CN204589010U - Semiconductor refrigeration member welding machine - Google Patents
Semiconductor refrigeration member welding machine Download PDFInfo
- Publication number
- CN204589010U CN204589010U CN201520287095.XU CN201520287095U CN204589010U CN 204589010 U CN204589010 U CN 204589010U CN 201520287095 U CN201520287095 U CN 201520287095U CN 204589010 U CN204589010 U CN 204589010U
- Authority
- CN
- China
- Prior art keywords
- temperature adjustment
- welding
- adjustment plate
- welding joint
- liquid case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
Abstract
The utility model relates to the equipment of cooling component production technical field, title is semiconductor refrigeration member welding machine, comprise frame, frame has cylinder and welding liner plate, welding joint is connected with below cylinder, welding liner plate there is lower welding joint, inside described upper welding joint and lower welding joint, heater strip is installed, heater strip connection control device, it also includes two temperature adjustment plates, upper temperature adjustment plate and lower temperature adjustment plate respectively, upper temperature adjustment plate is arranged on below welding joint, lower temperature adjustment plate is arranged on above lower welding joint, described temperature adjustment plate interiors has pipeline, pipeline is communicated with high-temperature liquid case and Low Temperature Liquid case through e Foerderanlage, e Foerderanlage connection control device, have and cooling component can be made to reduce temperature at short notice, and keep there is a firm process under pressure, to improve the advantage of welding quality, reach minimizing energy dissipation simultaneously, ensure the effect of production efficiency.
Description
Technical field
The utility model relates to the equipment of cooling component production technical field, particularly relates to cooling component welding machine.
Background technology
Cooling component is made up of porcelain plate and the multiple crystal grain be welded on porcelain plate, and cooling component is middle is crystal grain, both sides are porcelain plates, and the quality that crystal grain welds on porcelain plate is directly connected to the quality of cooling component.
Be cooling component welding machine by crystal particle welding on porcelain plate, such welding machine has frame, and frame has the welding joint that cylinder links, and described welding joint has heating unit; The process of welding is such: the parts that will weld are placed on below welding joint, and welding joint at high temperature presses down porcelain plate and crystal grain, can complete the welding to cooling component.
Use such welding machine, after cooling component welds, if welding joint departs from cooling component at a higher temperature, make cooling component be in freely stress-free state, will welding quality be affected; If Deng welding joint reduce certain temperature after move apart cooling component again, then because welding joint has larger thermal capacity, there is the shortcoming of difficulty, the production efficiency that wastes energy, affects of again heating up.
Make the good cooling component of welding at short notice reducing temperature and having a firm process under keeping certain pressure, be the effective measure improving cooling component welding quality, meanwhile, reduce energy dissipation, ensure the pursuit of production efficiency Ye Shi producer.
Summary of the invention
The purpose of this utility model is exactly for above-mentioned shortcoming, there is provided a kind of cooling component can be made to reduce temperature at short notice and keep cooling component under pressure to have a firm process, to improve the semiconductor refrigeration member welding machine of welding quality, reach the effect reducing energy dissipation, ensure production efficiency simultaneously.
The technical solution of the utility model is achieved in that semiconductor refrigeration member welding machine, comprise frame, frame has cylinder and welding liner plate, welding joint is connected with below cylinder, welding liner plate there is lower welding joint, it is the station of welding between upper welding joint and lower welding joint, inside described upper welding joint and lower welding joint, heater strip is installed, heater strip connection control device, it is characterized in that: further comprising and have two temperature adjustment plates, temperature adjustment plate is copper, upper temperature adjustment plate and lower temperature adjustment plate respectively, upper temperature adjustment plate is arranged on below welding joint, lower temperature adjustment plate is arranged on above lower welding joint, described temperature adjustment plate interiors has pipeline, pipeline is communicated with high-temperature liquid case and Low Temperature Liquid case through e Foerderanlage, e Foerderanlage connection control device.
Say further, the pipeline on described temperature adjustment plate is the subtube of many, and subtube is set in parallel in temperature adjustment plate, and every root subtube two ends connect high-temperature liquid case and Low Temperature Liquid case through e Foerderanlage respectively.
Say further, described upper temperature adjustment plate has larger area than upper welding joint, and described lower temperature adjustment plate has larger area than lower welding joint.
The beneficial effects of the utility model are: such welding machine has can be made cooling component reduce temperature at short notice and keep there is a firm process under pressure, to improve the advantage of welding quality, reach the effect reducing energy dissipation, ensure production efficiency simultaneously.
Pipeline on described temperature adjustment plate is the subtube of many, subtube is set in parallel in temperature adjustment plate, every root subtube two ends connect high-temperature liquid case and Low Temperature Liquid case through e Foerderanlage respectively, and balanced advantage of lowering the temperature everywhere when having refrigerating sheet cooling, ensure that quality product; Described upper temperature adjustment plate has larger area than upper welding joint, and described lower temperature adjustment plate has larger area than lower welding joint, has temperature adjustment advantage more rapidly, more can ensure quality product.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation of subtube of many that temperature adjustment plate distributes.
Wherein: 1, frame 2, cylinder 3, welding liner plate 4, upper welding joint 5, lower welding joint 6, station 7, heater strip 8, upper temperature adjustment plate 9, lower temperature adjustment plate 10, pipeline 11, e Foerderanlage 12, high-temperature liquid case 13, Low Temperature Liquid case 14, subtube.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail.
As shown in Figure 1, semiconductor refrigeration member welding machine, comprise frame 1, frame has cylinder 2 and welding liner plate 3, welding joint 4 is connected with below cylinder, welding liner plate there is lower welding joint 5, it is the station 6 of welding between upper welding joint and lower welding joint, inside described upper welding joint and lower welding joint, heater strip 7 is installed, heater strip connection control device, it is characterized in that: further comprising and have two temperature adjustment plates, temperature adjustment plate is copper, upper temperature adjustment plate 8 and lower temperature adjustment plate 9 respectively, upper temperature adjustment plate 8 is arranged on below welding joint, lower temperature adjustment plate 9 is arranged on above lower welding joint, described temperature adjustment plate interiors has pipeline 10, pipeline is communicated with high-temperature liquid case 12 and Low Temperature Liquid case 13 through e Foerderanlage 11, e Foerderanlage connection control device.The utility model is after cooling component welds, heater strip stops heating under control of the control means, the pressure that cylinder keeps down, start e Foerderanlage, Low Temperature Liquid case is to the pipeline input Low Temperature Liquid of temperature adjustment plate interiors, high-temperature liquid accepted by high-temperature liquid case, realize the fast cooling of temperature adjustment plate, due to the effect of cylinder 2, product is made at this moment to bear certain pressure, product is just lowered the temperature under stress, there is effect of the present utility model, in pipeline, the high-quality conductive fluid of flowing can realize changing to the firm suitable temp of cooling component low temperature in 3 seconds, there is higher production efficiency, on the contrary, during welding product, to the pipeline input high-temperature liquid of temperature adjustment plate interiors, Low Temperature Liquid accepted by Low Temperature Liquid case, start heater strip simultaneously, realize being rapidly heated of temperature adjustment plate and upper welding joint and lower welding joint, in pipeline, the high-quality conductive fluid of flowing can realize the suitable temp changing to cooling component welding in 3 seconds.
Say further, as shown in Figure 2, the pipeline on described temperature adjustment plate is the subtube 14 of many, and subtube is set in parallel in temperature adjustment plate, and every root is in charge of stage property two ends and is connected high-temperature liquid case and Low Temperature Liquid case through e Foerderanlage respectively.Like this because multiple subtube is even respectively, there is cooling component homogeneous temperature everywhere, ensure the advantage of quality product.
Described upper temperature adjustment plate has larger area than upper welding joint, and described lower temperature adjustment plate has larger area than lower welding joint, has temperature adjustment advantage more rapidly, more can ensure quality product.
The foregoing is only specific embodiment of the utility model, but constitutional features of the present utility model is not limited to this, any those skilled in the art is in field of the present utility model, and the change done or modification are all encompassed in the scope of the claims of the present utility model.
Claims (3)
1. semiconductor refrigeration member welding machine, comprise frame, frame has cylinder and welding liner plate, welding joint is connected with below cylinder, welding liner plate there is lower welding joint, it is the station of welding between upper welding joint and lower welding joint, inside described upper welding joint and lower welding joint, heater strip is installed, heater strip connection control device, it is characterized in that: further comprising and have two temperature adjustment plates, temperature adjustment plate is copper, upper temperature adjustment plate and lower temperature adjustment plate respectively, upper temperature adjustment plate is arranged on below welding joint, lower temperature adjustment plate is arranged on above lower welding joint, described temperature adjustment plate interiors has pipeline, pipeline is communicated with high-temperature liquid case and Low Temperature Liquid case through e Foerderanlage, e Foerderanlage connection control device.
2. semiconductor refrigeration member welding machine according to claim 1, it is characterized in that: the pipeline on described temperature adjustment plate is the subtube of many, subtube is set in parallel in temperature adjustment plate, and every root is in charge of stage property two ends and is connected high-temperature liquid case and Low Temperature Liquid case through e Foerderanlage respectively.
3. semiconductor refrigeration member welding machine according to claim 1 and 2, is characterized in that: described upper temperature adjustment plate has larger area than upper welding joint, and described lower temperature adjustment plate has larger area than lower welding joint.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520287095.XU CN204589010U (en) | 2015-05-07 | 2015-05-07 | Semiconductor refrigeration member welding machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520287095.XU CN204589010U (en) | 2015-05-07 | 2015-05-07 | Semiconductor refrigeration member welding machine |
Publications (1)
Publication Number | Publication Date |
---|---|
CN204589010U true CN204589010U (en) | 2015-08-26 |
Family
ID=53925185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201520287095.XU Withdrawn - After Issue CN204589010U (en) | 2015-05-07 | 2015-05-07 | Semiconductor refrigeration member welding machine |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN204589010U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104844248A (en) * | 2015-05-07 | 2015-08-19 | 河南鸿昌电子有限公司 | Semiconductor refrigerating member welding machine |
CN109483001A (en) * | 2018-12-28 | 2019-03-19 | 湖北赛格瑞新能源科技有限公司 | A kind of welding equipment and welding method for micro thermoelectric device |
CN112077472A (en) * | 2020-08-17 | 2020-12-15 | 国为(南京)软件科技有限公司 | Semiconductor refrigeration piece welding set |
-
2015
- 2015-05-07 CN CN201520287095.XU patent/CN204589010U/en not_active Withdrawn - After Issue
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104844248A (en) * | 2015-05-07 | 2015-08-19 | 河南鸿昌电子有限公司 | Semiconductor refrigerating member welding machine |
CN104844248B (en) * | 2015-05-07 | 2017-05-24 | 河南鸿昌电子有限公司 | Semiconductor refrigerating member welding machine |
CN109483001A (en) * | 2018-12-28 | 2019-03-19 | 湖北赛格瑞新能源科技有限公司 | A kind of welding equipment and welding method for micro thermoelectric device |
CN112077472A (en) * | 2020-08-17 | 2020-12-15 | 国为(南京)软件科技有限公司 | Semiconductor refrigeration piece welding set |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN204589010U (en) | Semiconductor refrigeration member welding machine | |
CN104844248A (en) | Semiconductor refrigerating member welding machine | |
CN104183666A (en) | Crystalline silicon solar cell connection method via laser welding | |
CN203401212U (en) | Pulse current auxiliary titanium alloy partial high temperature diffusion bonding device | |
CN108262554A (en) | A kind of welding machine and its welding procedure for being used to weld multilayer aluminium sheet | |
CN204272577U (en) | A kind of two-way laminating cooled plate | |
CN104801872A (en) | Semiconductor refrigeration piece welding machine | |
CN103624393B (en) | The hot self-pressure method of attachment of rigid restraint | |
CN204565437U (en) | A kind of semiconductor refrigeration member bonding machine | |
CN204039546U (en) | The heating unit of Large Copacity polycrystalline silicon ingot or purifying furnace | |
CN204397118U (en) | Reflow soldering apparatus | |
CN204589008U (en) | Samming cooling component welding machine | |
CN104289837A (en) | Long weld cooler | |
CN204644192U (en) | A kind of samming cooling component welding machine | |
CN203471141U (en) | Friction stir welding tool with rapid cooling device | |
CN205437420U (en) | Cold and hot integral type microscope carrier of can equilibrium cooling | |
CN203887364U (en) | Manual welding mold with temperature control device | |
CN102886581B (en) | A kind of solderer | |
CN204361129U (en) | A kind of electrothermal module of non-equidistant arrangement | |
CN102128519A (en) | Semiconductor heating and refrigerating device | |
CN202216324U (en) | Oil-filled thin plate electric oil heater | |
CN201109495Y (en) | Heating plate for welding transfusion soft bag interface and combined sealing cover | |
CN100480139C (en) | Heating plate device for soldering transfusion flexible bag interface and combined sealed cap | |
CN204094284U (en) | Reflow soldering air channel | |
CN205835992U (en) | A kind of contact magnetic door seal bonding machine |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
AV01 | Patent right actively abandoned |
Granted publication date: 20150826 Effective date of abandoning: 20170524 |
|
AV01 | Patent right actively abandoned |