JP2008078294A - Chip component and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip component capable of obtaining a low, stable resistance value without being affected by an increase in the resistance value due to the alloying reaction between an upper surface electrode and a conductor. <P>SOLUTION: The chip component comprises: the pair of upper surface electrodes 12 that is formed at both the ends of the upper surface of an insulating substrate 11 and uses gold as a main constituent; a conductor 13 that is formed so that it is electrically connected to the pair of upper surface electrodes 12 and uses silver as a main constituent; a protective film 14 for covering the conductor 13; an end face electrode 15 formed on the back and end face of the insulating substrate 11 so that it is electrically connected to the upper surface electrode 12; and plated layers 17, 18 electrically connected to the pair of upper surface electrodes 12, the conductor 13, and the end face electrode 15. The conductor 13 is electrically connected to the pair of upper surface electrodes 12 so that one portion of the conductor 13 is positioned outside both the ends in the width direction of the pair of upper surface electrodes 12, and the protective film 14 covers only one portion of the conductor 13, thus exposing a part without overlapping with the pair of upper surface electrodes 12 in the conductor 13. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a chip component, in particular, a minute jumper chip component and a manufacturing method thereof.

  A conventional chip component manufacturing method will be described below with reference to the drawings.

  7 (a) to (c) and FIGS. 8 (a) to (e) show manufacturing process diagrams of jumper chip parts which are examples of conventional chip parts. FIGS. 7 (a) to (c) ) And FIGS. 8A to 8E, the manufacturing method will be described below.

  First, as shown in FIG. 7A, a plurality of upper surface electrodes 4 are formed on the upper surface of a sheet-like insulating substrate 3 having a primary dividing line 1 and a secondary dividing line 2 and made of alumina having a purity of 96%. Is formed so as to straddle the primary dividing line 1 by a screen printing method.

  Next, as shown in FIG. 7 (b), a plurality of upper surface electrodes 4 are electrically connected to each other in the individual region surrounded by the primary division line 1 and the secondary division line 2. The conductor 5 is formed so as to overlap the plurality of upper surface electrodes 4.

  Next, as shown in FIG. 7C, a resin protective layer 6 is formed by a screen printing method so as to cover the entire surface of the plurality of conductors 5.

  Next, as shown in FIG. 8A, the sheet-like insulating substrate 3 is cut by dicing along the primary dividing line 1 so as to cut the plurality of upper surface electrodes 4, thereby FIG. A strip-shaped substrate 7 as shown in FIG.

  Next, as shown in FIG. 8C, the end surface electrode 8 is formed by sputtering or the like so as to be electrically connected to the upper surface electrode 4 on the end surface of the strip-shaped substrate 7.

  Finally, as shown in FIG. 8 (d), the strip-shaped substrate 7 is divided along the secondary dividing line 2 to form a piece-like substrate 9, and then shown in FIG. 8 (e). Thus, the conventional chip component was manufactured by forming the nickel plating layer (not shown) and the tin plating layer 10 on the surface of the end surface electrode 8 using the barrel plating method.

As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
JP 2005-78874 A

  In the above-described conventional method for manufacturing a chip component, when the material constituting the upper surface electrode 4 and the material constituting the conductor 5 are different, an alloying reaction occurs in the overlapping portion between the two and the resistance value of the conductor 5 increases. In particular, the characteristics of the jumper chip component requiring a low resistance value become unstable. In particular, the top electrode 4 is thinly printed using a gold-based material for the purpose of suppressing the occurrence of burrs during dicing, and the conductor 5 is often composed of a silver-based material having a low resistance value. In this case, the alloying reaction is promoted at the overlapping portion of the gold-based top electrode 4 and the silver-based conductor 5, and the resistance value increases at the alloyed portion. In this case, since the entire surface of the conductor 5 is covered with the resin protective layer 6 in the conventional chip component, when the plating layer is formed on the upper surface electrode 4, the plating layer is alloyed with an increased resistance value. As a result, a chip component having a stable low resistance value cannot be obtained.

  SUMMARY OF THE INVENTION The present invention solves the above-described conventional problems, and provides a chip component capable of obtaining a stable and low resistance value in a small size without being affected by an increase in resistance value due to an alloying reaction between the upper surface electrode and a conductor, and a method for manufacturing the chip component Is intended to provide.

  In order to achieve the above object, the present invention has the following configuration.

  The invention according to claim 1 of the present invention is formed so as to be electrically connected to a pair of upper surface electrodes mainly composed of gold and formed on both ends of the upper surface of the insulating substrate. A conductor composed mainly of silver, a protective film covering the conductor, end face electrodes formed on the back and end faces of the insulating substrate so as to be electrically connected to the pair of top face electrodes, and the top face An electrode and a plating layer formed so as to be electrically connected to the conductor and the end surface electrode, and the conductor is positioned so that a part of the conductor is located outside both ends in the width direction of the pair of upper surface electrodes. Is electrically connected to a pair of upper surface electrodes, and the protective film covers only a part of the conductor, thereby exposing a portion of the conductor that does not overlap with the upper surface electrode. According to this configuration, a part of the conductor is By electrically connecting the conductor to the pair of upper surface electrodes so as to be located outside both ends of the pair of upper surface electrodes in the width direction, and the protective film covers only a part of the conductor, Since the portion of the conductor that does not overlap with the upper surface electrode is exposed, the portion of the conductor that is electrically connected to the upper surface electrode does not overlap the upper surface electrode, and this protection Since the conductor portion that protrudes from the film is not alloyed with the top electrode, even if the overlapping portion between the top electrode and the conductor is alloyed and the resistance value is increased, the conductor is not alloyed without overlapping with the top electrode. The plating layer can be formed so as to be directly electrically connected, and this has the effect of obtaining a chip component having a stable low resistance value.

  The invention according to claim 2 of the present invention is such that, in particular, the auxiliary upper surface electrode is formed by sputtering so as to be electrically connected to the upper surface electrode, the conductor and the end surface electrode, and the protective film is formed of glass. According to this configuration, the auxiliary upper surface electrode is formed by sputtering so as to be electrically connected to the upper surface electrode, the conductor, and the end surface electrode, and the protective film is formed of glass, so the protective film is formed of resin. As a result, there is no bleeding of the resin that occurs in some cases, and thus no bleeding film is interposed between the conductor and the auxiliary upper surface electrode and / or the plating layer, so that a chip component having a stable low resistance value can be obtained. It has the effect of being obtained.

  The invention according to claim 3 of the present invention includes a step of forming a plurality of upper surface electrodes on the upper surface of a sheet-like insulating substrate having a primary division line and a secondary division line so as to straddle only the primary division line. Forming a conductor in a plurality of individual regions surrounded by the primary dividing line and the secondary dividing line so as to be electrically connected to the plurality of upper surface electrodes, and protecting the conductor so as to cover the conductor A step of forming a film; a step of primary dicing the sheet-like insulating substrate along the primary dividing line; and a plurality of the plurality of a plurality of the plurality of portions on the back surface of the sheet-like insulating substrate and the end face obtained by the primary dicing. Forming an end surface electrode so as to be electrically connected to the upper surface electrode and the conductor, and forming an auxiliary upper surface electrode by sputtering so as to be electrically connected to the upper surface electrode, the conductor and the end surface electrode; Secondary division Dividing the insulating substrate along the in-line to obtain an individual substrate, and forming a plating layer on both end surfaces of the individual substrate so as to cover the entire surface of the end surface electrode and the auxiliary upper surface electrode. And the step of forming the plurality of conductors so as to be electrically connected to the plurality of upper surface electrodes, wherein a part of the plurality of conductors is arranged in the direction of a primary dividing line of the plurality of upper surface electrodes in a piece region. In the step of electrically connecting the plurality of conductors to the plurality of upper surface electrodes so as to be located outside both ends, and forming the protective film so as to cover the conductor, the protective film is a part of the conductor In this configuration, a plurality of conductors are electrically connected to a plurality of upper surface electrodes. In this manufacturing method, a plurality of conductors are electrically connected to a plurality of upper surface electrodes. So as to form The plurality of conductors are electrically connected to the plurality of upper surface electrodes so that a part of the plurality of conductors is located outside both ends of the plurality of upper surface electrodes in the primary dividing line direction within the individual region. In the step of forming a protective film so as to connect and cover the conductor, the protective film covers only a part of the conductor so that a portion of the conductor that does not overlap with the upper surface electrode is exposed. Therefore, the part of the conductor that is electrically connected to the upper surface electrode does not overlap with the upper surface electrode, and the portion of the conductor that protrudes from the protective film is not alloyed with the upper surface electrode. Therefore, even when the overlapping portion of the upper surface electrode and the conductor is alloyed to increase the resistance value, the plating layer is directly applied to the non-alloyed conductor without overlapping the upper surface electrode via the auxiliary upper surface electrode. It can be formed so as to be electrically connected, and this has the effect of obtaining a chip component having a stable low resistance value.

  As described above, the chip component of the present invention electrically connects the conductor to the pair of upper surface electrodes so that a part of the conductor is positioned outside both ends in the width direction of the pair of upper surface electrodes, Since the protective film is configured to cover only a part of the conductor so that a portion of the conductor that does not overlap with the upper surface electrode is exposed, the conductor electrically connected to the upper surface electrode is the upper surface electrode. The part that does not overlap with the protective film greatly protrudes from the protective film, and the conductor part that protrudes from the protective film is not alloyed with the upper surface electrode, so the overlapping part of the upper surface electrode and the conductor is alloyed to increase the resistance value. Even in this case, the plated layer can be formed so as to be directly electrically connected to a non-alloyed conductor that does not overlap with the upper surface electrode, and thereby a chip component having a stable low resistance value. In which exhibits an excellent effect that is obtained.

  Hereinafter, a chip part manufacturing method according to an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a cross-sectional view of a jumper chip part which is an example of a chip part in an embodiment of the present invention, FIGS. 2 (a) to (c), FIGS. 3 (a) to (c), and FIG. 4 (a) to FIG. (C) is a manufacturing process figure which shows the manufacturing method of the jumper chip component.

  In FIG. 1, reference numeral 11 denotes a rectangular insulating substrate made of alumina having a purity of 96%, 12 denotes a top electrode mainly composed of gold provided at the center of both ends of the top surface of the insulating substrate 11, and 13 denotes an upper electrode 12. A conductor mainly composed of silver provided so as to be electrically connected, and 14 is a protective film provided so as to cover a part of the conductor 13. 15 is an end surface electrode provided from the back surface to the end surface of the insulating substrate 11 and is electrically connected to the upper surface electrode 12, and 16 is electrically connected to the upper surface electrode 12, the conductor 13 and the end surface electrode 15. It is the formed auxiliary upper surface electrode. Reference numeral 17 denotes a nickel plating layer formed on the end face electrode 15 and the auxiliary upper surface electrode 16, and reference numeral 18 denotes a tin plating layer formed on the nickel plating layer 17.

  Next, referring to FIGS. 2A to 2C, FIGS. 3A to 3C, and FIGS. 4A to 4C, a method of manufacturing a jumper chip component according to an embodiment of the present invention. Will be explained.

  First, as shown in FIG. 2A, a sheet-like insulating substrate 11c made of alumina having a purity of 96% having a primary dividing line 11a and a secondary dividing line 11b is prepared, and this sheet-like insulating substrate is prepared. A plurality of upper surface electrodes 12 made of a material mainly composed of gold, such as gold resinate, are screen-printed on the upper surface of 11c in a grid pattern so as to straddle only the primary dividing line 11a, and have a firing profile with a peak temperature of 850 ° C. Bake. In addition, since it can print thinly when the upper surface electrode 12 is formed using gold resinate, it is hard to generate | occur | produce a burr | flash also when cut | disconnecting the upper surface electrode 12 by the primary dicing mentioned later. Further, the primary dividing line 11a and the secondary dividing line 11b may be formed in advance on the upper surface and / or the back surface of the sheet-like insulating substrate 11c as slit-shaped dividing grooves. When the area surrounded by the primary dividing line 11a and the secondary dividing line 11b (hereinafter referred to as an individual area) is reduced in size, the slit-shaped dividing grooves are provided in advance on the sheet-like insulating substrate 11c. Since manufacturing is difficult due to a decrease in strength, the primary dividing line 11a and the secondary dividing line 11b are usually not provided with slit-shaped dividing grooves in advance.

  Next, as shown in FIG. 2 (b), the upper surface electrode 12 and the electricity are formed on the upper surface of the sheet-like insulating substrate 11c in a plurality of individual regions surrounded by the primary division line 11a and the secondary division line 11b. So that the conductor 13 made of a conductive paste mainly composed of silver, such as a silver-palladium alloy, is placed outside the both ends of the upper electrode 12 in the direction of the primary dividing line 11a in the individual piece region. And are fired with a firing profile having a peak temperature of 850 ° C. In this case, since two conductors 13 are formed in each of the plurality of individual regions surrounded by the primary division line 11a and the secondary division line 11b, the printing position of the conductor 13 is the primary division line 11a. Even if it deviates in this direction, either one of the conductors 13 will be reliably connected to the pair of upper surface electrodes 12, and no conduction failure will occur. Note that two conductors 13 do not necessarily have to be formed independently in the individual region, and the conductors 13 are formed in a wide enough range so as to protrude beyond both ends of the pair of upper surface electrodes 12 in the primary division line 11a direction. In this case, only one conductor 13 may be formed in the piece region.

  Next, as shown in FIG. 2C, a plurality of protective films 14 are formed in parallel with the primary dividing line 11a so as to cover only a part of the plurality of conductors 13. Here, if the protective film 14 is formed of resin, a resin bleeding film is formed and bonding between the conductor 13 and a plating layer described later becomes unstable. Therefore, the protective film 14 is preferably formed of glass. The protective film 14 is formed to have a narrow width as shown in FIG. 2C so as not to cover the overlapping portion of the upper surface electrode 12 and the conductor 13 in order to secure the exposed portion of the conductor 13 as wide as possible. It is what.

  Next, as shown in FIG. 3A, the sheet-like insulating substrate 11c is diced along the primary dividing line 11a to obtain a strip-like substrate 11d as shown in FIG. At the time of dicing, since only the upper surface electrode 12 mainly composed of gold is thinly formed on the primary dividing line 11a, burrs are hardly generated at the time of dicing.

  Next, as shown in FIG. 3C, the back surface (not shown) and the end surface of the strip-shaped substrate 11d are top surfaces by performing sputtering made of nickel chromium alloy or the like from the back surface side of the strip-shaped substrate 11d. An end face electrode 15 electrically connected to the electrode 12 is formed. The end face electrode 15 is not limited to a nickel-chrome alloy sputtered film, and may be formed of other materials. For example, the first layer 15 made of chromium and the second layer 2 made of copper-nickel alloy are used. It may be formed in a layer structure, or may be formed by applying a conductive paste to the back and end surfaces of the strip-shaped substrate 11d. Further, the end face electrode 15 can be obtained in a desired shape by installing a metal mask so as to cover the center of the back surface of the strip-shaped substrate 11d and forming it in this installed state. When the substrate 11c is divided by primary dicing along the primary dividing line 11a, the slit of the primary dicing is prevented from penetrating to the end of the sheet-like insulating substrate 11c, and the slit of the primary dicing is formed. If a metal mask is disposed on the back surface of the sheet-like insulating substrate 11c in a state of being formed and sputtering is performed from the back surface, the end face electrodes 15 can be simultaneously formed on the plurality of strip-shaped substrates 11d. is there.

  Next, as shown in FIG. 4A, the upper surface electrode 12 and the conductors 13 are formed on the upper surface and the end surface of the strip-shaped substrate 11d by sputtering from the upper surface of the strip-shaped substrate 11d. An auxiliary upper surface electrode 16 electrically connected to the end surface electrode 15 is formed. The auxiliary upper surface electrode 16 can have a desired shape by installing a metal mask so as to cover the upper surface central portion (the portion where the protective film 14 is formed) of the strip-shaped substrate 11d. When the insulating substrate 11c is divided by primary dicing along the primary dividing line 11a, the slit of the primary dicing is prevented from penetrating to the end of the sheet-like insulating substrate 11c. If a metal mask is arranged on the upper surface of the formed sheet-like insulating substrate 11c and sputtering is performed from the upper surface, the auxiliary upper surface electrode 16 can be simultaneously formed on the plurality of strip-shaped substrates 11d. Is. In FIG. 4A, the auxiliary upper surface electrode 16 is formed so as to completely cover the upper surface electrode 12 and the conductor 13 and to cover a part of the protective film 14, but without covering the protective film 14. A part of the conductor 13 may be exposed.

  Next, the strip-shaped substrate 11d is divided along a secondary dividing line 11b shown in FIG. 4A, thereby obtaining an individual substrate 11e as shown in FIG. 4B.

  Finally, as shown in FIG. 4C, the exposed portion of the end surface electrode 15 and the auxiliary upper surface electrode 16 in the individual substrate 11e is plated with a nickel plating layer 17 (not shown) and a tin plating layer 18. A layer is formed to manufacture a jumper chip component according to an embodiment of the present invention.

  In the jumper chip component manufactured by the chip component manufacturing method according to the embodiment of the present invention described above, the conductor 13 is such that a part of the conductor 13 is located outside the both ends in the width direction of the pair of upper surface electrodes 12. Are electrically connected to the pair of upper surface electrodes 12, and the protective film 14 covers only a part of the conductor 13, so that a portion of the conductor 13 that does not overlap the upper surface electrode 12 is exposed. Therefore, the portion of the conductor 13 electrically connected to the upper surface electrode 12 that does not overlap the upper surface electrode 12 protrudes greatly from the protective film 14, and the portion of the conductor 13 that protrudes from the protective film 14 is the upper surface electrode 12. Therefore, even when the overlapping portion of the upper surface electrode 12 and the conductor 13 is alloyed to increase the resistance value, it is alloyed without overlapping with the upper surface electrode 12. The plating layer 14 can be formed so as to be directly electrically connected to the non-conductor 13 via the auxiliary upper surface electrode 16, thereby providing a chip component having a stable low resistance value. Is obtained. In addition, since the protective film 14 is formed of glass, there is no bleeding of the resin that occurs when the protective film 14 is formed of resin, thereby preventing the conductor 13 and the auxiliary upper surface electrode 16 and / or nickel plating. Since the bleeding film does not intervene with the layer 17, a low resistance value required particularly for the jumper chip component can be stably obtained.

  FIG. 5 shows a comparison of the characteristics of a jumper chip part, which is an example of a conventional chip part, and a jumper chip part, which is an example of a chip part in an embodiment of the present invention. The horizontal axis represents the initial resistance value, and the vertical axis represents the resistance value change rate after the thermal shock test of 100 cycles. A part of the conductor 13 is disposed outside the both end portions of the upper surface electrode 12 in the direction of the primary dividing line 11a in the individual region, and the present invention indicated by a symbol ○ which is made of glass for the protective film 14. The chip component in one embodiment of the present invention has an initial resistance value that is stably low at around 30 mΩ and a resistance value change rate after a thermal shock test as low as 10% or less, and a low resistance required for a jumper chip component. The characteristic that the value is stably obtained is sufficiently satisfied. On the other hand, the conductor is arranged only inside the both end portions in the primary dividing line direction of the upper surface electrode within the individual piece region, and the conventional example 1 indicated by □ made of resin for the protective film and the conductor In the conventional example 2 which is disposed only inside both ends of the upper surface electrode in the direction of the primary dividing line in the individual piece region, and indicated by the Δ mark made of glass as the protective film, the initial resistance value is 40. Since the resin is used for the protective film in the first conventional example, a resin bleeding film 19 as shown in FIG. 6 is formed, and the conduction between the conductor 13 and the auxiliary upper surface electrode 16 is unstable. Thus, the rate of change in resistance value is increased. In particular, if the bleeding film 19 is formed densely, the conductive path between the conductor 13 and the tin plating layer 18 always passes through the upper surface electrode 12, and in this case, the upper surface electrode 12 is made of gold having a high resistance value. Since it is formed of resinate, the resistance value is increased due to the influence.

  In the above-described embodiment of the present invention, the jumper chip component is described as an example of the chip component. However, the jumper chip component is not particularly limited, and the conductor 13 is cut by laser trimming or the like. Thus, by adjusting the resistance value, it can be applied to a highly accurate chip resistor having a low resistance value.

  In the chip component and the manufacturing method thereof according to the present invention, even when the overlapping portion of the upper surface electrode and the conductor is alloyed and the resistance value is increased, the plating layer is directly applied to the non-alloyed conductor without overlapping the upper surface electrode. Since it can be formed so as to be connected to each other, it has an effect that a stable low resistance value can be obtained, and is particularly useful when applied to a manufacturing method of a micro jumper chip component. is there.

Sectional drawing of the jumper chip component which is an example of the chip component in one embodiment of this invention (A)-(c) Manufacturing process figure which shows the manufacturing method of the jumper chip component (A)-(c) Manufacturing process figure which shows the manufacturing method of the jumper chip component (A)-(c) Manufacturing process figure which shows the manufacturing method of the jumper chip component The figure which compared the characteristic of the jumper chip component which is an example of the chip component in one embodiment of this invention and the jumper chip component which is an example of the conventional chip component Sectional drawing when the protective film of the jumper chip part which is an example of the chip part in one embodiment of this invention raise | generates bleeding (A)-(c) Manufacturing process figure which shows the manufacturing method of the jumper chip component which is an example of the conventional chip component (A)-(e) Manufacturing process figure which shows the manufacturing method of the jumper chip component

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Insulation board | substrate 11a Primary division line 11b Secondary division line 11c Sheet-like insulation board | substrate 11d Strip-shaped board | substrate 11e Single piece board | substrate 12 Upper surface electrode 13 Conductor 14 Protective film 15 End surface electrode 16 Auxiliary upper surface electrode 17 Nickel plating layer 18 Tin plating layer

Claims (3)

A pair of upper surface electrodes mainly composed of gold formed on both ends of the upper surface of the insulating substrate, a conductor mainly composed of silver formed so as to be electrically connected to the pair of upper surface electrodes, A protective film covering the conductor, an end surface electrode formed on the back surface and the end surface of the insulating substrate so as to be electrically connected to the pair of upper surface electrodes, and an electrical connection to the upper surface electrode, the conductor and the end surface electrode And the conductive layer is electrically connected to the pair of upper surface electrodes such that a part of the conductor is positioned outside both ends in the width direction of the pair of upper surface electrodes, And the chip part comprised so that the part which does not overlap with the upper surface electrode in the said conductor might be exposed by making the said protective film cover only a part of said conductor. 2. The chip component according to claim 1, wherein the auxiliary upper surface electrode is formed by sputtering so as to be electrically connected to the upper surface electrode, the conductor, and the end surface electrode, and the protective film is formed of glass. Forming a plurality of upper surface electrodes on an upper surface of a sheet-like insulating substrate having a primary division line and a secondary division line so as to straddle only the primary division line; and being electrically connected to the plurality of upper surface electrodes. A step of forming a conductor in a plurality of individual regions surrounded by the primary dividing line and the secondary dividing line, a step of forming a protective film so as to cover the conductor, and the sheet-like insulation A step of primary dicing the substrate along the primary dividing line, and a back surface of the sheet-like insulating substrate and an end surface obtained by the primary dicing are electrically connected to the plurality of upper surface electrodes and conductors. Forming the end face electrode, forming the auxiliary upper face electrode by sputtering so as to be electrically connected to the upper face electrode, the conductor and the end face electrode, and dividing the insulating substrate along the secondary dividing line. Piece And a step of forming a plating layer so as to cover the entire surface of the end surface electrode and the auxiliary upper surface electrode on both end surfaces of the individual substrate, and the plurality of conductors are connected to the plurality of upper surface electrodes. In the step of forming the plurality of conductors so as to be electrically connected to each other, the part of the plurality of conductors is positioned outside the both ends of the plurality of upper surface electrodes in the primary division line direction in the piece region. In the step of electrically connecting a plurality of conductors to a plurality of upper surface electrodes and forming a protective film so as to cover the conductor, the protective film covers only a part of the conductor, whereby the conductor A method of manufacturing a chip component configured to expose a portion that does not overlap with the upper surface electrode.

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