WO2019082523A1 - Chip resistor and method for manufacturing chip resistor - Google Patents

Chip resistor and method for manufacturing chip resistor

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Publication number
WO2019082523A1
WO2019082523A1 PCT/JP2018/033296 JP2018033296W WO2019082523A1 WO 2019082523 A1 WO2019082523 A1 WO 2019082523A1 JP 2018033296 W JP2018033296 W JP 2018033296W WO 2019082523 A1 WO2019082523 A1 WO 2019082523A1
Authority
WO
WIPO (PCT)
Prior art keywords
resistor
electrode
slit
floating island
chip resistor
Prior art date
Application number
PCT/JP2018/033296
Other languages
French (fr)
Japanese (ja)
Inventor
松本　健太郎
Original Assignee
Koa株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koa株式会社 filed Critical Koa株式会社
Priority to CN201880068331.5A priority Critical patent/CN111279443B/en
Publication of WO2019082523A1 publication Critical patent/WO2019082523A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

Definitions

  • the present invention relates to a chip resistor whose resistance value is adjusted by forming a trimming groove in a resistor provided on an insulating substrate, and a method of manufacturing such a chip resistor.
  • the chip resistor includes a rectangular parallelepiped insulating substrate, a pair of front electrodes disposed opposite to the surface of the insulating substrate at a predetermined distance, and a pair of electrodes disposed opposite to the rear surface of the insulating substrate at a predetermined distance. It is mainly composed of a back electrode, an end face electrode that bridges the front electrode and the back electrode, a resistor that bridges the pair of front electrodes, a protective film that covers the resistor, and the like.
  • a large number of electrodes, resistors, protective films, etc. are collectively formed on a large-sized collective substrate, and then the collective substrate is divided into grids. It divides along a line (for example, dividing groove) to take a large number of chip resistors.
  • many resistors are formed by printing and baking a resistor paste on one side of the collective substrate, but the positional deviation or blur during printing, or the temperature unevenness in the baking furnace, etc. It is difficult to avoid slight variations in the size and film thickness of each resistor due to the influence of the resistance. Therefore, the adjustment of the resistance value is achieved by forming trimming grooves in each resistor in the collective substrate state and setting the desired resistance value. Work is done.
  • a pair of front electrodes 12 are formed at predetermined intervals at both ends of the insulating substrate 11, and then a resistance which is two-turn meandering between the two front electrodes 12 by printing technique.
  • a chip resistor 100 is proposed in which the resistor 13 is made to meander for three turns by forming the trimming groove 14 by laser trimming in the non-serpentine region of the resistor 13 after the body 13 is formed. (See Patent Document 1).
  • the combined use of printing technique such as screen printing and laser trimming makes it possible to increase the overall length of the resistor 13 (three-turn meandering) and improve the surge characteristics, and the trimming groove 14 Since the formation of the two also serves to adjust the resistance value, it is possible to improve the resistance value accuracy.
  • the resistor 13 can be made to meander as well as adjusting the resistance value.
  • the resistance value accuracy can be improved as compared to the case where the resistor 13 is formed.
  • the resistor 13 at the tip end portion of the trimming groove 14 is a portion which is weak to the load due to the occurrence of the micro crack, the portion is particularly inside the turn portion where the load concentrates in the resistor 13. The risk of causing a failure such as a change in resistance due to a load increases.
  • the present invention has been made in view of the circumstances of the prior art as described above, and a first object of the present invention is to reduce the adverse effect on the characteristics caused by the micro crack and to improve the surge characteristics.
  • a second object of the present invention is to provide a resistor, and to provide a method of manufacturing such a chip resistor.
  • a chip resistor comprises an insulating substrate, a pair of electrodes opposed to each other at a predetermined distance on the insulating substrate, and a bridge between the pair of electrodes
  • a trimming groove is formed in the resistor, extending toward the inter-electrode toward the floating island conductor, and the floating island conductor is separated from the electrode by a slit formed in the electrode.
  • the floating island conductor is formed in the turn portion facing the electrode with a gap, and the current flowing through the turn portion is a floating island with a small electric resistance formed outside the turn portion. Since it is easy to flow through the conductor, the load applied to the inside of the turn can be reduced, and even if micro cracks occur at the tip of the trimming groove, the adverse effect on the characteristics due to the micro cracks can be reduced. Further, since the floating island conductor is separated from the electrode by forming a slit in the electrode, there is no need to additionally provide the floating island conductor, and the chip resistor can be easily manufactured.
  • the trimming groove when the trimming groove is formed to have a length of 1/2 or more of the inter-electrode distance, the current flowing through the turn easily flows through the floating island conductor having a small electric resistance. Can be further reduced.
  • the slit and the trimming groove may be formed in separate steps, or may be formed using different means, but when the slit and the trimming groove are continuous, for example, If the laser beam irradiated to the electrode is directly extended to the resistor, the formation of the floating island conductor by the slit and the adjustment of the resistance value by the trimming groove can be continuously performed.
  • the meandering shape of the resistor may be defined by the trimming groove, but the meandering shape may be defined by both the printed pattern of the resistor and the trimming groove. It is also possible to configure. For example, when one of the two turn portions is formed by a printed pattern of a resistor, a notch extending in the direction of the other electrode toward the turn portion is printed in advance in the resistor, and the tip of the slit formed in the electrode If the width of the cut is set wider than that of the slit, the tip of the slit continuous to the cut is separated from the resistor, so that the micro crack does not occur in the resistor. Therefore, the adverse effect on the properties due to the micro crack can be further reduced. Although the width of the cut may be set wider than the slit over the entire length of the cut, the width of the cut may be set wider than the slit only in the portion of the cut continuous to the tip of the slit. .
  • a convex portion protruding in the direction of the other electrode is formed on at least one of the pair of electrodes, and a resistor is connected to the convex portion to the convex portion
  • a notch extending in the electrode direction toward the turn is printed on the resistor, and the width of the protrusion is set smaller than the width of the resistor overlapping the protrusion, and the protrusion is cut longitudinally
  • the tip of the slit is continuous with this cut, a space connected to the cut is secured in the vicinity of the overlapping portion of the convex portion and the resistor, and the tip of the slit continuous with this space is separated from the resistor.
  • the width of the cut can be set narrow, and the space for forming the resistor can be enlarged accordingly.
  • a method of manufacturing a chip resistor according to the present invention comprises an insulating substrate, a pair of electrodes disposed opposite to each other with a predetermined gap on the insulating substrate, and a pair of these And a resistor for bridging between the electrodes, wherein the resistor is formed in a serpentine shape having a plurality of turn portions facing each other with a gap between the electrodes. Forming a floating island conductor separated from the electrode at the turn portion by forming a slit reaching the connection portion with the resistor, extending the slit and extending the slit toward the floating island conductor Forming a trimming groove extending in a direction between the electrodes.
  • a floating island conductor is formed on the turn of the resistor facing the tip of the trimming groove, and the current flowing through the turn is the electric current formed on the outside of the turn
  • the load on the inside of the turn can be reduced because it is easy to flow through the floating island conductor with low resistance, and even if micro cracks occur at the tip of the trimming groove, the adverse effect on the characteristics due to micro cracks is reduced. be able to.
  • the floating island conductor is separated from the electrode by forming a slit in the electrode, there is no need to additionally provide the floating island conductor, and the chip resistor can be easily manufactured.
  • the present invention it is possible to provide a chip resistor capable of improving the surge characteristics as well as reducing the adverse effect on the characteristics due to the micro crack.
  • a chip resistor 1 according to a first embodiment of the present invention includes a rectangular parallelepiped insulating substrate 2 and a surface of the insulating substrate 2 The first electrode 3 and the second electrode 4 disposed opposite to each other with a predetermined interval at both ends in the longitudinal direction, the meandering resistor 5 connected to the first and second electrodes 3 and 4, and the resistor It is mainly comprised by the protective film etc. which cover 5 which are not shown.
  • the insulating substrate 2 is made of ceramic or the like, and the insulating substrate 2 is obtained by dividing a large-sized collective substrate to be described later along dividing grooves in the vertical and horizontal directions.
  • the 1st electrode 3 and the 2nd electrode 4 screen-print Ag-based paste, and are dried and baked.
  • the lower end portion of the first electrode 3 shown on the left side of the drawing is connected to one end of the resistor 5, and the upper end of the second electrode 4 shown on the right side of the drawing shown in FIG. It is connected to the other end.
  • the resistor 5 is obtained by screen-printing a resistor paste such as ruthenium oxide, dried, and fired, and the resistor 5 has a lead portion 5a extending in the interelectrode direction through the turn portion 5b whose direction of extension is reversed. It is formed in a continuous meandering shape (meaning shape).
  • the three lead portions 5a form a resistor body 5 of two-turn meandering which continues alternately via two turn portions 5b, and among these three lead portions 5a, the leads on the lower side
  • the portion 5 a is connected to the first electrode 3, and the lead portion 5 a on the upper side is connected to the second electrode 4.
  • floating island conductors 6A and 6B are respectively formed in the two turn portions 5b, and these floating island conductors 6A and 6B are made of the same material as the first and second electrodes 3 and 4.
  • the floating island conductor 6A on the left side of the drawing faces the first electrode 3 via the L-shaped slit S1
  • the floating island conductor 6B on the right side of the drawing faces the second electrode 4 via the reverse L-shaped slit S2. ing.
  • the trimming groove 7A on the lower side in the drawing extends continuously in the inter-electrode direction continuously from the tip of the slit S1 formed in the first electrode 3, and the tip of the trimming groove 7A is formed in the turn 5b on the right in the figure. It faces the floating island conductor 6B.
  • the trimming groove 7B on the upper side in the figure extends continuously in the inter-electrode direction continuously to the tip of the slit S2 formed in the second electrode 4, and the tip of the trimming groove 7B is a floating island formed in the turn 5b on the left side in the figure.
  • the slit S1 and the trimming groove 7A, and the slit S2 and the trimming groove 7B are respectively formed continuously by laser beam irradiation, and their width dimensions are set to be the same.
  • the protective film (not shown) is obtained by screen printing an epoxy resin paste and heat curing it.
  • the protective film has a function of protecting the resistor 5 from the external environment.
  • a large-sized collective substrate in which a large number of insulating substrates 2 are taken is prepared.
  • this collective substrate primary division grooves and secondary division grooves are provided in advance in a lattice shape, and each one of the squares divided by both division grooves becomes one chip area.
  • the collective substrate 2A corresponding to one chip area is representatively shown in FIG. 2, in actuality, each process described below is collectively performed on a collective substrate corresponding to a large number of chip areas. Be done.
  • a resistor paste such as ruthenium oxide is screen-printed on the surface of the collective substrate 2A, dried and fired to form first and second electrodes 3 and 4 at both ends as shown in FIG. 2 (b).
  • a resistor printing step To form a rectangular resistor 5 (resistor printing step).
  • the laser light is irradiated from the upper end of the first electrode 3 in the direction (downward) orthogonal to the inter-electrode direction, and then it is changed in direction to the inter-electrode direction
  • the laser light is also irradiated to the resistor 5 (see reference numeral LT1).
  • an L-shaped slit S1 reaching the resistor 5 from the upper end of the first electrode 3 is formed, and the portion separated from the first electrode 3 by the slit S1 is It becomes floating island conductor 6A (electrode cutting process).
  • a trimming groove 7A continuous with the tip of the slit S1 is formed in the resistor 5, and the trimming groove 7A linearly extends toward the second electrode 4 so that the resistance value of the resistor 5 is greater than the target resistance value.
  • the resistance is adjusted to a value slightly lower than the above (resistance adjustment step).
  • the laser light is irradiated from the lower end of the second electrode 4 in a direction (upward) perpendicular to the inter-electrode direction, and then it is changed to a right direction in the inter-electrode direction
  • the laser light is also irradiated to the resistor 5 (see reference numeral LT2).
  • an inverted L-shaped slit S2 reaching the resistor 5 from the lower end of the second electrode 4 is formed, and a portion separated from the second electrode 4 by the slit S2 Is the floating island conductor 6B. Further, a trimming groove 7B continuous to the tip of the slit S2 is formed in the resistor 5, and the trimming groove 7B linearly extends toward the first electrode 3 so that the resistance value of the resistor 5 becomes the target resistance value.
  • the resistance value is adjusted to be
  • the order of forming the slits S1 and S2 may be reversed, and after the slit S2 and the subsequent trimming groove 7B are formed from the second electrode 4 side, the slit S1 and the subsequent trimming groove 7A are formed from the first electrode 3 side. It is also possible to form
  • the resistor 5 printed in a rectangular shape becomes a continuous meandering shape through the two turn portions 5b.
  • the floating island conductors 6A and 6B separated from the first electrode 3 and the second electrode 4 are formed in the portion 5b.
  • the surface of the resistor 5 may be covered with a precoat layer of glass paste or the like, and laser light may be irradiated from above the precoat layer.
  • epoxy resin paste is screen-printed in a region including both slits S1 and S2 and heat curing is performed, whereby a portion including floating island conductors 6A and 6B of the first electrode 3 and the second electrode 4 and the resistor 5 Forming a protective film (not shown) covering the entire surface of the substrate (protective film forming step).
  • Each of the steps up to here is batch processing on the collective substrate 2A for taking a large number of pieces, but in the next step, primary break processing of dividing the collective substrate 2A into strip shapes along primary division grooves is performed Thus, a strip-like substrate (not shown) provided with a plurality of chip areas is obtained (primary division step). Then, an Ag paste is applied to the divided surface of the strip-like substrate, dried and fired, or Ni / Cr is sputtered instead of the Ag paste to form the first electrode 3 and the second electrode 4 and the corresponding back electrode. Form an end face electrode (not shown) for bridging (end face electrode forming step).
  • the floating island conductors 6A and 6B are formed in the turn portion 5b of the resistor 5 opposed to the tips of the trimming grooves 7A and 7B.
  • the current flowing through the portion 5b can easily flow through the floating island conductors 6A and 6B having small electric resistance formed outside the turn portion 5b, so that the load applied to the inside of the turn portion 5b can be reduced. Even if microcracks occur at the tip, adverse effects on the characteristics due to the microcracks can be reduced.
  • the floating island conductors 6A and 6B are separated from the first electrode 3 and the second electrode 4 by the slits S1 and S2, there is no need for the troublesome process of separately providing the floating island conductors 6A and 6B
  • the vessel 1 can be easily manufactured. Moreover, it is not necessary to secure a wider gap in consideration of positional deviation, bleeding, etc. between the turn 5b of the resistor 5 and the two electrodes 3 and 4, and accordingly, a space for forming the resistor 5 is increased. Since the width can be increased, the total length of the meander-shaped resistor 5 can be increased, and the chip resistor 1 having excellent surge characteristics can be realized.
  • the laser beam irradiated to the first electrode 3 is directly extended to the resistor 5 to form the trimming groove 7A, or the second electrode 4 is formed.
  • the irradiated laser beam can be extended as it is to the resistor 5 to form the trimming groove 7B, and the formation of the floating island conductors 6A and 6B and the adjustment of the resistance value can be continuously performed.
  • FIG. 3 is a plan view of a chip resistor 10 according to a second embodiment of the present invention.
  • the parts corresponding to FIG. 1 are given the same reference numerals.
  • the difference between the chip resistor 10 according to the second embodiment and the chip resistor 1 according to the first embodiment is that the tip of the trimming groove 7B continuing to the slit S2 reaches the floating island conductor 6A.
  • the other configurations are basically the same.
  • microcracks are not generated at the tip of the trimming groove 7B in contact with the floating island conductor 6A, and the portion where the microcrack is generated is trimming facing the other floating island conductor 6B. Since only one tip of the groove 7A is provided, the adverse effect on the characteristics due to the micro crack can be further reduced.
  • FIG. 4 is a plan view of a chip resistor 20 according to a third embodiment of the present invention
  • FIG. 5 is an explanatory view showing a manufacturing process of the chip resistor 20 according to the third embodiment.
  • the corresponding parts are given the same reference numerals.
  • the difference between the chip resistor 20 according to the third embodiment shown in FIG. 4 and the chip resistor 1 according to the first embodiment is that the resistor 5 is directed from the second electrode 4 to one floating island conductor 6A.
  • the extending cut 8 is formed by printing, and the serpentine shape of the resistor 5 is defined by the cut 8 and the trimming groove 7A extending from the first electrode 3 to the other floating island conductor 6B, and others
  • the configuration of is basically the same. That is, one of the turn portions 5b is defined by the notch 8 printed on the resistor 5, and the tip of the slit S2 formed in the second electrode 4 is continuous to the notch 8;
  • the width dimension of the incision 8 is set sufficiently wider than the slit S2.
  • FIG. 5A the pair of first electrodes 3 and the second electrodes facing each other with a predetermined interval on the surface of the collective substrate 2A.
  • a resistor 5 is formed by printing, the both ends of which overlap the first electrode 3 and the second electrode 4.
  • a rectangular notch 8 extending from the second electrode 4 to a position in front of the first electrode 3 is formed.
  • the laser light is irradiated from the lower end of the second electrode 4 in a direction (upward) orthogonal to the inter-electrode direction, and then it is changed to a right direction in the inter-electrode direction
  • an inverted L-shaped slit S2 extending from the lower end of the second electrode 4 to the notch 8 as shown in FIG. 5D by scanning into the notch 8 (see symbol LT2), this slit is formed.
  • the floating island conductor 6B separated from the second electrode 4 is obtained by S2.
  • the tip of the slit S2 is made continuous with the cut 8 simply and reliably. be able to.
  • the tip of the slit S2 continuing to the cut 8 is separated from the resistor 5, micro cracks do not occur in the resistor 5.
  • the laser light is irradiated from the upper end portion of the first electrode 3 in a direction (downward) orthogonal to the inter-electrode direction, and then the direction is orthogonally changed to the inter-electrode direction
  • the L-shaped slit S1 is formed in the first electrode 3 and the trimming groove 7A continuous with the tip of the slit S1 is formed in the resistor 5, as shown in FIG. Do.
  • the floating island conductor 6A separated from the first electrode 3 is obtained by the slits S1, and the floating island conductor 6A is formed in the turn portion 5b opposed to the cut 8.
  • the resistance value of the resistor 5 is adjusted by the trimming groove 7A so as to be the target resistance value.
  • the resistor 5 has a serpentine shape having two turn parts 5b by the cut 8 and the trimming groove 7A.
  • the subsequent steps are basically the same as those of the first embodiment, and thus redundant description will be omitted.
  • the notch 8 extending in the electrode direction toward the one turn 5b is printed and formed in the resistor 5 in advance. Since the tip of the slit S2 formed in the two electrodes 4 is made continuous and the width of the cut 8 is set wider than the slit S2, no microcrack is generated at the tip of the slit S2 continuous to the cut 8 It is possible to further reduce the adverse effect on the properties caused by
  • FIG. 6 is a plan view of a chip resistor 30 according to a fourth embodiment of the present invention.
  • the parts corresponding to FIG. 1 are given the same reference numerals.
  • a part of the resistor 5 is interposed between the floating island conductor 6A separated from the first electrode 3 and the notch 8, but the chip resistor shown in FIG. 6 As in 30, the tip of the cut 8 may be extended to the floating island conductor 6A.
  • the width of the resistor 5A is a trimming groove
  • the width is set smaller than the width of the resistor 5B in which 7A is formed.
  • a load is likely to be applied to the narrower resistor 5A, and microcracks are not generated by the trimming groove in this resistor 5A, so the load on the resistor 5B in which the trimming groove 7A is formed is reduced.
  • the load characteristics of the entire chip resistor 30 can be improved.
  • FIG. 7 is a plan view of a chip resistor 40 according to a fifth embodiment of the present invention
  • FIG. 8 is an explanatory view showing a manufacturing process of the chip resistor 40 according to the fifth embodiment.
  • the corresponding parts are given the same reference numerals.
  • the floating island conductor 6B is separated from the second electrode 4 by the linearly extending slit S2, and the notch 8 is continuous at the tip of the slit S2. It is done.
  • the first electrode 3 and the second electrode 3 facing the surface of the collective substrate 2A with a predetermined interval are described.
  • the electrode 4 is formed.
  • the first electrode 3 has a rectangular shape
  • the second electrode 4 is formed with a convex portion 4 a that protrudes toward the first electrode 3.
  • a resistor 5 is formed by printing, the both ends of which overlap the first electrode 3 and the second electrode 4.
  • This resistor 5 has a rectangular resistor 5A formed between the first electrode 3 and the second electrode 4 and a rectangular resistor 5B formed between the first electrode 3 and the convex portion 4a.
  • the resistor 5A and the resistor 5B are opposed to each other across the narrow cut 8.
  • the width of the resistor 5A is set smaller than the width of the resistor 5B
  • the width of the convex portion 4a is set smaller than the width of the resistor 5B.
  • the laser light is irradiated from the upper end of the first electrode 3 in the direction orthogonal to the inter-electrode direction, and then it is changed in direction to the inter-electrode direction at right angles (
  • the L-shaped slit S1 is formed in the first electrode 3 and the trimming groove 7A continuous with the tip of the slit S1 is formed in the resistor 5B as shown in FIG.
  • the floating island conductor 6A separated from the first electrode 3 is obtained by the slit S1, and the resistance value of the resistor 5 is adjusted by the trimming groove 7A so as to be the target resistance value.
  • the subsequent steps are basically the same as those of the first embodiment, and thus redundant description will be omitted.
  • the second electrode 4 is provided with the convex portion 4 a that protrudes toward the first electrode 3 on the other side, and the convex portion 4 a is formed
  • the convex portion 4a is separated from the second electrode 4 to obtain the floating island conductor 6B. Therefore, the floating island conductor 6B is cut by cutting the convex portion 4a. It can be easily formed.
  • the notch 8 for defining a part of the meandering shape is printed on the resistor 5 and the width of the convex portion 4a is set smaller than the width of the resistor 5B overlapping the convex portion 4a, the convex portion A space connected to the cut 8 can be secured in the vicinity of the overlapping portion of 4 a and the resistor 5 B. Then, by making the tip of the slit S2 continuous with this space, the tip of the slit S2 can be separated from the resistor 5A, so that no micro crack is generated in the resistor 5A, and as a result, it is defined by printing It is possible to set the width of the notch 8 narrow, and the space for forming the resistor 5 can be enlarged accordingly.
  • the tip of the incision 8 may not necessarily reach the floating island conductor 6A on the first electrode 3 side, and even if a part of the resistor 5 is interposed between the incision 8 and the floating island conductor 6A good.
  • the tip of the slit S2 is formed to be continuous with the notch 8 formed by printing on the resistor 5, but as in the first embodiment and the second embodiment, Even if the trimming groove 7A, 7B is used to define the meandering shape of the resistor 5 without forming a cut, the tip of the slit S2 may be extended in the orthogonal direction as it is to form the trimming groove 7B. good.
  • FIG. 9 is a plan view of a chip resistor 50 according to a sixth embodiment of the present invention.
  • the floating island conductor 6B is separated from the convex portion of the second electrode 4, but the floating island conductor 6A is also formed of the first electrode 3. It is comprised so that it may isolate
  • FIG. 10 is a plan view of a chip resistor 60 according to a seventh embodiment of the present invention
  • FIG. 11 is an explanatory view showing a manufacturing process of the chip resistor 60 according to the seventh embodiment.
  • the corresponding parts are given the same reference numerals.
  • the resistor 5 is formed in an N-shaped meandering shape by the printed pattern, and the first electrode is formed on one of the turn portions 5 b of the resistor 5. While the floating island conductor 6A separated from 3 is formed, the floating island conductor 6B separated from the 2nd electrode 4 is formed in the other turn part 5b. Further, L-shaped trimming grooves 7A and 7B are respectively formed in the lead portions 5a on both end sides of the resistor 5, and one trimming groove 7A is the tip of the slit S1 separating the first electrode 3 and the floating island conductor 6A. The other trimming groove 7B is continuous with the tip of the slit S2 separating the second electrode 4 and the floating island conductor 6B.
  • the first electrode 3 and the second electrode 3 facing the surface of the collective substrate 2A with a predetermined interval are described.
  • the electrode 4 is formed.
  • the first electrode 3 is formed with a convex portion 3 a projecting toward the second electrode 4
  • the second electrode 4 is formed with a convex portion 4 a projecting toward the first electrode 3.
  • a meandering resistor 5 whose both end portions overlap the first electrode 3 and the second electrode 4 is formed by printing.
  • the resistor 5 includes two turn portions 5b connected to the convex portions 3a and 4a of the first electrode 3 and the second electrode 4, and a lead portion 5a connecting the first electrode 3 and one of the turn portions 5b in a straight line.
  • a lead portion 5a connecting the second electrode 4 and the other turn portion 5b linearly and a total of three lead portions 5a connecting these two lead portions 5a in a diagonal direction are provided.
  • a laser beam is irradiated from the right side of the convex portion 4a of the second electrode 4 to the left, and after passing through the convex portion 4a, this laser beam is left as it is Extend into 5a (see symbol LT2).
  • a linear slit S2 is formed in the second electrode 4, and an L-shaped trimming groove 7B continuous with the slit S2 is formed in the lead portion 5a of the resistor 5B.
  • the floating island conductor 6B separated from the second electrode 4 is obtained by the slits S2.
  • the laser beam is irradiated from the left side of the convex portion 3a of the first electrode 3 to the right, and the laser beam is directly extended into the lead portion 5a on the right side of the figure after passing through the convex portion 3a ( Reference symbol LT1).
  • a linear slit S1 is formed in the first electrode 3 and an L-shaped trimming groove 7A continuous with the slit S1 is formed in the lead portion 5a of the resistor 5B.
  • the floating island conductor 6A separated from the first electrode 3 is obtained by the slit S1, and the resistance value of the resistor 5 is adjusted by the both trimming grooves 7A and 7B so as to be the target resistance value.
  • the subsequent steps are basically the same as those of the first embodiment, and thus redundant description will be omitted.
  • the meandering shape is defined by the printed pattern of the resistor 5 and the two slits S1 and S2 formed in the first electrode 3 and the second electrode 4.
  • the floating island conductors 6A and 6B are formed on the turn portions 5b facing the tips of the trimming grooves 7A and 7B, respectively, so that the load applied to the turn portions 5b can be reduced. Even if microcracks occur at the tips of 7A and 7B, the adverse effect on the characteristics due to the microcracks can be reduced.
  • the trimming grooves 7A and 7B are formed in an L shape starting from the inner side in the width direction of the lead portion 5a, the resistance value of the resistor 5 is adjusted with high precision. Since the slits S1 and S2 and the trimming grooves 7A and 7B are continuous, the start point (starting point) of the trimming grooves 7A and 7B is stable, and the resistance value can be easily adjusted.

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Abstract

Provided is a chip resistor which is capable of reducing the adverse effects due to microcracks on characteristics and improving surge characteristics. This chip resistor 1 is provided with: an insulating substrate 2; first and second electrodes 3, 4 arranged on the insulating substrate to face each other at a predetermined distance; and a resistive body 5 that bridges the first and second electrodes 3, 4, wherein the resistive body 5 is formed in a meandering shape having a plurality of turn parts 5b facing each other while spaced apart from the first and second electrodes 3, 4. The chip resistor 1 is configured such that: trimming grooves 7A, 7B facing the turn parts 5b are formed on the resistive body 5; a floating island conductor 6A separate from the first electrode 3 is formed on one turn part 5b; and a floating island conductor 6B separate from the second electrode 4 is formed on the other turn part 5b.

Description

チップ抵抗器およびチップ抵抗器の製造方法Chip resistor and method of manufacturing chip resistor
　本発明は、絶縁基板上に設けられた抵抗体にトリミング溝を形成することで抵抗値が調整されるチップ抵抗器と、そのようなチップ抵抗器の製造方法に関するものである。 The present invention relates to a chip resistor whose resistance value is adjusted by forming a trimming groove in a resistor provided on an insulating substrate, and a method of manufacturing such a chip resistor.
　チップ抵抗器は、直方体形状の絶縁基板と、絶縁基板の表面に所定間隔を存して対向配置された一対の表電極と、絶縁基板の裏面に所定間隔を存して対向配置された一対の裏電極と、表電極と裏電極を橋絡する端面電極と、対をなす表電極どうしを橋絡する抵抗体と、抵抗体を覆う保護膜等によって主に構成されている。 The chip resistor includes a rectangular parallelepiped insulating substrate, a pair of front electrodes disposed opposite to the surface of the insulating substrate at a predetermined distance, and a pair of electrodes disposed opposite to the rear surface of the insulating substrate at a predetermined distance. It is mainly composed of a back electrode, an end face electrode that bridges the front electrode and the back electrode, a resistor that bridges the pair of front electrodes, a protective film that covers the resistor, and the like.
　一般的に、このようなチップ抵抗器を製造する場合、大判の集合基板に対して多数個分の電極や抵抗体や保護膜等を一括して形成した後、この集合基板を格子状の分割ライン（例えば分割溝）に沿って分割してチップ抵抗器を多数個取りするようにしている。かかるチップ抵抗器の製造過程で、集合基板の片面には抵抗ペーストを印刷・焼成することにより多数の抵抗体が形成されるが、印刷時の位置ずれや滲み、あるいは焼成炉内の温度むら等の影響により、各抵抗体の大きさや膜厚に若干のばらつきを生じることは避け難いため、集合基板の状態で各抵抗体にトリミング溝を形成して所望の抵抗値に設定するという抵抗値調整作業が行われる。 Generally, in the case of manufacturing such a chip resistor, a large number of electrodes, resistors, protective films, etc. are collectively formed on a large-sized collective substrate, and then the collective substrate is divided into grids. It divides along a line (for example, dividing groove) to take a large number of chip resistors. In the process of manufacturing such a chip resistor, many resistors are formed by printing and baking a resistor paste on one side of the collective substrate, but the positional deviation or blur during printing, or the temperature unevenness in the baking furnace, etc. It is difficult to avoid slight variations in the size and film thickness of each resistor due to the influence of the resistance. Therefore, the adjustment of the resistance value is achieved by forming trimming grooves in each resistor in the collective substrate state and setting the desired resistance value. Work is done.
　このような構成のチップ抵抗器において、静電気や電源ノイズ等で発生するサージ電圧が印加すると、過剰な電気的ストレスにより抵抗器の特性に影響を与えることになり、最悪の場合に抵抗器が破壊されてしまうことがある。サージ特性を向上させるためには、抵抗体を蛇行形状（ミアンダ形状）にして全長を長くすれば、電位降下がなだらかになってサージ特性を改善できることが知られている。 In a chip resistor with such a configuration, when a surge voltage generated by static electricity or power supply noise is applied, excessive electrical stress will affect the characteristics of the resistor, and in the worst case, the resistor may be broken. It may be done. In order to improve the surge characteristics, it is known that the potential drop can be smoothed and the surge characteristics can be improved by making the resistor serpentine shape (meander shape) and lengthening the entire length.
　そこで、図１２に示すように、絶縁基板１１の両端部に所定間隔を存して一対の表電極１２を形成し、次いで、これら両表電極１２間に印刷技法により２ターン蛇行している抵抗体１３を形成した後、この抵抗体１３の蛇行していない領域にレーザートリミング法でトリミング溝１４を形成することにより、抵抗体１３を３ターン分蛇行させるようにしたチップ抵抗器１００が提案されている（特許文献１参照）。 Therefore, as shown in FIG. 12, a pair of front electrodes 12 are formed at predetermined intervals at both ends of the insulating substrate 11, and then a resistance which is two-turn meandering between the two front electrodes 12 by printing technique. A chip resistor 100 is proposed in which the resistor 13 is made to meander for three turns by forming the trimming groove 14 by laser trimming in the non-serpentine region of the resistor 13 after the body 13 is formed. (See Patent Document 1).
　このチップ抵抗器１００においては、スクリーン印刷等の印刷技法とレーザートリミング加工との併用により、抵抗体１３の全長を長く（３ターン蛇行）してサージ特性を向上させることができると共に、トリミング溝１４の形成が抵抗値の調整を兼ねているため、抵抗値精度を向上させることができる。 In the chip resistor 100, the combined use of printing technique such as screen printing and laser trimming makes it possible to increase the overall length of the resistor 13 (three-turn meandering) and improve the surge characteristics, and the trimming groove 14 Since the formation of the two also serves to adjust the resistance value, it is possible to improve the resistance value accuracy.
特開平９－２０５００４号公報Japanese Patent Laid-Open No. 9-205004
　特許文献１に記載された従来技術では、直線状に延びるトリミング溝１４を形成することによって、抵抗値調整を兼ねて抵抗体１３を蛇行させることができるため、印刷技法のみを用いて蛇行形状の抵抗体１３を形成する場合に比べると、抵抗値精度を向上させることができる。しかし、トリミング溝１４の先端部分の抵抗体１３はマイクロクラックの発生によって負荷に弱い部分であるにもかかわらず、当該部分は抵抗体１３の中で特に負荷の集中するターン部の内側であるため、負荷による抵抗値変化などの不具合を発生させてしまう危険性が高くなる。 In the prior art described in Patent Document 1, by forming the trimming grooves 14 extending in a straight line, the resistor 13 can be made to meander as well as adjusting the resistance value. The resistance value accuracy can be improved as compared to the case where the resistor 13 is formed. However, although the resistor 13 at the tip end portion of the trimming groove 14 is a portion which is weak to the load due to the occurrence of the micro crack, the portion is particularly inside the turn portion where the load concentrates in the resistor 13. The risk of causing a failure such as a change in resistance due to a load increases.
　本発明は、このような従来技術の実情に鑑みてなされたもので、その第１の目的は、マイクロクラックに起因する特性への悪影響を軽減できると共に、サージ特性を向上させることが可能なチップ抵抗器を提供することにあり、第２の目的は、そのようなチップ抵抗器の製造方法を提供することにある。 The present invention has been made in view of the circumstances of the prior art as described above, and a first object of the present invention is to reduce the adverse effect on the characteristics caused by the micro crack and to improve the surge characteristics. A second object of the present invention is to provide a resistor, and to provide a method of manufacturing such a chip resistor.
　上記第１の目的を達成するために、本発明のチップ抵抗器は、絶縁基板と、この絶縁基板上に所定間隔を存して対向配置された一対の電極と、これら一対の電極間を橋絡する抵抗体とを備え、前記抵抗体が前記電極と隙間を存して対向する複数のターン部を有する蛇行形状に形成されているチップ抵抗器において、前記ターン部に浮島導体が形成されていると共に、前記抵抗体に前記浮島導体に向かって電極間方向へ延びるトリミング溝が形成されており、前記浮島導体は前記電極に形成されたスリットによって該電極から分離されたものであることを特徴としている。 In order to achieve the first object, a chip resistor according to the present invention comprises an insulating substrate, a pair of electrodes opposed to each other at a predetermined distance on the insulating substrate, and a bridge between the pair of electrodes A chip resistor having a meandering shape including a resistor to be entangled and the resistor having a plurality of turn portions facing each other with a gap to the electrode, a floating island conductor is formed on the turn portion And a trimming groove is formed in the resistor, extending toward the inter-electrode toward the floating island conductor, and the floating island conductor is separated from the electrode by a slit formed in the electrode. And
　このように構成されたチップ抵抗器では、電極と隙間を存して対向するターン部に浮島導体が形成されており、ターン部を流れる電流はターン部の外側に形成された電気抵抗の小さい浮島導体を流れやすいため、ターン部の内側にかかる負荷を軽減することができ、トリミング溝の先端部にマイクロクラックが発生しても、マイクロクラックに起因する特性への悪影響を軽減することができる。また、浮島導体は電極にスリットを入れることで電極から分離されたものであるから、浮島導体をわざわざ別途設ける必要がなく、チップ抵抗器を容易に製造することができる。しかも、抵抗体のターン部と電極との間に位置ずれや滲み等を考慮して広めの隙間を確保しておく必要がなくなり、その分、抵抗体の形成スペースを広くすることができるため、蛇行形状の抵抗体の全長を長くすることが可能となり、サージ特性に優れたチップ抵抗器を実現することができる。 In the chip resistor configured in this way, the floating island conductor is formed in the turn portion facing the electrode with a gap, and the current flowing through the turn portion is a floating island with a small electric resistance formed outside the turn portion. Since it is easy to flow through the conductor, the load applied to the inside of the turn can be reduced, and even if micro cracks occur at the tip of the trimming groove, the adverse effect on the characteristics due to the micro cracks can be reduced. Further, since the floating island conductor is separated from the electrode by forming a slit in the electrode, there is no need to additionally provide the floating island conductor, and the chip resistor can be easily manufactured. In addition, it is not necessary to secure a wide gap in consideration of positional displacement and bleeding between the turn portion of the resistor and the electrode, and the space for forming the resistor can be widened accordingly. It is possible to increase the overall length of the meander-shaped resistor, and a chip resistor having excellent surge characteristics can be realized.
　上記構成のチップ抵抗器において、トリミング溝が電極間距離の１／２以上の長さに形成されていると、ターン部を流れる電流は電気抵抗の小さい浮島導体を流れやすいため、ターン部の内側にかかる負荷をより一層軽減することができる。 In the chip resistor having the above configuration, when the trimming groove is formed to have a length of 1/2 or more of the inter-electrode distance, the current flowing through the turn easily flows through the floating island conductor having a small electric resistance. Can be further reduced.
　また、上記構成のチップ抵抗器において、スリットとトリミング溝を別工程で形成したり、異なる手段を用いて形成することも可能であるが、これらスリットとトリミング溝とが連続していると、例えば電極に照射したレーザー光をそのまま抵抗体まで延ばせば、スリットによる浮島導体の形成とトリミング溝による抵抗値調整とを連続的に行うことができる。 In the chip resistor having the above configuration, the slit and the trimming groove may be formed in separate steps, or may be formed using different means, but when the slit and the trimming groove are continuous, for example, If the laser beam irradiated to the electrode is directly extended to the resistor, the formation of the floating island conductor by the slit and the adjustment of the resistance value by the trimming groove can be continuously performed.
　また、上記構成のチップ抵抗器において、トリミング溝によって抵抗体の蛇行形状が規定されるように構成しても良いが、抵抗体の印刷パターンとトリミング溝の両方によって蛇行形状が規定されるように構成することも可能である。例えば、２つのターン部の一方を抵抗体の印刷パターンによって形成する場合、抵抗体にターン部に向かって相手側の電極方向へ延びる切込みを予め印刷形成しておき、電極に形成したスリットの先端を切込みに連続させると共に、切込みの幅をスリットよりも広く設定するという構成にすると、切込みに連続するスリットの先端が抵抗体と離間するため、抵抗体にマイクロクラックが発生しなくなる。したがって、マイクロクラックに起因する特性への悪影響をより一層軽減することができる。なお、切込みの全長に亘って切込みの幅をスリットよりも広く設定しても良いが、切込みのうちスリットの先端に連続する部分だけ、切込みの幅をスリットよりも広く設定するようにしても良い。 In the chip resistor having the above configuration, the meandering shape of the resistor may be defined by the trimming groove, but the meandering shape may be defined by both the printed pattern of the resistor and the trimming groove. It is also possible to configure. For example, when one of the two turn portions is formed by a printed pattern of a resistor, a notch extending in the direction of the other electrode toward the turn portion is printed in advance in the resistor, and the tip of the slit formed in the electrode If the width of the cut is set wider than that of the slit, the tip of the slit continuous to the cut is separated from the resistor, so that the micro crack does not occur in the resistor. Therefore, the adverse effect on the properties due to the micro crack can be further reduced. Although the width of the cut may be set wider than the slit over the entire length of the cut, the width of the cut may be set wider than the slit only in the portion of the cut continuous to the tip of the slit. .
　また、上記構成のチップ抵抗器において、一対の電極の少なくとも一方に相手側の電極方向へ突出する凸部が形成されていると共に、この凸部に抵抗体が接続されており、凸部に対してスリットを電極間方向と直交する方向に沿って形成することにより、凸部が電極から分離されて浮島導体となるように構成すると、凸部を直線的に切断することが可能になるため、浮島導体を容易に形成することができる。 Further, in the chip resistor having the above configuration, a convex portion protruding in the direction of the other electrode is formed on at least one of the pair of electrodes, and a resistor is connected to the convex portion to the convex portion By forming the slits along the direction perpendicular to the inter-electrode direction, the projection can be cut linearly if it is configured such that the projection is separated from the electrode and becomes a floating island conductor. The floating island conductor can be easily formed.
　この場合において、抵抗体にターン部に向かって電極方向へ延びる切込みが印刷形成されていると共に、凸部の幅が該凸部に重なる抵抗体の幅より小さく設定されており、凸部を縦断するスリットの先端がこの切込みに連続していると、凸部と抵抗体の重なり部分の近傍に切込みに繋がるスペースが確保され、このスペースに連続するスリットの先端が抵抗体と離間するため、抵抗体にマイクロクラックは発生しなくなる。したがって、切込みの幅を狭く設定することが可能となり、その分、抵抗体の形成スペースを広くすることができる。 In this case, a notch extending in the electrode direction toward the turn is printed on the resistor, and the width of the protrusion is set smaller than the width of the resistor overlapping the protrusion, and the protrusion is cut longitudinally When the tip of the slit is continuous with this cut, a space connected to the cut is secured in the vicinity of the overlapping portion of the convex portion and the resistor, and the tip of the slit continuous with this space is separated from the resistor. There are no micro cracks in the body. Therefore, the width of the cut can be set narrow, and the space for forming the resistor can be enlarged accordingly.
　また、上記第２の目的を達成するために、本発明によるチップ抵抗器の製造方法は、絶縁基板と、この絶縁基板上に所定間隔を存して対向配置された一対の電極と、これら一対の電極間を橋絡する抵抗体とを備え、前記抵抗体が前記電極と隙間を存して対向する複数のターン部を有する蛇行形状に形成されているチップ抵抗器の製造方法において、前記電極に前記抵抗体との接続箇所に達するスリットを形成することにより、前記ターン部に前記電極から分離された浮島導体を形成する工程と、前記スリットを延長して前記抵抗体に前記浮島導体に向かって電極間方向へ延びるトリミング溝を形成する工程と、を含むことを特徴としている。 Further, in order to achieve the above second object, a method of manufacturing a chip resistor according to the present invention comprises an insulating substrate, a pair of electrodes disposed opposite to each other with a predetermined gap on the insulating substrate, and a pair of these And a resistor for bridging between the electrodes, wherein the resistor is formed in a serpentine shape having a plurality of turn portions facing each other with a gap between the electrodes. Forming a floating island conductor separated from the electrode at the turn portion by forming a slit reaching the connection portion with the resistor, extending the slit and extending the slit toward the floating island conductor Forming a trimming groove extending in a direction between the electrodes.
　このような工程を含むチップ抵抗器の製造方法では、トリミング溝の先端部と対向する抵抗体のターン部に浮島導体が形成され、このターン部を流れる電流はターン部の外側に形成された電気抵抗の小さい浮島導体を流れやすいため、ターン部の内側にかかる負荷を軽減することができ、トリミング溝の先端部にマイクロクラックが発生しても、マイクロクラックに起因する特性への悪影響を軽減することができる。また、浮島導体は電極にスリットを入れることで電極から分離されたものであるから、浮島導体をわざわざ別途設ける必要がなく、チップ抵抗器を容易に製造することができる。しかも、抵抗体のターン部と電極との間に位置ずれや滲み等を考慮して広めの隙間を確保しておく必要がなくなり、その分、抵抗体の形成スペースを広くすることができるため、蛇行形状の抵抗体の全長を長くすることが可能となり、サージ特性に優れたチップ抵抗器を実現することができる。 In a method of manufacturing a chip resistor including such steps, a floating island conductor is formed on the turn of the resistor facing the tip of the trimming groove, and the current flowing through the turn is the electric current formed on the outside of the turn The load on the inside of the turn can be reduced because it is easy to flow through the floating island conductor with low resistance, and even if micro cracks occur at the tip of the trimming groove, the adverse effect on the characteristics due to micro cracks is reduced. be able to. Further, since the floating island conductor is separated from the electrode by forming a slit in the electrode, there is no need to additionally provide the floating island conductor, and the chip resistor can be easily manufactured. In addition, it is not necessary to secure a wide gap in consideration of positional displacement and bleeding between the turn portion of the resistor and the electrode, and the space for forming the resistor can be widened accordingly. It is possible to increase the overall length of the meander-shaped resistor, and a chip resistor having excellent surge characteristics can be realized.
　本発明によれば、マイクロクラックに起因する特性への悪影響を軽減できると共に、サージ特性を向上させることが可能なチップ抵抗器を提供することができる。 According to the present invention, it is possible to provide a chip resistor capable of improving the surge characteristics as well as reducing the adverse effect on the characteristics due to the micro crack.
本発明の第１実施形態例に係るチップ抵抗器の平面図である。It is a top view of the chip resistor concerning a 1st example of an embodiment of the present invention. 第１実施形態例に係るチップ抵抗器の製造工程を示す説明図である。It is an explanatory view showing a manufacturing process of a chip resistor concerning a 1st example of an embodiment. 本発明の第２実施形態例に係るチップ抵抗器の平面図である。It is a top view of the chip resistor concerning a 2nd embodiment of the present invention. 本発明の第３実施形態例に係るチップ抵抗器の平面図である。It is a top view of the chip resistor concerning a 3rd embodiment of the present invention. 第３実施形態例に係るチップ抵抗器の製造工程を示す説明図である。It is explanatory drawing which shows the manufacturing process of the chip resistor which concerns on the example of 3rd Embodiment. 本発明の第４実施形態例に係るチップ抵抗器の平面図である。It is a top view of the chip resistor concerning a 4th example of embodiment of the present invention. 本発明の第５実施形態例に係るチップ抵抗器の平面図である。It is a top view of the chip resistor concerning a 5th example of embodiment of the present invention. 第５実施形態例に係るチップ抵抗器の製造工程を示す説明図である。It is explanatory drawing which shows the manufacturing process of the chip resistor which concerns on the example of 5th Embodiment. 本発明の第６実施形態例に係るチップ抵抗器の平面図である。It is a top view of the chip resistor concerning a 6th embodiment of the present invention. 本発明の第７実施形態例に係るチップ抵抗器の平面図である。It is a top view of the chip resistor concerning a 7th embodiment of the present invention. 第７実施形態例に係るチップ抵抗器の製造工程を示す説明図である。It is explanatory drawing which shows the manufacturing process of the chip resistor which concerns on the example of 7th Embodiment. 従来例に係るチップ抵抗器の平面図である。It is a top view of the chip resistor concerning a conventional example.
　発明の実施の形態について図面を参照して説明すると、図１に示すように、本発明の第１実施形態例に係るチップ抵抗器１は、直方体形状の絶縁基板２と、絶縁基板２の表面における長手方向両端部に所定間隔を存して対向配置された第１電極３および第２電極４と、これら第１および第２電極３，４に接続する蛇行形状の抵抗体５と、抵抗体５を覆う図示せぬ保護膜等によって主に構成されている。 A preferred embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 1, a chip resistor 1 according to a first embodiment of the present invention includes a rectangular parallelepiped insulating substrate 2 and a surface of the insulating substrate 2 The first electrode 3 and the second electrode 4 disposed opposite to each other with a predetermined interval at both ends in the longitudinal direction, the meandering resistor 5 connected to the first and second electrodes 3 and 4, and the resistor It is mainly comprised by the protective film etc. which cover 5 which are not shown.
　絶縁基板２はセラミック等からなり、この絶縁基板２は後述する大判の集合基板を縦横の分割溝に沿って分割して多数個取りされたものである。 The insulating substrate 2 is made of ceramic or the like, and the insulating substrate 2 is obtained by dividing a large-sized collective substrate to be described later along dividing grooves in the vertical and horizontal directions.
　第１電極３と第２電極４はＡｇ系ペーストをスクリーン印刷して乾燥・焼成させたものである。図示左側の第１電極３は段付き状に突出する下端部が抵抗体５の一端部と接続されており、図示右側の第２電極４は段付き状に突出する上端部が抵抗体５の他端部と接続されている。 The 1st electrode 3 and the 2nd electrode 4 screen-print Ag-based paste, and are dried and baked. The lower end portion of the first electrode 3 shown on the left side of the drawing is connected to one end of the resistor 5, and the upper end of the second electrode 4 shown on the right side of the drawing shown in FIG. It is connected to the other end.
　抵抗体５は酸化ルテニウム等の抵抗体ペーストをスクリーン印刷して乾燥・焼成させたものであり、この抵抗体５は電極間方向に延びるリード部５ａが延出方向を反転するターン部５ｂを介して連続する蛇行形状（ミアンダ形状）に形成されている。本実施形態例の場合、３つのリード部５ａが２つのターン部５ｂを介して交互に連続する２ターン蛇行の抵抗体５となっており、これら３つのリード部５ａのうち、下段側のリード部５ａが第１電極３に接続され、上段側のリード部５ａが第２電極４に接続されている。また、２つのターン部５ｂにはそれぞれ浮島導体６Ａ，６Ｂが形成されており、これら浮島導体６Ａ，６Ｂは第１および第２電極３，４と同一材料からなる。図示左側の浮島導体６ＡはＬ字状のスリットＳ１を介して第１電極３に対向しており、図示右側の浮島導体６Ｂは逆Ｌ字状のスリットＳ２を介して第２電極４に対向している。 The resistor 5 is obtained by screen-printing a resistor paste such as ruthenium oxide, dried, and fired, and the resistor 5 has a lead portion 5a extending in the interelectrode direction through the turn portion 5b whose direction of extension is reversed. It is formed in a continuous meandering shape (meaning shape). In the case of the present embodiment, the three lead portions 5a form a resistor body 5 of two-turn meandering which continues alternately via two turn portions 5b, and among these three lead portions 5a, the leads on the lower side The portion 5 a is connected to the first electrode 3, and the lead portion 5 a on the upper side is connected to the second electrode 4. In addition, floating island conductors 6A and 6B are respectively formed in the two turn portions 5b, and these floating island conductors 6A and 6B are made of the same material as the first and second electrodes 3 and 4. The floating island conductor 6A on the left side of the drawing faces the first electrode 3 via the L-shaped slit S1, and the floating island conductor 6B on the right side of the drawing faces the second electrode 4 via the reverse L-shaped slit S2. ing.
　抵抗体５には抵抗値調整用の２本のトリミング溝７Ａ，７Ｂが形成されており、これらトリミング溝７Ａ，７Ｂによって抵抗体５はＳ字状の蛇行形状となっている。図示下側のトリミング溝７Ａは第１電極３に形成されたスリットＳ１の先端部に連続して電極間方向へ延びており、このトリミング溝７Ａの先端は図示右側のターン部５ｂに形成された浮島導体６Ｂに対向している。図示上側のトリミング溝７Ｂは第２電極４に形成されたスリットＳ２の先端部に連続して電極間方向へ延びており、このトリミング溝７Ｂの先端は図示左側のターン部５ｂに形成された浮島導体６Ａに対向している。詳細については後述するが、スリットＳ１とトリミング溝７ＡおよびスリットＳ２とトリミング溝７Ｂは、レーザー光の照射によってそれぞれ連続的に形成されたものであり、それぞれの幅寸法は同一に設定されている。 Two trimming grooves 7A and 7B for adjusting the resistance value are formed in the resistor 5, and the resistor 5 has an S-shaped meandering shape by the trimming grooves 7A and 7B. The trimming groove 7A on the lower side in the drawing extends continuously in the inter-electrode direction continuously from the tip of the slit S1 formed in the first electrode 3, and the tip of the trimming groove 7A is formed in the turn 5b on the right in the figure. It faces the floating island conductor 6B. The trimming groove 7B on the upper side in the figure extends continuously in the inter-electrode direction continuously to the tip of the slit S2 formed in the second electrode 4, and the tip of the trimming groove 7B is a floating island formed in the turn 5b on the left side in the figure. It faces the conductor 6A. Although details will be described later, the slit S1 and the trimming groove 7A, and the slit S2 and the trimming groove 7B are respectively formed continuously by laser beam irradiation, and their width dimensions are set to be the same.
　図示せぬ保護膜はエポキシ系の樹脂ペーストをスクリーン印刷して加熱硬化させたものであり、この保護膜は抵抗体５を外部環境から保護する機能を有している。 The protective film (not shown) is obtained by screen printing an epoxy resin paste and heat curing it. The protective film has a function of protecting the resistor 5 from the external environment.
　次に、上記の如く構成されたチップ抵抗器１の製造工程について、図２を参照しながら説明する。 Next, a manufacturing process of the chip resistor 1 configured as described above will be described with reference to FIG.
　まず、絶縁基板２が多数個取りされる大判の集合基板を準備する。この集合基板には予め１次分割溝と２次分割溝が格子状に設けられており、両分割溝によって区切られたマス目の１つ１つが１個分のチップ領域となる。図２には１個分のチップ領域に相当する集合基板２Ａが代表して示されているが、実際は多数個分のチップ領域に相当する集合基板に対して以下に説明する各工程が一括して行われる。 First, a large-sized collective substrate in which a large number of insulating substrates 2 are taken is prepared. In this collective substrate, primary division grooves and secondary division grooves are provided in advance in a lattice shape, and each one of the squares divided by both division grooves becomes one chip area. Although the collective substrate 2A corresponding to one chip area is representatively shown in FIG. 2, in actuality, each process described below is collectively performed on a collective substrate corresponding to a large number of chip areas. Be done.
　すなわち、図２（ａ）に示すように、この集合基板２Ａの表面にＡｇ系ペーストをスクリーン印刷した後、これを乾燥・焼成して一対の第１電極３と第２電極４を形成する（表電極形成工程）。なお、この表電極形成工程と同時あるいは前後して、集合基板２Ａの裏面にＡｇ系ペーストをスクリーン印刷した後、これを乾燥・焼成することにより、第１および第２電極３，４に対応する図示せぬ裏電極を形成する（裏電極形成工程）。 That is, as shown in FIG. 2A, after Ag-based paste is screen-printed on the surface of the collective substrate 2A, it is dried and fired to form a pair of first electrodes 3 and a second electrode 4 (see FIG. Front electrode formation process). At the same time or before or after the front electrode forming step, an Ag-based paste is screen-printed on the back surface of the collective substrate 2A, and then dried and fired to correspond to the first and second electrodes 3 and 4. A back electrode (not shown) is formed (back electrode formation step).
　次に、集合基板２Ａの表面に酸化ルテニウム等の抵抗体ペーストをスクリーン印刷して乾燥・焼成することにより、図２（ｂ）に示すように、両端部が第１電極３と第２電極４に重なる長方形状の抵抗体５を形成する（抵抗体印刷工程）。 Next, a resistor paste such as ruthenium oxide is screen-printed on the surface of the collective substrate 2A, dried and fired to form first and second electrodes 3 and 4 at both ends as shown in FIG. 2 (b). To form a rectangular resistor 5 (resistor printing step).
　次に、図２（ｃ）に示すように、レーザー光を第１電極３の上端部から電極間方向と直交する方向（下方）へ照射した後、これを電極間方向へ直角に方向変換して抵抗体５にもレーザー光を照射する（符号ＬＴ１参照）。 Next, as shown in FIG. 2C, the laser light is irradiated from the upper end of the first electrode 3 in the direction (downward) orthogonal to the inter-electrode direction, and then it is changed in direction to the inter-electrode direction The laser light is also irradiated to the resistor 5 (see reference numeral LT1).
　これにより、図２（ｄ）に示すように、第１電極３の上端部から抵抗体５に達するＬ字状のスリットＳ１が形成され、このスリットＳ１によって第１電極３から分離された部分が浮島導体６Ａとなる（電極切断工程）。また、抵抗体５にスリットＳ１の先端と連続するトリミング溝７Ａが形成され、このトリミング溝７Ａが第２電極４に向かって直線状に延びることにより、抵抗体５の抵抗値が目標抵抗値よりも幾分下回る値まで抵抗値調整される（抵抗値調整工程）。 As a result, as shown in FIG. 2D, an L-shaped slit S1 reaching the resistor 5 from the upper end of the first electrode 3 is formed, and the portion separated from the first electrode 3 by the slit S1 is It becomes floating island conductor 6A (electrode cutting process). Further, a trimming groove 7A continuous with the tip of the slit S1 is formed in the resistor 5, and the trimming groove 7A linearly extends toward the second electrode 4 so that the resistance value of the resistor 5 is greater than the target resistance value. The resistance is adjusted to a value slightly lower than the above (resistance adjustment step).
　次に、図２（ｄ）に示すように、レーザー光を第２電極４の下端部から電極間方向と直交する方向（上方）へ照射した後、これを電極間方向へ直角に方向変換して抵抗体５にもレーザー光を照射する（符号ＬＴ２参照）。 Next, as shown in FIG. 2D, the laser light is irradiated from the lower end of the second electrode 4 in a direction (upward) perpendicular to the inter-electrode direction, and then it is changed to a right direction in the inter-electrode direction The laser light is also irradiated to the resistor 5 (see reference numeral LT2).
　これにより、図２（ｅ）に示すように、第２電極４の下端部から抵抗体５に達する逆Ｌ字状のスリットＳ２が形成され、このスリットＳ２によって第２電極４から分離された部分が浮島導体６Ｂとなる。また、抵抗体５にスリットＳ２の先端と連続するトリミング溝７Ｂが形成され、このトリミング溝７Ｂが第１電極３に向かって直線状に延びることにより、抵抗体５の抵抗値が目標抵抗値となるように抵抗値調整される。なお、スリットＳ１とスリットＳ２の形成順序は上記と逆でも良く、第２電極４側からスリットＳ２とそれに続くトリミング溝７Ｂを形成した後に、第１電極３側からスリットＳ１とそれに続くトリミング溝７Ａを形成することも可能である。 As a result, as shown in FIG. 2E, an inverted L-shaped slit S2 reaching the resistor 5 from the lower end of the second electrode 4 is formed, and a portion separated from the second electrode 4 by the slit S2 Is the floating island conductor 6B. Further, a trimming groove 7B continuous to the tip of the slit S2 is formed in the resistor 5, and the trimming groove 7B linearly extends toward the first electrode 3 so that the resistance value of the resistor 5 becomes the target resistance value. The resistance value is adjusted to be The order of forming the slits S1 and S2 may be reversed, and after the slit S2 and the subsequent trimming groove 7B are formed from the second electrode 4 side, the slit S1 and the subsequent trimming groove 7A are formed from the first electrode 3 side. It is also possible to form
　このようにスリットＳ１，Ｓ２と２本のトリミング溝７Ａ，７Ｂが形成された時点で、長方形状に印刷された抵抗体５は２つのターン部５ｂを介して連続する蛇行形状となり、これら両ターン部５ｂに第１電極３と第２電極４から分離した浮島導体６Ａ，６Ｂが形成される。なお、抵抗体５の表面をガラスペースト等からなるプリコート層で覆い、このプリコート層の上からレーザー光を照射するようにしても良い。 When the slits S1 and S2 and the two trimming grooves 7A and 7B are formed as described above, the resistor 5 printed in a rectangular shape becomes a continuous meandering shape through the two turn portions 5b. The floating island conductors 6A and 6B separated from the first electrode 3 and the second electrode 4 are formed in the portion 5b. The surface of the resistor 5 may be covered with a precoat layer of glass paste or the like, and laser light may be irradiated from above the precoat layer.
　次に、両スリットＳ１，Ｓ２を含む領域にエポキシ系樹脂ペーストをスクリーン印刷して加熱硬化することにより、第１電極３と第２電極４の浮島導体６Ａ，６Ｂを含む一部と抵抗体５の全体を覆う図示せぬ保護膜を形成する（保護膜形成工程）。 Next, epoxy resin paste is screen-printed in a region including both slits S1 and S2 and heat curing is performed, whereby a portion including floating island conductors 6A and 6B of the first electrode 3 and the second electrode 4 and the resistor 5 Forming a protective film (not shown) covering the entire surface of the substrate (protective film forming step).
　ここまでの各工程は多数個取り用の集合基板２Ａに対する一括処理であるが、次なる工程では、集合基板２Ａを１次分割溝に沿って短冊状に分割するという１次ブレーク加工を行うことより、複数個分のチップ領域が設けられた図示せぬ短冊状基板を得る（１次分割工程）。次いで、短冊状基板の分割面にＡｇペーストを塗布して乾燥・焼成したり、Ａｇペーストの代わりにＮｉ／Ｃｒをスパッタすることにより、第１電極３および第２電極４と対応する裏電極とを橋絡する図示せぬ端面電極を形成する（端面電極形成工程）。 Each of the steps up to here is batch processing on the collective substrate 2A for taking a large number of pieces, but in the next step, primary break processing of dividing the collective substrate 2A into strip shapes along primary division grooves is performed Thus, a strip-like substrate (not shown) provided with a plurality of chip areas is obtained (primary division step). Then, an Ag paste is applied to the divided surface of the strip-like substrate, dried and fired, or Ni / Cr is sputtered instead of the Ag paste to form the first electrode 3 and the second electrode 4 and the corresponding back electrode. Form an end face electrode (not shown) for bridging (end face electrode forming step).
　しかる後、短冊状基板を２次分割溝に沿って分割するという２次ブレーク加工を行うことにより、チップ抵抗器１と同等の大きさのチップ単体を得る（２次分割工程）。最後に、個片化された各チップ単体の絶縁基板の長手方向両端部にＮｉとＡｕやＳｎ等の電解メッキを施し、保護膜から露出する第１電極３と第２電極４を覆う図示せぬ外部電極を形成することにより、図１に示すようなチップ抵抗器１が得られる。 Thereafter, by performing secondary break processing of dividing the strip-like substrate along the secondary division grooves, a single chip of the same size as the chip resistor 1 is obtained (secondary division step). Finally, electrolytic plating of Ni, Au, Sn, etc. is applied to both end portions in the longitudinal direction of the insulating substrate of each singulated chip to cover the first electrode 3 and the second electrode 4 exposed from the protective film. By forming an external electrode, a chip resistor 1 as shown in FIG. 1 is obtained.
　以上説明したように、第１実施形態例に係るチップ抵抗器１では、トリミング溝７Ａ，７Ｂの先端部と対向する抵抗体５のターン部５ｂに浮島導体６Ａ，６Ｂが形成されており、ターン部５ｂを流れる電流はターン部５ｂの外側に形成された電気抵抗の小さい浮島導体６Ａ，６Ｂを流れやすいため、ターン部５ｂの内側にかかる負荷を軽減することができ、トリミング溝７Ａ，７Ｂの先端部にマイクロクラックが発生しても、マイクロクラックに起因する特性への悪影響を軽減することができる。 As described above, in the chip resistor 1 according to the first embodiment, the floating island conductors 6A and 6B are formed in the turn portion 5b of the resistor 5 opposed to the tips of the trimming grooves 7A and 7B. The current flowing through the portion 5b can easily flow through the floating island conductors 6A and 6B having small electric resistance formed outside the turn portion 5b, so that the load applied to the inside of the turn portion 5b can be reduced. Even if microcracks occur at the tip, adverse effects on the characteristics due to the microcracks can be reduced.
　また、浮島導体６Ａ，６ＢはスリットＳ１，Ｓ２によって第１電極３と第２電極４から分離されたものであるから、浮島導体６Ａ，６Ｂをわざわざ別途設けるという面倒な工程必要がなくなり、チップ抵抗器１を容易に製造することができる。しかも、抵抗体５のターン部５ｂと両電極３，４との間に位置ずれや滲み等を考慮して広めの隙間を確保しておく必要がなくなり、その分、抵抗体５の形成スペースを広くすることができるため、蛇行形状の抵抗体５の全長を長くすることが可能となり、サージ特性に優れたチップ抵抗器１を実現することができる。 Further, since the floating island conductors 6A and 6B are separated from the first electrode 3 and the second electrode 4 by the slits S1 and S2, there is no need for the troublesome process of separately providing the floating island conductors 6A and 6B The vessel 1 can be easily manufactured. Moreover, it is not necessary to secure a wider gap in consideration of positional deviation, bleeding, etc. between the turn 5b of the resistor 5 and the two electrodes 3 and 4, and accordingly, a space for forming the resistor 5 is increased. Since the width can be increased, the total length of the meander-shaped resistor 5 can be increased, and the chip resistor 1 having excellent surge characteristics can be realized.
　さらに、スリットＳ１，Ｓ２とトリミング溝７Ａ，７Ｂとが連続しているため、第１電極３に照射したレーザー光をそのまま抵抗体５まで延ばしてトリミング溝７Ａを形成したり、第２電極４に照射したレーザー光をそのまま抵抗体５まで延ばしてトリミング溝７Ｂを形成することができ、浮島導体６Ａ，６Ｂの形成と抵抗値調整を連続的に行うことができる。 Furthermore, since the slits S1 and S2 and the trimming grooves 7A and 7B are continuous, the laser beam irradiated to the first electrode 3 is directly extended to the resistor 5 to form the trimming groove 7A, or the second electrode 4 is formed. The irradiated laser beam can be extended as it is to the resistor 5 to form the trimming groove 7B, and the formation of the floating island conductors 6A and 6B and the adjustment of the resistance value can be continuously performed.
　図３は本発明の第２実施形態例に係るチップ抵抗器１０の平面図であり、図１に対応する部分には同一符号を付してある。第２実施形態例に係るチップ抵抗器１０が第１実施形態例に係るチップ抵抗器１と相違する点は、スリットＳ２に連続するトリミング溝７Ｂの先端が浮島導体６Ａまで達していることにあり、それ以外の構成は基本的に同様である。 FIG. 3 is a plan view of a chip resistor 10 according to a second embodiment of the present invention. The parts corresponding to FIG. 1 are given the same reference numerals. The difference between the chip resistor 10 according to the second embodiment and the chip resistor 1 according to the first embodiment is that the tip of the trimming groove 7B continuing to the slit S2 reaches the floating island conductor 6A. The other configurations are basically the same.
　このように構成されたチップ抵抗器１０によれば、浮島導体６Ａと接触するトリミング溝７Ｂの先端にマイクロクラックは発生せず、マイクロクラックが発生する部位はもう一方の浮島導体６Ｂと対向するトリミング溝７Ａの先端１箇所だけとなるため、マイクロクラックに起因する特性への悪影響をより一層軽減することができる。 According to the chip resistor 10 configured in this manner, microcracks are not generated at the tip of the trimming groove 7B in contact with the floating island conductor 6A, and the portion where the microcrack is generated is trimming facing the other floating island conductor 6B. Since only one tip of the groove 7A is provided, the adverse effect on the characteristics due to the micro crack can be further reduced.
　図４は本発明の第３実施形態例に係るチップ抵抗器２０の平面図、図５は第３実施形態例に係るチップ抵抗器２０の製造工程を示す説明図であり、図１，２に対応する部分には同一符号を付してある。 FIG. 4 is a plan view of a chip resistor 20 according to a third embodiment of the present invention, and FIG. 5 is an explanatory view showing a manufacturing process of the chip resistor 20 according to the third embodiment. The corresponding parts are given the same reference numerals.
　図４に示す第３実施形態例に係るチップ抵抗器２０が第１実施形態例に係るチップ抵抗器１と相違する点は、抵抗体５に第２電極４から一方の浮島導体６Ａに向かって延びる切込み８が印刷形成されており、この切込み８と第１電極３から他方の浮島導体６Ｂに向かって延びるトリミング溝７Ａとによって抵抗体５の蛇行形状が規定されていることにあり、それ以外の構成は基本的に同様である。すなわち、抵抗体５に印刷形成された切込み８によって一方のターン部５ｂが規定されると共に、この切込み８に第２電極４に形成されたスリットＳ２の先端が連続するように構成されており、切込み８の幅寸法はスリットＳ２よりも十分に幅広に設定されている。 The difference between the chip resistor 20 according to the third embodiment shown in FIG. 4 and the chip resistor 1 according to the first embodiment is that the resistor 5 is directed from the second electrode 4 to one floating island conductor 6A. The extending cut 8 is formed by printing, and the serpentine shape of the resistor 5 is defined by the cut 8 and the trimming groove 7A extending from the first electrode 3 to the other floating island conductor 6B, and others The configuration of is basically the same. That is, one of the turn portions 5b is defined by the notch 8 printed on the resistor 5, and the tip of the slit S2 formed in the second electrode 4 is continuous to the notch 8; The width dimension of the incision 8 is set sufficiently wider than the slit S2.
　このように構成されたチップ抵抗器２０の製造工程について説明すると、図５（ａ）に示すように、集合基板２Ａの表面に所定間隔を存して対向する一対の第１電極３と第２電極４を形成した後、図５（ｂ）に示すように、両端部が第１電極３と第２電極４に重なる抵抗体５を印刷形成する。この抵抗体５の内側領域には、第２電極４を始点として第１電極３の手前位置まで延びる長方形状の切込み８が形成されている。 The manufacturing process of the chip resistor 20 configured in this way will be described. As shown in FIG. 5A, the pair of first electrodes 3 and the second electrodes facing each other with a predetermined interval on the surface of the collective substrate 2A. After the electrode 4 is formed, as shown in FIG. 5B, a resistor 5 is formed by printing, the both ends of which overlap the first electrode 3 and the second electrode 4. In the inner region of the resistor 5, a rectangular notch 8 extending from the second electrode 4 to a position in front of the first electrode 3 is formed.
　次に、図５（ｃ）に示すように、レーザー光を第２電極４の下端部から電極間方向と直交する方向（上方）へ照射した後、これを電極間方向へ直角に方向変換して切込み８内まで走査することにより（符号ＬＴ２参照）、図５（ｄ）に示すように、第２電極４の下端部から切込み８に達する逆Ｌ字状のスリットＳ２を形成すると、このスリットＳ２によって第２電極４から分離した浮島導体６Ｂが得られる。その際、切込み８がスリットＳ２に対して幅広に設定されているため、スリットＳ２の先端が切込み８に対して多少位置ずれしても、スリットＳ２の先端を切込み８に簡単かつ確実に連続させることができる。また、切込み８に連続するスリットＳ２の先端が抵抗体５と離間するため、抵抗体５にマイクロクラックは発生しなくなる。 Next, as shown in FIG. 5C, the laser light is irradiated from the lower end of the second electrode 4 in a direction (upward) orthogonal to the inter-electrode direction, and then it is changed to a right direction in the inter-electrode direction By forming an inverted L-shaped slit S2 extending from the lower end of the second electrode 4 to the notch 8 as shown in FIG. 5D by scanning into the notch 8 (see symbol LT2), this slit is formed. The floating island conductor 6B separated from the second electrode 4 is obtained by S2. At this time, since the cut 8 is set wider than the slit S2, even if the tip of the slit S2 is slightly misaligned with respect to the cut 8, the tip of the slit S2 is made continuous with the cut 8 simply and reliably. be able to. In addition, since the tip of the slit S2 continuing to the cut 8 is separated from the resistor 5, micro cracks do not occur in the resistor 5.
　次に、図５（ｄ）に示すように、レーザー光を第１電極３の上端部から電極間方向と直交する方向（下方）へ照射した後、これを電極間方向へ直角に方向変換することにより（符号ＬＴ１参照）、図５（ｅ）に示すように、第１電極３にＬ字状のスリットＳ１を形成すると共に、抵抗体５にスリットＳ１の先端と連続するトリミング溝７Ａを形成する。このスリットＳ１によって第１電極３から分離した浮島導体６Ａが得られ、この浮島導体６Ａは切込み８と対向するターン部５ｂに形成される。また、トリミング溝７Ａによって抵抗体５の抵抗値が目標抵抗値となるように抵抗値調整される。この時点で抵抗体５は切込み８とトリミング溝７Ａによって２つのターン部５ｂを有する蛇行形状となる。なお、これ以降の工程は第１実施形態例と基本的に同様であるため、ここでは重複する説明を省略する。 Next, as shown in FIG. 5D, the laser light is irradiated from the upper end portion of the first electrode 3 in a direction (downward) orthogonal to the inter-electrode direction, and then the direction is orthogonally changed to the inter-electrode direction Thus, as shown in FIG. 5 (e), the L-shaped slit S1 is formed in the first electrode 3 and the trimming groove 7A continuous with the tip of the slit S1 is formed in the resistor 5, as shown in FIG. Do. The floating island conductor 6A separated from the first electrode 3 is obtained by the slits S1, and the floating island conductor 6A is formed in the turn portion 5b opposed to the cut 8. Further, the resistance value of the resistor 5 is adjusted by the trimming groove 7A so as to be the target resistance value. At this time, the resistor 5 has a serpentine shape having two turn parts 5b by the cut 8 and the trimming groove 7A. The subsequent steps are basically the same as those of the first embodiment, and thus redundant description will be omitted.
　以上説明したように、第３実施形態例に係るチップ抵抗器２０では、抵抗体５に一方のターン部５ｂに向かって電極方向へ延びる切込み８を予め印刷形成しておき、この切込み８に第２電極４に形成したスリットＳ２の先端を連続させると共に、切込み８の幅をスリットＳ２よりも広く設定しているため、切込み８に連続するスリットＳ２の先端にマイクロクラックは発生せず、マイクロクラックに起因する特性への悪影響をより一層軽減することができる。 As described above, in the chip resistor 20 according to the third embodiment, the notch 8 extending in the electrode direction toward the one turn 5b is printed and formed in the resistor 5 in advance. Since the tip of the slit S2 formed in the two electrodes 4 is made continuous and the width of the cut 8 is set wider than the slit S2, no microcrack is generated at the tip of the slit S2 continuous to the cut 8 It is possible to further reduce the adverse effect on the properties caused by
　図６は本発明の第４実施形態例に係るチップ抵抗器３０の平面図であり、図１に対応する部分には同一符号を付してある。第３実施形態例に係るチップ抵抗器２０では、第１電極３から分離する浮島導体６Ａと切込み８との間に抵抗体５の一部を介在させているが、図６に示すチップ抵抗器３０のように、切込み８の先端を浮島導体６Ａまで延ばしても良い。 FIG. 6 is a plan view of a chip resistor 30 according to a fourth embodiment of the present invention. The parts corresponding to FIG. 1 are given the same reference numerals. In the chip resistor 20 according to the third embodiment, a part of the resistor 5 is interposed between the floating island conductor 6A separated from the first electrode 3 and the notch 8, but the chip resistor shown in FIG. 6 As in 30, the tip of the cut 8 may be extended to the floating island conductor 6A.
　ここで、切込み８によって分離された２つの抵抗体５のうち、図示上側の抵抗体に符号５Ａを付し、図示下側の抵抗体に符号５Ｂを付すと、抵抗体５Ａの幅はトリミング溝７Ａが形成された抵抗体５Ｂの幅よりも狭く設定されている。このようにすると、負荷は幅の狭い方の抵抗体５Ａにかかりやすくなり、この抵抗体５Ａにはトリミング溝によるマイクロクラックが発生しないため、トリミング溝７Ａが形成された抵抗体５Ｂの負荷を軽減でき、結果的にチップ抵抗器３０全体の負荷特性を向上することができる。 Here, among the two resistors 5 separated by the notch 8, when the symbol 5A is attached to the resistor on the upper side in the drawing and the resistor 5B on the lower side in the drawing, the width of the resistor 5A is a trimming groove The width is set smaller than the width of the resistor 5B in which 7A is formed. In this case, a load is likely to be applied to the narrower resistor 5A, and microcracks are not generated by the trimming groove in this resistor 5A, so the load on the resistor 5B in which the trimming groove 7A is formed is reduced. As a result, the load characteristics of the entire chip resistor 30 can be improved.
　図７は本発明の第５実施形態例に係るチップ抵抗器４０の平面図、図８は第５実施形態例に係るチップ抵抗器４０の製造工程を示す説明図であり、図１，２に対応する部分には同一符号を付してある。図７に示す第５実施形態例に係るチップ抵抗器４０では、浮島導体６Ｂが直線状に延びるスリットＳ２によって第２電極４から分離され、このスリットＳ２の先端に切込み８が連続するように構成されている。 7 is a plan view of a chip resistor 40 according to a fifth embodiment of the present invention, and FIG. 8 is an explanatory view showing a manufacturing process of the chip resistor 40 according to the fifth embodiment. The corresponding parts are given the same reference numerals. In the chip resistor 40 according to the fifth embodiment shown in FIG. 7, the floating island conductor 6B is separated from the second electrode 4 by the linearly extending slit S2, and the notch 8 is continuous at the tip of the slit S2. It is done.
　このように構成されたチップ抵抗器４０の製造工程について説明すると、まず、図８（ａ）に示すように、集合基板２Ａの表面に所定間隔を存して対向する第１電極３と第２電極４を形成する。その際、第１電極３は長方形状であるが、第２電極４には第１電極３に向かって突出する凸部４ａが形成されている。 First, as shown in FIG. 8A, the first electrode 3 and the second electrode 3 facing the surface of the collective substrate 2A with a predetermined interval are described. The electrode 4 is formed. At this time, although the first electrode 3 has a rectangular shape, the second electrode 4 is formed with a convex portion 4 a that protrudes toward the first electrode 3.
　次に、図８（ｂ）に示すように、両端部が第１電極３と第２電極４に重なる抵抗体５を印刷形成する。この抵抗体５は、第１電極３と第２電極４間に形成された長方形状の抵抗体５Ａと、第１電極３と凸部４ａ間に形成された長方形状の抵抗体５Ｂとを有し、これら抵抗体５Ａと抵抗体５Ｂは幅狭な切込み８を挟んで対向している。ここで、抵抗体５Ａの幅は抵抗体５Ｂの幅よりも狭く設定されており、この抵抗体５Ｂの幅よりも凸部４ａの幅が小さく設定されている。 Next, as shown in FIG. 8B, a resistor 5 is formed by printing, the both ends of which overlap the first electrode 3 and the second electrode 4. This resistor 5 has a rectangular resistor 5A formed between the first electrode 3 and the second electrode 4 and a rectangular resistor 5B formed between the first electrode 3 and the convex portion 4a. The resistor 5A and the resistor 5B are opposed to each other across the narrow cut 8. Here, the width of the resistor 5A is set smaller than the width of the resistor 5B, and the width of the convex portion 4a is set smaller than the width of the resistor 5B.
　次に、図８（ｃ）に示すように、第２電極４から突出する凸部４ａの下端部からレーザー光を上方へ照射し、このレーザー光を凸部４ａを通過する位置まで走査する（符号ＬＴ２参照）。これにより、図８（ｄ）に示すように、第２電極４に凸部４ａを縦断して切込み８に達する直線状のスリットＳ２が形成され、このスリットＳ２によって第２電極４から分離した浮島導体６Ｂが得られる。 Next, as shown in FIG. 8C, laser light is emitted upward from the lower end of the convex portion 4a protruding from the second electrode 4 and this laser light is scanned to a position passing through the convex portion 4a ( Reference sign LT2). As a result, as shown in FIG. 8D, a linear slit S2 is formed in the second electrode 4 to reach the cut 8 by cutting the convex portion 4a longitudinally, and the floating island separated from the second electrode 4 by the slit S2 Conductor 6B is obtained.
　次に、図８（ｄ）に示すように、レーザー光を第１電極３の上端部から電極間方向と直交する方向へ照射した後、これを電極間方向へ直角に方向変換することにより（符号ＬＴ１参照）、図８（ｅ）に示すように、第１電極３にＬ字状のスリットＳ１を形成すると共に、抵抗体５ＢにスリットＳ１の先端と連続するトリミング溝７Ａを形成する。このスリットＳ１によって第１電極３から分離した浮島導体６Ａが得られると共に、トリミング溝７Ａによって抵抗体５の抵抗値が目標抵抗値となるように抵抗値調整される。なお、これ以降の工程は第１実施形態例と基本的に同様であるため、ここでは重複する説明を省略する。 Next, as shown in FIG. 8D, the laser light is irradiated from the upper end of the first electrode 3 in the direction orthogonal to the inter-electrode direction, and then it is changed in direction to the inter-electrode direction at right angles ( As shown in FIG. 8E, the L-shaped slit S1 is formed in the first electrode 3 and the trimming groove 7A continuous with the tip of the slit S1 is formed in the resistor 5B as shown in FIG. The floating island conductor 6A separated from the first electrode 3 is obtained by the slit S1, and the resistance value of the resistor 5 is adjusted by the trimming groove 7A so as to be the target resistance value. The subsequent steps are basically the same as those of the first embodiment, and thus redundant description will be omitted.
　以上説明したように、第５実施形態例に係るチップ抵抗器４０では、第２電極４に相手側の第１電極３に向かって突出する凸部４ａが形成されており、この凸部４ａに対してスリットＳ２を電極間方向と直交する方向に沿って形成することにより、凸部４ａが第２電極４から分離されて浮島導体６Ｂが得られるため、凸部４ａの切断によって浮島導体６Ｂを容易に形成することができる。しかも、抵抗体５に蛇行形状の一部を規定する切込み８が印刷形成されていると共に、凸部４ａの幅が凸部４ａに重なる抵抗体５Ｂの幅より小さく設定されているため、凸部４ａと抵抗体５Ｂが重なる部分の近傍に切込み８に繋がるスペースを確保することができる。そして、スリットＳ２の先端をこのスペースに連続させることで、スリットＳ２の先端を抵抗体５Ａと離間させることができるため、抵抗体５Ａにマイクロクラックは発生しなくなり、結果的に、印刷によって規定される切込み８の幅を狭く設定することが可能となり、その分、抵抗体５の形成スペースを広くすることができる。 As described above, in the chip resistor 40 according to the fifth embodiment, the second electrode 4 is provided with the convex portion 4 a that protrudes toward the first electrode 3 on the other side, and the convex portion 4 a is formed In contrast, by forming the slits S2 along the direction orthogonal to the inter-electrode direction, the convex portion 4a is separated from the second electrode 4 to obtain the floating island conductor 6B. Therefore, the floating island conductor 6B is cut by cutting the convex portion 4a. It can be easily formed. Moreover, since the notch 8 for defining a part of the meandering shape is printed on the resistor 5 and the width of the convex portion 4a is set smaller than the width of the resistor 5B overlapping the convex portion 4a, the convex portion A space connected to the cut 8 can be secured in the vicinity of the overlapping portion of 4 a and the resistor 5 B. Then, by making the tip of the slit S2 continuous with this space, the tip of the slit S2 can be separated from the resistor 5A, so that no micro crack is generated in the resistor 5A, and as a result, it is defined by printing It is possible to set the width of the notch 8 narrow, and the space for forming the resistor 5 can be enlarged accordingly.
　なお、切込み８の先端は必ずしも第１電極３側の浮島導体６Ａまで達していなくても良く、切込み８と浮島導体６Ａとの間に抵抗体５の一部が介在するように構成しても良い。また、上記第５実施形態例では、抵抗体５に印刷形成された切込み８にスリットＳ２の先端が連続するように構成されているが、第１実施形態例や第２実施形態例と同様に、切込みを形成せずにトリミング溝７Ａ，７Ｂだけで抵抗体５の蛇行形状を規定するように構成し、スリットＳ２の先端をそのまま直交方向へ延長してトリミング溝７Ｂを形成するようにしても良い。 The tip of the incision 8 may not necessarily reach the floating island conductor 6A on the first electrode 3 side, and even if a part of the resistor 5 is interposed between the incision 8 and the floating island conductor 6A good. Further, in the fifth embodiment, the tip of the slit S2 is formed to be continuous with the notch 8 formed by printing on the resistor 5, but as in the first embodiment and the second embodiment, Even if the trimming groove 7A, 7B is used to define the meandering shape of the resistor 5 without forming a cut, the tip of the slit S2 may be extended in the orthogonal direction as it is to form the trimming groove 7B. good.
　図９は本発明の第６実施形態例に係るチップ抵抗器５０の平面図である。図９に示すように、第６実施形態例に係るチップ抵抗器５０では、浮島導体６Ｂを第２電極４の凸部から分離して形成するだけでなく、浮島導体６Ａも第１電極３の凸部から分離して形成するように構成されている。すなわち、第１電極３には第２電極４に向かって突出する図示せぬ凸部が形成されており、この凸部を縦断するようにスリットＳ１を入れることで浮島導体６Ａが得られ、このスリットＳ１の先端がトリミング溝７Ｂと連続するようになっている。 FIG. 9 is a plan view of a chip resistor 50 according to a sixth embodiment of the present invention. As shown in FIG. 9, in the chip resistor 50 according to the sixth embodiment, not only the floating island conductor 6B is separated from the convex portion of the second electrode 4, but the floating island conductor 6A is also formed of the first electrode 3. It is comprised so that it may isolate | separate and form from a convex part. That is, a convex portion (not shown) protruding toward the second electrode 4 is formed in the first electrode 3, and the floating island conductor 6A is obtained by inserting the slit S1 so as to longitudinally cut the convex portion. The tip of the slit S1 is continuous with the trimming groove 7B.
　図１０は本発明の第７実施形態例に係るチップ抵抗器６０の平面図、図１１は第７実施形態例に係るチップ抵抗器６０の製造工程を示す説明図であり、図１，２に対応する部分には同一符号を付してある。 10 is a plan view of a chip resistor 60 according to a seventh embodiment of the present invention, and FIG. 11 is an explanatory view showing a manufacturing process of the chip resistor 60 according to the seventh embodiment. The corresponding parts are given the same reference numerals.
　図１０に示す第７実施形態例に係るチップ抵抗器６０では、抵抗体５は印刷パターンによってＮ字状の蛇行形状に形成されており、この抵抗体５の一方のターン部５ｂに第１電極３から分離した浮島導体６Ａが形成されると共に、他方のターン部５ｂに第２電極４から分離した浮島導体６Ｂが形成されている。また、抵抗体５の両端側のリード部５ａにそれぞれＬ字状のトリミング溝７Ａ，７Ｂが形成されており、一方のトリミング溝７Ａは第１電極３と浮島導体６Ａを分離するスリットＳ１の先端と連続し、他方のトリミング溝７Ｂは第２電極４と浮島導体６Ｂを分離するスリットＳ２の先端と連続している。 In the chip resistor 60 according to the seventh embodiment shown in FIG. 10, the resistor 5 is formed in an N-shaped meandering shape by the printed pattern, and the first electrode is formed on one of the turn portions 5 b of the resistor 5. While the floating island conductor 6A separated from 3 is formed, the floating island conductor 6B separated from the 2nd electrode 4 is formed in the other turn part 5b. Further, L-shaped trimming grooves 7A and 7B are respectively formed in the lead portions 5a on both end sides of the resistor 5, and one trimming groove 7A is the tip of the slit S1 separating the first electrode 3 and the floating island conductor 6A. The other trimming groove 7B is continuous with the tip of the slit S2 separating the second electrode 4 and the floating island conductor 6B.
　このように構成されたチップ抵抗器６０の製造工程について説明すると、まず、図１１（ａ）に示すように、集合基板２Ａの表面に所定間隔を存して対向する第１電極３と第２電極４を形成する。その際、第１電極３には第２電極４に向かって突出する凸部３ａを形成し、第２電極４には第１電極３に向かって突出する凸部４ａを形成する。 First, as shown in FIG. 11A, the first electrode 3 and the second electrode 3 facing the surface of the collective substrate 2A with a predetermined interval are described. The electrode 4 is formed. At this time, the first electrode 3 is formed with a convex portion 3 a projecting toward the second electrode 4, and the second electrode 4 is formed with a convex portion 4 a projecting toward the first electrode 3.
　次に、図１１（ｂ）に示すように、両端部が第１電極３と第２電極４に重なる蛇行形状の抵抗体５を印刷形成する。この抵抗体５は、第１電極３と第２電極４の凸部３ａ，４ａに接続する２つのターン部５ｂと、第１電極３と一方のターン部５ｂを直線状に繋ぐリード部５ａと、第２電極４と他方のターン部５ｂを直線状に繋ぐリード部５ａと、これら２つのリード部５ａを斜め方向に繋ぐ合計３つのリード部５ａを有している。 Next, as shown in FIG. 11B, a meandering resistor 5 whose both end portions overlap the first electrode 3 and the second electrode 4 is formed by printing. The resistor 5 includes two turn portions 5b connected to the convex portions 3a and 4a of the first electrode 3 and the second electrode 4, and a lead portion 5a connecting the first electrode 3 and one of the turn portions 5b in a straight line. A lead portion 5a connecting the second electrode 4 and the other turn portion 5b linearly and a total of three lead portions 5a connecting these two lead portions 5a in a diagonal direction are provided.
　次に、図１１（ｃ）に示すように、レーザー光を第２電極４の凸部４ａの右側部から左方へ照射し、このレーザー光を凸部４ａの通過後にそのまま図示左側のリード部５ａ内に延ばす（符号ＬＴ２参照）。これにより、図１１（ｄ）に示すように、第２電極４に直線状のスリットＳ２を形成すると共に、抵抗体５Ｂのリード部５ａにスリットＳ２に連続するＬ字状のトリミング溝７Ｂを形成し、このスリットＳ２によって第２電極４から分離した浮島導体６Ｂが得られる。 Next, as shown in FIG. 11C, a laser beam is irradiated from the right side of the convex portion 4a of the second electrode 4 to the left, and after passing through the convex portion 4a, this laser beam is left as it is Extend into 5a (see symbol LT2). As a result, as shown in FIG. 11D, a linear slit S2 is formed in the second electrode 4, and an L-shaped trimming groove 7B continuous with the slit S2 is formed in the lead portion 5a of the resistor 5B. The floating island conductor 6B separated from the second electrode 4 is obtained by the slits S2.
　また、これに前後して、レーザー光を第１電極３の凸部３ａの左側部から右方へ照射し、このレーザー光を凸部３ａの通過後にそのまま図示右側のリード部５ａ内に延ばす（符号ＬＴ１参照）。これにより、図１１（ｅ）に示すように、第１電極３に直線状のスリットＳ１を形成すると共に、抵抗体５Ｂのリード部５ａにスリットＳ１に連続するＬ字状のトリミング溝７Ａを形成し、このスリットＳ１によって第１電極３から分離した浮島導体６Ａが得られると共に、両トリミング溝７Ａ，７Ｂによって抵抗体５の抵抗値が目標抵抗値となるように抵抗値調整される。なお、これ以降の工程は第１実施形態例と基本的に同様であるため、ここでは重複する説明を省略する。 Also, before and after this, the laser beam is irradiated from the left side of the convex portion 3a of the first electrode 3 to the right, and the laser beam is directly extended into the lead portion 5a on the right side of the figure after passing through the convex portion 3a ( Reference symbol LT1). As a result, as shown in FIG. 11E, a linear slit S1 is formed in the first electrode 3 and an L-shaped trimming groove 7A continuous with the slit S1 is formed in the lead portion 5a of the resistor 5B. The floating island conductor 6A separated from the first electrode 3 is obtained by the slit S1, and the resistance value of the resistor 5 is adjusted by the both trimming grooves 7A and 7B so as to be the target resistance value. The subsequent steps are basically the same as those of the first embodiment, and thus redundant description will be omitted.
　以上説明したように、第７実施形態例に係るチップ抵抗器６０では、抵抗体５の印刷パターンと第１電極３および第２電極４に形成した両スリットＳ１，Ｓ２とによって蛇行形状を規定するように構成されており、トリミング溝７Ａ，７Ｂの先端部と対向するターン部５ｂにそれぞれ浮島導体６Ａ，６Ｂが形成されているため、ターン部５ｂにかかる負荷を軽減することができ、トリミング溝７Ａ，７Ｂの先端部にマイクロクラックが発生しても、マイクロクラックに起因する特性への悪影響を軽減することができる。 As described above, in the chip resistor 60 according to the seventh embodiment, the meandering shape is defined by the printed pattern of the resistor 5 and the two slits S1 and S2 formed in the first electrode 3 and the second electrode 4. The floating island conductors 6A and 6B are formed on the turn portions 5b facing the tips of the trimming grooves 7A and 7B, respectively, so that the load applied to the turn portions 5b can be reduced. Even if microcracks occur at the tips of 7A and 7B, the adverse effect on the characteristics due to the microcracks can be reduced.
　また、第７実施形態例では、トリミング溝７Ａ，７Ｂがリード部５ａの幅方向内側を始点としてＬ字状に形成されているため、抵抗体５の抵抗値を高精度に抵抗値調整することができると共に、スリットＳ１，Ｓ２とトリミング溝７Ａ，７Ｂが連続しているため、トリミング溝７Ａ，７Ｂのスタートポイント（始点）が安定し、抵抗値調整を容易に行うことができる。 Further, in the seventh embodiment, since the trimming grooves 7A and 7B are formed in an L shape starting from the inner side in the width direction of the lead portion 5a, the resistance value of the resistor 5 is adjusted with high precision. Since the slits S1 and S2 and the trimming grooves 7A and 7B are continuous, the start point (starting point) of the trimming grooves 7A and 7B is stable, and the resistance value can be easily adjusted.
　１，１０，２０，３０，４０，５０，６０　チップ抵抗器
　２　絶縁基板
　２Ａ　集合基板
　３　第１電極
　３ａ　凸部
　４　第２電極
　４ａ　凸部
　５　抵抗体
　５ａ　リード部
　５ｂ　ターン部
　６Ａ，６Ｂ　浮島導体
　７Ａ，７Ｂ　トリミング溝
　８　切込み
　Ｓ１，Ｓ２　スリット 1, 10, 20, 30, 40, 50, 60 Chip resistor 2 Insulating substrate 2A Assembly substrate 3 First electrode 3a Convex portion 4 Second electrode 4a Convex portion 5 Resistor 5a Lead portion 5b Turn portion 6A, 6B Floating island conductor 7A, 7B trimming groove 8 notches S1, S2 slits

Claims (7)

  1. 　絶縁基板と、この絶縁基板上に所定間隔を存して対向配置された一対の電極と、これら一対の電極間を橋絡する抵抗体とを備え、前記抵抗体が前記電極と隙間を存して対向する複数のターン部を有する蛇行形状に形成されているチップ抵抗器において、
    　前記ターン部に浮島導体が形成されていると共に、前記抵抗体に前記浮島導体に向かって電極間方向へ延びるトリミング溝が形成されており、前記浮島導体は前記電極に形成されたスリットによって該電極から分離されたものであることを特徴とするチップ抵抗器。     An insulating substrate, a pair of electrodes disposed opposite to each other at a predetermined distance on the insulating substrate, and a resistor bridging between the pair of electrodes, the resistor having a gap with the electrode A chip resistor formed in a serpentine shape having a plurality of opposing turns;
    A floating island conductor is formed in the turn portion, and a trimming groove extending in a direction between the electrodes toward the floating island conductor is formed in the resistor, and the floating island conductor is a slit formed in the electrode. Chip resistor characterized in that it is separated from.
  2. 　請求項１の記載において、前記トリミング溝が電極間距離の１／２以上の長さに形成されていることを特徴とするチップ抵抗器。 The chip resistor according to claim 1, wherein the trimming groove is formed to have a length of 1/2 or more of an inter-electrode distance.
  3. 　請求項１の記載において、前記スリットと前記トリミング溝とが連続していることを特徴とするチップ抵抗器。 The chip resistor according to claim 1, wherein the slit and the trimming groove are continuous.
  4. 　請求項１の記載において、前記抵抗体は前記ターン部に向かって電極方向へ延びる切込みを有しており、この切込みと前記スリットとが連続していると共に、前記切込みが前記スリットよりも幅広に設定されていることを特徴とするチップ抵抗器。 In the first aspect of the present invention, the resistor has a cut extending toward the electrode toward the turn portion, and the cut and the slit are continuous, and the cut is wider than the slit. Chip resistor characterized in that it is set.
  5. 　請求項１の記載において、一対の前記電極の少なくとも一方に相手側の電極方向へ突出する凸部が形成されていると共に、この凸部に前記抵抗体が接続されており、前記凸部に対して前記スリットを電極間方向と直交する方向に沿って形成することにより、前記凸部が前記電極から分離されて前記浮島導体となることを特徴とするチップ抵抗器。 According to the first aspect of the present invention, at least one of the pair of electrodes is formed with a protrusion projecting in the direction of the other electrode, and the resistor is connected to the protrusion, and the protrusion is formed relative to the protrusion A chip resistor characterized in that the convex portion is separated from the electrode to be the floating island conductor by forming the slit along a direction orthogonal to the inter-electrode direction.
  6. 　請求項５の記載において、前記抵抗体に前記ターン部に向かって電極方向へ延びる切込みが印刷形成されていると共に、前記凸部の幅が該凸部に重なる前記抵抗体の幅より小さく設定されており、前記スリットの先端が前記切込みに連続していることを特徴とするチップ抵抗器。 According to a fifth aspect of the present invention, the notch extending in the electrode direction toward the turn is printed on the resistor, and the width of the protrusion is set smaller than the width of the resistor overlapping the protrusion. A tip resistor characterized in that a tip of the slit is continuous with the cut.
  7. 　絶縁基板と、この絶縁基板上に所定間隔を存して対向配置された一対の電極と、これら一対の電極間を橋絡する抵抗体とを備え、前記抵抗体が前記電極と隙間を存して対向する複数のターン部を有する蛇行形状に形成されているチップ抵抗器の製造方法において、
    　前記電極に前記抵抗体との接続箇所に達するスリットを形成することにより、前記ターン部に前記電極から分離された浮島導体を形成する工程と、
    　前記スリットを延長して前記抵抗体に前記浮島導体に向かって電極間方向へ延びるトリミング溝を形成する工程と、
    を含むことを特徴とするチップ抵抗器の製造方法。     An insulating substrate, a pair of electrodes disposed opposite to each other at a predetermined distance on the insulating substrate, and a resistor bridging between the pair of electrodes, the resistor having a gap with the electrode In a method of manufacturing a chip resistor which is formed in a serpentine shape having a plurality of opposing turn portions,
    Forming a floating island conductor separated from the electrode in the turn portion by forming a slit in the electrode to reach a connection point with the resistor;
    Forming the trimming groove extending in the direction between the electrodes toward the floating island conductor in the resistor by extending the slit;
    A method of manufacturing a chip resistor comprising:
PCT/JP2018/033296 2017-10-25 2018-09-07 Chip resistor and method for manufacturing chip resistor WO2019082523A1 (en)

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