CN219264965U - Transmission positioning device of semiconductor chip continuous packaging vacuum furnace and vacuum furnace system - Google Patents
Transmission positioning device of semiconductor chip continuous packaging vacuum furnace and vacuum furnace system Download PDFInfo
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- CN219264965U CN219264965U CN202223510015.1U CN202223510015U CN219264965U CN 219264965 U CN219264965 U CN 219264965U CN 202223510015 U CN202223510015 U CN 202223510015U CN 219264965 U CN219264965 U CN 219264965U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The utility model relates to the technical field of semiconductor chip packaging, and provides a transmission positioning device of a semiconductor chip continuous packaging vacuum furnace and a vacuum furnace system. The transmission positioning device comprises: the stop gear, stop gear locates the joint portion of two adjacent cavities of vacuum furnace, and it includes: a telescopic part which can be telescopically inserted into the vacuum furnace; the blocking part is connected with the telescopic part and used for limiting the conveyed objects; the positioning mechanism is arranged on the outer side of the cavity of the vacuum furnace and faces the joint part of two adjacent cavities of the vacuum furnace and is used for detecting conveyed objects in place. The utility model adopts the external form of the positioning mechanism, does not need to reserve an installation position in the cavity, reduces the inner space and the whole size of the cavity, reduces the vacuumizing difficulty, saves materials and reduces the cost; the influence of the high-temperature environment in the cavity on the positioning mechanism is reduced; the sensor wire is not required to be sealed, so that the cavity sealing difficulty is reduced; the limit mechanism is convenient to install.
Description
Technical Field
The utility model relates to the technical field of chip packaging, in particular to a transmission positioning device of a semiconductor chip continuous packaging vacuum furnace and a vacuum furnace system.
Background
The existing vacuum packaging equipment transmission positioning device mostly adopts a stepping transmission structure; or continuously transmitting by adopting a chain, arranging the positioning sensor in the cavity of the equipment, and the like. The step-by-step transmission structure of the vacuum furnace is arranged to be horizontally transmitted and needs to be matched with the lifting mechanism to operate, so that the packaging piece can move forwards for a fixed distance each time. The vacuum furnace is continuously transported, and a positioning sensor is arranged in the cavity of the equipment to control the transport distance.
The vacuum furnace transmission structure can only realize the positioning of the workpiece in the welding cavity through the induction sensor, and if the workpiece is heavy or light, the positioning is inaccurate due to too large inertia or too small friction force. Some products need to place the positioning sensor in the equipment cavity, and it is great that it receives high temperature environment to influence, leads to measuring the precision to descend, can increase the vacuum seal degree of difficulty simultaneously.
Disclosure of Invention
The utility model provides a transmission positioning device and a vacuum furnace system of a semiconductor chip continuous packaging vacuum furnace, which are used for solving the defects that in the prior art, a stepping transmission structure or a chain transmission structure of the vacuum furnace is inaccurate in positioning due to the weight of a workpiece, a positioning sensor is affected by temperature to reduce the measurement accuracy and increase the vacuum sealing difficulty.
The utility model provides a transmission positioning device of a semiconductor chip continuous packaging vacuum furnace, which comprises:
the stop gear, stop gear locates the junction of two adjacent cavities of semiconductor chip continuous encapsulation vacuum furnace, stop gear includes:
the telescopic part can be inserted into the semiconductor chip continuous packaging vacuum furnace in a telescopic way;
the blocking part is connected with the telescopic part and used for limiting conveyed objects;
the positioning mechanism is arranged at the outer side of the cavity of the semiconductor chip continuous packaging vacuum furnace and faces the joint part of two adjacent cavities of the semiconductor chip continuous packaging vacuum furnace, and is used for detecting the conveyed objects in place.
According to the transmission positioning device of the semiconductor chip continuous packaging vacuum furnace provided by the utility model, the telescopic part comprises:
a driving unit;
the telescopic link, the one end of telescopic link with drive unit's drive end is connected, the other end of telescopic link with the blocking portion is connected.
According to the transmission positioning device of the semiconductor chip continuous packaging vacuum furnace, which is provided by the utility model, the limiting mechanism further comprises: the elastic sealing device is sleeved on the outer side of the telescopic rod along the axial direction of the telescopic rod.
According to the transmission positioning device of the semiconductor chip continuous packaging vacuum furnace, the blocking part comprises any one of a blocking block, a blocking plate and a blocking strip.
According to the transmission positioning device of the semiconductor chip continuous packaging vacuum furnace, the limiting mechanisms are symmetrically arranged on two sides of the semiconductor chip continuous packaging vacuum furnace.
According to the transmission positioning device of the semiconductor chip continuous packaging vacuum furnace, which is provided by the utility model, the positioning mechanism comprises an induction sensor.
The utility model provides a transmission positioning device of a semiconductor chip continuous packaging vacuum furnace, which further comprises: and the observation window is arranged at the joint part of the two adjacent chambers, and the positioning mechanism is correspondingly arranged with the observation window.
The utility model provides a transmission positioning device of a semiconductor chip continuous packaging vacuum furnace, which further comprises: and the sealing ring is arranged between the combining part of the observation window and the cavity.
The utility model provides a transmission positioning device of a semiconductor chip continuous packaging vacuum furnace, which further comprises: and the pressing piece is arranged on the outer side of the combining part of the cavity and is tightly pressed and arranged on the observation window.
The utility model also provides a semiconductor chip continuous packaging vacuum furnace system, which comprises: the transmission positioning device of the semiconductor chip continuous packaging vacuum furnace provided by the embodiment of the utility model.
According to the transmission positioning device and the vacuum furnace system of the semiconductor chip continuous packaging vacuum furnace, whether the conveyed objects are conveyed in place or not is monitored by the positioning mechanism, the conveyed objects are limited by the limiting mechanism, the conveyed objects are intercepted from continuously advancing, and accurate conveying of the conveyed objects in place is guaranteed. According to the transmission positioning device and the vacuum furnace system of the semiconductor chip continuous packaging vacuum furnace, provided by the utility model, the external form of the positioning mechanism is adopted, the installation position is not required to be reserved in the cavity, the inner space of the cavity is greatly reduced, the vacuumizing difficulty is reduced, the overall size of the cavity is also reduced, the materials are saved, and the cost is reduced; the influence of the high-temperature environment in the cavity on the positioning mechanism is reduced; the sensor wire is not required to be sealed, so that the cavity sealing difficulty is reduced; the limit mechanism is convenient to install.
Drawings
In order to more clearly illustrate the utility model or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a limiting mechanism according to the present utility model;
FIG. 2 is a schematic view of a positioning mechanism according to the present utility model;
FIG. 3 is a cross-sectional view of the spacing mechanism provided by the present utility model disposed on both sides of a chamber;
fig. 4 is a top view of a semiconductor chip continuous package vacuum furnace system provided by the present utility model;
fig. 5 is a front view of a semiconductor chip continuous package vacuum furnace system provided by the present utility model.
Reference numerals:
10: a vacuum furnace system for continuously packaging the semiconductor chips; 11: preheating the chamber; 12: a heating chamber; 13: a cooling chamber; 14: an inlet waiting zone; 15: an outlet to-be-transferred area;
100: a limiting mechanism; 101: a driving unit; 102: a telescopic rod; 103: an elastic sealing device; 104: a blocking portion;
200: a positioning mechanism; 201: an observation window; 202: a seal ring; 203: tabletting.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The following describes a transfer positioning device of a semiconductor chip continuous packaging vacuum furnace according to the present utility model with reference to fig. 1 to 5. The transmission positioning device of the semiconductor chip continuous packaging vacuum furnace comprises: a spacing mechanism 100 and a positioning mechanism 200.
Wherein, stop gear 100 locates the joint portion of two adjacent cavities of semiconductor chip continuous encapsulation vacuum furnace, stop gear 100 includes: telescoping portion and blocking portion 104. The telescopic part can be inserted into the semiconductor chip continuous packaging vacuum furnace in a telescopic way; the blocking part 104 is connected with the telescopic part, and the blocking part 104 is used for limiting the conveyed object and intercepting the conveyed object to continuously advance. The positioning mechanism 200 is arranged outside the chamber of the semiconductor chip continuous packaging vacuum furnace and faces the joint part of two adjacent chambers of the semiconductor chip continuous packaging vacuum furnace, and is used for detecting the conveyed objects in place.
Specifically, the positioning mechanism 200 and the limiting mechanism 100 are respectively disposed at the joint of two adjacent chambers of the vacuum furnace for continuously packaging semiconductor chips. The positioning mechanism 200 is used for monitoring whether a conveying object (the conveying object in the embodiment is a jig tray, on which a jig is mounted, and can be used for continuous packaging operation of a chip) is conveyed in place; when the fact that the conveying objects are conveyed in place is monitored, the positioning mechanism 200 feeds signals back to the working condition machine, the working condition machine sends instructions to the conveying unit to stop conveying immediately or stop conveying after a few seconds, so that the jig tray stops at a required working position, meanwhile, the telescopic part extends out of the semiconductor chip continuously packaging vacuum furnace and drives the blocking part 104 to intercept in front of the conveying objects, and the conveying objects are prevented from moving beyond the position of the blocking part. When the processing of the conveyed object is completed, the telescopic part drives the blocking part 104 to retract so as to avoid the travelling route of the conveyed object, and the working condition machine sends an instruction to the conveying unit to continue conveying the conveyed object to the next working procedure.
Further, the positioning mechanism 200 includes an inductive sensor, such as: any one of an correlation sensor, a diffuse reflection sensor and a proximity sensor detects whether a conveyed object is moved in place by the sensor. Taking the correlation sensor as an example, the transmitting end and the receiving end of the correlation sensor are respectively positioned at two sides of the cavity, when the conveyed object moves in place, the transmitting end of the correlation sensor transmits infrared light to pass through two layers of high-transmittance glass to be received by the receiving end at the other end, and a signal of the in-place jig tray is fed back to the industrial personal computer.
According to the transmission positioning device of the continuous packaging vacuum furnace for the semiconductor chips, provided by the utility model, whether the conveyed objects are conveyed in place is monitored by the positioning mechanism 200, the conveyed objects are limited by the limiting mechanism 100, the conveyed objects are intercepted from continuously advancing, and the conveyed objects are ensured to be accurately conveyed in place. The transmission positioning device of the semiconductor chip continuous packaging vacuum furnace provided by the utility model adopts the external form of the positioning mechanism 200, and a mounting position is not required to be reserved in the cavity, so that the inner space of the cavity is greatly reduced, the vacuumizing difficulty is reduced, the overall size of the cavity is also reduced, the materials are saved, and the cost is reduced; the influence of the high-temperature environment in the cavity on the positioning mechanism 200 is reduced; the sensor wire is not required to be sealed, so that the cavity sealing difficulty is reduced; the spacing mechanism 100 is convenient to install.
In one embodiment of the present utility model, the telescoping portion includes: a drive unit 101 and a telescopic rod 102. One end of the telescopic rod 102 is connected to the driving end of the driving unit 101, and the other end of the telescopic rod 102 is connected to the blocking portion 104. Further, the driving unit 101 adopts an air pump, a motor or a hydraulic driver, etc., which can drive the blocking portion 104 to perform telescopic movement, and when the blocking object stretches out, the blocking object can limit the jig tray, and the blocking object is blocked from moving continuously.
In one embodiment of the present utility model, the limiting mechanism 100 further comprises: and the elastic sealing device 103 is sleeved outside the telescopic rod 102 along the axial direction of the telescopic rod 102 by the elastic sealing device 103. Specifically, one end of the elastic sealing device 103 is fixed to the driving end of the driving unit 101, which has the advantages of pressure resistance, temperature resistance, corrosion resistance, and the like. Preferably, the elastic sealing device 103 may be a welded bellows.
In one embodiment of the present utility model, the blocking portion 104 includes any one of a blocking piece, a blocking plate, and a blocking bar. Specifically, the blocking portion 104 is mounted at an end of the telescopic rod 102, and moves with the telescopic rod 102, and the blocking portion 104 is used for blocking movement of a conveying object and plays a limiting role. It should be appreciated that other forms of the barrier 104 may be employed for the barrier 104 depending on the circumstances.
In one embodiment of the present utility model, the limiting mechanisms 100 are symmetrically disposed at both sides of the semiconductor chip continuous encapsulation vacuum furnace. In this embodiment, the limiting mechanisms 100 on both sides simultaneously move in a telescopic manner, so that when the telescopic rod 102 extends, the two blocking portions 104 can correspondingly abut against each other, thereby blocking the jig pallet from moving continuously.
In one embodiment of the present utility model, the transport positioning device of the continuous packaging vacuum furnace for semiconductor chips further comprises: the observation window 201, the observation window 201 is provided at the joint portion of two adjacent chambers, and the positioning mechanism 200 is provided corresponding to the observation window 201. Further, the viewing window 201 is made of high-transmittance glass, and the sensor of the positioning mechanism 200 can monitor whether the tray jig in the chamber moves in place or not through the viewing window 201. Specifically, the observation window 201 is mounted on a side wall of the joint of the two chambers, and the positioning mechanism 200 is disposed toward the observation window 201.
In one embodiment of the present utility model, the transport positioning device of the continuous packaging vacuum furnace for semiconductor chips further comprises: and a seal ring 202, wherein the seal ring 202 is arranged between the joint part of the observation window 201 and the chamber. Specifically, the seal ring 202 is disposed between the observation window 201 and the side wall of the chamber, enhancing the sealing effect of the chamber.
In one embodiment of the present utility model, the transport positioning device of the continuous packaging vacuum furnace for semiconductor chips further comprises: the pressing piece 203, the pressing piece 203 is arranged outside the combining part of the chamber and is pressed and arranged on the observation window 201. Specifically, the pressing piece 203 is a glass pressing piece, the observation window 201 is pressed on the joint part of the cavity through the glass pressing piece, and the sealing effect of the cavity is improved by utilizing the cooperation of the pressing piece 203 and the sealing ring 202.
The utility model also provides a semiconductor chip continuous packaging vacuum furnace system 10. The semiconductor chip continuous encapsulation vacuum furnace system 10 includes: the transmission positioning device of the semiconductor chip continuous packaging vacuum furnace in the embodiment.
Specifically, the conveying and positioning device of the vacuum furnace in the above embodiment is applicable to a vacuum furnace for continuously packaging chips, and the vacuum furnace includes: a plurality of first vacuum chambers and a plurality of second vacuum chambers. Wherein the plurality of first vacuum chambers are sequentially arranged along the direction of the operation flow; the second vacuum chamber covers the outer sides of the first vacuum chambers and is used for keeping the vacuum state of the environment where the workpiece is located when the workpiece flows in the first vacuum chambers.
Specifically, a plurality of first vacuum chambers may be provided according to the working procedure, and the continuous welding process of the chip package is taken as an example, and at least includes three steps of preheating, welding and cooling, so that three first vacuum chambers, that is, the preheating chamber 11, the heating chamber 12 and the cooling chamber 13, are correspondingly provided in sequence, and the three chambers are provided along the sequence of the working procedure of the workpiece. The second vacuum cavity size can include a plurality of first vacuum cavities, and the periphery of a plurality of first vacuum cavities is covered by the second vacuum cavity size, when workpieces need to circulate among different first vacuum cavities, the sealing door of the first vacuum cavities needs to be opened to enable the workpieces to pass through, and at the moment, the vacuum environment of the second vacuum cavity can ensure that the workpieces also carry out under vacuum conditions when circulating.
Further, the second vacuum cavity is a large vacuum cavity covered outside the first vacuum cavity, when the sealing door of the first vacuum cavity is opened, the second vacuum cavity is kept closed, so that the vacuum environment in the second vacuum cavity is ensured, and when workpieces circulate in different first vacuum cavities, the inside of the second vacuum cavity is in a vacuum state, so that the workpieces are always in a vacuum state; when the workpiece enters from the inlet of the second vacuum cavity, the second vacuum cavity is opened, the first vacuum cavity is in a closed state, the vacuum environment in the first vacuum cavity is kept, the workpiece is closed after entering the second vacuum cavity, and the interior of the second vacuum cavity is vacuumized by utilizing the vacuumizing device until the interior of the second vacuum cavity reaches a set vacuum degree. Further, the second vacuum chamber further comprises an inlet waiting zone 14 and an outlet waiting zone 15, wherein the inlet waiting zone 14 is arranged at the inlet end of the preheating chamber 11; the outlet transition zone 15 is provided at the outlet end of the cooling chamber 13.
In summary, the present embodiment specifically provides a vacuum furnace system 10 for continuously packaging semiconductor chips, which can employ the conveying and positioning device of the vacuum furnace in the above embodiment, and has the same advantages as above.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.
Claims (10)
1. The utility model provides a transmission positioner of semiconductor chip continuous packaging vacuum furnace which characterized in that includes:
the stop gear, stop gear locates the junction of two adjacent cavities of semiconductor chip continuous encapsulation vacuum furnace, stop gear includes:
the telescopic part can be inserted into the semiconductor chip continuous packaging vacuum furnace in a telescopic way;
the blocking part is connected with the telescopic part and used for limiting conveyed objects;
the positioning mechanism is arranged at the outer side of the cavity of the semiconductor chip continuous packaging vacuum furnace and faces the joint part of two adjacent cavities of the semiconductor chip continuous packaging vacuum furnace, and is used for detecting the conveyed objects in place.
2. The transport positioning device of a semiconductor chip continuous encapsulation vacuum furnace according to claim 1, wherein the expansion and contraction part comprises:
a driving unit;
the telescopic link, the one end of telescopic link with drive unit's drive end is connected, the other end of telescopic link with the blocking portion is connected.
3. The transport positioning device of a semiconductor chip continuous packaging vacuum furnace according to claim 2, wherein the limiting mechanism further comprises: the elastic sealing device is sleeved on the outer side of the telescopic rod along the axial direction of the telescopic rod.
4. The transport positioning device of a vacuum furnace for continuously packaging semiconductor chips as recited in claim 1, wherein the blocking portion comprises any one of a blocking piece, a blocking plate, and a blocking strip.
5. The transport positioning device of a semiconductor chip continuous packaging vacuum furnace according to any one of claims 1 to 4, wherein the limit mechanisms are symmetrically arranged at both sides of the semiconductor chip continuous packaging vacuum furnace.
6. The transport positioning device of a semiconductor chip continuous package vacuum furnace according to claim 1, wherein the positioning mechanism comprises an inductive sensor.
7. The transport positioning device of a semiconductor chip continuous package vacuum furnace according to claim 1, further comprising: and the observation window is arranged at the joint part of the two adjacent chambers, and the positioning mechanism is correspondingly arranged with the observation window.
8. The transport positioning device of a semiconductor chip continuous package vacuum furnace according to claim 7, further comprising: and the sealing ring is arranged between the combining part of the observation window and the cavity.
9. The transport positioning device of a semiconductor chip continuous package vacuum furnace according to claim 7, further comprising: and the pressing piece is arranged on the outer side of the combining part of the cavity and is tightly pressed and arranged on the observation window.
10. A semiconductor chip continuous encapsulation vacuum furnace system, comprising: a transport positioning device of a semiconductor chip continuous encapsulation vacuum furnace according to any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223510015.1U CN219264965U (en) | 2022-12-28 | 2022-12-28 | Transmission positioning device of semiconductor chip continuous packaging vacuum furnace and vacuum furnace system |
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| CN202223510015.1U CN219264965U (en) | 2022-12-28 | 2022-12-28 | Transmission positioning device of semiconductor chip continuous packaging vacuum furnace and vacuum furnace system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117139941A (en) * | 2023-10-30 | 2023-12-01 | 北京中科同志科技股份有限公司 | Vacuum system and working method thereof |
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- 2022-12-28 CN CN202223510015.1U patent/CN219264965U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117139941A (en) * | 2023-10-30 | 2023-12-01 | 北京中科同志科技股份有限公司 | Vacuum system and working method thereof |
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