CN219644241U - Uniform tin spraying device for PCB production - Google Patents
Uniform tin spraying device for PCB production Download PDFInfo
- Publication number
- CN219644241U CN219644241U CN202320542075.7U CN202320542075U CN219644241U CN 219644241 U CN219644241 U CN 219644241U CN 202320542075 U CN202320542075 U CN 202320542075U CN 219644241 U CN219644241 U CN 219644241U
- Authority
- CN
- China
- Prior art keywords
- pcb
- telescopic
- spraying device
- tin
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 92
- 238000005507 spraying Methods 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000010438 heat treatment Methods 0.000 claims abstract description 19
- 239000012535 impurity Substances 0.000 claims description 13
- 238000009434 installation Methods 0.000 claims description 3
- ZGHQUYZPMWMLBM-UHFFFAOYSA-N 1,2-dichloro-4-phenylbenzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 ZGHQUYZPMWMLBM-UHFFFAOYSA-N 0.000 description 14
- 238000005476 soldering Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Molten Solder (AREA)
Abstract
The utility model relates to a uniform tin spraying device for PCB circuit board production, which belongs to the technical field of circuit board production, and comprises an operation table, a telescopic assembly, a clamping plate, a heating plate and a tin pool, wherein a support frame is arranged on the operation table, the telescopic assembly comprises a telescopic end and a fixed end, the fixed end of the telescopic assembly is arranged on the support frame, the telescopic end of the telescopic assembly extends towards the operation table, the clamping plate is arranged at the telescopic end of the telescopic assembly, the clamping plate is used for clamping a PCB board, the heating plate is arranged on the operation table, the heating plate is used for preheating the PCB board, the tin pool is arranged on the operation table, and the tin pool is positioned below the support frame. Therefore, the uniform tin spraying device for producing the PCB board preheats the PCB board before the PCB board enters the tin bath, and reduces the risk of damage to the PCB board due to larger temperature difference before and after entering the tin bath.
Description
Technical Field
The utility model belongs to the technical field of circuit board production, and particularly relates to a uniform tin spraying device for PCB circuit board production.
Background
The PCB board tin spraying refers to the process that the PCB board is immersed in a molten tin soldering pool so as to enable the copper surface exposed on the surface of the PCB board to be adhered with tin, and then redundant tin on the PCB board is removed through a hot air cutter.
Disclosure of Invention
The utility model provides a uniform tin spraying device for producing a PCB (printed Circuit Board), which is used for solving the technical problem that the temperature difference of the PCB before and after entering a soldering tin pool is large.
The utility model is realized by the following technical scheme: a uniform tin spraying device for PCB circuit board production comprises: the operation panel, flexible subassembly, splint, hot plate and tin pond, install the support frame on the operation panel, flexible subassembly includes flexible end and stiff end, flexible subassembly's stiff end is installed on the support frame, flexible end of flexible subassembly to the operation panel extends, and the splint is installed flexible end of flexible subassembly, splint are used for centre gripping PCB board, and the hot plate is installed on the operation panel, the hot plate is used for preheating the PCB board, the tin pond is installed on the operation panel, the tin pond is located the below of support frame.
Optionally, in order to better implement the present utility model, the telescopic assembly includes a mounting block, a telescopic rod and a mounting plate, the mounting block is mounted on the support frame, the telescopic rod includes a fixed end and a telescopic end, the fixed end of the telescopic rod is mounted on the mounting block, the telescopic end of the telescopic rod extends towards the console, the mounting plate is mounted on the telescopic end of the telescopic rod, and the clamping plate is mounted on the mounting plate.
Optionally, to better implement the present utility model, the support frame includes a slide bar above the heating plate and the tin bath, and the mounting block is slidably mounted on the slide bar.
Optionally, in order to better implement the present utility model, the device further includes a linear motor, the linear motor is mounted on the mounting block, and a power output end of the linear motor is slidably abutted on the sliding rod.
Optionally, to better implement the present utility model, an extension plate is further included, and the extension plate is installed between the clamping plate and the mounting plate.
Optionally, in order to better implement the utility model, the PCB further comprises two air knives, wherein the two air knives are respectively installed on the installation plate, the two air knives are respectively positioned at two sides of the extension plate, and the air knives are used for removing impurities on the surface of the PCB.
Optionally, in order to better implement the present utility model, the device further comprises a collecting tank, wherein the collecting tank is mounted on the operation table, the collecting tank is located below the clamping plate, and the collecting tank is used for collecting impurities falling on the PCB.
Alternatively, in order to better implement the utility model, the number of heating plates is two, two being located on either side of the collecting tank.
Optionally, to better implement the utility model, a baffle is mounted on the operating table, the baffle being located between the collecting tank and the tin bath.
Compared with the prior art, the utility model has the following beneficial effects:
the utility model provides a uniform tin spraying device for producing a PCB (printed Circuit Board), which comprises an operation table, a telescopic assembly, a clamping plate, a heating plate and a tin pool, wherein a support frame is arranged on the operation table, the telescopic assembly comprises a telescopic end and a fixed end, the fixed end of the telescopic assembly is arranged on the support frame, the telescopic end of the telescopic assembly extends towards the operation table, the clamping plate is arranged at the telescopic end of the telescopic assembly, the clamping plate is used for clamping the PCB, the heating plate is arranged on the operation table, the heating plate is used for preheating the PCB, the tin pool is arranged on the operation table, and the tin pool is positioned below the support frame. Like this, the support frame is located the top of operation panel, and splint pass through telescopic assembly and install on the support frame, and the tin pond is located the operation panel, and splint are located the top in tin pond, and the hot plate is located the operation panel.
Through the structure, the uniform tin spraying device for producing the PCB provided by the utility model solves the technical problem that the temperature difference of the PCB before and after entering the soldering tin pool is large. Specifically, the PCB board centre gripping is on splint, and the height of flexible subassembly adjustment PCB board is in order to immerse the PCB board in the tin pond or take out from the tin pond, before the PCB board is immersed in the tin pond, is first put in the hot plate department with the PCB board and is heated up and preheat, in order to reduce the difference in temperature of PCB board before getting into the tin pond back and forth, thereby reduce the PCB board and because get into the great risk of deformation even damage of difference in temperature before and after the tin pond. Therefore, the uniform tin spraying device for producing the PCB board preheats the PCB board before the PCB board enters the tin bath, and reduces the risk of damage to the PCB board due to larger temperature difference before and after entering the tin bath.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a uniform tin spraying device for PCB production according to an embodiment of the present utility model;
fig. 2 is a schematic structural view of a telescopic assembly according to an embodiment of the present utility model.
In the figure: 1-an operation table; 2-telescoping assembly; 21-mounting blocks; 22-telescopic rod; 23-mounting plates; 3-clamping plates; 4-heating plate; 5-tin bath; 6-supporting frames; 7-a linear motor; 8-extension plates; 9-an air knife; 10-a collecting tank; 11-a baffle; 12-PCB board.
Detailed Description
In order to make the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the present utility model will be described in detail below. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, based on the examples herein, which are within the scope of the utility model as defined by the claims, will be within the scope of the utility model as defined by the claims.
Examples
The embodiment provides a PCB circuit board production is with even tin spraying device for solve the PCB board and get into the great technical problem of soldering tin pond back and forth difference in temperature. This PCB circuit board production is with even tin spraying device includes operation panel 1, flexible subassembly 2, splint 3, hot plate 4 and tin pond 5, wherein:
install support frame 6 on the operation panel 1, telescopic subassembly 2 includes flexible end and stiff end, telescopic subassembly 2's stiff end is installed on support frame 6, telescopic subassembly 2's flexible end extends to operation panel 1, splint 3 are installed at telescopic subassembly 2's flexible end, splint 3 are used for centre gripping PCB board 12, hot plate 4 is installed on operation panel 1, hot plate 4 is used for preheating PCB board 12, tin pool 5 is installed on operation panel 1, tin pool 5 is located the below of support frame 6, wherein, hot plate 4 is close to PCB board 12 and sets up, the temperature of hot plate 4 is less than the temperature in the tin pool 5 all the time, when PCB board 12 is close to hot plate 4 and sets up, the temperature of hot plate 4 rises gradually, preheat PCB board 12 slowly.
Through the structure, the uniform tin spraying device for producing the PCB circuit board provided by the embodiment solves the technical problem that the temperature difference of the PCB 12 before and after entering the soldering tin pool 5 is large. Specifically, the PCB 12 is clamped on the clamping plate 3, the telescopic assembly 2 adjusts the height of the PCB 12 so as to immerse the PCB 12 in the tin bath 5 or take out the PCB from the tin bath 5, and before the PCB 12 is immersed in the tin bath 5, the PCB 12 is placed at the heating plate 4 for heating and preheating, so that the temperature difference of the PCB 12 before and after entering the tin bath 5 is reduced, and the risk of deformation or even damage of the PCB 12 due to larger temperature difference before and after entering the tin bath 5 is reduced. Therefore, the uniform tin spraying device for producing the PCB circuit board preheats the PCB board 12 before the PCB board 12 enters the tin bath 5, and reduces the risk of damage to the PCB board 12 due to large temperature difference before and after entering the tin bath 5.
An alternative implementation of this embodiment is as follows: the telescopic assembly 2 comprises a mounting block 21, a telescopic rod 22 and a mounting plate 23, wherein the mounting block 21 is mounted on the support frame 6, the telescopic rod 22 comprises a fixed end and a telescopic end, the fixed end of the telescopic rod 22 is mounted on the mounting block 21, the telescopic end of the telescopic rod 22 extends towards the operating platform 1, the mounting plate 23 is mounted on the telescopic end of the telescopic rod 22, the clamping plate 3 is mounted on the mounting plate 23, the telescopic rod 22 is an electric telescopic rod, and the height of the PCB 12 is adjusted through the telescopic rod 22 so that the PCB 12 enters the tin bath 5 to realize tin spraying.
An alternative implementation of this embodiment is as follows: the support frame 6 includes the slide bar, and the slide bar is located the top of hot plate 4 and tin bath 5, and installation piece 21 slidable mounting is on the slide bar, and specifically, hot plate 4 is located one side of tin bath 5, and PCB board 12 is equipped with the hot plate 4 on operation panel 1 in advance and carries out PCB board 12 preheating, and then PCB board 12 slides to the top of tin bath 5, is gone into tin bath 5 by telescopic link 22 control PCB board 12 and is spouted tin.
An alternative implementation of this embodiment is as follows: the uniform tin spraying device for the production of the PCB circuit board further comprises a linear motor 7, wherein the linear motor 7 is arranged on the mounting block 21, and the power output end of the linear motor 7 is in sliding butt joint on the sliding rod, so that the linear motor 7 controls the movement of the mounting block 21, and the preheating and tin spraying of the PCB 12 are more convenient.
An alternative implementation of this embodiment is as follows: the uniform tin spraying device for producing the PCB circuit board further comprises the extension plate 8, wherein the extension plate 8 is arranged between the clamping plate 3 and the mounting plate 23, so that when the PCB 12 enters the tin bath 5, the extension plate 8 ensures that the mounting plate 23 and the telescopic rod 22 are positioned above the tin bath 5, and the risk that the mounting plate 23 and the telescopic rod 22 enter the tin bath 5 to pollute the tin bath 5 is reduced.
An alternative implementation of this embodiment is as follows: this PCB circuit board production is with even tin spraying device still includes two air knives 9, and two air knives 9 are installed respectively on mounting panel 23, and two air knives 9 are located the both sides of extension board 8 respectively, and air knife 9 is used for getting rid of the impurity on PCB board 12 surface, like this, the impurity on PCB board 12 surface is got rid of to air knife 9, avoids impurity entering tin spraying in the tin pond 5 to influence the roughness of tin spraying, reduce the influence of impurity to the tin spraying.
An alternative implementation of this embodiment is as follows: this PCB circuit board production is with even tin spraying device still includes collecting vat 10, and collecting vat 10 installs on operation panel 1, and collecting vat 10 is located the below of splint 3, and collecting vat 10 is used for collecting the impurity that drops on the PCB board 12, like this, in the collecting vat 10 was collected to the impurity, reduced dust and impurity pollution, and the structure is more reasonable.
Optionally, the uniform tin spraying device for producing the PCB circuit board further comprises a baffle 11, the baffle 11 is installed on the operating platform 1, the baffle 11 is located between the collecting tank 10 and the tin pool 5, the baffle 11 is used for shielding impurities at the collecting tank 10 from entering the tin pool 5, and the influence of the impurities on the tin pool 5 is reduced.
An alternative implementation of this embodiment is as follows: the number of the heating plates 4 is two, and the two heating plates 4 are positioned on two sides of the collecting tank 10, so that the heating of the PCB 12 is more uniform and efficient, and the risk of deformation of the PCB 12 due to uneven heating is reduced.
The above description is merely an embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present utility model, and it is intended to cover the scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.
Claims (9)
1. Uniform tin spraying device for PCB circuit board production is characterized by comprising:
the operation table is provided with a support frame;
the telescopic assembly comprises a telescopic end and a fixed end, the fixed end of the telescopic assembly is arranged on the support frame, and the telescopic end of the telescopic assembly extends towards the operation table;
the clamping plate is arranged at the telescopic end of the telescopic assembly and is used for clamping the PCB;
the heating plate is arranged on the operating platform and is used for preheating the PCB;
and the tin pool is arranged on the operating platform and is positioned below the supporting frame.
2. The uniform tin spraying device for producing a PCB circuit board according to claim 1, wherein the telescopic assembly comprises:
the mounting block is mounted on the support frame;
the telescopic rod comprises a fixed end and a telescopic end, the fixed end of the telescopic rod is arranged on the mounting block, and the telescopic end of the telescopic rod extends to the operating platform;
the mounting plate is mounted at the telescopic end of the telescopic rod, and the clamping plate is mounted on the mounting plate.
3. The uniform tin spraying device for producing the PCB circuit board according to claim 2, wherein the supporting frame comprises a sliding rod, the sliding rod is positioned above the heating plate and the tin bath, and the mounting block is slidably mounted on the sliding rod.
4. The uniform tin spraying device for producing a PCB (printed Circuit Board) according to claim 3, further comprising:
the linear motor is installed on the installation block, and the power output end of the linear motor is in sliding butt on the sliding rod.
5. The uniform tin spraying device for producing a PCB (printed Circuit Board) according to claim 4, further comprising:
and the extension plate is arranged between the clamping plate and the mounting plate.
6. The uniform tin spraying device for producing a PCB (printed Circuit Board) according to claim 5, further comprising:
the two air knives are respectively arranged on the mounting plate, the two air knives are respectively positioned on two sides of the extension plate, and the air knives are used for removing impurities on the surface of the PCB.
7. The uniform tin spraying device for producing a PCB (printed Circuit Board) according to claim 6, further comprising:
and the collecting tank is arranged on the operating platform and positioned below the clamping plate, and is used for collecting impurities falling on the PCB.
8. The uniform tin spraying device for producing the PCB circuit board according to claim 7, wherein the number of the heating plates is two, and the two heating plates are positioned on two sides of the collecting tank.
9. The uniform tin spraying device for producing a PCB (printed circuit board) according to claim 8, further comprising:
and the baffle is arranged on the operating platform and is positioned between the collecting tank and the tin pool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320542075.7U CN219644241U (en) | 2023-03-20 | 2023-03-20 | Uniform tin spraying device for PCB production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320542075.7U CN219644241U (en) | 2023-03-20 | 2023-03-20 | Uniform tin spraying device for PCB production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219644241U true CN219644241U (en) | 2023-09-05 |
Family
ID=87820507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320542075.7U Active CN219644241U (en) | 2023-03-20 | 2023-03-20 | Uniform tin spraying device for PCB production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219644241U (en) |
-
2023
- 2023-03-20 CN CN202320542075.7U patent/CN219644241U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |