CN116504710A - Mini-LED die bonding device and die bonding method - Google Patents
Mini-LED die bonding device and die bonding method Download PDFInfo
- Publication number
- CN116504710A CN116504710A CN202310750503.XA CN202310750503A CN116504710A CN 116504710 A CN116504710 A CN 116504710A CN 202310750503 A CN202310750503 A CN 202310750503A CN 116504710 A CN116504710 A CN 116504710A
- Authority
- CN
- China
- Prior art keywords
- wafer
- limiting
- substrate
- cylinder
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 87
- 230000007246 mechanism Effects 0.000 claims abstract description 84
- 239000000463 material Substances 0.000 claims abstract description 27
- 235000012431 wafers Nutrition 0.000 claims description 164
- 230000008569 process Effects 0.000 claims description 14
- 238000009434 installation Methods 0.000 claims description 11
- 238000004140 cleaning Methods 0.000 claims description 9
- 238000013459 approach Methods 0.000 claims description 8
- 238000001179 sorption measurement Methods 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims 2
- 230000010405 clearance mechanism Effects 0.000 claims 1
- 239000000428 dust Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 210000003437 trachea Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Robotics (AREA)
- Led Device Packages (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a Mini-LED die bonding device and a die bonding method, which relate to the field of die bonding equipment and comprise a die bonding table, a substrate material changing mechanism, a wafer material loading mechanism, a wafer carrier, a motor and a substrate carrier, wherein a fixing plate is arranged at the top end of the die bonding table, the motor is fixed above the fixing plate, the output end of the motor extends to the lower part of the fixing plate and is connected with a rotating table, four groups of limit cards are arranged on the outer side of the rotating table, and an objective table is movably connected inside each group of limit cards. When the wafer is taken out or bonded, the object stage is kept at a fixed position above the substrate or the wafer, and at the moment, the rotating table is driven by the motor to continuously rotate, so that the limiting sleeve slides outside the sliding rod, the limiting spring and gas in the limiting sleeve are extruded, the gas passes through the exhaust one-way valve, the gas pipe, the gas inlet and the annular pipe to be distributed into each group of gas nozzles, and the gas nozzles are uniformly distributed outside the suction nozzle, so that the gas flow is uniformly sprayed to the outside of the substrate or the wafer.
Description
Technical Field
The invention relates to the field of die bonding equipment, in particular to a Mini-LED die bonding device and a die bonding method.
Background
The Mini LED is usually an LED device with a chip size of 50-200 μm, a die bonder is usually required to be used for mounting the Mini LED, the die bonder is an important device for wafer production, and comprises various suction nozzles, ejector pins, dispensing heads, porcelain nozzles, pins, motors, carbon brushes, encoders, transmission belts, various parts of automatic devices, instruments, meters and the like of various chip mounting devices.
However, in the prior art, the wafer needs to be moved through the swing arm circulation and then is adsorbed through the suction nozzle, but in the prior art, the suction nozzle needs to be aligned with the wafer and then is adsorbed, in the adsorption process, the suction nozzle needs to be temporarily aligned with the wafer and is kept stopped for a certain time, so that intermittent control is performed on the motor until the wafer is sucked into the suction nozzle, the process consumes a certain time, the service efficiency of the device is reduced, in the process of installing the wafer, the wafer needs to be kept aligned with the surface of the substrate, the wafer is accurately installed on the substrate, the motor needs to be intermittently operated in the process, the loss of the motor is improved, and in the process of installing the wafer, the surface of the wafer needs to be cleaned, so that dust accumulation is avoided.
Disclosure of Invention
Based on the above, the invention aims to provide a Mini-LED die bonding device and a die bonding method, so as to solve the technical problems that the die mounting efficiency is low, a motor is required to run continuously in a gap, and the cleaning of the die is inconvenient.
In order to achieve the above purpose, the present invention provides the following technical solutions: the Mini-LED die bonding device comprises a die bonding table, a substrate material changing mechanism, a wafer material loading mechanism, a wafer carrier, a motor and a substrate carrier, wherein a fixing plate is arranged at the top end of the die bonding table, the motor is fixed above the fixing plate, the output end of the motor extends to the lower part of the fixing plate to be connected with a rotating table, four groups of limit clamps are arranged on the outer side of the rotating table, the inside of each group of limit clamps is movably connected with an objective table, a limit mechanism is connected between the objective table and the limit clamps, the end part of the limit mechanism is connected with a cleaning mechanism, a fixing cylinder is arranged in the objective table, an adjusting cylinder is arranged in the interior of the fixing cylinder, a suction nozzle is arranged below the objective table, the bottom end of the fixing plate is positioned above the wafer carrier and the substrate carrier, hanging plates are all arranged at the bottom end of each group of the hanging plates, the two groups of the hanging plates are in opposite rotating directions, the back surfaces of the hanging plates are connected with the fixing cylinder, the output ends of the fixing cylinder extend to the side surfaces of the limit plates, the bottom ends of the fixing plates are positioned at the bottom ends of the fixing plates, the two groups of the hanging plates are positioned at the opposite rotating directions, the two groups of the hanging plates are arranged, and are arranged at the positions of the opposite to be close to the top to the pick-up sensor and are respectively, and are arranged close to the pick-up sensor and are arranged at the top heads and are arranged at the positions, and are close to the pick-up and are arranged in the positions and close to the opposite to the positions, and are arranged in opposite to the positions and are arranged.
Through adopting above-mentioned technical scheme, can be convenient get material and installation to the wafer, and get material and installation in-process, carry out spacingly to the objective table through the limiting plate, make objective table invariable on base plate or wafer top, improved the stability of getting material and installation.
The invention is further characterized in that a conveyor belt and a reloading cylinder are arranged in the substrate reloading mechanism, the reloading cylinder is positioned on the side surface of the conveyor belt, the output end of the reloading cylinder is connected with a push plate, the substrate reloading mechanism and the substrate carrier are kept horizontal, a substrate is arranged above the reloading cylinder, and the substrate is moved into the substrate carrier through the push plate.
By adopting the technical scheme, the substrate can be conveniently mounted on the substrate carrier.
The invention is further characterized in that the bottom end of the substrate carrier is provided with the substrate moving mechanism, the substrate moving mechanism is composed of a plurality of groups of sliding tables with different moving directions, and the substrate moving mechanism drives the substrate carrier to move in multiple directions.
By adopting the technical scheme, the substrate carrier is conveniently moved, so that the substrate carrier is moved to a proper position.
The invention is further characterized in that the pushing cylinder and the feeding table are arranged in the wafer feeding mechanism, the wafer is arranged above the feeding table, the output end of the pushing cylinder is provided with the fixing clamp, and the wafer is moved into the wafer carrier through the fixing clamp.
Through adopting above-mentioned technical scheme, can be convenient carry out the material loading to the wafer.
The invention is further arranged that the bottom end of the wafer carrier is provided with the wafer moving mechanism, the wafer carrier moves in multiple directions through the wafer moving mechanism after the wafer moving mechanism is formed by a plurality of groups of air cylinders in different directions, and the bottom end of the wafer carrier is provided with the ejection mechanism, so that the chips are separated from the wafers through the ejection mechanism.
By adopting the technical scheme, the wafer carrier is conveniently moved, so that the wafer carrier is moved to a proper position.
The invention is further arranged that the bottom end of the fixed plate is provided with the electric connection rod, the top end of the rotating table is connected with the electric connection ring, the electric connection rod is inserted into the electric connection ring and is electrically connected with the electric connection ring, the bottom end of the electric connection ring is connected with the connecting wire, and the electric connection ring is communicated with the objective table in each group of limiting cards through the connecting wire.
Through adopting above-mentioned technical scheme, the convenient power supply to each group objective table makes objective table normal operating.
The invention further provides that the limiting mechanism between the limiting clamp and the objective table comprises a limiting sleeve and a sliding rod, wherein the limiting sleeve is fixed in the limiting clamp, the sliding rod is arranged on the side surface of the objective table, the sliding rod is inserted into the limiting sleeve and is movably connected with the sliding rod, the inner wall of the limiting sleeve is connected with a limiting spring, and the limiting spring is sleeved on the outer side of the sliding rod.
Through adopting above-mentioned technical scheme, conveniently carry out movable spacing to the objective table, carry out spacingly through the limiting plate to the objective table when appropriate, keep the position of objective table to improve the stability that the wafer got material and installed.
The invention is further arranged that the end part of the limit sleeve is connected with an air suction one-way valve, the interior of the sliding rod is hollow, the end part of the sliding rod is provided with an air discharge one-way valve, the port of the air discharge one-way valve is connected with an air pipe, the air pipe is connected with the suction nozzle through an air inlet, the air inlet extends to the interior of the suction nozzle and is provided with a circular pipe, the bottom end of the circular pipe is connected with a plurality of groups of air nozzles, and each group of air nozzles are arranged around the suction nozzle.
Through adopting above-mentioned technical scheme, when spacing through the limiting plate to the objective table, send into the air jet through the trachea with gas in, blow the clearance to the suction nozzle outside, improve the cleanliness factor of getting material and in the installation.
The Mini-LED die bonding method comprises the following steps:
step one: firstly, mounting a substrate on a conveying belt in a substrate material changing mechanism, feeding the substrate onto a substrate carrier in a wafer fixing table, moving the substrate to the position below an objective table through a substrate moving mechanism, then mounting a wafer into a wafer material loading mechanism, transporting the wafer through the material loading table, feeding the wafer onto the wafer carrier in the wafer fixing table, and moving the wafer through the wafer moving mechanism to the position below a group of objective tables;
step two: the electric connection rod, the electric connection ring and the connecting wire supply power to the object table, so that the object table can normally operate, then the motor is started, the output end of the motor drives the rotating table to rotate, and the rotating table drives the outer groups of object tables to synchronously rotate;
step three: the object stage moves to the wafer to be aligned with a group of wafers, at the moment, the top end of the object stage is attached to the limiting plate to limit the object stage, the object stage cannot move, at the moment, the rotating table continuously operates to drive the limiting clamp to approach the object stage, the limiting mechanism is extruded, and the cleaning mechanism is started to clean the outer side of the wafer;
step four: starting the suction nozzle to adsorb and fix the wafer, wherein the process objective table is always kept above the wafer, and the motor continuously runs, so that the motor can not be intermittently started while ensuring stable adsorption of the wafer;
step five: the limiting clamp gradually approaches the objective table and the limiting plate, after a proximity switch at the top end of the limiting clamp and a proximity sensor in the hanging plate reach a proper distance, the proximity sensor senses the proximity switch and starts up to control the fixed air cylinder, the output end of the fixed air cylinder is pulled out from the back of the limiting plate to release the limiting of the limiting plate, the limiting plate rotates under the pushing of the objective table, the objective table continues to rotate along with the rotating table and is separated from the wafer, and the limiting mechanism returns to drive the objective table to return;
step six: the rotating table drives the objective table to rotate to the upper side of the substrate, the objective table is limited through the second group of limiting plates, the outer side of the substrate is cleaned again through the limiting mechanism and the cleaning mechanism, the adjusting cylinder pushes the suction nozzle to be attached to the substrate, the suction nozzle is downwards bonded with the wafer and separated from the wafer, and the adjusting cylinder returns to complete the assembly of a group of wafers.
By adopting the technical scheme
In summary, the invention has the following advantages:
according to the invention, the motor, the rotating table and the objective table are arranged, so that when a wafer is installed, the motor drives the rotating table to rotate, the rotating table synchronously drives the plurality of groups of objective tables to synchronously move, and in the process of installing the wafer, the plurality of groups of objective tables are used for sequentially taking and installing the wafer, so that cantilever cyclic swing is not required, the installation efficiency is improved, and the problem of lower wafer installation efficiency is effectively solved.
According to the invention, the motor, the rotating table, the objective table, the limiting sleeve, the limiting plate, the proximity switch and the fixed air cylinder are arranged, and in the process of taking out and installing the wafer, the objective table is limited by the limiting plate, so that the objective table is kept at a position which is fixed above the wafer or the substrate, the objective table is ensured not to move when the wafer is taken out and bonded, and the stability of installation is ensured.
According to the invention, when the wafer is taken out or bonded through the rotating table, the object table, the limiting sleeve and the air jet ports, the object table is kept at a fixed position above the substrate or the wafer, at the moment, the rotating table is driven by the motor to continuously rotate, so that the limiting sleeve slides outside the sliding rod, the limiting spring and the air in the limiting sleeve are extruded, the air passes through the exhaust one-way valve, the air pipe, the air inlet and the annular pipe to be distributed in each group of air jet ports, the air jet ports are uniformly distributed outside the suction nozzle, so that the air flow is uniformly sprayed to the outside of the substrate or the wafer, the substrate and the wafer are cleaned, the cleanliness of the wafer in the mounting process is improved, and the problem that the wafer is inconvenient to clean is effectively solved.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic top view of the present invention;
FIG. 3 is a schematic view of a turntable mounting structure according to the present invention;
FIG. 4 is a schematic view of the mounting structure of the turntable and motor of the present invention;
FIG. 5 is a schematic view of a stage mounting structure of the present invention;
FIG. 6 is a schematic diagram of a distribution structure of a limiting plate according to the present invention;
FIG. 7 is a schematic view of an alignment structure of an object stage and a limiting plate according to the present invention;
FIG. 8 is a schematic view of the structure of the stage according to the present invention;
FIG. 9 is a schematic view of the jet structure outside the suction nozzle according to the present invention;
fig. 10 is a schematic top view of the nozzle of the present invention.
In the figure: 1. a die bonding table; 101. a fixing plate; 102. a power receiving rod; 103. a hanging plate; 2. a substrate material changing mechanism; 201. a conveyor belt; 202. a material changing cylinder; 3. a wafer loading mechanism; 301. a propulsion cylinder; 302. a feeding table; 4. a wafer carrier; 401. a wafer moving mechanism; 5. a motor; 6. a substrate carrier; 601. a substrate moving mechanism; 7. a detection mechanism; 8. a rotating table; 801. an electric ring; 802. a limit clamp; 803. a proximity switch; 9. an objective table; 901. a fixed cylinder; 902. a slide bar; 903. an exhaust check valve; 904. an air pipe; 10. a limit sleeve; 1001. an air suction one-way valve; 1002. a limit spring; 11. a suction nozzle; 12. a connecting wire; 13. installing a detection camera; 14. a limiting plate; 15. a fixed cylinder; 16. a proximity sensor; 17. adjusting a cylinder; 18. a movable spring; 19. an air inlet; 20. a grommet; 21. and a gas nozzle.
Description of the embodiments
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
Hereinafter, an embodiment of the present invention will be described in accordance with its entire structure.
As shown in the figure, the Mini-LED die bonding device comprises a die bonding table 1, a substrate material changing mechanism 2, a wafer material loading mechanism 3, a wafer carrier 4, a motor 5 and a substrate carrier 6, wherein a fixing plate 101 is arranged at the top end of the die bonding table 1, the motor 5 is fixed above the fixing plate 101, an output end of the motor 5 extends to the lower part of the fixing plate 101 and is connected with a rotating table 8, a plurality of groups of rotating tables 8 are driven to rotate by the motor 5, four groups of limit cards 802 are arranged at the outer side of the rotating table 8, an objective table 9 is movably connected in each group of limit cards 802, so that a plurality of groups of objective tables 9 are driven to rotate, a limit mechanism between each limit card 802 and each objective table 9 comprises a limit sleeve 10 and a slide rod 902, two sides of the objective table 9 are connected with sliding blocks, the limit sleeve 10 is fixed in the limit cards 802 through movable clamping of the sliding blocks, the slide rod 902 is arranged on the side surface of the objective table 9, the sliding rod 902 is inserted into the limit sleeve 10 and is movably connected with the sliding rod 902, the inner wall of the limit sleeve 10 is connected with a limit spring 1002, the limit spring 1002 is sleeved on the outer side of the sliding rod 902, the end part of the limit sleeve 10 is connected with an air suction one-way valve 1001, the inner hollow of the sliding rod 902 is provided with an air discharge one-way valve 903 at the end part, the port of the air discharge one-way valve 903 is connected with an air pipe 904, the air pipe 904 is connected with a suction nozzle 11 through an air inlet 19, the air inlet 19 extends to the suction nozzle 11 and is internally provided with a ring pipe 20, the bottom end of the ring pipe 20 is connected with a plurality of groups of air nozzles 21, each group of air nozzles 21 is arranged around the suction nozzle 11, a fixed cylinder 901 is internally arranged in the object stage 9, an adjusting cylinder 17 is internally arranged in the fixed cylinder 901, the output end of the adjusting cylinder 17 extends to the lower part of the object stage 9 and is provided with the suction nozzle 11, a movable spring 18 is connected between the adjusting cylinder 17 and the suction nozzle 11, can when adjusting cylinder 17 promotes, cushion suction nozzle 11 through movable spring 18, the improvement installation effect, the bottom of fixed plate 101 is located the top of wafer carrier 4 and base plate carrier 6 and all installs hanging plate 103, the bottom of every group hanging plate 103 rotates and connects limiting plate 14, the rotation direction of two sets of limiting plates 14 is opposite, hanging plate 103's the back is connected with fixed cylinder 15, the output of fixed cylinder 15 extends to limiting plate 14's side, the bottom of fixed plate 101 is located the opposite position of every group limiting plate 14 rotation direction all installs and install and detect camera 13, two sets of installation detect camera 13 also respectively with wafer carrier 4, base plate carrier 6 aligns, proximity switch 803 is installed on the top of limiting card 802, hanging plate 103's internally mounted has with proximity switch 803 assorted proximity sensor 16, proximity sensor 16 passes through the wire with fixed cylinder 15 and is connected, objective table 9 top and limiting plate 14 laminating are spacing objective table 9, 9 can't move, rotary table 8 continuously moves this moment, drive limiting card 802 and be close to 9, limiting sleeve 10 is in the slip past the objective table 903 and carry out the slip through the slip air duct joint pipe 903, the slip joint 902 carries out the slip duct 902 to the clearance duct 902 and carry out the slip duct 902 and carry out the dust through the slip duct 902 and the clearance duct 20 and carry out the clearance duct 902 and take off the outside and take off the dust hole in the duct 902, the duct 902 is blown out the duct is opened.
Referring to fig. 1 and 2, a conveyor belt 201 and a reloading cylinder 202 are installed in the substrate reloading mechanism 2, the reloading cylinder 202 is located at a side surface of the conveyor belt 201, an output end of the reloading cylinder 202 is connected with a push plate, the substrate reloading mechanism 2 and the substrate carrier 6 are kept horizontal, a substrate is arranged above the reloading cylinder 202, the substrate is moved to the inside of the substrate carrier 6 by the push plate, a substrate moving mechanism 601 is installed at the bottom end of the substrate carrier 6, the substrate moving mechanism 601 is composed of a plurality of groups of sliding tables with different moving directions, and the substrate moving mechanism 601 drives the substrate carrier 6 to move in multiple directions, so that the substrate is convenient to install and replace.
Referring to fig. 1 and 2, a pushing cylinder 301 and a loading table 302 are installed in the wafer loading mechanism 3, a wafer is installed above the loading table 302, a fixing clamp is installed at an output end of the pushing cylinder 301, the wafer is moved into the wafer carrier 4 through the fixing clamp, a wafer moving mechanism 401 is installed at a bottom end of the wafer carrier 4, after the wafer moving mechanism 401 is formed by a plurality of groups of cylinders in different directions, the wafer carrier 4 moves in multiple directions through the wafer moving mechanism 401, and an ejection mechanism is installed at a bottom end of the wafer carrier 4, and a wafer is separated from the wafer through the ejection mechanism, so that the wafer is convenient to install and replace.
Referring to fig. 3 and 4, a power receiving rod 102 is installed at the bottom end of the fixing plate 101, a power receiving ring 801 is connected to the top end of the rotating table 8, the power receiving rod 102 is inserted into the power receiving ring 801 and is electrically connected with the power receiving ring 801, a connecting wire 12 is connected to the bottom end of the power receiving ring 801, the power receiving ring 801 is communicated with the object stages 9 in each group of limiting cards 802 through the connecting wire 12, and power can be conveniently supplied to each group of object stages 9, so that the object stages 9 can normally operate.
Referring to fig. 1 to 10, the mini-LED die bonding method includes the following steps:
step one: firstly, mounting a substrate on a conveying belt in a substrate material changing mechanism, feeding the substrate onto a substrate carrier in a wafer fixing table, moving the substrate to the position below an objective table through a substrate moving mechanism, then mounting a wafer into a wafer material loading mechanism, transporting the wafer through the material loading table, feeding the wafer onto the wafer carrier in the wafer fixing table, and moving the wafer through the wafer moving mechanism to the position below a group of objective tables;
step two: the electric connection rod, the electric connection ring and the connecting wire supply power to the object table, so that the object table can normally operate, then the motor is started, the output end of the motor drives the rotating table to rotate, and the rotating table drives the outer groups of object tables to synchronously rotate;
step three: the object stage moves to the wafer to be aligned with a group of wafers, at the moment, the top end of the object stage is attached to the limiting plate to limit the object stage, the object stage cannot move, at the moment, the rotating table continuously operates to drive the limiting clamp to approach the object stage, the limiting mechanism is extruded, and the cleaning mechanism is started to clean the outer side of the wafer;
step four: starting the suction nozzle to adsorb and fix the wafer, wherein the process objective table is always kept above the wafer, and the motor continuously runs, so that the motor can not be intermittently started while ensuring stable adsorption of the wafer;
step five: the limiting clamp gradually approaches the objective table and the limiting plate, after a proximity switch at the top end of the limiting clamp and a proximity sensor in the hanging plate reach a proper distance, the proximity sensor senses the proximity switch and starts up to control the fixed air cylinder, the output end of the fixed air cylinder is pulled out from the back of the limiting plate to release the limiting of the limiting plate, the limiting plate rotates under the pushing of the objective table, the objective table continues to rotate along with the rotating table and is separated from the wafer, and the limiting mechanism returns to drive the objective table to return;
step six: the rotating table drives the objective table to rotate to the upper side of the substrate, the objective table is limited through the second group of limiting plates, the outer side of the substrate is cleaned again through the limiting mechanism and the cleaning mechanism, the adjusting cylinder pushes the suction nozzle to be attached to the substrate, the suction nozzle is downwards bonded with the wafer and separated from the wafer, and the adjusting cylinder returns to complete the assembly of a group of wafers.
The working principle of the invention is as follows: when the wafer fixing device is used, firstly, a substrate is mounted on a conveying belt 201 in a substrate material changing mechanism 2, the substrate is fed onto a substrate carrier 6 in a wafer fixing table 1, the substrate is moved to the lower part of a carrying table 9 through a substrate moving mechanism 601, then a wafer is mounted in a wafer material loading mechanism 3, the wafer is transported through a material loading table 302, the wafer is fed onto a wafer carrier 4 in the wafer fixing table 1, the wafer is moved through a wafer moving mechanism 401, the wafer is moved to the lower part of a group of carrying tables 9, the carrying tables 9 are powered through a power receiving rod 102, a power receiving ring 801 and a connecting wire 12, so that the carrying tables 9 can normally operate, then a motor 5 is started, the output end of the motor 5 drives a rotating table 8 to rotate, the rotating table 8 drives a plurality of groups of carrying tables 9 on the outer side to synchronously rotate, the carrying tables 9 are firstly moved to the wafer to be aligned with a group of wafers, at this time, the top end of the objective table 9 is attached to the limiting plate 14 to limit the objective table 9, the objective table 9 cannot move, at this time, the rotary table 8 continuously operates to drive the limiting clamp 802 to approach the objective table 9, the limiting sleeve 10 slides outside the sliding rod 902 and extrudes the limiting spring 1002, at this time, air in the limiting sleeve 10 pushes the exhaust one-way valve 903 to open through a pipeline in the sliding rod 902, air flow enters the outside of the suction nozzle 11 through the air pipe 904 and is distributed to the air nozzles 21 of each group through the annular pipe 20 to be sprayed out, the surface of the wafer is subjected to air-jet cleaning, dust accumulation is reduced, meanwhile, an ejection mechanism below the wafer carrier 4 is started, a group of wafers are ejected, the wafers are aligned with the suction nozzle 11, the suction nozzle 11 is started to adsorb and fix the wafers, the objective table 9 is always kept above the wafers during the process, and the motor 5 continuously operates, therefore, the motor can not be intermittently started while ensuring stable adsorption of the wafer, the adsorption effect is improved, and the service life of the motor is prolonged;
then the limit clamp 802 gradually approaches the objective table 9 and the limit plate 14, after the proximity switch 803 at the top end of the limit clamp 802 and the proximity sensor 16 in the hanging plate 103 reach a proper distance, the proximity sensor 16 senses the proximity switch 803 and starts to control the fixed air cylinder 15, the output end of the fixed air cylinder 15 is pulled out from the back of the limit plate 14 to release the limit of the limit plate 14, the limit plate 14 rotates under the pushing of the objective table 9, the objective table 9 continues to rotate along with the rotating table 8 to separate from the wafer, after the proximity switch 803 is far away from the proximity sensor 16, the output end of the fixed air cylinder 15 stretches out, the limit plate 14 returns under the pushing of the gravity and the output end of the fixed air cylinder 15, then under the pushing of the limit spring 1002, the objective table 9 moves in the limit clamp 802, the sliding rod 902 is pulled out from the limit sleeve 10, and the external air is sucked into the limit sleeve 10 from the suction check valve 1001, the object stage 9 is restored to the original position, the rotating table 8 drives the object stage 9 to rotate to the upper part of the substrate, at the moment, the second group hanging connection plate 103 and the limiting plate 14 intercept the object stage 9 again, the adjusting air cylinder 17 pushes the suction nozzle 11 to be attached to the substrate, the suction nozzle 11 is downwards bonded with the wafer and separated from the wafer, the adjusting air cylinder 17 returns to finish the assembly of a group of wafers, in the process, the object stage 9 is intercepted by the second group limiting plate 14, the stability of the wafer mounting on the substrate is ensured, and the air in the limiting sleeve 10 is extruded by the sliding rod 902 again when the wafer is mounted, the air is sent into each group of air nozzles 21 from the exhaust check valve 903 and the air pipe 904 to clean the air inlet outside the substrate, the wafer mounting effect is improved, the proximity switch 803 on the limiting card 802 is also close to the proximity sensor 16 in the second group hanging connection plate 103, the limit of the second group of limiting plates 14 is released, the object stage 9 continues to move and separate from the base plate, a group of wafers are installed, the motor 5 is not intermittently controlled in the process, and the service life of the motor is prolonged.
Although embodiments of the invention have been shown and described, the detailed description is to be construed as exemplary only and is not limiting of the invention as the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples, and modifications, substitutions, variations, etc. may be made in the embodiments as desired by those skilled in the art without departing from the principles and spirit of the invention, provided that such modifications are within the scope of the appended claims.
Claims (9)
1. Mini-LED die bonding device, including die bonding platform (1), base plate feed mechanism (2), wafer feed mechanism (3), wafer carrier (4), motor (5) and base plate carrier (6), its characterized in that: the utility model discloses a die bonding machine, including die bonding platform (1), fixed plate (101) are installed on the top of die bonding platform (1), motor (5) are fixed in the top of fixed plate (101), and the output of motor (5) extends to the below of fixed plate (101) and is connected with rolling table (8), four sets of spacing card (802) have been seted up in rolling table (8) outside, and the inside of every set of spacing card (802) all swing joint has objective table (9), be connected with stop gear between objective table (9) and spacing card (802), and stop gear's end connection has clearance mechanism, the internally mounted of objective table (9) has fixed cylinder (901), the internally mounted of fixed cylinder (901) has adjustment cylinder (17), the output of adjustment cylinder (17) extends to the below of objective table (9) and installs suction nozzle (11), the bottom of fixed plate (101) is located the top of wafer carrier (4) and base plate carrier (6) and all installs fishplate bar (103), the bottom of every set of fishplate bar (103) rotates limiting plate bar (14), the opposite direction of rotation of two sets of limiting plates (14) is connected to fixed cylinder (15) and is connected to fixed cylinder (15) side of the fixed cylinder (15), the bottom of fixed plate (101) is located every group limiting plate (14) rotation direction opposite position and all installs installation detection camera (13), and two sets of installation detection cameras (13) also align with wafer carrier (4), base plate carrier (6) respectively, proximity switch (803) are installed on the top of spacing card (802), the internally mounted of hanging board (103) has proximity sensor (16) with proximity switch (803) assorted, and proximity sensor (16) are connected through the wire with fixed cylinder (15).
2. The Mini-LED die attach apparatus of claim 1, wherein: the inside of base plate feed mechanism (2) is installed conveyer (201) and reload cylinder (202), and reload cylinder (202) are located the side of conveyer (201), and the output of reload cylinder (202) is connected with the push pedal, and base plate feed mechanism (2) keeps the level with base plate carrier (6), and the top of reload cylinder (202) is provided with the base plate, removes the inside of base plate carrier (6) with the base plate through the push pedal.
3. The Mini-LED die attach apparatus of claim 1, wherein: the bottom end of the substrate carrier (6) is provided with a substrate moving mechanism (601), the substrate moving mechanism (601) is composed of a plurality of groups of sliding tables with different moving directions, and the substrate moving mechanism (601) drives the substrate carrier (6) to move in multiple directions.
4. The Mini-LED die attach apparatus of claim 1, wherein: the wafer loading mechanism is characterized in that a pushing cylinder (301) and a loading table (302) are arranged in the wafer loading mechanism (3), a wafer is arranged above the loading table (302), a fixing clamp is arranged at the output end of the pushing cylinder (301), and the wafer is moved into the wafer carrier (4) through the fixing clamp.
5. The Mini-LED die attach apparatus of claim 1, wherein: the bottom end of the wafer carrier (4) is provided with a wafer moving mechanism (401), after the wafer moving mechanism (401) is formed by a plurality of groups of cylinders in different directions, the wafer carrier (4) moves in multiple directions through the wafer moving mechanism (401), and the bottom end of the wafer carrier (4) is provided with an ejection mechanism which separates chips from wafers.
6. The Mini-LED die attach apparatus of claim 1, wherein: the utility model discloses a motor vehicle, including fixed plate (101), electric pole (102) are installed to the bottom of fixed plate (101), the top of rotating platform (8) is connected with and connects electric ring (801), and electric pole (102) insert the inside that connects electric ring (801) to with connect electric ring (801) electric connection, the bottom that connects electric ring (801) is connected with connecting wire (12), connects electric ring (801) and objective table (9) in each group limit card (802) through connecting wire (12) switch on.
7. The Mini-LED die attach apparatus of claim 1, wherein: the limiting mechanism between the limiting clamp (802) and the objective table (9) comprises a limiting sleeve (10) and a sliding rod (902), wherein the limiting sleeve (10) is fixed inside the limiting clamp (802), the sliding rod (902) is installed on the side face of the objective table (9), the sliding rod (902) is inserted into the limiting sleeve (10) and movably connected with the sliding rod (902), a limiting spring (1002) is connected to the inner wall of the limiting sleeve (10), and the limiting spring (1002) is sleeved on the outer side of the sliding rod (902).
8. The Mini-LED die attach apparatus of claim 7, wherein: the utility model discloses a suction pipe is characterized by comprising a limit sleeve (10), a suction pipe and a suction pipe, wherein the end part of the limit sleeve (10) is connected with a suction check valve (1001), an exhaust check valve (903) is arranged at the hollow inside and end part of a sliding rod (902), an air pipe (904) is connected to a port of the exhaust check valve (903), the air pipe (904) is connected with a suction nozzle (11) through an air inlet (19), the air inlet (19) extends to the suction nozzle (11) and internally provided with a ring pipe (20), the bottom end of the ring pipe (20) is connected with a plurality of groups of air nozzles (21), and each group of air nozzles (21) are arranged around the suction nozzle (11).
9. The Mini-LED die attach method of claim 1, wherein: the method comprises the following steps:
step one: firstly, mounting a substrate on a conveying belt in a substrate material changing mechanism, feeding the substrate onto a substrate carrier in a wafer fixing table, moving the substrate to the position below an objective table through a substrate moving mechanism, then mounting a wafer into a wafer material loading mechanism, transporting the wafer through the material loading table, feeding the wafer onto the wafer carrier in the wafer fixing table, and moving the wafer through the wafer moving mechanism to the position below a group of objective tables;
step two: the electric connection rod, the electric connection ring and the connecting wire supply power to the object table, so that the object table can normally operate, then the motor is started, the output end of the motor drives the rotating table to rotate, and the rotating table drives the outer groups of object tables to synchronously rotate;
step three: the object stage moves to the wafer to be aligned with a group of wafers, at the moment, the top end of the object stage is attached to the limiting plate to limit the object stage, the object stage cannot move, at the moment, the rotating table continuously operates to drive the limiting clamp to approach the object stage, the limiting mechanism is extruded, and the cleaning mechanism is started to clean the outer side of the wafer;
step four: starting the suction nozzle to adsorb and fix the wafer, wherein the process objective table is always kept above the wafer, and the motor continuously runs, so that the motor can not be intermittently started while ensuring stable adsorption of the wafer;
step five: the limiting clamp gradually approaches the objective table and the limiting plate, after a proximity switch at the top end of the limiting clamp and a proximity sensor in the hanging plate reach a proper distance, the proximity sensor senses the proximity switch and starts up to control the fixed air cylinder, the output end of the fixed air cylinder is pulled out from the back of the limiting plate to release the limiting of the limiting plate, the limiting plate rotates under the pushing of the objective table, the objective table continues to rotate along with the rotating table and is separated from the wafer, and the limiting mechanism returns to drive the objective table to return;
step six: the rotating table drives the objective table to rotate to the upper side of the substrate, the objective table is limited through the second group of limiting plates, the outer side of the substrate is cleaned again through the limiting mechanism and the cleaning mechanism, the adjusting cylinder pushes the suction nozzle to be attached to the substrate, the suction nozzle is downwards bonded with the wafer and separated from the wafer, and the adjusting cylinder returns to complete the assembly of a group of wafers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310750503.XA CN116504710B (en) | 2023-06-25 | 2023-06-25 | Mini-LED die bonding device and die bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310750503.XA CN116504710B (en) | 2023-06-25 | 2023-06-25 | Mini-LED die bonding device and die bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116504710A true CN116504710A (en) | 2023-07-28 |
| CN116504710B CN116504710B (en) | 2023-12-29 |
Family
ID=87325059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310750503.XA Active CN116504710B (en) | 2023-06-25 | 2023-06-25 | Mini-LED die bonding device and die bonding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116504710B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010063412A (en) * | 1999-12-22 | 2001-07-09 | 윤종용 | Apparatus for bonding CSP dies |
| JP2012069730A (en) * | 2010-09-24 | 2012-04-05 | Hitachi High-Tech Instruments Co Ltd | Die bonder and bonding method |
| CN210429766U (en) * | 2019-11-04 | 2020-04-28 | 深圳新益昌科技股份有限公司 | Mini-LED wide bracket die bonder |
| WO2022004170A1 (en) * | 2020-07-03 | 2022-01-06 | キヤノン株式会社 | Article manufacturing device, article manufacturing method, program, and recording medium |
| CN217641226U (en) * | 2022-05-13 | 2022-10-21 | 深圳市万福达智能装备有限公司 | Multi-swing-arm die bonder for Mini LED |
| CN115541581A (en) * | 2022-10-21 | 2022-12-30 | 广东芯乐光光电科技有限公司 | Mini-LED dispensing detection equipment and dispensing detection method |
| CN116053153A (en) * | 2023-01-06 | 2023-05-02 | 华南理工大学 | Die bonder and die bonding method |
-
2023
- 2023-06-25 CN CN202310750503.XA patent/CN116504710B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010063412A (en) * | 1999-12-22 | 2001-07-09 | 윤종용 | Apparatus for bonding CSP dies |
| JP2012069730A (en) * | 2010-09-24 | 2012-04-05 | Hitachi High-Tech Instruments Co Ltd | Die bonder and bonding method |
| CN210429766U (en) * | 2019-11-04 | 2020-04-28 | 深圳新益昌科技股份有限公司 | Mini-LED wide bracket die bonder |
| WO2022004170A1 (en) * | 2020-07-03 | 2022-01-06 | キヤノン株式会社 | Article manufacturing device, article manufacturing method, program, and recording medium |
| CN217641226U (en) * | 2022-05-13 | 2022-10-21 | 深圳市万福达智能装备有限公司 | Multi-swing-arm die bonder for Mini LED |
| CN115541581A (en) * | 2022-10-21 | 2022-12-30 | 广东芯乐光光电科技有限公司 | Mini-LED dispensing detection equipment and dispensing detection method |
| CN116053153A (en) * | 2023-01-06 | 2023-05-02 | 华南理工大学 | Die bonder and die bonding method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116504710B (en) | 2023-12-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102693921B (en) | Foreign substance removing device and die bonder equipped with the same | |
| CN101677060B (en) | Part mounting device | |
| WO2015045018A1 (en) | Component mounting device | |
| CN109225968B (en) | Wiping device | |
| CN105609436B (en) | A kind of vertical back bonding equipment | |
| KR20070058982A (en) | Work transporting device and work transporting method | |
| US6453548B1 (en) | Electronic component mounting method | |
| JP2012116528A (en) | Taping unit and electronic component inspection device | |
| CN116504710B (en) | Mini-LED die bonding device and die bonding method | |
| CN110211898B (en) | Stable type chip sorting equipment with function destatics | |
| CN114405860A (en) | All-round appearance imperfections check out test set | |
| JP3497078B2 (en) | Die bonder | |
| JPH05267896A (en) | Surface mounting machine | |
| JPH0964147A (en) | Feeding-return device for wafer ring | |
| CN219095900U (en) | Backlight film laminating equipment | |
| CN109108604B (en) | Workpiece inserting device and automatic processing equipment thereof | |
| JP3462621B2 (en) | Nozzle drive mechanism of mounting machine | |
| CN217007033U (en) | All-round appearance imperfections check out test set | |
| CN106238338A (en) | A kind of automatic letter sorting machine | |
| CN115206856A (en) | Chip element feeding device with dust removal function | |
| JPH10209687A (en) | Structure of air cylinder for elevating/lowering nozzle in surface mounting machine | |
| CN206009253U (en) | A kind of automatic letter sorting machine | |
| JP3745479B2 (en) | Air supply circuit for surface mounters | |
| CN210456596U (en) | Automatic feeding device is used in circuit board processing | |
| CN209156482U (en) | Wiping device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |