CN115206856A - Chip element feeding device with dust removal function - Google Patents
Chip element feeding device with dust removal function Download PDFInfo
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- CN115206856A CN115206856A CN202210827296.9A CN202210827296A CN115206856A CN 115206856 A CN115206856 A CN 115206856A CN 202210827296 A CN202210827296 A CN 202210827296A CN 115206856 A CN115206856 A CN 115206856A
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- base
- seat
- chip component
- support frame
- chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning In General (AREA)
Abstract
The invention discloses a chip element supply device with a dust removal function, which comprises a base, a support frame and a feed box, wherein the support frame is arranged on the base; first pneumatic rod work drives the linking arm and removes in the spout, push plate begins to remove this moment, in the chip component that will be located the workbin in proper order pushes away transposable draw-in groove, and the propelling movement back of finishing each time, servo motor work drives the swivel mount rotation, rotatory back each time, guarantee transposable top side and support frame top side parallel and level all the time, then power motor work realizes the conveyer belt and takes turns to the transmission, drive the slide through the holder and remove along the slide rail, then the removal of regulating plate and push rod is realized in second pneumatic rod work, realize that the push rod slides in the draw-in groove, with the chip component propelling movement to the blown down tank in the draw-in groove, realize the automatic feeding of chip component, degree of automation is high, and the machining efficiency of chip component is improved.
Description
Technical Field
The invention relates to the technical field of chip element processing, in particular to a chip element supply device with a dust removal function.
Background
Chips, also known as microcircuits, microchips, and integrated circuits, are silicon chips containing integrated circuits that are small and often part of a computer or other electronic device.
When a chip element is processed, automatic feeding operation needs to be carried out on the chip element, and the existing feeding operation needs manual assistance, so that the processing efficiency is low; meanwhile, in the subsequent processing process of the chip element, the surface of the chip needs to be subjected to dust removal operation, otherwise, the normal use of the chip element is influenced after the subsequent installation is finished.
Disclosure of Invention
The invention provides a chip element supply device with a dust removal function, which solves the problems that when a chip element is processed, the automatic supply operation is required, the existing supply operation needs manual assistance, and the processing efficiency is low; meanwhile, in the subsequent processing process of the chip element, the surface of the chip element needs to be subjected to dust removal operation, otherwise, the normal use of the chip element is influenced after the subsequent installation is finished.
In order to achieve the purpose, the invention adopts the following technical scheme:
a chip element supply device with a dust removal function comprises a base, a support frame and a feed box, wherein the support frame is installed on the base, the feed box used for stacking chip elements is installed on the support frame, a pushing plate is installed on the top side of the support frame in a sliding mode, shaft bases are symmetrically installed on the base, a rotary seat is installed between the shaft bases in a rotating mode, a clamping groove is formed in each side of the rotary seat, an adjusting plate is installed on the base in a sliding mode, and a push rod is installed on the adjusting plate;
install the blown down tank on the base, and blown down tank and draw-in groove adaptation, dust removal mechanism is installed to the blown down tank outer end.
Preferably, the supporting frame is provided with a sliding groove, a first air pressure rod is mounted at the bottom side of the supporting frame, a connecting arm is mounted at the telescopic end of the first air pressure rod, and the connecting arm penetrates through the sliding groove and is connected with the pushing plate.
Preferably, a servo motor is installed on the outer side of the shaft seat, and the output end of the servo motor is connected with the rotary seat.
Preferably, two belt pulleys are installed at the top of the base and are driven by a conveying belt, a power motor is installed in the base, and the output end of the power motor is connected with one of the belt pulleys.
Preferably, install the slide rail on the base, and install the slide on the slide rail, install the holder on the slide, and the holder is connected with the conveyer belt.
Preferably, the clamping seat is provided with a second air pressure rod, and the telescopic end of the second air pressure rod is connected with the adjusting plate.
Preferably, the dust removal mechanism comprises a U-shaped seat, a plurality of air injection seats are arranged on two opposite sides inside the U-shaped seat, a plurality of air holes are formed in the air injection seats, and the air injection seats are connected through connecting pipes.
Preferably, install the mounting panel on the base, and install the inflator pump on the mounting panel, install the spring in the inflator pump, and the spring is connected with the piston, the piston is connected with connecting rod one end, and the connecting rod other end installs the contact plate.
Chip elements are stacked in the material box, the top side of the rotary seat is parallel to the top side of the support frame at the moment, the connecting arm is driven to move in the sliding groove through the work of the first air pressure rod, the push plate starts to move at the moment, the chip elements in the material box are sequentially pushed into the clamping grooves of the rotary seat, the servo motor works to drive the rotary seat to rotate after each pushing is finished, and the top side of the rotary seat is always parallel to the top side of the support frame after each rotation;
the draw-in groove that has the chip component is rotatory when corresponding with the blown down tank, realize the conveyer belt through power motor work and take turns to the transmission this moment, drive the slide through the holder and remove along the slide rail, then the removal of second air pressure bar work realization regulating plate and push rod, realize the push rod and slide in the draw-in groove, with the chip component propelling movement in the draw-in groove to the blown down tank in, through the U type seat of dust removal mechanism, the slide removes to act on the contact plate this moment, drive connecting rod and piston and remove in the gas cylinder, carry the connecting pipe with gas in the gas cylinder when compression spring, spout from jet-propelled seat at last, to the chip component through U type seat realization dust removal operation.
The invention has the beneficial effects that: the first air pressure rod works to drive the connecting arm to move in the sliding groove, the pushing plate starts to move at the moment, chip elements in the material box are sequentially pushed into the clamping groove of the rotary seat, after each pushing is finished, the servo motor works to drive the rotary seat to rotate, after each rotation, the top side of the rotary seat is always parallel to the top side of the supporting frame, then the power motor works to realize transmission of the conveying belt on the belt wheel, the sliding seat is driven to move along the sliding rail through the clamping seat, then the second air pressure rod works to realize movement of the adjusting plate and the push rod, the push rod slides in the clamping groove, the chip elements in the clamping groove are pushed to the discharging groove, automatic supply of the chip elements is realized, the automation degree is high, and the processing efficiency of the chip elements is improved;
the chip elements sequentially pass through the U-shaped seat when moving, the sliding seat moves to act on the contact plate at the moment to drive the connecting rod and the piston to move in the inflator pump, gas in the inflator pump is conveyed to the connecting pipe while the spring is compressed, and finally the gas is sprayed out from the gas spraying seat, the generated high-pressure gas blows the surface of the chip elements to blow off dust of the chip elements, and the dust removal operation of the chip elements is automatically realized.
Drawings
FIG. 1 is a schematic view of an overall first structure of the present invention;
FIG. 2 is a schematic view of a second overall structure of the present invention;
FIG. 3 is a schematic view of a swivel mount mounting structure according to the present invention;
FIG. 4 is an enlarged view of a portion of the area A of FIG. 1 according to the present invention;
FIG. 5 is an enlarged view of a portion of the area B of FIG. 1 in accordance with the present invention;
fig. 6 is a schematic view of the internal structure of the inflator according to the present invention.
Illustration of the drawings:
1. a base; 2. a support frame; 3. a material box; 4. a push plate; 5. a shaft seat; 6. rotating; 7. a card slot; 8. an adjusting plate; 9. a push rod; 10. a discharge chute; 11. a dust removal mechanism; 12. a first air pressure lever; 13. a chute; 14. a connecting arm; 15. a servo motor; 16. a pulley; 17. a conveyor belt; 18. a slide rail; 19. a slide base; 20. a holder; 21. a second pneumatic rod; 22. a U-shaped seat; 23. an air injection seat; 24. a connecting pipe; 25. mounting a plate; 26. an inflator; 27. a spring; 28. a piston; 29. a connecting rod; 30. a contact plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Specific examples are given below.
Referring to fig. 1 to 6, a chip component supply device with a dust removal function comprises a base 1, a support frame 2 and a bin 3, wherein the support frame 2 is installed on the base 1, the bin 3 for stacking chip components is installed on the support frame 2, a push plate 4 is installed on the top side of the support frame 2 in a sliding manner, a sliding groove 13 is formed in the support frame 2, a first air pressure rod 12 is installed on the bottom side of the support frame 2, a connecting arm 14 is installed at the telescopic end of the first air pressure rod 12, the connecting arm 14 penetrates through the sliding groove 13 to be connected with the push plate 4, the first air pressure rod 12 works to drive the connecting arm 14 to move in the sliding groove 13, the push plate 4 starts to move at the moment, chip components located in the bin 3 are sequentially pushed into a clamping groove 7 of a rotary seat 6, shaft seats 5 are symmetrically installed on the base 1, the rotary seat 6 is rotatably installed between the shaft seats 5, a servo motor 15 is installed outside the shaft seats 5, the output end of the servo motor 15 is connected with the rotary seat 6, the rotary seat 6 is driven to rotate by the work of the servo motor 15, after each rotation, the top side of the rotary seat 6 is always parallel and level with the top side of the support frame 2, each side of the rotary seat 6 is provided with a clamping groove 7, the base 1 is provided with the adjusting plate 8 in a sliding manner, the adjusting plate 8 is provided with the push rod 9, the top of the base 1 is provided with two belt wheels 16, the two belt wheels 16 are driven by the conveying belt 17, the base 1 is internally provided with the power motor, the output end of the power motor is connected with one of the belt wheels 16, the base 1 is provided with the sliding rail 18, the sliding rail 18 is provided with the sliding seat 19, the sliding seat 19 is provided with the clamping seat 20, the clamping seat 20 is connected with the conveying belt 17, the clamping seat 20 is provided with the second air pressure rod 21, and the telescopic end of the second air pressure rod 21 is connected with the adjusting plate 8, the power motor works to realize transmission of the conveying belt 17 on the belt pulley 16, the clamping seat 20 drives the sliding seat 19 to move along the sliding rail 18, then the second air pressure rod 21 works to realize movement of the adjusting plate 8 and the push rod 9, and the push rod 9 slides in the clamping groove 7;
install blown down tank 10 on base 1, and blown down tank 10 and draw-in groove 7 adaptation, dust removal mechanism 11 is installed to blown down tank 10 outer end, dust removal mechanism 11 includes U type seat 22, and the inside double-phase offside of U type seat 22 is provided with a plurality of gas injection seat 23, and has seted up a plurality of gas pocket on the gas injection seat 23, and connect through connecting pipe 24 between the gas injection seat 23, install mounting panel 25 on the base 1, and install inflator pump 26 on the mounting panel 25, install spring 27 in the inflator pump 26, and spring 27 is connected with piston 28, piston 28 is connected with connecting rod 29 one end, and connecting rod 29 installs contact plate 30 at the other end, when slide 19 removes the removal that realizes the chip component, slide 19 acts on contact plate 30 this moment, drive connecting rod 29 and piston 28 and remove in inflator pump 26, carry the connecting pipe 24 with the interior gas of inflator pump 26 when compressing spring 27, spout from gas injection seat 23 at last, the high-pressure gas that produces blows off the chip component surface, blow off the dust of chip component, after 19 is putted aside, drive piston 28 through spring 27 and remove the normal position, realize the continuous operation of chip repeatedly.
Chip elements are stacked in the material box 3, the top side of the rotary seat 6 is parallel and level to the top side of the support frame 2 at the moment, the first air pressure rod 12 works to drive the connecting arm 14 to move in the sliding groove 13, the push plate 4 starts to move at the moment, the chip elements in the material box 3 are sequentially pushed into the clamping groove 7 of the rotary seat 6, after each pushing is finished, the servo motor 15 works to drive the rotary seat 6 to rotate, and after each rotating, the top side of the rotary seat 6 is always parallel and level to the top side of the support frame 2;
when the clamping groove 7 with the chip element rotates to correspond to the discharge chute 10, the transmission of the conveying belt 17 on the belt wheel 16 is realized through the work of the power motor, the sliding seat 19 is driven to move along the sliding rail 18 through the clamping seat 20, then the movement of the adjusting plate 8 and the push rod 9 is realized through the work of the second air pressure rod 21, the push rod 9 slides in the clamping groove 7, the chip element in the clamping groove 7 is pushed into the discharge chute 10 and passes through the U-shaped seat 22 of the dust removing mechanism 11, at the moment, the sliding seat 19 moves to act on the contact plate 30, the connecting rod 29 and the piston 28 are driven to move in the air cylinder 26, the air in the air cylinder 26 is conveyed to the connecting pipe 24 while the spring 27 is compressed, and finally the chip element passing through the U-shaped seat 22 is sprayed out from the air injection seat 23, and the dust removing operation is realized for the chip element passing through the U-shaped seat 22.
The first air pressure rod 12 works to drive the connecting arm 14 to move in the sliding groove 13, at the moment, the pushing plate 4 starts to move, chip elements in the material box 3 are sequentially pushed into the clamping groove 7 of the rotary seat 6, after each pushing is finished, the servo motor 15 works to drive the rotary seat 6 to rotate, after each rotation, the top side of the rotary seat 6 is always kept flush with the top side of the support frame 2, then the power motor works to realize transmission of the conveying belt 17 on the belt wheel 16, the sliding seat 19 is driven by the clamping seat 20 to move along the sliding rail 18, then the second air pressure rod 21 works to realize movement of the adjusting plate 8 and the push rod 9, sliding of the push rod 9 in the clamping groove 7 is realized, the chip elements in the clamping groove 7 are pushed to the discharging groove 10, automatic supply of the chip elements is realized, the automation degree is high, and the processing efficiency of the chip elements is improved;
when the chip element moves, the chip element sequentially passes through the U-shaped seat 22, at the moment, the sliding seat 19 moves to act on the contact plate 30 to drive the connecting rod 29 and the piston 28 to move in the inflator 26, the gas in the inflator 26 is conveyed to the connecting pipe 24 while the spring 27 is compressed, finally, the gas is sprayed out from the gas spraying seat 23, the generated high-pressure gas blows the surface of the chip element to blow off dust of the chip element, and the dust removal operation on the chip element is automatically realized.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered as the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.
Claims (8)
1. The chip element supply device with the dust removal function is characterized by comprising a base (1), a support frame (2) and a material box (3), wherein the support frame (2) is installed on the base (1), the material box (3) used for stacking chip elements is installed on the support frame (2), a pushing plate (4) is installed on the top side of the support frame (2) in a sliding mode, shaft seats (5) are symmetrically installed on the base (1), a rotary seat (6) is installed between the shaft seats (5) in a rotating mode, a clamping groove (7) is formed in each side of the rotary seat (6), an adjusting plate (8) is installed on the base (1) in a sliding mode, and a push rod (9) is installed on the adjusting plate (8);
install blown down tank (10) on base (1), and blown down tank (10) and draw-in groove (7) adaptation, dust removal mechanism (11) are installed to blown down tank (10) outer end.
2. The chip component feeding device with the dust removing function according to claim 1, wherein the supporting frame (2) is provided with a sliding slot (13), the bottom side of the supporting frame (2) is provided with a first air pressure rod (12), the telescopic end of the first air pressure rod (12) is provided with a connecting arm (14), and the connecting arm (14) penetrates through the sliding slot (13) to be connected with the pushing plate (4).
3. The chip component supply device with dust removing function according to claim 1, wherein a servo motor (15) is installed outside the shaft seat (5), and an output end of the servo motor (15) is connected with the rotary seat (6).
4. The chip component supply device with the dust removing function according to claim 1, wherein two belt wheels (16) are installed on the top of the base (1), the two belt wheels (16) are driven by a conveyer belt (17), a power motor is installed in the base (1), and the output end of the power motor is connected with one of the belt wheels (16).
5. A chip component feeding apparatus with dust removing function according to claim 1, wherein a slide rail (18) is installed on said base (1), and a slide seat (19) is installed on said slide rail (18), and a holder (20) is installed on said slide seat (19), and said holder (20) is connected with said conveyor belt (17).
6. The chip component supplying device with dust removing function according to claim 5, wherein a second pneumatic rod (21) is installed on the holder (20), and the telescopic end of the second pneumatic rod (21) is connected with the adjusting plate (8).
7. The chip component feeding device with the dust removing function according to claim 1, wherein the dust removing mechanism (11) comprises a U-shaped seat (22), a plurality of air injection seats (23) are arranged on two opposite sides inside the U-shaped seat (22), a plurality of air holes are formed in the air injection seats (23), and the air injection seats (23) are connected through a connecting pipe (24).
8. A chip component supply device with a dust removing function according to claim 1, wherein a mounting plate (25) is mounted on the base (1), an inflator (26) is mounted on the mounting plate (25), a spring (27) is mounted in the inflator (26), the spring (27) is connected with a piston (28), the piston (28) is connected with one end of a connecting rod (29), and a contact plate (30) is mounted at the other end of the connecting rod (29).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210827296.9A CN115206856A (en) | 2022-07-13 | 2022-07-13 | Chip element feeding device with dust removal function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210827296.9A CN115206856A (en) | 2022-07-13 | 2022-07-13 | Chip element feeding device with dust removal function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115206856A true CN115206856A (en) | 2022-10-18 |
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ID=83580258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210827296.9A Pending CN115206856A (en) | 2022-07-13 | 2022-07-13 | Chip element feeding device with dust removal function |
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| Country | Link |
|---|---|
| CN (1) | CN115206856A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117524958A (en) * | 2024-01-08 | 2024-02-06 | 四川晁禾微电子有限公司 | Semiconductor packaging chip discharging device |
-
2022
- 2022-07-13 CN CN202210827296.9A patent/CN115206856A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117524958A (en) * | 2024-01-08 | 2024-02-06 | 四川晁禾微电子有限公司 | Semiconductor packaging chip discharging device |
| CN117524958B (en) * | 2024-01-08 | 2024-03-08 | 四川晁禾微电子有限公司 | Semiconductor packaging chip discharging device |
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