JP5135745B2 - Chip component and manufacturing method thereof - Google Patents

Description

  The present invention relates to a chip component, in particular, a minute jumper chip component and a manufacturing method thereof.

  A conventional chip component manufacturing method will be described below with reference to the drawings.

  7 (a) to (c) and FIGS. 8 (a) to (e) show manufacturing process diagrams of jumper chip parts which are examples of conventional chip parts. FIGS. 7 (a) to (c) ) And FIGS. 8A to 8E, the manufacturing method will be described below.

  First, as shown in FIG. 7A, a plurality of upper surface electrodes 4 are formed on the upper surface of a sheet-like insulating substrate 3 having a primary dividing line 1 and a secondary dividing line 2 and made of alumina having a purity of 96%. Is formed so as to straddle the primary dividing line 1 by a screen printing method.

  Next, as shown in FIG. 7 (b), a plurality of conductors are electrically connected to the plurality of upper surface electrodes 4 in the individual region surrounded by the primary division line 1 and the secondary division line 2. 5 is formed so as to overlap the plurality of upper surface electrodes 4.

  Next, as shown in FIG. 7C, a resin protective layer 6 is formed by a screen printing method so as to cover the entire surface of the plurality of conductors 5.

  Next, as shown in FIG. 8A, the sheet-like insulating substrate 3 is cut by dicing along the primary dividing line 1 so as to cut the plurality of upper surface electrodes 4, thereby FIG. A strip-shaped substrate 7 as shown in FIG.

  Next, as shown in FIG. 8C, the end surface electrode 8 is formed by sputtering or the like so as to be electrically connected to the upper surface electrode 4 on the end surface of the strip-shaped substrate 7.

  Finally, as shown in FIG. 8 (d), the strip-shaped substrate 7 is divided along the secondary dividing line 2 to form a piece-like substrate 9, and then shown in FIG. 8 (e). Thus, the conventional chip component was manufactured by forming the nickel plating layer (not shown) and the tin plating layer 10 on the surface of the end surface electrode 8 using the barrel plating method.

As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
JP 2005-78874 A

  In the above-described conventional method for manufacturing a chip component, when the material constituting the upper surface electrode 4 and the material constituting the conductor 5 are different, an alloying reaction occurs in the overlapping portion between the two and the resistance value of the conductor 5 increases. In particular, the characteristics of the jumper chip component requiring a low resistance value become unstable. In particular, the top electrode 4 is thinly printed using a gold-based material for the purpose of suppressing the occurrence of burrs during dicing, and the conductor 5 is often composed of a silver-based material having a low resistance value. In this case, the alloying reaction is promoted at the overlapping portion of the gold-based top electrode 4 and the silver-based conductor 5, and the resistance value increases at the alloyed portion. In this case, in the conventional chip component, since the entire surface of the conductor 5 is covered with the resin protective layer 6, when the plating layer is formed on the upper surface electrode 4, the plating layer is alloyed with an increased resistance value. As a result, a chip component having a stable low resistance value cannot be obtained.

  SUMMARY OF THE INVENTION The present invention solves the above-described conventional problems, and provides a chip component capable of obtaining a stable and low resistance value in a small size without being affected by an increase in resistance value due to an alloying reaction between the upper surface electrode and a conductor, and a method for manufacturing the chip component. Is intended to provide.

  In order to achieve the above object, the present invention has the following configuration.

According to a first aspect of the present invention, printing and the upper electrode composed mainly of gold formed by printing and firing a four corners of the upper surface of the insulating substrate, so as to be electrically connected to the upper electrode And a conductor mainly composed of silver formed by firing, a protective film covering only a part of the conductor so as to expose a portion of the conductor that does not overlap with the upper surface electrode, and electrically connected to the upper surface electrode. An end surface electrode formed by sputtering on the back surface and end surface of the insulating substrate, an auxiliary upper surface electrode formed by sputtering so as to be electrically connected to the upper surface electrode, the conductor, and the end surface electrode; which was a plated layer formed so as to be electrically connected to the end surface electrode and the auxiliary upper electrode, according to this configuration, that the protective film is configured to cover only a part of the conductor Further, since the portion that does not overlap with the upper surface electrode in the conductor is exposed, the portion of the conductor that is electrically connected to the upper surface electrode does not protrude from the protective film greatly, Since the conductor portion protruding from the protective film is not alloyed with the upper surface electrode, even when the overlapping portion of the upper surface electrode and the conductor is alloyed and the resistance value is increased, it is not alloyed without overlapping with the upper surface electrode. The plating layer can be formed so as to be directly electrically connected to the conductor, thereby having the effect of obtaining a chip component having a stable low resistance value.

The invention according to claim 2 of the present invention, in particular, the protective layer is one that is glass, according to this configuration, since the coercive Mamorumaku formed of glass, when the protective film is formed of a resin As a result, there is no bleeding of the resin that occurs in the substrate, so that no bleeding film is interposed between the conductor and the auxiliary upper surface electrode and / or the plating layer, so that a chip component having a stable low resistance value can be obtained. It has the effect that it is.

According to a third aspect of the present invention, a plurality of upper surface electrodes are disposed on the upper surface of a sheet-like insulating substrate having a primary division line and a secondary division line so as to straddle the intersection of the primary division line and the secondary division line. forming by printing and firing as, by printing and firing the primary split line and a plurality of pieces in the region surrounded by the second division line so that the connected plurality of upper surface electrodes electrically A step of forming a conductor, a step of forming a protective film so as to cover the conductor, a step of primary dicing the sheet-like insulating substrate along the primary dividing line, and a step of forming the sheet-like insulating substrate. forming by sputtering the edge electrode to be electrically connected to the plurality of top electrodes and the conductor on the end surface obtained by the back surface and the primary dicing, electricity to the upper electrode and the conductor, and the end surface electrode Forming an auxiliary upper surface electrode by sputtering so as to be connected to the substrate, dividing the insulating substrate along the secondary dividing line to obtain a piece-like substrate, and forming both sides of the piece-like substrate A step of forming a plating layer so as to cover the entire surface of the end face electrode and the auxiliary upper surface electrode, and the protective film covers only a part of the conductor in the step of forming a protective film so as to cover the conductor with, which was so as to expose the portions not overlapping the upper electrode in the conductor, according to this manufacturing method, in the step of forming a protective film so as to cover the conductor, wherein the protective film is conductive one Since the portion that does not overlap the upper surface electrode in the conductor is exposed by covering only the portion, the portion of the conductor that is electrically connected to the upper surface electrode does not overlap the upper surface electrode. Since the conductor part that protrudes from the protective film is not alloyed with the upper surface electrode, even if the resistance value rises due to alloying of the overlapping part of the upper surface electrode and the conductor, the upper surface electrode The plating layer can be formed so as to be directly electrically connected to the non-alloyed conductor without overlapping with the auxiliary upper surface electrode, thereby obtaining a chip component having a stable low resistance value. It has the effect that it is.

  As described above, the chip component of the present invention is configured so that the protective film covering the conductor covers only a part of the conductor, thereby exposing a portion that does not overlap the upper surface electrode in the conductor. The portion of the conductor that is electrically connected to the upper surface electrode does not overlap the protective film, and the portion of the conductor that protrudes from the protective film is not alloyed with the upper surface electrode. Even when the overlapping portion of the conductor is alloyed and the resistance value is increased, the plating layer can be formed so as to be directly electrically connected to the non-alloyed conductor without overlapping with the upper surface electrode. Thus, an excellent effect is obtained in that a chip component having a stable low resistance value can be obtained.

  Hereinafter, a chip part manufacturing method according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a cross-sectional view of a jumper chip part which is an example of a chip part in an embodiment of the present invention, FIGS. 2 (a) to (c), FIGS. 3 (a) to (c), and FIG. 4 (a) to FIG. (C) is a manufacturing process figure which shows the manufacturing method of the jumper chip component.

  In FIG. 1, 11 is a rectangular insulating substrate made of alumina with a purity of 96%, 12 is an upper surface electrode mainly composed of gold provided at both ends of the upper surface of the insulating substrate 11, and 13 is electrically connected to the upper surface electrode 12. A conductor mainly composed of silver provided so as to be connected to, and a protective layer 14 provided so as to cover a part of the conductor 13. 15 is an end surface electrode provided from the back surface to the end surface of the insulating substrate 11 and is electrically connected to the upper surface electrode 12, and 16 is electrically connected to the upper surface electrode 12, the conductor 13 and the end surface electrode 15. It is the formed auxiliary upper surface electrode. Reference numeral 17 denotes a nickel plating layer formed on the end face electrode 15 and the auxiliary upper surface electrode 16, and reference numeral 18 denotes a tin plating layer formed on the nickel plating layer 17.

  Next, referring to FIGS. 2A to 2C, FIGS. 3A to 3C, and FIGS. 4A to 4C, a method of manufacturing a jumper chip component according to an embodiment of the present invention. Will be explained.

  First, as shown in FIG. 2A, a sheet-like insulating substrate 11c made of alumina having a purity of 96% having a primary dividing line 11a and a secondary dividing line 11b is prepared, and this sheet-like insulating substrate is prepared. A plurality of upper surface electrodes 12 made of a material mainly composed of gold, such as gold resinate, are screen-printed on the upper surface of 11c in a grid pattern so as to straddle the intersection of the primary division line 11a and the secondary division line 11b. Bake with a firing profile of 850 ° C. In addition, since it can print thinly when the upper surface electrode 12 is formed using gold resinate, it is hard to generate | occur | produce a burr | flash also when cut | disconnecting the upper surface electrode 12 by the primary dicing mentioned later. Further, the primary dividing line 11a and the secondary dividing line 11b may be formed in advance on the upper surface and / or the back surface of the sheet-like insulating substrate 11c as slit-shaped dividing grooves. When the area surrounded by the primary dividing line 11a and the secondary dividing line 11b (hereinafter referred to as an individual area) is reduced in size, the slit-shaped dividing grooves are provided in advance on the sheet-like insulating substrate 11c. Since manufacturing is difficult due to a decrease in strength, the primary dividing line 11a and the secondary dividing line 11b are usually not provided with slit-shaped dividing grooves in advance.

  Next, as shown in FIG. 2 (b), the upper surface electrode 12 and the electricity are formed on the upper surface of the sheet-like insulating substrate 11c in a plurality of individual regions surrounded by the primary division line 11a and the secondary division line 11b. The conductor 13 made of a conductive paste mainly composed of silver such as a silver-palladium alloy is formed so as to be connected, and fired with a firing profile having a peak temperature of 850 ° C. In this case, since the upper surface electrode 12 is formed at the four corners in the plurality of individual regions surrounded by the primary division line 11a and the secondary division line 11b as described above, the printing position of the conductor 13 is 1. Even in the case of deviation in the direction of the next division line 11a, the conductor 13 is reliably connected to any one of the pair of upper surface electrodes 12, and no conduction failure occurs.

  Next, as shown in FIG. 2C, a plurality of protective films 14 are formed in parallel with the primary dividing line 11a so as to cover only a part of the plurality of conductors 13. Here, if the protective film 14 is formed of resin, a resin bleeding film is formed and bonding between the conductor 13 and a plating layer described later becomes unstable. Therefore, the protective film 14 is preferably formed of glass. The protective film 14 is formed to have a narrow width as shown in FIG. 2C so as not to cover the overlapping portion of the upper surface electrode 12 and the conductor 13 in order to secure the exposed portion of the conductor 13 as wide as possible. It is what.

  Next, as shown in FIG. 3A, the sheet-like insulating substrate 11c is diced along the primary dividing line 11a to obtain a strip-like substrate 11d as shown in FIG. At the time of dicing, since only the upper surface electrode 12 mainly composed of gold is thinly formed on the primary dividing line 11a, burrs are hardly generated at the time of dicing.

  Next, as shown in FIG. 3C, the back surface (not shown) and the end surface of the strip-shaped substrate 11d are top surfaces by performing sputtering made of nickel chromium alloy or the like from the back surface side of the strip-shaped substrate 11d. An end face electrode 15 electrically connected to the electrode 12 is formed. The end face electrode 15 is not limited to a nickel-chrome alloy sputtered film, and may be formed of other materials. For example, the first layer 15 made of chromium and the second layer 2 made of copper-nickel alloy are used. It may be formed in a layer structure, or may be formed by applying a conductive paste to the back and end surfaces of the strip-shaped substrate 11d. Further, the end face electrode 15 can be obtained in a desired shape by installing a metal mask so as to cover the center of the back surface of the strip-shaped substrate 11d and forming it in this installed state. When the substrate 11c is divided by primary dicing along the primary dividing line 11a, the slit of the primary dicing is prevented from penetrating to the end of the sheet-like insulating substrate 11c, and the slit of the primary dicing is formed. If a metal mask is disposed on the back surface of the sheet-like insulating substrate 11c in a state of being formed and sputtering is performed from the back surface, the end face electrodes 15 can be simultaneously formed on the plurality of strip-shaped substrates 11d. is there.

  Next, as shown in FIG. 4A, the upper surface electrode 12 and the conductors 13 are formed on the upper surface and the end surface of the strip-shaped substrate 11d by sputtering from the upper surface of the strip-shaped substrate 11d. An auxiliary upper surface electrode 16 electrically connected to the end surface electrode 15 is formed. The auxiliary upper surface electrode 16 can have a desired shape by installing a metal mask so as to cover the upper surface central portion (the portion where the protective film 14 is formed) of the strip-shaped substrate 11d. When the insulating substrate 11c is divided by primary dicing along the primary dividing line 11a, the slit of the primary dicing is prevented from penetrating to the end of the sheet-like insulating substrate 11c. If a metal mask is arranged on the upper surface of the formed sheet-like insulating substrate 11c and sputtering is performed from the upper surface, the auxiliary upper surface electrode 16 can be simultaneously formed on the plurality of strip-shaped substrates 11d. Is. In FIG. 4A, the auxiliary upper surface electrode 16 is formed so as to completely cover the upper surface electrode 12 and the conductor 13 and to cover a part of the protective film 14, but without covering the protective film 14. A part of the conductor 13 may be exposed.

  Next, the strip-shaped substrate 11d is divided along a secondary dividing line 11b shown in FIG. 4A, thereby obtaining an individual substrate 11e as shown in FIG. 4B.

  Finally, as shown in FIG. 4C, the exposed portion of the end surface electrode 15 and the auxiliary upper surface electrode 16 in the individual substrate 11e is plated with a nickel plating layer 17 (not shown) and a tin plating layer 18. A layer is formed to manufacture a jumper chip component according to an embodiment of the present invention.

  The jumper chip component manufactured by the chip component manufacturing method according to the embodiment of the present invention described above is configured such that the protective film 14 covers only a part of the conductor 13, thereby overlapping the upper surface electrode 12 in the conductor 13. Since the portion not to be exposed is configured to be exposed, the portion of the conductor 13 electrically connected to the upper surface electrode 12 that does not overlap the upper surface electrode 12 protrudes greatly from the protective film 14. Since the protruding portion of the conductor 13 is not alloyed with the upper surface electrode 12, even when the overlapping portion of the upper surface electrode 12 and the conductor 13 is alloyed and the resistance value is increased, it is alloyed without overlapping with the upper surface electrode 12. The plating layer 14 can be formed so as to be directly electrically connected to the non-conductor 13 via the auxiliary upper surface electrode 16, thereby stabilizing In which there is an advantage that it is possible to provide a chip component having had resistance. In addition, since the protective film 14 is formed of glass, there is no bleeding of the resin that occurs when the protective film 14 is formed of a resin, whereby the conductor 13 and the auxiliary upper surface electrode 16 and / or nickel plating are eliminated. Since no bleeding film is interposed between the layer 17 and the layer 17, a low resistance value particularly required for a jumper chip component can be obtained stably.

  FIG. 5 shows a comparison of the characteristics of a jumper chip part, which is an example of a conventional chip part, and a jumper chip part, which is an example of a chip part in an embodiment of the present invention. The horizontal axis represents the initial resistance value, and the vertical axis represents the resistance value change rate after the thermal shock test of 100 cycles. The chip component according to the embodiment of the present invention indicated by the circle mark in which the upper surface electrode 12 is arranged at the four corners of the upper surface of the insulating substrate 11 and the protective film 14 is made of glass has an initial resistance value of around 30 mΩ. It is stable and low, and the rate of change in resistance after a thermal shock test is as low as 10% or less, and it sufficiently satisfies the characteristics required to stably obtain the low resistance required for jumper chip components. is there. On the other hand, the upper surface electrode is disposed at both ends of the upper surface of the insulating substrate, and the conventional example 1 indicated by □ using a resin for the protective film and the upper surface electrode are disposed at both ends of the upper surface of the insulating substrate. In the conventional example 2 indicated by the triangle mark using glass as the protective film, the initial resistance value is as high as 40 to 100 mΩ, and in particular, the resin in the protective film is used in the conventional example 1, and therefore, as shown in FIG. Such a resin bleeding film 19 is formed, and the conduction between the conductor 13 and the auxiliary upper surface electrode 16 becomes unstable, thereby increasing the rate of change in resistance value. In particular, if the bleeding film 19 is formed densely, the conductive path between the conductor 13 and the tin plating layer 18 always passes through the upper surface electrode 12, and in this case, the upper surface electrode 12 is made of gold having a high resistance value. Since it is formed of resinate, the resistance value is increased due to the influence.

  In the above-described embodiment of the present invention, the jumper chip component is described as an example of the chip component. However, the jumper chip component is not particularly limited, and the conductor 13 is cut by laser trimming or the like. Thus, by adjusting the resistance value, it can be applied to a highly accurate chip resistor having a low resistance value.

  In the chip component and the manufacturing method thereof according to the present invention, even when the overlapping portion of the upper surface electrode and the conductor is alloyed and the resistance value is increased, the plating layer is directly applied to the non-alloyed conductor without overlapping the upper surface electrode. Since it can be formed so as to be connected to each other, it has an effect that a stable low resistance value can be obtained, and is particularly useful when applied to a manufacturing method of a micro jumper chip component. is there.

Sectional drawing of the jumper chip component which is an example of the chip component in one embodiment of this invention (A)-(c) Manufacturing process figure which shows the manufacturing method of the jumper chip component (A)-(c) Manufacturing process figure which shows the manufacturing method of the jumper chip component (A)-(c) Manufacturing process figure which shows the manufacturing method of the jumper chip component The figure which compared the characteristic of the jumper chip component which is an example of the chip component in one embodiment of this invention and the jumper chip component which is an example of the conventional chip component Sectional drawing when the protective film of the jumper chip part which is an example of the chip part in one embodiment of this invention raise | generates bleeding (A)-(c) Manufacturing process figure which shows the manufacturing method of the jumper chip component which is an example of the conventional chip component (A)-(e) Manufacturing process figure which shows the manufacturing method of the jumper chip component

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Insulation board | substrate 11a Primary division line 11b Secondary division line 11c Sheet-like insulation board | substrate 11d Strip-shaped board | substrate 11e Single piece board | substrate 12 Upper surface electrode 13 Conductor 14 Protective film 15 End surface electrode 16 Auxiliary upper surface electrode 17 Nickel plating layer 18 Tin plating layer

Claims (3)

A top electrode composed mainly of gold formed by printing and firing at the four corners of the top surface of the insulating substrate, and a conductor composed mainly of silver formed by printing and firing so as to be electrically connected to the top surface electrode And a protective film that covers only a part of the conductor so as to expose a portion of the conductor that does not overlap the upper surface electrode, and a back surface and an end surface of the insulating substrate so as to be electrically connected to the upper surface electrode by sputtering. The formed end face electrode, the auxiliary upper face electrode formed by sputtering so as to be electrically connected to the upper face electrode, the conductor and the end face electrode, and electrically connected to the end face electrode and the auxiliary upper face electrode. A chip component comprising a plating layer formed as described above. The protective layer chip component according to claim 1 wherein the glass. Forming a plurality of upper surface electrodes on the upper surface of a sheet-like insulating substrate having a primary division line and a secondary division line by printing and firing so as to straddle the intersection of the primary division line and the secondary division line; Forming a conductor by printing and firing in a plurality of individual regions surrounded by the primary dividing line and the secondary dividing line so as to be electrically connected to a plurality of upper surface electrodes; and covering the conductor A step of forming a protective film on the sheet, a step of primary dicing the sheet-like insulating substrate along the primary dividing line, a back surface of the sheet-like insulating substrate, and an end face obtained by the primary dicing. a step of the end surface electrode is formed by sputtering so as to be electrically connected to the plurality of top electrodes and conductors, auxiliary upper electrode to be electrically connected to the top electrode and the conductor, and the end surface electrode A step of forming by sputtering, a step of dividing the insulating substrate along the secondary dividing line to obtain a piece-like substrate, and a whole surface of the end face electrode and the auxiliary upper surface electrode on both end faces of the piece-like substrate. Forming a plating layer so as to cover, and in the step of forming a protective film so as to cover the conductor, the protective film covers only a part of the conductor, whereby the upper surface electrode in the conductor A method of manufacturing a chip component that is configured to expose a portion that does not overlap.

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