CN219499662U - Processing arrangement structure for high-efficiency production SMT patch workshop - Google Patents
Processing arrangement structure for high-efficiency production SMT patch workshop Download PDFInfo
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- CN219499662U CN219499662U CN202320451590.4U CN202320451590U CN219499662U CN 219499662 U CN219499662 U CN 219499662U CN 202320451590 U CN202320451590 U CN 202320451590U CN 219499662 U CN219499662 U CN 219499662U
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Abstract
The utility model relates to the field of SMT chip processing equipment, and discloses a high-efficiency SMT chip processing workshop processing arrangement structure, which comprises a collecting system, wherein two production line groups and a rear production system are arranged on two sides of the collecting system, and the two production line groups and the rear production system are distributed in an I shape by the collecting system; the collecting system is used for collecting the circuit board patches conveyed by the production line groups, the three production line groups are used for circuit board patch processing, and the post-production system is used for pin welding processing of the circuit board. According to the utility model, the SMT patch workshop is provided with the arrangement structure, so that the labor cost of the pin inserting process is effectively saved, and the production efficiency of SMT patch assembly is improved.
Description
Technical Field
The utility model relates to the field of SMT chip processing equipment, in particular to a processing arrangement structure of an SMT chip workshop.
Background
SMT paster refers to the short of a series of process flows of processing on the basis of a PCB, the PCB is a printed circuit board, SMT is a surface assembly technology, and is the most popular technology and process in the electronic assembly industry, an SMT assembly workshop is a very popular and mature circuit board processing place, when a plurality of SMT paster are processed, the SMT paster is produced, after the process of coding, printing and paster processing is finished, a material frame for the circuit board is often loaded to a pin inserting process independently, so a plurality of working posts are added before the pin inserting process, the production cost is improved, and the production progress is delayed due to the extension of the processing process.
Disclosure of Invention
The utility model aims to solve the defects in the prior art, and provides a processing arrangement structure of an SMT patch workshop for high-efficiency production, which effectively saves the labor cost of a pin inserting procedure and improves the production efficiency of SMT patch assembly.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
the processing arrangement structure of the SMT patch workshop comprises a collecting system, wherein two production line groups and a post-production system are arranged on two sides of the collecting system, and the two production line groups and the post-production system are distributed in an I shape by the collecting system;
the collecting system is used for collecting the circuit board patches conveyed by the production line groups, the three production line groups are used for circuit board patch processing, and the post-production system is used for pin welding processing of the circuit board;
the collecting system comprises a patch collecting box, an aluminum alloy frame is arranged at the bottom of the patch collecting box, a first infrared sensor is arranged in the middle of one end of the aluminum alloy frame, a transverse conveying chain is transversely arranged at the other end of the aluminum alloy frame through a roller, one end of the transverse conveying chain is connected to the driving end of a motor through the roller and is fixedly connected to the outer side of the aluminum alloy frame, a third infrared sensor is arranged in the aluminum alloy frame, a second infrared sensor is arranged at one end, far away from the first infrared sensor, of the aluminum alloy frame, and the second infrared sensor is arranged on the longitudinal conveying chain;
through above-mentioned technical scheme, through the horizontal conveying chain in the collection system and vertical conveying chain cooperation, can be with the unified direct transportation of circuit board product from the line group to the paster collection case, afterwards the paster collection case can directly carry the circuit board product to the contact pin operation panel in directly carrying out contact pin process operation through the transmission track, so can save the manual work post before the contact pin, just so can promote production efficiency and reduce human cost, the circuit board product of also being convenient for directly gets into next step process, the process time of circuit board product has been shortened, can be with the statistics of the circuit board product that enters into the circuit board product the inside between through first infrared sensor, second infrared sensor and the third infrared sensor, promote work efficiency.
Further, the third infrared sensor is arranged below the transverse conveying chain;
through above-mentioned technical scheme, the third infrared sensor can count the circuit board product through horizontal conveying chain, need not the manual work and carries and count the quantity of circuit board product, promotes SMT paster efficiency.
Further, the longitudinal conveying chain is arranged on the inner side of the aluminum alloy frame through a roller, one end of the longitudinal conveying chain is connected with a motor through the roller, and the motor is fixedly connected on the outer side of the aluminum alloy frame;
through the technical scheme, when the circuit board product enters the longitudinal conveying chain, the motor drives the longitudinal conveying chain through the roller to realize conveying of the circuit board product.
Further, the longitudinal conveying chain and the transverse conveying chain are vertically arranged, and circuit board products are arranged on the inner sides of the transverse conveying chain and the longitudinal conveying chain;
through the technical scheme, the vertical arrangement is mainly for the purpose that the longitudinal conveying chain can convey the circuit board products produced by two of the production line groups into the patch collecting box, the transverse conveying chain can convey the circuit board products in one of the production line groups and the longitudinal conveying chain into the contact pin operating platform, the subsequent processing efficiency of the SMT patch is directly shortened, and the labor cost and the procedure links are saved.
Further, the production line group comprises an SPI detection system, an automatic chip mounter, an automatic printer, a laser code engraving machine and an SMT chip mounting machine, and the collecting system is connected with the SPI detection system, the automatic chip mounter, the automatic printer, the laser code engraving machine and the SMT chip mounting machine from near to far in sequence through a transmission track;
through the technical scheme, the SMT patch enters the laser code printing machine for processing through the SMT trigger, then enters the automatic printing machine for processing through the transmission rail, then enters the automatic chip printing machine for processing through the transmission rail, and then enters the SPI detection system for detection through the transmission rail, so that the SMT patch is completely processed.
Further, two SPI detection systems are connected to two sides of a longitudinal conveying chain close to the first infrared sensor through a conveying track, and one SPI detection system is connected to one side of a transverse conveying chain close to the third infrared sensor through a conveying track;
through the technical scheme, the circuit board products can be directly conveyed into the patch collecting box in a mutual connection mode, and follow-up direct entering of the contact pin operating platform is facilitated.
Further, the post production system comprises a contact pin operating platform, a reflow soldering furnace, a cooling furnace and a manual operating platform, and the collecting system is connected with the contact pin operating platform, the reflow soldering furnace, the cooling furnace and the manual operating platform from near to far in sequence through a transmission track;
through the technical scheme, the SMT chip circuit board product enters the contact pin operation table to be directly processed, then enters the reflow soldering furnace to be subjected to reflow soldering, then enters the manual operation table after entering the cooling furnace to be cooled, and therefore a production line only needs to be provided with a post on the manual operation table, and the processing efficiency of the circuit board product is improved.
Further, the pin operating platform is arranged at one side of the transverse conveying chain far away from the third infrared sensor;
through the technical scheme, all circuit board products in the patch collecting box are convenient to directly collect.
The utility model has the following beneficial effects:
according to the utility model, through the arrangement of the I-shaped SMT paster working procedures, three production line groups simultaneously supply SMT paster circuit boards to enter the collecting system, the collecting system counts the circuit board products through the first sensor, the second sensor and the third sensor, and the collecting system uniformly conveys the circuit board products to the contact pin operation table through the longitudinal conveying chain and the transverse conveying chain, so that the labor cost of the contact pin working procedures is effectively saved, and the production efficiency of SMT paster assembly is improved.
Drawings
FIG. 1 is a flow chart of a system for efficiently producing a processing arrangement structure of an SMT chip shop;
FIG. 2 is a flow chart of a collecting system for efficiently producing the processing arrangement structure of the SMT chip workshop;
fig. 3 is a flow chart of a production line set for efficiently producing an SMT patch workshop processing arrangement structure according to the present utility model.
Legend description:
1. an aluminum alloy frame; 2. a patch collecting box; 3. a pin console; 4. a reflow oven; 5. a cooling furnace; 6. a manual operation table; 7. an SPI detection system; 8. an automatic chip mounter; 9. an automatic printing machine; 10. a laser lithography machine; 11. a transmission track; 12. a circuit board product; 13. a first infrared sensor; 14. a motor; 15. a second infrared sensor; 16. a transverse conveyor chain; 17. a longitudinal conveyor chain; 18. a third infrared sensor; 19. SMT paster plate feeding machine; 20. a production line group; 21. a post-production system; 22. and (5) collecting the system.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Embodiment one:
referring to fig. 1-2, the utility model provides a processing arrangement structure of a high-efficiency SMT patch workshop, which comprises a collecting system 22, two production line groups 20 and a rear production system 21 are arranged on two sides of the collecting system 22, the two production line groups 20 and the rear production system 21 are distributed in an I shape by taking the collecting system 22 as an I shape, the I shape distribution can well collect circuit board products 12, the high-efficiency processing of the circuit board products 12 is ensured, the collecting system 22 is used for collecting circuit board patches conveyed by the production line groups 20, the three production line groups 20 are used for processing the circuit board patches, the rear production system 21 is used for pin welding processing of the circuit boards, the collecting system 22 comprises a patch collecting box 2, an aluminum alloy frame 1 is arranged at the bottom of the patch collecting box 2, a first infrared sensor 13 is arranged in the middle of one end of the aluminum alloy frame 1, a transverse conveying chain 16 is transversely arranged at the other end of the aluminum alloy frame 1 through a roller, one end of the transverse conveying chain 16 is connected to the driving end of the motor 14 through a roller, the motor 14 is fixedly connected to the outer side of the aluminum alloy frame 1, a third infrared sensor 18 is arranged in the aluminum alloy frame 1, one end, far away from the first infrared sensor 13, of the aluminum alloy frame 1 is provided with a second infrared sensor 15, the second infrared sensor 15 is arranged on the longitudinal conveying chain 17, the circuit board products 12 can be uniformly and directly conveyed to the patch collecting box 2 from the production line group 20 through matching of the transverse conveying chain 16 and the longitudinal conveying chain 17 in the collecting system 22, then the patch collecting box 2 can directly convey the circuit board products 12 to the pin operating table 3 through the conveying rail 11 to directly conduct pin inserting procedure operation, thus manual positions before pins can be saved, production efficiency can be improved, labor cost can be reduced, the circuit board products 12 can directly enter the next process, the processing time of the circuit board products 12 is shortened, the statistics of the circuit board products 12 entering the circuit board products 12 can be carried out through the first infrared sensor 13, the second infrared sensor 15 and the third infrared sensor 18, the working efficiency is improved, the third infrared sensor 18 is arranged below the transverse conveying chain 16, the third infrared sensor 18 can count the circuit board products 12 passing through the transverse conveying chain 16, the quantity of the circuit board products 12 is not needed to be carried and counted manually, the SMT paster efficiency is improved, the longitudinal conveying chain 17 is arranged on the inner side of the aluminum alloy frame 1 through a roller, one end of the longitudinal conveying chain 17 is connected with a motor 14 through the roller and the motor 14 is fixedly connected on the outer side of the aluminum alloy frame 1, when the circuit board products 12 enter the longitudinal conveying chain 17, the motor 14 drives the longitudinal conveying chain 17 through the roller to realize conveying the circuit board products 12, the longitudinal conveying chain 17 and the transverse conveying chain 16 are vertically arranged, the circuit board products 12 are placed on the inner sides of the transverse conveying chain 16 and the longitudinal conveying chain 17, the vertical arrangement is mainly for the purpose that the longitudinal conveying chain 17 can convey the circuit board products 12 produced by two production line groups 20 into the patch collecting box 2, the transverse conveying chain 16 can convey the circuit board products 12 in one production line group 20 and the longitudinal conveying chain 17 into the contact pin operating table 3, the subsequent processing efficiency of the SMT patch is directly shortened, the labor cost and the procedure links are saved, the longitudinal conveying chain 17 and the transverse conveying chain 16 belong to the prior art, and are all existing equipment chains for processing the prior circuit board products 12, and detailed description is omitted.
Embodiment two:
referring to fig. 1-3, the utility model provides a processing arrangement structure of an SMT patch workshop, a production line set 20 comprises an SPI detection system 7, an automatic chip mounter 8, an automatic printer 9, a laser marking machine 10 and an SMT patch upper board 19, wherein a collecting system 22 is connected with the SPI detection system 7, the automatic chip mounter 8, the automatic printer 9, the laser marking machine 10 and the SMT patch upper board 19 from near to far through a transmission track 11 in sequence, the SMT patch enters the laser marking machine 10 through the SMT patch upper board 19 for processing, then enters the automatic printer 9 through the transmission track 11 for processing, then enters the automatic chip mounter 8 through the transmission track 11 for processing, then enters the SPI detection system 7 for detection, and complete processing of the SMT patch is achieved, wherein two SPI detection systems 7 are connected to two sides of a longitudinal transmission chain 17 close to a first infrared sensor 13 through the transmission track 11, one SPI detection system 7 is connected to one side of a transverse transmission chain 16 close to a third infrared sensor 18 through the transmission track 11, and the mutual connection can directly convey a circuit board product 12 into the collecting box 2, so that the subsequent patch can enter the automatic chip mounter 8 through the transmission track 11 for processing, then enters the automatic chip mounter 8 for processing, then enters the automatic chip mounter for detecting through the transmission track 11 for detecting, then enters the chip mounter for detection, and finally enters the infrared chip handling machine for processing.
Embodiment III:
referring to fig. 1, the utility model provides a processing arrangement structure for an SMT patch workshop with high efficiency, a post-production system 21 comprises a pin operation table 3, a reflow oven 4, a cooling oven 5 and a manual operation table 6, a collecting system 22 is connected with the pin operation table 3, the reflow oven 4, the cooling oven 5 and the manual operation table 6 from near to far in sequence through a transmission track 11, SMT patch circuit board products 12 enter the pin operation table 3 to be directly processed, then enter the reflow oven 4 to be subjected to reflow soldering, then enter the cooling oven 5 to be cooled and then enter the manual operation table 6, so that a production line only needs to set a post on the manual operation table 6, the processing efficiency of the circuit board products 12 is improved, and the pin operation table 3 is arranged on one side of a transverse transmission chain 16 far from a third infrared sensor 18, so that all the circuit board products 12 in the patch collecting box 2 can be conveniently and directly collected.
Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.
Claims (8)
1. High efficiency production SMT paster workshop processing arrangement structure, including collecting the system, its characterized in that: two production line groups and a rear production system are arranged on two sides of the collecting system, and the two production line groups and the rear production system are distributed in an I shape by the collecting system;
the collecting system is used for collecting the circuit board patches conveyed by the production line groups, the three production line groups are used for circuit board patch processing, and the post-production system is used for pin welding processing of the circuit board;
the collecting system comprises a patch collecting box, an aluminum alloy frame is arranged at the bottom of the patch collecting box, a first infrared sensor is arranged in the middle of one end of the aluminum alloy frame, a transverse conveying chain is transversely arranged at the other end of the aluminum alloy frame through a roller, one end of the transverse conveying chain is connected with the driving end of a motor through the roller and is fixedly connected with the outer side of the aluminum alloy frame, a third infrared sensor is arranged in the aluminum alloy frame, a second infrared sensor is arranged at one end, far away from the first infrared sensor, of the aluminum alloy frame, and the second infrared sensor is arranged on the longitudinal conveying chain.
2. A high efficiency production SMT patch shop tooling arrangement as claimed in claim 1, wherein: the third infrared sensor is arranged below the transverse conveying chain.
3. A high efficiency production SMT patch shop tooling arrangement as claimed in claim 1, wherein: the longitudinal conveying chain is arranged on the inner side of the aluminum alloy frame through a roller, one end of the longitudinal conveying chain is connected with a motor through the roller and the motor is fixedly connected on the outer side of the aluminum alloy frame.
4. A high efficiency production SMT patch shop tooling arrangement as claimed in claim 3, wherein: the longitudinal conveying chain and the transverse conveying chain are arranged vertically, and circuit board products are placed on the inner sides of the transverse conveying chain and the longitudinal conveying chain.
5. A high efficiency production SMT patch shop tooling arrangement as claimed in claim 1, wherein: the production line group comprises an SPI detection system, an automatic chip mounter, an automatic printer, a laser marking machine and an SMT chip mounting machine, and the collection system is connected with the SPI detection system, the automatic chip mounter, the automatic printer, the laser marking machine and the SMT chip mounting machine from near to far through a transmission track.
6. A high efficiency production SMT patch shop tooling arrangement as claimed in claim 5, wherein: two SPI detecting systems are connected to two sides of a longitudinal conveying chain close to the first infrared sensor through a conveying track, and one SPI detecting system is connected to one side of a transverse conveying chain close to the third infrared sensor through a conveying track.
7. A high efficiency production SMT patch shop tooling arrangement as claimed in claim 1, wherein: the post production system comprises a contact pin operating platform, a reflow soldering furnace, a cooling furnace and a manual operating platform, and the collecting system is connected with the contact pin operating platform, the reflow soldering furnace, the cooling furnace and the manual operating platform from near to far in sequence through a transmission track.
8. A high efficiency production SMT patch shop tooling arrangement as claimed in claim 7, wherein: the contact pin operation platform is arranged on one side of the transverse conveying chain far away from the third infrared sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320451590.4U CN219499662U (en) | 2023-03-10 | 2023-03-10 | Processing arrangement structure for high-efficiency production SMT patch workshop |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320451590.4U CN219499662U (en) | 2023-03-10 | 2023-03-10 | Processing arrangement structure for high-efficiency production SMT patch workshop |
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| Publication Number | Publication Date |
|---|---|
| CN219499662U true CN219499662U (en) | 2023-08-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320451590.4U Active CN219499662U (en) | 2023-03-10 | 2023-03-10 | Processing arrangement structure for high-efficiency production SMT patch workshop |
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| CN (1) | CN219499662U (en) |
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- 2023-03-10 CN CN202320451590.4U patent/CN219499662U/en active Active
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