CN112091354B - Automatic vacuum anaerobic tunnel furnace - Google Patents
Automatic vacuum anaerobic tunnel furnace Download PDFInfo
- Publication number
- CN112091354B CN112091354B CN202011093146.7A CN202011093146A CN112091354B CN 112091354 B CN112091354 B CN 112091354B CN 202011093146 A CN202011093146 A CN 202011093146A CN 112091354 B CN112091354 B CN 112091354B
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- Prior art keywords
- heating
- chamber
- cavity
- frame
- heating chamber
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 122
- 238000001816 cooling Methods 0.000 claims description 38
- 238000003756 stirring Methods 0.000 claims description 17
- 230000000087 stabilizing effect Effects 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 abstract description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 24
- 229910000679 solder Inorganic materials 0.000 description 12
- 238000007789 sealing Methods 0.000 description 8
- 238000007599 discharging Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Furnace Details (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides an automatic vacuum anaerobic tunnel furnace, which comprises a frame, a conveying device arranged on the frame, a pre-storing and deoxidizing device and a heat treatment device which are sequentially arranged on the conveying device, wherein the heat treatment device comprises a heating cavity, a heating component arranged in the heating cavity and a negative pressure pipeline communicated into the heating cavity, the heating component comprises a heating cover fixedly arranged in the heating cavity and a heat exchange tube attached to the heating cover, the heating cover is arranged on the conveying device, the heat exchange tube is arranged on the side surface of the heating cover, which is away from the conveying device, the negative pressure pipeline penetrates through the side wall of the heating cavity, the heat exchange tube can increase the temperature in the heating cavity, the negative pressure pipeline can suck internal gas of the heating cavity, the temperature in the heating cavity is increased through the heat exchange tube, and the negative pressure pipeline changes the air pressure in the heating cavity, so that bubbles in a soldering tin block between a jig and a wafer can be extracted.
Description
Technical Field
The invention relates to the technical field of welding equipment, in particular to an automatic vacuum anaerobic tunnel furnace.
Background
When producing electronic chip, the main component of electronic chip is the wafer that the silicon material was made, and the wafer needs splendid attire to the tool in the processing, for strengthening the position of wafer on the tool, often welds wafer to the tool in the contact position department of wafer and tool with the mode of heating soldering tin, and traditional welding process can lead to bubble bulge phenomenon to appear in the soldering department, leads to the welded surface to reduce after the bubble bulge, and the welding dynamics descends, causes adverse effect to the course of working of follow-up wafer, and specifically the wafer is because the position on the tool is unstable, and laser sculpture, ultrasonic cleaning etc. process processing effect is not ideal.
Disclosure of Invention
The invention aims to solve the technical problems that: bubbles can be generated at the welding positions of the wafer and the jig, so that the position of the wafer on the jig is loosened.
The technical scheme adopted for solving the technical problems is as follows: the utility model provides an automatic vacuum anaerobic tunnel furnace, includes the frame, installs conveyer in the frame, set gradually advance deoxidation device and heat treatment device on the conveyer, heat treatment device includes heating chamber, installs heating element in the heating chamber and intercommunication extremely negative pressure pipeline in the heating chamber, heating element includes fixed mounting heating cover in the heating chamber and attached to heat exchange tube on the heating cover, the heating cover covers and establishes conveyer, heat exchange tube sets up deviating from on the heating cover the side of conveyer, negative pressure pipeline runs through the lateral wall setting of heating chamber, heat exchange tube can improve temperature in the heating chamber, negative pressure pipeline can suck the inside gas of heating chamber.
Further, a stirring motor is arranged on the side wall of the heating chamber, a stirring shaft is fixedly arranged on a rotating shaft of the stirring motor, and the stirring shaft extends to the space between the heating chamber and the heating cover.
Further, the heat treatment device further comprises a cooling chamber, the cooling chamber is arranged on the side wall of the heating chamber, a cooling fan is arranged in the cooling chamber, and the cooling fan can cool the inner space of the cooling chamber.
Further, the pre-storing deoxidizing device comprises a deoxidizing chamber, the deoxidizing chamber and the cooling chamber are respectively arranged at two sides of the heating chamber, and a deoxidizing pipeline and a pressure stabilizing pipeline are arranged on the side wall of the deoxidizing chamber.
Further, the pre-storing deoxidizing device further comprises a feeding chamber, wherein the feeding chamber, the deoxidizing chamber, the heating chamber and the cooling chamber are sequentially arranged along the direction of the frame.
Further, each cavity is followed all open on the lateral wall of frame direction has the transportation mouth, the transportation mouth upper cover is equipped with pneumatic door subassembly, pneumatic door subassembly including install in travel board, two symmetries of installing on the cavity lateral wall travel bar on the travel board, slidable cover establish extremely support on the travel bar hold cylinder and fixed mounting and be in support and hold the epaxial closing plate of cylinder piston, the closing plate can support and hold pushing away of cylinder and support down the laminating to on the transportation mouth.
Further, the number of the travel bars is two, the travel bars are respectively arranged on two sides of the transportation port, the pneumatic door assembly further comprises a sliding frame which is slidably sleeved on the travel bars, and the supporting cylinder is arranged on the sliding frame.
Further, the transportation device comprises a transportation roller assembly arranged on the frame, the transportation roller assembly comprises a driving motor arranged on the side edge of the frame and a plurality of rotating rollers arranged on the frame, the rotating rollers are uniformly arranged along the direction of the frame, and the driving motor can drive the rotating rollers to rotate on the frame.
Further, a bearing is sleeved on the rotating roller, the rotating roller is mounted on the frame through the bearing, and the heating chamber and the heating cover penetrate through gaps between the rotating roller.
Further, driven gears are sleeved on the rotating rollers, racks are sleeved on the driven gears in a matched mode, driving gears are sleeved on rotating shafts of the driving motors, and the driving gears are meshed with the racks.
The invention has the beneficial effects that the heating cover and the negative pressure pipeline are arranged in the heating chamber in the tunnel furnace, the heating pipe is arranged on the heating cover, the internal temperature of the heating chamber can be increased after the medium is injected into the heating pipe, then the heating chamber can be pumped into a negative pressure state through the negative pressure pipeline, air bubbles in the soldering block between the jig and the wafer are pumped out, the connection strength of the soldering block between the jig and the wafer is improved, the wafer is prevented from loosening on the jig in the subsequent processing process, and the processing effect of the wafer is ensured.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a perspective view of an automated vacuum anaerobic tunnel furnace of the present invention;
FIG. 2 is another perspective view (with the frame omitted) of the automated vacuum anaerobic tunnel furnace shown in FIG. 1;
FIG. 3 is a perspective view of the feed assembly of FIG. 2;
FIG. 4 is a perspective view of the heating chamber and heating assembly of FIG. 2;
In the figure: the automatic vacuum anaerobic tunnel furnace 100, the frame 10, the transporting device 20, the pre-storing deoxidizing device 30, the heat treatment device 40, the transporting table 110, the heating chamber 410, the heating assembly 420, the negative pressure pipeline 430, the heating cover 421, the heat exchange pipe 422, the stirring motor 411, the stirring shaft 412, the cooling chamber 440, the cooling fan 415, the deoxidizing chamber 310, the feeding chamber 320, the deoxidizing pipeline 311, the pressure stabilizing pipeline 312, the access opening 502, the access cover 560, the cooling elbow 561, the transporting opening 501, the pneumatic door assembly 50, the travel plate 510, the travel rod 520, the sliding frame 530, the holding cylinder 540, the sealing plate 550, the feeding assembly 210, the discharging assembly 220, the transporting roller assembly 230, the driving motor 231, the rotating roller 232, the bearing 233, the driven gear 234, the driving gear 235, the pushing cylinder 211, and the pushing cylinder 212.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention. On the contrary, the embodiments of the invention include all alternatives, modifications and equivalents as may be included within the spirit and scope of the appended claims.
As shown in fig. 1 to 4, the present invention provides an automatic vacuum anaerobic tunnel furnace 100 for welding a wafer on a jig, the automatic vacuum anaerobic tunnel furnace 100 including a frame 10, a transporting device 20 installed on the frame 10, a pre-storing and deoxidizing device 30 and a heat treating device 40 sequentially arranged along a transporting direction of the transporting device 20.
The frame 10 is made of square tube section bar, is equipped with transportation mesa 110 on the frame 10, and the tool that bears the wafer removes on transportation mesa 110, specifically, under the effect of conveyer 20, the tool is through prestoring deoxidization device 30 and heat treatment device 40 in proper order, and when heat treatment device 40 was passed through, the bubble in the soldering piece can be sucked by the negative pressure.
More specifically, the heat treatment apparatus 40 includes a heating chamber 410, a heating assembly 420 installed in the heating chamber 410, and a negative pressure pipe 430 connected to the inside of the heating chamber 410, wherein the transporting apparatus 20 passes through the heating chamber 40, so that a jig for carrying a wafer can pass through the heating chamber 410 under the transporting action of the transporting apparatus 20.
As shown in fig. 4, the heating assembly 420 includes a heating cover 421 fixedly installed in the heating chamber 410 and a heat exchange tube 422 attached to the heating cover 421, the heating cover 421 has a U-shaped structure, the transporting device 20 is disposed through the heating cover 421, the heat exchange tube 422 is disposed on a side surface of the heating cover 421, a negative pressure pipe 430 is penetratingly installed on a top wall of the heating chamber 410, the negative pressure pipe 430 is communicated with an inner space and an outer space of the heating chamber 410, and the interior of the heating chamber 410 can be pumped into a negative pressure state through the negative pressure pipe 430.
When the jig is transported into the heating cover 421 along the direction of the frame 10, the heat exchange tube 422 mounted on the heating cover 421 starts to inject heat exchange medium, which may be steam or hot water, until the solder block between the jig and the wafer is softened, and then is connected to external air pressure equipment through the negative pressure pipeline 430, the interior of the heating chamber 410 can be pumped into a negative pressure state through the air pressure equipment, and bubbles in the solder block are pumped out from the solder block under the action of negative pressure, so that the welding performance of the solder block is improved, and the connection stability between the wafer and the jig is enhanced.
Preferably, a stirring motor 411 is installed on the top wall of the heating chamber 410, a stirring shaft 412 is fixedly installed on a rotating shaft of the stirring motor 411, the stirring shaft 412 extends into the heating chamber 410, stirring blades (not shown) are installed on the stirring shaft 412, and under the rotation action of the stirring blades, the air around the stirring shaft 412 is stirred until the heat emitted by the heat exchange tube 422 is uniformly stirred in the heating chamber 430, so that the soldering block on the jig can be uniformly heated, uneven heating of a connecting piece between the jig and the wafer can be avoided, and the bonding strength of the soldering block is further ensured.
Preferably, the heat treatment device 40 further comprises a cooling chamber 440, the cooling chamber 440 is disposed on a side wall of the heating chamber 410, the transporting device 20 is disposed through the cooling chamber 440, the jig can enter the cooling chamber 440 from the heating chamber 410 along the transporting direction of the transporting device 20, a cooling fan 415 is disposed in the cooling chamber 410, and the cooling fan 415 can cool the jig in the cooling chamber 440 after being started, so as to promote the soldering block to be cooled to a normal temperature solidification state.
The pre-existing deoxidizing device 30 is disposed at one side of the heating chamber 410 far away from the cooling chamber 440, preferably, the pre-existing deoxidizing device 30 includes a deoxidizing chamber 310 and a feeding chamber 320, so that the feeding chamber 320, the deoxidizing chamber 310, the heating chamber 410 and the cooling chamber 440 are sequentially disposed along the transportation direction of the jig, and each chamber is communicated with each other, a deoxidizing pipe 311 and a pressure stabilizing pipe 312 are disposed on the sidewall of the deoxidizing chamber 310, when the jig enters the deoxidizing chamber 310 from the feeding chamber 320, air in the deoxidizing chamber 310 can be pumped out through the deoxidizing pipe 311, and inert gases such as nitrogen are injected into the deoxidizing chamber 310 through the pressure stabilizing pipe 312, so that oxidation reaction of oxygen and wafers at high temperature can be avoided, and quality of the wafers is affected.
Preferably, the side walls of the feeding chamber 320, the deoxidizing chamber 310, the heating chamber 410 and the cooling chamber 440 are provided with access holes 502, the side edges of the access holes 502 are movably provided with access covers 560, the top ends of the access covers 560 are detachably connected to the side walls of the corresponding chambers, the bottom ends of the access covers 560 are hinged to the side walls of the chambers, cooling bent pipes 561 are arranged on the inner sides of the access holes 502 of the heating chamber 410 and the cooling chamber 440, cooling medium flows in the cooling bent pipes 561, the temperature of the access covers 560 is reduced under the cooling effect of the cooling medium, and operators can conveniently observe and overhaul the conditions in the feeding chamber 320, the deoxidizing chamber 310, the heating chamber 410, the cooling chamber 440 and the like through the access holes 502.
Preferably, each chamber is provided with a transport opening 501 on a side wall along the transport direction of the jig, the transport opening 501 is covered with a pneumatic door assembly 50, and the pneumatic door assembly 50 comprises a travel plate 510 which can be attached to the side wall of the chamber, two travel rods 520 symmetrically arranged on the travel plate 510, a sliding frame 530 slidably sleeved on the two travel rods 520, a supporting cylinder 540 fixedly arranged on the inner wall of the sliding frame 530, and a sealing plate 550 fixedly arranged on the piston shaft of the supporting cylinder 540.
The travel plate 510 is arranged at two sides of the transport port 501, the travel rod 520 is arranged on the travel plate 510 in parallel, the sliding frame 530 is slidably sleeved on the travel rod 520, the cylinder body of the supporting cylinder 540 is fixedly arranged on the inner wall of the sliding frame 530, the piston shaft of the supporting cylinder 540 is arranged towards the transport port 501, and the sealing plate 550 can be pressed down by the supporting cylinder 540 to be attached to or away from the transport port 501, so that sealing and isolation of each chamber are realized.
Preferably, the conveyor 20 includes an infeed assembly 210, an outfeed assembly 220, and a conveyor roller assembly 230 mounted on the conveyor table 110. The feeding assembly 210 and the discharging assembly 220 are separately provided at both ends of the frame 10, and the transporting roller assembly 230 is provided between the feeding assembly 210 and the discharging assembly 220, and the transporting roller assembly 230 passes through the heating chamber 410 and the heating cover 421.
The transport roller assembly 230 includes a driving motor 231 disposed on a side of the frame 10 and a plurality of rotating rollers 232 mounted on the frame 10, the rotating rollers 232 are uniformly arranged along a transport direction of the frame 10, bearings 233 corresponding to the frame 10 are further sleeved on the rotating rollers 232, the rotating rollers 232 are fixed on the frame 10 through the bearings 233, the rotating rollers 232 are driven by the driving motor 231 to synchronously rotate relative to the frame 10, and the heating chamber 410 and the heating cover 421 penetrate through gaps between the rotating rollers 232.
Preferably, the rotating roller 232 is sleeved with a driven gear 234, the driven gear 234 is sleeved with a rack (not shown) in a matched manner, the driven gear 234 can be uniformly driven to rotate through the cyclic rotation of the rack, a driving gear 235 is installed on a rotating shaft of the driving motor 231, the driving gear 235 is meshed in the rack, the driving motor 231 drives the driving gear 235 to rotate, the driving gear 235 drives the rack to rotate relative to the driven gear 234, the rack can drive the driven gear 234 to rotate when the rack circularly rotates, and the driven gear 234 drives the rotating roller 232 to rotate, so that the jig can be driven to move along the rack 10 when the rotating roller 232 synchronously rotates.
Preferably, the feeding assembly 210 and the discharging assembly 220 are symmetrically distributed on the frame 10, the feeding assembly 210 and the discharging assembly 220 have the same structure, the feeding assembly 210 can move the jig into the feeding chamber 320, the discharging assembly 220 can move the jig in the cooling chamber 440 out, more specifically, the feeding assembly 210 comprises a pushing cylinder 211 installed on the conveying table 110 and a pushing cylinder 212 installed on a piston shaft of the pushing cylinder 211, the piston shaft of the pushing cylinder 212 is perpendicular to the piston shaft of the pushing cylinder 211, a bearing plate (not shown) is further installed on the pushing cylinder 212, after the jig is placed on the bearing plate, the jig can be pushed to the upper side of the rotating roller 232 under the pushing of the pushing cylinder 212, then the pushing cylinder 211 is started, the jig can be pushed to the upper side of the rotating roller 232 under the pushing of the pushing cylinder 211, then the pushing cylinder 212 and the pushing cylinder 211 are sequentially retracted, the jig is placed on the rotating roller 232 and is conveyed to the respective chambers by the rotating roller 232.
When the automatic vacuum anaerobic tunnel furnace 100 is used, the jig containing the wafer is transported to the rotating roller 232 by matching the pushing cylinder 212 and the pushing cylinder 211 in the feeding component 210, when the rotating roller 232 rotates relative to the frame 10 under the driving of the driving motor 231, the jig can be driven to move towards the feeding chamber 320 until the sealing plate 550 in the pneumatic door component 50 on the feeding chamber 320 is separated from the side wall, the jig can enter the feeding chamber 320, when a new jig is placed on the rotating roller 232 again, the sealing plate 550 in the other pneumatic door component 50 in the feeding chamber 320 is separated from the chamber side wall until the jig is transported into the deoxidizing chamber 310, the sealing plates 550 at two sides of the deoxidizing chamber 310 are propped against the side wall again, after the deoxidizing chamber 310 is in a closed state, the air of the deoxidizing chamber 310 is pumped out through the deoxidizing channel 311, and inert gas is injected into the deoxidizing chamber 310 through the pressure stabilizing pipeline 312, so that the oxygen-free environment can be kept all the time near the jig, the jig in the deoxidizing chamber 310 can be transported into the heating chamber 410 in the continuous feeding process, after the internal space of the heating chamber 410 is regulated to a proper temperature by the heat exchange pipe 422 on the heating cover 421, the solder bump on the jig is softened, then the inside of the heating chamber 410 is pumped into a negative pressure state through the negative pressure pipeline 430, after the jig is continuously placed in the negative pressure environment for a period of time, the jig is transported into the cooling chamber 440, when the solder bump on the jig is cooled to a normal temperature state in the cooling chamber 440, the wafer and the jig can be bonded again, and after the cooling process is finished, the jig can be transported out of the frame 10 through the pushing cylinder 211 and the lifting cylinder 212 in the discharging assembly 220, and the removal of the solder bump bubbles in the jig is finished.
In the above-mentioned use, when the jig is transported into the heating chamber 410, the heat exchange tube 422 heats the solder bump, so that the hardness of the solder bump can be changed, that is, the solder bump is heated and softened, and then the gas around the jig is pumped through the negative pressure pipeline 430, so that the jig is in a negative pressure environment, and the bubbles in the solder bump can be pumped out in a negative pressure pumping sealing manner, so that the bonding strength of the solder bump between the jig and the jig is improved, and the wafer can not move relative to the jig in the subsequent processing process.
With the above-described preferred embodiments according to the present invention as an illustration, the above-described descriptions can be used by persons skilled in the relevant art to make various changes and modifications without departing from the scope of the technical idea of the present invention. The technical scope of the present invention is not limited to the description, but must be determined according to the scope of claims.
Claims (4)
1. An automatic vacuum anaerobic tunnel furnace, which is characterized in that: comprises a frame, a transportation device arranged on the frame, a pre-storing and deoxidizing device and a heat treatment device which are sequentially arranged on the transportation device, wherein the heat treatment device comprises a heating chamber, a heating component arranged in the heating chamber and a negative pressure pipeline communicated to the heating chamber, the heating component comprises a heating cover fixedly arranged in the heating chamber and a heat exchange tube attached to the heating cover, the heating cover is arranged on the transportation device, the heat exchange tube is arranged on the side surface of the heating cover, which is away from the transportation device, the negative pressure pipeline penetrates through the side wall of the heating chamber, the heat exchange tube can improve the temperature in the heating chamber, the negative pressure pipeline can suck internal gas of the heating chamber, a stirring motor is arranged on the side wall of the heating chamber, the stirring motor is fixedly arranged on a rotating shaft, the stirring shaft extends to the position between the heating cavity and the heating cover, the heat treatment device further comprises a cooling cavity, the cooling cavity is arranged on the side wall of the heating cavity, a cooling fan is arranged in the cooling cavity and can cool the inner space of the cooling cavity, the pre-storing deoxidation device comprises a deoxidation cavity, the deoxidation cavity and the cooling cavity are respectively arranged on two sides of the heating cavity, a deoxidation pipeline and a pressure stabilizing pipeline are arranged on the side wall of the deoxidation cavity, the transportation device comprises a transportation roller assembly arranged on the rack, the transportation roller assembly comprises a driving motor arranged on the side wall of the rack and a rotating roller arranged on the rack, the rotating rollers are multiple and are uniformly arranged along the direction of the rack, the driving motor can drive the rotating roller to rotate on the frame, the bearing is sleeved on the rotating roller, the rotating roller is installed on the frame through the bearing, the heating cavity and the heating cover all penetrate through gaps between the rotating roller, driven gears are sleeved on the rotating roller, racks are sleeved on the driven gears in a matched mode, a driving gear is sleeved on a rotating shaft of the driving motor, and the driving gear is meshed with the racks.
2. An automated vacuum anaerobic tunnel furnace according to claim 1, wherein: the pre-storing deoxidizing device further comprises a feeding chamber, wherein the feeding chamber, the deoxidizing chamber, the heating chamber and the cooling chamber are sequentially arranged along the direction of the frame.
3. An automated vacuum anaerobic tunnel furnace according to claim 2, wherein: each cavity is followed all open on the lateral wall of frame direction has the transportation mouth, the transportation mouth upper cover is equipped with pneumatic door subassembly, pneumatic door subassembly including install in travel board, two symmetries of installing on the cavity lateral wall travel bar on the travel board, slidable cover establish to support on the travel bar hold cylinder and fixed mounting and be in support hold cylinder piston epaxial closing plate, the closing plate can support to hold pushing away of cylinder and support down the laminating to on the transportation mouth.
4. An automated vacuum anaerobic tunnel furnace according to claim 3, wherein: the two travel bars are respectively arranged on two sides of the transportation port, the pneumatic door assembly further comprises a sliding frame which is slidably sleeved on the travel bars, and the supporting cylinder is arranged on the sliding frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011093146.7A CN112091354B (en) | 2020-10-13 | 2020-10-13 | Automatic vacuum anaerobic tunnel furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011093146.7A CN112091354B (en) | 2020-10-13 | 2020-10-13 | Automatic vacuum anaerobic tunnel furnace |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112091354A CN112091354A (en) | 2020-12-18 |
| CN112091354B true CN112091354B (en) | 2024-05-31 |
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ID=73783607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011093146.7A Active CN112091354B (en) | 2020-10-13 | 2020-10-13 | Automatic vacuum anaerobic tunnel furnace |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112091354B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101771632B1 (en) * | 2016-12-09 | 2017-08-25 | 한국진공주식회사 | Automatic in-line drying device for secondary battery plate |
| CN108690906A (en) * | 2017-04-07 | 2018-10-23 | 江油立航金属材料有限公司 | Using the stainless steel hot treatment process of vacuum seamless heat-treatment furnace |
| CN108913853A (en) * | 2018-10-12 | 2018-11-30 | 江苏天工科技股份有限公司 | It is a kind of to roll the preceding annealing device processed for titanium alloy plate |
| CN109321727A (en) * | 2018-09-10 | 2019-02-12 | 安庆牛力模具股份有限公司 | A kind of feeding in continuous material metal vacuum heat-treatment furnace |
| CN213318198U (en) * | 2020-10-13 | 2021-06-01 | 常州常耀半导体科技有限公司 | Automatic vacuum anaerobic tunnel furnace |
-
2020
- 2020-10-13 CN CN202011093146.7A patent/CN112091354B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101771632B1 (en) * | 2016-12-09 | 2017-08-25 | 한국진공주식회사 | Automatic in-line drying device for secondary battery plate |
| CN108690906A (en) * | 2017-04-07 | 2018-10-23 | 江油立航金属材料有限公司 | Using the stainless steel hot treatment process of vacuum seamless heat-treatment furnace |
| CN109321727A (en) * | 2018-09-10 | 2019-02-12 | 安庆牛力模具股份有限公司 | A kind of feeding in continuous material metal vacuum heat-treatment furnace |
| CN108913853A (en) * | 2018-10-12 | 2018-11-30 | 江苏天工科技股份有限公司 | It is a kind of to roll the preceding annealing device processed for titanium alloy plate |
| CN213318198U (en) * | 2020-10-13 | 2021-06-01 | 常州常耀半导体科技有限公司 | Automatic vacuum anaerobic tunnel furnace |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112091354A (en) | 2020-12-18 |
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