CN203541781U - Reflow soldering device - Google Patents
Reflow soldering device Download PDFInfo
- Publication number
- CN203541781U CN203541781U CN201320669554.1U CN201320669554U CN203541781U CN 203541781 U CN203541781 U CN 203541781U CN 201320669554 U CN201320669554 U CN 201320669554U CN 203541781 U CN203541781 U CN 203541781U
- Authority
- CN
- China
- Prior art keywords
- electronic component
- heat
- canister
- reflow soldering
- liquid heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000005476 soldering Methods 0.000 title claims abstract description 25
- 239000007788 liquid Substances 0.000 claims abstract description 27
- 238000010438 heat treatment Methods 0.000 claims abstract description 19
- 239000011261 inert gas Substances 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 22
- 239000000463 material Substances 0.000 abstract description 15
- 239000002184 metal Substances 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 6
- 238000009833 condensation Methods 0.000 abstract description 5
- 230000005494 condensation Effects 0.000 abstract description 5
- 238000001704 evaporation Methods 0.000 abstract description 4
- 230000008020 evaporation Effects 0.000 abstract description 4
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 238000007599 discharging Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 238000009835 boiling Methods 0.000 description 6
- 238000010992 reflux Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 239000006071 cream Substances 0.000 description 3
- 238000009834 vaporization Methods 0.000 description 3
- 230000008016 vaporization Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a reflow soldering device which comprises a metal container. A separating plate is arranged inside the metal container, electronic parts coated with soldering materials are placed on the separating plate, liquid heat media and a heater are arranged at the bottom of the metal container, the heater is used for heating the liquid heat media to vaporize the liquid heat media into heat medium vapor, a plurality of holes are formed in the separating plate, and the heat medium vapor passes through the holes to melt the welding materials on the electronic parts. According to the reflow soldering device, heat absorption and heat discharging in the evaporation and condensation processes of the liquid heat media are adopted for delivering heat to heat the electronic parts to achieve the soldering aim, heating is even, the heat amount is large, the speed is high, and the heat efficiency is high.
Description
Technical field
The utility model relates to electronic component welding technology field, relates in particular to a kind of metal exit of large shape electronic component or reflow soldering apparatus of electric connecting point of being applicable to.
Background technology
In all electronic products, the metal exit of electronic component or electric connecting point all will adopt soldering to connect.Conventional welding method has hot air reflux weldering, wave-soldering, flatiron weldering etc.During welding, thermal source heats electronic component, make the temperature of contact to be welded exceed soldering tin material fusing point 20-50 degree, and maintain the regular hour, soldering tin material is fused into liquid state and is enclosed in around contact to be welded, after cooling, just form a solder joint, thereby completed the fixing and electric connection of electronic component.
Hot air reflux weldering is carried out in hot air reflux brazier, and the hot blast after heating is blown on electronic component by air blast as thermal source, thereby heats to electronic component.Hot air reflux brazier generally has 8-12 warm area, and the hot blast temperature of each warm area is controlled separately, and it is to set according to the size of the type of solder(ing) paste used (soldering tin material of paste), electronic component, distribution density etc.When electronic component moves in reflow soldering, by the temperature on test electronic component, can obtain a welding curve, this curve can be divided into preheating zone, weld zone and cooling zone, the temperature of general preheating zone is at 120-150 degree, and the temperature of weld zone is generally than the high 20-30 degree of molten point of tin cream, and (the molten point of Pb63Sn37 is 183 degree, the molten point of Sn96.5Ag3Cu0.5 is 217 degree), cooling zone is cooling to electronic component by drying.Welding completes in weld zone, when the temperature of contact to be welded exceedes the melting temperature 20-30 degree of tin cream, and reaches the 30-60 time of second, has just formed a solder joint.
When hot air reflux welds, air blast blows to hot blast on electronic component, and electronic component is heated and temperature rising.In this process, because material, volume, weight, the surface state of each electronic component are different, its absorbs the efficiency of heat and electronic component and is raised to the heat that welding temperature need to absorb and has difference.Volume is little, lightweight, rough surface, saturate heat absorption are fast, and temperature also rises soon, otherwise rises slowly.This has just caused on certain time point, and the temperature on each electronic component is different, and what rise soon may form solder joint, and also not reaching of rising slowly forms the needed temperature of solder joint.If certain electronic component arrives greatly certain degree, while causing its long-time liter less than the required temperature reaching of welding, its surface meeting oxidation by air, finally cannot complete welding.
There is equally above problem in wave-soldering and flatiron weldering.
So, the electronic component of, Heavy Weight large for size, owing to being raised to, the heat that welding temperature need to absorb is a lot, and the heated time is long, causes contact to be welded easy oxidized and cannot complete welding.
Utility model content
The utility model is mainly to solve existing technical problem in prior art, thereby a kind of reflow soldering apparatus that size is large, the electronic component of Heavy Weight welds that meets is provided.
Above-mentioned technical problem of the present utility model is mainly solved by following technical proposals:
Reflow soldering apparatus of the present utility model, comprise a canister, described canister inside is provided with a dividing plate, on described dividing plate, be placed with the electronic component that has applied scolder, liquid heat medium and heater are equipped with in described canister bottom, described heater is for the heating of described liquid heat medium is vaporizated into thermal medium steam, and described dividing plate is provided with multiple holes, and described thermal medium steam melts the scolder on described electronic component through described hole.
Further, the top of described canister is also provided with a top cover, described top cover be shaped as circular arc or plate shaped, the centre position of described top cover is also provided with an observation window.
Further, the liquid level of described liquid heat medium is positioned at 1/4 place of described canister height, and is positioned at the below of described dividing plate.
Further, the top of described canister is also provided with a pre-heating cabin, and described pre-heating cabin is used for described electronic component to carry out preheating, and which is provided with first, second closing door, and described the second closing door is arranged between described canister and pre-heating cabin.
Further, described thermal medium steam is inert gas.
Compared with prior art, the utility model has the advantage of: utilize the heat absorption and release in the evaporation of liquid heat medium material and condensation process to carry out transferring heat, electronic component is heated, reach the object of welding, heat more evenly, heat is large, and speed is fast and the thermal efficiency is high.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural representation of the embodiment mono-of reflow soldering apparatus of the present utility model;
Fig. 2 is the structural representation of the embodiment bis-of reflow soldering apparatus of the present utility model.
The specific embodiment
Below in conjunction with accompanying drawing, preferred embodiment of the present utility model is described in detail, thereby so that advantage of the present utility model and feature can be easier to be it will be appreciated by those skilled in the art that, protection domain of the present utility model is made to more explicit defining.
The total design of the utility model is: when fluent material is heated to boiling temperature, material absorbs heat (heat of vaporization), changes into steam, and steam is met when cold, can emit heat (condensation heat).Utilize this principle, can design a welder, and select a kind of liquid heat medium, the boiling temperature of liquid heat medium is identical with the welding temperature needing, than the high 20-30 degree of the fusing point of welding material.Heating liquid thermal medium, make it vaporization, the steam after vaporization contacts with soldered electronic component, because the temperature of electronic component is lower than the boiling point of liquid heat medium material, the thermal medium of vapor state can be in electronic component surface condensation, when condensing, can emit heat, the temperature of electronic component will raise gradually, finally reach boiling temperature, temperature now just in time meets welding temperature condition, welding material fusing, thus complete welding.
Embodiment mono-
Consult shown in Fig. 1, the reflow soldering apparatus of the present embodiment, comprise a canister 1, this canister 1 inside is provided with a dividing plate 2, on dividing plate 2, be placed with the electronic component 3 that has applied scolder, liquid heat medium 4 and heater are equipped with in canister 1 bottom, and heater is for being vaporizated into thermal medium steam 5 by liquid heat medium 4 heating, and dividing plate 2 is provided with multiple holes, thermal medium steam 5 is through the scolder on this hole fusing electronic component 3.In the present embodiment, the liquid level of liquid heat medium 4 is positioned at 1/4 place of canister 1 height, and its liquid level also can be positioned at other height, but need be lower than the lower surface of dividing plate 2, is convenient to thermal medium steam 5 and through dividing plate 2, arrives electronic component 3 places smoothly.
Preferably, the top of canister 1 is also provided with a top cover 7, top cover 7 be shaped as circular arc or plate shaped, the centre position of top cover 7 is also provided with an observation window 8, for checking in time the welding situation of electronic component 3 of canister 1 inside.When work, open container cap 7, electronic component to be welded 3 is placed on dividing plate 2 to the container cap 7 that closes, heater, liquid heat medium 4 is heated, when liquid heat medium is raised to boiling temperature, come to life, become thermal medium steam 5, thermal medium steam 5 heats electronic component 3, welds.In the present embodiment, electronic component 3 is preferably flat surface transformer, and weight reaches 200 grams, wherein, in its constituent, copper accounts for 80%, welding material is selected Sn96.5Ag3Cu0.5 lead-free tin cream, and its fusing point is 217 degree, and it is the thermal medium of 240 degree that liquid heat medium 4 is selected boiling point.
Embodiment bis-
Consult shown in Fig. 2, other parts of the present embodiment are identical with embodiment mono-, difference is: the top of canister 1 is also provided with a pre-heating cabin 6, pre-heating cabin 6 having heaters, for electronic component 3 is carried out to preheating, preheat temperature is at 150 ℃, and pre-heating cabin 6 is provided with first, second closing door (9,10).The first closing door 9 is arranged on device outside, and the second closing door 10 is arranged between pre-heating cabin 6 and canister 1.During work, electronic component 3 by the first closing door 9 enter pre-heating cabin 6 interior after, close the first closing door 9, open heater, to electronic component preheating, after preheating completes, open the second closing door 10, electronic component is sent in canister, then close the second closing door 10.First, second closing door (9,10) can not be opened simultaneously, reduces electronic component 3 while passing in and out canister 1, the overflowing of thermal medium steam 5.
In sum, the utlity model has following advantage:
1), thermal medium steam is inert gas, in welding process, the metal solder joint of electronic component can be by airborne dioxygen oxidation, for large shape electronic component, no matter weld interval how long, electronic component can both and form solder joint with the good infiltration of soldering material.
2), liquid heat medium material heat of transmitting in evaporation and condensation process is large, speed is fast, the thermal efficiency is high, the quick heating of electronic component.
3), steam heated is more even, much no matter shape, size, weight, the surface state difference of electronic component have, they almost reach welding temperature in the identical time.
4), thermal medium is in when evaporation, the temperature of steam is constant, while there will not be normal welding, little electronic component is by superheated problem.
The above, be only the specific embodiment of the present utility model, but protection domain of the present utility model is not limited to this, and any variation of expecting without creative work or replacement, within all should being encompassed in protection domain of the present utility model.Therefore, protection domain of the present utility model should be as the criterion with the protection domain that claims were limited.
Claims (5)
1. a reflow soldering apparatus, comprise a canister (1), described canister (1) inside is provided with a dividing plate (2), on described dividing plate (2), be placed with the electronic component (3) that has applied scolder, it is characterized in that: liquid heat medium (4) and heater are equipped with in described canister (1) bottom, described heater is for being vaporizated into thermal medium steam (5) by described liquid heat medium (4) heating, and described dividing plate (2) is provided with multiple holes, described thermal medium steam (5) melts the scolder on described electronic component (3) through described hole.
2. reflow soldering apparatus according to claim 1, it is characterized in that: the top of described canister (1) is also provided with a top cover (7), described top cover (7) be shaped as circular arc or plate shaped, the centre position of described top cover (7) is also provided with an observation window (8).
3. reflow soldering apparatus according to claim 1, is characterized in that: the liquid level of described liquid heat medium (4) is positioned at 1/4 place of described canister (1) height, and is positioned at the below of described dividing plate (2).
4. reflow soldering apparatus according to claim 1, it is characterized in that: the top of described canister (1) is also provided with a pre-heating cabin (6), described pre-heating cabin (6) is for carrying out preheating to described electronic component (3), and which is provided with first, second closing door (9,10), described the second closing door (10) is arranged between described canister (1) and pre-heating cabin (6).
5. reflow soldering apparatus according to claim 1, is characterized in that: described thermal medium steam (5) is inert gas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320669554.1U CN203541781U (en) | 2013-10-28 | 2013-10-28 | Reflow soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320669554.1U CN203541781U (en) | 2013-10-28 | 2013-10-28 | Reflow soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203541781U true CN203541781U (en) | 2014-04-16 |
Family
ID=50459950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320669554.1U Expired - Lifetime CN203541781U (en) | 2013-10-28 | 2013-10-28 | Reflow soldering device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203541781U (en) |
-
2013
- 2013-10-28 CN CN201320669554.1U patent/CN203541781U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140416 |
|
| CX01 | Expiry of patent term |