CN205611068U - Power amplifier device - Google Patents
Power amplifier device Download PDFInfo
- Publication number
- CN205611068U CN205611068U CN201620299482.XU CN201620299482U CN205611068U CN 205611068 U CN205611068 U CN 205611068U CN 201620299482 U CN201620299482 U CN 201620299482U CN 205611068 U CN205611068 U CN 205611068U
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- China
- Prior art keywords
- power amplifier
- solder
- printed circuit
- power
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model provides a power amplifier device, the device includes: power tube, printed circuit board and metal substrate, printed circuit board fixes on the metal substrate, the body of power tube passes the last mounting hole of printed circuit board welds in the mounting groove of metal substrate, the bottom surface of the mounting groove of metal substrate is equipped with the solder bath for used solder during the splendid attire welding. The utility model discloses reduce the solder voidage, guaranteed power tube adjacent ground solder bumps effect, effectively improved power amplifier subassembly saturation power mean value, efficiency value mean value and linear value mean value, improved the power amplifier performance, reduced power amplifier manufacturing cost, promoted power amplifier yield and product competitiveness.
Description
Technical field
This utility model relates to wireless communication technology field, particularly relates to a kind of power amplifier apparatus.
Background technology
Base station performance is had higher requirement by the fast development of modern wireless technology, particularly determines wireless
The PA (PowerAmplifier, power amplifier) of base station products overall performance becomes wireless base station product
Core.Power tube is the key determining power amplifier properties, and the ground connection welding effect of power tube is shadow simultaneously
Ring the deciding factor of power tube radio-frequency performance.
As it is shown in figure 1, power tube 1 is welded on copper base 3 by scolding tin, need when copper base 3 designs
Will be according to power tube 1 flange size, pin height and PCB (Printed Circuit Board, printed circuit board)
2 THICKNESS CALCULATION go out mounting groove 4 size of copper base 3, and the mounting groove 4 of existing copper base 3 is at copper base
A mounting groove 4 suitable with the flange of power tube 1 is opened in power tube 1 welding position of 3.When carrying out SMT
During (Surface Mount Technology, surface mounting technology) welding, at the mounting groove 4 of copper base 3
Bottom coat tin cream or place stannum sheet, the copper flange of power tube 1 sinks to copper base 3 through PCB2 rectangular opening
Mounting groove 4 in, melted down by high temperature and make tin cream or stannum sheet melt, then by cooled and solidified, complete merit
Put the welding of pipe 1.
Owing to finished surface the non-critical of copper base are smooth, the bottom of power tube is also and non-critical is smooth, logical
Crossing scolding tin when copper base and power tube being welded together, scolding tin can produce cavity.Can not in batch production
Some mismachining tolerances avoided can cause power tube scolding tin voidage too high, causes power tube earthing effect poor,
The radio-frequency performances such as power amplifier emergent power is low, inefficient and poor linearity are abnormal.Additionally, power tube factory
The welding voidage of power tube is distinctly claimed, such as by family: overall power tube scolding tin voidage 25% with
In, maximum power tube scolding tin maximum cavity is less than 10%.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of power amplifier apparatus, will by solder
When copper base and power tube weld together, solder voidage is excessive.
The technical solution adopted in the utility model is, described power amplifier apparatus, including:
Power tube, printed circuit board and metal basal board, wherein,
Described printed circuit board is fixing on metallic substrates；
The body of described power tube is welded on the installation of metal basal board through the installing hole on described printed circuit board
In groove；
The bottom surface of the mounting groove of described metal basal board is provided with solder bath, for containing solder used during welding.
Further, the quantity of described solder bath is one or more.
Further, described metal basal board includes: copper base, aluminium base or alloy substrate.
Further, described solder includes: tin cream or stannum sheet.
Further, the solder bath of described metal basal board be positioned at described metal basal board mounting groove coverage it
In.
Further, when welding, by described power amplifier apparatus high temperature is melted down heating, so that institute
State solder to melt for welding.
Using technique scheme, this utility model at least has the advantage that
Power amplifier apparatus described in the utility model, by arranging metal basal board in metal basal board mounting groove
Solder bath, is welded on power tube in metal basal board mounting groove by filling solder in solder bath, reduces
Solder voidage, it is ensured that power tube ground connection welding effect, be effectively improved power amplifier saturation power average,
Efficiency value average and linear value average, improve power amplifier properties, reduces power amplifier and produces into
This, hoisting power amplifier yield rate and product competitiveness.
Accompanying drawing explanation
Fig. 1 is the power amplifier apparatus composition structural representation of this utility model background technology；
Fig. 2 is the power amplifier apparatus composition structural representation of this utility model first embodiment.
Detailed description of the invention
By further illustrating the technological means and effect that this utility model taked by reaching predetermined purpose, with
Lower combination accompanying drawing and preferred embodiment, be described in detail as rear to this utility model.
This utility model first embodiment, a kind of power amplifier apparatus, as in figure 2 it is shown, include following group
One-tenth part:
Power tube 1, printed circuit board 2 and copper base 3.
Printed circuit board 2 is welded on copper base 3 by solder, and the body of power tube 1 passes printed circuit board
2 installing holes are welded in copper base 3 mounting groove 4 by solder.
The pin of power tube 1 is welded on the pad of printed circuit board 2 correspondence.
Wherein, copper base 3 includes: mounting groove 4 and solder bath 5.
The mounting groove 4 of copper base 3 is positioned at below printed circuit board 2 installing hole.
The bottom surface of the mounting groove 4 of copper base 3 is provided with solder bath 5.
Mounting groove 4 frame size of copper base 3 is identical with printed circuit board 2 installing hole frame size, cuprio
Mounting groove 4 degree of depth of plate 3 and printed circuit board 2 thickness sum are power tube 1 pin height.
Power tube 1 pin height is power tube 1 pin to the distance of power tube 1 bottom surface.
The solder bath 5 of copper base 3 is smaller in size than mounting groove 4 size of copper base 3.
Solder bath 5 degree of depth of copper base 3 is set according to the thickness of copper base 3 and the model of power tube 1.
The mounting groove 4 of copper base 3 is for supporting the bottom surface of power tube 1.
The solder bath 5 of copper base 3 is used for containing solder.
Solder includes: tin cream or stannum sheet.
During power tube surface mount, power amplifier apparatus melts down heating, copper base 3 by high temperature
Solder bath 5 in solder become liquid from solid-state, liquid solder fills the solder bath 5 of full copper base 3, logical
Supercooling, solder solidification, make the bottom of power tube 1 fully weld together with copper base 3, it is ensured that power amplifier
The bottom of pipe 1 completely attaches to copper base 3.Avoid the bottom solder of copper base 3 and power tube 1 is formed
Cavity.
Through batch production checking, the solder voidage of power tube 1 reduces by 30%～50%, and solder voidage is improved
Substantially, overall voidage controls within 8%；The ground connection welding effect of power tube 1, power are fully ensured that
Amplifier saturation power average improves 0.3dB～0.5dB, and efficiency value average improves 1%, and linear value average is improved
More than 2dB, produces yield rate and promotes 7%, improve power amplifier properties, reduces power amplifier and produces
Cost, hoisting power amplifier yield rate and product competitiveness.
By the explanation of detailed description of the invention, it should can be to this utility model by reaching what predetermined purpose was taked
Technological means and effect are able to more deeply and concrete understanding, but appended diagram is only to provide reference and says
Bright it is used, is not used for this utility model is any limitation as.
Claims (6)
1. a power amplifier apparatus, including: power tube, printed circuit board and metal basal board, wherein,
Described printed circuit board is fixing on metallic substrates；
The body of described power tube is welded on the installation of metal basal board through the installing hole on described printed circuit board
In groove；
It is characterized in that,
The bottom surface of the mounting groove of described metal basal board is provided with solder bath, for containing solder used during welding.
Power amplifier apparatus the most according to claim 1, it is characterised in that the number of described solder bath
Amount is for one or more.
Power amplifier apparatus the most according to claim 1, it is characterised in that described metal basal board bag
Include: copper base, aluminium base or alloy substrate.
Power amplifier apparatus the most according to claim 1, it is characterised in that described solder includes:
Tin cream or stannum sheet.
Power amplifier apparatus the most according to claim 1, it is characterised in that described metal basal board
Within solder bath is positioned at the mounting groove coverage of described metal basal board.
Power amplifier apparatus the most according to claim 1, it is characterised in that when welding, pass through
Described power amplifier apparatus high temperature is melted down heating, is used for welding so that described solder melts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620299482.XU CN205611068U (en) | 2016-04-12 | 2016-04-12 | Power amplifier device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620299482.XU CN205611068U (en) | 2016-04-12 | 2016-04-12 | Power amplifier device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205611068U true CN205611068U (en) | 2016-09-28 |
Family
ID=56972113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620299482.XU Active CN205611068U (en) | 2016-04-12 | 2016-04-12 | Power amplifier device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205611068U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107891209A (en) * | 2017-12-19 | 2018-04-10 | 成都芯通软件有限公司 | A kind of metal weldedstructure and welding substrate |
-
2016
- 2016-04-12 CN CN201620299482.XU patent/CN205611068U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107891209A (en) * | 2017-12-19 | 2018-04-10 | 成都芯通软件有限公司 | A kind of metal weldedstructure and welding substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |