CN213003173U - Double-track nitrogen gas stove that PCB circuit board reflow soldering used - Google Patents
Double-track nitrogen gas stove that PCB circuit board reflow soldering used Download PDFInfo
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- CN213003173U CN213003173U CN202021327183.5U CN202021327183U CN213003173U CN 213003173 U CN213003173 U CN 213003173U CN 202021327183 U CN202021327183 U CN 202021327183U CN 213003173 U CN213003173 U CN 213003173U
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Abstract
The utility model discloses a double track nitrogen furnace that PCB circuit board reflow soldering used, including frame, double track conveyor, furnace body, vacuum pump, heater strip, cooling device and nitrogen gas conveyor, the furnace body sets up in the top of frame, and the both ends of furnace body are equipped with the transport entry and carry the export, are equipped with nitrogen gas conveyor and vacuum pump on the furnace body, nitrogen gas conveyor and vacuum pump all communicate with the furnace body inside through the pipeline; the double-track conveying device penetrates through the furnace body, the heating wires are evenly distributed on two sides of the row cavity of the furnace body, the motor is arranged at the top outside the furnace body, the wind impeller is arranged below the row cavity in the furnace body, the driving shaft of the wind impeller penetrates through the row cavity to be connected with the motor, and the cooling device is arranged on the inner wall of the furnace body and is close to the conveying outlet. The fan impeller drives the air flow to move, the heat conduction of the air flow is sufficient and uniform, the heating efficiency and uniformity are greatly improved, the temperature of the air flow sprayed on the PCB is uniform, the influence of temperature difference on welding points of the PCB is improved, and the quality of the PCB is improved.
Description
Technical Field
The utility model relates to a circuit board paster technical field specifically is a double track nitrogen gas stove that PCB circuit board reflow soldering used.
Background
In the production process of the printed circuit board, all the chip components are assembled by adopting a surface mounting technology, the chip components are generally mounted by adopting reflow soldering, firstly, a printing machine is used for scraping soldering paste on a bonding pad on the printed circuit board, then, a chip mounter is used for pressing the chip components to the corresponding soldering positions of the cable board to be attached with the soldering paste, and finally, the printed circuit board attached with the components is sent into a reflow soldering furnace for soldering; the existing reflow soldering equipment generally sends a piece of PCB circuit board into a reflow soldering furnace, in a high-temperature area in the furnace body, soldering paste is melted into liquid state, a patch element is combined with the soldering paste, after the soldering paste enters a cooling area, the soldering paste is solidified into solid state, pins of the patch element and the printed circuit board are firmly welded into a whole, air or nitrogen is used as protective raw materials, and the welding quality of the circuit board is improved; however, the air flow distribution in the existing reflow oven is not uniform, which causes unstable welding quality of welding points on the circuit board, affects the surface mounting quality of the circuit board, and reduces the qualification rate of product processing.
SUMMERY OF THE UTILITY MODEL
Utility model purpose: problem and not enough to the existence among the above-mentioned prior art, the utility model aims at providing a double track nitrogen gas stove that PCB circuit board reflow soldering used.
The technical scheme is as follows: in order to achieve the purpose, the utility model discloses a double track nitrogen furnace that PCB circuit board reflow soldering used, including frame, double track conveyor, furnace body, vacuum pump, heater strip, cooling device and nitrogen gas conveyor, the furnace body sets up above the frame, the both ends of furnace body are equipped with the transport entry and carry the export, be equipped with nitrogen gas conveyor and vacuum pump on the furnace body, nitrogen gas conveyor and vacuum pump all communicate with the furnace body inside through the pipeline; the double-track conveying device penetrates through the furnace body, the heating wires are evenly distributed on two sides of the row cavity of the furnace body, the motor is arranged at the top outside the furnace body, the wind impeller is arranged below the row cavity in the furnace body, the driving shaft of the wind impeller penetrates through the row cavity to be connected with the motor, and the cooling device is arranged on the inner wall of the furnace body and is close to the conveying outlet. The fan impeller drives the air flow to move, the heat conduction of the air flow is sufficient and uniform, the heating efficiency and uniformity are greatly improved, the temperature of the air flow sprayed on the PCB is uniform, the influence of the temperature difference on the welding points of the PCB is improved, and the quality of the PCB is improved.
Further, the nitrogen gas conveying device comprises a nitrogen gas storage tank, a conveying pipeline and a flow control switch.
Furthermore, protective curtains are arranged at the conveying inlet and the conveying outlet.
Furthermore, a fire-resistant insulating layer is annularly built in the furnace body.
Furthermore, a transparent observation window is arranged on the furnace body.
Further, double track conveyor includes conveying frame, motor, drive roll, bearing roller, driven voller, holds in the palm net and circuit board limit baffle and two sets of gear components, drive roll, bearing roller and driven voller are all installed in conveying frame, and the motor is installed in conveying frame's the outside, and the output shaft of motor is connected with the drive roll, and the gear component is installed on drive roll and driven voller, holds in the palm the outside of net cover at the gear component, the top that lies in on the conveying frame and holds in the palm the net sets up circuit board limit baffle. The double-track conveying device can simultaneously carry out reflow soldering treatment on the two groups of PCB circuit boards, and the reflow soldering treatment efficiency of the PCB circuit boards is improved.
Furthermore, the gear assembly comprises a first driving gear, a first driven gear, a second driving gear, a second driven gear and a chain, wherein the first driving gear and the second driving gear are both arranged on the driving roller, the first driven gear and the second driven gear are both arranged on the driven roller, and the first driving gear and the first driven gear, the second driving gear and the second driven gear are both driven through the chain.
Furthermore, a lubricating oil pipe is arranged at an upper inlet of the furnace body. The lubricating oil pipe is used for lubricating the chain, prevents the cardboard, guarantees that the circuit board steadily transports to the furnace body in and carries out the solder joint welding.
Above-mentioned technical scheme can see out, the beneficial effects of the utility model are that:
a double track nitrogen gas stove that PCB circuit board reflow soldering used, do evacuation processing through the vacuum pump with the internal air of furnace, then pour into nitrogen gas into, blow to the circuit board of having pasted the component after the heating wire heats the nitrogen gas in the furnace to enough high temperature, make the solder of component both sides melt back and mainboard bond, the impeller of the wind drives the air current motion, the air current heat-conduction is abundant even, the efficiency and the homogeneity of heating are provided greatly, make the air current temperature of spouting on the PCB circuit board even, the solder joint surface can be more smooth, the form is more good than air reflow soldering, the quality of PCB board has been improved, the welding quality is promoted greatly.
Drawings
Fig. 1 is a schematic external structural view of the present invention;
FIG. 2 is a schematic view of the internal structure of the present invention;
FIG. 3 is a left side view of FIG. 2;
FIG. 4 is a top view of the dual track conveyor and circuit board drop guide;
fig. 5 is a schematic view showing the detailed structure of the double-track conveying device and the circuit board falling guide device.
Detailed Description
The invention will be further elucidated with reference to the drawings and the specific embodiments.
As shown in fig. 1-5, the double-track nitrogen furnace for reflow soldering of the PCB circuit board comprises a rack 1, a double-track conveying device 2, a furnace body 3, a vacuum pump 4, a heating wire 5, a cooling device 6 and a nitrogen conveying device 7, wherein the furnace body 3 is arranged above the rack 1, a conveying inlet 31 and a conveying outlet 32 are arranged at two ends of the furnace body 3, the furnace body 3 is provided with the nitrogen conveying device 7 and the vacuum pump 4, and both the nitrogen conveying device 7 and the vacuum pump 4 are communicated with the inside of the furnace body 3 through pipelines; the double-track conveying device 2 is arranged in the furnace body 3 in a penetrating mode, the heating wires 5 are uniformly distributed on two sides of a row cavity 33 of the furnace body 3, a motor 8 is arranged on the outer top of the furnace body 3, a wind impeller 9 is arranged below the row cavity 33 in the furnace body 3, and a driving shaft of the wind impeller 9 penetrates through the row cavity 33 and is connected with the motor 8; the cooling device 6 is arranged on the inner wall of the furnace body 3 and close to the conveying outlet 32; the circuit board falling guide device 10 is arranged outside the furnace body 3 at the conveying outlet 32.
The nitrogen gas supply device 7 in this embodiment includes a nitrogen gas storage tank 71, a supply pipe 72, and a flow control switch 73.
In this embodiment, protective curtains are disposed at the conveying inlet 31 and the conveying outlet 32.
In this embodiment, the furnace body 3 is internally provided with a fire-resistant insulating layer in a surrounding manner.
In this embodiment, the furnace body 3 is provided with a transparent observation window 11.
In this embodiment, the double-track conveying device 2 includes a conveying frame 21, a motor 22, a driving roller 23, a carrier roller 24, a driven roller 25, a supporting net 26, a circuit board limiting baffle 27 and two sets of gear assemblies 28, wherein the driving roller 23, the carrier roller 24 and the driven roller 25 are all installed in the conveying frame 21, the motor 22 is installed on the outer side of the conveying frame 21, an output shaft of the motor 22 is connected with the driving roller 23, the gear assemblies 28 are installed on the driving roller 23 and the driven roller 25, the supporting net 26 is sleeved on the outer side of the gear assemblies 28, and the circuit board limiting baffle 27 is arranged on the conveying frame 21 above the supporting net 26.
In this embodiment, the gear assembly 28 includes a first driving gear 281, a first driven gear 283, a second driving gear 282, a second driven gear 284 and a chain 285, wherein the first driving gear 281 and the second driving gear 282 are both disposed on the driving roller 23, the first driven gear 283 and the second driven gear 284 are both disposed on the driven roller 25, the first driving gear 281 and the first driven gear 283, and the second driving gear 282 and the second driven gear 284 are both driven by the chain 285.
In this embodiment, a lubricating oil pipe 13 is arranged at the upper inlet of the furnace body 3.
The circuit board falling guide device 10 in the embodiment comprises a first rotating arm 101, a second rotating arm 102 and a guide plate 103; the first rotating arm 101 and the second rotating arm 102 are both arranged on the conveying frame 21, the guide plates 103 are respectively arranged on the first rotating arm 101 and the second rotating arm 102, and a support rod 104 is arranged between the two guide plates 103; the stay 104 is provided with a slide tube 105.
The examples are given solely for the purpose of illustration and are not intended to limit the scope of the invention, which is to be determined by those skilled in the art after reading the present disclosure, and all such equivalents are intended to fall within the scope of the invention as defined in the claims appended hereto.
Claims (9)
1. The utility model provides a double track nitrogen gas stove that PCB circuit board reflow soldering used which characterized in that: the furnace comprises a rack (1), a double-track conveying device (2), a furnace body (3), a vacuum pump (4), a heating wire (5), a cooling device (6) and a nitrogen conveying device (7), wherein the furnace body (3) is arranged above the rack (1), a conveying inlet (31) and a conveying outlet (32) are arranged at two ends of the furnace body (3), the nitrogen conveying device (7) and the vacuum pump (4) are arranged on the furnace body (3), and the nitrogen conveying device (7) and the vacuum pump (4) are communicated with the interior of the furnace body (3) through pipelines; the double-track conveying device (2) is arranged in the furnace body (3) in a penetrating mode, the heating wires (5) are uniformly distributed on two sides of a row cavity (33) of the furnace body (3), a motor (8) is arranged on the outer top of the furnace body (3), a wind impeller (9) is arranged below the row cavity (33) in the furnace body (3), and a driving shaft of the wind impeller (9) penetrates through the row cavity (33) to be connected with the motor (8); the cooling device (6) is arranged on the inner wall close to the furnace body (3) and close to the conveying outlet (32); the furnace body (3) is externally positioned at the conveying outlet (32) and is provided with a circuit board falling guide device (10).
2. The double-track nitrogen furnace for reflow soldering of the PCB circuit board as claimed in claim 1, wherein: the nitrogen conveying device (7) comprises a nitrogen storage tank (71), a conveying pipeline (72) and a flow control switch (73).
3. The double-track nitrogen furnace for reflow soldering of the PCB circuit board as claimed in claim 1, wherein: protective curtains are arranged at the conveying inlet (31) and the conveying outlet (32).
4. The double-track nitrogen furnace for reflow soldering of the PCB circuit board as claimed in claim 1, wherein: and the furnace body (3) is internally provided with a fire-resistant heat-insulating layer in an annular manner.
5. The double-track nitrogen furnace for reflow soldering of the PCB circuit board as claimed in claim 1, wherein: and a transparent observation window (11) is arranged on the furnace body (3).
6. The double-track nitrogen furnace for reflow soldering of the PCB circuit board as claimed in claim 1, wherein: double track conveyor (2) are including conveying frame (21), motor (22), drive roll (23), bearing roller (24), driven voller (25), hold in the palm net (26), circuit board limit baffle (27) and two sets of gear assembly (28), drive roll (23), bearing roller (24) and driven voller (25) are all installed in conveying frame (21), and the outside at conveying frame (21) is installed in motor (22), and the output shaft and the drive roll (23) of motor (22) are connected, and install on drive roll (23) and driven voller (25) gear assembly (28), hold in the palm the outside that net (26) were established at gear assembly (28), the top that lies in on conveying frame (21) and ask net (26) sets up circuit board limit baffle (27).
7. The double-track nitrogen furnace for reflow soldering of the PCB circuit board as claimed in claim 6, wherein: the gear assembly (28) comprises a first driving gear (281), a first driven gear (283), a second driving gear (282), a second driven gear (284) and a chain (285), wherein the first driving gear (281) and the second driving gear (282) are arranged on the driving roller (23), the first driven gear (283) and the second driven gear (284) are arranged on the driven roller (25), the first driving gear (281) and the first driven gear (283), and the second driving gear (282) and the second driven gear (284) are driven through the chain (285).
8. The double-track nitrogen furnace for reflow soldering of the PCB circuit board as claimed in claim 1, wherein: and a lubricating oil pipe (13) is arranged at an upper inlet of the furnace body (3).
9. The double-track nitrogen furnace for reflow soldering of the PCB circuit board as claimed in claim 1, wherein: the circuit board falling guide device (10) comprises a rotating arm I (101), a rotating arm II (102) and a guide plate (103); the first rotating arm (101) and the second rotating arm (102) are both arranged on the conveying frame (21), the guide plates (103) are respectively arranged on the first rotating arm (101) and the second rotating arm (102), and a support rod (104) is arranged between the two guide plates (103); a slide pipe (105) is arranged on the support rod (104).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021327183.5U CN213003173U (en) | 2020-07-08 | 2020-07-08 | Double-track nitrogen gas stove that PCB circuit board reflow soldering used |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021327183.5U CN213003173U (en) | 2020-07-08 | 2020-07-08 | Double-track nitrogen gas stove that PCB circuit board reflow soldering used |
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| Publication Number | Publication Date |
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| CN213003173U true CN213003173U (en) | 2021-04-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021327183.5U Active CN213003173U (en) | 2020-07-08 | 2020-07-08 | Double-track nitrogen gas stove that PCB circuit board reflow soldering used |
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| CN (1) | CN213003173U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113681104A (en) * | 2021-08-31 | 2021-11-23 | 无锡鑫迈维电子设备有限公司 | Nitrogen vacuum auxiliary reflow furnace |
-
2020
- 2020-07-08 CN CN202021327183.5U patent/CN213003173U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113681104A (en) * | 2021-08-31 | 2021-11-23 | 无锡鑫迈维电子设备有限公司 | Nitrogen vacuum auxiliary reflow furnace |
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