CN110756943A - Baseplate structure for improving welding quality and welding method thereof - Google Patents
Baseplate structure for improving welding quality and welding method thereof Download PDFInfo
- Publication number
- CN110756943A CN110756943A CN201910892281.9A CN201910892281A CN110756943A CN 110756943 A CN110756943 A CN 110756943A CN 201910892281 A CN201910892281 A CN 201910892281A CN 110756943 A CN110756943 A CN 110756943A
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- Prior art keywords
- welding
- improving
- quality
- bottom plate
- dbc
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
A bottom plate structure for improving welding quality comprises a body and a preset material for DBC welding; the body is connected with a preset material, and at least two viscous identification points are arranged on the upper surface of the preset material; the viscosity characteristic of the identification points can effectively solve the problems of drift dislocation and rotation dislocation when the base plate and the DBC plate are welded, so that the solder flows uniformly on the surface of the base plate, the phenomenon of nonuniform solder at four corners of a welding layer is reduced, and the welding quality of the four corners of the welding layer is improved; the novel bottom plate structure can effectively solve the phenomena of drift dislocation, rotation dislocation and uneven welding layer during welding between the bottom plate and the DBC, and improves the welding quality and the production efficiency of the welding layer.
Description
Technical Field
The invention belongs to the technical field of semiconductor device modules, and particularly relates to a bottom plate structure for improving welding quality and a welding method thereof.
Background
At present, as shown in the figure, an IGBT device mainly comprises a bottom plate body 1, a DBC3, a chip 4, a silica gel 5, a bonding wire 6, a PCB 7, a top cover 8, a housing 9 and a motor, wherein the bottom plate body 1, the DBC3, the DBC3 and the chip 4 are all connected by forming a metal alloy layer through a material welding process to complete internal connection, the surface of the chip 4 is electrically connected in parallel through aluminum wire bonding to meet the voltage and current requirements, in the frequent switching process of the IGBT device, mechanical fatigue can cause the service life failure of the device, and the phenomenon mainly appears as cracking and degradation at four corners of a solder layer between the bottom plate and the DBC3, between the DBC3 and the chip 4 and the bonding and falling of the surface of the.
As shown in fig. 2, in the existing welding process of the DBC3 and the base plate, a material made of lead, tin and silver is placed on the base plate with a radian on the surface, the DBC3 is placed on the material, the position is adjusted to enable the DBC3 to be completely overlapped with the material, the assembled DBC3, the material and the base plate are sent into a vacuum confluence welding furnace to be welded, the melting of a solder is completed through the processes of preheating, heating, heat preservation and cooling, the solder flows on the plane of the base plate and forms intermetallic compounds with tin-coated layers on the surface of the base plate and back copper layers of the DBC3 respectively, the welding process between the base plate and the DBC3 is completed, the thickness of a welding layer is usually 50-150 um, and the phenomenon of delamination can be caused by the.
When the DBC3 is welded with the bottom plate, a special tool is needed to be used for placing materials on the bottom plate, then the DBC3 plate is placed on the materials, workers adjust the three to proper positions according to experience, the whole DBC3 plate is placed in welding equipment to be started to weld, the materials and the DBC3 plate are prone to drifting and rotating and dislocating in the process, meanwhile, due to the fact that the phenomenon that welding layers are uneven due to the fact that the welding flux flows on the surface of the bottom plate, welding quality is affected, and after the phenomenon occurs, the welding flux is irreversible and cannot be repaired.
Meanwhile, care is needed in the whole process of assembling and placing welding equipment, and if dislocation occurs, re-assembling is needed, so that the production efficiency is seriously affected.
Disclosure of Invention
The invention aims to provide a bottom plate structure for improving welding quality and a welding method thereof, which solve the problems of drift dislocation, rotation dislocation and uneven welding layer during welding between a bottom plate and a DBC.
The purpose of the invention is realized by the following technical scheme:
a bottom plate structure for improving welding quality comprises a body and a preset welding material for DBC welding;
the body is connected with preset welding materials, and at least two sticky identification points are arranged on the upper surface of the preset welding materials.
Further: the at least two identification points having stickiness are disposed on a diagonal line of an upper surface of the pre-set soldering material.
Further: the preset welding material can be a welding sheet or soldering paste or nano silver.
Further: the identification points are circular.
Further: the identification points are squares.
Further: the identification points are rectangles.
Further: the body is made of AlSiC or Cu.
Further: the identification point is made of terpineol.
A welding method for a bottom plate structure for improving welding quality specifically comprises the following steps:
the bottom plate structure is an integrated bottom plate with a preset welding material and a body;
bonding at least two identification points on the upper surface of the preset welding material;
and bonding the DBC on the identification point for welding.
Compared with the prior art, the beneficial effect that this application has is:
the fixing between the DBC and the material can be improved by presetting the identification points on the upper surface of the welding material, the efficiency of installing the base plate, the material and the DBC by workers or equipment can be greatly improved by the identification points in the installation process of the DBC, and the functions of quick identification and positioning are achieved;
the drift dislocation, the rotation dislocation that appear when the viscidity characteristic of identification point can effectively be solved bottom plate and DBC board and weld for the solder flows at bottom plate surface uniformity, reduces the inhomogeneous phenomenon of welding layer four corners solder, improves welding layer four corners welding quality.
The novel bottom plate structure can effectively solve the phenomena of drift dislocation, rotation dislocation and uneven welding layer during welding between the bottom plate and the DBC, and improves the welding quality and the production efficiency of the welding layer.
Drawings
FIG. 1 is a schematic representation of the prior art of the present invention;
FIG. 2 is a flowchart illustrating a process for welding a base plate according to the prior art;
fig. 3 is an exploded view of the novel backplane structure and DBC of the present invention.
Wherein: 1. a body; 2. presetting welding materials; 21. identifying a point; 3. DBC; 4. a chip; 5. a silicone gel; 6. a bonding wire; 7. a PCB board; 8. a top cover; 9. a housing; 10. and an electrode.
Detailed Description
The invention is described in further detail below with reference to the accompanying drawings:
as shown in fig. 3, a floor structure for improving welding quality includes a body 1 and a pre-material 2 for DBC3 welding.
The body 1 is made of AlSiC or Cu, a preset groove is formed in the body 1, and the preset welding material 2 is located in the preset groove and abutted to the body 1.
Or the prefabricated welding material 2 is adhered to the body 1.
The body 1 is rectangular, and the preset groove is rectangular.
The upper surface of the pre-set soldering material 2 is adhered with two identification points 21 having viscosity, and the two identification points 21 having viscosity are arranged on the diagonal line of the upper surface of the pre-set soldering material 2.
The identification points 21 are circular or square or rectangular.
The preset welding material 2 is preferably soldering lug or soldering paste or nano silver, and the soldering lug is preferably lead soldering tin.
The identification spot 21 is made of terpineol.
A welding method for a bottom plate structure for improving welding quality specifically comprises the following steps:
the bottom plate structure is an integrated bottom plate with a preset welding material 2 and a body 1.
Two identification points 21 are bonded to the upper surface of the material.
And then the DBC3 is bonded to the identification point 21 for welding.
The working principle is as follows: the novel bottom plate comprises AlSiC or Cu bottom plate, preset material 2, identification point 21, and identification point 21 has viscidity, and in bottom plate and DBC 3's assembling process, because novel bottom plate preset material, can save this step of placing the material on the bottom plate, avoid phenomenons such as material pollution, pincher trees in the assembling process. The preset material 2 is provided with the identification points 21, so that automatic assembly is facilitated, and meanwhile, due to the fact that the identification points 21 are sticky, after the DBC3 is placed, the phenomena of drifting dislocation, rotating dislocation, uneven welding layer and the like of DBC3 and materials can be avoided, and welding quality and production efficiency are effectively improved.
It is noted that relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
It is to be understood that the present application is not limited to what has been described above, and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.
Claims (9)
1. A floor construction for improving the welding quality, characterized in that it comprises a body (1) and a pre-placed welding material (2) for DBC (3) welding;
the body (1) is connected with a preset welding material (2), and at least two sticky identification points (21) are arranged on the upper surface of the preset welding material (2).
2. A floor construction for improving the quality of a weld according to claim 1, characterised in that said at least two identification points (21) with adhesive properties are arranged on the diagonal of the upper surface of the pre-arranged welding material (2).
3. A backplane structure for improving solder quality according to claim 1, characterized in that the pre-positioned solder material (2) is a solder pad or a solder paste or nanosilver.
4. A floor construction for improving the quality of a weld according to claim 1, characterised in that the identification points (21) are circular.
5. A floor construction for improving the quality of the welding according to claim 1, characterized in that the identification points (21) are square.
6. A floor construction for improving the quality of a weld according to claim 1, characterized in that the identification point (21) is rectangular.
7. A floor construction improving the quality of the weld according to claim 1, characterized in that the body (1) is made of AlSiC or Cu.
8. A floor structure for improving the quality of the welding according to claim 1, characterized in that said identification point (21) is made of terpineol.
9. A welding method for a bottom plate structure for improving welding quality is characterized by comprising the following steps:
the bottom plate structure is an integrated bottom plate with a preset welding material (2) and a body (1);
bonding at least two identification points (21) on the upper surface of the preset welding material (2);
and then bonding the DBC (3) on the identification point (21) for welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910892281.9A CN110756943A (en) | 2019-09-20 | 2019-09-20 | Baseplate structure for improving welding quality and welding method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910892281.9A CN110756943A (en) | 2019-09-20 | 2019-09-20 | Baseplate structure for improving welding quality and welding method thereof |
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| Publication Number | Publication Date |
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| CN110756943A true CN110756943A (en) | 2020-02-07 |
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| CN201910892281.9A Pending CN110756943A (en) | 2019-09-20 | 2019-09-20 | Baseplate structure for improving welding quality and welding method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111725082A (en) * | 2020-06-10 | 2020-09-29 | 西安中车永电电气有限公司 | Welding method of IGBT chip |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102054708A (en) * | 2009-10-28 | 2011-05-11 | 联致科技股份有限公司 | Method for forming window ball grid array encapsulated pre-substrate |
| CN102960077A (en) * | 2010-06-28 | 2013-03-06 | 阿有米工业股份有限公司 | Joint structure manufacturing method, heating and melting treatment method, and system for same |
| CN204834594U (en) * | 2015-07-15 | 2015-12-02 | 中山大洋电机股份有限公司 | Power semiconductor |
| CN105990265A (en) * | 2015-02-26 | 2016-10-05 | 台达电子工业股份有限公司 | Power conversion circuit package module and manufacture method thereof |
| CN106098573A (en) * | 2015-04-30 | 2016-11-09 | 三菱电机株式会社 | The manufacture method of semiconductor device |
| WO2018202919A1 (en) * | 2017-05-05 | 2018-11-08 | Pink Gmbh Thermosysteme | Soldering device and a method for producing a solder connection of components using adhesive material for temporary connection of the components |
| CN110142475A (en) * | 2019-05-07 | 2019-08-20 | 国电南瑞科技股份有限公司 | It is a kind of to be fixedly welded method without tooling for high-power IGBT module |
-
2019
- 2019-09-20 CN CN201910892281.9A patent/CN110756943A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102054708A (en) * | 2009-10-28 | 2011-05-11 | 联致科技股份有限公司 | Method for forming window ball grid array encapsulated pre-substrate |
| CN102960077A (en) * | 2010-06-28 | 2013-03-06 | 阿有米工业股份有限公司 | Joint structure manufacturing method, heating and melting treatment method, and system for same |
| CN105990265A (en) * | 2015-02-26 | 2016-10-05 | 台达电子工业股份有限公司 | Power conversion circuit package module and manufacture method thereof |
| CN106098573A (en) * | 2015-04-30 | 2016-11-09 | 三菱电机株式会社 | The manufacture method of semiconductor device |
| CN204834594U (en) * | 2015-07-15 | 2015-12-02 | 中山大洋电机股份有限公司 | Power semiconductor |
| WO2018202919A1 (en) * | 2017-05-05 | 2018-11-08 | Pink Gmbh Thermosysteme | Soldering device and a method for producing a solder connection of components using adhesive material for temporary connection of the components |
| CN110142475A (en) * | 2019-05-07 | 2019-08-20 | 国电南瑞科技股份有限公司 | It is a kind of to be fixedly welded method without tooling for high-power IGBT module |
Non-Patent Citations (1)
| Title |
|---|
| 徐玲: ""IGBT功率模块封装可靠性研究"", 《中国博士学位论文全文数据库信息科技辑》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111725082A (en) * | 2020-06-10 | 2020-09-29 | 西安中车永电电气有限公司 | Welding method of IGBT chip |
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