JP2019192811A - Soldering jig, soldering apparatus, and method of manufacturing semiconductor device - Google Patents

Abstract

To provide a soldering jig that enables a soldering process to be performed with improved productivity.SOLUTION: A soldering jig 50 includes: a support member 51; a pressing member 70; and a first movable part 60. The pressing member 70 is configured to press a workpiece toward the support member 51. The pressing member 70 is movably attached to the support member 51. The first movable part 60 is configured to move the pressing member 70.SELECTED DRAWING: Figure 23

Description

  The present invention relates to a soldering jig, a soldering apparatus, and a method for manufacturing a semiconductor device.

  Japanese Patent Laid-Open No. 9-107177 (Patent Document 1) discloses a soldering jig unit. The soldering jig unit includes a first flexible thin plate jig, a second flexible thin plate jig, and a cassette-shaped jig.

JP-A-9-107177

  However, in the soldering jig unit described in Patent Document 1, the first flexible thin plate jig and the second flexible board are soldered before the soldering surface of the solder adherend is soldered. It is necessary to assemble a soldering jig unit for holding a solder adherend using a thin plate jig and a cassette-shaped jig. After soldering the soldering surface of the solder adherend, the soldering jig unit needs to be disassembled in order to remove the solder adherend from the soldering jig unit. Therefore, in the soldering jig unit described in Patent Document 1, it is difficult to efficiently perform the soldering process. An object of the present invention is to provide a soldering jig, a soldering apparatus, and a method for manufacturing a semiconductor device that enable a soldering process to be performed with improved productivity.

  The soldering jig of the present invention includes a support member, a pressing member, and a first movable part. The support member includes a first main surface and is configured to support the workpiece on the first main surface. The pressing member includes a second main surface facing the first main surface, and a third main surface opposite to the second main surface. The pressing member is configured to press a workpiece disposed between the first main surface and the second main surface toward the support member. The pressing member is attached to the support member so as to be movable in the first direction and the second direction. The first direction is a direction in which the pressing member approaches the first main surface. The second direction is a direction in which the pressing member moves away from the first main surface. The first movable portion is configured to move the pressing member in the first direction and the second direction.

The soldering apparatus of the present invention includes the soldering jig of the present invention.
The method of manufacturing a semiconductor device of the present invention includes setting a workpiece on the soldering jig of the present invention, placing a solder and a component on the workpiece, soldering the component to the workpiece, and a component. And taking out the work joined by soldering from the soldering jig. In the method for manufacturing a semiconductor device of the present invention, it is not necessary to disassemble the soldering jig when the workpiece is detached from the soldering jig. The semiconductor device manufacturing method of the present invention enables the soldering process to be performed with improved productivity.

  In the soldering jig of the present invention, the pressing member is attached to the support member so as to be movable in the first direction and the second direction. Therefore, when the workpiece is detached from the soldering jig, the soldering jig is used. There is no need to disassemble the tool. The soldering jig of the present invention enables the soldering process to be performed with improved productivity. Similarly, the soldering apparatus of the present invention and the method of manufacturing a semiconductor device of the present invention enable the soldering process to be performed with improved productivity.

It is a block diagram of the soldering apparatus of an embodiment. It is a schematic sectional drawing of the semiconductor device of embodiment. It is a schematic plan view of the component supply part contained in the soldering apparatus of embodiment. It is a schematic side view of the component supply part contained in the soldering apparatus of embodiment. It is a schematic plan view of the soldering part contained in the soldering apparatus of embodiment. It is a schematic sectional drawing of the soldering part contained in the soldering apparatus of embodiment. It is a schematic plan view of the soldering jig attaching / detaching part included in the soldering apparatus of the embodiment. It is a schematic sectional drawing in the sectional line VIII-VIII of FIG. 7 of the soldering jig attachment / detachment part contained in the soldering apparatus of embodiment. It is a schematic sectional drawing in the sectional line IX-IX of FIG. 7 of the soldering jig attachment / detachment part contained in the soldering apparatus of embodiment. It is a schematic plan view of the soldering jig of the embodiment. It is a schematic sectional drawing in the sectional line XI-XI of FIG. 10 of the soldering jig of embodiment. It is a schematic sectional drawing in the sectional line XII-XII of FIG. 10 of the soldering jig of embodiment. It is a schematic sectional drawing in the sectional line XIII-XIII of FIG. 10 of the soldering jig of embodiment. It is a schematic sectional drawing in the sectional line XIV-XIV of FIG. 10 of the soldering jig of embodiment. It is a figure which shows the flowchart of the manufacturing method of the semiconductor device of embodiment. It is a schematic plan view which shows 1 process of the manufacturing method of the semiconductor device of embodiment. FIG. 17 is a schematic cross sectional view taken along a cross sectional line XVII-XVII in the process shown in FIG. 16 in the method for manufacturing a semiconductor device of the embodiment. FIG. 17 is a schematic plan view showing a step subsequent to the step shown in FIG. 16 in the method for manufacturing the semiconductor device of the embodiment. FIG. 19 is a schematic cross sectional view taken along a cross sectional line XIX-XIX of the process shown in FIG. 18 in the method for manufacturing a semiconductor device of the embodiment. FIG. 19 is a schematic plan view showing a step subsequent to the step shown in FIG. 18 in the method for manufacturing a semiconductor device of the embodiment. FIG. 21 is a schematic cross sectional view taken along a cross sectional line XXI-XXI in the process shown in FIG. 20 in the method for manufacturing a semiconductor device of the embodiment. FIG. 21 is a schematic plan view showing a step subsequent to the step shown in FIG. 20 in the method for manufacturing a semiconductor device of the embodiment. FIG. 23 is a schematic cross sectional view taken along a cross sectional line XXIII-XXIII in the process shown in FIG. 22 in the method for manufacturing a semiconductor device of the embodiment. It is a schematic plan view which shows 1 process of the manufacturing method of the semiconductor device of embodiment. FIG. 25 is a schematic cross sectional view taken along a cross sectional line XXV-XXV in the process shown in FIG. 24 in the method for manufacturing a semiconductor device of the embodiment. FIG. 25 is a schematic plan view showing a step subsequent to the step shown in FIG. 24 in the method for manufacturing a semiconductor device of the embodiment. FIG. 27 is a schematic cross sectional view taken along a cross sectional line XXVII-XXVII in the process shown in FIG. 26 in the method for manufacturing a semiconductor device of the embodiment. FIG. 27 is a schematic plan view showing a step subsequent to the step shown in FIG. 26 in the method for manufacturing a semiconductor device of the embodiment. FIG. 29 is a schematic cross sectional view taken along a cross sectional line XXIX-XXIX of the process shown in FIG. 28 in the method for manufacturing a semiconductor device of the embodiment. FIG. 29 is a schematic cross-sectional view showing a step subsequent to the step shown in FIG. 28 in the method for manufacturing a semiconductor device of the embodiment. FIG. 31 is a schematic plan view showing a step subsequent to the step shown in FIG. 30 in the method for manufacturing a semiconductor device of the embodiment. FIG. 32 is a schematic cross sectional view taken along a cross sectional line XXXII-XXXII of the step shown in FIG. 31 in the method for manufacturing a semiconductor device of the embodiment. It is a schematic sectional drawing which shows the soldering jig | tool of the 1st modification of embodiment. It is a schematic sectional drawing which shows the soldering jig of the 2nd modification of embodiment.

  Embodiments of the present invention will be described below. The same components are denoted by the same reference numerals, and description thereof will not be repeated.

  A soldering apparatus 1 according to an embodiment will be described with reference to FIGS. 1 and 3 to 9. The soldering apparatus 1 is used in the method for manufacturing the semiconductor device 2 shown in FIG. As shown in FIG. 1, the soldering apparatus 1 includes a component supply unit 3, a soldering unit 5, a soldering jig attaching / detaching unit 7, a soldering jig 50, a conveyor 15, and a control unit 8. Is mainly provided. The soldering apparatus 1 may further include a display unit 8b.

  As shown in FIG. 2, the semiconductor device 2 includes a workpiece, a component 82, and a sealing member 83. The semiconductor device 2 is not particularly limited, but may be a power semiconductor module. In the present embodiment, the work is a lead frame 80 formed of a metal such as copper or aluminum. The component 82 is soldered onto the lead frame 80 by a solder joint portion 81. The component 82 is, for example, at least one of a power semiconductor element such as an insulated gate bipolar transistor (IGBT), a semiconductor element such as a diode chip, a passive electronic component such as a thermistor, a shunt resistor or a capacitor, and a temperature sensor. It is. The sealing member 83 seals the component 82. The sealing member 83 has electrical insulation. The sealing member 83 may be formed of a mold resin. The sealing member 83 may be made of, for example, an epoxy resin.

  As shown in FIGS. 3 and 4, the component supply unit 3 includes a base 10, a tray 11, a solder supply unit 13, a drive unit 17, and a head 18. The tray 11 is disposed on the base 10. The parts 82 are stored in the tray 11 for each type. The solder supply unit 13 is disposed on the base 10. The solder supply unit 13 may be configured to supply a solder plate. Specifically, the solder supply unit 13 includes a reel (not shown) around which the solder tape is wound, and a cutter (not shown) that cuts the solder tape. The solder supply unit 13 cuts the solder tape supplied from the reel with a cutter and supplies a solder plate. The solder plate may be made of lead-free solder, for example.

  The drive unit 17 is disposed above the base 10. The drive unit 17 includes a first rail 17a and a second rail 17b. The first rail 17a extends in the x direction. The second rail 17b extends in the y direction perpendicular to the x direction. The drive unit 17 is configured to move the head 18 along the first rail 17a and the second rail 17b. The head 18 is provided with a suction nozzle 18a. The suction nozzle 18 a is configured to move in the z direction perpendicular to the x direction and the y direction with respect to the head 18.

  A conveyor 15 is provided on the base 10. The conveyor 15 conveys the soldering jig 50 on which the lead frame 80 is set between the component supply unit 3, the soldering unit 5, and the soldering jig attaching / detaching unit 7.

  As shown in FIGS. 5 and 6, the soldering part 5 includes a preheating chamber 20, a main heating chamber 21, and a cooling chamber 22. The conveyor 15 conveys the soldering jig 50 in which the lead frame 80 is set over the preheating chamber 20, the main heating chamber 21, and the cooling chamber 22. A shutter 28 is disposed at the conveyance inlet of the preheating chamber 20, and a shutter 28 a is disposed at the conveyance outlet of the preheating chamber 20. A shutter 28 a is arranged at the conveyance inlet of the main heating chamber 21, and a shutter 28 b is arranged at the conveyance outlet of the main heating chamber 21. A shutter 28 b is disposed at the conveyance inlet of the cooling chamber 22, and a shutter 28 c is disposed at the conveyance outlet of the cooling chamber 22. The preheating chamber 20 and the main heating chamber 21 are partitioned by a shutter 28a. The main heating chamber 21 and the cooling chamber 22 are partitioned by a shutter 28b.

  A vacuum pump 25 a is connected to the preheating chamber 20. The vacuum pump 25a enables the inside of the preheating chamber 20 to be in a reduced pressure atmosphere. A vacuum pump 25 b is connected to the main heating chamber 21. The vacuum pump 25b enables the inside of the main heating chamber 21 to be in a reduced pressure atmosphere. A vacuum pump 25 c is connected to the cooling chamber 22. The vacuum pump 25c enables the inside of the cooling chamber 22 to be in a reduced pressure atmosphere. The reduced pressure atmosphere in the preheating chamber 20, the main heating chamber 21, and the cooling chamber 22 suppresses the generation of voids in the solder joints 81.

  An inert gas such as nitrogen gas, or a reducing agent such as hydrogen gas or formic acid gas may be introduced into the preheating chamber 20. A heat plate 23 a is disposed in the preheating chamber 20. The heat plate 23a can move in the preheating chamber 20 in the z direction. The heat plate 23a contacts the soldering jig 50 on which the lead frame 80 is set, and heats the lead frame 80, the component 82, and the solder. An infrared heater 24 a is arranged in the preheating chamber 20. Infrared rays emitted from the infrared heater 24a heat the lead frame 80, the component 82 and the solder. It is sufficient that at least one of the heat plate 23a and the infrared heater 24a is provided in the preheating chamber 20.

  An inert gas such as nitrogen gas or a reducing agent such as hydrogen gas or formic acid gas can be introduced into the heating chamber 21. A heat plate 23 b is disposed in the main heating chamber 21. The heat plate 23b can move in the main heating chamber 21 in the z direction. The heat plate 23b contacts the soldering jig 50 on which the lead frame 80 is set, and heats the lead frame 80, the component 82, and the solder. An infrared heater 24 b is disposed in the main heating chamber 21. Infrared rays emitted from the infrared heater 24b heat the lead frame 80, the component 82 and the solder. In the main heating chamber 21, at least one of the heat plate 23b and the infrared heater 24b may be provided.

  An inert gas such as nitrogen gas may be introduced into the cooling chamber 22. A cooling plate 26 is disposed in the cooling chamber 22. The cooling plate 26 can move in the cooling chamber 22 in the z direction. The cooling plate 26 contacts the soldering jig 50 on which the lead frame 80 is set, and cools the lead frame 80, the component 82, and the solder joint portion 81. A coolant such as antifreeze and pure water may be circulated inside the cooling plate 26. A cooling gas spray unit (not shown) may be disposed in the cooling chamber 22 instead of the cooling plate 26 or together with the cooling plate 26. The cooling gas spraying unit sprays an inert gas such as nitrogen gas to the lead frame 80, the component 82, and the solder joint 81.

  As shown in FIG. 7 to FIG. 9, the soldering jig attaching / detaching unit 7 includes the transport table 30, the transport unit 34, the housing 35, the first magazine 36, the second magazine 37, the first transport belt 39, and the second. The conveyor belt 40, the raising / lowering part 42, the 1st conveyance part 45, and the 2nd conveyance part 46 are provided. The soldering jig attaching / detaching unit 7 may further include a third magazine 38, a third conveying belt 41, and third conveying units 47, 47b. The soldering jig attaching / detaching part 7 may further include a first gas spraying part 48 and a second gas spraying part 49.

  The transport unit 34 is provided on the upper surface of the housing 35. The conveyance unit 34 moves the conveyance table 30 in the soldering jig attaching / detaching unit 7. The soldering jig 50 on which the lead frame 80 is set is transferred between the transport table 30 and the conveyor 15. The housing 35 accommodates a first magazine 36, a second magazine 37, a first transport belt 39 and a second transport belt 40.

  The first magazine 36 accommodates a lead frame 80 to which the component 82 is not soldered. The first conveyor belt 39 and the elevating unit 42 move the first magazine 36 housed in the housing 35 to a position facing the conveyor table 30 that holds the soldering jig 50. The first transport unit 45 pushes the lead frame 80 from the first magazine 36 to the soldering jig 50. When all the lead frames 80 in the first magazine 36 are lost, the empty first magazine 36 is carried outside the soldering jig attaching / detaching portion 7.

  The second magazine 37 accommodates the lead frame 80 to which the component 82 is soldered. The second conveyor belt 40 and the elevating unit 42 move the empty second magazine 37 accommodated in the housing 35 to a position facing the conveyor table 30 that holds the soldering jig 50. The second transport unit 46 pulls out the lead frame 80 to which the component 82 is solder-joined from the soldering jig 50 and stores it in the second magazine 37. When the second magazine 37 is filled with the lead frame 80 to which the component 82 is soldered, the second magazine 37 is carried to the outside of the soldering jig attaching / detaching portion 7.

  The third magazine 38 temporarily stores the soldering jig 50 in which the lead frame 80 to which the component 82 is not soldered is set. The third conveyor belt 41 and the elevating part 42 move the third magazine 38 accommodated in the housing 35 to a position facing the conveyor table 30 that holds the soldering jig 50. The third transport unit 47 b pushes the soldering jig 50 on which the lead frame 80 is set from the transport base 30 to the third magazine 38 and accommodates it in the third magazine 38. The third transport unit 47 pushes the soldering jig 50 on which the lead frame 80 is set from the third magazine 38 to the transport table 30.

  The first gas spray unit 48 is configured to spray an inert gas such as nitrogen gas and ions to the first position. When the soldering jig 50 is in the first position, the soldering jig 50 faces the first transport part 45. The second gas spray unit 49 is configured to spray an inert gas such as nitrogen gas and ions to the second position. When the soldering jig 50 is in the second position, the soldering jig 50 faces the second transport part 46.

  As shown in FIGS. 16 to 19, the transport table 30 includes a placement portion 31 on which the soldering jig 50 is placed. The placement portion 31 includes a main surface 31m on which the soldering jig 50 is placed. The transport table 30 may include a groove 33. The groove 33 accommodates a solder ball generated when the component 82 is soldered to the lead frame 80.

  The soldering apparatus 1 further includes a second movable portion 32 that drives the first movable portion 60 of the soldering jig 50. The second movable part 32 may be a part of the transport table 30 on which the soldering jig 50 is placed. The transport table 30 may further include a second movable part 32. Since the 2nd movable part 32 is a part of the conveyance stand 30, the soldering apparatus 1 can be reduced in size. The second movable part 32 is configured to move or rotate with respect to the placement part 31. The second movable unit 32 may move or rotate with respect to the placement unit 31 using, for example, a pneumatic actuator.

  Specifically, the second movable portion 32 is configured to rotate around a third shaft 31 r fixed to the placement portion 31. The second movable portion 32 may have a shape bent into an L shape. Specifically, the second movable portion 32 includes a first portion 32a and a second portion 32b connected to the first portion 32a. The first portion 32a is rotatably connected to the third shaft 31r, and is rotatably connected to the placement portion 31. As shown in FIGS. 18 and 19, the second movable part 32 can press the second end 65 of the first movable part 60. The second movable part 32 presses the top of the wall part 52 of the support member 51, and the soldering jig 50 can be clamped by the second movable part 32 and the placement part 31.

  The soldering jig 50 will be described with reference to FIGS. The soldering jig 50 includes a support member 51, a pressing member 70, and a first movable part 60. The soldering jig 50 may further include an elastic member 77. The soldering jig 50 may further include a guide member 55.

  Support member 51 includes first main surface 51m. The support member 51 is configured to support the work (lead frame 80) on the first main surface 51m. Support member 51 includes a wall portion 52 provided at the peripheral edge portion of first main surface 51m. The wall 52 includes an insertion port 52a. The lead frame 80 is attached to and detached from the soldering jig 50 through the insertion port 52a. The wall portion 52 faces the side surface 70 u of the pressing member 70. The support member 51 includes a notch 51a. The notch 51a and the insertion port 52a are formed on the same side of the soldering jig 50. The notch 51a facilitates attachment / detachment of the workpiece to / from the soldering jig 50.

  The pressing member 70 includes a second main surface 70m facing the first main surface 51m, and a third main surface 70n opposite to the second main surface 70m. The pressing member 70 further includes a side surface 70u that connects the second main surface 70m and the third main surface 70n. The pressing member 70 includes an opening 71 that penetrates the pressing member 70 from the second main surface 70m to the third main surface 70n. The component 82 can be placed on the work (lead frame 80) through the opening 71. The opening 71 enables the component 82 to be soldered onto the workpiece while the workpiece is held or clamped by the pressing member 70 and the support member 51.

  The pressing member 70 is attached to the support member 51 so as to be movable in a first direction and a second direction. The first direction is a direction in which the pressing member 70 approaches the first main surface 51m. The second direction is a direction in which the pressing member 70 moves away from the first main surface 51m. Specifically, the guide member 55 is provided on the first main surface 51 m of the support member 51. The guide member 55 is a guide pin, for example. The pressing member 70 includes the receiving portion 70p, and the guide member 55 is inserted into the receiving portion 70p. The receiving portion 70p may be a through-hole extending from the second main surface 70m to the third main surface 70n, or may be a recess formed in the second main surface 70m. The guide member 55 guides the pressing member 70. The pressing member 70 is configured to move in the first direction and the second direction along the guide member 55. The guide member 55 prevents the pressing member 70 from colliding with the supporting member 51 (wall portion 52), and prevents the pressing member 70 and the supporting member 51 (wall portion 52) from being damaged.

  The pressing member 70 is configured to press a workpiece (lead frame 80) disposed between the first main surface 51m and the second main surface 70m toward the support member 51. The workpiece disposed between the first main surface 51m and the second main surface 70m is held or clamped by the pressing member 70 and the support member 51. Specifically, the elastic member 77 urges the pressing member 70 toward the first main surface 51 m of the support member 51. The elastic member 77 connects the support member 51 and the pressing member 70. Specifically, the elastic member 77 is connected to the wall portion 52 of the support member 51 and the side surface 70 u of the pressing member 70. The elastic member 77 prevents the pressing member 70 from colliding with the support member 51 (wall portion 52), and prevents the pressing member 70 and the support member 51 (wall portion 52) from being damaged. The elastic member 77 is, for example, a spring.

  The first movable part 60 is disposed in the notch 59 of the support member 51. The first movable unit 60 is configured to move the pressing member 70 in the first direction and the second direction. The first movable part 60 includes a first end 62 and a second end 65. The first end 62 and the second end 65 may protrude from the support member 51. The first end 62 is configured to be in contact with the second main surface 70m. The second end 65 may protrude from the top of the wall portion 52.

  Specifically, the first movable portion 60 includes a first rod member 61 including a first end 62, a second rod member 64 including a second end 65, a first shaft 63, and a second shaft 66. Including. The first rod member 61 is rotatably attached to the support member 51. Specifically, the first rod member 61 is connected to a first shaft 63 fixed to the support member 51 and is configured to rotate around the first shaft 63. The first rod member 61 may have a shape bent into an L shape. The second bar member 64 is rotatably attached to the first bar member 61. Specifically, the first bar member 61 is connected to a second shaft 66 fixed to the second bar member 64 and is configured to rotate around the second shaft 66. A portion of the first rod member 61 connected to the second shaft 66 is located on the opposite side of the first shaft 62 with respect to the first shaft 63.

  As shown in FIG. 14, the soldering jig 50 may further include a pressure sensor 73 provided on at least one of the first main surface 51m and the second main surface 70m. The pressure sensor 73 is configured to detect the pressure applied to the workpiece by the pressing member 70. When the elastic member 77 deteriorates, this pressure decreases. By detecting this pressure, the deterioration of the elastic member 77 can be detected. The pressure sensor 73 is not particularly limited, but may be a piezoelectric element.

  The soldering jig 50 is mainly formed of carbon. A portion of the soldering jig 50 that requires higher mechanical strength (for example, a portion connected to the elastic member 77) may be formed of stainless steel such as SUS. Further, of the portion of the soldering jig 50 formed of stainless steel, the portion where the solder scatters when the component 82 is soldered to the lead frame 80 (see S3 in FIG. 15) is covered with aluminum. Also good.

  As shown in FIG. 1, the control unit 8 is configured to control the operation of the soldering apparatus 1. For example, the control unit 8 is connected to the component supply unit 3, the soldering unit 5, the soldering jig attaching / detaching unit 7, the conveyor 15, and the display unit 8b. The control unit 8 is configured to control the component supply unit 3, the soldering unit 5, the soldering jig attaching / detaching unit 7, the conveyor 15, and the display unit 8b. The control unit 8 is configured to receive a signal output from the pressure sensor 73 (see FIG. 14). The display part 8b displays the state of each part of the soldering apparatus 1.

  With reference to FIGS. 15 to 34, a method of manufacturing the semiconductor device 2 of the present embodiment will be described. The manufacturing method of the semiconductor device 2 according to the present embodiment includes setting a work (lead frame 80) on the soldering jig 50 (S1). Specifically, as shown in FIGS. 16 and 17, the soldering jig 50 is mounted on the main surface 31 m of the mounting portion 31 of the transport table 30. The gap g between the support member 51 and the pressing member 70 is smaller than the thickness t of the lead frame 80 (see FIG. 21). The transport unit 34 moves the transport table 30 to the first position facing the first transport unit 45.

  As shown in FIGS. 18 and 19, the second movable portion 32 is rotated with respect to the placement portion 31. The second portion 32 b of the second movable part 32 presses the second end 65 of the first movable part 60. The first movable part 60 rotates around the first shaft 63. The first end 62 of the first movable part 60 contacts the second main surface 70 m of the pressing member 70. The first movable part 60 lifts the pressing member 70 upward against the urging force of the elastic member 77. The interval between the pressing member 70 and the support member 51 is made larger than the thickness of the lead frame 80. The lead frame 80 is cleaned by blowing an inert gas such as nitrogen gas from the first gas blowing unit 48. Further, the lead frame 80 may be neutralized by spraying ions from the first gas spraying portion 48.

  The first conveyor belt 39 and the elevating part 42 move the first magazine 36 that houses the lead frame 80 to which the component 82 is not soldered, to a position facing the conveyor table 30. The first transport unit 45 pushes the lead frame 80 from the first magazine 36 to the soldering jig 50. As shown in FIGS. 20 and 21, the lead frame 80 is inserted between the support member 51 and the pressing member 70 through the insertion port 52a. Then, the second movable part 32 is rotated with respect to the placement part 31. The second portion 32 b of the second movable part 32 is separated from the second end 65 of the first movable part 60. The first movable part 60 rotates around the first shaft 63. The first end 62 of the first movable part 60 is separated from the second main surface 70 m of the pressing member 70. The pressing member 70 presses the lead frame 80 toward the first main surface 51 m of the support member 51 by the urging force of the elastic member 77. 22 and 23, the lead frame 80 is held or clamped by the pressing member 70 and the support member 51. The blowing of the inert gas and ions from the first gas blowing unit 48 is stopped.

  When the lead frame 80 is held or clamped by the pressing member 70 and the support member 51, the pressure sensor 73 detects the pressure applied to the lead frame 80 by the pressing member 70, and transmits information regarding this pressure to the control unit 8. (See FIG. 1). When the elastic member 77 deteriorates, this pressure decreases. When the pressure applied to the lead frame 80 by the pressing member 70 is equal to or less than the reference value, the control unit 8 displays a warning on the display unit 8b to notify the operator of the deterioration of the elastic member 77. The worker who has recognized this warning repairs or replaces the elastic member 77 or the soldering jig 50.

  22 and 23, after the lead frame 80 is held or clamped by the pressing member 70 and the support member 51, the soldering jig 50 on which the lead frame 80 is set is temporarily attached to the third magazine. 38 may be stored. Specifically, the conveyance unit 34 moves the conveyance table 30 on which the soldering jig 50 on which the lead frame 80 is set is placed to a third position facing the third conveyance units 47 and 47b. . The third conveyor belt 41 and the elevating part 42 move the third magazine 38 accommodated in the housing 35 to a position facing the conveyor table 30 that holds the soldering jig 50. The third transport unit 47 b pushes the soldering jig 50 on which the lead frame 80 is set from the transport base 30 to the third magazine 38 and accommodates it in the third magazine 38. Thus, the soldering jig 50 on which the lead frame 80 is set is stored in the third magazine 38.

  The manufacturing method of the semiconductor device 2 of the present embodiment includes placing the solder and the component 82 on the work (lead frame 80) (S2). Specifically, the soldering jig 50 on which the lead frame 80 is set is transferred from the transport table 30 to the conveyor 15. Immediately after the lead frame 80 is set on the soldering jig 50, the soldering jig 50 on which the lead frame 80 is set may be transferred from the transport table 30 to the conveyor 15. Alternatively, the soldering jig 50 in which the lead frame 80 temporarily stored in the third magazine 38 is set is pushed out from the third magazine 38 to the transport table 30 by the third transport unit 47 and transported by the transport unit 34. The table 30 may be moved to the conveyor 15, and the soldering jig 50 on which the lead frame 80 is set may be transferred from the conveyance table 30 to the conveyor 15.

  The conveyor 15 conveys the soldering jig 50 on which the lead frame 80 is set from the soldering jig attaching / detaching unit 7 to the component supplying unit 3. The solder plate is placed on the lead frame 80 through the opening 71 of the pressing member 70. The drive unit 17 moves the head 18 to the solder supply unit 13. The solder plate supplied from the solder supply unit 13 is adsorbed by the adsorption nozzle 18a. The drive unit 17 moves the head 18 to the lead frame 80. The suction of the solder plate by the suction nozzle 18 a is released, and the solder plate is placed on the lead frame 80.

  Subsequently, the component 82 is placed on the lead frame 80 through the opening 71 of the pressing member 70. The drive unit 17 moves the head 18 to the tray 11. The component 82 accommodated in the tray 11 is sucked by the suction nozzle 18a. The drive unit 17 moves the head 18 to the lead frame 80. The suction of the component 82 by the suction nozzle 18 a is released, and the component 82 is placed on the lead frame 80.

  The manufacturing method of the semiconductor device 2 according to the present embodiment includes soldering the component 82 to the workpiece (lead frame 80) (S3). Specifically, the conveyor 15 conveys the soldering jig 50 on which the lead frame 80 is set from the component supply unit 3 to the soldering unit 5. A component 82 and a solder plate are placed on the lead frame 80. The shutter 28 is opened, and the soldering jig 50 on which the lead frame 80 is set is conveyed to the preheating chamber 20. After the soldering jig 50 is accommodated in the preheating chamber 20, the shutters 28 and 28a are closed. The inside of the preheating chamber 20 is exhausted with the vacuum pump 25a, and the inside of the preheating chamber 20 is reduced to a pressure of 10 Pa or more and 100 Pa or less, for example.

  A reducing agent such as formic acid mist is introduced into the preheating chamber 20 to make the inside of the preheating chamber 20 a reducing atmosphere. The heat plate 23a is brought into contact with the soldering jig 50. The lead frame 80, the component 82, and the solder plate are heated at a first temperature. The first temperature may be, for example, 150 ° C. or higher and 200 ° C. or lower. Instead of the heat plate 23a or together with the heat plate 23a, the lead frame 80, the component 82 and the solder plate may be heated at the first temperature using the infrared heater 24a. The surface of the lead frame 80, the surface of the component 82, and the surface of the solder plate are reduced by formic acid mist, and the solder wettability of these surfaces is improved.

  The inside of the main heating chamber 21 is exhausted by the vacuum pump 25b. Then, a reducing agent such as formic acid mist is introduced into the main heating chamber 21 to make the inside of the main heating chamber 21 the same reducing atmosphere as in the preheating chamber 20. The shutter 28 a is opened, and the soldering jig 50 on which the lead frame 80 is set is conveyed from the preheating chamber 20 to the main heating chamber 21. After the soldering jig 50 is accommodated in the main heating chamber 21, the shutters 28a and 28b are closed. The heat plate 23 b is brought into contact with the soldering jig 50. The lead frame 80, the component 82, and the solder plate are heated at a second temperature higher than the first temperature. The second temperature may be, for example, 250 ° C. or higher and 300 ° C. or lower. Instead of the heat plate 23b or together with the heat plate 23b, the lead frame 80, the component 82 and the solder plate may be heated at the second temperature using the infrared heater 24b.

  Then, the inside of the main heating chamber 21 is exhausted by the vacuum pump 25b, and the inside of the main heating chamber 21 is reduced to a pressure of 100 Pa to 500 Pa, for example. Therefore, voids in the solder joint portion 81 are reduced. Nitrogen gas is introduced into the main heating chamber 21 to make the inside of the main heating chamber 21 a nitrogen atmosphere.

  The manufacturing method of the semiconductor device 2 of the present embodiment includes taking out a work (lead frame 80) to which the component 82 is soldered from the soldering jig 50 (S4). Specifically, the conveyor 15 conveys the soldering jig 50 on which the lead frame 80 is set from the cooling chamber 22 to the conveyance table 30. As shown in FIGS. 24 and 25, the soldering jig 50 on which the lead frame 80 is set is placed on the transport table 30. The component 82 is soldered to the lead frame 80. The conveyance unit 34 moves the conveyance table 30 to the second position facing the second conveyance unit 46.

  The inside of the cooling chamber 22 is exhausted by the vacuum pump 25c. Then, nitrogen gas is introduced into the cooling chamber 22 so that the inside of the cooling chamber 22 has a nitrogen atmosphere similar to that in the main heating chamber 21. The shutter 28b is opened, and the soldering jig 50 on which the lead frame 80 is set is conveyed from the main heating chamber 21 to the cooling chamber 22. After the soldering jig 50 is accommodated in the cooling chamber 22, the shutters 28b and 28c are closed. The cooling plate 26 is brought into contact with the soldering jig 50. The soldering jig 50 on which the lead frame 80 is set is cooled to a third temperature of 60 ° C. or lower in a nitrogen atmosphere. Since the lead frame 80 is cooled in a nitrogen atmosphere, oxidation of the lead frame 80 is suppressed. Then, the shutter 28c is opened, and the soldering jig 50 in which the lead frame 80 is set is conveyed out of the preheating chamber 20.

  The manufacturing method of the semiconductor device 2 of the present embodiment includes taking out a work (lead frame 80) to which the component 82 is soldered from the soldering jig 50 (S4). Specifically, the conveyor 15 conveys the soldering jig 50 on which the lead frame 80 is set from the cooling chamber 22 to the conveyance table 30. As shown in FIGS. 24 and 25, the soldering jig 50 on which the lead frame 80 is set is placed on the transport table 30. The component 82 is soldered to the lead frame 80. The conveyance unit 34 moves the conveyance table 30 to the second position facing the second conveyance unit 46.

  As shown in FIGS. 26 and 27, the protrusion 86 of the pressing member 85 is inserted into the opening 71 of the pressing member 70, and the lead frame 80 soldered to the protrusion 86 is pressed against the support member 51. The protrusion 86 is made of a low-repulsive conductive material such as conductive urethane rubber. Therefore, the protrusion 86 can prevent the lead frame 80 to which the component 82 is soldered from being subjected to mechanical damage and electrical damage due to static electricity.

  As shown in FIGS. 28 and 29, the second movable portion 32 is rotated with respect to the placement portion 31. The second portion 32 b of the second movable part 32 presses the second end 65 of the first movable part 60. The first movable part 60 rotates around the first shaft 63. The first end 62 of the first movable part 60 contacts the second main surface 70 m of the pressing member 70. The first movable part 60 lifts the pressing member 70 upward against the urging force of the elastic member 77. The interval between the pressing member 70 and the support member 51 is made larger than the thickness of the lead frame 80. The lead frame 80 to which the component 82 is soldered is pressed by a pressing tool 85. Therefore, even if the pressing member 70 bites the lead frame 80 to which the component 82 is soldered, the pressing member 70 moves upward without causing mechanical damage to the lead frame 80 to which the component 82 is soldered. obtain.

  The lead frame 80 to which the component 82 is soldered is cleaned by blowing an inert gas such as nitrogen gas from the second gas blowing portion 49. Solder balls generated when the component 82 is soldered to the lead frame 80 are blown off by an inert gas and collected in the groove 33 of the transport table 30. Furthermore, the lead frame 80 to which the component 82 is solder-bonded may be neutralized by blowing ions from the second gas blowing portion 49.

  As shown in FIG. 30, the pressing tool 85 is removed from the pressing member 70. As shown in FIGS. 31 and 32, the lead frame 80 to which the component 82 is soldered is taken out from the soldering jig 50 by using the second transporting part 46 and accommodated in the second magazine 37. Then, the second movable unit 32 is rotated with respect to the transport table 30. The second portion 32 b of the second movable part 32 is separated from the second end 65 of the first movable part 60. The first movable part 60 rotates around the first shaft 63. The first end 62 of the first movable part 60 is separated from the second main surface 70 m of the pressing member 70. Thus, the pressing member 70 approaches the support member 51 as in the soldering jig 50 shown in FIGS.

  The manufacturing method of the semiconductor device 2 according to the present embodiment includes sealing a workpiece (lead frame 80) to which the component 82 is soldered with the sealing member 83 (S5). Specifically, the lead frame 80 to which the component 82 is soldered is set in a mold. The component 82 is sealed with the sealing member 83 using the transfer molding method or the compression molding method. In this way, the semiconductor device 2 shown in FIG. 2 is obtained.

  As shown in FIG. 33, in the soldering jig 50b of the first modification of the present embodiment, a concave portion 79 that receives the convex portion 84 of the lead frame 80 is formed on the first main surface 51m of the support member 51. May be. As shown in FIG. 34, in the soldering jig 50c of the second modification of the present embodiment, the elastic member 77 may connect the first main surface 51m and the second main surface 70m. The workpiece is not limited to the lead frame 80, and may be, for example, a printed wiring board or a heat sink. The first movable portion 60 may be a magnetic attractive force acting between the pressing member 70 and the support member 51 or a member utilizing a magnetic repulsive force. The first movable part 60 may be an electrostatic attractive force acting between the pressing member 70 and the support member 51 or may utilize an electrostatic repulsive force. The second movable part 32 may be a wedge member that moves or rotates the first movable part 60. The 2nd movable part 32 should just be provided in the soldering apparatus 1, and does not need to be provided in the conveyance stand 30. FIG.

  The effects of the manufacturing method of the soldering jig 50, the soldering apparatus 1 and the semiconductor device 2 according to the present embodiment will be described.

  The soldering jig 50 according to the present embodiment includes a support member 51, a pressing member 70, and a first movable part 60. The support member 51 includes a first main surface 51m, and is configured to support a work (for example, the lead frame 80) on the first main surface 51m. The pressing member 70 includes a second main surface 70m facing the first main surface 51m, and a third main surface 70n opposite to the second main surface 70m. The pressing member 70 is configured to press a workpiece disposed between the first main surface 51m and the second main surface 70m toward the support member 51. The pressing member 70 is attached to the support member 51 so as to be movable in a first direction and a second direction. The first direction is a direction in which the pressing member 70 approaches the first main surface 51m. The second direction is a direction in which the pressing member 70 moves away from the first main surface 51m. The first movable unit 60 is configured to move the pressing member 70 in the first direction and the second direction.

  In the soldering jig 50, since the pressing member 70 is attached to the support member 51 so as to be movable in the first direction and the second direction, the workpiece (for example, the lead frame 80) is moved from the soldering jig 50. There is no need to disassemble the soldering jig 50 when attaching and detaching. The soldering jig 50 of this embodiment makes it possible to perform the soldering process with improved productivity. Furthermore, the position shift of the workpiece with respect to the soldering jig 50 is suppressed. The soldering jig 50 of this embodiment makes it possible to perform the soldering process with improved productivity.

  While the component 82 is soldered to the workpiece (for example, the lead frame 80), the workpiece is held or clamped by the pressing member 70 and the support member 51. Even if the workpiece is warped or deformed, the soldering jig 50 can hold or clamp the workpiece in a flat state. When soldering the part 82 to the workpiece, the workpiece can be heated uniformly. Defects in solder joining of the component 82 to the workpiece (for example, occurrence of Manhattan phenomenon (tombstone phenomenon)) can be suppressed. The soldering jig 50 of this embodiment makes it possible to perform the soldering process with improved productivity.

  During the process of transporting the soldering jig 50 by the conveyor 15, the process of placing the solder and the part 82 on the work, and the process of soldering the part 82 to the work, the work is supported by the pressing member 70 and the support member. 51 or is held by or clamped by. Even if the workpiece is warped or deformed, the soldering jig 50 can hold or clamp the workpiece in a flat state. During these steps, it is possible to prevent the positional deviation of the component 82 with respect to the workpiece. Even if the solder supplied onto the workpiece is a solder plate that does not have adhesiveness, the position of the solder plate relative to the workpiece can be prevented during these steps. During these steps, the workpiece is held or clamped on the soldering jig 50 without any gap. It is possible to prevent the component 82 and the solder plate from dropping from the workpiece during these steps. The soldering jig 50 of this embodiment makes it possible to perform the soldering process with improved productivity.

  The soldering apparatus 1 according to the present embodiment includes a soldering jig 50 and a second movable part 32 that drives the first movable part 60. In the soldering apparatus 1, it is not necessary to disassemble the soldering jig 50 when the workpiece is detached from the soldering jig 50. The soldering apparatus 1 of the present embodiment makes it possible to perform the soldering process with improved productivity.

  In the soldering apparatus 1 of the present embodiment, the positional deviation of the workpiece with respect to the soldering jig 50, the positional deviation of the component 82 with respect to the workpiece, and the positional deviation of the solder plate with respect to the workpiece are suppressed. Defects in soldering of the part 82 to the workpiece can be suppressed. The soldering apparatus 1 of the present embodiment makes it possible to perform the soldering process with improved productivity.

  In the manufacturing method of the semiconductor device 2 of the present embodiment, a work is set on the soldering jig 50 (S1), the solder and the component 82 are placed on the work (S2), and the component 82 is mounted. Soldering to the workpiece (S3), and taking out the workpiece to which the component 82 is soldered from the soldering jig 50 (S4). In the manufacturing method of the semiconductor device 2 according to the present embodiment, it is not necessary to disassemble the soldering jig 50 when the workpiece is detached from the soldering jig 50. The manufacturing method of the semiconductor device 2 according to the present embodiment makes it possible to perform the soldering process with improved productivity.

  In the manufacturing method of the semiconductor device 2 according to the present embodiment, the positional deviation of the workpiece with respect to the soldering jig 50, the positional deviation of the component 82 with respect to the workpiece, and the positional deviation of the solder plate with respect to the workpiece are suppressed. Defects in soldering of the part 82 to the workpiece can be suppressed. The manufacturing method of the semiconductor device 2 according to the present embodiment makes it possible to perform the soldering process with improved productivity.

  It should be thought that embodiment disclosed this time and its modification are illustrations in all points, and are not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  DESCRIPTION OF SYMBOLS 1 Soldering device, 2 Semiconductor device, 3 Component supply part, 5 Soldering part, 7 Soldering jig attaching / detaching part, 8 Control part, 8b Display part, 10 base, 11 Tray, 13 Solder supply part, 15 Conveyor, 17 drive unit, 17a first rail, 17b second rail, 18 head, 18a suction nozzle, 20 preheating chamber, 21 heating chamber, 22 cooling chamber, 23a, 23b heat plate, 24a, 24b infrared heater, 25a, 25b, 25c Vacuum pump, 26 Cooling plate, 28, 28a, 28b, 28c Shutter, 30 Carrier, 31 Placement part, 31m Main surface, 31r Third shaft, 32 Second movable part, 32a First part, 32b First 2 parts, 33 grooves, 34 transport section, 35 housing, 36 first magazine, 37 second magazine 38 3rd magazine, 39 1st conveyor belt, 40 2nd conveyor belt, 41 3rd conveyor belt, 42 Elevator, 45 1st conveyor, 46 2nd conveyor, 47, 47b 3rd conveyor, 48 1st Gas spraying part, 49 2nd gas spraying part, 50, 50b, 50c Soldering jig, 51 Support member, 51m First main surface, 52 Wall part, 52a Insertion port, 55 Guide member, 60 First movable part, 61 1st rod member, 62 1st end, 63 1st shaft, 64 2nd rod member, 65 2nd end, 66 2nd shaft, 70 pressing member, 70m 2nd main surface, 70n 3rd main surface, 70p receiving part , 70u side surface, 71 opening, 73 pressure sensor, 77 elastic member, 79 concave portion, 80 lead frame, 81 solder joint, 82 parts, 83 sealing member, 84 convex portion, 85 presser , 86 projections.

Claims (14)

A support member including a first main surface, wherein the support member is configured to support a workpiece on the first main surface;
The pressing member includes a second main surface facing the first main surface and a third main surface opposite to the second main surface, and the pressing member includes the first main surface and the second main surface. It is comprised so that the said workpiece | work arrange | positioned between surfaces may be pressed toward the said supporting member, The said pressing member is attached to the said supporting member so that a movement to a 1st direction and a 2nd direction is possible. The first direction is a direction in which the pressing member approaches the first main surface, the second direction is a direction in which the pressing member moves away from the first main surface, and
A soldering jig comprising a first movable part configured to move the pressing member in the first direction and the second direction. An elastic member for connecting the support member and the pressing member;
The elastic member urges the pressing member toward the first main surface of the support member, and the work disposed between the first main surface and the second main surface is the pressing member. The soldering jig according to claim 1, wherein the soldering jig is configured to be held by the support member.   The soldering jig according to claim 2, wherein the elastic member is connected to the first main surface and the second main surface. The support member includes a wall portion facing a side surface of the pressing member, and the side surface connects the second main surface and the third main surface,
The soldering jig according to claim 2, wherein the elastic member is connected to the wall portion and the side surface. The first movable part includes a first end and a second end, and the first end and the second end protrude from the support member,
The first end is configured to be in contact with the second main surface,
The soldering jig according to claim 4, wherein the second end protrudes from a top portion of the wall portion. The first movable part includes a first end and a second end, and the first end and the second end protrude from the support member,
The soldering jig according to claim 1, wherein the first end is configured to be able to contact the second main surface. A guide member;
The solder according to any one of claims 1 to 6, wherein the pressing member is configured to move in the first direction and the second direction along the guide member. Attaching jig.   The pressure sensor further includes a pressure sensor provided on at least one of the first main surface and the second main surface, and the pressure sensor is configured to detect a pressure applied to the workpiece by the pressing member. The soldering jig according to any one of claims 1 to 7, wherein:   The soldering jig according to claim 1, wherein the workpiece is a lead frame. The pressing member includes an opening that penetrates the pressing member from the second main surface to the third main surface,
The soldering jig according to any one of claims 1 to 9, wherein the opening is configured such that a part is placed on the workpiece through the opening. The soldering jig according to any one of claims 1 to 10,
A soldering apparatus comprising: a second movable part that drives the first movable part. The second movable part is a part of a transport table on which the soldering jig is placed,
The said conveyance stand contains the mounting part which mounts the said soldering jig | tool, and the said 2nd movable part comprised so that it may move or rotate with respect to the said mounting part. Soldering equipment. The soldering jig according to claim 5,
A second movable part for driving the first movable part,
The second movable part is a part of a transport table on which the soldering jig is placed,
The transport table includes a placement portion for placing the soldering jig, and the second movable portion configured to move or rotate with respect to the placement portion,
The second movable part can press the second end,
The said 2nd movable part is a soldering apparatus which can press the said top part of the said wall part, and can clamp the said soldering jig with the said 2nd movable part and the said mounting part. Setting the workpiece on the soldering jig according to any one of claims 1 to 9,
Placing a solder plate and components on the workpiece;
Soldering the part to the workpiece;
Removing the workpiece to which the component is soldered from the soldering jig.

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