WO2022004170A1

WO2022004170A1 - Article manufacturing device, article manufacturing method, program, and recording medium

Info

Publication number: WO2022004170A1
Application number: PCT/JP2021/018997
Authority: WO
Inventors: 智史塩田; 亮太岡崎; 昭宏林
Original assignee: キヤノン株式会社
Priority date: 2020-07-03
Filing date: 2021-05-19
Publication date: 2022-01-06
Also published as: TW202203334A

Abstract

A die bonder (100) is provided with: a feeding unit (70) that feeds a workpiece (110); a bonding stage (20) that is capable of holding the workpiece (110) and moving the workpiece from a workpiece receiving position to a bonding work position and that is capable of heating a region corresponding to the position and/or dimensions of the workpiece; and a mounting unit (10) that places parts to be mounted onto the workpiece held by the bonding stage at the bonding work position. Preliminary heating of the workpiece (110) is started before the workpiece (110) arrives at the bonding work position, and during bonding work at the bonding work position, the bonding stage (20) holding the workpiece (110) controls heating of the workpiece (110).

Description

Goods manufacturing equipment, goods manufacturing methods, programs, recording media

The present invention relates to an apparatus and a method for mounting, for example, a semiconductor chip or the like on a substrate or the like. In particular, the present invention relates to a method for heating a work when a work such as a substrate is conveyed, set on a bonding stage, and die-bonded.

There are various forms of electronic devices, but most of them are equipped with a semiconductor package in which a semiconductor chip is mounted on a lead frame, or a circuit package in which an electronic component such as a semiconductor chip is mounted on a circuit board. A semiconductor package or a circuit package is manufactured by the following procedure, for example. First, a large number of integrated circuits are formed on a semiconductor wafer, and the semiconductor wafer is cut and divided into semiconductor chips (dies) in a dicing process. Then, in the bonding process, electronic components such as semiconductor chips (dies) are bonded to workpieces such as lead frames and circuit boards. The device used in this bonding process is a so-called die bonder die bonding device. A die bonder is a device that places electronic components on a lead frame or substrate and bonds them using a bonding material such as solder, gold, or resin. In some cases, it is placed on an electronic component that has already been bonded to the substrate. It can also be used to mount and bond other electronic components.

When bonding electronic components to the surface of a substrate, etc. using a die bonder, the substrate, etc. is transported to the bonding stage and set. Then, the electronic component is picked up by using a suction nozzle called a collet and placed at a predetermined position to be bonded. Depending on the type of bonding material, the substrate or the like on the bonding stage is heated for bonding. When heating a substrate or the like, a heating method for heating a substrate or the like on a bonding stage is important in order to improve the throughput of the bonding work and the bonding quality such as the accuracy of the bonding position and the bonding strength.

For example, in the apparatus disclosed in Patent Document 1, when sequentially bonding dies to a plurality of positions on a substrate, the bonding stage is first lowered to separate it from the substrate, and the first die is bonded. Transport the board to the working position. When the transfer is complete, the bonding stage is raised to heat the substrate and bond the first die. After the bonding of the first die is completed, the bonding stage is lowered to stop the heating of the substrate, and the substrate is transferred to the work position where the next die is bonded while dissipating heat. When the transfer is complete, the bonding stage is raised to reheat the substrate and bond the next die. Hereinafter, this procedure is repeated until the bonding of all the dies is completed.

Further, the substrate mounting apparatus disclosed in Patent Document 2 includes a carrier that has a heat capacity of a predetermined value or more and holds a substrate supplied from the substrate supply means, and a carrier heating transfer means that heats the carrier while transporting the carrier. ing. Then, the carrier heating transfer means transports the carrier while heating it from the substrate transport start position, and stops heating at a predetermined position. However, since the heat is stored in the carrier having a large heat capacity, the substrate is still transported. Continues to be heated. Electronic components are dropped onto a substrate that has moved to a predetermined working position and fused by ultrasonic vibration.

Japanese Unexamined Patent Publication No. 2019-62034 Japanese Unexamined Patent Publication No. 2006-128476

However, with the conventional method, it is difficult to achieve both the throughput of the bonding work and the bonding quality such as the bonding position accuracy and the bonding strength.
For example, in the apparatus disclosed in Patent Document 1, every time the bonding work position is changed, the bonding stage is repeatedly raised, lowered, horizontally moved, and heated and cooled. Therefore, the heat cycle of heating and cooling takes time, and the accuracy of controlling the position and temperature of the substrate may not be improved. In addition, since heating and cooling are repeated, energy consumption may increase.

Further, in the apparatus disclosed in Patent Document 2, a carrier having a large heat capacity is heated in a predetermined period at the initial stage of transportation, and thereafter, the substrate is heated by the residual heat accumulated in the carrier, but the temperature of the substrate is high during the bonding operation. It was difficult to control with precision. In addition, since the temperature of carriers having a large heat capacity is raised, energy consumption may increase.
Therefore, there has been a demand for a device that can keep the throughput of bonding work high and precisely control the temperature of the substrate.

A first aspect of the present invention is a supply unit that supplies a work, a work that can be held and moved from a work receiving position to a bonding work position, and a range corresponding to the position and / or size of the work can be heated. The bonding stage, the work transfer unit that transfers the work supplied by the supply unit to the bonding stage at the work receiving position, and the work held by the bonding stage at the bonding work position. A mounting unit for mounting mounting components is provided, and while the work is moved from the supply unit to the bonding work position, preheating of the work is started before the work reaches the bonding work position. However, during the bonding work at the bonding work position, the bonding stage that holds the work controls the heating of the work, which is an article manufacturing apparatus.

A second aspect of the present invention is to heat a supply unit that supplies the work, a range that can hold the work and move from the work receiving position to the bonding work position, and a range corresponding to the position and / or size of the work. A possible bonding stage, a work transfer unit that transfers the work supplied by the supply unit to the bonding stage at the work receiving position, and the work held by the bonding stage at the bonding work position. It is a method of manufacturing an article using a device provided with a mounting portion for mounting a mounting component on a work, and the work is subjected to the bonding operation while the work is moved from the supply unit to the bonding work position. A heating start step of starting preheating of the work before reaching the position, and a heating control in which the bonding stage holding the work controls heating of the work during the bonding work at the bonding work position. A method of manufacturing an article comprising a process.

According to the present invention, it is possible to provide an apparatus capable of precisely controlling the temperature of a substrate with low energy while keeping the throughput of bonding work high.
Other features and advantages of the invention will be apparent by the following description with reference to the accompanying drawings. In the attached drawings, the same or similar configurations are given the same reference numbers.

The schematic perspective view of the die bonder which concerns on Embodiment 1. FIG. A side view of the substrate transfer portion and the bonding stage according to the embodiment as viewed along the + X direction. The plan view of the bonding stage and the moving mechanism thereof which concerns on embodiment. The front view of the bonding stage and the moving mechanism thereof which concerns on embodiment. The schematic plan view for demonstrating the temperature control mechanism of the bonding stage which concerns on embodiment. The schematic front view for demonstrating the temperature control mechanism of the bonding stage which concerns on embodiment. The schematic plan view for demonstrating the adsorption mechanism of the bonding stage which concerns on embodiment. A schematic plan view of the die supply unit and the die mounting unit according to the embodiment. An operation time chart for explaining the operation of each part according to the embodiment. Schematic plan view showing a plurality of die mounting areas provided on a substrate. The schematic plan view which shows the operation position of the die mounting part at the time of bonding to a plurality of die mounting areas. An operation time chart for explaining the operation of each part when bonding to multiple die mounting areas. An operation time chart showing the operation of each part when the substrate after the bonding is completed is housed in the board housing part. The schematic perspective view of the die bonder which concerns on Embodiment 2. An operation time chart for explaining the operation of each part of the die bonder according to the second embodiment.

With reference to the drawings, an article manufacturing apparatus, an article manufacturing method, and the like according to the embodiment of the present invention will be described. In the drawings referred to in the description of the following embodiments, unless otherwise specified, the elements indicated by the same reference numbers shall have the same or similar functions.

[Embodiment 1]
FIG. 1 is a schematic perspective view for explaining a die bonder according to the present embodiment.
In the following description, the XYZ coordinate system, which is a Cartesian coordinate system, may be referred to, but the X axis is the direction in which the substrate is horizontally conveyed (from left to right in FIG. 1), and the Y axis is a horizontal plane. In the direction orthogonal to the X-axis, the Z-axis is the vertical direction (direction opposite to gravity). The direction parallel to the X axis may be referred to as the X direction, the same direction as the substrate transport direction (arrow of the X axis) in the X direction may be referred to as the + X direction, and the direction opposite to the + X direction may be referred to as the −X direction. Further, the direction parallel to the Y axis may be referred to as the Y direction, the same direction as the arrow on the Y axis in the Y direction may be referred to as the + Y direction, and the direction opposite to the + Y direction may be referred to as the −Y direction. In some cases, the direction parallel to the Z axis is the Z direction, the vertically upward direction (arrow on the Y axis) opposite to gravity is the + Z direction, and the direction opposite to the + Z direction is called the -Z direction. be.
The most characteristic part of this embodiment is the mechanism and procedure for heating the substrate, but first, the overall configuration of the die bonder will be described.

(Die bonder composition)
As shown in FIG. 1, the die bonder 100 includes a gantry 01, a substrate supply unit 70 for supplying a substrate 110 as a work, a bonding stage 20, a die supply unit 90, a die mounting unit 10, a substrate accommodating unit 80, and a control unit 200. I have. Further, a substrate transfer unit 50 (work transfer unit) and a preheating unit 22 are provided between the substrate supply unit 70 and the bonding stage 20, and a substrate discharge unit is provided between the bonding stage 20 and the substrate accommodating unit 80. A unit 60 is provided.

A stage moving track 41 is installed on the gantry 01 along the X direction, which is the substrate transport direction, and the moving table 42 is movably placed on the stage moving track 41. The bonding stage 20 is supported on the moving table 42, and moves on the stage moving track 41 together with the moving table.

The board supply unit 70 includes a board storage unit 72 capable of storing a plurality of boards 110 on which a die (mounting component) is not mounted. In the example of FIG. 1, the substrate supply unit 70 includes two substrate storage units 72, but the substrate storage unit 72 may be a single unit or three or more units. The board storage unit 72 can be moved in the Y direction by the Y direction drive mechanism 70Y, and can be moved in the Z direction by the Z direction drive mechanism 70Z. By driving these drive mechanisms, any board in the board stored in the board storage unit 72 can be set in the carry-out port. The carry-out port is provided with a board extrusion mechanism 71 for pushing out the board in the + X direction and sending the board to the board transfer unit 50.

The board transfer unit 50 includes an X-direction moving mechanism 50X for moving in the X direction and a Z-direction moving mechanism 50Z for moving in the Z direction. The substrate transfer unit 50 can receive the substrate from the substrate supply unit 70 and place it in a predetermined position where the temperature of the preheating unit 22 is controlled. It is also possible to pick up the substrate placed on the preheating unit 22, transfer it onto the bonding stage 20, and place it at a predetermined position where the temperature of the bonding stage 20 is controlled.

With reference to FIG. 2, a gripping mechanism in which the board transfer unit 50 grips the board will be described. FIG. 2 is a side view of the substrate transfer portion 50 and the bonding stage 20 as viewed along the −X direction. The substrate transfer portion 50 includes a grip portion 54a and a grip portion 54b for gripping two sides of the substrate 110 extending in the X direction (board transport direction).

The grip portion 54a includes a fixed claw 51a that supports the substrate from below along one side of the substrate 110 extending along the substrate transport direction, and a movable claw 52a that presses the substrate from above along the one side. The fixed claw 51a and the movable claw 52a can be integrally moved in the Y direction by the Y direction moving mechanism 53a, and the movable claw 52a can be moved up and down in the Z direction by the Z direction moving mechanism 55a. By driving the fixed claw 51a and the movable claw 52a using these mechanisms, the grip portion 54a sandwiches or releases the substrate 110 from above and below along one side of the substrate 110 extending along the substrate transport direction. It is possible to do it.

Similarly, the grip portion 54b has a fixed claw 51b that supports the substrate from below along the other side of the substrate 110 extending along the substrate transport direction, and a movable claw that presses the substrate from above along the other side. 52b is provided. The fixed claw 51b and the movable claw 52b can be integrally moved in the Y direction by the Y direction moving mechanism 53b, and the movable claw 52b can be moved up and down in the Z direction by the Z direction moving mechanism 55b. By driving the fixed claw 51b and the movable claw 52b using these mechanisms, the grip portion 54b can hold the substrate 110 from above and below along the other side of the substrate 110 extending along the substrate transport direction. It is possible to release it.

Returning to FIG. 1, the preheating unit 22 includes a heat generation source such as a heater (not shown in FIG. 1), a temperature sensor such as a thermocouple, and a temperature control unit, and the position and / or position of the substrate 110 mounted on the upper surface thereof. The range according to the dimensions can be heated to a predetermined temperature. The preheating unit 22 can be configured to be able to adsorb and stably hold the substrate 110 by providing an adsorption means (not shown) or the like.

The bonding stage 20 is a stage that holds the substrate as a work when the work of bonding the die to the substrate is performed. The bonding stage 20 fixed on the moving table 42 can move along the X direction in a horizontal plane together with the moving table 42. The substrate supplied from the substrate supply unit 70 via the preheating unit 22 can be received and horizontally moved to the bonding work position. Then, during the bonding work, the substrate can be held at the bonding work position and the range corresponding to the position and / or size of the substrate 110 can be heated, and after the bonding work, the substrate can be conveyed to the substrate accommodating portion 80 side.

The bonding stage 20 will be described in detail with reference to FIGS. 2 to 7. FIG. 2 is a side view of the bonding stage 20 and its moving mechanism seen along the −X direction, FIG. 3 is a plan view seen along the −Z direction, and FIG. 4 is a front view seen along the + Y direction. .. 5 is a schematic plan view for explaining the temperature control mechanism included in the bonding stage 20, FIG. 6 is a schematic front view, and FIG. 7 is for explaining the adsorption mechanism included in the bonding stage 20. It is a schematic plan view.

As shown in FIGS. 2 to 4, the bonding stage 20 is supported on a moving table 42 movably mounted in the X direction on the stage moving track 41, and is supported by the moving table and the stage moving track. It can move freely in the X direction on 41. For the drive unit of the moving table 42, for example, a drive mechanism using a motor and a ball screw may be used, but when the distance between the stage moving tracks 41 is long, a drive mechanism using a linear motor is preferable.

The bonding stage 20 is provided with a suction mechanism for sucking the substrate 110 on its upper surface, and the suction mechanism has a suction path 30 and a suction hole 31 (suction portion).
As shown in FIG. 7, a large number of suction holes 31 two-dimensionally arranged in a plan view are connected to the suction control unit 32 by an airtight path via a suction path 30. The suction control unit 32 includes, for example, a negative pressure generator 33 such as a vacuum pump, a flow path switching valve 34, and a leak path 35 such as an atmospheric communication path, and operates under the control of the control unit 200. After the substrate 110 is transferred onto the bonding stage 20, the control unit 200 sends an instruction to the suction control unit 32, sucks the substrate from the suction hole 31 (suction portion) via the suction path 30, and bonds the substrate 110. Can be fixed on the stage. Alternatively, the substrate can be released from adsorption by leaking a negative pressure through the suction path 30.

Further, the bonding stage 20 is provided with a heating mechanism for controlling the temperature in a range according to the position and / or size of the substrate 110 mounted on the upper surface thereof, and the heating mechanism is provided with the heater 24. In the present embodiment, the heater 24 is arranged at a position farther from the substrate 110 than the suction mechanism when viewed in the Z direction as shown in FIG. 2, and is arranged in a direction intersecting the suction path 30 in a plan view as shown in FIG. Although extended, the layout of the heater 24 is not limited to this example.

As shown in FIGS. 5 and 6, in order to detect the temperature in the vicinity of the substrate 110, the heating mechanism includes a temperature sensor 23 such as a thermocouple as a temperature detecting unit, and the temperature sensor 23 is a temperature control unit 21. Is connected to. The temperature control unit 21 operates under the control of the control unit 200, and when the substrate 110 is transferred onto the bonding stage 20, the control unit 200 adjusts the temperature of the place where the substrate 110 of the bonding stage 20 is placed. The temperature of the substrate 110 is controlled. The method and arrangement of the temperature sensors 23 are not limited to this example, and for example, a plurality of temperature sensors may be arranged two-dimensionally in a plan view. The temperature sensor may measure the temperature of the portion of the bonding stage close to the substrate, but may also measure the temperature of the substrate itself by a contact type or non-contact type sensor (for example, an infrared sensor). The place where the board 110 is placed in the bonding stage 20, that is, the place where the temperature of the board 110 is controlled may be set by the user, or the position and / or the dimension of the board 110 is detected by a board detection sensor (not shown). , The position information may be output to the control unit 200 and set. The substrate detection sensor is, for example, an image pickup device such as a digital camera.

Returning to FIG. 1, the die supply unit 90 is a device for supplying a die (mounting component) for die bonding. For example, a semiconductor wafer diced to a large number of semiconductor chips (dies) can be held.
The die mounting unit 10 includes a collet capable of adsorbing the die and a collet drive unit for moving the collet in each direction of XYZ.

FIG. 8 is a schematic plan view of the die supply unit 90 and the die mounting unit 10 (mounting unit) in a plan view, and the die 111 as a large number of diced mounting components is placed on the die supply unit 90. It shows the situation that was done. The die mounting unit 10 (mounting unit) includes a collet 13, a Y moving unit 11 that moves the collet 13 in the Y direction, and a Z moving unit 12 that moves the collet 13 in the Z direction. The die mounting unit 10 attracts the die 111 by using the collet 13 in the die supply unit 90, conveys the die 111 to the bonding work position, and places the die 111 at a predetermined position of the substrate 110 held on the bonding stage 20. Further, a pressing force can be applied to the die 111 toward the substrate 110 in the −Z direction. The die mounting portion may be configured such that two Z moving portions are arranged on the Y moving portion 11 and a collet is provided for each, and an intermediate stand is provided between the bonding stage 20 and the die supply portion 90. In this case, the collet on the die supply section 90 picks up the die 111 from the die supply section 90 and places it on the intermediate stand, and the collet on the bonding stage 20 side takes out the die 111 from the intermediate stand and places it on the substrate on the bonding stage 20. It is mounted on 110.

Returning to FIG. 1, a substrate discharging unit 60 is provided between the bonding stage 20 and the substrate accommodating unit 80. The substrate discharge unit 60 includes an X-direction moving mechanism 60X for moving in the X direction and a Z-direction moving mechanism 60Z for moving in the Z direction. Further, the substrate discharge unit 60 includes a gripping mechanism having the same configuration as the substrate transfer unit 50 described with reference to FIG. The substrate discharge unit 60 can pick up the substrate mounted on the bonding stage 20 and carry it out to the substrate accommodating unit 80.

The board accommodating unit 80 includes a substrate accommodating unit 82 capable of accommodating a substrate on which a die is mounted after the bonding work is completed. In the example of FIG. 1, the substrate accommodating portion 80 includes two substrate accommodating portions 82, but the substrate accommodating portion 82 may be a single number or three or more. The board accommodating portion 82 can be moved in the Y direction by the Y direction drive mechanism 80Y, and can be moved in the Z direction by the Z direction drive mechanism 80Z. By driving these drive mechanisms, the substrate can be accommodated at an arbitrary position of the substrate accommodating portion 82.

The control unit 200 is a computer for controlling the operation of the die bonder 100, and internally includes a CPU, a ROM, a RAM, an I / O port, and the like.
A program for executing various processes according to the present embodiment can be stored in a ROM, which is a computer-readable recording medium, together with other programs. The program may be recorded on any recording medium that can be read by a computer. Further, the program may be loaded into the RAM from the outside via the network, or may be loaded into the RAM via the recording medium in which the program is recorded.

The I / O port is connected to an external device or network, and for example, data required for bonding can be input / output to / from an external computer. Further, the I / O port is connected to a monitor or an input device (not shown), and can display the operation status information of the die bonder to the operator and can receive a command from the operator.

The control unit 200 includes a substrate supply unit 70, a substrate extrusion mechanism 71, a substrate transfer unit 50, a preheating unit 22, a moving table 42, a bonding stage 20, a die mounting unit 10, a substrate discharge unit 60, and a substrate accommodating unit 80. It controls the drive of each part. The control unit 200 is electrically connected to the drive mechanism and the sensor of each unit so as to be able to exchange control signals, and controls these.

(Die bonding method)
Next, the die bonding method according to this embodiment will be described.
First, in preparation for starting die bonding, a die 111 (for example, a semiconductor chip) as a mounting member is set in the die supply unit 90. For example, a thermosetting adhesive film is attached to the lower surface of the die 111, that is, the surface that comes into contact with the substrate during bonding. Further, the substrate 110 as a mounted member (work) is set at a predetermined position of the substrate accommodating portion 72 of the substrate supply unit 70. When the setting of the die in the die supply unit 90 and the storage of the substrate in the substrate supply unit 70 are completed, the control unit 200 moves the substrate transfer unit 50 in the −X direction and comes into contact with the substrate supply unit 70. Or move it to a nearby board delivery position.

FIG. 9 is an operation time chart for explaining the operation of each part thereafter.
After moving the board transfer unit 50 to the board receiving position, the control unit 200 drives the board extrusion mechanism 71 to push the rear end of the board 110 and starts feeding the board 110 in the + X direction (901). ).

When the two sides of the substrate 110 extending along the X direction (the substrate transport direction) are placed on the fixed claws 51a and the fixed claws 51b of the substrate transfer portion 50, the control unit 200 has the movable claws 52a of the substrate transfer portion 50 and the movable claws 52a. The movable claw 52b is driven to grip (pinch) the substrate 110 (902).

Next, the control unit 200 moves the substrate transfer unit 50 gripping the substrate 110 in the −Z direction (904), and further moves the substrate transfer unit 50 directly above the preheating unit 22 in the + X direction (903). Then, the substrate transfer portion 50 is released from gripping the substrate 110 (902), and the substrate 110 is placed on the preheating portion 22.

The control unit 200 drives the adsorption control unit 25 of the preheating unit 22 to adsorb the substrate 110 (905), and operates the heater to heat a range corresponding to the position and / or the dimension of the substrate 110 to prepare the substrate 110. The temperature of the heating unit 22 is raised to preheat the substrate. When the curing temperature of the thermosetting adhesive film attached to the lower surface of the die 111 is, for example, 80 ° C to 160 ° C, the temperature of the preheating unit 22 is lower than this by a predetermined temperature (for example, 60). ° C). This is because the temperature of the substrate is raised by preheating so that the substrate can reach the curing temperature in a short time after being transferred onto the bonding stage, and the preheating temperature is excessively raised. This is to prevent the substrate from deteriorating.

Next, the control unit 200 drives the substrate transfer unit 50 again to grip the substrate 110 for which preheating has been completed, and moves it in the + X direction to move it to the work receiving position. At the work receiving position, the bonding stage 20 supported by the moving table 42 stands by, but the control unit 200 moves the heater 24 of the bonding stage 20 to the position of the substrate 110 and the position of the substrate 110 together with the movement of the substrate transfer unit 50. / Or driven to heat a range according to the dimensions to start the temperature rise of the bonding stage.

When the substrate transfer unit 50 reaches directly above the bonding stage 20, the control unit 200 moves the substrate transfer unit 50 in the −Z direction (904). Then, the substrate transfer portion 50 is made to release the grip of the substrate 110 (902), and the substrate 110 is placed on the bonding stage 20. At this time, a part or the entire surface of the portion where the substrate of the bonding stage is not placed is not heated. Further, the control unit 200 drives the suction control unit 32 of the bonding stage 20 to suck the substrate 110, and fixes the substrate 110 at a predetermined position on the bonding stage 20.
Then, with the substrate fixed at a predetermined position, the control unit 200 drives the moving table 42 to move the bonding stage 20 to the bonding work position in the + X direction.

As shown in 908 of FIG. 9, the temperature of the substrate 110 rises to the preheating temperature (for example, 60 ° C.) by the preheating unit 22, and further rises to the curing temperature of the adhesive or higher by the heater 24 of the bonding stage 20. do.

After moving the bonding stage 20 to the bonding work position, the control unit 200 moves the collet of the die mounting unit 10 to a predetermined position of the die supply unit 90, adsorbs the die (semiconductor chip), and picks it up. Then, the collet is moved onto the substrate 110 at the bonding work position, the collet is lowered to bring the die 111 into contact with or close to the substrate 110, and the suction is stopped, so that the die is placed at a predetermined position on the substrate. do. The control unit 200 may control the bonding arm of the die mounting unit 10 so that the collet presses the die 111 against the substrate 110 during bonding. When the bonding material is cured, the bonding of the die is completed.

The die bonder 100 of the present embodiment may be used for bonding one die to one substrate, but may also be used for bonding a plurality of dies to one substrate. For example, as shown in FIG. 10, the dies can be sequentially bonded to the substrate 110 in which the die mounting regions 112 are provided at m × n positions in a plan view. In FIG. 10, an example of m = 7 and n = 10 is shown, but the number and arrangement of the die mounting areas 112 are not limited to this example.

After moving the bonding stage 20 to the bonding work position, the control unit 200 reciprocates the collet of the die mounting unit 10 between the die supply unit 90 and the substrate 110, and sequentially bonds the dies 111. FIG. 11 is a schematic plan view showing the drive position of the Y moving portion 11 of the die mounting portion 10 and the driving position of the moving table 42 for moving the bonding stage 20 in the X direction when the dies 111 are sequentially bonded. Is. Further, FIG. 12 is an operation time chart showing the operation of each part when the dies are sequentially bonded.

When the bonding of all the dies to be mounted on the substrate 110 is completed, the control unit 200 drives the substrate ejection unit 60 to accommodate the bonded substrate in an appropriate substrate accommodating unit 82 of the substrate accommodating unit 80. FIG. 13 is an operation time chart showing the operation of each part when the base plate is housed in the board housing part 80.

The control unit 200 drives the moving table 42 to move the bonding stage 20 to the storage delivery position in the + X direction, and drives the substrate discharging unit 60 to grip the substrate on the bonding stage 20. Then, the substrate discharging portion 60 is moved in the + X direction, and the substrate is accommodated in a slot of an appropriate substrate accommodating portion 82 of the substrate accommodating portion 80. At that time, a substrate extrusion mechanism (not shown) may be used.
By repeating the operation described above, the die bonder 100 of the present embodiment can continuously perform die bonding processing on a large number of substrates.

According to the present embodiment, there is a means for fixing the substrate at a predetermined position on the bonding stage, and the mounted component can be mounted in a state where the substrate is fixed at a predetermined position on the bonding stage. It is not necessary to perform the positioning operation of the mounted component. Therefore, it is possible to shorten the time from transporting the mounted component to mounting. Further, since the mounted component does not rub against the transport lane or the heating stage, there is an advantage that the mounted component is prevented from being scratched or worn.

Further, according to the present embodiment, when the unmounted substrate is moved from the substrate supply unit to the bonding work position, the preheating of the substrate is started before the substrate reaches the bonding work position (heating start step). Moreover, the temperature of the substrate is actively controlled during the work at the bonding work position (heat control process).

In particular, in the present embodiment, the preheating unit 22 is used to preheat the substrate to be bonded next, so that the time from the transfer of the substrate to the bonding stage to the completion of the bonding of the die is completed. Can be shortened.

When bonding to new boards one after another in succession, while the bonding work of one board and the delivery work to the board discharge part are performed on the bonding stage, the next bonding work is performed in the preheating part. The substrate to be used can be preheated. Therefore, the time required to complete the bonding of the dies can be significantly shortened as compared with the case where the substrate at room temperature is transferred onto the bonding stage at the bonding work position and then heating is started. Moreover, since the bonding stage performs feedback control using the detection results of the temperature detection unit until the bonding of all the dies is completed, the temperature of the substrate can be precisely controlled. That is, it is possible to improve the throughput of the bonding work, reduce the manufacturing cost, and achieve high bonding quality.
Further, when the size of the work is smaller than the surface for holding the work of the bonding stage, if the entire surface for holding the work of the bonding stage is uniformly heated, the surface not in contact with the work is heated and energy is wasted. .. However, in the present embodiment, the preheating unit 22 and the bonding stage 20 heat the work by setting a range for uniformly heating according to the position and / or the size of the work. Therefore, it does not waste energy.

[Embodiment 2]
Embodiment 2 of the present invention will be described with reference to the drawings. However, common reference numbers will be assigned to the parts common to the first embodiment, and detailed explanations will be omitted as much as possible.

The die bonder according to the second embodiment also starts preheating of the substrate before the substrate reaches the bonding work position when the unmounted substrate is moved from the substrate supply unit to the bonding work position (heating start step). Then, the temperature of the substrate is actively controlled at the bonding work position until the bonding work of all the dies is completed (heat control step).

In the first embodiment, the substrate supplied from the substrate supply unit was preheated via the preheating unit 22 and transferred to the bonding stage. On the other hand, in the second embodiment, the substrate is transferred from the substrate supply unit to the bonding stage without passing through the preheating unit, but the bonding stage is transferred to the bonding stage after the transfer until the bonding stage is moved to the bonding work position. Starts preheating the substrate. Then, the bonding stage arriving at the bonding work position continues to actively continue the temperature control operation until the bonding work of all the dies is completed.

FIG. 14 is a schematic perspective view for explaining the die bonder according to the second embodiment. Further, FIG. 15 is an operation time chart showing the operation of each part when the unmounted substrate is moved from the board supply part to the bonding work position.
As shown in FIG. 14, in the present embodiment, the stage moving track 41 extends to the board receiving position on the board supply unit 70 side, and the bonding stage 20 can be moved to the board receiving position by the moving table 42. ..

As shown in FIG. 15, when the supply of the substrate is started, the substrate extrusion mechanism 71 operates to extrude the substrate in the + X direction (941). The substrate reaches the substrate transfer portion 50, and the substrate is gripped by the substrate gripping mechanism 54 (942). At this time, although the bonding stage 20 is at the substrate receiving position, the heating unit is already turned on and the heating control of the bonding stage 20 is started.

The substrate transfer portion 50 that grips the substrate moves in the + Z direction (944), and further moves in the + X direction to directly above the bonding stage 20 (943). Then, the substrate transfer unit 50 moves in the −Z direction (944), and the substrate is placed on the bonding stage 20. The suction control unit 32 of the bonding stage 20 operates to suck the substrate (946), and the substrate transfer unit 50 releases the substrate from gripping (942).

The control unit 200 controls the heater 24 of the bonding stage 20 to preheat the substrate 110, moves the moving table 42 in the + X direction, and moves the bonding stage 20 from the substrate receiving position to the bonding work position (945).
The operation after moving the bonding stage 20 to the bonding work position is the same as that of the first embodiment.

According to the present embodiment, when the unmounted substrate is moved from the substrate supply unit to the bonding work position, the preheating of the substrate is started before the substrate reaches the bonding work position, and the work is performed at the bonding work position. The temperature of the substrate is actively controlled even inside. Therefore, the time required to complete the bonding of the dies can be significantly shortened as compared with the case where the substrate at room temperature is transferred onto the bonding stage at the bonding work position and then heating is started. Moreover, since the bonding stage performs feedback control using the temperature sensor until the bonding of all the dies is completed, the temperature of the substrate can be precisely controlled. That is, it is possible to improve the throughput of the bonding work, reduce the manufacturing cost, and achieve high bonding quality.
Further, when the size of the work is smaller than the surface for holding the work of the bonding stage, if the entire surface for holding the work of the bonding stage is uniformly heated, the surface not in contact with the work is heated and energy is wasted. .. However, in the present embodiment, the bonding stage 20 heats the work by setting a range for uniformly heating according to the position and / or the size of the work. Therefore, it does not waste energy.

[Other embodiments]
The present invention is not limited to the embodiments described above, and many modifications can be made within the technical idea of the present invention.
For example, the die is not limited to a semiconductor element (semiconductor chip), and may be an electronic component such as a resistance element or a capacitor. As the work, various mounted members such as a printed circuit board, a flexible board, and a lead frame can be used. As the bonding material, in addition to the thermosetting adhesive, various materials can be used as long as they require a heating step in the bonding process. As described above, the present invention can be widely used not only as a method for manufacturing a semiconductor for die-bonding a semiconductor chip, but also as a method for manufacturing an article for mounting a component such as an electronic component.

An embodiment of the present invention also includes a control program capable of executing the control operation according to the die bonding method described above, and a computer-readable recording medium in which the control program is stored.
The present invention supplies a program that realizes one or more functions of an embodiment to a system or device via a network or storage medium, and one or more processors in the computer of the system or device reads and executes the program. But it is feasible. It can also be realized by a circuit (for example, ASIC) that realizes one or more functions.

The present invention can be widely implemented in a device for die-bonding a semiconductor chip, a device for mounting an electronic component or the like on a circuit board or the like, and the like.
The present invention is not limited to the above embodiments, and various modifications and modifications can be made without departing from the spirit and scope of the present invention. Therefore, in order to publicize the scope of the present invention, the following claims are attached.

01 ... Stand / 10 ... Die mounting part / 20 ... Bonding stage / 21 ... Temperature control part / 22 ... Preheating part / 23 ... Temperature sensor / 24 ... Heater / 30 ... Suction path / 31 ... Suction hole / 32 ... Suction control unit / 41 ... Stage moving track / 42 ... Moving table / 50 ... Board transfer unit / 60 ...・ Board discharge part / 70 ・・・ Board supply part / 71 ・・・ Board extrusion mechanism / 72 ・・・ Board storage part / 80 ・・・ Board storage part / 82 ・・・ Board storage part / 90 ・・・ Die Supply unit / 100 ... Die bonder / 110 ... Board / 111 ... Die / 200 ... Control unit

Claims

The supply unit that supplies the work and
A bonding stage that can hold the work and move from the work receiving position to the bonding work position and can heat a range according to the position and / or size of the work.
A work transfer unit that transfers the work supplied by the supply unit to the bonding stage at the work receiving position, and a work transfer unit.
At the bonding work position, a mounting unit for mounting mounting components on the work held on the bonding stage is provided.
While moving the work from the supply unit to the bonding work position, preheating of the work is started before the work reaches the bonding work position.
During the bonding work at the bonding work position, the bonding stage holding the work controls heating to the work.
Goods manufacturing equipment.
When the work transfer unit transfers the work supplied from the supply unit to the bonding stage, the work transfer unit sandwiches two sides extending along the direction in which the work is transferred.
The article manufacturing apparatus according to claim 1.
The work transfer portion has a fixed claw and a movable claw, and has a fixed claw and a movable claw.
The work is sandwiched between the fixed claw and the movable claw by driving the movable claw.
The article manufacturing apparatus according to claim 2.
The bonding stage has means for fixing the work to a predetermined position of the bonding stage, and moves from the work receiving position to the bonding work position in a state where the work is fixed to the predetermined position of the bonding stage. do,
The article manufacturing apparatus according to any one of claims 1 to 3.
When the work transfer unit transfers the work to the bonding stage,
The bonding stage starts preheating the work before reaching the bonding work position.
The article manufacturing apparatus according to any one of claims 1 to 4.
A preheating unit capable of heating a range according to the position and / or size of the work is provided between the supply unit and the bonding stage.
The work transfer unit transfers the work to the bonding stage after passing the work through the preheating unit.
The article manufacturing apparatus according to any one of claims 1 to 5.
The mounting unit sequentially places a plurality of the mounted components on the work at the bonding work position, and the bonding stage is placed on the work until all the bonding operations of the plurality of mounted components are completed. Control heating,
The article manufacturing apparatus according to any one of claims 1 to 6.
The bonding stage has a suction portion for sucking the work and fixing the work to a predetermined position of the bonding stage, and a heating portion capable of heating a range corresponding to the position and / or size of the work. A temperature detecting unit for detecting the temperature of the bonding stage or the work is provided, and the heating unit starts heating before the suction unit sucks the work.
The article manufacturing apparatus according to any one of claims 1 to 7.
The work is a substrate, and the mounting component is a semiconductor chip.
The article manufacturing apparatus according to any one of claims 1 to 8.
The supply unit that supplies the work and
A bonding stage that can hold the work and move from the work receiving position to the bonding work position and can heat a range according to the position and / or size of the work.
A work transfer unit that transfers the work supplied by the supply unit to the bonding stage at the work receiving position, and a work transfer unit.
A method for manufacturing an article using a device provided with a mounting portion for mounting mounting components on the work held on the bonding stage at the bonding work position.
A heating start step of starting preheating of the work before the work reaches the bonding work position while moving the work from the supply unit to the bonding work position.
It comprises a heating control step in which the bonding stage holding the work controls heating to the work during the bonding work at the bonding work position.
How to manufacture goods.
When the work transfer unit transfers the work supplied from the supply unit to the bonding stage, the work transfer unit sandwiches two sides extending along the direction in which the work is transferred.
The method for manufacturing an article according to claim 10.
The work transfer portion has a fixed claw and a movable claw, and has a fixed claw and a movable claw.
The work is sandwiched between the fixed claw and the movable claw by driving the movable claw.
The method for manufacturing an article according to claim 11.
The bonding stage has means for fixing the work to a predetermined position of the bonding stage, and moves from the work receiving position to the bonding work position in a state where the work is fixed to the predetermined position of the bonding stage. do,
The method for manufacturing an article according to any one of claims 10 to 12.
When the work transfer unit transfers the work to the bonding stage,
In the heating start step, preheating of the work is started before the bonding stage reaches the bonding work position.
The method for manufacturing an article according to any one of claims 10 to 13.
The apparatus includes a preheating unit capable of heating the work between the supply unit and the bonding stage.
In the heating start step, the work transfer unit places the work on the preheating unit.
After that, the work transfer unit transfers the work from the preheating unit to the bonding stage.
The method for manufacturing an article according to any one of claims 10 to 14.
In the heating control step,
The mounting unit sequentially places a plurality of the mounted components on the work at the bonding work position, and the bonding stage is placed on the work until all the bonding operations of the plurality of mounted components are completed. Control heating,
The method for manufacturing an article according to any one of claims 10 to 15.
The bonding stage has a suction portion for sucking the work and fixing the work to a predetermined position of the bonding stage, and a heating portion capable of heating a range corresponding to the position and / or size of the work. A temperature detecting unit for detecting the temperature of the bonding stage or the work.
The heating unit starts heating before the suction unit adsorbs the work.
The method for manufacturing an article according to any one of claims 10 to 16.
The work is a substrate, and the mounting component is a semiconductor chip.
The method for manufacturing an article according to any one of claims 10 to 17.
A program for causing a computer included in the apparatus to execute each step of the method for manufacturing an article according to any one of claims 10 to 18.
A recording medium that can be read by a computer that records the program according to claim 19.