JPH09139555A - Ceramic substrate and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate wherein conductive paste for forming electrodes does not ooze out into division trenches, and electrodes are not short-circuited, and a manufacturing equipment of the substrate. SOLUTION: In order to take out many substrates of chip electronic components like chip resistors, a plurality of division trenches 28a, 28b are formed in the length and breadth directions, in a ceramic substrate 32. A plurality of pairs of electrodes 6 are formed on the ceramic board 32. In the division trench 28a in the direction between each pair of electrodes, an intercepting part 30 wherein the division trench 28a is partly shallowed in the vicinity of the electrode 6 is formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic substrate for forming an insulating substrate for a so-called chip-shaped electronic component and a manufacturing apparatus therefor.

[0002]

2. Description of the Related Art First, a chip resistor 1 whose insulating substrate 2 is made of ceramic is shown in FIG. In the method for manufacturing the chip resistor 1, a die having a large number of orthogonal blades at regular intervals is pressed against a green ceramic sheet before firing to form orthogonal division grooves 12a and 12b. Then, by firing this green sheet,
The large-sized ceramic substrate 14 shown in FIG. next,
A plurality of rows of the first electrodes 6 are printed with a metal glaze paste or the like at predetermined intervals across the dividing groove 12a and fired again. Similarly, the second electrode 7, the resistor 3 and the glass coat 11 are sequentially printed and fired. Are repeatedly formed. After that, the ceramic substrate 14 is divided into rows by one of the division grooves 12a, and the third electrode 8 is applied so as to cover the division end face and fired. Further, Ni plating 9 and solder plating 10 are sequentially applied to the surface of this electrode, and a protective coating 1 is applied to the surface of the resistor 3.
Apply 2. Finally, the chip grooves 1 are individually divided by the dividing grooves 12b to complete the independent chip resistor 1.

[0003]

In the case of the above-mentioned conventional technique, when the first electrode 6 and the third electrode 8 are printed, the dividing groove 1 is formed.
The conductive paste oozes out and extends into the dividing groove 12b orthogonal to 2a due to a capillary phenomenon, and the first electrodes 6 at both ends come into contact with each other in the dividing groove 12b to be in a conductive state. was there. This is a problem in which the smaller the chip size, the more likely it is to appear.

The present invention has been made in view of the above-mentioned problems of the prior art, and a ceramic substrate and a conductive substrate which form an electrode do not ooze out into the dividing groove and the electrode is not short-circuited. An object is to provide a manufacturing apparatus.

[0005]

SUMMARY OF THE INVENTION In order to obtain a large number of substrates for chip electronic parts such as chip resistors,
A ceramic substrate in which a plurality of dividing grooves are formed in each of the vertical and horizontal directions, and the dividing grooves are formed in the vicinity of the electrodes in the dividing grooves in a pair of electrodes of a plurality of pairs of electrodes provided in the ceramic substrate. The ceramic substrate is provided with a cutoff portion that is made shallower or narrower.

Further, the present invention is an apparatus for manufacturing a ceramic substrate for forming a ceramic substrate having a plurality of dividing grooves for picking up a large number of substrates for a chip electronic component, wherein the surface of the ceramic substrate is on a flat plate. A plurality of ridges for forming dividing grooves are provided vertically and horizontally, and a part of the ridges for forming dividing grooves in the direction between each pair of electrodes of the plurality of pairs of electrodes provided on the ceramic substrate is It is an apparatus for manufacturing a ceramic substrate provided with a die cut out in the depth direction or the width direction.

In the ceramic substrate of the present invention, when the electrodes are printed on the ceramic substrate with the conductive paste, even if the conductive paste oozes into the dividing grooves near the electrodes, the conductive paste exuded is kept in the dividing grooves. There is no short-circuit because it is blocked by the shut-off part of.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. The ceramic substrate manufacturing apparatus of this embodiment has a flat plate-shaped mold 20 shown in FIG. The mold 20 is made of metal, and is provided with blades 24a and 24b, which are a plurality of ridges orthogonal to one surface of a flat plate 22. The cross-sectional shape of the blades 24a, 24b is a triangular shape with a sharp tip and a height of about 0.25 mm. Blade 2
4a has a long side of about 1 mm and a short side of about 0.5 mm from the point of intersection with the blade 24b to the point of intersection, and two notches 26 are provided therebetween. The cutout 26 is
0.2 to 0.4 m from the intersection of the blades 24a and 24b
It is located in the vicinity of the electrode formation portion at a position of m and is provided with a width of about 0.1 mm.

Next, a method of manufacturing a chip resistor using the mold 20 will be described with reference to FIGS. First, a so-called doctor blade method is used to prepare a ceramic green sheet before firing. This green sheet is produced by a known method. A powder of a raw material is mixed with a solvent and the like, a binder is added and further kneaded, and this is coated on a predetermined carrier tape with a constant thickness and dried to obtain a green sheet. make. This green sheet is pressed by the mold 20 to form the dividing grooves 28a and 28b which are orthogonal to each other. In the dividing groove 28a, between the intersecting points with the dividing groove 28b and between the intersecting points, there are two blocking portions 3 in which the dividing groove 28a is not formed.
0 is provided. The blocking portion 30 is formed by the cutout portion 26 of the mold 20, and is formed by filling the dividing groove 28a with a width of 0.1 mm at a position of 0.2 to 0.4 mm from the intersection of the dividing grooves 28a and 28b. . Then, the dividing groove 28
The green sheet on which a and 28b are formed is fired at a predetermined temperature to become the ceramic substrate 32.

The dividing groove 2 is formed on the ceramic substrate 32.
Ag-P which becomes the first electrode 6 at a predetermined interval with 8b in between.
A plurality of rows of conductive paste such as metal glaze paste such as t or Ag-resin paste is printed. At this time, the conductive paste exudes into the dividing groove 28a orthogonal to the first electrode 6 by the capillary phenomenon, but the blocking portion 30 in the vicinity thereof is present.
Can be blocked by. Then, it is baked at a predetermined temperature to form the first electrode 6. Similarly, the second electrode 7 is printed on the back surface of the ceramic substrate 32 at a position facing the first electrode 6 and fired. Further, a large number of resistors 3 are formed in a matrix on the ceramic substrate 36 between the first electrodes 6 and fired. After that, the surface of the resistor 3 is coated with a protective coat 11 such as glass or resin and baked at an average of 680 ° C.

After that, the ceramic substrate 32 is divided into the dividing grooves 28.
It is divided into rows along b, and the third electrode 8 of a conductive paste of Ag-resin system or the like is applied to the divided surface to a thickness of about 20 μm and cured at a temperature of about 200 ° C. And
Ni plating and solder plating are sequentially applied. Finally, the ceramic substrate 32 is individually divided along the dividing grooves 28a,
It becomes an independent chip resistor.

In the ceramic substrate 32 of this embodiment, a blocking portion 30 for the dividing groove 28a is provided in the vicinity of an electrode to be printed, and a conductive paste for printing the first electrode 6 and the third electrode 8 is formed in the dividing groove. Even if it oozes out to 28a, the blocking portion 30
Since the first electrodes 6 on both sides are short-circuited by the above, it is possible to prevent a defect that the first electrodes 6 on both sides are short-circuited. In addition, since the blocking portion 30 is provided in a part of a narrow range, and the portion other than the blocking portion 30 is provided with the dividing groove 28a having a sufficient length, it can be easily divided. Furthermore, the blade 24 of the mold 20
It is easy and cost-free because only part of a is cut off.

Next, a second embodiment of the present invention will be described with reference to FIG.
It will be described based on. Here, the same members as those in the above embodiment are denoted by the same reference numerals, and description thereof will be omitted. In the mold 32 of this embodiment, the blade 24a is provided with two notches 34 between the points of intersection with the blade 24b. The notch 34 is provided at a position of 0.2 to 0.4 mm from the intersection of the blade 24a and the blade 24b, and has an inverted triangle when the blade 24a is viewed horizontally horizontally, and one lower vertex is It has reached the flat plate surface. With the mold 32 of this embodiment, the same effect as that of the above embodiment can be obtained.

The present invention is not limited to the above-mentioned respective embodiments, and for example, the cutout portion 2 of the molds 20 and 32.
The recesses 6 and 34 may be recesses that do not reach the surface of the flat plate 22, or may be notched in the width direction so as to narrow the width of the dividing groove to be formed. Therefore, the blocking unit 34
It suffices as long as it is possible to form, in the dividing groove of the ceramic substrate, a blocking portion having a shape capable of reliably blocking the conductive paste such as the metal glaze paste.

[0015]

The ceramic substrate and the manufacturing apparatus for the same according to the present invention do not cause a defect in which the electrodes are short-circuited with each other when the electrodes are formed, and the substrate can be easily divided. In particular, even in the case of a small chip electronic component having a short distance between electrodes, there is no short circuit between the electrodes.

[Brief description of the drawings]

FIG. 1 is a partial perspective view showing a mold according to a first embodiment of the present invention.

FIG. 2 is a partial perspective view showing the ceramic substrate of the first embodiment.

FIG. 3 is a perspective view showing a state of one manufacturing process of the chip resistor of the first embodiment.

FIG. 4 is a perspective view showing a mold according to a second embodiment of the present invention.

FIG. 5 is a perspective view showing a conventional ceramic substrate.

FIG. 6 is a cross-sectional view showing a prior art chip resistor.

[Explanation of symbols]

 20 mold 22 flat plate 24a, 24b blade 26 notch 32 ceramic substrate 28a, 28b dividing groove 30 blocking part

Claims (2)

[Claims] 1. A ceramic substrate in which a plurality of dividing grooves are formed vertically and horizontally in order to obtain a large number of substrates for a chip electronic component, and between a pair of electrodes of a plurality of electrodes provided on the ceramic substrate. A ceramic substrate, characterized in that, in the dividing groove in the direction, a blocking portion is provided in the vicinity of the electrode in which the dividing groove is partially made small. 2. A ceramic substrate manufacturing apparatus for forming a ceramic substrate having a plurality of dividing grooves for picking up a large number of substrates for a chip electronic component, wherein the dividing grooves are formed on the surface of the ceramic substrate on a flat plate. A plurality of ridges are provided vertically and horizontally, and a part of the ridges that form the dividing grooves in the direction between each pair of electrodes of the plurality of pairs of electrodes provided on the ceramic substrate is cut out. Characteristic ceramic substrate manufacturing equipment.