CN212070723U - Water-cooled vacuum sealing door system - Google Patents
Water-cooled vacuum sealing door system Download PDFInfo
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- CN212070723U CN212070723U CN202020360943.6U CN202020360943U CN212070723U CN 212070723 U CN212070723 U CN 212070723U CN 202020360943 U CN202020360943 U CN 202020360943U CN 212070723 U CN212070723 U CN 212070723U
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Abstract
The utility model relates to a water-cooled vacuum sealing door system, a be used for the sealing of reflow oven, including sealed door plant, water-cooling backplate and elevating system, elevating system is located the opening below of the vacuum cavity of reflow oven, sealed door plant is connected with elevating system, sealed door plant shape matches with vacuum cavity, constitute vacuum cavity's mobile lateral wall, the water-cooling backplate is fixed in the sealed door plant outside, when elevating system promotes sealed door plant and water-cooling backplate upward movement, sealed door plant laminates with vacuum cavity's opening, realize vacuum cavity's sealing, when elevating system drives sealed door plant and water-cooling backplate downstream, sealed door plant leaves vacuum cavity, realize vacuum cavity and backward flow furnace intercommunication, make the normal business turn over of product. Compared with the prior art, the utility model discloses utilize the water-cooling backplate to realize the cooling of sealing door and vacuum cavity outer wall, the cooling effect is obvious, and is with low costs, reduces welding point cavity size and quantity, improves product quality.
Description
Technical Field
The utility model relates to a sealing door especially relates to a water-cooled vacuum sealing door system.
Background
A Reflow Oven (Reflow Oven) is an apparatus for soldering a circuit board carrying electronic components. It makes the solder paste be heated and melts through providing a heating environment thereby let surface mounted's components and parts and circuit board combine together through the solder paste alloy reliably. The soldering paste used for soldering is prepared by making grease-shaped soldering flux and powder solder into paste, coating the paste on the soldering position of each component of the circuit board by printing, accurately mounting electronic components on the paste, and heating and melting by using a reflow furnace to achieve reliable soldering of the components.
With the miniaturization of the electronic industry, the development of multiple specifications is in progress. The requirement on the product quality is higher and higher, and in order to meet the new market demand, the product defects caused by welding are reduced, and the product productivity and the qualified rate are improved. The vacuum device is added into the reflow oven, so that the welding reliability of the product can be improved, the defects can be reduced, the size and the number of soldering tin cavities can be effectively reduced, and the welding quality can be improved.
Some brazing materials that electronic components used can exert better performance under high temperature heating environment, and in order to adapt to this demand, vacuum apparatus also need can normal operating under high temperature environment for some parts need adopt high temperature resistant material, cause equipment cost to increase. Therefore, a vacuum sealing door needs to be designed, so that the sealing performance of the vacuum device can be ensured while the cost performance is improved.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a water-cooled vacuum sealing door system applied to a vacuum device under a high-temperature environment in order to overcome the defects of the prior art.
The purpose of the utility model can be realized through the following technical scheme:
the utility model provides a water-cooled vacuum sealing door system for reflow soldering furnace's is sealed, includes sealing door board, water-cooling backplate and elevating system, elevating system be located reflow soldering furnace's vacuum cavity's opening below, sealing door board be connected with elevating system, sealing door board shape matches with vacuum cavity, constitutes vacuum cavity's mobile lateral wall, water-cooling backplate fix in the sealing door board outside, when elevating system promoted sealing door board and water-cooling backplate upward movement, sealing door board and vacuum cavity's opening laminating realized vacuum cavity's sealing, when elevating system drove sealing door board and water-cooling backplate downstream, sealing door board left vacuum cavity, realized vacuum cavity and backward flow furnace intercommunication, made the normal business turn over of product.
The lifting mechanism is a cylinder.
The top of the cylinder is connected with two vertical connecting rods, and the sealing door plate is arranged between the two connecting rods.
The top of the cylinder is connected with a transverse supporting plate, and the connecting rods are fixed at two ends of the transverse supporting plate.
And a floating sealing element is arranged on the connecting rod.
The water-cooling back plate is provided with a water pipe, the connecting rod is hollow and is communicated with the water pipe, and the bottom of the connecting rod is provided with a water inlet joint and a water outlet joint.
The water pipe is a copper pipe.
The bottom of the cylinder is fixed on the chassis of the reflow oven through a support frame.
The support frame bottom be equipped with two L shape stabilizer blades, stabilizer blade bottom be equipped with the screw thread through-hole.
Compared with the prior art, the utility model has the advantages of it is following:
(1) utilize the cooling of water-cooling backplate realization sealing door and vacuum chamber outer wall, the cooling effect is obvious, and is with low costs, reduces welding point cavity size and quantity, improves product quality.
(2) The connecting rod is provided with a floating sealing element, and after the sealing door is installed, the connecting rod penetrates through other parts on the reflow oven, and the floating sealing element can seal the other parts.
(3) The cylinder top even has two vertical connecting rods, and sealing door plant installs between two connecting rods, and the commonality is strong.
(4) The connecting rod is hollow and is communicated with the water pipe, and the bottom of the connecting rod is provided with a water inlet and outlet joint, so that the structure is simplified and the installation is convenient.
(5) The water pipe is a copper pipe, is easy to install and maintain, has stronger rigidity, can extend into the connecting rod to improve the supporting effect, and has high temperature resistance, deformation resistance and good heat dissipation effect.
Drawings
FIG. 1 is a schematic front view of a water-cooled vacuum sealing door system according to an embodiment;
FIG. 2 is a schematic diagram of a back side of the water-cooled vacuum sealing door system according to the embodiment;
FIG. 3 is a schematic diagram of a water inlet/outlet joint at the bottom of a connecting rod of the water-cooled vacuum sealing door system according to the embodiment;
reference numerals:
1 is a sealing door plate; 2 is a connecting rod; 3 is a cylinder; 4 is a supporting frame; 5 is a water pipe; 6 is a water-cooled back plate; 7 is a water inlet and outlet joint; 8 is a transverse supporting plate; and 9 is a floating sealing element.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. The embodiment is implemented on the premise of the technical solution of the present invention, and a detailed implementation manner and a specific operation process are given, but the scope of the present invention is not limited to the following embodiments.
Examples
As shown in figures 1-3, the water-cooled vacuum sealing door system is used for sealing a reflow soldering furnace and comprises a sealing door plate 1, a water-cooled back plate 6 and a lifting mechanism, wherein the lifting mechanism is located below an opening of a vacuum cavity of the reflow soldering furnace, the sealing door plate 1 is connected with the lifting mechanism, the shape of the sealing door plate 1 is matched with that of the vacuum cavity to form a movable side wall of the vacuum cavity, and the water-cooled back plate 6 is fixed on the outer side of the sealing door plate 1.
Elevating system is cylinder 3, and 3 tops of cylinder even have two vertical connecting rods 2, and sealing door panel 1 installs between two connecting rods 2.
The top of the cylinder 3 is connected with a transverse supporting plate 8, the connecting rod 2 is fixed at two ends of the transverse supporting plate 8, and a limiting plate 9 is arranged on the connecting rod 2.
The water cooling back plate 6 is provided with a water pipe 5, the connecting rod 2 is hollow and is communicated with the water pipe 5, and the bottom of the connecting rod 2 is provided with a water inlet and outlet joint 7.
The water pipe 5 is a copper pipe, the copper pipe has stronger rigidity, can extend into the connecting rod to improve the supporting effect, and is high-temperature resistant, not easy to deform and good in heat dissipation effect.
The bottom of the cylinder 3 is fixed on the chassis of the reflow soldering furnace through the support frame 4, the bottom of the support frame 4 is provided with two L-shaped support legs, and the bottoms of the support legs are provided with threaded through holes to realize detachable fixation.
When the air cylinder 3 pushes the sealing door plate 1 and the water-cooling back plate 6 to move upwards, the sealing door plate 1 is attached to the opening of the vacuum cavity and automatically stops after being completely in place, so that the vacuum cavity is sealed; when the cylinder 3 drives the sealing door plate 1 and the water-cooling back plate 6 to move downwards, the sealing door plate 1 leaves the vacuum cavity, so that the vacuum cavity is communicated with the backflow hearth, and a product can normally enter and exit. The floating seal on the tie rod 2 can seal against other components on the reflow oven.
Claims (9)
1. A water-cooled vacuum sealing door system is used for sealing a reflow oven and is characterized by comprising a sealing door plate (1), a water-cooled back plate (6) and a lifting mechanism, wherein the lifting mechanism is positioned below an opening of a vacuum cavity of the reflow oven, the sealing door plate (1) is connected with the lifting mechanism, the shape of the sealing door plate (1) is matched with that of the vacuum cavity to form a movable side wall of the vacuum cavity, the water-cooled back plate (6) is fixed on the outer side of the sealing door plate (1), when the lifting mechanism pushes the sealing door plate (1) and the water-cooled back plate (6) to move upwards, the sealing door plate (1) is attached to the opening of the vacuum cavity to realize the sealing of the vacuum cavity, when the lifting mechanism drives the sealing door plate (1) and the water-cooled back plate (6) to move downwards, the sealing door plate (1) leaves the vacuum cavity to realize the communication of the, so that the product can be normally fed in and out.
2. The water-cooled vacuum sealing door system according to claim 1, wherein the lifting mechanism is a cylinder (3).
3. The water-cooled vacuum sealing door system according to claim 2, characterized in that two vertical connecting rods (2) are connected to the top of the cylinder (3), and the sealing door panel (1) is installed between the two connecting rods (2).
4. The water-cooled vacuum sealing door system according to claim 3, wherein a transverse supporting plate (8) is connected to the top of the cylinder (3), and the connecting rod (2) is fixed to both ends of the transverse supporting plate (8).
5. The water-cooled vacuum sealing door system according to claim 3, wherein the connecting rod (2) is provided with a floating seal (9).
6. The water-cooled vacuum sealing door system according to claim 3, wherein a water pipe (5) is mounted on the water-cooled back plate (6), the connecting rod (2) is hollow and is communicated with the water pipe (5), and a water inlet and outlet joint (7) is arranged at the bottom of the connecting rod (2).
7. The water-cooled vacuum sealing door system according to claim 6, wherein the water pipe (5) is a copper pipe.
8. The water-cooled vacuum sealing door system according to claim 2, wherein the bottom of the cylinder (3) is fixed on the chassis of the reflow oven through a support frame (4).
9. The water-cooled vacuum sealing door system according to claim 8, wherein the bottom of the support frame (4) is provided with two L-shaped legs, and the bottom of each leg is provided with a threaded through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020360943.6U CN212070723U (en) | 2020-03-20 | 2020-03-20 | Water-cooled vacuum sealing door system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020360943.6U CN212070723U (en) | 2020-03-20 | 2020-03-20 | Water-cooled vacuum sealing door system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212070723U true CN212070723U (en) | 2020-12-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020360943.6U Active CN212070723U (en) | 2020-03-20 | 2020-03-20 | Water-cooled vacuum sealing door system |
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| CN (1) | CN212070723U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113492242A (en) * | 2020-03-20 | 2021-10-12 | 上海朗仕电子设备有限公司 | Water-cooled vacuum sealing door system |
| CN113492242B (en) * | 2020-03-20 | 2024-07-16 | 上海朗仕电子设备有限公司 | Water-cooled vacuum seal door system |
-
2020
- 2020-03-20 CN CN202020360943.6U patent/CN212070723U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113492242A (en) * | 2020-03-20 | 2021-10-12 | 上海朗仕电子设备有限公司 | Water-cooled vacuum sealing door system |
| CN113492242B (en) * | 2020-03-20 | 2024-07-16 | 上海朗仕电子设备有限公司 | Water-cooled vacuum seal door system |
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