CN204589010U - Semiconductor refrigeration member welding machine - Google Patents

Semiconductor refrigeration member welding machine Download PDF

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Publication number
CN204589010U
CN204589010U CN201520287095.XU CN201520287095U CN204589010U CN 204589010 U CN204589010 U CN 204589010U CN 201520287095 U CN201520287095 U CN 201520287095U CN 204589010 U CN204589010 U CN 204589010U
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CN
China
Prior art keywords
temperature adjustment
welding
adjustment plate
welding joint
liquid case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn - After Issue
Application number
CN201520287095.XU
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Chinese (zh)
Inventor
陈磊
刘栓红
赵丽萍
张文涛
蔡水占
郭晶晶
张会超
陈永平
王东胜
惠小青
辛世明
田红丽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henan Hongchang Electronics Co Ltd
Original Assignee
Henan Hongchang Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henan Hongchang Electronics Co Ltd filed Critical Henan Hongchang Electronics Co Ltd
Priority to CN201520287095.XU priority Critical patent/CN204589010U/en
Application granted granted Critical
Publication of CN204589010U publication Critical patent/CN204589010U/en
Withdrawn - After Issue legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to the equipment of cooling component production technical field, title is semiconductor refrigeration member welding machine, comprise frame, frame has cylinder and welding liner plate, welding joint is connected with below cylinder, welding liner plate there is lower welding joint, inside described upper welding joint and lower welding joint, heater strip is installed, heater strip connection control device, it also includes two temperature adjustment plates, upper temperature adjustment plate and lower temperature adjustment plate respectively, upper temperature adjustment plate is arranged on below welding joint, lower temperature adjustment plate is arranged on above lower welding joint, described temperature adjustment plate interiors has pipeline, pipeline is communicated with high-temperature liquid case and Low Temperature Liquid case through e Foerderanlage, e Foerderanlage connection control device, have and cooling component can be made to reduce temperature at short notice, and keep there is a firm process under pressure, to improve the advantage of welding quality, reach minimizing energy dissipation simultaneously, ensure the effect of production efficiency.

Description

Semiconductor refrigeration member welding machine
Technical field
The utility model relates to the equipment of cooling component production technical field, particularly relates to cooling component welding machine.
Background technology
Cooling component is made up of porcelain plate and the multiple crystal grain be welded on porcelain plate, and cooling component is middle is crystal grain, both sides are porcelain plates, and the quality that crystal grain welds on porcelain plate is directly connected to the quality of cooling component.
Be cooling component welding machine by crystal particle welding on porcelain plate, such welding machine has frame, and frame has the welding joint that cylinder links, and described welding joint has heating unit; The process of welding is such: the parts that will weld are placed on below welding joint, and welding joint at high temperature presses down porcelain plate and crystal grain, can complete the welding to cooling component.
Use such welding machine, after cooling component welds, if welding joint departs from cooling component at a higher temperature, make cooling component be in freely stress-free state, will welding quality be affected; If Deng welding joint reduce certain temperature after move apart cooling component again, then because welding joint has larger thermal capacity, there is the shortcoming of difficulty, the production efficiency that wastes energy, affects of again heating up.
Make the good cooling component of welding at short notice reducing temperature and having a firm process under keeping certain pressure, be the effective measure improving cooling component welding quality, meanwhile, reduce energy dissipation, ensure the pursuit of production efficiency Ye Shi producer.
Summary of the invention
The purpose of this utility model is exactly for above-mentioned shortcoming, there is provided a kind of cooling component can be made to reduce temperature at short notice and keep cooling component under pressure to have a firm process, to improve the semiconductor refrigeration member welding machine of welding quality, reach the effect reducing energy dissipation, ensure production efficiency simultaneously.
The technical solution of the utility model is achieved in that semiconductor refrigeration member welding machine, comprise frame, frame has cylinder and welding liner plate, welding joint is connected with below cylinder, welding liner plate there is lower welding joint, it is the station of welding between upper welding joint and lower welding joint, inside described upper welding joint and lower welding joint, heater strip is installed, heater strip connection control device, it is characterized in that: further comprising and have two temperature adjustment plates, temperature adjustment plate is copper, upper temperature adjustment plate and lower temperature adjustment plate respectively, upper temperature adjustment plate is arranged on below welding joint, lower temperature adjustment plate is arranged on above lower welding joint, described temperature adjustment plate interiors has pipeline, pipeline is communicated with high-temperature liquid case and Low Temperature Liquid case through e Foerderanlage, e Foerderanlage connection control device.
Say further, the pipeline on described temperature adjustment plate is the subtube of many, and subtube is set in parallel in temperature adjustment plate, and every root subtube two ends connect high-temperature liquid case and Low Temperature Liquid case through e Foerderanlage respectively.
Say further, described upper temperature adjustment plate has larger area than upper welding joint, and described lower temperature adjustment plate has larger area than lower welding joint.
The beneficial effects of the utility model are: such welding machine has can be made cooling component reduce temperature at short notice and keep there is a firm process under pressure, to improve the advantage of welding quality, reach the effect reducing energy dissipation, ensure production efficiency simultaneously.
Pipeline on described temperature adjustment plate is the subtube of many, subtube is set in parallel in temperature adjustment plate, every root subtube two ends connect high-temperature liquid case and Low Temperature Liquid case through e Foerderanlage respectively, and balanced advantage of lowering the temperature everywhere when having refrigerating sheet cooling, ensure that quality product; Described upper temperature adjustment plate has larger area than upper welding joint, and described lower temperature adjustment plate has larger area than lower welding joint, has temperature adjustment advantage more rapidly, more can ensure quality product.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the structural representation of subtube of many that temperature adjustment plate distributes.
Wherein: 1, frame 2, cylinder 3, welding liner plate 4, upper welding joint 5, lower welding joint 6, station 7, heater strip 8, upper temperature adjustment plate 9, lower temperature adjustment plate 10, pipeline 11, e Foerderanlage 12, high-temperature liquid case 13, Low Temperature Liquid case 14, subtube.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail.
As shown in Figure 1, semiconductor refrigeration member welding machine, comprise frame 1, frame has cylinder 2 and welding liner plate 3, welding joint 4 is connected with below cylinder, welding liner plate there is lower welding joint 5, it is the station 6 of welding between upper welding joint and lower welding joint, inside described upper welding joint and lower welding joint, heater strip 7 is installed, heater strip connection control device, it is characterized in that: further comprising and have two temperature adjustment plates, temperature adjustment plate is copper, upper temperature adjustment plate 8 and lower temperature adjustment plate 9 respectively, upper temperature adjustment plate 8 is arranged on below welding joint, lower temperature adjustment plate 9 is arranged on above lower welding joint, described temperature adjustment plate interiors has pipeline 10, pipeline is communicated with high-temperature liquid case 12 and Low Temperature Liquid case 13 through e Foerderanlage 11, e Foerderanlage connection control device.The utility model is after cooling component welds, heater strip stops heating under control of the control means, the pressure that cylinder keeps down, start e Foerderanlage, Low Temperature Liquid case is to the pipeline input Low Temperature Liquid of temperature adjustment plate interiors, high-temperature liquid accepted by high-temperature liquid case, realize the fast cooling of temperature adjustment plate, due to the effect of cylinder 2, product is made at this moment to bear certain pressure, product is just lowered the temperature under stress, there is effect of the present utility model, in pipeline, the high-quality conductive fluid of flowing can realize changing to the firm suitable temp of cooling component low temperature in 3 seconds, there is higher production efficiency, on the contrary, during welding product, to the pipeline input high-temperature liquid of temperature adjustment plate interiors, Low Temperature Liquid accepted by Low Temperature Liquid case, start heater strip simultaneously, realize being rapidly heated of temperature adjustment plate and upper welding joint and lower welding joint, in pipeline, the high-quality conductive fluid of flowing can realize the suitable temp changing to cooling component welding in 3 seconds.
Say further, as shown in Figure 2, the pipeline on described temperature adjustment plate is the subtube 14 of many, and subtube is set in parallel in temperature adjustment plate, and every root is in charge of stage property two ends and is connected high-temperature liquid case and Low Temperature Liquid case through e Foerderanlage respectively.Like this because multiple subtube is even respectively, there is cooling component homogeneous temperature everywhere, ensure the advantage of quality product.
Described upper temperature adjustment plate has larger area than upper welding joint, and described lower temperature adjustment plate has larger area than lower welding joint, has temperature adjustment advantage more rapidly, more can ensure quality product.
The foregoing is only specific embodiment of the utility model, but constitutional features of the present utility model is not limited to this, any those skilled in the art is in field of the present utility model, and the change done or modification are all encompassed in the scope of the claims of the present utility model.

Claims (3)

1. semiconductor refrigeration member welding machine, comprise frame, frame has cylinder and welding liner plate, welding joint is connected with below cylinder, welding liner plate there is lower welding joint, it is the station of welding between upper welding joint and lower welding joint, inside described upper welding joint and lower welding joint, heater strip is installed, heater strip connection control device, it is characterized in that: further comprising and have two temperature adjustment plates, temperature adjustment plate is copper, upper temperature adjustment plate and lower temperature adjustment plate respectively, upper temperature adjustment plate is arranged on below welding joint, lower temperature adjustment plate is arranged on above lower welding joint, described temperature adjustment plate interiors has pipeline, pipeline is communicated with high-temperature liquid case and Low Temperature Liquid case through e Foerderanlage, e Foerderanlage connection control device.
2. semiconductor refrigeration member welding machine according to claim 1, it is characterized in that: the pipeline on described temperature adjustment plate is the subtube of many, subtube is set in parallel in temperature adjustment plate, and every root is in charge of stage property two ends and is connected high-temperature liquid case and Low Temperature Liquid case through e Foerderanlage respectively.
3. semiconductor refrigeration member welding machine according to claim 1 and 2, is characterized in that: described upper temperature adjustment plate has larger area than upper welding joint, and described lower temperature adjustment plate has larger area than lower welding joint.
CN201520287095.XU 2015-05-07 2015-05-07 Semiconductor refrigeration member welding machine Withdrawn - After Issue CN204589010U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520287095.XU CN204589010U (en) 2015-05-07 2015-05-07 Semiconductor refrigeration member welding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520287095.XU CN204589010U (en) 2015-05-07 2015-05-07 Semiconductor refrigeration member welding machine

Publications (1)

Publication Number Publication Date
CN204589010U true CN204589010U (en) 2015-08-26

Family

ID=53925185

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520287095.XU Withdrawn - After Issue CN204589010U (en) 2015-05-07 2015-05-07 Semiconductor refrigeration member welding machine

Country Status (1)

Country Link
CN (1) CN204589010U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104844248A (en) * 2015-05-07 2015-08-19 河南鸿昌电子有限公司 Semiconductor refrigerating member welding machine
CN109483001A (en) * 2018-12-28 2019-03-19 湖北赛格瑞新能源科技有限公司 A kind of welding equipment and welding method for micro thermoelectric device
CN112077472A (en) * 2020-08-17 2020-12-15 国为(南京)软件科技有限公司 Semiconductor refrigeration piece welding set

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104844248A (en) * 2015-05-07 2015-08-19 河南鸿昌电子有限公司 Semiconductor refrigerating member welding machine
CN104844248B (en) * 2015-05-07 2017-05-24 河南鸿昌电子有限公司 Semiconductor refrigerating member welding machine
CN109483001A (en) * 2018-12-28 2019-03-19 湖北赛格瑞新能源科技有限公司 A kind of welding equipment and welding method for micro thermoelectric device
CN112077472A (en) * 2020-08-17 2020-12-15 国为(南京)软件科技有限公司 Semiconductor refrigeration piece welding set

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
AV01 Patent right actively abandoned

Granted publication date: 20150826

Effective date of abandoning: 20170524

AV01 Patent right actively abandoned