JPH10135583A - Ceramic substrate with split groove - Google Patents
Ceramic substrate with split grooveInfo
- Publication number
- JPH10135583A JPH10135583A JP28700096A JP28700096A JPH10135583A JP H10135583 A JPH10135583 A JP H10135583A JP 28700096 A JP28700096 A JP 28700096A JP 28700096 A JP28700096 A JP 28700096A JP H10135583 A JPH10135583 A JP H10135583A
- Authority
- JP
- Japan
- Prior art keywords
- notch
- dummy
- ceramic substrate
- dividing
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明が属する技術分野】本発明は、チップ状電子部品
等を製造するための分割溝を有するセラミック基板に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic substrate having divided grooves for manufacturing chip-shaped electronic components and the like.
【０００２】[0002]
【従来の技術】従来より、耐熱性、耐電気絶縁性等に優
れた電気、電子部品等の基板としてセラミック基板が用
いられている。その一例として、アルミナを主体として
マグネシアや珪石等を混合したセラミック粉末を、有機
バインダー及び焼結助剤とともに混練した後、押出成形
機等によって連続シート状に成形し、これを所望形状に
打抜加工してグリーンシートとし、これを焼成してセラ
ミック基板とすることが行われている。2. Description of the Related Art Conventionally, ceramic substrates have been used as substrates for electric and electronic parts having excellent heat resistance and electric insulation resistance. As an example, ceramic powder obtained by mixing magnesia or silica with alumina as a main component is kneaded together with an organic binder and a sintering aid, then formed into a continuous sheet by an extruder or the like, and punched into a desired shape. Green sheets are processed and fired to form ceramic substrates.
【０００３】この時、グリーンシートの状態でスリット
刃を押し当てることによって分割溝を形成し、そのまま
焼成すれば分割溝を有するセラミック基板が得られる。
そして、分割溝で囲まれる領域に電極等のパターンを印
刷した後、最終的に分割溝に沿って分割し、チップ状の
電子部品等を得ることが行われている。At this time, a dividing groove is formed by pressing a slit blade in a state of a green sheet, and if it is fired as it is, a ceramic substrate having the dividing groove can be obtained.
Then, after printing a pattern of an electrode or the like in a region surrounded by the dividing groove, the chip is finally divided along the dividing groove to obtain a chip-shaped electronic component or the like.
【０００４】このような分割溝を有するセラミック基板
の例としては、図６に示すように、セラミック基板１の
表面に縦の分割溝２と横の分割溝３を複数形成し、短辺
側の端部に最終製品とならないダミー部５を備えたもの
が一般的に用いられている。このセラミック基板１は厚
みが薄く、分割溝２、３の数も多いため製造工程中で分
割溝２、３から割れたり、クラックが生じたりする等の
問題がある。そこで、短辺側の端部にダミー部５を備え
ることによって、上記問題を避けるようにしてある。As an example of a ceramic substrate having such a dividing groove, as shown in FIG. 6, a plurality of vertical dividing grooves 2 and a plurality of horizontal dividing grooves 3 are formed on the surface of a ceramic substrate 1 so as to form a short side. The one provided with a dummy portion 5 which is not a final product at the end is generally used. Since the ceramic substrate 1 is thin and has many dividing grooves 2 and 3, there are problems such as cracking or cracking from the dividing grooves 2 and 3 during the manufacturing process. Therefore, the above problem is avoided by providing the dummy portion 5 at the short side end.
【０００５】また、このセラミック基板１の一つの角部
には斜面状のノッチ４が形成されており、このノッチ４
でセラミック基板１の方向決めを行うようになってい
る。[0005] A sloped notch 4 is formed at one corner of the ceramic substrate 1.
The direction of the ceramic substrate 1 is determined.
【０００６】しかし、図６に示すようなセラミック基板
１では、長辺側の端部からクラック等が生じるという不
都合があった。これに対し、例えば特開昭５９−１６２
０１３号公報に示されるように、分割溝２、３を形成し
た後、グリーンシートの段階で分割溝２、３の先端部に
有機溶剤を含浸させてクラックを消失させる方法も提案
されているが、このような方法は製造工程が煩雑となる
だけでなく、上記不都合の解消に効果的ではなかった。However, the ceramic substrate 1 as shown in FIG. 6 has a disadvantage that a crack or the like is formed from the end on the long side. On the other hand, for example, Japanese Unexamined Patent Application Publication No.
As disclosed in Japanese Patent No. 013, a method of forming cracks 2 and 3 and then impregnating an organic solvent at the end of the grooves 2 and 3 at a green sheet stage to eliminate cracks has been proposed. However, such a method not only complicates the manufacturing process but also is not effective in solving the above-mentioned disadvantages.
【０００７】そこで、セラミック基板１の長辺側にもダ
ミー部を形成することが行われている。この場合のノッ
チ近傍を図７に示すように、最外周の分割溝２ａ、３ａ
の外側にそれぞれダミー部５ａ、５ｂを備え、斜面状の
ノッチ４を形成したものである。なおダミー部５ａ、５
ｂ中にダミー分割溝６を形成してあるが、これは分割溝
２、３を形成する際に、最外周の分割溝２ａ、３ａに歪
みが生じないようにするためである。Therefore, a dummy portion is also formed on the long side of the ceramic substrate 1. As shown in FIG. 7, the vicinity of the notch in this case is the outermost divided grooves 2a, 3a.
Are provided with dummy portions 5a and 5b, respectively, and are formed with notches 4 having an inclined surface. Note that the dummy sections 5a, 5
The dummy division groove 6 is formed in the groove b in order to prevent distortion in the outermost division grooves 2a, 3a when the division grooves 2, 3 are formed.
【０００８】[0008]
【発明が解決しようとする課題】ところで、図７に示す
ようなセラミック基板１を分割する際には、まず縦の最
外周の分割溝２ａで分割して長辺側のダミー部５ａを切
り落とすが、この際にノッチ４の近傍にバリが生じやす
いという問題があった。When the ceramic substrate 1 as shown in FIG. 7 is divided, first, it is divided by the outermost vertical dividing groove 2a, and the long side dummy portion 5a is cut off. However, at this time, there is a problem that burrs are easily generated near the notch 4.
【０００９】即ち、分割溝２ａで分割した後のセラミッ
ク基板１を図８（ａ）（ｂ）に示すように、ノッチ４近
傍部分に、凸状又は凹状のバリ７が発生しやすかった。That is, as shown in FIGS. 8 (a) and 8 (b), the ceramic substrate 1 after being divided by the dividing grooves 2a tends to have convex or concave burrs 7 near the notch 4.
【００１０】[0010]
【課題を解決するための手段】そこで本発明は、多数個
に分割するために複数の分割溝を備えたセラミック基板
において、全周にダミー部を備えるとともに、このダミ
ー部の一部に、最外周の分割溝に連続する切り込み状又
は貫通孔からなるノッチを形成したことを特徴とする。SUMMARY OF THE INVENTION Accordingly, the present invention provides a ceramic substrate having a plurality of division grooves for dividing into a large number of parts, including a dummy part all around and a part of the dummy part A notch formed of a continuous cut or through hole is formed in the outer peripheral dividing groove.
【００１１】即ち、上記の問題点について種々検討した
結果、ノッチが斜面状であることから、ダミー部のノッ
チ側端部の幅が狭くなって充分に応力が加わらず、しか
もダミー部のノッチ側端面と分割溝が斜めに交差するた
め分割時の応力が横方向に逃げてしまい、これらの理由
によってバリが発生することがわかった。そして、この
ようなバリを防止するために、ノッチの形状を切り込み
状又は貫通孔とすれば良いことを見出したのである。That is, as a result of various studies on the above-mentioned problems, the notch has a slope, so that the width of the notch-side end of the dummy portion becomes narrow, and sufficient stress is not applied. Since the end face and the dividing groove cross obliquely, the stress at the time of dividing escapes in the horizontal direction, and it was found that burrs were generated for these reasons. And, in order to prevent such burrs, they found that the shape of the notch should be a notch or a through hole.
【００１２】[0012]
【発明の実施の形態】以下、本発明の実施形態を図によ
って説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings.
【００１３】図１に示すセラミック基板１は、表面に縦
の分割溝２と横の分割溝３を複数形成したものであり、
その一つの角部にノッチ４を備え、全周にダミー部５
ａ、５ｂを有している。A ceramic substrate 1 shown in FIG. 1 has a plurality of vertical division grooves 2 and a plurality of horizontal division grooves 3 formed on the surface thereof.
A notch 4 is provided at one corner, and a dummy portion 5 is provided all around.
a and 5b.
【００１４】図２にノッチ４の近傍部を示すように、最
外周の分割溝２ａ、３ａの外側にそれぞれダミー部５
ａ、５ｂを備えており、このダミー部５ａ、５ｂにはダ
ミー分割溝６を有している。なお、このダミー分割溝６
は、分割溝２ａ、３ａの形成時に歪みを生じないように
するためのものであり、このダミー分割溝６に沿って分
割することはない。As shown in the vicinity of the notch 4 in FIG. 2, dummy portions 5 are provided outside the outermost divided grooves 2a and 3a, respectively.
a, 5b, and the dummy portions 5a, 5b have dummy division grooves 6. In addition, this dummy division groove 6
Are provided to prevent distortion during formation of the division grooves 2a and 3a, and are not divided along the dummy division grooves 6.
【００１５】また、ノッチ４は外辺からの切り込み状で
あり、その内壁は曲面部４ａと斜面部４ｂから形成さ
れ、縦の最外周の分割溝２ａと連続している。The notch 4 is cut out from the outer side, and its inner wall is formed by a curved surface portion 4a and a sloped portion 4b, and is continuous with the vertical outermost peripheral dividing groove 2a.
【００１６】ここで、ノッチ４が切り込み状であると
は、図７の従来例のように斜面状ではなく、平面視した
時に外辺から切り込んだ凹形状となっていることを言
う。言い換えれば、ノッチ４の斜面部４ｂの延長線４ｃ
（従来のノッチ形状に相当する）よりも外側にダミー部
５ａが張り出して形成していることを意味している。Here, that the notch 4 is notched means that the notch 4 is not a slope as in the conventional example of FIG. In other words, the extension line 4c of the slope 4b of the notch 4
This means that the dummy portion 5a is formed so as to protrude outside (corresponding to a conventional notch shape).
【００１７】そのため、このダミー部５ａを分割する最
に、ノッチ４近傍でも幅が広いことから充分に応力が加
わり、しかもダミー部５ａのノッチ４側の端面と分割溝
２ａがほぼ直角に交わることから応力が逃げずに確実に
分割することができ、バリの発生を防止できるのであ
る。また、ノッチ４は縦の最外周の分割溝２ａと連続し
ているために、分割溝２ａに沿った分割を良好に行うこ
とができる。Therefore, when the dummy portion 5a is divided, a sufficient stress is applied because the width is large even in the vicinity of the notch 4, and the end face of the dummy portion 5a on the side of the notch 4 and the dividing groove 2a intersect at a substantially right angle. Therefore, it is possible to surely divide the components without escaping the stress, and to prevent the occurrence of burrs. In addition, since the notch 4 is continuous with the outermost vertical division groove 2a, division along the division groove 2a can be performed favorably.
【００１８】以上のように、本発明のセラミック基板１
は、全周にダミー部５ａ、５ｂを備えていることから、
製造工程中等に割れたりクラックが生じたりすることは
なく、またノッチ４によって方向決めを行うことができ
る。しかも、上述したようにノッチ４を切り込み状とし
て最外周の分割溝２ａと連続させたことにより、ダミー
部５ａを分割する際にバリ等の発生を防止できる。As described above, the ceramic substrate 1 of the present invention
Has dummy portions 5a and 5b all around,
No cracks or cracks occur during the manufacturing process and the like, and the orientation can be determined by the notch 4. Moreover, as described above, since the notch 4 is cut into a notch and is continuous with the outermost peripheral groove 2a, it is possible to prevent the occurrence of burrs and the like when dividing the dummy portion 5a.
【００１９】また、ノッチ４の深さｄは、ダミー部５ｂ
に形成したダミー分割溝６の位置までとして、最外周の
分割溝３ａの位置よりも浅くしてある。そのため、ダミ
ー部５ａを分割した後、分割線３ａに沿ってもう一方の
ダミー部５ｂを分割する際にも、ダミー部５ｂのノッチ
４近傍部に充分な幅を残すとともに、この部分のダミー
部５ｂの端面と分割溝３ａが直角に交差することとな
り、バリの発生を防止することができる。The depth d of the notch 4 is the same as that of the dummy portion 5b.
Is made shallower than the position of the outermost peripheral dividing groove 3a up to the position of the dummy dividing groove 6 formed in the above. Therefore, after dividing the dummy portion 5a, when dividing the other dummy portion 5b along the dividing line 3a, a sufficient width is left near the notch 4 of the dummy portion 5b, and the dummy portion 5b Since the end face of 5b and the dividing groove 3a intersect at right angles, the occurrence of burrs can be prevented.
【００２０】さらに、ノッチ４の内壁に曲面部４ａを備
えるとともに、ダミー部５ａの角部にも曲面部５ｃを形
成してあることにより、グリーンシートの段階での外力
による変形や欠損等を防止することができる。なお、こ
れらの曲面部４ａ、５ｃの曲率半径は、ノッチ４の深さ
ｄに対して、０．５〜１倍とすることが好ましい。Further, the curved surface portion 4a is provided on the inner wall of the notch 4, and the curved surface portion 5c is also formed at the corner portion of the dummy portion 5a, thereby preventing deformation or loss due to external force at the stage of the green sheet. can do. It is preferable that the radius of curvature of the curved surface portions 4a and 5c is 0.5 to 1 times the depth d of the notch 4.
【００２１】また、本発明のセラミック基板１の材質と
しては、アルミナ、ジルコニア、ムライト、窒化珪素、
窒化アルミニウム等を主成分とするセラミックスを用い
るが、一般的にはＡｌ2 Ｏ3 を主成分とし、ＳｉＯ2 、
ＭｇＯ、ＣａＯ等を焼結助剤として含有するアルミナセ
ラミックスを用いる。The material of the ceramic substrate 1 of the present invention includes alumina, zirconia, mullite, silicon nitride,
Although ceramics containing aluminum nitride or the like as a main component are used, generally, Al 2 O 3 is used as a main component, and SiO 2 ,
Alumina ceramics containing MgO, CaO or the like as a sintering aid is used.
【００２２】次に、本発明のセラミック基板１の製造方
法を説明する。Next, a method for manufacturing the ceramic substrate 1 of the present invention will be described.
【００２３】まず、これらの原料を用いて、押出成形法
やドクターブレード法等によってシート状に成形し、得
られたシート状成形体を図１、２に示す外辺形状に打抜
くとともにスリット刃を押し当てて分割溝２、３等を形
成する。この時、外辺の打抜きとスリット刃による分割
溝２、３等の形成は、同時に行っても別々に行ってもよ
い。このようにして得られた成形体を所定条件で焼成す
ることによって、図１、２に示すセラミック基板１を得
ることができる。First, these materials are formed into a sheet by an extrusion molding method or a doctor blade method, and the obtained sheet-like molded body is punched into an outer shape shown in FIGS. To form the dividing grooves 2, 3 and the like. At this time, the punching of the outer side and the formation of the divided grooves 2, 3 and the like by the slit blade may be performed simultaneously or separately. By firing the obtained compact under predetermined conditions, the ceramic substrate 1 shown in FIGS. 1 and 2 can be obtained.
【００２４】また、本発明のセラミック基板１は、分割
溝２、３で囲まれる領域に所定の電極パターン等を印刷
して分割することによって、最終的にチップ状電子部品
等とすることができる。この時の分割の順序は、まず分
割溝２ａに沿ってダミー部５ａを分割し、つぎに分割溝
３ａに沿ってダミー部５ｂを分割し、最後に縦横の分割
溝２、３に沿って分割すれば良い。The ceramic substrate 1 of the present invention can be finally formed into a chip-shaped electronic component or the like by printing and dividing a predetermined electrode pattern or the like in a region surrounded by the dividing grooves 2 and 3. . The order of division at this time is as follows: first, the dummy portion 5a is divided along the division groove 2a, then the dummy portion 5b is divided along the division groove 3a, and finally, the division is performed along the vertical and horizontal division grooves 2, 3. Just do it.
【００２５】次に本発明の他の実施形態を説明する。Next, another embodiment of the present invention will be described.
【００２６】図３（ａ）に示すセラミック基板１は、ノ
ッチ４の形状を二つの斜面４ｂからなる切り込み状とし
たものである。また、図３（ｂ）に示すセラミック基板
１は、ノッチ４の形状を斜面４ｂと、ダミー部５ｂのダ
ミー分割溝６の延長線とにより形成したものである。In the ceramic substrate 1 shown in FIG. 3A, the shape of the notch 4 is a notch formed by two slopes 4b. In the ceramic substrate 1 shown in FIG. 3B, the shape of the notch 4 is formed by the slope 4b and an extension of the dummy division groove 6 of the dummy portion 5b.
【００２７】いずれの実施形態でも、ノッチ４は平面視
した時に外辺から切り込んだ凹形状となっており、従来
のノッチ形状に相当する斜面４ｂの延長線４ｃよりも外
側にダミー部５ａが張り出した形状となっている。した
がって、図１、２に例と同様に、ダミー部５ａを分割す
る際にバリの発生を防止することができる。In any of the embodiments, the notch 4 has a concave shape cut from the outer side when viewed in a plan view, and the dummy portion 5a projects outside the extension 4c of the slope 4b corresponding to the conventional notch shape. Shape. Therefore, similar to the example shown in FIGS. 1 and 2, it is possible to prevent the occurrence of burrs when dividing the dummy portion 5a.
【００２８】また、他の実施形態を図４に示すように、
ノッチ４の内壁を全て曲率半径Ｒの曲面部４ａとするこ
ともできる。Another embodiment is shown in FIG.
The entire inner wall of the notch 4 may be a curved surface portion 4a having a radius of curvature R.
【００２９】さらに他の実施形態として、図５に示すよ
うに、ノッチ４を貫通孔とし、最外周の分割溝２ａと連
続させることもできる。この場合も、上記の実施例と同
様にダミー部５ａの分割時にバリの発生を防止すること
ができる。また、円形の貫通孔として、ノッチ４の内壁
を曲面部４ａとすれば、グリーンシートの段階での外力
による変形や欠損等を防止できる。As still another embodiment, as shown in FIG. 5, the notch 4 may be formed as a through-hole, and may be continuous with the outermost peripheral dividing groove 2a. Also in this case, it is possible to prevent the occurrence of burrs at the time of dividing the dummy portion 5a as in the above-described embodiment. In addition, if the inner wall of the notch 4 is a curved surface portion 4a as a circular through hole, it is possible to prevent deformation, loss, and the like due to external force at the stage of the green sheet.
【００３０】このような本発明のセラミック基板１は、
チップ抵抗、チップコンデンサー等のチップ状電子部品
の製造、あるいはその他のチップ状部品の製造に用いる
ことができる。The ceramic substrate 1 according to the present invention has the following features.
It can be used for manufacturing chip-shaped electronic components such as chip resistors and chip capacitors, or for manufacturing other chip-shaped components.
【００３１】[0031]
【実施例】Ａｌ2 Ｏ3 含有量９３重量％で残部がＳｉＯ
2 、ＭｇＯ、ＣａＯからなるアルミナセラミックスを用
いて、図２、３（ａ）（ｂ）に示す本発明実施例のセラ
ミック基板１を作製した。寸法は、縦６０ｍｍ、横５５
ｍｍ、厚み０．５ｍｍで、分割溝２、３で囲まれる最小
領域を２．０×１．２５ｍｍとし、ノッチ４の深さｄは
１．５ｍｍとした。EXAMPLE An Al 2 O 3 content of 93% by weight and a balance of SiO
2 , 3 (a) and (b), the ceramic substrate 1 of the embodiment of the present invention was manufactured using alumina ceramics composed of MgO and CaO. Dimensions are 60mm in height and 55 in width
mm, the thickness was 0.5 mm, the minimum area surrounded by the dividing grooves 2 and 3 was 2.0 × 1.25 mm, and the depth d of the notch 4 was 1.5 mm.
【００３２】一方、比較例として、同じ材料、寸法で、
図７に示すノッチ形状のセラミック基板１を作製した。On the other hand, as a comparative example, with the same material and dimensions,
A notch-shaped ceramic substrate 1 shown in FIG. 7 was produced.
【００３３】これらのセラミック基板１に対し、治具を
ダミー部５ａに押し当てて、分割溝２ａから切断する試
験を行った。それぞれ、分割した部分に幅０．０３ｍｍ
以上のバリが発生したものを不良とし、不良の発生率を
調べた。結果は表１に示す通りである。With respect to these ceramic substrates 1, a test was performed in which a jig was pressed against the dummy portion 5a and cut from the dividing groove 2a. Each part is 0.03mm in width
Those having the above burrs were regarded as defective, and the defect occurrence rate was examined. The results are as shown in Table 1.
【００３４】この結果より、図７の比較例（Ｎｏ．４）
では、ダミー部５ａのノッチ４近傍において、ダミー部
５ａのノッチ４近傍の幅が狭く、しかもダミー部５ａの
ノッチ４側の端面と分割溝２ａが斜めに交わるために、
分割時の応力が分割溝２ａの横方向に逃げてしまい、そ
の結果凸状のバリが生じやすく、不良発生率が２．６％
と高かった。From the results, the comparative example (No. 4) shown in FIG.
Therefore, in the vicinity of the notch 4 of the dummy portion 5a, the width of the vicinity of the notch 4 of the dummy portion 5a is narrow, and the end face of the dummy portion 5a on the side of the notch 4 obliquely intersects with the dividing groove 2a.
The stress at the time of division escapes in the lateral direction of the division groove 2a, and as a result, convex burrs are easily generated, and the defect occurrence rate is 2.6%.
And it was high.
【００３５】これらに対し、ノッチ４を凹状とした本発
明実施例（Ｎｏ．１〜３）では、いずれも、ダミー部５
ａのノッチ４近傍の幅が広いことから充分に応力を加え
ることができ、バリによる不良発生率を０．６５％以下
と低くすることができた。特に図２の形状（Ｎｏ．１）
では、ダミー部５ａのノッチ４側の端面が分割溝２ａに
対して直角に交わることから、分割時の応力が直角に加
わるため、バリの発生が最も少なかった。On the other hand, in the embodiments of the present invention (Nos. 1 to 3) in which the notch 4 is concave,
Since the width of the notch 4 in the vicinity of “a” is wide, stress can be sufficiently applied, and the defect occurrence rate due to burrs can be reduced to 0.65% or less. In particular, the shape (No. 1) in FIG.
Since the end face of the dummy portion 5a on the side of the notch 4 intersects at right angles with the division groove 2a, the stress at the time of division is applied at right angles, and thus the occurrence of burrs is minimized.
【００３６】また、図３（ａ）の形状（Ｎｏ．２）で
は、ダミー部５ａのノッチ４側の端面が分割溝２ａに対
して斜めとなるため、若干応力が横方向に逃げてしまい
凹状のバリが発生したが、それでも比較例に比べて不良
率は充分に低かった。さらに、図３（ｂ）の形状（Ｎ
ｏ．３）では、ダミー部５ａのノッチ４側の端面が分割
溝２ａに対して直角であり、分割時の応力が直角に加わ
るため、バリの発生が少なかった。In the shape (No. 2) shown in FIG. 3A, the end face of the dummy portion 5a on the side of the notch 4 is inclined with respect to the dividing groove 2a, so that a small amount of stress escapes in the lateral direction and the concave portion becomes concave. However, the defect rate was still sufficiently lower than that of the comparative example. Further, the shape (N
o. In 3), the end face of the dummy portion 5a on the side of the notch 4 was perpendicular to the dividing groove 2a, and the stress at the time of dividing was applied at a right angle, so that the occurrence of burrs was small.
【００３７】[0037]
【表１】 [Table 1]
【００３８】[0038]
【発明の効果】以上のように本発明によれば、多数個に
分割するために複数の分割溝を備えたセラミック基板に
おいて、全周にダミー部を備えるとともに、このダミー
部の一部に、最外周の分割溝に連続する切り込み状又は
貫通孔からなるノッチを形成したことによって、製造工
程中等に割れたりクラックが生じたりすることがなく、
しかもダミー部を分割する際にバリの発生を防止するこ
とができる。As described above, according to the present invention, in a ceramic substrate provided with a plurality of division grooves for dividing into a plurality of parts, a dummy part is provided on the entire periphery and a part of the dummy part is provided. By forming a notch consisting of a notch or a through hole that is continuous with the outermost divided groove, no cracking or cracking occurs during the manufacturing process, etc.
In addition, it is possible to prevent the occurrence of burrs when dividing the dummy portion.
【００３９】したがって、各種チップ状電子部品等を製
造するために使用される分割溝を有するセラミック基板
を、極めて歩留り良く得ることができる。Therefore, it is possible to obtain a ceramic substrate having a divided groove used for manufacturing various chip-shaped electronic components and the like with extremely high yield.
【図１】本発明の分割溝を有するセラミック基板を示す
斜視図である。FIG. 1 is a perspective view showing a ceramic substrate having a dividing groove according to the present invention.
【図２】図１中のノッチ近傍を示す平面図である。FIG. 2 is a plan view showing the vicinity of a notch in FIG. 1;
【図３】（ａ）（ｂ）は本発明の他の実施形態を示すノ
ッチ近傍の平面図である。FIGS. 3 (a) and 3 (b) are plan views near a notch showing another embodiment of the present invention.
【図４】本発明の他の実施形態を示すノッチ近傍の平面
図である。FIG. 4 is a plan view near a notch showing another embodiment of the present invention.
【図５】本発明の他の実施形態を示すノッチ近傍の平面
図である。FIG. 5 is a plan view near a notch showing another embodiment of the present invention.
【図６】従来の分割溝を有するセラミック基板を示す斜
視図である。FIG. 6 is a perspective view showing a conventional ceramic substrate having a dividing groove.
【図７】図６中のノッチ近傍を示す平面図である。FIG. 7 is a plan view showing the vicinity of a notch in FIG. 6;
【図８】従来のセラミック基板を分割した後の平面図で
ある。FIG. 8 is a plan view after a conventional ceramic substrate is divided.
１：セラミック基板 ２、２ａ：分割溝 ３、３ａ：分割溝 ４：ノッチ ５、５ａ、５ｂ：ダミー部 ６：ダミー分割溝 ７：バリ 1: Ceramic substrate 2, 2a: Dividing groove 3, 3a: Dividing groove 4: Notch 5, 5a, 5b: Dummy part 6: Dummy dividing groove 7: Burr
Claims (1)
えたセラミック基板において、全周にダミー部を備える
とともに、このダミー部の一部に、最外周の分割溝に連
続する切り込み状又は貫通孔からなるノッチを形成した
ことを特徴とする分割溝を有するセラミック基板。1. A ceramic substrate provided with a plurality of divided grooves for dividing into a plurality of pieces, a dummy part is provided on the entire periphery, and a part of the dummy part is provided with a notch shape continuous with the outermost divided groove. Alternatively, a ceramic substrate having a dividing groove, wherein a notch made of a through hole is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28700096A JP3610173B2 (en) | 1996-10-29 | 1996-10-29 | Ceramic substrate having dividing grooves |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28700096A JP3610173B2 (en) | 1996-10-29 | 1996-10-29 | Ceramic substrate having dividing grooves |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10135583A true JPH10135583A (en) | 1998-05-22 |
| JP3610173B2 JP3610173B2 (en) | 2005-01-12 |
Family
ID=17711734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28700096A Expired - Fee Related JP3610173B2 (en) | 1996-10-29 | 1996-10-29 | Ceramic substrate having dividing grooves |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3610173B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007281115A (en) * | 2006-04-05 | 2007-10-25 | Murata Mfg Co Ltd | Multilayer circuit board and its manufacturing method |
-
1996
- 1996-10-29 JP JP28700096A patent/JP3610173B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007281115A (en) * | 2006-04-05 | 2007-10-25 | Murata Mfg Co Ltd | Multilayer circuit board and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3610173B2 (en) | 2005-01-12 |
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