JP4380398B2 - Jumper chip component and manufacturing method thereof - Google Patents

Description

The present invention relates to a jumper chip component used in various electronic devices and a method for manufacturing the same.

As shown in FIG. 4, this type of conventional jumper chip component includes an insulating substrate 1, an element 2 provided on the upper surface of the insulating substrate 1, and back electrodes 3 provided at both ends of the lower surface of the insulating substrate 1. And a pair of end face electrodes 4 provided at both ends of the insulating substrate 1 so as to be connected to the element 2 and the back electrode 3, and a protective film 5 provided so as to cover at least the element 2.

The shape of the outer surface of the protective film 5 is arcuate central portion of the central portion 5a i.e. jumper chip component is in the top of the jumper chip component. Further, an end face electrode 4 is also formed on the lower surface of the back electrode 3, and the end face electrode 4 on the lower surface of the back electrode 3 is the lowermost part of the jumper chip component .

As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
Japanese Patent Laid-Open No. 2002-25802

The conventional jumper chip component described above has a problem that the yield at the time of mounting is low because it is cracked when mounted on a printed circuit board. This is thought to be due to the following reasons.

When mounting the jumper chip component on the printed circuit board, the jumper chip component is moved to a predetermined position on the printed circuit board while being held by the suction nozzle of the mounting machine. The jumper chip component moved to the printed circuit board is in contact with the printed circuit board and the back electrode 3, while the suction nozzle is in contact with the uppermost portion of the jumper chip component , that is, the central portion 5a of the protective film. At this time, the suction nozzle applies a force for pressing the jumper chip component against the printed circuit board. In other words, the jumper chip component is in a state where a force is applied to the central portion 5a by the suction nozzle, and this force is received by the back surface electrodes 3 at both ends of the jumper chip component .

  In such a state, the bending moment applied to the insulating substrate 1 is large, and the insulating substrate 1 is relatively easily broken. In recent years, the insulating substrate 1 has been made thinner, especially when the thickness of the insulating substrate 1 is 0.3 mm or less, and the insulating substrate 1 is more likely to be cracked. Yield was decreasing.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-described conventional problems, and to provide a jumper chip component capable of improving the yield at the time of mounting or the like and a method for manufacturing the same.

  In order to achieve the above object, the present invention has the following configuration.

The invention according to claim 1 of the present invention includes an insulating substrate, an element provided on the upper surface of the insulating substrate, and a pair of end face electrodes provided at both ends of the insulating substrate so as to be connected to the element. A protective film provided so as to cover the element, and provided with a convex portion protruding above the other part of the protective film at the end of the protective film. Since the convex portion protruding above the other part of the protective film is provided at the end of the protective film, the place where the suction nozzle contacts when mounting on the printed circuit board is the end of the jumper chip component. Since the bending moment can be reduced as compared with the case where the contact is made only at the center, the possibility of breaking the insulating substrate can be reduced, and the effect of improving the yield in mounting can be obtained.

The invention according to claim 2 of the present invention is particularly one in which a plurality of convex portions are provided and at least one of the convex portions is provided at an end portion of the protective film. Since the suction nozzle comes into contact with the end of the jumper chip component during mounting, the bending moment can be reduced compared to when the suction nozzle touches only at one central point, thus reducing the possibility of breaking the insulating substrate. Thus, it is possible to obtain an effect that the yield at the time of mounting can be improved.

In the invention according to claim 3 of the present invention, in particular, one or more convex portions are provided at both ends of the protective film. According to this configuration, the suction nozzle is a jumper chip component when mounted on a printed circuit board. Since the contact is made at both ends, the bending moment can be reduced compared to the case where the suction nozzle contacts only at one point in the center, so the possibility of breaking the insulating substrate can be reduced and the yield during mounting is improved. The effect that it can be made is obtained.

In the invention according to claim 4 of the present invention, in particular, the convex portion is formed by the auxiliary protective layer formed between the element and the protective film. According to this configuration, the formation of the auxiliary protective layer is simplified. Since the convex portion can be formed at a desired position by a simple method, at least one convex portion can be easily provided at both end portions of the protective film, so that the suction nozzle contacts only at one point in the center. Since the bending moment can be reduced as compared with the above, the possibility of breaking the insulating substrate can be reduced, and the effect of improving the yield during mounting can be obtained.

According to a fifth aspect of the present invention, there is provided a step of forming an element on an upper surface of an insulating substrate, a step of forming an auxiliary protective layer on an end portion of the upper surface of the element, and covering the element and the auxiliary protective layer. Providing a protective film so as to project a convex portion projecting upward from other parts at the end of the protective film, and forming a pair of end face electrodes on both end faces of the insulating substrate so as to be connected to the element According to this manufacturing method, since the method has a step of forming a convex portion protruding above the other portion at the end of the protective film, the suction nozzle comes into contact with the printed circuit board when mounted. Since the location is the end of the jumper chip component , the bending moment can be reduced compared to the case where the suction nozzle contacts only at the center, so the possibility of breaking the insulating substrate can be reduced. Yield Effect that can be above can be obtained.

As described above, the jumper chip component of the present invention includes an insulating substrate, an element provided on the upper surface of the insulating substrate, and a pair of end face electrodes provided at both ends of the insulating substrate so as to be connected to the element. A protective film provided so as to cover the element, and a protrusion projecting upward from the other part of the protective film is provided at the end of the protective film. Since the contact point is the end of the jumper chip component , the bending moment can be reduced compared to the case where the suction nozzle contacts only at the center, so the possibility of breaking the insulating substrate can be reduced. It is possible to improve the yield of the product.

Hereinafter, a jumper chip component according to an embodiment of the present invention will be described.

FIG. 1 is a sectional view showing a jumper chip component according to an embodiment of the present invention.

As shown in FIG. 1, a jumper chip component according to an embodiment of the present invention includes an insulating substrate 11, a device 12 provided on the upper surface of the insulating substrate 11, and a pair of devices provided at both ends of the insulating substrate 11. An end face electrode 13 and a protective film 14 provided so as to cover the element 12 are provided, and convex portions 15 that protrude upward from the other portions of the protective film 14 are provided at both ends of the protective film 14.

  A plurality of convex portions 15 are provided on the protective film 14, and at least one of the convex portions 15 is provided on an end portion of the protective film 14.

  Further, an auxiliary protective layer 16 is provided between the protective film 14 and the element 12.

The said structure WHEREIN: The said insulating substrate 11 is a rectangular sheet form, and consists of insulators, such as an alumina. In the case of a very small jumper chip component, the insulating substrate 11 having a thickness of about 0.05 mm to 0.3 mm is used. Note that a back electrode 17 made of silver-based metal is provided at both ends of the lower surface of the insulating substrate 11.

  The element 12 is provided on the upper surface of the insulating substrate 11 and is made of a silver alloy such as silver or silver palladium, or a conductor such as gold. In addition, you may provide precoat glass on the upper surface of the element 12 as needed.

The pair of end surface electrodes 13 are provided at both end portions of the insulating substrate 11 and are connected to the upper surface of the element 12 and the lower surface of the back electrode 17. Therefore, the end face electrode 13 formed also on the lower surface of the back electrode 17 is the lowermost part of the jumper chip component . When the end electrode 13 is not formed on the lower surface of the back electrode 17, the back electrode 17 is the lowest part of the jumper chip component . Thus, the bottom of the jumper chip component for which is to be located at both ends of the jumper chip component, thereby supporting the jumper chip component at both ends of the jumper chip component at the mounting or the like. Further, the end face electrode 13 is made of silver, a nickel plating layer (not shown) is formed on the surface thereof, and a tin plating layer (not shown) is further formed on the surface of the nickel plating layer.

  The protective film 14 is provided on the insulating substrate 11 so as to cover at least the element 12 and is made of a resin such as an epoxy resin.

  The convex portion 15 is a portion that protrudes upward from the other portion of the protective film 14, and is provided in two, one at each end of the protective film 14. For this reason, at the time of mounting on the printed circuit board, the suction nozzle of the mounting machine comes into contact with the two convex portions 15, and the bending moment of the insulating substrate 11 can be reduced.

Incidentally, the convex portion 15 is preferred as it reduces the bending moment in the insulating substrate 11 the distance between the end surface electrode 13 as formed in a position close to the top end is reduced in the insulating substrate 11, formed ease, parts considering the dimensions and the like, the distance from the top end portion of the insulating substrate 11 with respect to the total length of the jumper chip component, for example, it may be formed at a position of 1 / 3-1 / 4.

  Two auxiliary protective layers 16 are provided between a part of the upper surface of the element 12 and the lower surface of the protective film 14, and are made of a resin such as an epoxy resin. By providing the auxiliary protective layer 16, the protective film 14 formed thereon protrudes upward by an amount corresponding to the thickness of the auxiliary protective layer 16, and becomes a convex portion 15. Therefore, the convex part 15 can be provided easily.

Next, a method for manufacturing a jumper chip component according to an embodiment of the present invention will be described. 2A to 2C are top views, and FIGS. 3A to 3C are perspective views.

First, as shown in FIG. 2A, on the upper surface of a sheet-like insulating substrate 21 in which regions corresponding to one jumper chip component are continuously partitioned, pieces corresponding to one jumper chip component. A plurality of vertical grooves 22 and horizontal grooves 23 to be divided into pieces are formed by a mold or the like.

  Then, the element 12 is formed on the upper surface of the insulating substrate 21 in parallel with the vertical grooves 22. At this time, the element 12 is formed so as to straddle the horizontal groove 23, but the vertical groove 22 is formed so as not to straddle. The element 12 is formed by screen-printing a silver alloy such as silver or silver-palladium, or a conductive paste such as gold, and then firing at about 850 ° C.

  Thereafter, a back electrode (not shown) is formed on the lower surface of the sheet-like insulating substrate 21. The back electrode is formed in parallel to the lateral groove 23 and at a position including the lateral groove 23. Note that the back electrode may be provided before the element 12 is formed. Moreover, you may form precoat glass on the upper surface of the element 12 as needed.

Next, as shown in FIG. 2B, two auxiliary protective layers 16 are formed in parallel with the lateral grooves 23 and between two adjacent lateral grooves 23. The auxiliary protective layer 16 is formed at the end of the element 12 in the finished jumper chip component .

  Next, as shown in FIG. 2C, a protective film 14 is formed by screen printing and curing a resin paste made of an epoxy resin or the like so as to cover at least the auxiliary protective layer 16.

  Next, as shown in FIG. 3A, the sheet-like insulating substrate 21 obtained in the previous step is divided into strips along the lateral grooves 23 to form a plurality of strip-like insulating substrates 24.

  Next, as shown in FIG. 3B, the end face electrode 13 is formed on the opposite side face in the longitudinal direction of the strip-like insulating substrate 24 so as to be connected to the element 12 and the back face electrode. The end face electrode 13 is formed by printing silver. Further, a nickel plating layer (not shown) is formed on the surface by plating, and a tin plating layer (not shown) is formed on the surface of the nickel plating layer by plating.

  Finally, as shown in FIG. 3C, the strip-shaped insulating substrate 24 obtained in the previous step is divided along the longitudinal groove 22 to produce individual chip jumpers 25.

  In the above-described embodiment of the present invention, since the protrusions 15 projecting upward from the other portions of the protective film 14 are provided at both ends of the protective film 14 at the end of the protective film 14, the insulating substrate Since the bending moment resulting from the force which 11 receives from a suction nozzle can be reduced, the possibility that the insulating substrate 11 will break can be reduced, thereby obtaining the effect that the yield at the time of mounting can be improved. It is done.

  Moreover, since the convex part 15 is formed in the protective film 14 by providing the auxiliary protective layer 16 between the protective film 14 and the element 12, the convex part 15 can be easily provided in a predetermined position.

  Note that the convex portion 15 is a portion that protrudes upward from the other portion of the protective film 14, but strictly speaking, the plurality of protruding portions do not have the same protruding amount, and are higher than the other portions. However, in the present invention, the “part projecting upward from the other parts” means the part projecting to the extent that the suction nozzle of the mounting machine contacts during mounting, that is, The part which can be considered that it protrudes upwards substantially from other parts is pointed out.

  Moreover, although the convex part 15 was formed in the edge part of the protective film 14, an edge part here is a word with respect to a center part, and does not point out only the position of the extreme end of the protective film 14. FIG.

  Further, the present invention is not limited to the configuration of the above-described embodiment, and may be configured as follows.

  Although the convex portions 15 are formed at both end portions of the protective film 14, the effect can be obtained even when formed at one end portion. The position where the convex portion 15 having the most effect is formed is a portion facing the back electrode 17. In this case, theoretically, the insulating substrate 11 does not generate a bending moment, and the insulating substrate 11 is cracked during mounting. Disappears. Even if the position where the convex portion 15 is formed is not a portion facing the back electrode 17, the bending moment applied to the insulating substrate 11 can be reduced as the portion is closer to the outermost portion of the protective film 14.

  Moreover, although the plurality of convex portions 15 are provided, one may be provided. In this case, it is preferable to form the convex portion 15 at a position as far as possible from the central portion of the protective film 14.

  Furthermore, a plurality of convex portions 15 may be formed, one of them may be formed at the center of the protective film 14, and the other convex portion 15 may be formed at the end of the protective film 14. Even in this case, the bending moment can be reduced as compared with the case where the convex portion 15 is formed only in the central portion of the protective film 14.

  In addition, the position where the convex portion 15 is formed is formed on the end portion of the protective film 14, or a plurality of the convex portions 15 are formed and at least one of them is formed on the end portion, or the convex portion 15 is protected. The reason why the bending moment applied to the insulating substrate 11 can be reduced by forming it at both ends of the film 14 as compared with the case where the convex part 15 is formed only at the center of the protective film 14 is as follows. The insulating substrate 11 may be considered as a simple beam that supports the back electrode 17.

The jumper chip component and the manufacturing method thereof according to the present invention can improve the yield and are useful for various electronic devices and the like.

Sectional drawing of the jumper chip component in one embodiment of this invention (A)-(c) Top view which shows the manufacturing method of the jumper chip component (A)-(c) The perspective view which shows the manufacturing method of the jumper chip component Cross-sectional view of conventional jumper chip parts

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Insulation board | substrate 12 Element 13 End surface electrode 14 Protective film 15 Convex part 16 Auxiliary protective layer

Claims (5)

An insulating substrate, an element provided on the upper surface of the insulating substrate, a pair of end face electrodes provided at both ends of the insulating substrate so as to be connected to the element, and a protective film provided so as to cover the element And a jumper chip component provided with a convex portion protruding above the other portion of the protective film at the end of the protective film . The jumper chip component according to claim 1, wherein a plurality of protrusions are provided, and at least one of the protrusions is provided at an end of the protective film . The jumper chip component according to claim 2, wherein at least one convex portion is provided at each end of the protective film . 4. The jumper chip component according to claim 1, wherein a convex portion is formed on the protective film by providing an auxiliary protective layer between the protective film and the element . Forming an element on the upper surface of the insulating substrate; forming an auxiliary protective layer on an end of the upper surface of the element; and providing a protective film to cover the element and the auxiliary protective layer and above the other part. A method of manufacturing a jumper chip component , comprising: a step of forming a protruding portion projecting on the end of the protective film; and a step of forming a pair of end surface electrodes on both end surfaces of the insulating substrate so as to be connected to the element. .

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