CN102208498A - Method and device for packaging light-emitting diode (LED) high-heat-conduction insulated base - Google Patents
Method and device for packaging light-emitting diode (LED) high-heat-conduction insulated base Download PDFInfo
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- CN102208498A CN102208498A CN2011101184865A CN201110118486A CN102208498A CN 102208498 A CN102208498 A CN 102208498A CN 2011101184865 A CN2011101184865 A CN 2011101184865A CN 201110118486 A CN201110118486 A CN 201110118486A CN 102208498 A CN102208498 A CN 102208498A
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Abstract
The invention provides a method and device for packaging a light-emitting diode (LED) high-heat-conduction insulated base. The device comprises an insulated heat-conduction plate, a metal radiator and an LED lamp chip, wherein the upper and lower surfaces of the insulated heat-conduction plate are provided with first and second weldable metal base surfaces which are insulated with each other; the top of the metal radiator is provided with a layer of third weldable metal base surface; the third weldable metal base surface and the second weldable metal base surface are welded, so that the insulated heat-conduction layer and the metal radiator are welded into a whole; and the LED lamp chip is welded on the first weldable metal base surface. In the LED lamp device manufactured according to the invention, the LED lamp chip and the metal radiator are insulated, and the insulated heat-conduction plate has a high heat conduction coefficient and an extremely high electric isolation effect, thereby solving the problem that a large-power LED lamp device can not resist high voltages and providing a guarantee for further the popularization and application of the large-power LED lamp device in the aspects of street lamp and factory illumination and the reduction in maintenance rate.
Description
Technical field
The present invention relates to the manufacturing technology of LED device packaging technique and integrated circuit (IC) chip, especially relate to the manufacturing technology that a kind of high-capacity LED lamp chip base adopts the encapsulation of high heat conductive insulating pedestal.
Background technology
The energy-saving and environmental protection that this new type light source of LED is had, life-span are long, toggle speed is fast, can control luminescent spectrum and forbid making more advantages of higher of brightness with the size of the width of cloth, make conventional light source to have obtained developing on an unprecedented scale with its analogy.
Be accompanied by increasing the actual demand of LED lamp luminous quantity, the high-capacity LED lamp chip arises at the historic moment.Thing followed problem is, for the LED lamp, 80% of the electric energy of importing all consumes with the form of heat.If these heats that can not in time apace LED wick sheet be produced distribute, temperature-rise effect not only makes the light output of LED lamp have a greatly reduced quality, and the life-span of led chip also will significantly reduce.
The traditional fabrication technology of LED lamp is to consider design heat dissipating method and structure from the angle of single led wick sheet and pedestal encapsulation.The shortcoming of this method for designing is: be used for the best radiating mode of radiating effect---heat conducting material volume is little, the heat conducting and radiating area is little, and air flow passage disorder between pedestal, radiating efficiency is low; Pedestal need be processed a plurality of tiny through hole complex manufacturing technology, cost of manufacture height; Consumptions such as precious metal material silver, tungsten, molybdenum are big.For example just there are the problems referred to above in Chinese invention patent CN 101252162A " a kind of high-power LED ceramic package base ".
It is to be noted especially, great power LED device of the prior art, LED wick sheet and metal base all are electrical communication, for improving the capacity of heat transmission of metal base to radiator, metal base directly can be linked to each other with radiator, when such great power LED device is used for occasions such as street lamp, industrial light, the induction of the high-voltage electrical apparatus of thunder and lightning and factory's complexity, tend to be higher than 20% device breakdown damage, this has been confirmed when the LED light fixture keeps in repair repeatedly.As addressing this problem, then need between LED metal base and radiator, add an insulating material, very low owing to can not closely contacting with the conductive coefficient of insulating material, the contradictory problems that therefore solves between the anti-puncture of LED wick sheet and the raising capacity of heat transmission is a problem that needs to be resolved hurrily.
Summary of the invention
In order to solve the anti-breakdown problem of LED wick sheet that exists in the prior art, the present invention proposes a kind of method and device of LED high heat conductive insulating pedestal encapsulation.
The present invention is by realizing by the following technical solutions:
Implement a kind of first embodiment of method of LED high heat conductive insulating pedestal encapsulation, described method comprises the steps:
1., insulating heat-conductive plate of preparation, at the upper surface of described insulating heat-conductive plate,, but adopt plating or sintering process to make one deck weld metal first basal plane at the predeterminated position of design in advance; At the lower surface of described insulating heat-conductive plate, but adopt plating or sintering process to make one deck weld metal second basal plane;
But it is but insulated from each other between described weld metal first basal plane and weld metal second basal plane;
2., preparation one metal heat sink, but make one deck weld metal the 3rd basal plane at the end face of described metal heat sink, this basal plane can carry out soldering or metal connects;
But 3., on the weld metal first basal plane predeterminated position of insulating heat-conductive plate the coated with high temperature tin cream, this high temperature tin cream fusion temperature 〉=250 ℃, the bottom that then LED wick sheet is coated with metal level is placed on the high temperature tin cream, and closely contact; Again insulating heat-conductive plate and LED wick sheet together are heated to more than 250 ℃, LED wick sheet and insulating heat-conductive plate are welded together; But then Herba Anoectochili roxburghii is welded on the circuit on weld metal first basal plane on LED wick plate electrode and the insulating heat-conductive plate, or Herba Anoectochili roxburghii is welded on the electric current that forms the LED lamp on the electrode of adjacent LED wick sheet and goes the same way; To be coated in the fluorescent material that glue mixes then on the LED wick sheet, form a complete LED encapsulation;
But 4., then on weld metal the 3rd basal plane of described metal heat sink, apply the eutectic welding tin cream, 180 ℃～249 ℃ of its fusion temperatures, but weld metal second basal plane with the insulating heat-conductive plate in the described LED encapsulation closely contacts with described eutectic welding tin cream then, they are heated to the fusion temperature of eutectic welding tin cream jointly, make described insulating heat-conductive plate and described metal heat sink integrally welded.
The 1. described insulating heat-conductive plate of step is made of high heat-conducting ceramic, and described high heat-conducting ceramic comprises that conductive coefficient is higher than 30 aluminium oxide, aluminium nitride;
But but but the metal material of the described weld metal first basal plane weld metal second basal plane weld metal the 3rd basal plane comprises gold, silver, copper, nickel;
The material of described metal heat sink comprises aluminium alloy, steel, copper, high heat-conducting ceramic.
The LED wick sheet of preparation more than one on the described insulating heat-conductive plate.
But can also realize being connected with the bonding mode of high hot elargol between LED wick sheet and weld metal first basal plane.
A kind of second embodiment of method of LED high heat conductive insulating pedestal encapsulation, described alternative plan comprises the steps:
1., insulating heat-conductive plate of preparation, at the upper surface of described insulating heat-conductive plate,, but adopt plating or sintering process to make one deck weld metal first basal plane at the predeterminated position of design in advance; At the lower surface of described insulating heat-conductive plate, but adopt plating or sintering process to make one deck weld metal second basal plane;
But it is but insulated from each other between described weld metal first basal plane and weld metal second basal plane;
2., preparation one metal heat sink, but make one deck weld metal the 3rd basal plane at the end face of described metal heat sink, this basal plane can carry out soldering or metal connects;
But 3., coated with high temperature tin cream on weld metal the 3rd basal plane of metal heat sink then, its fusing point 〉=250 ℃, but again weld metal second basal plane of insulating heat-conductive plate is placed on the high temperature tin cream closely contact, together be heated to above 250 ℃, they are welded together;
But weld metal first basal plane that 4., default circuit is arranged on the insulating heat-conductive plate then
Apply the low temperature tin cream on the predeterminated position, 180 ℃～249 ℃ of its fusion temperatures, metal covering with LED wick sheet is placed on the low temperature tin cream then, together be heated to the fusion temperature of tin cream then, they are welded together, and then but Herba Anoectochili roxburghii is welded on the circuit on weld metal first basal plane on LED wick plate electrode and the insulating heat-conductive plate, or Herba Anoectochili roxburghii is welded on the electric current that forms the LED lamp on the electrode of adjacent LED wick sheet and goes the same way, on the chip of insulation board, apply fluorescent material more at last.
With a kind of LED high heat conductive insulating pedestal packaged device that said method is made, described device comprises:
The insulating heat-conductive plate;
Metal heat sink;
LED wick sheet; But one deck weld metal first basal plane that the upper surface of described insulating heat-conductive plate has plating adopted or sintering process to make;
At the lower surface of described insulating heat-conductive plate, but one deck weld metal second basal plane that has plating adopted or sintering process to make;
But it is but insulated from each other between described weld metal first basal plane and weld metal second basal plane;
But the end face of described metal heat sink has one deck weld metal the 3rd basal plane;
But but welding or metal are connected between described weld metal the 3rd basal plane and weld metal second basal plane, and described insulating heat-conductive plate and described metal heat sink are linked into an integrated entity;
But described LED wick sheet is welded on weld metal first basal plane.
The structure of described insulating heat-conductive plate is included in conductive coefficient and is higher than 30 highly heat-conductive carbon/ceramic
But but the thin layer of the two sides of porcelain thin slice preparation weld metal first basal plane and weld metal second basal plane.
The LED wick sheet of preparation more than one on the described insulating heat-conductive plate.
But can realize being connected with the bonding mode of high hot elargol between LED wick sheet and weld metal first basal plane.
Compared with the prior art, advantage of the present invention is:
LED lamp components with the present invention's making, insulate between LED wick sheet and the metal heat sink, the existing high conductive coefficient of one deck insulating heat-conductive plate, high electrical isolation effect is arranged again, thereby solved the not high voltage bearing problem of great power LED lamp components, for the great power LED lamp components is further applied in street lamp, industrial light, reducing maintenance rate provides assurance.
Description of drawings
Fig. 1 is the method and the device schematic diagram of the LED high heat conductive insulating pedestal encapsulation of a plurality of LED wick of the present invention sheet.
The drawing reference numeral explanation
1 insulating heat-conductive plate.
But 11 weld metals, first basal plane.
But 12 weld metals, second basal plane.
2 metal heat sinks.
But 21 weld metals the 3rd basal plane.
3 solder(ing) pastes.
4 LED wick sheets.
5 solder(ing) pastes.
Embodiment
In order to further specify method of the present invention, existing a preferred embodiment of the present invention shown in conjunction with the accompanying drawings is elaborated, yet the described embodiment usefulness for furnishing an explanation and explaining only can not be used for limiting scope of patent protection of the present invention.
As shown in Figure 1, implement a kind of method of LED high heat conductive insulating pedestal encapsulation, described first embodiment comprises the steps:
1., insulating heat-conductive plate 1 of preparation, at the upper surface of described insulating heat-conductive plate 1,, but adopt plating or sintering process to make one deck weld metal first basal plane 11 at the predeterminated position of design in advance; At the lower surface of described insulating heat-conductive plate 1, but adopt plating or sintering process to make one deck weld metal second basal plane 12;
But it is but insulated from each other between described weld metal first basal plane 11 and weld metal second basal plane 12;
2., preparation one metal heat sink 2, but make one deck weld metal the 3rd basal plane 21 at the end face of described metal heat sink 2, this basal plane can carry out soldering or metal connects;
But 3., on weld metal first basal plane 11 predeterminated positions of insulating heat-conductive plate 1, be coated with
Cover the high temperature tin cream, this high temperature tin cream fusion temperature 〉=250 ℃, the bottom that LED wick sheet 4 is coated with metal level is placed on the high temperature tin cream then, and closely contact; Again insulating heat-conductive plate 1 and LED wick sheet 4 together are heated to more than 250 ℃, LED wick sheet 4 and insulating heat-conductive plate 1 are welded together; But then Herba Anoectochili roxburghii is welded on the circuit on weld metal first basal plane 11 on LED wick sheet 4 electrodes and the insulating heat-conductive plate 1, or Herba Anoectochili roxburghii is welded on the electric current that forms the LED lamp on the electrode of adjacent LED wick sheet 4 and goes the same way; To be coated in the fluorescent material that glue mixes then on the LED wick sheet 4, form a complete LED encapsulation;
But 4., then on weld metal the 3rd basal plane 21 of described metal heat sink 2,
Apply the eutectic welding tin cream, 180 ℃～249 ℃ of its fusion temperatures, but weld metal second basal plane 12 with the insulating heat-conductive plate 1 in the described LED encapsulation closely contacts with described eutectic welding tin cream then, they are heated to the fusion temperature of eutectic welding tin cream jointly, make described insulating heat-conductive plate 1 and described metal heat sink 2 integrally welded.
The 1. described insulating heat-conductive plate 1 of step is made of high heat-conducting ceramic, and described high heat-conducting ceramic comprises that conductive coefficient is higher than 30 aluminium oxide, aluminium nitride;
But but but the metal material of described weld metal first basal plane 11 weld metals second basal plane 12 weld metals the 3rd basal plane 21 comprises gold, silver, copper, nickel;
The material of described metal heat sink 2 comprises aluminium alloy, steel, copper, high heat-conducting ceramic.
The LED wick sheet 4 of preparation more than one on the described insulating heat-conductive plate 1.
But can also be with high hot elargol between LED wick sheet 4 and weld metal first basal plane 11
Bonding mode realizes connecting.
As shown in Figure 1 and Figure 2, a kind of method of LED high heat conductive insulating pedestal encapsulation, its second execution mode comprises the steps:
1., insulating heat-conductive plate 1 of preparation, at the upper surface of described insulating heat-conductive plate 1,, but adopt plating or sintering process to make one deck weld metal first basal plane 11 at the predeterminated position of design in advance; At the lower surface of described insulating heat-conductive plate 1, but adopt plating or sintering process to make one deck weld metal second basal plane 12;
But it is but insulated from each other between described weld metal first basal plane 11 and weld metal second basal plane 12;
2., preparation one metal heat sink 2, but make one deck weld metal the 3rd basal plane 21 at the end face of described metal heat sink 2, this basal plane can carry out soldering or metal connects;
But 3., then on weld metal the 3rd basal plane 21 of metal heat sink 2
The coated with high temperature tin cream, its fusing point 〉=250 ℃, but again weld metal second basal plane 12 of insulating heat-conductive plate 1 is placed on the high temperature tin cream, closely contact together is heated to above 250 ℃, and they are welded together;
But the weld metal first that 4., default circuit is arranged on insulating heat-conductive plate 1 then
Apply the low temperature tin cream on basal plane 11 predeterminated positions, 180 ℃～249 ℃ of its fusion temperatures,
Metal covering with LED wick sheet 4 is placed on the low temperature tin cream then, together be heated to the fusion temperature of tin cream then, they are welded together, and then but Herba Anoectochili roxburghii is welded on the circuit on weld metal first basal plane 11 on LED wick sheet 4 electrodes and the insulating heat-conductive plate 1, or Herba Anoectochili roxburghii is welded on the current path that forms the LED lamp on the electrode of adjacent LED wick sheet 4, on the chip of insulation board, apply fluorescent material more at last.
As shown in Figure 1 and Figure 2, with a kind of LED high heat conductive insulating pedestal packaged device that said method is made, described device comprises:
Insulating heat-conductive plate 1;
But it is but insulated from each other between described weld metal first basal plane 11 and weld metal second basal plane 12;
But the end face of described metal heat sink 2 has one deck weld metal the 3rd basal plane 21;
But but described weld metal the 3rd basal plane 21 and weld metal second basal plane 12
Between welding or metal connect, described insulating heat-conductive plate 1 is linked into an integrated entity with described metal heat sink 2;
But described LED wick sheet 4 is welded on weld metal first basal plane 11.
The structure of described insulating heat-conductive plate 1 is included in conductive coefficient and is higher than 30 highly heat-conductive carbon/ceramic
But but the thin layer of the two sides of porcelain thin slice preparation weld metal first basal plane 11 and weld metal second basal plane 12.
The LED wick sheet 4 of preparation more than one on the described insulating heat-conductive plate 1.
But can realize being connected with the bonding mode of high hot elargol between LED wick sheet 4 and weld metal first basal plane 11.
The present invention can make the workpiece of many LED wicks of large tracts of land sheet 4, cuts then, is divided into little unit.
But the present invention can utilize prior aries such as plating, soldering, sintering, sputter to realize adhering to of weld metal basal plane, and the material that described insulating heat-conductive plate 1 can be selected for use is more, does not exemplify one by one at this.
The present invention can freely choose the size of pedestal according to actual needs, because the material of pedestal is full of near the space the LED wick sheet, when the present invention works, the heat that LED wick sheet produces, with the highest heat exchange pattern of heat transfer efficiency, conduct fast by described insulating heat-conductive plate and radiator.
The present invention has satisfactorily resolved the anti-puncture technical problem of LED light fixture.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (9)
1. the method for a LED high heat conductive insulating pedestal encapsulation is characterized in that described method comprises the steps:
1., a preparation insulating heat-conductive plate (1), at the upper surface of described insulating heat-conductive plate (1),, but adopt plating or sintering process to make one deck weld metal first basal plane (11) at the predeterminated position of design in advance; At the lower surface of described insulating heat-conductive plate (1), but adopt plating or sintering process to make one deck weld metal second basal plane (12);
But described weld metal first basal plane (11) but and insulated from each other between weld metal second basal plane (12);
2., preparation one metal heat sink (2), at described metal heat sink (2) but end face make one deck weld metal the 3rd basal plane (21), this basal plane can carry out soldering or metal connects;
3., at insulating heat-conductive plate (1) but weld metal first basal plane (11) predeterminated position on the coated with high temperature tin cream, this high temperature tin cream fusion temperature 〉=250 ℃, the bottom that then LED wick sheet (4) is coated with metal level is placed on the high temperature tin cream, and closely contact; Again insulating heat-conductive plate (1) and LED wick sheet (4) together are heated to more than 250 ℃, LED wick sheet (4) and insulating heat-conductive plate (1) are welded together; Then Herba Anoectochili roxburghii is welded on LED wick sheet (4) electrode and insulating heat-conductive plate (1) but on weld metal first basal plane (11) on circuit on, or Herba Anoectochili roxburghii is welded on the current path that forms the LED lamp on the electrode of adjacent LED wick sheet (4); To be coated in the fluorescent material that glue mixes then on the LED wick sheet (4), form a complete LED encapsulation;
4., then at described metal heat sink (2) but weld metal the 3rd basal plane (21) on, apply the eutectic welding tin cream, 180 ℃～249 ℃ of its fusion temperatures, then with the insulating heat-conductive plate (1) in the described LED encapsulation but weld metal second basal plane (12) closely contact with described eutectic welding tin cream, they are heated to the fusion temperature of eutectic welding tin cream jointly, make described insulating heat-conductive plate (1) and described metal heat sink (2) integrally welded.
2. the method for LED high heat conductive insulating pedestal encapsulation according to claim 1 is characterized in that:
The 1. described insulating heat-conductive plate of step (1) is made of high heat-conducting ceramic, and described high heat-conducting ceramic comprises that conductive coefficient is higher than 30 aluminium oxide, aluminium nitride;
But described weld metal first basal plane (11) but weld metal second basal plane (12) but the metal material of weld metal the 3rd basal plane (21) comprises gold, silver, copper, nickel;
The material of described metal heat sink (2) comprises aluminium alloy, steel, copper, high heat-conducting ceramic.
3. the method for LED high heat conductive insulating pedestal encapsulation according to claim 1 is characterized in that:
The LED wick sheet (4) of preparation more than one on the described insulating heat-conductive plate (1).
4. the method for LED high heat conductive insulating pedestal encapsulation according to claim 1 is characterized in that:
LED wick sheet (4) but with weld metal first basal plane (11) between realize being connected with the bonding mode of high hot elargol.
5. the method for a LED high heat conductive insulating pedestal encapsulation is characterized in that described method comprises the steps:
1., a preparation insulating heat-conductive plate (1), at the upper surface of described insulating heat-conductive plate (1),, but adopt plating or sintering process to make one deck weld metal first basal plane (11) at the predeterminated position of design in advance; At the lower surface of described insulating heat-conductive plate (1), but adopt plating or sintering process to make one deck weld metal second basal plane (12);
But described weld metal first basal plane (11) but and insulated from each other between weld metal second basal plane (12);
2., preparation one metal heat sink (2), at described metal heat sink (2) but end face make one deck weld metal the 3rd basal plane (21), this basal plane can carry out soldering or metal connects;
3., then at metal heat sink (2) but weld metal the 3rd basal plane (21) go up the coated with high temperature tin cream, its fusing point 〉=250 ℃, again with insulating heat-conductive plate (1) but weld metal second basal plane (12) be placed on the high temperature tin cream, closely contact, together be heated to above 250 ℃, they are welded together;
4., then at insulating heat-conductive plate (1) but on weld metal first basal plane (11) predeterminated position on apply the low temperature tin cream, 180 ℃～249 ℃ of its fusion temperatures, metal covering with LED wick sheet (4) is placed on the low temperature tin cream then, together be heated to the fusion temperature of tin cream then, they are welded together, and then Herba Anoectochili roxburghii is welded on LED wick sheet (4) electrode and insulating heat-conductive plate (1) but on weld metal first basal plane (11) on circuit on, or Herba Anoectochili roxburghii is welded on the current path that forms the LED lamp on the electrode of adjacent LED wick sheet (4), on the chip of insulation board, apply fluorescent material more at last.
6. LED high heat conductive insulating pedestal packaged device is characterized in that described device comprises:
Insulating heat-conductive plate (1);
Metal heat sink (2);
LED wick sheet (4); Described insulating heat-conductive plate (1) but upper surface one deck weld metal first basal plane (11) of having plating adopted or sintering process to make; At the lower surface of described insulating heat-conductive plate (1), but one deck weld metal second basal plane (12) that has plating adopted or sintering process to make;
But described weld metal first basal plane (11) but and insulated from each other between weld metal second basal plane (12);
Described metal heat sink (2) but end face one deck weld metal the 3rd basal plane (21) is arranged;
But described weld metal the 3rd basal plane (21) but with weld metal second basal plane (12) between welding or metal is connected, described insulating heat-conductive plate (1) and described metal heat sink (2) are linked into an integrated entity;
Described LED wick sheet (4) but be welded on weld metal first basal plane (11).
7. LED high heat conductive insulating pedestal packaged device according to claim 6 is characterized in that: described insulating heat-conductive plate (1) but structure be included in conductive coefficient be higher than 30 high heat-conducting ceramic thin slice two sides preparation weld metal first basal plane (11) but and the thin layer of weld metal second basal plane (12).
8. LED high heat conductive insulating pedestal packaged device according to claim 6 is characterized in that: the LED wick sheet (4) of preparation more than one on the described insulating heat-conductive plate (1).
9. LED high heat conductive insulating pedestal packaged device according to claim 6 is characterized in that:
LED wick sheet (4) but with weld metal first basal plane (11) between realize being connected with the bonding mode of high hot elargol.
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| CN2011101184865A CN102208498A (en) | 2011-05-09 | 2011-05-09 | Method and device for packaging light-emitting diode (LED) high-heat-conduction insulated base |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103648253A (en) * | 2013-11-21 | 2014-03-19 | 苏州市莱赛电车技术有限公司 | Novel thermally conductive and insulating structure |
| CN104051377A (en) * | 2013-03-14 | 2014-09-17 | 通用电气公司 | Power Overlay Structure And Method Of Making Same |
| WO2014166113A1 (en) * | 2013-04-12 | 2014-10-16 | 深圳市银盾科技开发有限公司 | Highly heat-conductive led welding method |
| CN104124323B (en) * | 2014-07-14 | 2017-07-11 | 华南师范大学 | A kind of high-power LED encapsulation structure and its manufacture method |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201242129Y (en) * | 2008-08-11 | 2009-05-20 | 陈鸿文 | High power LED lamp |
| CN101576238A (en) * | 2008-09-02 | 2009-11-11 | 陈立有 | Method and equipment for welding LED lamp bead |
| CN101702424A (en) * | 2009-10-23 | 2010-05-05 | 广东昭信光电科技有限公司 | LED encapsulation structure with functions of integrated light distribution and heat dissipation |
| CN101719490A (en) * | 2009-10-23 | 2010-06-02 | 广东昭信光电科技有限公司 | Multifunctional LED encapsulating structure |
| CN101776248A (en) * | 2009-01-09 | 2010-07-14 | 台达电子工业股份有限公司 | Lamp and lighting device thereof |
| US20100288537A1 (en) * | 2009-05-15 | 2010-11-18 | High Conduction Scientific Co., Ltd. | Circuit board module and method of making the same |
-
2011
- 2011-05-09 CN CN2011101184865A patent/CN102208498A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201242129Y (en) * | 2008-08-11 | 2009-05-20 | 陈鸿文 | High power LED lamp |
| CN101576238A (en) * | 2008-09-02 | 2009-11-11 | 陈立有 | Method and equipment for welding LED lamp bead |
| CN101776248A (en) * | 2009-01-09 | 2010-07-14 | 台达电子工业股份有限公司 | Lamp and lighting device thereof |
| US20100288537A1 (en) * | 2009-05-15 | 2010-11-18 | High Conduction Scientific Co., Ltd. | Circuit board module and method of making the same |
| CN101702424A (en) * | 2009-10-23 | 2010-05-05 | 广东昭信光电科技有限公司 | LED encapsulation structure with functions of integrated light distribution and heat dissipation |
| CN101719490A (en) * | 2009-10-23 | 2010-06-02 | 广东昭信光电科技有限公司 | Multifunctional LED encapsulating structure |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051377A (en) * | 2013-03-14 | 2014-09-17 | 通用电气公司 | Power Overlay Structure And Method Of Making Same |
| CN104051377B (en) * | 2013-03-14 | 2020-02-21 | 通用电气公司 | Power covering structure and manufacturing method thereof |
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| CN103648253A (en) * | 2013-11-21 | 2014-03-19 | 苏州市莱赛电车技术有限公司 | Novel thermally conductive and insulating structure |
| CN103648253B (en) * | 2013-11-21 | 2016-01-20 | 苏州市莱赛电车技术有限公司 | A kind of Novel heat-conducting insulation system |
| CN104124323B (en) * | 2014-07-14 | 2017-07-11 | 华南师范大学 | A kind of high-power LED encapsulation structure and its manufacture method |
| US10490478B2 (en) | 2016-07-12 | 2019-11-26 | Industrial Technology Research Institute | Chip packaging and composite system board |
| CN107508026A (en) * | 2017-07-24 | 2017-12-22 | 张家港保税区灿勤科技有限公司 | The silver paste welding procedure of wave filter |
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Application publication date: 20111005 |