JP2007173281A - Method of manufacturing electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component which has stability in formation of upper surface electrodes and connection reliability by enabling to suppress the generation of burrs in dicing the upper surface electrodes formed with a thick film. <P>SOLUTION: This method is provided with a process of forming the upper surface electrodes 13 made of a thick film on the upper surface of a sheet-like insulation substrate 11; a process of sticking the insulation substrate 11 on a fixing tape 19 so that its upper surface side may contact the fixing tape; and a process of dicing a region including the upper surface electrode 13 of the insulation substrate 11 stuck on the fixing tape 19. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electronic component, and more particularly to a method for manufacturing a minute chip-type electronic component.

  Hereinafter, a conventional method for manufacturing an electronic component will be described with reference to the drawings.

  6 (a) to 6 (d) show a manufacturing process diagram of a chip resistor which is one of the conventional electronic components. Based on FIGS. 6 (a) to 6 (d), the manufacturing method is shown. This will be described below.

  First, as shown in FIG. 6A, a plurality of upper surface electrodes 2 and a plurality of resistors 3 are formed on the upper surface of an insulating substrate 1 made of alumina or the like in a regularly aligned grid pattern by a screen printing method. . In this case, the resistor 3 is electrically connected with its both ends overlapped with the upper surface electrode 2. The top electrode 2 and the resistor 3 formed by the screen printing method usually have a thickness of 5 to 20 μm.

  Next, as shown in FIG. 6B, the insulating substrate 1 is pasted so that the back side of the insulating substrate 1 is in contact with the fixing film 4, and the upper surface electrode 2 is cut in a direction perpendicular to the row composed of the upper surface electrode 2 and the resistor 3. As described above, the first slit groove 5 is formed on the insulating substrate 1 by dicing. In this case, the first slit groove 5 penetrates the insulating substrate 1 but does not completely cross the insulating substrate 1 so that the insulating substrate 1 is not divided.

  Next, as shown in the sectional view of FIG. 6C, the end face electrode film 6 is formed in the vicinity of the first slit groove 5 on the cut end face of the upper surface electrode 2 and the first slit groove 5 and the back surface of the insulating substrate 1. Are formed by sputtering and plating techniques.

  Finally, as shown in FIG. 6D, an insulating substrate 1 on which an end face electrode film 6 is formed is stuck on a fixing tape (not shown), and the direction parallel to the row of the top electrode 2 and the resistor 3 A conventional chip resistor has been manufactured by forming the second slit groove 7 and dividing it into pieces.

  A fixing tape for attaching the insulating substrate 1 when forming the first slit groove 5 and the second slit groove 7 on the insulating substrate 1 is generally an acrylic adhesive on one side of a resin base material such as polyolefin. A UV tape provided with a layer is used, and when this UV tape is subjected to UV irradiation (irradiation with ultraviolet light), the adhesive strength is rapidly reduced. When the first slit groove 5 and the second slit groove 7 are formed, the fixing tape is not exposed to ultraviolet light in order to prevent the separated substrate from being taken off from the fixing tape and scattered. In the case where the first slit groove 5 and the second slit groove 7 are formed and the individual substrate is removed from the fixing tape, ultraviolet light is applied to the fixing tape. By reducing the adhesive strength, the individual substrate is easily peeled off.

  Moreover, as a method for holding the insulating substrate at the time of dicing, in addition to the above-described method, a method of attaching to a glass or the like with a liquid adhesive such as wax is known. In this case, the adhesive is removed. Therefore, it is difficult to remove the adhesive completely, which is disadvantageous in terms of cost and reliability as compared with the case of using a fixing tape.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
Japanese Patent Laid-Open No. 5-267025

  In the above-described conventional chip-type electronic component, the upper surface electrode 2 is made of a thick film electrode material whose main component is a metal material such as silver or gold which is rich in ductility. As a result, there is a problem that the burr 8 as shown in FIG. This problem has been a factor incurring an increase in manufacturing cost due to a deterioration in yield and a reduction in equipment operation rate, especially for a minute chip-type electronic component that requires a high dimensional accuracy. Further, since the rotating blade used at the time of dicing applies a force in the direction of separating the upper surface electrode 2 from the insulating substrate 1, peeling 9 of the upper surface electrode 2 as shown in FIG. 8 may occur. There was a problem that the reliability was lowered due to instability.

  In addition, as a method for preventing the burr of the upper surface electrode 2 due to dicing, it is also known to partially reduce the film thickness of the portion to be diced in the upper surface electrode 2, but in this case, the upper surface electrode 2 is thin. Not only does this cause a problem of an increase in the resistance value of the electrode part, but it is disadvantageous in terms of cost, for example, it is necessary to perform printing twice in order to partially change the thickness.

  The present invention solves the above-described conventional problems, and can suppress the generation and peeling of burrs when the upper surface electrode formed of a thick film is cut by dicing, thereby improving the shape stability and connection reliability of the upper surface electrode. An object of the present invention is to provide a method of manufacturing an electronic component having excellent properties.

  In order to achieve the above object, the present invention has the following configuration.

  According to the first aspect of the present invention, a step of forming a top electrode made of a thick film on the upper surface of a sheet-like insulating substrate, and the insulating substrate is affixed to the fixing tape so that the upper surface side is in contact with the fixing tape. And a step of cutting the region including the upper surface electrode of the insulating substrate affixed to the fixing tape by dicing. According to this manufacturing method, the upper surface electrode formed on the upper surface of the insulating substrate is fixed. Since the insulating substrate is attached to the fixing tape so as to be in contact with the tape and the region including the upper surface electrode of the insulating substrate is diced, the upper surface electrode has a gap between the insulating substrate and the fixing tape. As a result, there is no space for burrs to grow.Therefore, no burrs are generated, and the force for peeling the top electrode from the insulating substrate is fixed. Since it is possible to suppress the flop, peeling of the upper electrode does not occur, as a result, and has a effect that can manufacture an electronic component shape stability and connection reliability of the upper electrode is superior.

  In the invention according to claim 2 of the present invention, in particular, a step of attaching the insulating substrate to a fixing tape after forming a back electrode having a thickness of 1 μm or less on the back surface of the insulating substrate, and cutting the back electrode by dicing. According to this manufacturing method, since the film thickness of the back electrode is reduced, no burr is generated even if the back electrode is attached to the side not fixed with the fixing tape. Thus, it is possible to easily obtain the top electrode and the back electrode without burrs or peeling on both surfaces of the insulating substrate.

  In the invention according to claim 3 of the present invention, in particular, the back electrode is formed by sputtering, and according to this manufacturing method, a thin back electrode can be easily formed and the thickness of the back electrode is reduced. Because it is thin, it does not generate burrs when it is applied to the side where the back electrode is not fixed with a fixing tape, so that it is possible to easily obtain a top electrode and a back electrode that are not burred or peeled off on both sides of the insulating substrate. It has a working effect.

  In the invention according to claim 4 of the present invention, in particular, the back electrode is formed by a resinate paste printing / firing method, and according to this manufacturing method, a thin back electrode can be easily formed, Since the back electrode is thin, burrs do not occur even if the back electrode is affixed to the side that is not fixed with a fixing tape. This allows the top and back electrodes to be free of burrs and peeling on both sides of the insulating substrate. It has the effect that it can be easily obtained.

  As described above, the method of manufacturing an electronic component according to the present invention includes a step of forming an upper electrode made of a thick film on the upper surface of a sheet-like insulating substrate, and the fixing tape so that the upper surface of the insulating substrate is in contact with the fixing tape. And a step of cutting the region including the upper electrode of the insulating substrate attached to the fixing tape by dicing, so that the upper electrode made of a thick film is fixed to the insulating substrate during dicing. Since there is no space for burr to grow, there is no space for burr to grow, and the force to peel off the top electrode from the insulating substrate is also suppressed by the fixing tape. As a result, it is possible to manufacture an electronic component having excellent shape stability and connection reliability of the upper surface electrode. It is intended to.

  Hereinafter, a method for manufacturing a chip-type electronic component according to an embodiment of the present invention will be described with reference to the drawings.

  1 (a)-(c), 2 (a)-(d), 3 (a)-(c), and 4 (a)-(d) are chip shapes according to an embodiment of the present invention. It is a manufacturing process figure which shows the manufacturing method of the chip resistor which is an example of an electronic component.

  First, as shown in FIG. 1A, an insulating sheet-like insulating substrate 11 made of a ceramic such as alumina is prepared. The insulating substrate 11 is provided with two or more through holes 12 in the periphery thereof. Then, an electrode paste mainly composed of silver is screen-printed on the upper surface of the sheet-like insulating substrate 11 and fired with a firing profile having a peak temperature of 850 ° C., thereby forming a plurality of upper surface electrodes 13 arranged in a grid pattern. . The through hole 12 and the upper surface electrode 13 of the insulating substrate 11 are always formed so as to have a fixed positional relationship, and a region where the upper surface electrode 13 is not formed is provided in the periphery of the sheet-like insulating substrate 11. deep. Here, the thickness of the upper surface electrode 13 is about 6 μm.

  Next, as shown in FIG. 1B, a resinate paste containing gold as a main component is screen-printed at a position facing the upper surface electrode 13 on the back surface of the sheet-like insulating substrate 11 with the through hole 12 as a reference. By baking with a baking profile having a peak temperature of 850 ° C., the back electrodes 14 having a thickness of 1 μm or less are arranged in a grid pattern. Since the resinate paste is suitable for forming a very thin film, the back electrode 14 of 1 μm or less can be easily formed by using this resinate paste. Further, the back electrode 14 is a base for plating, and since the film thickness is thin, there is no characteristic problem even if the resistance value is high.

  Next, as shown in FIG. 1C, a ruthenium oxide-based material is screen-printed so as to partially overlap the plurality of upper surface electrodes 13, that is, to be electrically connected to the plurality of upper surface electrodes 13. A plurality of resistors 15 are formed on the upper surface of the sheet-like insulating substrate 11 and fired with a firing profile having a peak temperature of 850 ° C., thereby making the resistors 15 stable. By forming the resistor 15, the resistor 15 and the upper surface electrode 13 are formed in a row, and a large number of these rows are formed in parallel.

  Next, as shown in FIG. 2A, a precoat glass 16 made of glass is formed by a screen printing method so as to cover the resistor 15, and fired with a firing profile having a peak temperature of 600 ° C. In order to adjust the resistance value of the resistor 15 between the plurality of upper surface electrodes 13 to a constant value, the resistor 15 is trimmed from above the precoat glass 16 by a laser trimming method. A trimming groove 17 is formed.

  Next, as shown in FIG. 2B, a protective film 18 mainly composed of an epoxy resin is formed by a screen printing method so as to cover the plurality of resistors 15 and the precoat glass 16, and a peak temperature of 200 ° C. The protective film 18 is made a stable film by curing with the curing profile of

  Next, as shown in the cross-sectional view of FIG. 2C, the sheet-like insulating substrate 11 is attached to the fixing tape 19 so that the surface on which the top electrode 13 is formed is in contact with the adhesive layer 19b. Here, the fixing tape 19 has a structure having an adhesive layer 19b which is cured by irradiation with ultraviolet light (hereinafter referred to as UV irradiation) on the surface of the base material 19a. Next, the sheet-like insulating substrate 11 is cut by a dicing method of cutting with a blade 20 that rotates at high speed so that the upper electrode 13 and the rear electrode 14 are cut in a direction perpendicular to the row of the resistors 15 and the upper electrode 13. First slit grooves 21 are formed in the first. The first slit groove 21 is formed at a predetermined position by positioning with reference to the through hole 12. In this case, since the upper surface electrode 13 is sandwiched between the insulating substrate 11 and the fixing tape 19, burrs are generated on the upper surface electrode 13 or the upper surface electrode 13 is peeled off even if the thickness is large. Never do. Further, since the back electrode 14 is formed very thin as 1 μm or less, no burr is generated on the back electrode 14 or the back electrode 14 is not peeled off.

  The adhesive layer 19b of the fixing tape 19 absorbs irregularities on the upper surface of the sheet-like insulating substrate 11 due to the formation of the upper surface electrode 13, the protective film 18 and the like, and at least the maximum of the print pattern. It is desirable to make it thicker than the thickness. If the thickness is set to be twice or more the maximum thickness of the printed pattern, the adhesion is further improved and a remarkable effect is obtained.

  Next, as shown in the sectional view of FIG. 2D, the adhesive layer 19b of the fixing tape 19 is cured by irradiating the fixing tape 19 with UV. At this time, in order to promote curing of the adhesive layer 19b, the surface on the adhesive layer 19b side is kept in a nitrogen atmosphere.

  Next, as shown in FIG. 3A, the sheet-like insulating substrate 11 is peeled off from the fixing tape 19.

  Next, as shown in the cross-sectional view of FIG. 3B, a thin film is formed from the upper surface side of the sheet-like insulating substrate 11 with the metal mask 22 masking the protective film 18 on the upper surface side of the sheet-like insulating substrate 11. Sputtering film 23 is formed on part of the upper surface of sheet-like insulating substrate 11 and the wall surface of first slit groove 21 by performing sputtering, which is a forming technique. The sputtered film 23 has a two-layer structure of a first layer made of chromium and a second layer made of a copper nickel alloy. The sputtered film 23 may be formed of other materials such as a single layer structure of a nickel chromium alloy.

  Next, as shown in the sectional view of FIG. 3C, the sheet-like insulating substrate 11 is attached to the fixing tape 19 with the surface on which the resistor 15 is formed facing upward, and the base material of the fixing tape 19 The adhesive layer 19b of the fixing tape 19 is cured by applying UV irradiation from the surface on the 19a side. At this time, in order to promote curing of the adhesive layer 19b, the surface on the adhesive layer 19b side is kept in a nitrogen atmosphere.

  Next, as shown in the cross-sectional view of FIG. 4A, the dicing method using the blade 20 that rotates at high speed with the through hole 12 as a reference, in a direction parallel to the row of the resistors 15 and the upper surface electrode 13, A second slit groove 24 is formed in the sheet-like insulating substrate 11 so as not to cut the resistor 15. When the second slit groove 24 is formed, as shown in FIG. 4B, the sheet-like insulating substrate 11 is separated into a plurality of separated substrates 11a.

  Next, the plurality of substrates 11a cut and separated by the formation of the first slit groove 21 and the second slit groove 24 are peeled off from the fixing tape 19, and as shown in FIG. The chip resistor main body 11b separated into pieces is obtained.

  Finally, as shown in FIG. 4D, a nickel plating layer, a solder plating layer, or a tin plating layer is formed on the exposed portion of the upper surface electrode 13, the back surface electrode 14, and the surface of the sputtered film 23 in the chip resistor body 11b. A plating layer 25 is formed to manufacture a chip resistor.

  FIG. 5 shows a relationship between the thickness of the back electrode 14 and the height of burrs generated by dicing. As can be seen from FIG. 5, when the thick film electrode material is cut by dicing with a space above, a burr 8 as shown in FIG. However, the height of the burr becomes smaller as the thickness of the back electrode 14 becomes thinner, and it can be seen that the burr hardly occurs at 1 μm or less. Further, the thinner the back electrode 14 is, the weaker the force that the back electrode 14 receives from the dicing blade. Therefore, peeling does not occur at the back electrode 14 having a thickness of 1 μm or less.

  In the above-described embodiment of the present invention, the case where the back electrode 14 is formed by printing and baking the resinate paste has been described. In particular, the formation of the back electrode 14 by the sputtering method is excellent in terms of dimensional accuracy, adhesion, and the like, and in this case, the same operation as that of the embodiment of the present invention is performed. An effect is obtained.

  Further, in the above-described embodiment of the present invention, the description has been given of the case where it is applied to the chip resistor having the resistor 15 as the functional element. However, in the electronic component having a functional element other than the resistor, for example, a coil or a capacitor. Also in this case, the same effect as that of the above-described embodiment of the present invention can be obtained.

  In the above-described embodiment of the present invention, the case where the sheet-like insulating substrate 11 is cut by the dicing method has been described. However, the present invention is also applied when a strip-shaped substrate is cut by the dicing method. Is applicable.

  In the embodiment of the present invention, the end face electrode is formed by the sputtered film 23 formed from the upper surface of the insulating substrate 11. However, sputtering is performed from the back surface of the insulating substrate 11, conductive resin or the like is used. The end face electrode may be formed by a coating method.

  Furthermore, in the above-described embodiment of the present invention, the sheet-like insulating substrate 11 is attached to the fixing tape 19 with the surface on which the upper surface electrode 13 is formed facing upward, and the second slit groove 24 is formed in this state. However, the direction in which the sheet-like insulating substrate 11 is affixed is reversed, that is, the sheet-like insulating substrate 11 is affixed to the fixing tape 19 with the surface on which the back electrode 14 is formed facing upward. Even when the slit grooves 24 are formed, the same effects as those of the embodiment of the present invention can be obtained.

  Furthermore, in the embodiment of the present invention, the case where the adhesive layer 19b is cured after the first slit groove 21 is formed has been described. However, the first slit groove 21 is cured after the adhesive layer 19b is cured. In this case, since the upper surface electrode 13 is cut by dicing in a state where the adhesive layer 19b is hard and hardly deformed, an effect of further suppressing the occurrence of burrs on the upper surface electrode 13 can be obtained. However, when dicing is performed in a state where the adhesive layer 19b is cured, wear of the blade 20 for dicing is promoted, so it is necessary to frequently replace the blade 20, which is disadvantageous in terms of manufacturing cost. .

  Further, the example in which the insulating substrate 11 is fixed and diced with the fixing tape 19 having the UV curable adhesive layer 19b has been described. However, even when other fixing tape such as a thermal firing type is used, the above-described embodiment of the present invention is performed. The same effect as that of the embodiment can be obtained.

  As described above, the chip-type electronic component according to the present invention can suppress the generation and peeling of burrs when the upper surface electrode formed with a thick film is cut by dicing, and the shape stability and connection reliability of the upper surface electrode. Is particularly useful when applied to minute electronic components.

(A)-(c) Manufacturing process figure which shows the manufacturing method of the chip resistor in one embodiment of this invention (A)-(d) Manufacturing process figure which shows the manufacturing method of the chip resistor (A)-(c) Manufacturing process figure which shows the manufacturing method of the chip resistor (A)-(d) Manufacturing process figure which shows the manufacturing method of the chip resistor Diagram showing the relationship between the thickness of the back electrode and the height of burrs generated by dicing (A)-(d) Manufacturing process figure which shows the manufacturing method of the conventional chip resistor Sectional drawing which shows the upper surface electrode burr | flash which generate | occur | produces in the manufacturing method of the same chip resistor Sectional drawing which shows peeling of the upper surface electrode which generate | occur | produces in the manufacturing method of the same chip resistor

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Insulating substrate 13 Upper surface electrode 14 Back surface electrode 15 Resistor 19 Fixed tape 19a Base material of fixed tape 19b Adhesive layer of fixed tape 20 Blade 21 First slit groove

Claims (4)

Forming a top electrode made of a thick film on the upper surface of the sheet-like insulating substrate; attaching the insulating substrate to the fixing tape so that the upper surface of the insulating substrate is in contact with the fixing tape; and insulating affixed to the fixing tape And a step of cutting a region including the upper surface electrode of the substrate by dicing. The electronic device according to claim 1, further comprising: a step of attaching the insulating substrate to a fixing tape after forming a back electrode having a thickness of 1 μm or less on the back surface of the sheet-like insulating substrate; and a step of cutting the back electrode by dicing. A manufacturing method for parts. The method of manufacturing an electronic component according to claim 2, wherein the back electrode is formed by sputtering. 3. The method of manufacturing an electronic component according to claim 2, wherein the back electrode is formed by a resin paste paste printing / firing method.

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