CN214381649U - Novel wave soldering device - Google Patents
Novel wave soldering device Download PDFInfo
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- CN214381649U CN214381649U CN202120011585.2U CN202120011585U CN214381649U CN 214381649 U CN214381649 U CN 214381649U CN 202120011585 U CN202120011585 U CN 202120011585U CN 214381649 U CN214381649 U CN 214381649U
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- soldering
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Abstract
The utility model relates to a wave-soldering technical field, concretely relates to novel wave-soldering device. The welding device comprises a shell (1), a connection table (2), a spraying system (3), a preheating system (4), a welding system (5), a cooling system (6) and a control system (7), wherein the control system (7) is electrically connected with the connection table (2), the spraying system (3), the preheating system (4), the welding system (5) and the cooling system (6) respectively. The conveyer belt sends the circuit base plate into the wave soldering machine, and the automatic soldering process is carried out on the circuit board and the components through the soldering flux spraying system, the preheating system, the welding system and the cooling system. The problem that the wave-soldering circuit board is not clamped stably is solved, so that components are clamped stably and are distributed uniformly; the problems that soldering tin at a wave soldering tin spraying opening is easy to oxidize and the waste of the soldering tin is serious are solved; wave-soldering efficiency after the transformation is higher, and the structure more laminates the in-service use, avoids soldering tin extravagant, practices thrift manufacturing cost, improves the quality of welding point.
Description
Technical Field
The utility model relates to a wave-soldering technical field, concretely relates to novel wave-soldering device.
Background
Electronic components can not be manufactured without separating from a circuit board, a plurality of components are welded on a base of the circuit board by soldering tin to form the circuit board, the welding mode is initially manual welding, however, with the increase of the welding components, the welding mode is changed into wave soldering with higher automation degree. Wave soldering is to insert a plug-in type component into a transmission belt, spray soldering flux, preheat, wave solder, and cool to complete the soldering of the component. Various types of wave soldering machines are available on the market at present, however, in the practical use process of wave soldering, some defects are found to be still existed, and the efficiency and the effect of wave soldering are influenced. One is that the components are inserted into the transmission belt and are not stably inserted, so that the components cannot be stably fixed on the transmission belt and are easy to fall or skew; secondly, the soldering tin at the opening of the tin spraying opening is easy to oxidize, and the waste of the soldering tin is serious.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a novel wave-soldering device solves current components and parts and inserts the shakiness, and tin-spraying mouth soldering tin is easy to be oxidized, extravagant serious technical problem.
In order to achieve the above object, the utility model provides a following technical scheme:
a novel wave soldering apparatus comprising:
the shell is a cavity and is provided with an observation window and a support table; the observation window is arranged above the side surface of the shell; the support table is arranged at the bottom end inside the shell;
the connection table is arranged at the front end of the support table; the connecting table is provided with a conveyor belt and an element positioner; the component positioners are uniformly arranged on two sides of the conveyor belt;
the spraying system is positioned on the supporting table of the shell and is provided with a nozzle, a soldering flux tank and an air pump; the nozzle is connected with the soldering flux tank through an air pump;
the preheating system is positioned behind the spraying system and used for preheating and drying the part to be soldered;
the welding system is positioned behind the preheating system and is provided with a tin spraying opening, a tin melting tank and a wave-soldering generator; the tin spraying port is connected with the tin melting tank through a wave soldering generator;
the cooling system is positioned behind the welding system and used for cooling the welded components;
and the control system is positioned outside the shell and is respectively and electrically connected with the docking station, the spraying system, the preheating system, the welding system and the cooling system.
The element positioner is in a shape of a snap tooth and consists of two cylinders in a group; the component positioners on both sides of the conveyor belt are arranged parallel to each other.
The spray system further comprises a laser sensor; the method is used for identifying the position needing to be sprayed with the soldering flux.
The preheating system is provided with an electric heating wire and a blower, and the blower is arranged at the rear end of the electric heating wire.
The width of a tin spraying opening of the welding system is 210 mm.
The cooling system is an air cooling system.
The utility model discloses a theory of operation:
the conveying belt sends the circuit bottom plate into the wave soldering machine, and the automatic soldering process is carried out on the circuit board and the components along the way through the soldering flux spraying system, the preheating system, the welding system and the cooling system. A spraying system in the soldering flux adding area identifies the part needing to be welded and sprays the soldering flux on the part needing to be welded; after being dried by the preheating system, the circuit board is transmitted to the welding system for wave soldering of soldering tin, and then is conveyed out of the wave soldering device after being cooled.
Compared with the prior art, the utility model has the advantages that:
1. the component positioner sets up to the latch form of relative setting, and two cylinders are a set of, and the component positioner of conveyer belt both sides sets up relatively for it is more firm to fix the circuit board.
2. The spraying system is also provided with a laser sensor, and the laser sensor can accurately identify the part needing to be sprayed with the soldering flux, so that the part is effectively identified, and the production efficiency is favorably improved.
3. The design of the tin spraying opening is smaller than that of the existing tin spraying opening, the using amount of tin is reduced, the oxidation is reduced, the cost is reduced, the oxidation amount is reduced, and the using amount of tin can be reduced.
4. The cooling system is an air cooling system which cools the soldering tin, has high cooling speed and does not have other influences on the circuit board and components on the circuit board.
5. The current situation that the wave-soldering circuit board is unstable in clamping at present is solved, so that the components are stable in clamping and are uniformly arranged; the current situations that soldering tin at a wave soldering tin spraying opening is easy to oxidize and the soldering tin is seriously wasted are solved; wave-soldering efficiency after the transformation is higher, and the structure more laminates the in-service use, avoids the waste of soldering tin, practices thrift manufacturing cost, improves the quality of welding point.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is a top view of the connection table of the present invention;
fig. 3 is a side view of the structure of the connection table of the present invention;
1. the device comprises a shell, 101, an observation window, 102, a support table, 2, a connection table, 201, a conveyor belt, 202, a component positioner, 3, a spraying system, 301, a nozzle, 302, a soldering flux tank, 303, an air pump, 304, a laser sensor, 4, a preheating system, 401, a heating wire, 402, a blower, 5, a welding system, 501, a tin spraying opening, 502, a tin melting tank, 503, a wave soldering generator, 6, a cooling system, 7 and a control system.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings of the present invention, and obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Example 1
Referring to fig. 1, 2 and 3, a novel wave soldering apparatus includes:
the device comprises a shell 1, wherein the shell 1 is a cavity, and the shell 1 is provided with an observation window 101 and a support table 102; the observation window 101 is arranged above the side surface of the shell 1; the support platform 102 is arranged at the bottom end inside the shell 1;
the connection table 2 is arranged at the front end of the support table 102; the connection table 2 is provided with a conveyor belt 201 and a component positioner 202; the component positioners 202 are uniformly arranged on both sides of the conveyor belt 201;
the spraying system 3 is positioned on the supporting table 102 of the shell 1, and the spraying system 3 is provided with a nozzle 301, a soldering flux tank 302 and an air pump 303; the nozzle 301 is connected with the soldering flux tank 302 through an air pump 303;
the preheating system 4 is positioned behind the spraying system 3 and used for preheating and drying the part to be soldered;
the welding system 5 is positioned behind the preheating system 4, and is provided with a tin spraying opening 501, a tin melting tank 502 and a wave-soldering generator 503; the tin spraying opening 501 is connected with the tin melting tank 502 through a wave soldering generator 503;
the cooling system 6 is positioned behind the welding system 5, and is used for cooling the welded components;
and the control system 7 is positioned outside the shell 1, and is respectively electrically connected with the docking station 2, the spraying system 3, the preheating system 4, the welding system 5 and the cooling system 6.
In the arrangement, a conveyor belt sends a circuit bottom plate into a wave soldering machine, the circuit board and components are automatically soldered by a soldering flux spraying system, a preheating system, a soldering system and a cooling system along the way, the spraying system in a soldering flux adding area identifies the parts needing to be soldered, and the parts needing to be soldered are sprayed with soldering flux; after being dried by a preheating system, the circuit board is transmitted to a welding system for wave soldering of soldering tin, and then is conveyed out of a wave soldering device after being cooled; the current situation that the wave-soldering circuit board is unstable in clamping is solved, and the components are stable in clamping and even in arrangement. The problems that soldering tin at a wave soldering tin spraying opening is easy to oxidize and the soldering tin is seriously wasted at present are solved.
Example 2
According to fig. 2 and 3, the component positioner 202 is in the shape of a ratchet and is composed of two cylinders; the component positioners 202 located on both sides of the conveyor belt 201 are arranged parallel to each other.
In the above arrangement, the two cylinders are in a group and the element positioners on the two sides of the conveyor belt are arranged oppositely, so that the circuit board is fixed more firmly.
Example 3
As shown in fig. 1, the spraying system 3 further comprises a laser sensor 304; the method is used for identifying the position needing to be sprayed with the soldering flux.
In the above arrangement, the laser sensor can accurately identify the part needing to be sprayed with the soldering flux, so that the soldering flux can be effectively identified, and the production efficiency can be improved.
Example 4
According to fig. 1, the preheating system 4 is provided with heating wires 401 and a blower fan 402, the blower fan 402 being provided at the rear end of the heating wires 401.
In the above arrangement, the heat generated by the heating wire is brought to the circuit board by the wind generated by the blower, and the portion to be soldered is preheated and dried.
Example 5
According to fig. 1, the width of the solder nozzle 501 of the soldering system 5 is 210 mm.
In the above arrangement, the design of the tin spraying port is smaller than that of the existing tin spraying port, the consumption of tin and the oxidation are reduced, the cost is reduced, the oxidation amount is reduced, and the tin consumption can be reduced.
Example 6
According to fig. 1, the cooling system 6 is an air cooling system.
In the above arrangement, the air cooling system cools the solder, and the cooling speed is high, and the air cooling system does not affect the circuit board and components on the circuit board.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (4)
1. A novel wave soldering device is characterized by comprising:
the device comprises a shell (1), wherein the shell (1) is a cavity, and the shell (1) is provided with an observation window (101) and a support table (102); the observation window (101) is arranged above the side surface of the shell (1); the support table (102) is arranged at the bottom end inside the shell (1);
the connection table (2), the connection table (2) is arranged at the front end of the support table (102); the connection table (2) is provided with a conveyor belt (201) and an element positioner (202); the component positioners (202) are uniformly arranged on two sides of the conveyor belt (201);
the spraying system (3) is positioned on the supporting table (102) of the shell (1), and the spraying system (3) is provided with a nozzle (301), a soldering flux tank (302) and an air pump (303); the nozzle (301) is connected with the soldering flux tank (302) through an air pump (303);
the preheating system (4) is positioned behind the spraying system (3) and used for preheating and drying the part to be soldered;
the welding system (5) is positioned behind the preheating system (4), and is provided with a tin spraying opening (501), a tin melting tank (502) and a wave-soldering generator (503); the tin spraying opening (501) is connected with the tin melting tank (502) through a wave soldering generator (503);
the cooling system (6) is positioned behind the welding system (5) and used for cooling the welded components;
the control system (7) is positioned outside the shell (1), and the control system (7) is respectively and electrically connected with the connection table (2), the spraying system (3), the preheating system (4), the welding system (5) and the cooling system (6);
the element positioner (202) is in a shape of a ratchet and consists of two cylinders in a group; the component positioners (202) positioned at the two sides of the conveyor belt (201) are arranged in parallel;
the spray system (3) further comprises a laser sensor (304); the method is used for identifying the position needing to be sprayed with the soldering flux.
2. The novel wave soldering apparatus of claim 1, wherein: the preheating system (4) is provided with a heating wire (401) and a blower (402), and the blower (402) is arranged at the rear end of the heating wire (401).
3. The novel wave soldering apparatus of claim 1, wherein: the width of a tin spraying opening (501) of the welding system (5) is 210 mm.
4. The novel wave soldering apparatus of claim 1, wherein: the cooling system (6) is an air cooling system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120011585.2U CN214381649U (en) | 2021-01-05 | 2021-01-05 | Novel wave soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120011585.2U CN214381649U (en) | 2021-01-05 | 2021-01-05 | Novel wave soldering device |
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| Publication Number | Publication Date |
|---|---|
| CN214381649U true CN214381649U (en) | 2021-10-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202120011585.2U Active CN214381649U (en) | 2021-01-05 | 2021-01-05 | Novel wave soldering device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114515881A (en) * | 2022-03-26 | 2022-05-20 | 宁波诚兴道电子科技有限公司 | PCBA circuit board welding equipment and process |
| CN117206625A (en) * | 2023-11-08 | 2023-12-12 | 深圳市矗鑫电子设备有限公司 | Welding equipment and welding method for preventing selective wave soldering from being carried out in succession |
-
2021
- 2021-01-05 CN CN202120011585.2U patent/CN214381649U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114515881A (en) * | 2022-03-26 | 2022-05-20 | 宁波诚兴道电子科技有限公司 | PCBA circuit board welding equipment and process |
| CN117206625A (en) * | 2023-11-08 | 2023-12-12 | 深圳市矗鑫电子设备有限公司 | Welding equipment and welding method for preventing selective wave soldering from being carried out in succession |
| CN117206625B (en) * | 2023-11-08 | 2024-01-09 | 深圳市矗鑫电子设备有限公司 | Welding equipment and welding method for preventing selective wave soldering from being carried out in succession |
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