CN117139941A - Vacuum system and working method thereof - Google Patents
Vacuum system and working method thereof Download PDFInfo
- Publication number
- CN117139941A CN117139941A CN202311416508.5A CN202311416508A CN117139941A CN 117139941 A CN117139941 A CN 117139941A CN 202311416508 A CN202311416508 A CN 202311416508A CN 117139941 A CN117139941 A CN 117139941A
- Authority
- CN
- China
- Prior art keywords
- chamber
- station
- workpiece
- preheating
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000001816 cooling Methods 0.000 claims abstract description 82
- 238000003466 welding Methods 0.000 claims abstract description 58
- 230000009467 reduction Effects 0.000 claims abstract description 48
- 230000007246 mechanism Effects 0.000 claims abstract description 19
- 238000007789 sealing Methods 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 239000003638 chemical reducing agent Substances 0.000 claims description 2
- 238000006722 reduction reaction Methods 0.000 abstract description 43
- 230000008569 process Effects 0.000 abstract description 12
- 238000012545 processing Methods 0.000 abstract description 6
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 238000007599 discharging Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 235000019253 formic acid Nutrition 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/003—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
Abstract
The application relates to the technical field of semiconductor chip processing equipment, and provides a vacuum system and a working method thereof. The vacuum system comprises: the device comprises a preheating station, a reduction station, a welding station, a cooling station and a carrying mechanism. The preheating station comprises a preheating chamber; the reduction station comprises a first chamber, a second chamber, a first moving device, a first air inlet pipeline and a first air exhaust pipeline, wherein the first moving device is connected with the second chamber and drives the second chamber to move so that the second chamber and the preheating chamber are matched to form a first closed space for providing a vacuum environment or a reducing atmosphere environment for a reduction workpiece, and the first air inlet pipeline and the first air exhaust pipeline are respectively connected with the first closed space. The application can effectively reduce the oxide generated in the welding process of the workpiece; the online welding method is adopted, preheating, reduction, welding and cooling are performed at different stations, so that the production period of the product is greatly shortened, and the leakage of reducing gas is reduced.
Description
Technical Field
The application relates to the technical field of semiconductor chip processing equipment, in particular to a vacuum system and a working method thereof.
Background
At present, the semiconductor chip packaging device in the prior art mostly adopts a pipeline form, and needs to solder and package the chip, and in order to ensure the quality of chip soldering, the chip packaging device needs to be ensured to be performed in a vacuum environment or a reducing environment before and during the chip soldering. In the semiconductor chip packaging equipment in the prior art, before a workpiece enters a welding station, vacuum reduction treatment is not carried out or other atmospheres are added by replacing air, so that the chip can be oxidized in the welding process.
Disclosure of Invention
The application provides a vacuum system and a working method thereof, which are used for solving the defect that oxidation is generated during chip welding and packaging in the prior art.
The present application provides a vacuum system comprising:
the preheating station is used for preheating the workpiece and comprises a preheating chamber;
the reduction station is used for reducing the preheated workpiece and comprises a first chamber, a second chamber, a first moving device, a first air inlet pipeline and a first air exhaust pipeline, wherein the first chamber is arranged at the periphery of the second chamber, the first moving device is connected with the second chamber and drives the second chamber to move so that the second chamber and the preheating chamber are matched to form a first closed space for providing a vacuum environment or a reducing atmosphere environment for reducing the workpiece, and the first air inlet pipeline and the first air exhaust pipeline are respectively communicated with the first closed space;
the welding station is used for welding the reduced workpiece;
the cooling station is used for cooling the welded workpiece;
and the conveying mechanism is used for conveying the workpiece so as to enable the workpiece to circulate among the preheating station, the reduction station, the welding station and the cooling station.
According to the vacuum system provided by the application, the preheating station further comprises a heating carrying platform, the heating carrying platform is arranged on the bottom plate of the preheating chamber, and the preheating chamber is provided with a first air inlet.
According to the vacuum system provided by the application, the reduction station further comprises: the first sealing device is arranged at the opening end of the second chamber and is suitable for being in sealing connection with the opening end of the preheating chamber.
According to the vacuum system provided by the application, the reduction station further comprises:
the first heating device is arranged in the second chamber;
and the first cooling device is arranged in the second chamber.
According to the vacuum system provided by the application, the cooling station comprises a cooling cavity and a water cooling device, wherein the water cooling device is arranged in the cooling cavity, and the cooling cavity is provided with a second air inlet.
According to the present application, there is provided a vacuum system, the carrying mechanism comprising:
the supporting table is used for placing a workpiece;
the horizontal driving unit is connected with the supporting table and used for driving the supporting table to horizontally move;
and the vertical driving unit is connected with the supporting table and is used for driving the supporting table to move vertically.
According to the present application, there is provided a vacuum system, further comprising:
the feeding device is arranged at the inlet of the preheating station;
and the blanking device is arranged at the outlet of the cooling station.
According to the vacuum system provided by the application, the welding station comprises a third chamber and a second moving device, the first chamber is arranged at the periphery of the second chamber and the third chamber, the second moving device is connected with the third chamber and drives the third chamber to move so that the third chamber and the preheating chamber are matched to form a second closed space for providing a vacuum environment or a reducing atmosphere environment for a welding workpiece.
According to the vacuum system provided by the application, the welding station further comprises:
the second heating device is arranged in the third chamber;
and the second cooling device is arranged in the third chamber.
The application also provides an operation method of the vacuum system, which comprises the following steps:
the workpiece enters a preheating station for preheating, and the temperature of the workpiece rises to a preset temperature;
the preheated workpiece enters a reduction station, the second chamber is controlled to descend through a first moving device, a first closed space is formed between the second chamber and the preheating chamber, a vacuum environment is formed by air suction through a first air suction pipeline, or a reducing substance is introduced through a first air inlet pipeline, so that the workpiece is reduced;
the reduced workpiece enters a welding station for welding;
and (5) cooling the welded workpiece in a cooling station.
According to the vacuum system and the working method thereof, the preheating station, the reduction station, the welding station and the cooling station are sequentially arranged, and the workpiece is conveyed through the conveying mechanism so as to circulate among the stations, and the preheating, reduction, welding and cooling processes are sequentially carried out; in addition, in the reduction station, the first moving device controls the movement of the second chamber to enable the second chamber to form a closed space with the preheating chamber, reducing atmosphere is input into the interior by utilizing the first air inlet pipeline, and air is pumped from the interior by utilizing the first air pumping pipeline, so that environment is provided for workpiece reduction, workpiece oxidation is avoided, and processing efficiency is improved.
Drawings
In order to more clearly illustrate the application or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the application, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of the overall structure of a vacuum system provided by the present application;
FIG. 2 is a schematic diagram of the reducing station and the welding station provided by the present application;
FIG. 3 is a schematic top view of a reduction station and a welding station provided by the present application;
FIG. 4 is a schematic cross-sectional view of A-A of FIG. 3;
FIG. 5 is a schematic view of a handling mechanism according to the present application;
FIG. 6 is a front view of the handling mechanism provided by the present application;
FIG. 7 is a top view of the handling mechanism provided by the present application;
FIG. 8 is a schematic view of section A-A of the second and third chambers of FIG. 3 lowered to form a closed space.
Reference numerals:
1: a feeding device; 2: a preheating station; 21: preheating the chamber; 3: a reduction station; 31: a first chamber; 32: a second chamber; 33: a first mobile device; 34: a first air intake line; 35: a first bleed line; 4: a welding station; 41: a third chamber; 42: a second mobile device; 43: a second air intake line; 44: a second bleed line; 5: a cooling station; 6: a carrying mechanism; 61: a support table; 62: a horizontal driving unit; 63: a vertical driving unit; 7: a blanking device; 8: a feeding and conveying device; 9: and a blanking conveying device.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present application, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
A vacuum system of the present application is described below in conjunction with fig. 1-8. The vacuum system includes: a preheating station 2, a reduction station 3, a welding station 4, a cooling station 5 and a carrying mechanism 6.
The preheating station 2, the reduction station 3, the welding station 4 and the cooling station 5 are sequentially connected, a workpiece sequentially flows among the preheating station 2, the reduction station 3, the welding station 4 and the cooling station 5, and the working procedures of preheating, reduction, welding, cooling and the like are sequentially carried out. The workpiece is transferred between the stations by the transfer mechanism 6.
Specifically, the preheating station 2 is used for preheating a workpiece, the preheating station 2 comprises a preheating chamber 21, and an opening is formed in the top of the preheating chamber 21; the reduction station 3 is used for reducing the preheated workpiece, the reduction station 3 comprises a first chamber 31, a second chamber 32, a first moving device 33, a first air inlet pipeline 34 and a first air exhaust pipeline 35, the first chamber 31 is arranged at the periphery of the second chamber 32, the first moving device 33 is connected with the second chamber 32 and drives the second chamber 32 to move so that the second chamber 32 and the preheating chamber 21 cooperatively form a first closed space for providing a vacuum environment or a reducing atmosphere environment for reducing the workpiece, and the first air inlet pipeline 34 and the first air exhaust pipeline 35 are respectively communicated with the first closed space; the welding station 4 is used for welding the reduced workpiece; the cooling station 5 is used for cooling the welded workpiece; the handling mechanism 6 is used for handling the workpiece to circulate the workpiece between the preheating station 2, the reduction station 3, the welding station 4 and the cooling station 5.
Further, the first moving device 33 may be a lifting device, and specifically may be a lifting moving device driven by a pneumatic, electric, hydraulic or other structure; the first chamber 31 and the second chamber 32 are designed to have an opening at the lower end and an opening or through hole at the upper end of the preheating chamber 21, so that by the descent of the second chamber 32, a sealing connection with the preheating chamber 21 can be achieved, in particular: the first moving device 33 is used for controlling the lifting movement of the second chamber 32, when the second chamber 32 moves below the first chamber 31 and is in butt joint with the preheating chamber 21, the second chamber 32 and the preheating chamber 21 are sealed to form a first closed space (as shown in fig. 8), and the reducing gas is delivered into the first closed space through the first air inlet pipeline 34, for example: formic acid gas or hydrogen gas, etc.; air is extracted from the first enclosed space through the first extraction line 35.
Furthermore, the whole vacuum system adopts a shell sealing design, so that the reducing gas or welding tail gas can not be leaked at will, and the whole use environment can not be polluted. One or a plurality of reduction stations 3 may be provided, and one reduction station 3 may reduce one reduction workpiece or reduce a plurality of reduction workpieces at the same time.
The vacuum system is provided with a preheating station 2, a reduction station 3, a welding station 4 and a cooling station 5 in sequence, and carries workpieces through a carrying mechanism 6 so as to enable the workpieces to circulate among the stations, and preheating, reduction, welding and cooling processes are sequentially carried out; in addition, in the reduction station 3, the first moving device 33 controls the movement of the second chamber 32 to form a closed space with the preheating chamber 21, and the first air inlet pipeline 34 is used for inputting the reducing atmosphere into the interior, and the first air exhaust pipeline 35 is used for exhausting air from the interior, so that an environment is provided for reduction of the workpiece, oxidation of the workpiece is avoided, and the processing efficiency is improved.
In one embodiment of the present application, the preheating station 2 further comprises a preheating chamber 21 and a heating stage provided on the bottom plate of the preheating chamber 21. In this embodiment, the preheating station 2 may be provided with one or more heating devices, each of which has an independent temperature control, except for the preheating chamber 21, specifically: at the preheating station 2, which takes the form of a heating stage mounted on the floor of the preheating chamber 21 for preheating the workpiece; in addition, the preheating chamber 21 is provided with a first gas inlet, and a process gas may be added to the preheating chamber 21, for example: nitrogen or air.
In one embodiment of the application, the reduction station 3 further comprises: and a first sealing means provided at the open end of the second chamber 32 and adapted to be in sealing connection with the open end of the preheating chamber 21. In this embodiment, the second chamber 32 and the preheating chamber 21 are abutted through respective open ends, so that the first sealed space may need to be vacuumized, and in order to ensure the sealing performance between the second chamber 32 and the preheating chamber 21, a first sealing device is disposed at the connection position of the two. Preferably, the first sealing means may take the form of a sealing ring, gasket or bead.
In one embodiment of the application, the reduction station 3 further comprises: a first heating device and a first cooling device. Wherein the first heating device is disposed inside the second chamber 32; the first cooling means is provided inside the second chamber 32. In this embodiment, the first heating device and the first cooling device are disposed in the second chamber 32, and after the workpiece enters the reduction station 3, the environment where the workpiece is located can be heated and raised by the first heating device, and cooled by the first cooling device. Preferably, the first cooling device may employ a water cooling module disposed on the second chamber 32 to protect the sealing device and increase the service life.
In one embodiment of the application, the cooling station 5 comprises a cooling chamber and a water cooling device, which is arranged in the cooling chamber. In this embodiment, one or more cooling stations 5 may be provided. The cooling station 5 is in the form of a water cooling device and is arranged in the cooling cavity for cooling the workpiece; in addition, the cooling chamber is provided with a second gas inlet, into which a process gas can be added, for example: nitrogen or air. Further, a heating device can be arranged in the cooling cavity, so that the cooling rate can be controlled.
In one embodiment of the present application, the welding station 4 includes a third chamber 41, a second moving device 42, a second air inlet pipeline 43 and a second air exhaust pipeline 44, the first chamber 31 is disposed at the periphery of the second chamber 32 and the third chamber 41, the second moving device 42 is connected with the third chamber 41, drives the third chamber 41 to move so that the third chamber 41 and the preheating chamber 21 cooperatively form a second closed space for providing a vacuum environment or a reducing atmosphere environment for welding a workpiece, and the second air inlet pipeline 43 and the second air exhaust pipeline 44 are respectively communicated with the second closed space. In the present embodiment, the reduction station 3 and the welding station 4 share a first chamber 31, the third chamber 41 being designed with an opening at the lower end, enabling a sealed connection with the preheating chamber 21 by the descent of the third chamber 41, in particular: the second moving device 42 may be a lifting device, specifically, a lifting moving device driven by a pneumatic, electric, hydraulic or other structure, where the second moving device 42 is used to control lifting movement of the third chamber 41, and when the third chamber 41 moves below the first chamber 31 and is in butt joint with the preheating chamber 21, the second moving device and the preheating chamber are sealed to form a second closed space, and the reducing gas is delivered into the second closed space through the second air inlet pipeline 43, for example: carrying out secondary reduction and welding on the workpiece by formic acid gas or hydrogen gas and the like; air is drawn from the second enclosed space through a second air-drawing line 44.
In one embodiment of the application, the welding station 4 further comprises: and a second sealing means provided at the open end of the third chamber 41 and adapted to be in sealing connection with the open end of the preheating chamber 21. In this embodiment, the third chamber 41 and the preheating chamber 21 are abutted through respective open ends, so that the second enclosed space may need to be vacuumized, and in order to ensure the sealing performance between the third chamber 41 and the preheating chamber 21, a second sealing device is disposed at the connection position of the two. Preferably, the second sealing means may take the form of a sealing ring, gasket or bead.
In one embodiment of the application, the welding station 4 further comprises: a second heating device and a second cooling device. Wherein the second heating means is provided inside the third chamber 41; the second cooling means is provided inside the third chamber 41. In this embodiment, the second heating device and the second cooling device are disposed in the third chamber 41, and after the workpiece enters the welding station 4, the environment where the workpiece is located can be heated and raised by the second heating device, and cooled by the second cooling device. Preferably, the second cooling device may employ a water cooling module disposed on the third chamber 41 to protect the sealing device and improve the service life.
In one embodiment of the present application, the handling mechanism 6 includes: a support table 61, a horizontal driving unit 62, and a vertical driving unit 63. Wherein the support table 61 is used for placing a workpiece; the horizontal driving unit 62 is connected with the supporting table 61 and is used for driving the supporting table 61 to move horizontally; the vertical driving unit 63 is connected to the support table 61, and is used for driving the support table 61 to move vertically. In this embodiment, the workpiece is placed on the supporting table 61, the supporting table 61 is driven by the horizontal driving unit 62 to drive the workpiece to move horizontally, and the supporting table 61 is driven by the vertical driving unit 63 to drive the workpiece to move vertically, so that the workpiece can be transported and circulated between different chambers.
In one embodiment of the application, the vacuum system further comprises: a feeding device 1 and a discharging device 7. Wherein, the feeding device 1 is arranged at the inlet of the preheating station 2; the blanking device 7 is arranged at the outlet of the cooling station 5. In the embodiment, a workpiece is fed by a feeding device 1 and conveyed to a preheating station 2; the workpiece is conveyed from the cooling station 5 to a blanking device 7 and is blanked. Specifically, the feeding device 1 and the discharging device 7 may be a conveyor, a lifter, a transfer machine, or the like.
In one embodiment of the application, the vacuum system further comprises: a feeding conveying device 8 and a discharging conveying device 9. Wherein, loading conveyor 8 is connected with loading attachment 1, and unloading conveyor 9 is connected with unloader 7, carries the position of loading attachment 1 with the work piece through loading conveyor 8, carries the work piece to next equipment from unloader 7 through unloading conveyor 9. Preferably, the feeding conveyor 8 and the discharging conveyor 9 may be belt conveyors, scraper conveyors, or the like.
The application also provides an operation method of the vacuum system. The operation method comprises the following steps:
the workpiece enters a preheating station 2 for preheating, and the temperature of the workpiece rises to a preset temperature;
the preheated workpiece enters a reduction station 3, the second chamber 32 is controlled to descend through the first moving device 33, a first closed space is formed between the second chamber 32 and the preheating chamber 21, a vacuum environment is formed by air suction through the first air suction pipeline 35 or reducing substances are introduced through the first air inlet pipeline 34, and the workpiece is reduced;
the reduced workpiece enters a welding station 4 for welding, the third chamber 41 is controlled to descend by the second moving device 42, a first closed space is formed between the third chamber 41 and the preheating chamber 21, a vacuum environment is formed by air suction through the second air suction pipeline 44 or reducing substances are introduced through the second air inlet pipeline 43, and the workpiece is subjected to secondary reduction and welding;
the welded workpiece enters a cooling station 5 for cooling.
The working method of the vacuum system in the embodiment of the application mainly comprises four working procedures, namely workpiece preheating, workpiece reduction, workpiece welding and workpiece cooling, and further, in order to improve the mechanization and automation degree of workpiece processing, the integrity of a workpiece processing assembly line is further increased, workpiece feeding is further increased before workpiece preheating, and workpiece discharging is further increased after workpiece cooling.
Specifically, in the workpiece preheating procedure, after the workpiece enters the preheating station 2 and is heated (preheated) for a preset time, the workpiece is raised to a preset temperature, and protective gas or process gas can be added through the first air inlet in the preheating procedure to reduce the oxidation degree of the workpiece;
in the workpiece reduction process, a conveying mechanism 6 conveys a workpiece to a reduction station 3, a second chamber 32 on the reduction station 3 falls down to be matched with a preheating chamber 21 to form a closed space, a first air suction pipeline 35 is used for vacuumizing the workpiece, a first air inlet pipeline 34 is used for adding reducing gas, the workpiece is reduced, after a period of time, the workpiece is exhausted and vacuumized, nitrogen is added for cooling, and after the cooling is carried out to reach a preset temperature, the second chamber 32 rises upwards;
in the workpiece welding process, the conveying mechanism 6 conveys the workpiece to the welding station 4, the third chamber 41 on the welding station 4 falls down to be matched with the preheating chamber 21 to form a closed space, the second air suction pipeline 44 is used for vacuumizing the workpiece, the second air inlet pipeline 43 is used for adding reducing gas, the workpiece is reduced and welded, after a period of time, the workpiece is exhausted and vacuumized, and then nitrogen is added for vacuuming, and the third chamber 41 rises upwards;
in the workpiece cooling process, the carrying mechanism 6 carries the workpiece to the cooling station 5, the workpiece needs to be placed at the cooling station 5 for a period of time, air, nitrogen or other inert gases can be added through the second air inlet in the cooling process, and the cooling station 5 can also set a preset temperature to adjust the cooling slope.
After the cooling is completed, the carrying mechanism 6 carries the workpiece to the outside of the apparatus, and the entire welding cycle of the workpiece is completed. The present application is an on-line welding process in which, as a first workpiece passes from the preheating station 2 to the welding station 4, a second workpiece also passes synchronously to the preheating station 2, and so on.
According to the operation method of the vacuum system, the reduction station 3 is added, so that air can be replaced, other atmospheres can be added, a reducing medium can be added in the sealed environment, medium overflow is prevented, and oxides generated in the welding process of the chip can be effectively reduced; the online welding method is adopted, preheating, reduction, welding and cooling are performed at different stations, so that the production period of the product is greatly shortened, and the leakage of reducing gas is reduced.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims (10)
1. A vacuum system, comprising:
the preheating station is used for preheating the workpiece and comprises a preheating chamber;
the reduction station is used for reducing the preheated workpiece and comprises a first chamber, a second chamber, a first moving device, a first air inlet pipeline and a first air exhaust pipeline, wherein the first chamber is arranged at the periphery of the second chamber, the first moving device is connected with the second chamber and drives the second chamber to move so that the second chamber and the preheating chamber are matched to form a first closed space for providing a vacuum environment or a reducing atmosphere environment for reducing the workpiece, and the first air inlet pipeline and the first air exhaust pipeline are respectively communicated with the first closed space;
the welding station is used for welding the reduced workpiece;
the cooling station is used for cooling the welded workpiece;
and the conveying mechanism is used for conveying the workpiece so as to enable the workpiece to circulate among the preheating station, the reduction station, the welding station and the cooling station.
2. The vacuum system of claim 1, wherein the preheat station further comprises a heating stage disposed on a floor of the preheat chamber, the preheat chamber being provided with a first air inlet.
3. The vacuum system of claim 1, wherein the reduction station further comprises: the first sealing device is arranged at the opening end of the second chamber and is suitable for being in sealing connection with the opening end of the first chamber.
4. The vacuum system of claim 1, wherein the reduction station further comprises:
the first heating device is arranged in the second chamber;
and the first cooling device is arranged in the second chamber.
5. A vacuum system according to claim 1, wherein the cooling station comprises a cooling chamber and a water cooling device, the water cooling device being provided in the cooling chamber, the cooling chamber being provided with a second air inlet.
6. The vacuum system of claim 1, wherein the handling mechanism comprises:
the supporting table is used for placing a workpiece;
the horizontal driving unit is connected with the supporting table and used for driving the supporting table to horizontally move;
and the vertical driving unit is connected with the supporting table and is used for driving the supporting table to move vertically.
7. The vacuum system of claim 1, further comprising:
the feeding device is arranged at the inlet of the preheating station;
and the blanking device is arranged at the outlet of the cooling station.
8. The vacuum system of any one of claims 1 to 7, wherein the welding station comprises a third chamber and a second moving device, the first chamber is arranged at the periphery of the second chamber and the third chamber, the second moving device is connected with the third chamber and drives the third chamber to move so that the third chamber and the preheating chamber cooperatively form a second closed space for providing a vacuum environment or a reducing atmosphere environment for welding a workpiece.
9. The vacuum system of claim 8, wherein the welding station further comprises:
the second heating device is arranged in the third chamber;
and the second cooling device is arranged in the third chamber.
10. A method of operating a vacuum system, comprising:
the workpiece enters a preheating station for preheating, and the temperature of the workpiece rises to a preset temperature;
the preheated workpiece enters a reduction station, the second chamber is controlled to descend through a first moving device, a first closed space is formed between the second chamber and the preheating chamber, a vacuum environment is formed by air suction through a first air suction pipeline, or a reducing substance is introduced through a first air inlet pipeline, so that the workpiece is reduced;
the reduced workpiece enters a welding station for welding;
and (5) cooling the welded workpiece in a cooling station.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311416508.5A CN117139941A (en) | 2023-10-30 | 2023-10-30 | Vacuum system and working method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311416508.5A CN117139941A (en) | 2023-10-30 | 2023-10-30 | Vacuum system and working method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117139941A true CN117139941A (en) | 2023-12-01 |
Family
ID=88884778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311416508.5A Pending CN117139941A (en) | 2023-10-30 | 2023-10-30 | Vacuum system and working method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117139941A (en) |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10178268A (en) * | 1996-10-18 | 1998-06-30 | Fuji Electric Co Ltd | Method and device for soldering electronic parts |
| JPH11233934A (en) * | 1998-02-06 | 1999-08-27 | Shinko Seiki Co Ltd | Soldering apparatus |
| CN1387468A (en) * | 1999-11-08 | 2002-12-25 | 平克有限公司 | Method and device for producing soldered joint |
| JP2007000915A (en) * | 2005-06-27 | 2007-01-11 | Shinko Seiki Co Ltd | Soldering method and soldering device |
| JP2008229660A (en) * | 2007-03-20 | 2008-10-02 | Shinko Seiki Co Ltd | Soldering device |
| CN209532328U (en) * | 2019-01-31 | 2019-10-25 | 北京中科同志科技股份有限公司 | A kind of microscope carrier for heating and cooling down |
| JP2019192811A (en) * | 2018-04-26 | 2019-10-31 | 三菱電機株式会社 | Soldering jig, soldering apparatus, and method of manufacturing semiconductor device |
| CN112518166A (en) * | 2021-02-10 | 2021-03-19 | 北京中科同志科技股份有限公司 | Packaging method for chip reliability vacuum packaging welding equipment |
| CN216912581U (en) * | 2021-10-26 | 2022-07-08 | 诚联恺达科技有限公司 | Channel type vacuum welding furnace |
| CN115070150A (en) * | 2022-07-01 | 2022-09-20 | 福导智能科技(苏州)有限公司 | Online three-cavity vacuum welding furnace and vacuum welding process |
| CN115654913A (en) * | 2022-12-28 | 2023-01-31 | 泰姆瑞（北京）精密技术有限公司 | Vacuum furnace lifting device, jig frame and system for continuously packaging semiconductor chips |
| CN115654922A (en) * | 2022-12-28 | 2023-01-31 | 泰姆瑞（北京）精密技术有限公司 | Continuous chip packaging welding vacuum furnace and working method thereof |
| CN219264965U (en) * | 2022-12-28 | 2023-06-27 | 北京中科同志科技股份有限公司 | Transmission positioning device of semiconductor chip continuous packaging vacuum furnace and vacuum furnace system |
| CN116705668A (en) * | 2023-08-02 | 2023-09-05 | 江苏新智达新能源设备有限公司 | Closed encapsulation curing mechanism and encapsulation curing method for formic acid system |
| CN116944616A (en) * | 2023-08-02 | 2023-10-27 | 诚联恺达科技有限公司 | Vacuum welding furnace control method, vacuum welding furnace, terminal equipment and medium |
-
2023
- 2023-10-30 CN CN202311416508.5A patent/CN117139941A/en active Pending
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10178268A (en) * | 1996-10-18 | 1998-06-30 | Fuji Electric Co Ltd | Method and device for soldering electronic parts |
| JPH11233934A (en) * | 1998-02-06 | 1999-08-27 | Shinko Seiki Co Ltd | Soldering apparatus |
| CN1387468A (en) * | 1999-11-08 | 2002-12-25 | 平克有限公司 | Method and device for producing soldered joint |
| JP2007000915A (en) * | 2005-06-27 | 2007-01-11 | Shinko Seiki Co Ltd | Soldering method and soldering device |
| JP2008229660A (en) * | 2007-03-20 | 2008-10-02 | Shinko Seiki Co Ltd | Soldering device |
| JP2019192811A (en) * | 2018-04-26 | 2019-10-31 | 三菱電機株式会社 | Soldering jig, soldering apparatus, and method of manufacturing semiconductor device |
| CN209532328U (en) * | 2019-01-31 | 2019-10-25 | 北京中科同志科技股份有限公司 | A kind of microscope carrier for heating and cooling down |
| CN112518166A (en) * | 2021-02-10 | 2021-03-19 | 北京中科同志科技股份有限公司 | Packaging method for chip reliability vacuum packaging welding equipment |
| CN216912581U (en) * | 2021-10-26 | 2022-07-08 | 诚联恺达科技有限公司 | Channel type vacuum welding furnace |
| CN115070150A (en) * | 2022-07-01 | 2022-09-20 | 福导智能科技(苏州)有限公司 | Online three-cavity vacuum welding furnace and vacuum welding process |
| CN115654913A (en) * | 2022-12-28 | 2023-01-31 | 泰姆瑞（北京）精密技术有限公司 | Vacuum furnace lifting device, jig frame and system for continuously packaging semiconductor chips |
| CN115654922A (en) * | 2022-12-28 | 2023-01-31 | 泰姆瑞（北京）精密技术有限公司 | Continuous chip packaging welding vacuum furnace and working method thereof |
| CN219264965U (en) * | 2022-12-28 | 2023-06-27 | 北京中科同志科技股份有限公司 | Transmission positioning device of semiconductor chip continuous packaging vacuum furnace and vacuum furnace system |
| CN116705668A (en) * | 2023-08-02 | 2023-09-05 | 江苏新智达新能源设备有限公司 | Closed encapsulation curing mechanism and encapsulation curing method for formic acid system |
| CN116944616A (en) * | 2023-08-02 | 2023-10-27 | 诚联恺达科技有限公司 | Vacuum welding furnace control method, vacuum welding furnace, terminal equipment and medium |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7165737B2 (en) | Transfer mechanism of vacuum welding furnace | |
| CN115654922B (en) | Continuous chip packaging and welding vacuum furnace and working method thereof | |
| CN115070150A (en) | Online three-cavity vacuum welding furnace and vacuum welding process | |
| CN115815730A (en) | Vacuum welding equipment for preparing semiconductor laser | |
| US3782705A (en) | Continuously operated vacuum furnace having work part transfer conveyor and load and unload mechanism | |
| CN117139941A (en) | Vacuum system and working method thereof | |
| JP2008007829A (en) | Conveying device of vacuum heat treatment furnace | |
| CN115654913B (en) | Vacuum furnace lifting device, jig frame and system for continuously packaging semiconductor chips | |
| CN210560614U (en) | Quenching type vacuum solid solution furnace | |
| CN216663301U (en) | Semiconductor material annealing device | |
| CN117020567B (en) | Online hot-pressing crimping equipment with reduction function | |
| CN212293691U (en) | Horizontal cylindrical furnace | |
| JP2001108375A (en) | Apparatus for vacuum heat treatment | |
| CN117080132B (en) | Online hot pressing equipment with vacuum function | |
| CN210548673U (en) | Heating furnace | |
| CN111850282A (en) | Horizontal cylindrical furnace | |
| KR100691851B1 (en) | Vacuum absorption device for transferring hot plate | |
| CN111219978A (en) | Transfer device and drying equipment | |
| CN113410109A (en) | Cathode assembly integrated process line | |
| CN111668143A (en) | Substrate storage device | |
| CN218224993U (en) | Vacuum welding furnace | |
| KR100808820B1 (en) | Vacuum treatment device | |
| CN215216822U (en) | Process chamber and wafer cooling equipment | |
| CN213318198U (en) | Automatic vacuum anaerobic tunnel furnace | |
| CN116532743A (en) | Substrate heat treatment device and method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |