion are formed on a plurality of strip-shaped substrates in the insulating substrate so that the plurality of resistance layers are individually separated and divided into individual substrates. Forming a divided part of the resistor. Forming a plurality of pairs of upper electrode layers and a plurality of resistance layers on the upper surface of the sheet-shaped insulating substrate so that both are electrically connected to each other; and forming the plurality of pairs of upper electrode layers and the plurality of resistance layers. Forming a plurality of slit-shaped first divided portions for separating the plurality of pairs of upper electrode layers into a plurality of strip-shaped substrates on a sheet-shaped insulating substrate; and forming the plurality of slit-shaped first divided portions on the plurality of resistance layers. Performing trimming to adjust the resistance value between a plurality of pairs of upper electrode layers; forming a protective layer so as to cover at least the plurality of resistance layers; and forming the protective layer on the upper surface side of the sheet-shaped insulating substrate. Forming a first resist layer so as to cover the layer and forming a second resist layer on the back surface of the sheet-like insulating substrate; and forming a sheet-like state in which a plurality of the slit-like first divided portions are formed. No insulation board Forming a plurality of pairs of side electrode layers on the inner surface of the plurality of slit-shaped first divided portions by applying nickel plating by a deplating method, and peeling the first resist layer and the second resist layer. Patterning the plurality of pairs of side electrode layers, and forming a plurality of strip-shaped substrates in the sheet-shaped insulating substrate, so that the plurality of resistance layers are individually separated and divided into individual substrates. Forming a plurality of second divided portions in a direction orthogonal to the slit-shaped first divided portions. A plurality of pairs of upper electrode layers and a plurality of resistance layers are formed on the upper surface of the sheet-shaped insulating substrate so that they are electrically connected to each other, and a resistance value between the plurality of pairs of upper electrode layers in the plurality of resistance layers. Performing a trimming process to adjust the thickness, and forming a first slit-shaped substrate for separating the plurality of pairs of upper surface electrode layers into a plurality of strip-shaped substrates on the trimmed sheet-shaped insulating substrate. Forming a plurality of divided portions, forming a protective layer so as to cover at least the plurality of resistance layers, and forming a first resist layer on the upper surface side of the sheet-shaped insulating substrate so as to cover the protective layer And forming a second resist layer on the back surface of the sheet-like insulating substrate, and forming the slit-like first divided portion on the sheet-like insulating substrate by electroless plating. Forming a plurality of pairs of side electrode layers on the inner surface of the plurality of slit-shaped first divided portions, and peeling the first resist layer and the second resist layer to form the plurality of side surfaces. Patterning an electrode layer; forming a plurality of strip-shaped substrates on the sheet-shaped insulating substrate, wherein the plurality of resistive layers are individually separated so as to be divided into individual substrates; Forming a plurality of second divided portions in a direction orthogonal to the divided portions.

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