CN204094284U - Reflow soldering air channel - Google Patents
Reflow soldering air channel Download PDFInfo
- Publication number
- CN204094284U CN204094284U CN201420522697.4U CN201420522697U CN204094284U CN 204094284 U CN204094284 U CN 204094284U CN 201420522697 U CN201420522697 U CN 201420522697U CN 204094284 U CN204094284 U CN 204094284U
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- CN
- China
- Prior art keywords
- reflow soldering
- air
- air channel
- eddy current
- cavity
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Abstract
The utility model discloses a kind of Reflow Soldering air channel, comprise the cavity be located in reflow soldering, the bottom in described Reflow Soldering air channel is provided with the first exhausting plate, described first exhausting plate is evenly provided with multiple discharge pipe, the outer both sides of described cavity are also provided with the back cavity being positioned at reflow soldering, be provided with eddy current air-supply arrangement in described cavity, described eddy current air-supply arrangement top is connected with air supply motor, is provided with kuppe bottom described eddy current air-supply arrangement.Reflow Soldering air channel of the present utility model, blown by eddy current air-supply arrangement, hot air circulation can be made even, and by adding the setting of kuppe bottom eddy current air-supply arrangement, hot air circulation can be made more even, thus reduce the generation of rosin joint, make welding effect better, hot blast utilizes high, reduces costs.
Description
Technical field
The utility model relates to a kind of air channel, is specifically related to a kind of Reflow Soldering air channel.
Background technology
In board production process, each surface mount elements adopts surface mounting technology to carry out paster assembling.First it be that solder(ing) paste is scraped in the pin hole that utilizes printing machine on-pcb board and welding position; And then with chip mounter, paster switching is overwhelmed on the corresponding welding position of PCB and fits with solder(ing) paste; Last feeding in solder reflow device by the pcb board posting element is again welded, Reflow Soldering arranges the Inner eycle heating system adopting and be divided into multiple warm area, because solder(ing) paste adopts various material to form, the difference of temperature will cause the change of solder(ing) paste state, when high-temperature region, solder(ing) paste is fused into liquid, and surface mount elements easily combines with solder(ing) paste; Enter cooling warm area after, solder(ing) paste is frozen into solid-state, just by the pin of surface mount elements and pcb board welded firmly.
In existing solder reflow device, the air channel structure of Reflow Soldering is that hot blast is directly sent by hot blast motor, causes hot blast uneven, easily produces rosin joint after welding, thus on pcb board everywhere solder joint quality can not stablize.
Summary of the invention
For solving the problems of the technologies described above, the purpose of this utility model is to provide a kind of Reflow Soldering air channel, thus can hot air circulation even, thus reduce the generation of rosin joint, welding effect is good, and hot blast utilizes high, reduces costs.
For achieving the above object, the technical solution of the utility model is as follows:
The utility model provides a kind of Reflow Soldering air channel, comprise the cavity be located in reflow soldering, the bottom in described Reflow Soldering air channel is provided with the first exhausting plate, described first exhausting plate is evenly provided with multiple discharge pipe, the outer both sides of described cavity are also provided with the back cavity being positioned at reflow soldering, be provided with eddy current air-supply arrangement in described cavity, described eddy current air-supply arrangement top is connected with air supply motor, is provided with kuppe bottom described eddy current air-supply arrangement.
Reflow Soldering air channel of the present utility model, blown by eddy current air-supply arrangement, hot air circulation can be made even, and by adding the setting of kuppe bottom eddy current air-supply arrangement, hot air circulation can be made more even, thus reduce the generation of rosin joint, make welding effect better, hot blast utilizes high, reduces costs.
On the basis of technique scheme, the utility model also can make following improvement:
As preferred scheme, the outer surface of described cavity bottom is that arc-shaped is arranged.
Adopt above-mentioned preferred scheme, adopt cavity bottom to be the setting that circular arc fills, the heat loss that heat radiation causes can be reduced, improve the utilization rate of hot blast, reduce costs.
As preferred scheme, described kuppe both sides are also evenly provided with multiple mozzle.
Adopt above-mentioned preferred scheme, the setting of mozzle can make hot blast more easily be transported to from down on pcb board, improves hot blast utilization rate, reduces costs, and make whole hot air circulation more even.
As preferred scheme, opening and the horizontal plane of described mozzle acutangulate.
Adopt above-mentioned preferred scheme, hot blast can be made more easily to be transported on pcb board from down.
As preferred scheme, the cross section of described kuppe is trapezoidal.
Adopt above-mentioned preferred scheme, the interface of kuppe is trapezoidal setting, and hot blast can be made more uniformly to be distributed in whole cavity.
As preferred scheme, be also provided with the second exhausting plate in parallel under described first exhausting plate, described discharge pipe passes the second exhausting plate, and on described second exhausting plate, the both sides of each discharge pipe are equipped with return air inlet.
Adopt above-mentioned preferred scheme, by increasing exhausting plate, and the both sides of each discharge pipe are equipped with the design of return air inlet on exhausting plate, each discharge pipe and return air inlet form a microcirculation, make hot air circulation more abundant, distribute more even, improve the uniformity of conduction, make welding effect better.
As preferred scheme, in described back cavity, be also provided with heater.
Adopt above-mentioned preferred scheme, the design of heater is set in back cavity, hot blast can be made to conduct more even, improve the utilization ratio of hot blast, make the gas flow temperature that is sprayed on pcb board more even, make welding effect better, the quality of raising pcb board.
Accompanying drawing explanation
Fig. 1 is the structural representation in Reflow Soldering air channel described in the utility model;
Fig. 2 is the upward view in Reflow Soldering air channel described in the utility model;
Fig. 3 Reflow Soldering air channel described in the utility model is installed in reflow soldering carries out welded structure schematic diagram;
Wherein:
1. Reflow Soldering air channel, 2. reflow soldering, 3. cavity, 4. back cavity, 5. eddy current air-supply arrangement, 6. air supply motor, 7. kuppe, 8. mozzle, 9. the first exhausting plate, 10. discharge pipe, 11. second exhausting plates, 12. return air inlets, 13. heaters, 14 is pcb board.
Detailed description of the invention
Preferred embodiment of the present utility model is described in detail below in conjunction with accompanying drawing.
In order to reach the purpose of this utility model, in embodiments more of the present utility model,
As shown in Figures 1 to 3, Reflow Soldering air channel 1 described in the utility model, comprise the cavity 3 be located in reflow soldering 2, the bottom in described Reflow Soldering air channel 1 is provided with the first exhausting plate 9, described first exhausting plate 9 is evenly provided with multiple discharge pipe 10, and the described outer both sides of cavity 3 are also provided with the back cavity 4 being positioned at reflow soldering 2, are provided with eddy current air-supply arrangement 5 in described cavity 3, described eddy current air-supply arrangement 5 top is connected with air supply motor 6, is provided with kuppe 7 bottom described eddy current air-supply arrangement 5.Blown by eddy current air-supply arrangement, hot air circulation can be made even, and by adding the setting of kuppe bottom eddy current air-supply arrangement, hot air circulation can be made more even, thus reduce the generation of rosin joint, make welding effect better, hot blast utilizes high, reduces costs.
In order to optimize implementation result of the present utility model further, the outer surface of described cavity 3 bottom is that arc-shaped is arranged.Employing cavity bottom is the setting of arc-shaped, can reduce the heat loss that heat radiation causes, and improves the utilization rate of hot blast, reduces costs.
In order to optimize implementation result of the present utility model further, described kuppe 7 both sides are also evenly provided with multiple mozzle 8.The setting of this mozzle can make hot blast more easily be transported to from down on pcb board, improves hot blast utilization rate, reduces costs, and make whole hot air circulation more even.
In order to optimize implementation result of the present utility model further, opening and the horizontal plane of described mozzle 8 acutangulate.This design can make hot blast more easily be transported on pcb board from down.
In order to optimize implementation result of the present utility model further, the cross section of described kuppe 7 is trapezoidal.The interface adopting kuppe is trapezoidal setting, and hot blast can be made more uniformly to be distributed in whole cavity.
In order to optimize implementation result of the present utility model further, described first exhausting plate is also provided with the second exhausting plate 11 in parallel for 9 times, described discharge pipe 10 passes the second exhausting plate 11, and on described second exhausting plate 11, the both sides of each discharge pipe 10 are equipped with return air inlet 12.By increasing exhausting plate, and the both sides of each discharge pipe are equipped with the design of return air inlet on exhausting plate, and each discharge pipe and return air inlet form a microcirculation, make hot air circulation more abundant, distribute more even, improve the uniformity of conduction, make welding effect better.
In order to optimize implementation result of the present utility model further, in described back cavity 4, be also provided with heater 13.Adopt in back cavity the design that heater is set, hot blast can be made to conduct more even, improve the utilization ratio of hot blast, make the gas flow temperature that is sprayed on pcb board more even, make welding effect better, the quality of raising pcb board.
As shown in Figure 3, the course of work is specially, under the drive of air supply motor 6, hot blast blows out from eddy current air-supply arrangement 5, discharge pipe 10 is evenly entered from the first exhausting plate 9 by kuppe 7, evenly blow out from discharge pipe 10 through the second exhausting plate 11 again, then be sprayed on pcb board 14 through bounce-back, enter in back cavity 4 by return air inlet 12, again reheated by heater 13, hot blast after heating enters in eddy current air-supply arrangement 5 again, thus form a constant temperature system, and then blow out from eddy current air-supply arrangement 5 under the effect of air supply motor 6, be sprayed onto on pcb board 14 by abovementioned steps again, iterative cycles, thus hot blast conduction is more even, and improve utilization rate, make the problem of faulty soldering of minimizing pcb board, make welding effect better.
Above-described is only preferred embodiment of the present utility model; it should be pointed out that for the person of ordinary skill of the art, under the prerequisite not departing from the utility model creation design; can also make some distortion and improvement, these all belong to protection domain of the present utility model.
Claims (7)
1. a Reflow Soldering air channel, comprise the cavity be located in reflow soldering, it is characterized in that, the bottom in described Reflow Soldering air channel is provided with the first exhausting plate, described first exhausting plate is evenly provided with multiple discharge pipe, and the outer both sides of described cavity are also provided with the back cavity being positioned at reflow soldering, are provided with eddy current air-supply arrangement in described cavity, described eddy current air-supply arrangement top is connected with air supply motor, is provided with kuppe bottom described eddy current air-supply arrangement.
2. Reflow Soldering air channel according to claim 1, is characterized in that, the outer surface of described cavity bottom is that arc-shaped is arranged.
3. Reflow Soldering air channel according to claim 2, is characterized in that, described kuppe both sides are also evenly provided with multiple mozzle.
4. Reflow Soldering air channel according to claim 3, is characterized in that, opening and the horizontal plane of described mozzle acutangulate.
5. Reflow Soldering air channel according to any one of claim 1 to 4, is characterized in that, the cross section of described kuppe is trapezoidal.
6. Reflow Soldering air channel according to any one of claim 1 to 4, it is characterized in that, also be provided with the second exhausting plate in parallel under described first exhausting plate, described discharge pipe passes the second exhausting plate, and on described second exhausting plate, the both sides of each discharge pipe are equipped with return air inlet.
7. Reflow Soldering air channel according to any one of claim 1 to 4, is characterized in that, is also provided with heater in described back cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420522697.4U CN204094284U (en) | 2014-09-12 | 2014-09-12 | Reflow soldering air channel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420522697.4U CN204094284U (en) | 2014-09-12 | 2014-09-12 | Reflow soldering air channel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204094284U true CN204094284U (en) | 2015-01-14 |
Family
ID=52262753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420522697.4U Expired - Fee Related CN204094284U (en) | 2014-09-12 | 2014-09-12 | Reflow soldering air channel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204094284U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111408807A (en) * | 2020-04-10 | 2020-07-14 | 张书香 | Small-size reflow soldering machine of environmental protection |
-
2014
- 2014-09-12 CN CN201420522697.4U patent/CN204094284U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111408807A (en) * | 2020-04-10 | 2020-07-14 | 张书香 | Small-size reflow soldering machine of environmental protection |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150114 Termination date: 20190912 |