JP2007220860A - Manufacturing method of chip-type electronic part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip-type electronic part manufacturing method which is capable of reducing a thickness variation of the end face electrode of an electronic part. <P>SOLUTION: The manufacturing method comprises processes of cutting first slits 20 on the surface of a sheet-like substrate 11, filling the first slits 20 with conductive paste 22, and cutting off the conductive paste 22 by a second blade 24 smaller in width than the first slit 20 to form end face electrodes 25. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a chip-type electronic component employed in various electronic devices.

  Hereinafter, a conventional chip-type electronic component will be described with reference to the drawings.

  FIG. 6 shows a cross-sectional view of a chip resistor which is an example of a conventional chip-type electronic component. In FIG. 6, reference numeral 1 denotes an insulating substrate made of a ceramic such as alumina. A pair of upper surface electrodes 2 are provided at both left and right end portions of the upper surface. Reference numeral 3 denotes a resistor provided on the upper surface of the substrate 1 so that both ends thereof overlap the pair of upper surface electrodes 2. Reference numeral 4 denotes a pair of back surface electrodes provided on the back surface of the substrate 1 so as to face the pair of top surface electrodes 2. A protective layer 5 is provided so as to cover the entire surface of the resistor 3. Reference numeral 6 denotes a pair of end surface electrodes provided on both end surfaces of the substrate 1 so as to be electrically connected to the pair of upper surface electrodes 2 and the pair of back surface electrodes 4. Reference numeral 7 denotes a nickel plating layer provided on a part of the surface of the pair of upper surface electrodes 2, the surface of the pair of end surface electrodes 6, and the surface of the pair of back surface electrodes 4. Reference numeral 8 denotes a solder plating layer provided so as to cover the nickel plating layer 7.

  Next, a method for manufacturing a chip resistor, which is an example of a conventional chip-type electronic component, will be described with reference to the drawings.

  7 (a) to 7 (c) and FIGS. 8 (a) to 8 (c) show manufacturing process diagrams of a conventional chip resistor. FIGS. 7 (a) to 7 (c) and FIG. ) To (c), the manufacturing method will be described below.

  First, as shown in FIG. 7 (a), an insulating sheet-like substrate 1c made of porcelain such as alumina, in which primary divided grooves 1a and secondary divided grooves 1b are formed in advance on the upper surface and the rear surface, respectively, is prepared. A plurality of upper surface electrodes 2 are formed on the upper surface of the sheet-like substrate 1c by a screen printing method so as to straddle the primary division grooves 1a. Although not shown, a plurality of back electrodes 4 are also formed on the back surface of the sheet-like substrate 1c by screen printing so as to straddle the primary division grooves 1a.

  Next, as shown in FIG. 7B, a resistor 3 made of ruthenium oxide or the like is formed on the upper surface of the sheet-like substrate 1c so as to partially overlap the plurality of upper surface electrodes 2 by screen printing. The trimming groove 3a is formed in the resistor 3 with a laser or the like so that the total resistance value in the resistor 3 falls within a predetermined resistance value range.

  Next, as shown in FIG. 7C, a protective film 5 is formed by screen printing so as to cover the plurality of resistors 3.

  Next, by dividing at the primary dividing groove 1a shown in FIG. 7C, a strip-shaped substrate 1d as shown in FIG. 8A is formed, and both end surfaces of the strip-shaped substrate 1d are formed. Then, an end face electrode 6 is formed by applying a conductive paste so as to be electrically connected to the upper surface electrode 2 and the rear surface electrode 4 and curing at a high temperature.

  Next, by dividing at the portion of the secondary dividing groove 1b in the strip-shaped substrate 1d shown in FIG. 8A, an individual substrate 1e as shown in FIG. 8B is configured.

  Finally, as shown in FIG. 8C, a nickel plating layer 7 (not shown) is formed on a part of the surface of the upper electrode 2, the surface of the back electrode 4, and the surface of the end electrode 6, and then solder plating. By forming layer 8, a conventional chip resistor has been manufactured.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP-A-7-86003

  In the conventional chip resistor described above, when the end face electrode 6 is formed, it is formed by applying a conductive paste. However, it is difficult to stabilize the coating amount of the conductive paste, and the conductive paste As shown in FIG. 6, it is difficult to stabilize the shape of the end face electrode 6 because the center is applied in a semi-cylindrical shape. As a result, there has been a problem that the thickness of the end face electrode 6 varies and the length of the product becomes unstable. The variation in the thickness dimension of the end face electrode 6 is a serious problem in a minute chip-type electronic component that requires high dimensional accuracy.

  SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described conventional problems, and to provide a method for manufacturing a chip-type electronic component that can reduce variations in the thickness dimension of end face electrodes.

  In order to achieve the above object, the present invention has the following configuration.

  The invention according to claim 1 of the present invention includes a step of forming a slit in a sheet-like substrate, a step of filling a conductive paste inside the slit, and a blade that is narrower than the width of the slit. And cutting the conductive paste to form an end face electrode. According to this manufacturing method, the conductive paste is cut with a blade that is narrower than the width of the slit formed on the sheet-like substrate. Since the step of forming the end face electrode is provided, the conductive paste filled in the slit having the specified width is cut by the blade having the specified width, thereby uniformly forming the thickness of the end face electrode. Therefore, the length and dimension of the chip-type electronic component can be stabilized.

  The invention according to claim 2 of the present invention includes a step of forming an upper surface electrode and a functional element on an upper surface of a sheet-like substrate, and a step of forming a slit in the sheet-like substrate so as to cut the upper surface electrode. A step of attaching the sheet-like substrate to the fixing tape so that the upper surface side of the sheet-like substrate is in contact with the fixing tape; and a conductive paste in the vicinity of the slit and inside the slit from the back side of the sheet-like substrate. A step of filling, and a step of simultaneously forming a back electrode and an end surface electrode by cutting a conductive paste with a blade having a width smaller than the width of the slit. Since the step of cutting the conductive paste with a blade that is narrower than the width of the slit formed in step 1 and forming the back electrode and the end electrode at the same time, the thickness of the end electrode is made uniform. As a result, the shape and size of the chip-type electronic component can be stabilized, and the back surface electrode and the end surface electrode can be simultaneously formed, thereby simplifying the process and reducing the cost. It has the effect of being realizable.

  As described above, the method for manufacturing a chip-type electronic component according to the present invention includes a step of forming a slit in a sheet-like substrate, a step of filling a conductive paste inside the slit, and a width wider than the width of the slit. And a step of forming an end face electrode by cutting the conductive paste with a thin blade, the conductive paste filled in the slit with the specified width is cut with the blade with the specified width. As a result, the thickness of the end face electrode can be formed uniformly, so that an excellent effect that the shape dimension of the chip-type electronic component can be stabilized is exhibited.

  Hereinafter, a method for manufacturing a chip resistor, which is an example of a chip-type electronic component according to an embodiment of the present invention, will be described with reference to the drawings.

  1 (a) to (c), FIGS. 2 (a) to (c), FIGS. 3 (a) to (d), and FIGS. 4 (a) to (d) are chips in an embodiment of the present invention. It is a manufacturing-process figure which shows the manufacturing method of a resistor.

  First, as shown in FIG. 1A, an insulating sheet-like substrate 11 made of a ceramic such as baked alumina is prepared. Then, an electrode paste mainly composed of silver is screen-printed on the upper surface of the sheet-like substrate 11 and fired with a firing profile having a peak temperature of 850 ° C., thereby forming a plurality of upper surface electrodes 12 arranged in a grid pattern. A region where the upper surface electrode 12 is not formed is provided in the periphery of the sheet-like substrate 11.

  Next, as shown in FIG. 1B, a ruthenium oxide-based material is screen-printed so as to partially overlap the plurality of upper surface electrodes 12, that is, to be electrically connected to the plurality of upper surface electrodes 12. A plurality of resistors 13 are formed on the upper surface of the sheet-like substrate 11 and fired with a firing profile having a peak temperature of 850 ° C., thereby making the resistors 13 stable. By forming the resistor 13, the resistor 13 and the first upper surface electrode 12 are formed in a row, and a large number of these rows are formed in parallel. At the same time when the resistor 13 is formed, the alignment mark 14 is formed using the same material as the resistor 13.

  Next, as shown in FIG. 1C, a lead borosilicate glass-based glass layer 15 is formed on the upper surface of the sheet-like substrate 11 by a screen printing method so as to cover the resistor 13 between the upper surface electrodes 12. In order to make the glass layer 15 a stable film by baking with a baking profile having a peak temperature of 600 ° C., and to adjust the resistance value of the resistor 13 between the plurality of upper surface electrodes 12 to a constant value, a laser is used. The resistor 13 is trimmed by a trimming method to form a trimming groove 16.

  Next, as shown in FIG. 2A, a protective film 17 mainly composed of an epoxy resin is formed by a screen printing method so as to cover the plurality of resistors 13, and a curing profile having a peak temperature of 200 ° C. is formed. By curing, the protective film 17 is made a stable film.

  Next, as shown in FIG. 2B, the sheet-like substrate 11 is composed of a base material 18a and an adhesive layer 18b which is cured by irradiation with ultraviolet light (UV irradiation) with the surface on which the upper electrode 12 is formed facing up. Affixed to the first fixing tape 18.

  Next, as shown in FIG. 2C, a dicing method using a first blade 19 that rotates at high speed with reference to the alignment mark 14 in a direction orthogonal to the row of the resistors 13 and the upper surface electrodes 12. The first slit 20 that penetrates the sheet-like substrate 11 in the vertical direction is formed in the sheet-like substrate 11 so that the upper surface electrode 12 is cut. The first slit 20 is formed so as to leave the peripheral portion of the sheet-like substrate 11.

  Next, after the adhesive layer 18b of the first fixing tape 18 is cured to reduce the adhesive force, the sheet-like substrate 11 is pulled from the first fixing tape 18 as shown in FIG. Remove.

  Next, as shown in FIG. 3B, the sheet-like substrate 11 is attached to the second fixing tape 21 so that the surface of the sheet-like substrate 11 on which the upper surface electrode 12 is formed is in contact with the adhesive layer 21b. Here, the second fixing tape 21 is configured to have an adhesive layer 21b that is cured by irradiation with ultraviolet light (UV irradiation) on the surface of the substrate 21a.

  Next, as shown in FIG. 3C, the inside of the first slit 20 is filled with a resin-based conductive paste 22, and the back surface side in the vicinity of the first slit 20 in the sheet-like substrate 11. Also, the conductive paste 22 is applied and dried at a high temperature. The back side conductive paste 22 becomes the back side electrode 23.

  Next, as shown in FIG. 3D, the conductive paste 22 filled in the first slit 20 is cut by the second blade 24 that rotates at a high speed. At this time, the second blade 24 uses a narrower one than the width of the first slit 20, so that the conductive paste 22 remains on the inner wall of the first slit 20 with a constant thickness. Therefore, the back surface electrode 23 and the end surface electrode 25 are formed simultaneously.

  Next, as shown in FIG. 4A, a dicing method using a third blade 26 that rotates at high speed with the alignment mark 14 as a reference in a direction parallel to the row of the resistors 13 and the upper surface electrodes 12. The second slit 27 penetrating the sheet-like substrate 11 in the vertical direction is formed in the sheet-like substrate 11 so as not to cut the resistor 13. Then, by forming the second slits 27, the sheet-like substrate 11 is divided into pieces as shown in FIG. 4B and separated into a plurality of individual substrates 11a.

  Next, the plurality of individual substrates 11a cut and separated by the formation of the first slit 20 and the second slit 27 are peeled off from the second fixing tape 21, and FIG. A piece-like substrate 11a as shown in FIG. Here, the thickness of the end face electrode 25 is substantially uniform, and the surface thereof is flat.

  Finally, as shown in FIG. 4D, the first plating layer 28 made of nickel is formed on the surface of the top electrode 12, the surface of the end electrode 25, and the surface of the back electrode 23 (not shown) by barrel plating. (Not shown) and a second plating layer 29 made of tin are formed to manufacture the chip resistor in one embodiment of the present invention.

  FIG. 5 shows a cross-sectional view of a chip resistor according to an embodiment of the present invention manufactured by the above manufacturing method.

  In the embodiment of the present invention described above, the conductive paste 22 is cut with the second blade 24 that is narrower than the width of the first slit 20 formed in the sheet-like substrate 11, so that the end face electrode 25 is formed. Since the step of forming is provided, the conductive paste 22 filled in the first slit 20 having the specified width is cut by the second blade 24 having the specified width. Since the thickness of the chip resistor can be formed uniformly, the length dimensional accuracy of the chip resistor can be remarkably improved.

  In the above-described embodiment of the present invention, the conductive paste is formed in the vicinity of the first slit 20 formed in the sheet-like substrate 11 from the back side of the sheet-like substrate 11 and in the first slit 20. 22 and a step of cutting the conductive paste 22 with a second blade 24 narrower than the width of the first slit 20 to simultaneously form the back electrode 23 and the end electrode 25. The thickness of the end face electrode 25 can be formed uniformly, thereby stabilizing the shape dimension of the chip-type electronic component, and the back face electrode 23 and the end face electrode 25 are simultaneously formed, thereby providing a process. Is simplified, so that the cost can be reduced.

  In the above-described embodiment of the present invention, as an example of the chip-type electronic component, a chip resistor having a resistor 13 as a functional element has been described. However, the present invention is not limited to this chip resistor. The present invention can also be applied to an electronic component having a functional element other than a resistor, such as a coil or a capacitor. In this case, the same effect as that of the embodiment of the present invention can be obtained.

  In the embodiment of the present invention, the back surface electrode 23 and the end surface electrode 25 are formed simultaneously. However, the present invention is not limited to this, and the back surface electrode 23 and the end surface electrode 25 are formed separately. You can do it.

  In the method for manufacturing a chip-type electronic component according to the present invention, the conductive paste is filled in the slit, and the conductive paste is cut with a blade having a width smaller than the width of the slit, thereby obtaining a uniform thickness. The end face electrode can be formed, and is particularly useful when applied to a minute chip resistor that requires strict dimensional accuracy.

(A)-(c) Manufacturing process figure which shows the manufacturing method of the chip resistor which is an example of the chip-type electronic component in one embodiment of this invention (A)-(c) Manufacturing process figure which shows the manufacturing method of the chip resistor (A)-(d) Manufacturing process figure which shows the manufacturing method of the chip resistor (A)-(d) Manufacturing process figure which shows the manufacturing method of the chip resistor Cross section of the chip resistor Cross-sectional view of a chip resistor as an example of a conventional chip-type electronic component (A)-(c) Manufacturing process figure which shows the manufacturing method of the chip resistor (A)-(c) Manufacturing process figure which shows the manufacturing method of the chip resistor

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Sheet-shaped board | substrate 12 Upper surface electrode 13 Resistor 19 1st blade 20 1st slit 21 2nd fixing tape 22 Conductive paste 23 Back surface electrode 24 2nd blade 25 End surface electrode 26 3rd blade

Claims (2)

A step of forming a slit in a sheet-like substrate, a step of filling the inside of the slit with a conductive paste, and a step of forming an end face electrode by cutting the conductive paste with a blade narrower than the width of the slit A method of manufacturing a chip-type electronic component comprising: Forming a top electrode and a functional element on an upper surface of the sheet-like substrate; forming a slit in the sheet-like substrate so as to cut the upper electrode; and an upper surface side of the sheet-like substrate on the fixing tape A step of affixing a sheet-like substrate to a fixing tape so as to contact, a step of filling a conductive paste in the vicinity of the slit and inside the slit from the back side of the sheet-like substrate, and a width wider than the width of the slit A method of manufacturing a chip-type electronic component comprising a step of cutting a conductive paste with a thin blade and forming a back electrode and an end electrode simultaneously.

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