CN215545615U - Reflow soldering furnace with cooling mechanism for SMT paster processing - Google Patents
Reflow soldering furnace with cooling mechanism for SMT paster processing Download PDFInfo
- Publication number
- CN215545615U CN215545615U CN202120956490.8U CN202120956490U CN215545615U CN 215545615 U CN215545615 U CN 215545615U CN 202120956490 U CN202120956490 U CN 202120956490U CN 215545615 U CN215545615 U CN 215545615U
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- box
- filter box
- cooling mechanism
- reflow
- reflow soldering
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- 238000005476 soldering Methods 0.000 title claims abstract description 48
- 238000001816 cooling Methods 0.000 title claims abstract description 33
- 230000007246 mechanism Effects 0.000 title claims abstract description 21
- 238000003466 welding Methods 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 18
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000005192 partition Methods 0.000 claims description 7
- 238000001914 filtration Methods 0.000 claims description 5
- 238000000746 purification Methods 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 7
- 238000005457 optimization Methods 0.000 description 6
- 241000220317 Rosa Species 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010926 purge Methods 0.000 description 4
- 238000005057 refrigeration Methods 0.000 description 4
- 206010053615 Thermal burn Diseases 0.000 description 3
- 208000027418 Wounds and injury Diseases 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 208000014674 injury Diseases 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a reflow soldering furnace with a cooling mechanism for SMT (surface mount technology) chip processing, which comprises a reflow soldering furnace body, wherein a purifying box is fixedly arranged on the upper side of the reflow soldering furnace body, supporting legs are arranged on the lower side of the reflow soldering furnace body, a control panel is arranged on the front side of the purifying box, an air outlet connector is arranged on the upper side of the purifying box, positioning rods are arranged on the left side and the right side of the purifying box, a supporting plate is fixedly arranged on the inner side of the reflow soldering furnace body, a lower fixing block is arranged on the inner side of the supporting plate, an upper fixing block is arranged on the upper side of the lower fixing block, a supporting rod is fixedly arranged on the inner side of the upper fixing block, and a sliding table is movably arranged on the outer side of the supporting rod. The reflow oven with the cooling mechanism for processing the SMT paster solves the problem that some reflow ovens have no cooling mechanism and cannot weld the SMT pasters with different specifications.
Description
Technical Field
The utility model relates to the technical field of SMT paster processing, in particular to a reflow soldering furnace with a cooling mechanism for SMT paster processing.
Background
SMT paster refers to the short name of a series of process flows processed on the basis of a PCB, the PCB is a printed circuit board, SMT is a surface assembly technology (surface mount technology) and is the most popular technology and process in the electronic assembly industry, the paster processing and welding in SMT processing are basically completed through a reflow soldering process, sometimes called reflow soldering, the processing quality of reflow soldering has direct influence on the welding quality of SMT paster processing, and the welding is performed through melting solder printed on a pad of the PCB in advance, so that mechanical and electrical connection between the pin positions or welding ends of paster electronic components and the PCB in SMT paster processing production is completed.
But current reflow soldering stove all is not cooling body, SMT paster high temperature after reflow soldering stove welding, can scald one's hand when taking, cause the staff injury, reflow soldering stove can not adjust the width moreover, only can weld specific SMT paster, can't weld the SMT paster of different specifications, there is certain limitation, need the reflow soldering stove of other different specifications separately to the SMT paster of other specifications, unnecessary economic loss has been caused.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems in the background art, the utility model aims to provide a reflow soldering oven with a cooling mechanism for processing SMT patches, which has the advantages of being adjustable and having the cooling mechanism, and solves the problems that some reflow soldering ovens have no cooling mechanism, can scald hands when being taken, and cannot solder SMT patches with different specifications.
In order to achieve the purpose, the utility model provides the following technical scheme: a reflow soldering furnace with a cooling mechanism for SMT patch processing comprises a reflow soldering furnace body, wherein a purifying box is fixedly mounted on the upper side of the reflow soldering furnace body, supporting legs are arranged on the lower side of the reflow soldering furnace body, a control panel is arranged on the front side of the purifying box, an air outlet connector is arranged on the upper side of the purifying box, positioning rods are arranged on the left side and the right side of the purifying box, a supporting plate is fixedly mounted on the inner side of the reflow soldering furnace body, a lower fixing block is arranged on the inner side of the supporting plate, an upper fixing block is arranged on the upper side of the lower fixing block, a supporting rod is fixedly mounted on the inner side of the upper fixing block, a sliding table is movably mounted on the outer side of the supporting rod, a connecting plate is arranged on the lower side of the supporting rod, a fan is arranged on the upper side of the connecting plate, a heating plate is arranged on the left side of the fan, and a heating pipe is arranged on the inner side of the heating plate, the top of purifying box is provided with the welding dish, the downside of welding dish is provided with the soldered connection, the inboard of purifying box is provided with rose box one.
Preferably, the right side of the welding disc is provided with a refrigerating disc, the inner side of the refrigerating disc is provided with a semiconductor refrigerating sheet, the upper side of the refrigerating disc is provided with a second filtering box, the right side of the second filtering box is provided with a first air suction fan, and the outer side of the first air suction fan is provided with a first air suction pipe.
Preferably, the filter box II and the filter box I have the same specification, filter screens are arranged on the inner sides of the filter box II and the filter box I, a suction fan II is arranged on the left side of the filter box I, a suction pipe II is arranged on the outer side of the suction fan II, two air outlet connectors are arranged, and the air outlet connectors are connected with the filter box II and the filter box I.
Preferably, an electric push rod is fixedly mounted on the inner side of the reflow oven body, and the sliding table is fixedly mounted on the outer side of the electric push rod.
Preferably, the inner sides of the second filter box and the first filter box are provided with air cylinders, the lower sides of the air cylinders are fixedly provided with sliding plates, and the height of each sliding plate is equal to the distance between the upper end of the reflow oven body and the top of the purification box.
Preferably, a partition plate is arranged between the heating plate and the connecting plate, and the partition plate is fixedly installed on the inner side of the reflow oven body.
Preferably, the inner side of the sliding table is provided with a groove, and the width of the groove is equal to 1/2 of the width of the sliding table.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the reflow soldering furnace with the cooling mechanism for processing the SMT paster, the fan is arranged on the inner side of the reflow soldering furnace, the semiconductor refrigerating sheet is arranged at the bottom of the purifying box, the fan and the semiconductor refrigerating sheet form the cooling mechanism, the welded SMT paster can be cooled, the temperature of the SMT paster is prevented from being too high, hands are prevented from being scalded when the SMT paster is taken, and the injury probability of workers is reduced;
2. according to the reflow soldering furnace with the cooling mechanism for processing the SMT paster, the sliding tables can be pushed to move back and forth through the arrangement of the electric push rod, so that the distance between the two sliding tables is adjusted, the SMT pasters with different specifications can be welded, other reflow soldering furnaces with different specifications do not need to be additionally used, and unnecessary economic loss is reduced;
3. this reflow soldering stove is used in SMT paster processing with cooling body, through the setting of rose box one and rose box two, can filter the harmful gas that produces when can producing when welding and the harmful gas that produces when cooling for the gas that discharges away can reach the environmental protection requirement, avoids the harmful gas polluted environment.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic cross-sectional view of the present invention;
FIG. 3 is a side cross-sectional structural schematic view of the present invention;
fig. 4 is an enlarged schematic view of the sliding table of the present invention.
In the figure: 1. a reflow oven body; 2. a purification box; 3. a control panel; 4. a support plate; 5. supporting legs; 6. a lower fixed block; 7. an upper fixed block; 8. a support bar; 9. a sliding table; 10. a connecting plate; 11. a fan; 12. heating the plate; 13. heating a tube; 14. welding a disc; 15. welding a head; 16. a first filter box; 17. a refrigeration tray; 18. a semiconductor refrigeration sheet; 19. a second filter box; 20. a filter screen; 21. a second air suction fan; 22. a second air suction pipe; 23. a first air suction fan; 24. a first air suction pipe; 25. an air outlet connector; 26. positioning a rod; 27. an electric push rod; 28. a groove; 29. a cylinder; 30. a slide plate; 31. a separator.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 4, the reflow soldering oven with a cooling mechanism for SMT patch processing provided by the present invention includes a reflow soldering oven body 1, a purge bin 2 is fixedly installed on an upper side of the reflow soldering oven body 1, support legs 5 are provided on a lower side of the reflow soldering oven body 1, a control panel 3 is provided on a front side of the purge bin 2, an air outlet connector 25 is provided on an upper side of the purge bin 2, positioning rods 26 are provided on left and right sides of the purge bin 2, a support plate 4 is fixedly installed on an inner side of the reflow soldering oven body 1, a lower fixing block 6 is provided on an inner side of the support plate 4, an upper fixing block 7 is provided on an upper side of the lower fixing block 6, a support rod 8 is fixedly installed on an inner side of the upper fixing block 7, a sliding table 9 is movably installed on an outer side of the support rod 8, a connecting plate 10 is provided on a lower side of the connecting plate 10, a fan 11 is provided on a left side of the fan 11, the heating pipe 13 is arranged on the inner side of the heating plate 12, the welding plate 14 is arranged on the top of the purifying box 2, the welding head 15 is arranged on the lower side of the welding plate 14, and the first filtering box 16 is arranged on the inner side of the purifying box 2.
Referring to fig. 2, a cooling plate 17 is arranged on the right side of the welding plate 14, a semiconductor cooling plate 18 is arranged on the inner side of the cooling plate 17, a second filter box 19 is arranged on the upper side of the cooling plate 17, a first suction fan 23 is arranged on the right side of the second filter box 19, and a first suction pipe 24 is arranged on the outer side of the first suction fan 23.
As a technical optimization scheme of the utility model, the temperature of the welding surface of the SMT paster can be rapidly cooled through the arrangement of the semiconductor refrigerating sheet 18, the problem that the SMT paster is inconvenient to take due to overhigh temperature is avoided, and hands are prevented from being scalded during taking.
Referring to fig. 2, the specifications of the second filter box 19 and the first filter box 16 are the same, a filter screen 20 is arranged on the inner sides of the second filter box 19 and the first filter box 16, a second suction fan 21 is arranged on the left side of the first filter box 16, a second suction pipe 22 is arranged on the outer side of the second suction fan 21, two air outlet connectors 25 are arranged, and the air outlet connectors 25 are connected with the second filter box 19 and the first filter box 16.
As a technical optimization scheme of the utility model, by arranging the second filter box 19 and the first filter box 16, harmful gas generated during welding and harmful gas generated during cooling can be filtered, so that the discharged gas can meet the environmental protection requirement, and the environment pollution caused by the harmful gas is avoided.
Referring to fig. 3, an electric push rod 27 is fixedly installed on the inner side of the reflow oven body 1, and the sliding table 9 is fixedly installed on the outer side of the electric push rod 27.
As a technical optimization scheme of the utility model, the electric push rod 27 can push the sliding tables 9 to move back and forth, so that the distance between the two sliding tables 9 can be adjusted, and SMT patches with different specifications can be welded.
Referring to fig. 2, the inner sides of the second filter box 19 and the first filter box 16 are provided with air cylinders 29, the lower sides of the air cylinders 29 are fixedly provided with sliding plates 30, and the height of the sliding plates 30 is equal to the distance between the upper end of the reflow oven body 1 and the top of the purifying box 2.
As a technical optimization scheme of the utility model, the cylinder 29 and the sliding plate 30 are matched for use, the sliding plate 30 can be used for separating the welding end and the refrigerating end of the reflow oven body 1, and air circulation between the welding end and the refrigerating end is avoided, so that the temperature is prevented from being consumed too fast.
Referring to fig. 2, a partition plate 31 is provided between the heating pan 12 and the connecting plate 10, and the partition plate 31 is fixedly installed inside the reflow oven body 1.
As a technical optimization scheme of the present invention, the fan 11 and the heating plate 12 can be separated by the arrangement of the partition plate 31, so that the wind of the fan 11 is prevented from blowing on the heating plate 12.
Referring to fig. 4, the inner side of the sliding table 9 is provided with a groove 28, and the width of the groove 28 is equal to 1/2 of the width of the sliding table 9.
As a technical optimization scheme of the present invention, the SMT patch can be better fixed by the arrangement of the groove 28, so that the SMT patch is prevented from being shifted during the moving process.
The working principle and the using process of the utility model are as follows: when in use, a user firstly connects the reflow soldering oven body 1 with other production equipment of the SMT paster to be placed at the rear end of a chip mounter of a production line, then opens the electric push rod 27 through the control panel 3 to enable the electric push rod 27 to push the sliding table 9 to move back and forth, the SMT paster is just placed at the inner side of the sliding table 9, SMT pasters with different specifications can be soldered by adjusting the distance between the two sliding tables 9, reflow soldering ovens with other different specifications are not needed to be additionally used, unnecessary economic loss is reduced, then the soldering disc 14 and the heating disc 12 are opened, then the fan 11 and the semiconductor refrigerating sheet 18 are opened, the fan 11 and the semiconductor refrigerating sheet 18 form a cooling mechanism, the soldered SMT paster can be cooled, the phenomenon that the temperature of the SMT paster is too high is avoided, hands are prevented from being scalded when the SMT paster is taken, and the injury probability of workers is reduced, then, the first air suction fan 23 and the second air suction fan 21 are opened, so that gas generated in the production process is sucked into the first filter box 16 and the second filter box 19, harmful gas generated in welding and harmful gas generated in cooling can be filtered, discharged gas can meet the environment-friendly requirement, and the environment pollution caused by the harmful gas is avoided.
In summary, the following steps: this reflow soldering stove is used in SMT paster processing with cooling body, through setting up purifying box 2, slip table 9, connecting plate 10, fan 11, heating plate 12, heating pipe 13, soldering dish 14, soldered connection 15, rose box 16, refrigeration dish 17, semiconductor refrigeration piece 18, rose box two 19 and reflow soldering stove body 1's cooperation is used, some reflow soldering stoves have been solved, all do not have cooling body, SMT paster temperature after reflow soldering stove welding is too high, can scald one's hand when taking, cause the staff injured, and reflow soldering stove can not adjust the width, only can weld specific SMT paster, can't weld the SMT paster of different specifications, there is certain limitation, need the reflow soldering stove of other different specifications separately to the SMT paster of other specifications, the problem of unnecessary SMT economic loss has been caused.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a reflow oven is used in processing of SMT paster with cooling body, includes reflow oven body, its characterized in that: the upper side of the reflow soldering furnace body is fixedly provided with a purifying box, the lower side of the reflow soldering furnace body is provided with supporting legs, the front side of the purifying box is provided with a control panel, the upper side of the purifying box is provided with an air outlet connector, the left side and the right side of the purifying box are provided with positioning rods, the inner side of the reflow soldering furnace body is fixedly provided with a supporting plate, the inner side of the supporting plate is provided with a lower fixing block, the upper side of the lower fixing block is provided with an upper fixing block, the inner side of the upper fixing block is fixedly provided with a supporting rod, the outer side of the supporting rod is movably provided with a sliding table, the lower side of the supporting rod is provided with a connecting plate, the upper side of the connecting plate is provided with a fan, the left side of the fan is provided with a heating plate, the inner side of the heating plate is provided with a heating pipe, the top of the purifying box is provided with a soldering pan, and the lower side of the soldering head is provided with a soldering joint, a first filter box is arranged on the inner side of the purification box.
2. A reflow oven with cooling mechanism for SMT chip processing according to claim 1, wherein: the right side of the welding disc is provided with a refrigerating disc, the inner side of the refrigerating disc is provided with a semiconductor refrigerating sheet, the upper side of the refrigerating disc is provided with a second filtering box, the right side of the second filtering box is provided with a first air suction fan, and the outer side of the first air suction fan is provided with a first air suction pipe.
3. A reflow oven with cooling mechanism for SMT chip processing according to claim 2, wherein: the filter box II and the filter box I are the same in specification, filter screens are arranged on the inner sides of the filter box II and the filter box I, a suction fan II is arranged on the left side of the filter box I, a suction pipe II is arranged on the outer side of the suction fan II, two air outlet connectors are arranged, and the air outlet connectors are connected with the filter box II and the filter box I.
4. A reflow oven with cooling mechanism for SMT chip processing according to claim 1, wherein: the inside fixed mounting of reflow oven body has electric putter, slip table fixed mounting is in electric putter's the outside.
5. A reflow oven with cooling mechanism for SMT chip processing according to claim 2, wherein: the inner sides of the second filter box and the first filter box are provided with air cylinders, sliding plates are fixedly mounted on the lower sides of the air cylinders, and the height of each sliding plate is equal to the distance between the upper end of the reflow oven body and the top of the purification box.
6. A reflow oven with cooling mechanism for SMT chip processing according to claim 1, wherein: a partition plate is arranged between the heating plate and the connecting plate, and the partition plate is fixedly installed on the inner side of the reflow oven body.
7. A reflow oven with cooling mechanism for SMT chip processing according to claim 1, wherein: the inner side of the sliding table is provided with a groove, and the width of the groove is equal to 1/2 of the width of the sliding table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120956490.8U CN215545615U (en) | 2021-04-30 | 2021-04-30 | Reflow soldering furnace with cooling mechanism for SMT paster processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120956490.8U CN215545615U (en) | 2021-04-30 | 2021-04-30 | Reflow soldering furnace with cooling mechanism for SMT paster processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215545615U true CN215545615U (en) | 2022-01-18 |
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ID=79859027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120956490.8U Expired - Fee Related CN215545615U (en) | 2021-04-30 | 2021-04-30 | Reflow soldering furnace with cooling mechanism for SMT paster processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215545615U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114425645A (en) * | 2022-04-07 | 2022-05-03 | 深圳市凯泰精密设备有限公司 | Circuit board cooling module for reflow soldering |
| CN116160082A (en) * | 2023-04-21 | 2023-05-26 | 常州文通光电有限公司 | SMT reflow soldering machine for PCB circuit board soldering |
-
2021
- 2021-04-30 CN CN202120956490.8U patent/CN215545615U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114425645A (en) * | 2022-04-07 | 2022-05-03 | 深圳市凯泰精密设备有限公司 | Circuit board cooling module for reflow soldering |
| CN114425645B (en) * | 2022-04-07 | 2022-06-14 | 深圳市凯泰精密设备有限公司 | Circuit board cooling module for reflow soldering |
| CN116160082A (en) * | 2023-04-21 | 2023-05-26 | 常州文通光电有限公司 | SMT reflow soldering machine for PCB circuit board soldering |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220118 |
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| CF01 | Termination of patent right due to non-payment of annual fee |