CN107064571B - Conductive device convenient for loading and unloading test sample and constant-temperature electromigration experimental device - Google Patents
Conductive device convenient for loading and unloading test sample and constant-temperature electromigration experimental device Download PDFInfo
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- CN107064571B CN107064571B CN201710227016.XA CN201710227016A CN107064571B CN 107064571 B CN107064571 B CN 107064571B CN 201710227016 A CN201710227016 A CN 201710227016A CN 107064571 B CN107064571 B CN 107064571B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
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Abstract
The invention provides a conductive device convenient for loading and unloading test patterns and a constant temperature electromigration experimental device, wherein the constant temperature electromigration experimental device comprises: the device comprises a power supply device, a conductive device and a temperature control device, wherein the conductive device comprises a placing table, two conductor tables, an upper lead pressing wire, a lower lead pressing wire and a clamping device for clamping a test pattern, the upper lead pressing wire and the lower lead pressing wire are arranged on the conductor tables, the clamping device is used for clamping the test pattern, the placing table is provided with a clamping groove, the two conductor tables are slidably arranged in the clamping groove, an upper lead pressing wire and a lower lead pressing wire for fixing the lead and the conductor tables are respectively arranged above and below the conductor tables, and a detachable pattern is arranged in the clamping device on the conductor tables; the conductor platform is provided with a wiring hole, and the clamping device and the wiring hole are fixed on the conductor platform through a silicon nitride ceramic plate; the top of the conductor table is provided with a groove, and the groove is provided with a clip for fixing the lead corresponding to the wiring hole; the device has overcome the problem of electromigration experimental apparatus style dress card difficulty, can solve and freely change and the problem of dismantling the style.
Description
Technical Field
The invention belongs to the technical field of material connection, and particularly relates to a conducting device convenient for loading and unloading a test pattern and a constant-temperature electromigration experimental device, which are applied to reliability research of microelectronic connection electricity.
Background
The electromigration phenomenon refers to a phenomenon that the metal wire generates atom migration under the action of current and temperature, local metal dissolution is generated, the metal wire can be cracked, and further normal operation of components is influenced. When electromigration occurs, metal atoms diffuse and migrate, and the atom migration direction is consistent with the electron flow direction. Electromigration drives some metal atoms to migrate from the cathode to the anode, holes are gradually formed near the cathode, a large amount of atoms are accumulated on one side of the anode, the conductive cross section is reduced, the electromigration process is accelerated, and finally welding point failure can be caused.
Miniaturization and intellectualization are inevitable trends in development of future electronic products, however, miniaturization of electronic products leads to a corresponding continuous reduction in size and spacing of solder joints, and the problem of solder joint reliability is attracting more and more attention and research of enterprises and researchers. When the solder joint is subjected to a certain loading including electrical loading, thermal loading, mechanical loading or a combination thereof for a long time, the service life of the solder joint is shortened, wherein the electromigration reliability problem is a very extensive field studied in recent years. As the size of the solder joint is decreased, the current density flowing through the solder joint will increase sharply, and according to the research theory taught by the k.n.tu, the current density can easily reach the critical value of electromigration of the solder joint, i.e. 104A/cm 2 However, it is considered that the critical value of the current density is 103A/cm 2 Or lower, so that an electromigration phenomenon occurs.
When the current density flowing through the metal is high, electrons move from the cathode to the anode and collide with metal atoms to exchange momentum, and the metal atoms are subjected to the force generated by the violent impact of the electrons, namely, the electron wind force. When the force of the generated electron wind exceeds the force of the electrostatic field, the force of the electron wind drives the metal atoms to directionally diffuse from the cathode to the anode, thereby generating the electromigration effect. Electromigration can cause metal atoms to migrate from one side of the cathode to one side of the anode, a large number of holes are generated near one side of the cathode, a large number of atoms are accumulated on one side of the anode, and the cathode is subjected to tensile stress and the anode is subjected to compressive stress in the welding spot. The electromigration process can cause defects such as holes and cracks, and the existence of the defects further aggravates the electromigration effect and finally induces the failure of the interconnection welding spot.
The melting point of the SnAgCu brazing filler metal alloy is about 217 ℃, the melting point of the SnAgCu brazing filler metal alloy is 34 ℃ higher than that of the SnPb eutectic brazing filler metal, and the alloy has the advantages of good wettability, high joint reliability, good thermal fatigue resistance and the like. The SnAgCu brazing filler metal alloy has good ductility, high strength and bright appearance of welding spots, and is widely applied to reflow soldering and wave soldering. Comprehensively analyzes the aspects of wettability, mechanical property, compatibility with other metals and the like, and the SnAgCu brazing filler metal is the first choice substitute alloy of the traditional SnPb brazing filler metal at present. In addition, the SnAgCu alloy is insensitive to Pb pollution, and can be well applied to components, circuit boards and production assembly lines in the prior use at the current lead-free transition stage. Among the various lead-free solders, the SnAgCu-based solder has very good practicability in industrial production, and is considered as the most reliable substitute for the tin-lead solder.
The electrotransport devices used in the relevant research and literature are usually designed according to the needs of researchers themselves, and do not have corresponding industry standards. Because the style is less when carrying out the electromigration experiment, the dress card is more difficult, causes the damage to the style when carrying out the style change easily to make the experiment go on again, wasted a large amount of time.
Disclosure of Invention
The invention aims to provide a conductive device convenient for loading and unloading a test sample and a constant-temperature electromigration experiment device, which overcome the problem that the electromigration experiment device is difficult to install and clamp samples and can solve the problem of freely replacing and disassembling samples.
The technical scheme adopted by the invention for solving the technical problems is as follows: a conductive device convenient for assembling and disassembling a test pattern comprises a placing table made of insulating materials, two conductor tables made of conductive materials, an upper lead pressing wire, a lower lead pressing wire and a clamping device for clamping the test pattern, wherein the upper lead pressing wire, the lower lead pressing wire and the clamping device are arranged on the conductor tables; the conductor platform is provided with a wiring hole, and the clamping device and the wiring hole are fixed on the conductor platform through a silicon nitride ceramic plate; the top of the conductor table is provided with a groove, and the groove is provided with a clip for fixing the lead corresponding to the wiring hole.
Furthermore, the pattern is formed by welding the brazing filler metal and a base metal with a lap joint structure.
Furthermore, the placing table is an insulating ceramic gasket.
Furthermore, a gasket is arranged on the conductor table.
Further, a soldering joint constant temperature electromigration experimental apparatus who constitutes by above-mentioned electrically conductive device, its characterized in that: the electric heating oil bath device comprises a power supply device, a conductive device and a temperature control device, wherein the power supply device is a constant-current stabilized power supply, a power supply hand strap, a lead connector, a liquid crystal display panel, a current adjusting knob and a voltage adjusting knob are arranged on the power supply device, the power supply device is connected with the conductive device through a lead, the temperature control device is a constant-temperature oil bath pot, the conductive device is positioned in the constant-temperature oil bath pot, and a high-temperature-resistant ceramic base plate is arranged in the constant-temperature oil bath pot.
Furthermore, the conductor table is a pure copper conductor table, and the clamping device is coated with a conductive coating.
Further, the current of the power supply device is controlled to be 0 to 100A, the voltage is controlled to be 0 to 50V, and the voltage stability is as follows: less than or equal to 0.2 percent, current stability: less than or equal to 0.5 percent, load stability: less than or equal to 0.5 percent.
Furthermore, the wire is a high-temperature-resistant silica gel wire.
The beneficial effects of the invention are mainly shown in the following aspects:
1. the two conductor tables are slidably mounted in the clamping grooves of the placing table, the distance between the two conductor tables is adjusted according to the types with different lengths, the conductor tables are provided with clamping devices for clamping test patterns, the patterns with different thickness and sizes can be fixed by adjusting the clamping devices, the clamping device overcomes the difficulty in clamping the patterns of the electromigration experiment device, the patterns can be freely replaced and detached, and therefore the experiment requirements of the patterns with different specifications are met;
2. the clamping device and the wiring hole are fixed on the conductor table through the silicon nitride ceramic plate, so that the stability can be enhanced, and the pattern falling caused by vibration when the temperature control device is opened can be prevented. The checkpost is fixed on the recess of conductor bench top, can be so that the conductor platform in time dispels the heat, avoids overheated messenger's copper to melt. The gasket is fixed below the clamp through the bolt, so that the high-temperature-resistant silica gel lead can be fixed in the conductor table, the lead is ensured to be completely contacted and conducted with the conductor table, and the circuit is prevented from being burnt down due to resistance increase;
3. the conductor table is made of copper, so that the conductor table can be in good conductive contact with the pattern, and the copper conductor table can be effectively prevented from deforming;
4. a ceramic gasket is fixed below the conducting device through a bolt and plays roles in heat insulation and insulation.
Drawings
FIG. 1 is a front view of a conveniently-disassembled butt-jointed soldering joint constant-temperature electromigration experimental device;
FIG. 2 is a top view of a conveniently disassembled butt-joint soldering joint constant temperature electromigration experimental device;
FIG. 3 is a connection diagram of a butt-joint soldering joint constant-temperature electromigration experimental device convenient to disassemble;
FIG. 4 is a schematic diagram of a butt-joint soldering joint constant-temperature electromigration experimental device convenient to disassemble;
FIG. 5 is a schematic view of a sample mounting and clamping apparatus for a conveniently disassembled butt-joint solder joint constant temperature electromigration experimental apparatus;
the labels in the figure are: 1. the device comprises a power supply device, 2, a wire connector, 3, a liquid crystal display panel, 4, a current adjusting knob, 5, a voltage adjusting knob, 6, a conductor table, 601, a clip, 602, a wiring hole, 603, a gasket sheet, 7, an upper wire pressing wire, 8, a pattern, 9, a clamping device, 10, a lower wire pressing wire, 11, a wire, 12, a power supply hand strap, 13, a clamping groove, 14, a placing table, 15, a base material, 16 and brazing filler metal; 17. temperature control device, 18, ceramic backing plate, 19, conducting device.
Detailed Description
The embodiments of the present invention are described in detail with reference to the accompanying drawings, and the embodiments and specific operations of the embodiments are provided on the premise of the technical solutions of the present invention, but the scope of the present invention is not limited to the following embodiments.
A conductive device convenient for assembling and disassembling a test pattern, wherein the conductive device 19 comprises a placing table 14 made of an insulating material, two conductor tables 6 made of a conductive material, an upper lead pressing wire 7 and a lower lead pressing wire 10 which are arranged on the conductor tables 6, and a clamping device 9 used for clamping the test pattern, clamping grooves 13 are formed in the placing table 14, the two conductor tables 6 are slidably arranged in the clamping grooves 13, the upper lead pressing wire 7 and the lower lead pressing wire 10 which are used for fixing a lead 11 and the conductor tables 6 are respectively arranged above and below the conductor tables 6, and the clamping device 9 on the conductor tables 6 is internally provided with a detachable pattern 8; a wiring hole 602 is arranged on the conductor platform, and the clamping device 9 and the wiring hole 602 are fixed on the conductor platform 6 through a silicon nitride ceramic plate; the top of the conductor platform 6 is provided with a groove, and the groove is provided with a clip 601 for fixing the lead corresponding to the wiring hole 602.
Further, the pattern 8 is formed by welding the brazing material 16 to the base material 15 having the lap joint structure.
Further, the placing table 14 is an insulating ceramic gasket.
Furthermore, a gasket 603 is disposed on the conductor stage 6.
Further, a soldering joint constant temperature electromigration experimental apparatus who constitutes by above-mentioned electrically conductive device, its characterized in that: the constant-temperature oil bath device comprises a power supply device 1, a conductive device 19 and a temperature control device 17, wherein the power supply device 1 is a constant-current stabilized-voltage power supply, a power supply hand-held belt 12, a wire connector 2, a liquid crystal display panel 3, a current adjusting knob 4 and a voltage adjusting knob 5 are arranged on the power supply device 1, the power supply device 1 is connected with the conductive device 19 through a wire 11, the temperature control device 17 is a constant-temperature oil bath pot, the conductive device 19 is positioned in the constant-temperature oil bath pot, and a high-temperature-resistant ceramic backing plate 18 is arranged in the constant-temperature oil bath pot.
Further, the conductor table 6 is a pure copper conductor table, and the clamping device 9 is coated with a conductive coating.
Further, the current of the power supply device 1 is controlled to 0 to 100A, the voltage is controlled to 0 to 50V, and the voltage stability: less than or equal to 0.2 percent, current stability: less than or equal to 0.5 percent, load stability: less than or equal to 0.5 percent.
Further, the wire 11 is a high temperature resistant silica gel wire.
The following examples are further described.
Examples
1. Preparation of the forms
1. Preparation before welding
1, selection and preparation of brazing filler metal: the solder is Sn2.5Ag0.7Cu0.1RExNi, and a vacuum melting method is adopted to prepare a solder alloy: adopts more than 99.9 percent of Sn, ag, cu and Ni and mixed Rare Earth (RE) rich in Ce and La elements, and the vacuum degree is 5 multiplied by 10 -3 Pa non-consumable electric furnace ZHW-600A, firstly, preparing intermediate alloy of Cu and RE, then taking a certain amount of intermediate alloy, sn, ag, cu and Ni to prepare Sn2.5Ag0.7Cu0.1RExNi, and the brazing filler metal 16 is a brazing filler metal alloy sheet.
2) Debugging of welding equipment: and (3) connecting a power supply of the box type resistance furnace with 220V alternating current, adjusting parameters of the box type resistance furnace to enable the box type resistance furnace to reach the working temperature, if the box type resistance furnace normally runs, closing the box type resistance furnace, and starting the box type resistance furnace when needed by an experiment.
3) Design of the pattern: in the electromigration experiment, since the current density is required to reach the critical current density, the design of 8 dimensions and sizes requires 5 considerations: a. the processing is convenient, b, the critical current density is achieved, c, the size and the dimension are matched with the conducting device, d, the heat resistance meet the requirement of electrifying time, and e, the disassembly is convenient.
2. The brazing process comprises the following steps: before a brazing welding test, grinding by using metallographic abrasive paper with different types of thicknesses, cleaning brazing filler metal 16, soaking by using acetone, cleaning a welding surface by using alcohol, blow-drying by using a blower, manufacturing the brazing filler metal into brazing filler metal alloy sheets, placing the prepared brazing filler metal 16 between the upper part and the lower part of two base metals 15 with a step-shaped lap joint structure, dripping 1-2 drops of commercial CX600 water-washing brazing flux on the surface to be welded, wherein the brazing flux can effectively remove oxide films on the surface layers of the liquid brazing filler metal 16 and the base metals 15 so as to realize good combination between a Cu matrix and the liquid brazing filler metal 16, then placing the base metals into a box type resistance furnace for brazing, setting the brazing temperature at 270 ℃, setting the brazing time at 240s, obtaining a pattern 8, setting the thickness of the pattern at 0.2-2 mm, and cutting the pattern 8 into the pattern 8 by a secondary line, wherein the pattern 8 is cut into the pattern 8 with the specification of 20mm multiplied by 3 mm.
2. Design of the conductive system: the conducting system is a device for electromigration after the sample 8 is installed, the balance between the conducting system and a heat circulation system is adjusted, the conducting system is a core device for installing the sample in an electromigration experiment, a conducting device 19 in the conducting system is connected with the positive electrode and the negative electrode of a constant current stabilized voltage power supply through a high temperature resistant silica gel lead 11, the current of the constant current stabilized voltage power supply is controlled to be 0-100A, and the voltage of the constant current stabilized voltage power supply is controlled to be 0-50V.
The placing table 14 below the conducting device 19 is fixed inside the experimental device through a fixing bolt, the placing table is an insulating ceramic gasket and plays roles of heat insulation and insulation, the conductor table 6 is slidably mounted in a clamping groove 13 of the placing table 14, the conductor table 6 can be in good conductive contact with the pattern 8, and the conductor table 6 can be effectively prevented from being deformed. The clamping device 9 can be adjusted by size, the thickness of the mounting pattern 8 is between 0.2mm and 2mm, and the clamping device 9 is coated with a conductive coating. The clamping device 9 and the wiring hole 602 are fixed on the conductor table 6 through a silicon nitride ceramic plate, so that the stability can be enhanced, and the pattern 8 can be prevented from falling off due to the open vibration of the thermal cycle equipment. The clamp 601 is fixed on the groove above the conductor table 6, so that the conductor table 6 can timely dissipate heat, and overheating is avoided to melt copper. The high-temperature-resistant silica gel lead 11 can be fixed in the conductor table 6 under the clamp 601 through the bolt fixing pad gasket 603, so that the lead 11 is ensured to be completely contacted and conducted with the conductor table 14, and the circuit is prevented from being burnt due to resistance increase.
3. The style card installing method comprises the following steps: the pattern card firstly fixes the high temperature resistant silica gel lead wire 11 on the conductor platform 6 through the wiring hole 602, and the high temperature resistant silica gel lead wire 11 is fully contacted with the conductor platform 6 through the clamp 601. The chucking device 9 is polished flat and smooth by sandpaper, and a conductive coating is applied to the chucking device 9 to enhance conductivity. Because the pattern is subjected to line cutting before the experiment is carried out, the pattern 8 needs to be polished by abrasive paper before the pattern is installed and clamped so as to remove oil stains and oxidation films on the surface layer of the pattern 8, the polished pattern 8 is lightly placed on the left clamping device 9 and the right clamping device 9, the pattern 8 is slowly fixed on the conductor table 6, and the lining sheet 603 is arranged on the conductor table 6, so that the pattern 8 can be prevented from being broken due to uneven stress in the installation process. In the model 8 clamping device, two pure copper conductor tables 6 are placed in parallel, the two pure copper conductor tables 6 are positioned in two clamping grooves of an insulation placing table 14, the two pure copper conductor tables 6 are ensured to be parallel and stable, the distance between the two pure copper conductor tables 6 is adjusted according to the size of an experimental model 8, a model joint 8 is placed in a gap between the two pure copper conductor tables 6, a high-temperature-resistant lead 11 penetrates through the pure copper conductor tables 6, an upper lead pressing wire 7 and a lower lead pressing wire 10 fix the high-temperature-resistant lead 11 and the pure copper conductor tables 6, the model 11 and the pure copper conductor tables 6 are connected into a whole through a clamping device 9, the model 11 is fixed through a rotary clamping device 9, the high-temperature-resistant lead 11 is connected with a lead connector 2, the insulation placing table 14 is placed in a constant-temperature oil bath, a high-temperature-resistant ceramic base plate 18 is placed in the constant-temperature oil bath, a direct-current stabilized power supply is opened, a current adjusting knob 4 and a voltage adjusting knob 5 are adjusted at the same time, the target current is adjusted according to data on a liquid crystal display panel 3, and a power supply lifting belt 12 is used for facilitating movement of a power supply.
In order to prevent the pattern 8 from being brittle when the pattern 8 is detached after the energization, the pattern 8 needs to be cooled in the air for half an hour due to a high ambient temperature, and the pattern 8 is detached by rotating the clamper 9 after the temperature of the pattern 8 is lowered.
In the invention, the size of the pattern 8 is matched with that of the pure copper conductor table 6, and the fixation of the pure copper conductor table 6 and the pattern 8 is the key point for building an electromigration experiment. The pure copper conductor tables 6 serve for conducting current and for placing the patterns 8, and the length of the patterns 8 is matched with the gap between the pure copper conductor tables 6 so as to better complete the installation of the patterns 8 on the experimental device. The placement of the gripping device 9 is essential to the invention, and it is ensured that the placement of the gripping device 9 is rotated at the same time as the fixing of the pattern 8.
4. Selection of power supply: in the electromigration experiment process, a direct current power supply is mainly used for carrying out experiments, the model of the power supply is LW-50100KD type two-way tracking voltage and current stabilizing power supply, and the measuring range is 0 to 100A, as shown in figures 2-5. The DC power supply has the functions of constant voltage and constant current, and the two modes can be automatically switched along with the change of the load. In addition, the overvoltage protection function is also provided, so that the power supply can be prevented from being burnt when the power supply voltage is too high. The protection circuit has multiple protections, can protect the self-protection circuit at high voltage and can stably work at low voltage; the time display is accurate under the conditions of action voltage and startup delay, the execution response speed is high, and meanwhile, the real-time voltage can be displayed; the automatic starting or manual starting can be set after power failure, power supply and tripping power-off protection; the closing delay time can be set. The voltage stability and the current stability are higher, and the voltage stability is as follows: less than or equal to 0.2 percent, current stability: less than or equal to 0.5 percent, load stability: less than or equal to 0.5 percent. The power supply has the characteristics of convenient and effective use, short circuit permission and constant current during short circuit. The output end of the panel is provided with a grounding binding post, so that the power supply can be conveniently connected to the system ground potential of a user.
5. Heating and temperature control system: in order to isolate the influence of joule heat in the electromigration experiment, the sample of formula 8 needs to be placed in a constant temperature environment, and thus the electromigration experiment device needs to be controlled at a constant temperature.
Before the device is placed in a constant-temperature oil bath, conducting test needs to be carried out firstly, namely after the device is connected, a direct-current stabilized voltage power supply is turned on, a voltage adjusting knob 5 and a current adjusting knob 4 are adjusted, if conducting, the device is placed in the constant-temperature oil bath for test, and if not conducting, whether a clamping device 9 and a wire connector 2 are well connected with a high-temperature-resistant wire 11 is checked.
The heating and temperature control system mainly comprises an HH-S digital display constant-temperature oil bath, the power supply of the heating and temperature control system adopts a 220V power supply, the accurate temperature control at 300 ℃ can be realized at room temperature (the error is not more than +/-1 ℃), the temperature control instrument is designed by adopting a high-stability operational amplifier, a double-integral high-precision A/D conversion technology and a far infrared heating technology, the heat balance time is short, the temperature fluctuation is small, and the test data is displayed by an LED (light-emitting diode) and is visual and accurate. In order to prevent electromigration pattern from contacting the constant temperature oil bath, it is necessary to place ceramic pad 18 in the constant temperature oil bath, which is needed to place conductive device 19 connected with pattern 8 in the constant temperature oil bath during electromigration experiment.
The above description is of the preferred embodiment of the invention. It is to be understood that the invention is not limited to the particular embodiments described above, in that devices and structures not described in detail are understood to be implemented in a manner common in the art; those skilled in the art can make many possible variations and modifications to the disclosed embodiments, or modify equivalent embodiments, without affecting the spirit of the invention, using the methods and techniques disclosed above, without departing from the scope of the invention. Therefore, any simple modification, equivalent change and modification of the above embodiments according to the technical essence of the present invention are within the protection scope of the technical solution of the present invention.
Claims (8)
1. The utility model provides a conveniently load and unload electrically conductive device of test style which characterized in that: the conductive device (19) comprises a placing table (14) made of insulating materials, two conductor tables (6) made of conductive materials, an upper lead pressing wire (7), a lower lead pressing wire (10) and a clamping device (9) for clamping a test pattern, wherein the upper lead pressing wire and the lower lead pressing wire (10) are arranged on the conductor tables (6), the clamping groove (13) is formed in the placing table (14), the two conductor tables (6) are slidably mounted in the clamping groove (13), the upper lead pressing wire (7) and the lower lead pressing wire (10) for fixing a lead (11) and the conductor tables (6) are respectively arranged above and below the conductor tables (6), and the detachable pattern (8) is mounted in the clamping device (9) on the conductor tables (6); a wiring hole (602) is arranged on the conductor platform, and the clamping device (9) and the wiring hole (602) are fixed on the conductor platform (6) through a silicon nitride ceramic plate; the top of the conductor platform (6) is provided with a groove, and the groove is provided with a clip (601) which is corresponding to the wiring hole (602) and used for fixing the lead (11).
2. The conductive apparatus for facilitating handling of test patterns according to claim 1, wherein: the pattern (8) is formed by welding a brazing material (16) and a base material (15) with a lap joint structure.
3. The conductive apparatus for facilitating handling of test patterns according to claim 1, wherein: the placing table (14) is an insulating ceramic gasket.
4. The conductive apparatus for facilitating handling of test patterns according to claim 1, wherein: and a gasket (603) is also arranged on the conductor table (6).
5. A constant temperature electromigration test apparatus having the conductive apparatus of claim 1, wherein: the constant-temperature oil bath device comprises a power supply device (1), a conductive device (19) and a temperature control device (17), wherein the power supply device (1) is a constant-current stabilized voltage power supply, a power supply portable belt (12) is arranged on the power supply device (1), a wire connector (2), a liquid crystal display panel (3), a current adjusting knob (4) and a voltage adjusting knob (5), the power supply device (1) is connected with the conductive device (19) through a wire (11), the temperature control device (17) is a constant-temperature oil bath pot, the conductive device (19) is located in the constant-temperature oil bath pot, and a high-temperature resistant ceramic backing plate (18) is arranged in the constant-temperature oil bath pot.
6. The constant-temperature electromigration experimental apparatus according to claim 5, wherein: the conductor table (6) is a pure copper conductor table, and the clamping device (9) is coated with a conductive coating.
7. The constant-temperature electromigration experimental apparatus according to claim 5, wherein: the current of the power supply device (1) is controlled to be 0-100A, the voltage is controlled to be 0-50V, and the voltage stability is as follows: less than or equal to 0.2 percent, current stability: less than or equal to 0.5 percent, load stability: less than or equal to 0.5 percent.
8. The constant-temperature electromigration experimental apparatus according to claim 5, wherein: the lead (11) is a high-temperature-resistant silica gel lead.
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| TWI221908B (en) * | 2002-06-25 | 2004-10-11 | Infineon Technologies Ag | Electromigration test apparatus and an electromigration test method |
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