JP2005191405A - Manufacturing method of chip type electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the manufacturing method of a chip type electronic component which can suppress the deformation of its substrate caused by its stress generated when dicing it, and is excellent in a shape stability. <P>SOLUTION: The manufacturing method has a process for sticking on a UV tape 17 having an adhesive layer 17b a sheet-form substrate 11 provided with resistive substances (functional elements) 13, a process for hardening thereafter the adhesive layer 17b by irradiating the UV tape 17 by ultraviolet rays, and a process for cutting thereafter the sheet-form substrate 11 by a dicing working method. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a chip-type electronic component, and more particularly to a method for manufacturing a minute chip-type electronic component.

  Hereinafter, a conventional method for manufacturing a chip-type electronic component will be described with reference to the drawings.

  10 (a) to 10 (d) show manufacturing process diagrams of a chip resistor which is one of the conventional chip-type electronic components. Based on FIGS. 10 (a) to 10 (d), the manufacturing is performed. The method will be described below.

  First, as shown in FIG. 10A, a plurality of upper surface electrodes 2 and a plurality of resistors 3 are formed in a regularly aligned grid pattern on the upper surface of an insulating substrate 1 such as alumina. In this case, both ends of the resistor 3 are electrically connected to the upper surface electrode 2.

  Next, as shown in FIG. 10B, a cutting groove 4 is formed by dicing on the insulating substrate 1 so that the upper surface electrode 2 is cut in a direction orthogonal to the row of the upper surface electrode 2 and the resistor 3. To do. In this case, the cutting grooves 4 are formed so as not to completely traverse the insulating substrate 1 so that the insulating substrate 1 is not divided.

  Next, as shown in the cross-sectional view of FIG. 10C, a substantially U-shaped end face electrode film 5 is formed in the vicinity of the cut end face of the upper surface electrode 2 and the cut groove 4 and the cut groove 4 on the back surface of the insulating substrate 1. Are formed by sputtering and plating techniques.

  Finally, as shown in FIG. 10 (d), an insulating substrate 1 on which an end face electrode film 5 is formed is pasted on a base film (not shown), and dicing is performed in parallel with the row composed of the upper surface electrode 2 and the resistor 3. A conventional chip resistor has been manufactured by forming the groove 6 and dividing it into pieces.

  In addition, when forming the said dicing groove | channel 6 in the insulated substrate 1, the base film (not shown) which affixes the insulated substrate 1 generally provided the acrylic adhesive layer on the single side | surface of resin-made base materials, such as polyolefin. A UV tape is used, and this UV tape has an adhesive force that suddenly decreases when exposed to ultraviolet light. When forming the dicing groove 6, in order to prevent the substrate in the form of individual pieces from being taken off from the UV tape and scattered, the UV tape should be in an adhesive state without being exposed to ultraviolet light, and When removing a dicing substrate from a UV tape by forming a dicing groove 6, UV light is applied to the UV tape to reduce the adhesive force, thereby facilitating the separation of the individual substrate. It was.

  Moreover, as a method for holding the insulating substrate at the time of dicing, in addition to the above-described method, a method of attaching to a glass or the like with a liquid adhesive such as wax is known. In this case, the adhesive is removed. Therefore, it is disadvantageous in terms of cost and reliability as compared with the case of using a UV tape, because it takes a great deal of cost for the cleaning process and it is difficult to completely remove it.

As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
Japanese Patent Laid-Open No. 5-267025

  In the conventional chip-type electronic component described above, the insulating substrate 1 is held by an acrylic soft adhesive layer in UV tape, and the dicing grooves 6 are formed in the insulating substrate 1 by dicing in this holding state. The insulating substrate 1 is likely to be deformed by stress during dicing, and as a result, there is a problem that the outer shape of the insulating substrate 1 is not stable. This problem has been a cause of a decrease in yield, an increase in manufacturing cost due to a decrease in equipment operation, a decrease in mounting rate, and the like, especially for a minute electronic component that requires a high dimensional accuracy.

  SUMMARY OF THE INVENTION The present invention solves the above-described conventional problems, and an object thereof is to provide a method for manufacturing a chip-type electronic component that can suppress deformation of a substrate due to stress during dicing and is excellent in shape stability. It is.

  In order to achieve the above object, the present invention has the following configuration.

  In the invention according to claim 1 of the present invention, a sheet-like or strip-like substrate provided with a functional element is attached to a UV tape having an adhesive layer, and then the UV tape is irradiated with ultraviolet light to form an adhesive layer. It is provided with a step of curing and then cutting the substrate by a dicing method. According to this manufacturing method, when the substrate is cut by the dicing method, the adhesive layer of the UV tape is in a cured state. Therefore, the deformation of the substrate due to stress during dicing can be suppressed, and as a result, a chip-type electronic component having excellent shape stability can be produced.

  The invention according to claim 2 of the present invention is a substrate in which the arithmetic average height of the surface roughness is in the range of 0.05 μm to 1.00 μm. Since the adhesive layer is cured with the adhesive layer of the UV tape biting into the minute irregularities on the surface of the substrate, the adhesive force in the lateral direction can be maintained even when the adhesive layer is cured by ultraviolet light. As a result, since the chip-type electronic component is not scattered from the UV tape during dicing, the chip-type electronic component can be manufactured with a high yield.

  According to the third aspect of the present invention, the thickness of the adhesive layer of the UV tape is set in the range of 0.01 mm to 0.05 mm. According to this manufacturing method, local protrusions are formed on the substrate. Even if there is a dent, the adhesive layer of the UV tape is deformed and adheres to the substrate, so that the chip-type electronic component does not scatter from the UV tape during dicing, and as a result, the chip-type electronic component scatters. Thus, it is possible to prevent a decrease in yield due to the above, and to suppress the deformation of the substrate during dicing.

  In the invention according to claim 4 of the present invention, in particular, the thickness of the adhesive layer of the UV tape is set in the range of 0.02 mm to 0.03 mm. According to this manufacturing method, the substrate is localized on the substrate. Even if there are protrusions or dents, the adhesive layer of the UV tape is more easily deformed and reliably adheres to the substrate, so that the chip-type electronic components do not scatter from the UV tape during dicing, and as a result In addition, it is possible to surely prevent a decrease in yield due to scattering of chip-type electronic components, and to suppress the deformation of the substrate during dicing.

  As described above, in the method for manufacturing a chip-type electronic component according to the present invention, after a sheet-like or strip-like substrate provided with a functional element is attached to a UV tape having an adhesive layer, the UV tape is irradiated with ultraviolet light. The adhesive layer is cured, and then the substrate is cut by the dicing method. Therefore, when the substrate is cut by the dicing method, the adhesive layer of the UV tape is in a cured state. Thus, since the deformation of the substrate due to the stress during dicing can be suppressed, a chip-type electronic component having excellent shape stability can be produced.

  Hereinafter, a method for manufacturing a chip-type electronic component according to an embodiment of the present invention will be described with reference to the drawings.

  FIGS. 1A to 1D, 2A to 2D, and 3A to 3F show a chip resistor as an example of a chip-type electronic component in an embodiment of the present invention. It is a manufacturing process figure which shows a manufacturing method.

  Hereinafter, with reference to FIGS. 1A to 1C, FIGS. 2A to 2D, and FIGS. 3A to 3F, a chip resistor manufacturing method according to an embodiment of the present invention will be described. While explaining.

  First, as shown in FIG. 1 (a), a ceramic such as baked alumina having an arithmetic average height of surface roughness defined by JIS (Japanese Industrial Standard) in the range of 0.05 μm to 1.00 μm. An insulative sheet-like substrate 11 is prepared. A gold resinate paste containing gold is screen-printed on the upper surface of the sheet-like substrate 11 and fired with a firing profile having a peak temperature of 850 ° C., thereby forming a plurality of upper surface electrodes 12 arranged in a grid. A region where the upper surface electrode 12 is not formed is provided in the periphery of the sheet-like substrate 11.

  Next, as shown in FIG. 1B, a ruthenium oxide-based material is screen-printed so as to partially overlap the plurality of upper surface electrodes 12, that is, to be electrically connected to the plurality of upper surface electrodes 12. A plurality of resistors 13 are formed on the upper surface of the sheet-like substrate 11 and fired with a firing profile having a peak temperature of 850 ° C., thereby making the resistors 13 stable. By forming the resistor 13, the resistor 13 and the upper surface electrode 12 are formed in a line, and a large number of these lines are formed in parallel. At the same time when the resistor 13 is formed, the alignment mark 14 is formed using the same material as the resistor 13.

  Next, as shown in FIG.1 (c), precoat glass (not shown) is formed by the screen-printing method so that the resistor 13 may be covered, and it prebakes by the baking profile with a peak temperature of 600 degreeC. After making a stable film (not shown), in order to adjust the resistance value of the resistor 13 between the plurality of upper surface electrodes 12 to a constant value, a laser trimming method is used to form a pre-coated glass (not shown). The trimming groove 15 is formed by trimming the resistor 13.

  Next, as shown in FIG. 1D, a protective film 16 mainly composed of an epoxy resin is formed by a screen printing method so as to cover the plurality of resistors 13, and a curing profile with a peak temperature of 200 ° C. is formed. By hardening, the protective film 16 is made a stable film.

  Next, as shown in the cross-sectional view of FIG. 2A, a sheet-like substrate 11 is placed on a UV tape 17 having an acrylic adhesive layer 17b on a base material 17a with the surface on which the top electrode 12 is formed facing up. A sheet shape is formed so that the upper surface electrode 9 is cut in a direction perpendicular to the row of the resistor 13 and the upper surface electrode 12 by a dicing method using a blade 18 that rotates at a high speed with reference to the alignment mark 14. A first slit groove 19 is formed on the substrate 11. The first slit groove 19 is formed leaving the periphery of the sheet-like substrate 11, and the groove width is about 0.5 to 2.0 times the thickness of the sheet-like substrate 11.

  Next, as shown in the cross-sectional view of FIG. 2B, the adhesive layer 17b is cured by applying ultraviolet light from the surface of the UV tape 17 on the substrate 17a side. At this time, in order to promote the curing of the adhesive layer 17b, the surface on the adhesive layer 17b side is kept in a nitrogen atmosphere.

  Next, as shown in FIG. 2C, the sheet-like substrate 11 is peeled off from the UV tape 17.

  Next, as shown in the cross-sectional view of FIG. 2D, the sheet-like substrate 11 is masked with the metal mask 20 at the center between the first slit grooves 19 on the back side of the sheet-like substrate 11. The first sputtered film 21 is formed on a part of the back surface of the sheet-like substrate 11 and the wall surface of the first slit groove 19 by performing sputtering, which is a thin film forming technique, from the back surface side. The first sputtered film 21 has a two-layer structure of a first layer made of chromium and a second layer made of a copper nickel alloy. The first sputtered film 21 located on the wall surface of the first slit groove 19 constitutes the end face electrode 22, and its film thickness becomes thinner as it approaches the upper surface of the sheet-like substrate 11, The first slit groove 19 is thinner as the groove width is smaller than the thickness of the sheet-like substrate 11.

  Next, as shown in the cross-sectional view of FIG. 3A, in the state where the central portion between the first slit grooves 19 on the upper surface side of the sheet-like substrate 11 is masked by the metal mask 23, By performing sputtering, which is a thin film forming technique, from the upper surface side, the second sputtered film 24 is formed on a part of the upper surface of the sheet-like substrate 11 and the wall surface of the first slit groove 19. The second sputtered film 24 also has a two-layer structure of a first layer made of chromium and a second layer made of a copper nickel alloy. Note that the second sputtered film 24 positioned on the end face of the first slit groove 19 is electrically connected to a portion of the first sputtered film 21 that constitutes the end face electrode 22. The second sputtered film 24 is formed so as to cover the exposed part of the upper surface electrode 12 and a part of the protective film 16.

  The order of forming the first sputtered film 21 shown in FIG. 2D and the second sputtered film 24 shown in FIG. 3A is limited to the order of the embodiment of the present invention. The second sputtered film 24 shown in FIG. 3A is formed first, and then the first sputtered film 21 shown in FIG. 2D is formed in the reverse order. However, there is no particular problem. Each of the first sputtered film 21 and the second sputtered film 24 has a two-layer structure of a first layer made of chromium and a second layer made of copper-nickel alloy. It may be formed of a single layer structure of an alloy.

  Next, as shown in the cross-sectional view of FIG. 3B, a UV tape 17 having an acrylic adhesive layer 17b having a thickness of 0.03 mm on a transparent substrate 17a having a thickness of 0.14 mm is used. Then, the adhesive layer 17b is cured by attaching the sheet-like substrate 11 with the surface on which the upper electrode 12 is formed facing upward, and applying ultraviolet light from the surface of the UV tape 17 on the base material 17a side. At this time, in order to promote the curing of the adhesive layer 17b, the surface on the adhesive layer 17b side is kept in a nitrogen atmosphere.

  Next, as shown in the cross-sectional view of FIG. 3C, a dicing method using a blade 25 rotating at high speed with reference to the alignment mark 14 as a reference in a direction parallel to the row of resistors 13 and the upper surface electrode 12. The second slit groove 26 is formed in the sheet-like substrate 11 without cutting the resistor 13. When the second slit groove 26 is formed, it is separated into a plurality of separated substrates 11a as shown in FIG.

  Next, from the UV tape 17 shown in FIG. 3 (d), the plurality of substrates 11a cut and separated by the formation of the first slit groove 19 and the second slit groove 26 are peeled off, and FIG. A chip resistor main body 11b separated as shown in FIG.

  Finally, as shown in FIG. 3F, a nickel plating layer and a solder are formed on the surface of the first sputtered film 21, the surface of the end face electrode 22 and the surface of the second sputtered film 24 in the chip resistor body 11b. A plating layer 27 made of a plating layer or a tin plating layer is formed to manufacture a chip resistor.

  FIG. 4 is a cross-sectional view showing a close contact state between the sheet-like substrate 11 and the adhesive layer 17 b of the UV tape 17. In one embodiment of the present invention, since the sheet-like substrate 11 has an arithmetic average height of surface roughness in the range of 0.05 μm to 1.00 μm, the adhesive layer 17 b is a sheet-like substrate. In this state, the pressure-sensitive adhesive layer 17b is cured by ultraviolet light, so that the pressure-sensitive adhesive layer 17b remains on the surface of the sheet-like substrate 11 even after the curing. Due to the anchoring effect on the unevenness, it is possible to maintain the fixing force particularly in the lateral pushing direction. It will not be scattered. On the other hand, since the adhesive strength of the adhesive layer 17b of the UV tape 17 is reduced by curing with ultraviolet light, when the separated substrate 11a is peeled off from the UV tape 17, it is perpendicular to the UV tape 17. By applying force, the separated substrate 11 a can be easily peeled off from the UV tape 17.

  For example, when a substrate with excellent surface smoothness such as a glass substrate or a silicon wafer is attached to UV tape and dicing is performed after the adhesive layer of UV tape is cured by ultraviolet light, the anchor effect between the UV tape and the substrate is almost Since it does not work, the substrate is scattered by the stress during dicing, and therefore the surface roughness of the substrate is very important.

  When the adhesive layer 17b of the UV tape 17 is not cured, as shown in FIG. 5, the sheet-like substrate 11 sinks into the adhesive layer 17b of the UV tape 17 due to the stress received from the blade 25 for dicing. In addition, dicing is performed with the cut portion escaping sideways. When such dicing is performed, as shown in FIG. 6, the separated substrate 11a has a trapezoidal shape whose back side is enlarged. It becomes a shape and burrs are likely to occur. This phenomenon is particularly likely to occur in a small chip-type electronic component having a small contact area with the UV tape 17.

  Small chip-type electronic components are required to have high dimensional accuracy in order to achieve narrow adjacent mounting. For example, a tolerance of 0.02 mm is required for a size of 0.4 mm in length and 0.2 mm in width. Has been. However, when the sheet-like substrate 11 made of alumina having a thickness of 0.1 mm is diced without curing the adhesive layer 17b of the UV tape 17, the upper surface side of the separated substrate 11a is 0.5 mm or more than the back surface side. Due to the small trapezoidal shape, the dimensional accuracy is very poor, and it is easy to cause poor adsorption during mounting. On the other hand, when the sheet-like substrate 11 is diced with the adhesive layer 17b of the UV tape 17 cured, as shown in FIG. 7, the dimensional difference between the upper surface side and the back surface side of the separated substrate 11a is zero. Since it becomes about 0.01 mm and can be cut with a cross section close to a rectangle, high dimensional accuracy and good mounting properties can be realized.

  Further, the sheet-like substrate 11 made of alumina has local protrusions and depressions having a height of about 0.01 mm to 0.05 mm on the surface, apart from the surface roughness, the protrusions and depressions. In order for the adhesive layer 17b of the UV tape 17 and the sheet-like substrate 11 to be in close contact with each other, the thickness of the adhesive layer 17b needs to be thicker than the height of the protrusions or dents. 8 and 9 are cross-sectional views showing a state in which the sheet-like substrate 11 having the protrusions 28 is attached to the adhesive layer 17b of the UV tape 17, and FIG. 8 shows that the thickness of the adhesive layer 17b is higher than the height of the protrusions 28. On the other hand, FIG. 9 shows a case where the thickness of the adhesive layer 17b is thicker than the height of the protrusion 28. As shown in FIG. 8, when the thickness of the adhesive layer 17b is thinner than the height of the protrusion 28, the sheet-like substrate 11 is separated from the adhesive layer 17b at the periphery of the protrusion 28. The converted substrate 11a is scattered. On the other hand, as shown in FIG. 9, if the thickness of the adhesive layer 17b is made larger than the height of the protrusion 28, scattering of the separated substrate 11a when cut by dicing can be suppressed.

  As described above, the thickness of the adhesive layer 17b of the UV tape 17 needs to be at least 0.01 mm, preferably 0.02 mm. However, if the thickness of the adhesive layer 17b becomes too thick, even if the adhesive layer 17b is diced after being cured with ultraviolet light, deformation and burrs of the separated substrate 11a are likely to be large. Therefore, the thickness of the adhesive layer 17b should be as thin as possible so that there is no problem with the adhesion with the sheet-like substrate 11, and the thickness of 0.05 mm or more is not so preferable. Ideally, a sheet-like substrate 11 having a surface protrusion or dent height of 0.02 mm or less is attached to the UV tape 17 having a thickness of the adhesive layer 17b of 0.02 mm to 0.03 mm. Is desirable from the viewpoint of balancing the yield.

  In the above-described embodiment of the present invention, the description has been given of the case where the functional element is applied to a chip resistor having a resistor. However, a chip-type electronic component having a functional element other than the resistor, for example, a coil or a capacitor. In this case, the same effect as that of the embodiment of the present invention can be obtained.

  In the above-described embodiment of the present invention, the case where the sheet-like substrate 11 is cut by the dicing method has been described. However, the present invention also applies when the strip-like substrate is cut by the dicing method. Applicable.

  In the embodiment of the present invention, the end face electrode 22 is formed by the first sputtered film 21 and the second sputtered film 24, but the end face electrode is formed by a method of applying a conductive resin or the like. May be formed.

  Furthermore, in the above-described embodiment of the present invention, the case where the sheet-like substrate 11 is attached to the UV tape 17 provided with the adhesive layer 17b with the surface on which the upper surface electrode 12 is formed is described. Even if it sticks in the direction, the same effect as the one embodiment of the present invention can be obtained.

  Furthermore, in the embodiment of the present invention, the case where the adhesive layer 17b is cured after the first slit groove 19 is formed has been described. However, the first slit groove 19 is cured after the adhesive layer 17b is cured. In this case, the same effect as that of the embodiment of the present invention can be obtained. However, when dicing is performed in a state where the adhesive layer 17b is cured, wear of the blade for dicing is promoted, so that it is not always necessary to form the first slit groove 19 having a relatively large contact area during dicing. There is no.

  As described above, the chip-type electronic component of the present invention can suppress the deformation of the substrate due to stress during dicing and has excellent shape stability. It will be useful.

(A)-(d) Manufacturing process figure which shows the manufacturing method of the chip resistor in one embodiment of this invention (A)-(d) Manufacturing process figure which shows the manufacturing method of the chip resistor (A)-(f) Manufacturing process figure which shows the manufacturing method of the chip resistor Sectional drawing which shows the contact | adherence state of the sheet-like board | substrate and adhesion layer in the chip resistor Sectional drawing which shows the state at the time of dicing a sheet-like board | substrate without hardening the adhesion layer in the chip resistor Sectional drawing which shows the shape after dicing in FIG. Sectional drawing which shows the shape after the dicing of the chip resistor in one embodiment of this invention Sectional drawing which shows the state which affixed the board | substrate which has a local processus | protrusion and a dent on UV tape which has an adhesive layer whose thickness is thinner than a processus | protrusion and a dent. Sectional drawing which shows the state which affixed the board | substrate which has a local processus | protrusion and a dent on UV tape which has an adhesion layer thicker than a processus | protrusion and a dent. (A)-(d) Manufacturing process figure which shows the manufacturing method of the conventional chip resistor

Explanation of symbols

11 Sheet-like substrate 13 Resistor (functional element)
17 UV tape 17b Adhesive layer 18 Blade 19 First slit groove 25 Blade 26 Second slit groove

Claims (4)

After pasting a sheet-like or strip-like substrate provided with functional elements on a UV tape having an adhesive layer, the UV tape is irradiated with ultraviolet light to cure the adhesive layer, and then the substrate is cut by a dicing method. A method for manufacturing a chip-type electronic component comprising the step of: 2. The method for manufacturing a chip-type electronic component according to claim 1, wherein the substrate has an arithmetic average height of surface roughness in the range of 0.05 [mu] m to 1.00 [mu] m. The method for manufacturing a chip-type electronic component according to claim 1, wherein the thickness of the adhesive layer of the UV tape is set in a range of 0.01 mm to 0.05 mm. The method for manufacturing a chip-type electronic component according to claim 1, wherein the thickness of the adhesive layer of the UV tape is set in a range of 0.02 mm to 0.03 mm.

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