CN211915759U

CN211915759U - Novel reflow soldering equipment

Info

Publication number: CN211915759U
Application number: CN201922477836.1U
Authority: CN
Inventors: 孙黎明; 梁正永; 朱大恒; 黄飞; 王阳; 何伟
Original assignee: Shanghai Austor Technology Co ltd
Current assignee: Shanghai Austor Technology Co ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-11-13
Anticipated expiration: 2029-12-31

Abstract

The utility model relates to a novel welding technique field just discloses a novel reflow soldering equipment, which comprises a frame, the bottom fixedly connected with support column of frame, the left side fixed mounting at frame top has first motor, the inside swing joint of frame has conveyor, the top fixedly connected with preheating chamber of frame, the top fixedly connected with reflow soldering room of frame, the top fixedly connected with cooling chamber of frame. This novel reflow soldering equipment, through on placing the conveyer belt with the component, drive the conveyer belt motion through first motor, make the component advance go into the preheating chamber, when reentrant reflow soldering room, the component perk that can avoid the rapid heating to cause stands to through the heating pipe heating, make the inside air of reflow soldering room intensifies, rethread second motor drives the fan and rotates, make high-temperature gas at reflow soldering room circulation flow, make the component heat evenly, avoided central temperature height, the effect that marginal temperature is low.

Description

Novel reflow soldering equipment

Technical Field

The utility model relates to a novel welding technology field specifically is a novel reflow soldering equipment.

Background

Due to the continuous miniaturization requirement of electronic product PCB boards, sheet elements appear, the traditional welding method can not adapt to the requirement, along with the gradual improvement of the whole SMT technology, the appearance of various patch elements and surface mounted devices, reflow soldering technology and equipment which are part of the surface mounted technology are correspondingly developed, the application of the reflow soldering technology and the equipment is gradually wide, the reflow soldering technology and the equipment are almost applied to all electronic product fields, the process has the advantages that the temperature is easy to control, the oxidation can be avoided in the welding process, and the manufacturing cost is easy to control.

The heating of the elements is not uniform due to the influence of the edges of the conveyor belt or the heater, the conveyor belt in the reflow furnace can be used as a heat dissipation system when the conveyed products are subjected to reflow soldering, and the edges of the heating part have different heat dissipation conditions from the center and have common temperature deviation, so that the elements are heated unevenly.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a to prior art not enough, the utility model provides a novel reflow soldering equipment possesses the heating evenly, can in time observe advantages such as the inside condition, has solved reflow soldering technology and has heated inhomogeneous problem to the component.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: a novel reflow soldering device comprises a rack, wherein a support column is fixedly connected to the bottom of the rack, a first motor is fixedly mounted on the left side of the top of the rack, a conveying device is movably connected inside the rack, a preheating chamber is fixedly connected to the top of the rack, a reflow soldering chamber is fixedly connected to the top of the rack, a cooling chamber is fixedly connected to the top of the rack, an exhaust fan is fixedly mounted on the right side of the top of the rack, a heat insulation layer is fixedly connected between the cooling chamber and the reflow soldering chamber, a heating pipe is fixedly connected to the inner side wall of the reflow soldering chamber, a fixing plate is fixedly connected to the inner side wall of the reflow soldering chamber and positioned above the heating pipe, a fan is movably connected to the bottom of the fixing plate, a second motor is fixedly mounted at the top of the fixing plate, the second motor is rotatably connected with the fan, and, the cooling device comprises a cooling chamber, and is characterized in that a water pump is fixedly connected to the inner bottom wall of the cooling chamber, a water tank is fixedly connected to the inner bottom wall of the cooling chamber, the water tank is located on the left side of the water pump, a heat exchanger is fixedly connected to the inner side wall of the cooling chamber, the heat exchanger is located above a cooler, and an exhaust hole is formed in the top of the right side of the cooling chamber.

Preferably, conveyor includes the conveyer belt, the left side swing joint of conveyer belt has the action wheel, the right side swing joint of conveyer belt has from the driving wheel, the middle swing joint of conveyer belt has the auxiliary wheel, the output shaft and the action wheel fixed connection of first motor, the action wheel passes through the conveyer belt transmission with following the driving wheel and is connected, the quantity of auxiliary wheel is a plurality ofly, and the auxiliary wheel all sets up to smooth surface.

Preferably, the preheating chamber is located on the right side of the first motor, the reflow soldering chamber is located on the right side of the preheating chamber, the cooling chamber is located on the right side of the reflow soldering chamber, and the cooling chamber is located on the left side of the exhaust fan.

Preferably, the front of reflow soldering room and cooling chamber all is equipped with the room door, two the front of room door is equipped with the transparent window, two the front fixedly connected with handle of room door, the handle is located the below of transparent window.

Preferably, the fan is rotatably connected with an output shaft of the second motor through a rotating shaft, and the rotating shaft is movably connected with the inside of the fixing plate.

Preferably, the cooler is communicated with the water pump through a water pipe, the water pump is communicated with the water tank through a water pipe, the water tank is communicated with the heat exchanger through a water pipe, and the heat exchanger is communicated with the cooler through a water pipe.

Preferably, the exhaust fan is communicated with the exhaust hole through an exhaust pipeline.

Compared with the prior art, the utility model provides a novel reflow soldering equipment possesses following beneficial effect:

1. this novel reflow soldering equipment, through on placing the conveyer belt with the component, drive the conveyer belt motion through first motor, make the component advance go into the preheating chamber, when reentrant reflow soldering room, the component perk that can avoid the rapid heating to cause stands to through the heating pipe heating, make the inside air of reflow soldering room intensifies, rethread second motor drives the fan and rotates, make high-temperature gas at reflow soldering room circulation flow, make the component heat evenly, avoided central temperature height, the effect that marginal temperature is low.

2. This novel reflow soldering equipment, through the positive transparent window of reflow soldering room, the condition of knowing the component in the heating process that can understand when the component is impaired, can stop heating to through the positive handle of room door, open the room door, take out the component.

Drawings

FIG. 1 is a front sectional view of the present invention;

FIG. 2 is a side sectional view of the present invention;

fig. 3 is a schematic front structural view of the present invention.

Wherein: 1. a frame; 2. a support pillar; 3. a first motor; 4. a conveyor belt; 5. a driving wheel; 6. a driven wheel; 7. an auxiliary wheel; 8. a preheating chamber; 9. a reflow chamber; 10. a cooling chamber; 11. an exhaust fan; 12. A thermal insulation layer; 13. heating a tube; 14. a fixing plate; 15. a fan; 16. a second motor; 17. a cooler; 18. a water pump; 19. a water tank; 20. a heat exchanger; 21. and (4) exhausting holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, a novel reflow soldering device comprises a frame 1, a support column 2 is fixedly connected to the bottom of the frame 1, a first motor 3 is fixedly installed on the left side of the top of the frame 1, a conveying device is movably connected to the inside of the frame 1, the conveying device comprises a conveying belt 4, a driving wheel 5 is movably connected to the left side of the conveying belt 4, a driven wheel 6 is movably connected to the right side of the conveying belt 4, an auxiliary wheel 7 is movably connected to the middle of the conveying belt 4, an output shaft of the first motor 3 is fixedly connected with the driving wheel 5, the driving wheel 5 is in transmission connection with the driven wheel 6 through the conveying belt 4, a plurality of auxiliary wheels 7 are provided, the auxiliary wheels 7 are all provided with smooth surfaces, a preheating chamber 8 is fixedly connected to the top of the conveying frame 1, a reflow soldering chamber 9 is fixedly connected to the top of the frame 1, the front of the reflow soldering chamber 9 and the front of the cooling chamber 10 are both provided with chamber doors, the front of the two chamber doors is provided with a transparent window, the front of the two chamber doors is fixedly connected with handles, the handles are positioned below the transparent window, the condition of the element in the heating process can be clearly known through the transparent window on the front of the reflow soldering chamber 9, when the element is damaged, the heating can be stopped, the chamber doors are opened through the handles on the front of the chamber doors, the element is taken out, the right side of the top of the rack 1 is fixedly provided with an exhaust fan 11, the preheating chamber 8 is positioned on the right side of the first motor 3, the reflow soldering chamber 9 is positioned on the right side of the preheating chamber 8, the cooling chamber 10 is positioned on the right side of the reflow soldering chamber 9, the cooling chamber 10 is positioned on the left side of the exhaust fan 11, a thermal insulation layer 12 is fixedly connected between the cooling chamber 10 and the reflow, the fixing plate 14 is positioned above the heating pipe 13, the bottom of the fixing plate 14 is movably connected with a fan 15, the top of the fixing plate 14 is fixedly provided with a second motor 16, the second motor 16 is rotatably connected with the fan 15, the fan 15 is rotatably connected with an output shaft of the second motor 16 through a rotating shaft, the rotating shaft is movably connected with the inside of the fixing plate 14, the components are placed on the conveyer belt 4, the conveyer belt 4 is driven by the first motor 3 to move, so that the components firstly enter the preheating chamber 8 and then enter the reflow soldering chamber 9, the components can be prevented from being tilted due to sharp heat, the heating is carried out through the heating pipe 13, the temperature of the air inside the reflow soldering chamber 9 is raised, the fan 15 is driven by the second motor 16 to rotate, high-temperature gas circularly flows in the reflow soldering chamber 9, the components are uniformly heated, the effects of high central temperature and low edge temperature are avoided, the inner side wall of the cooling chamber, inner bottom wall fixedly connected with water pump 18 of cooling chamber 10, inner bottom wall fixedly connected with water tank 19 of cooling chamber 10, water tank 19 is located the left side of water pump, inside wall fixedly connected with heat exchanger 20 of cooling chamber 10, heat exchanger 20 is located the top of cooler 17, cooler 17 leads to pipe and water pump 18 intercommunication, water pump 18 leads to pipe and water tank 19 intercommunication, water tank 19 leads to pipe and heat exchanger 20 intercommunication, heat exchanger 20 leads to pipe and cooler 17 intercommunication, exhaust hole 21 has been seted up at the top on cooling chamber 10 right side, air exhauster 11 passes through exhaust duct and exhaust hole 21 intercommunication.

When the device is used, the element is placed on the conveying belt 4, the conveying belt 4 is driven by the first motor 3 to move, the element firstly enters the preheating chamber 8 and then enters the reflow soldering chamber 9, the element can be prevented from tilting caused by sharp heat, the heating pipe 13 is used for heating, the temperature of the air in the reflow soldering chamber 9 is raised, the fan 15 is driven by the second motor 16 to rotate, high-temperature gas circularly flows in the reflow soldering chamber 9, the element is uniformly heated, the effects of high central temperature and low edge temperature are avoided, the condition of the element in the heating process can be clearly known through the transparent window on the front side of the reflow soldering chamber 9, when the element is damaged, the heating can be stopped, the chamber door is opened through the handle on the front side of the chamber door, the element is taken out, after the element enters the cooling chamber 10, the heat of the element is absorbed through the cooler 17, the water which absorbs the heat is pumped from the cooler 17 to the heat exchanger 20 by the water pump 18, after the temperature of the heat exchanger 20 is reduced, water flows into the water tank 19, meanwhile, the water in the water tank 19 is pumped out and flows into the cooler 17 to obtain a cooling circulation, the heat exchanger 20 can generate heat while the temperature is reduced, and the heat generated by the heat exchanger 20 is discharged outside by the exhaust fan 11 through the exhaust hole 21.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a novel reflow soldering equipment, includes frame (1), its characterized in that: the bottom of the rack (1) is fixedly connected with a support column (2), the left side of the top of the rack (1) is fixedly provided with a first motor (3), the inside of the rack (1) is movably connected with a conveying device, the top of the rack (1) is fixedly connected with a preheating chamber (8), the top of the rack (1) is fixedly connected with a reflow soldering chamber (9), the top of the rack (1) is fixedly connected with a cooling chamber (10), the right side of the top of the rack (1) is fixedly provided with an exhaust fan (11), a heat insulation layer (12) is fixedly connected between the cooling chamber (10) and the reflow soldering chamber (9), the inner side wall of the reflow soldering chamber (9) is fixedly connected with a heating pipe (13), the inner side wall of the reflow soldering chamber (9) is fixedly connected with a fixing plate (14), and the fixing plate (14) is positioned above, the bottom swing joint of fixed plate (14) has fan (15), the top fixed mounting of fixed plate (14) has second motor (16), second motor (16) rotate with fan (15) and are connected, the inside wall fixedly connected with cooler (17) of cooling chamber (10), the interior diapire fixedly connected with water pump (18) of cooling chamber (10), the interior diapire fixedly connected with water tank (19) of cooling chamber (10), water tank (19) are located the left side of water pump, the inside wall fixedly connected with heat exchanger (20) of cooling chamber (10), heat exchanger (20) are located the top of cooler (17), exhaust hole (21) have been seted up at the top on cooling chamber (10) right side.

2. The novel reflow soldering apparatus of claim 1, wherein: conveyor includes conveyer belt (4), the left side swing joint of conveyer belt (4) has action wheel (5), the right side swing joint of conveyer belt (4) has from driving wheel (6), the middle swing joint of conveyer belt (4) has auxiliary wheel (7), the output shaft and action wheel (5) fixed connection of first motor (3), action wheel (5) are connected through conveyer belt (4) transmission with from driving wheel (6), the quantity of auxiliary wheel (7) is a plurality of, and auxiliary wheel (7) all set up to smooth surface.

3. The novel reflow soldering apparatus of claim 1, wherein: preheating chamber (8) are located the right side of first motor (3), reflow soldering room (9) are located the right side of preheating chamber (8), cooling chamber (10) are located the right side of reflow soldering room (9), cooling chamber (10) are located the left side of air exhauster (11).

4. The novel reflow soldering apparatus of claim 1, wherein: reflow soldering room (9) all are equipped with the room door with the front of cooling chamber (10), two the front of room door is equipped with the transparent window, two the front fixedly connected with handle of room door, the handle is located the below of transparent window.

5. The novel reflow soldering apparatus of claim 1, wherein: the fan (15) is rotatably connected with an output shaft of the second motor (16) through a rotating shaft, and the rotating shaft is movably connected with the inner part of the fixing plate (14).

6. The novel reflow soldering apparatus of claim 1, wherein: the cooler (17) is communicated with the water pump (18) through a water pipe, the water pump (18) is communicated with the water tank (19) through a water pipe, the water tank (19) is communicated with the heat exchanger (20) through a water pipe, and the heat exchanger (20) is communicated with the cooler (17) through a water pipe.

7. The novel reflow soldering apparatus of claim 1, wherein: the exhaust fan (11) is communicated with the exhaust hole (21) through an exhaust pipeline.