CN204397118U - Reflow soldering apparatus - Google Patents
Reflow soldering apparatus Download PDFInfo
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- CN204397118U CN204397118U CN201420830904.2U CN201420830904U CN204397118U CN 204397118 U CN204397118 U CN 204397118U CN 201420830904 U CN201420830904 U CN 201420830904U CN 204397118 U CN204397118 U CN 204397118U
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- reflow soldering
- discharge pipe
- soldering apparatus
- air
- exhausting plate
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Abstract
The utility model discloses a kind of reflow soldering apparatus, blown by eddy current air-supply arrangement, hot air circulation can be made even, and by adding the setting of kuppe bottom eddy current air-supply arrangement, hot air circulation can be made more even, thus reduce the generation of rosin joint, make welding effect better, hot blast utilizes high, reduces costs.Sheathed heating element heater on discharge pipe, one directly can heat at air outlet place, the temperature of air outlet can be controlled accurately, not by the impact of pilot process, return air is heated simultaneously, reduce even elimination low temperature return air to affect the temperature of hot blast in discharge pipe, simplify temperature controlled difficulty further, improve the accuracy of temperature control.
Description
Technical field
The utility model relates to a kind of air channel, is specifically related to a kind of reflow soldering apparatus.
Background technology
In board production process, each surface mount elements adopts surface mounting technology to carry out paster assembling.First it be that solder(ing) paste is scraped in the pin hole that utilizes printing machine on-pcb board and welding position; And then with chip mounter, paster switching is overwhelmed on the corresponding welding position of PCB and fits with solder(ing) paste; Last feeding in solder reflow device by the pcb board posting element is again welded, Reflow Soldering arranges the Inner eycle heating system adopting and be divided into multiple warm area, because solder(ing) paste adopts various material to form, the difference of temperature will cause the change of solder(ing) paste state, when high-temperature region, solder(ing) paste is fused into liquid, and surface mount elements easily combines with solder(ing) paste; Enter cooling warm area after, solder(ing) paste is frozen into solid-state, just by the pin of surface mount elements and pcb board welded firmly.
In existing solder reflow device, the air channel structure of Reflow Soldering is that hot blast is directly sent by hot blast motor, causes hot blast uneven, easily produces rosin joint after welding, thus on pcb board everywhere solder joint quality can not stablize.A utility model has been applied for before the applicant, solution is proposed to the problems referred to above, blown by eddy current air-supply arrangement, hot air circulation can be made even, and by adding the setting of kuppe bottom eddy current air-supply arrangement, hot air circulation can be made more even, thus reduce the generation of rosin joint, make welding effect better, hot blast utilizes high, reduces costs.But in actual use, because air-supply pipeline is arranged in return flow line, the low warm air of backflow will carry out heat exchange with air-supply pipeline, cause a part of heat energy of hot blast in air-supply pipeline to be pulled away, accurately control to bring unnecessary variable to temperature, make control from being complicated.
Summary of the invention
For solving the problems of the technologies described above, the purpose of this utility model is to provide a kind of reflow soldering apparatus, thus can hot air circulation even, thus reduce the generation of rosin joint, welding effect is good, and hot blast utilizes high, reduces costs.
For achieving the above object, the technical solution of the utility model is as follows: a kind of reflow soldering apparatus, comprise Reflow Soldering air channel, described Reflow Soldering air channel comprises the cavity be located in reflow soldering apparatus, the bottom in described Reflow Soldering air channel is provided with the first exhausting plate, described first exhausting plate is evenly provided with multiple discharge pipe, described each discharge pipe is all arranged with a heating component, the outer both sides of described cavity are also provided with the back cavity being positioned at reflow soldering, eddy current air-supply arrangement is provided with in described cavity, described eddy current air-supply arrangement top is connected with air supply motor, kuppe is provided with bottom described eddy current air-supply arrangement.
Reflow soldering apparatus of the present utility model, blown by eddy current air-supply arrangement, hot air circulation can be made even, and by adding the setting of kuppe bottom eddy current air-supply arrangement, hot air circulation can be made more even, thus reduce the generation of rosin joint, make welding effect better, hot blast utilizes high, reduces costs.And sheathed heating element heater on discharge pipe, one directly can heat at air outlet place, the temperature of air outlet can be controlled accurately, not by the impact of pilot process, return air is heated simultaneously, reduce even elimination low temperature return air to affect the temperature of hot blast in discharge pipe, simplify temperature controlled difficulty further, improve the accuracy of temperature control.
Also the scheme of the coated discharge pipe of insulation material can be utilized to overcome the impact of low temperature return air, but insulation material is thicker, greatly can ties up the capacity of return air duct, increase the volume of equipment, therefore still utilize heating element heater more outstanding.
Further, described heating component comprises at least one bar shaped planar heat-generating body, the axis being parallel of the plane that described heating element heater area is maximum and described discharge pipe or at same plane.
Further, described heating component comprises the spirality planar heat-generating body that at least one is arranged at described discharge pipe outer surface.
Further, described heating component comprises to multiple strip piece shape heating element heater, the long axis of described heating element heater and the axes normal of described discharge pipe.
On the basis of technique scheme, the utility model also can make following improvement:
As preferred scheme, the outer surface of described cavity bottom is that arc-shaped is arranged.
Adopt above-mentioned preferred scheme, adopt cavity bottom to be the setting that circular arc fills, the heat loss that heat radiation causes can be reduced, improve the utilization rate of hot blast, reduce costs.
As preferred scheme, described kuppe both sides are also evenly provided with multiple mozzle.
Adopt above-mentioned preferred scheme, the setting of mozzle can make hot blast more easily be transported to from down on pcb board, improves hot blast utilization rate, reduces costs, and make whole hot air circulation more even.
As preferred scheme, opening and the horizontal plane of described mozzle acutangulate.
Adopt above-mentioned preferred scheme, hot blast can be made more easily to be transported on pcb board from down.
As preferred scheme, the cross section of described kuppe is trapezoidal.
Adopt above-mentioned preferred scheme, the interface of kuppe is trapezoidal setting, and hot blast can be made more uniformly to be distributed in whole cavity.
As preferred scheme, be also provided with the second exhausting plate in parallel under described first exhausting plate, described discharge pipe passes the second exhausting plate, and on described second exhausting plate, the both sides of each discharge pipe are equipped with return air inlet.
Adopt above-mentioned preferred scheme, by increasing exhausting plate, and the both sides of each discharge pipe are equipped with the design of return air inlet on exhausting plate, each discharge pipe and return air inlet form a microcirculation, make hot air circulation more abundant, distribute more even, improve the uniformity of conduction, make welding effect better.
As preferred scheme, in described back cavity, be also provided with heater.
Adopt above-mentioned preferred scheme, the design of heater is set in back cavity, hot blast can be made to conduct more even, improve the utilization ratio of hot blast, make the gas flow temperature that is sprayed on pcb board more even, make welding effect better, the quality of raising pcb board.
Accompanying drawing explanation
Fig. 1 is the structural representation of reflow soldering apparatus described in the utility model;
Fig. 2 is the upward view of reflow soldering apparatus described in the utility model;
Fig. 3 reflow soldering apparatus described in the utility model is installed in reflow soldering and carries out welded structure schematic diagram;
Wherein:
1. Reflow Soldering air channel, 2. reflow soldering, 3. cavity, 4. back cavity, 5. eddy current air-supply arrangement, 6. air supply motor, 7. kuppe, 8. mozzle, 9. the first exhausting plate, 10. discharge pipe, 11. second exhausting plates, 12. return air inlets, 13. heaters, 13A. heating element heater, 14 is pcb board.
Detailed description of the invention
Preferred embodiment of the present utility model is described in detail below in conjunction with accompanying drawing.
In order to reach the purpose of this utility model, in embodiments more of the present utility model,
As shown in Figures 1 to 3, Reflow Soldering air channel 1 described in the utility model, comprise the cavity 3 be located in reflow soldering 2, the bottom in described Reflow Soldering air channel 1 is provided with the first exhausting plate 9, described first exhausting plate 9 is evenly provided with multiple discharge pipe 10, described discharge pipe 10 is all arranged with heating component 13A, the described outer both sides of cavity 3 are also provided with the back cavity 4 being positioned at reflow soldering 2, eddy current air-supply arrangement 5 is provided with in described cavity 3, described eddy current air-supply arrangement 5 top is connected with air supply motor 6, is provided with kuppe 7 bottom described eddy current air-supply arrangement 5.Blown by eddy current air-supply arrangement, hot air circulation can be made even, and by adding the setting of kuppe bottom eddy current air-supply arrangement, hot air circulation can be made more even, thus reduce the generation of rosin joint, make welding effect better, hot blast utilizes high, reduces costs.Sheathed heating element heater on discharge pipe, one directly can heat at air outlet place, the temperature of air outlet can be controlled accurately, not by the impact of pilot process, return air is heated simultaneously, reduce even elimination low temperature return air to affect the temperature of hot blast in discharge pipe, simplify temperature controlled difficulty further, improve the accuracy of temperature control.
Also the scheme of the coated discharge pipe of insulation material can be utilized to overcome the impact of low temperature return air, but insulation material is thicker, greatly can ties up the capacity of return air duct, increase the volume of equipment, therefore still utilize heating element heater more outstanding.
In actual applications, described heating component comprises at least one bar shaped planar heat-generating body, the axis being parallel of the plane that described heating element heater area is maximum and described discharge pipe or at same plane.The heating element heater of vertical vertical bar shape, while increase heating surface (area) (HS, can ensure the unobstructed of air return pipeline.
Heating element heater also can do such selection: described heating component comprises the spirality planar heat-generating body that at least one is arranged at described discharge pipe outer surface.Spirality heating element heater can increase heating path and area further, also less on the impact of air return pipeline.
Or described heating component comprises to multiple strip piece shape heating element heater, the long axis of described heating element heater and the axes normal of described discharge pipe.The heating element heater of hedgehog row or fin shape provides larger heating surface (area) (HS.
In order to optimize implementation result of the present utility model further, the outer surface of described cavity 3 bottom is that arc-shaped is arranged.Employing cavity bottom is the setting of arc-shaped, can reduce the heat loss that heat radiation causes, and improves the utilization rate of hot blast, reduces costs.
In order to optimize implementation result of the present utility model further, described kuppe 7 both sides are also evenly provided with multiple mozzle 8.The setting of this mozzle can make hot blast more easily be transported to from down on pcb board, improves hot blast utilization rate, reduces costs, and make whole hot air circulation more even.
In order to optimize implementation result of the present utility model further, opening and the horizontal plane of described mozzle 8 acutangulate.This design can make hot blast more easily be transported on pcb board from down.
In order to optimize implementation result of the present utility model further, the cross section of described kuppe 7 is trapezoidal.The interface adopting kuppe is trapezoidal setting, and hot blast can be made more uniformly to be distributed in whole cavity.
In order to optimize implementation result of the present utility model further, described first exhausting plate is also provided with the second exhausting plate 11 in parallel for 9 times, described discharge pipe 10 passes the second exhausting plate 11, and on described second exhausting plate 11, the both sides of each discharge pipe 10 are equipped with return air inlet 12.By increasing exhausting plate, and the both sides of each discharge pipe are equipped with the design of return air inlet on exhausting plate, and each discharge pipe and return air inlet form a microcirculation, make hot air circulation more abundant, distribute more even, improve the uniformity of conduction, make welding effect better.
In order to optimize implementation result of the present utility model further, in described back cavity 4, be also provided with heater 13.Adopt in back cavity the design that heater is set, hot blast can be made to conduct more even, improve the utilization ratio of hot blast, make the gas flow temperature that is sprayed on pcb board more even, make welding effect better, the quality of raising pcb board.
As shown in Figure 3, the course of work is specially, under the drive of air supply motor 6, hot blast blows out from eddy current air-supply arrangement 5, discharge pipe 10 is evenly entered from the first exhausting plate 9 by kuppe 7, evenly blow out from discharge pipe 10 through the second exhausting plate 11 again, then be sprayed on pcb board 14 through bounce-back, enter in back cavity 4 by return air inlet 12, again reheated by heater 13, hot blast after heating enters in eddy current air-supply arrangement 5 again, thus form a constant temperature system, and then blow out from eddy current air-supply arrangement 5 under the effect of air supply motor 6, be sprayed onto on pcb board 14 by abovementioned steps again, iterative cycles, thus hot blast conduction is more even, and improve utilization rate, make the problem of faulty soldering of minimizing pcb board, make welding effect better.
Heating component is arranged on after on discharge pipe, both can have cancelled the heater 13 being originally arranged on top, also heater 13 and heating component 13A can be set simultaneously.Heater 13 also can be coatedly be installed on sheet on cavity 3 outer surface or fin-shaped heating element heater, or duct type heating element heater, heats further return air.
Above-described is only preferred embodiment of the present utility model; it should be pointed out that for the person of ordinary skill of the art, under the prerequisite not departing from the utility model creation design; can also make some distortion and improvement, these all belong to protection domain of the present utility model.
Claims (10)
1. a reflow soldering apparatus, comprise Reflow Soldering air channel, described Reflow Soldering air channel comprises the cavity be located in reflow soldering apparatus, it is characterized in that, the bottom in described Reflow Soldering air channel is provided with the first exhausting plate, described first exhausting plate is evenly provided with multiple discharge pipe, described each discharge pipe is all arranged with a heating component, the outer both sides of described cavity are also provided with the back cavity being positioned at reflow soldering, eddy current air-supply arrangement is provided with in described cavity, described eddy current air-supply arrangement top is connected with air supply motor, is provided with kuppe bottom described eddy current air-supply arrangement.
2. reflow soldering apparatus according to claim 1, is characterized in that, described heating component comprises at least one bar shaped planar heat-generating body, the axis being parallel of the plane that described heating element heater area is maximum and described discharge pipe or at same plane.
3. reflow soldering apparatus according to claim 1, is characterized in that, described heating component comprises the spirality planar heat-generating body that at least one is arranged at described discharge pipe outer surface.
4. reflow soldering apparatus according to claim 1, is characterized in that, described heating component comprises to multiple strip piece shape heating element heater, the long axis of described heating element heater and the axes normal of described discharge pipe.
5. reflow soldering apparatus according to claim 1, is characterized in that, the outer surface of described cavity bottom is that arc-shaped is arranged.
6. reflow soldering apparatus according to claim 2, is characterized in that, described kuppe both sides are also evenly provided with multiple mozzle.
7. reflow soldering apparatus according to claim 3, is characterized in that, opening and the horizontal plane of described mozzle acutangulate.
8. reflow soldering apparatus according to any one of claim 1 to 7, is characterized in that, the cross section of described kuppe is trapezoidal.
9. reflow soldering apparatus according to any one of claim 1 to 7, it is characterized in that, also be provided with the second exhausting plate in parallel under described first exhausting plate, described discharge pipe passes the second exhausting plate, and on described second exhausting plate, the both sides of each discharge pipe are equipped with return air inlet.
10. reflow soldering apparatus according to any one of claim 1 to 7, is characterized in that, is also provided with heater in described back cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420830904.2U CN204397118U (en) | 2014-12-24 | 2014-12-24 | Reflow soldering apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420830904.2U CN204397118U (en) | 2014-12-24 | 2014-12-24 | Reflow soldering apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204397118U true CN204397118U (en) | 2015-06-17 |
Family
ID=53421016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420830904.2U Expired - Fee Related CN204397118U (en) | 2014-12-24 | 2014-12-24 | Reflow soldering apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204397118U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105562866A (en) * | 2016-01-26 | 2016-05-11 | 东莞市先飞电子材料有限公司 | Through-hole welding device and method for circuit board |
| CN106440727A (en) * | 2016-09-26 | 2017-02-22 | 中国电子科技集团公司第四十八研究所 | Chain oven |
-
2014
- 2014-12-24 CN CN201420830904.2U patent/CN204397118U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105562866A (en) * | 2016-01-26 | 2016-05-11 | 东莞市先飞电子材料有限公司 | Through-hole welding device and method for circuit board |
| CN106440727A (en) * | 2016-09-26 | 2017-02-22 | 中国电子科技集团公司第四十八研究所 | Chain oven |
| CN106440727B (en) * | 2016-09-26 | 2018-09-25 | 中国电子科技集团公司第四十八研究所 | A kind of chain type baking oven |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150617 Termination date: 20191224 |